CN108538792A - 导电物质分布状态可控的异方性导电胶及其制备方法 - Google Patents

导电物质分布状态可控的异方性导电胶及其制备方法 Download PDF

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CN108538792A
CN108538792A CN201810467124.9A CN201810467124A CN108538792A CN 108538792 A CN108538792 A CN 108538792A CN 201810467124 A CN201810467124 A CN 201810467124A CN 108538792 A CN108538792 A CN 108538792A
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die plate
contact tube
foraminous die
conductive adhesive
anisotropic conductive
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李辉
赵振宇
黄漭
孙宇
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201810467124.9A priority Critical patent/CN108538792A/zh
Priority to PCT/CN2018/092173 priority patent/WO2019218421A1/zh
Priority to US16/083,218 priority patent/US10957668B2/en
Publication of CN108538792A publication Critical patent/CN108538792A/zh
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Abstract

本发明公开了一种导电物质分布状态可控的异方性导电胶及其制备方法，异方性导电胶包括多孔模板、若干导电管以及绝缘胶层，所述多孔模板的厚度方向贯穿设置有若干通孔，每根所述导电管分别插设于一个所述通孔内且两端伸出，所述绝缘胶层包裹所述导电管伸出所述多孔模板的部分。本发明通过采用轴向导电性优越、原料廉价易得的导电管作为导电物质形成在具有通孔的多孔模板内，通过在制备过程中控制多孔模板中孔洞的疏密程度，即可控制导电管的分布状态，实现对异方性导电胶中导电物质分布状态的精确控制。

Description

导电物质分布状态可控的异方性导电胶及其制备方法
技术领域
本发明涉及导电材料技术领域，尤其涉及一种导电物质分布状态可控的异方性导电胶及其制备方法。
背景技术
近年来，随着人们对显示水平的要求不断提高，显示屏制造技术不断革新，其中离不开材料科学的发展。在模组Bonding制程中必须使用到ACF胶(Anisotropic ConductiveFilm，异方性导电胶)，ACF胶限定电流只能由沿其厚度方向(Z轴方向)流通于ACF胶两侧的基材之间的一种特殊涂布物质，其利用导电粒子连接IC芯片与基板两者之间的电极使之成为导通，同时又能避免相邻两电极间导通短路，而达成只在Z轴方向导通的目的。
传统的ACF胶由导电粒子、粘着剂组成，导电粒子填充混杂在树脂中。导电粒子在树脂中极易出现局部团聚现象，粒子在树脂中的分布状况难以控制，因此可能会影响到导电性能从而造成Bonding不良现象发生。此外，传统ACF胶中所用的导电粒子结构复杂，包括内部的聚合物(polymer)、包裹聚合物的Au、Ni等金属层以及包裹在外层的金属层外的绝缘层，制作步骤繁琐，而且需要使用大量的Au、Ni等贵金属导致造价不菲。
发明内容
鉴于现有技术存在的不足，本发明提供了一种导电物质分布状态可控的异方性导电胶及其制备方法，ACF胶内导电物质的分布状态可控，可避免传统ACF胶中导电粒子分布不均匀、易发生局部团聚的问题，同时有望降低ACF胶生产成本、提高导电性能。
为了实现上述的目的，本发明采用了如下的技术方案：
一种导电物质分布状态可控的异方性导电胶，包括多孔模板、若干导电管以及绝缘胶层，所述多孔模板的厚度方向贯穿设置有若干通孔，每根所述导电管分别插设于一个所述通孔内且两端伸出，所述绝缘胶层包裹所述导电管伸出所述多孔模板的部分。
作为其中一种实施方式，所述绝缘胶层覆盖在所述多孔模板设有所述通孔的两相对侧，并完全覆盖导电管。
作为其中一种实施方式，所述通孔阵列地形成在所述多孔模板上，每个所述导电管分别对应一个所述通孔。
作为其中一种实施方式，所述多孔模板为SiO2或多孔阳极氧化铝。
作为其中一种实施方式，所述绝缘胶层为环氧树脂或亚克力胶。
作为其中一种实施方式，所述导电管为碳纳米管。
作为其中一种实施方式，所述多孔模板每侧的所述绝缘胶层的覆盖面积均小于所述多孔模板，且所述绝缘胶层的每侧端面均缩进于所述多孔模板的边缘。
本发明的另一目的在于提供一种导电物质分布状态可控的异方性导电胶的制备方法，包括：
提供一具有若干通孔的多孔模板；
在所述多孔模板的各所述通孔内制作出导电管阵列，并使得每根导电管的两端均伸出于所述通孔外；
在所述多孔模板的两侧分别涂布覆盖所述导电管两端的绝缘胶层。
作为其中一种实施方式，所述导电管为甲烷或乙炔经化学气相沉积反应得到。
本发明通过采用轴向导电性优越、原料廉价易得的导电管作为导电物质形成在具有通孔的多孔模板内，通过在制备过程中控制多孔模板中孔洞的疏密程度，即可控制导电管的分布状态，实现对异方性导电胶中导电物质分布状态的精确控制。
附图说明
图1为本发明实施例的异方性导电胶的制备过程示意图；
图2为本发明实施例的异方性导电胶的制备方法示意图；
图3为本发明实施例的异方性导电胶的剖面结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1，为本发明的异方性导电胶的制备方法，其主要包括：
S01、提供一具有若干通孔100的多孔模板10；
S02、在多孔模板10的各通孔100内制作出导电管阵列，并使得每根导电管20的两端均伸出于通孔100外；
S03、在多孔模板10的两侧分别涂布覆盖导电管20两端的绝缘胶层30。
这里，导电管20采用碳纳米管(CNTs)，是由石墨层沿中心按照一定角度卷绕而成的同轴的管状中空结构。电子在碳纳米管的径向运动受到限制，而电子在轴向运动不受任何限制，金属性的碳纳米管具有优异的轴向导电性。同时，碳纳米管还具有非凡的力学性能，其弹性模量为1TPa左右，约为钢材的5倍，其弹性应变约为5％，断裂过程不是脆性断裂，而是具有一定塑性，可承受大于40％的应变。由若干碳纳米管组成的碳纳米管阵列具有一致的长径比、很好的取向性和较高的纯度，因此，可以很好地作为本实施例的异性导电复合材料。
进一步地，多孔模板10为SiO2或多孔阳极氧化铝，形成为具有阵列设置的通孔100的限位结构，可以为碳纳米管的制备提供孔道限位作用。导电管20为甲烷或乙炔等碳源经化学气相沉积反应得到，为其中一种实施方式，绝缘胶层30为具有适用于Bonding(绑定)工艺的绝缘性树脂胶材，例如环氧树脂、亚克力胶等。
在上述步骤S03中，多孔模板10的上下两侧均涂布有绝缘胶层30，每侧的绝缘胶层30的厚度均略大于碳纳米管的延伸长度，将碳纳米管伸出的部分埋于其中，通孔100阵列地形成在多孔模板10上，每个导电管20分别对应一个通孔100。在制备过程中，可通过控制多孔模板10中通孔100的疏密程度，从而控制CNTs阵列的分布状态，达到对ACF胶中导电物质分布状态的精确控制。例如，可通过控制反应液种类、浓度、温度、电压、阳极氧化时间等参数控制多孔阳极氧化铝的孔径大小以及膜厚，从而控制多孔模板10中通孔100的排布。
如图3，制作完成后，异方性导电胶包括多孔模板10、若干导电管20以及绝缘胶层30，多孔模板10的厚度方向贯穿设置有若干通孔100，每根导电管20分别插设于一个通孔100内且两端伸出，绝缘胶层30包裹导电管20伸出多孔模板10的部分，例如，有的实施方式中绝缘胶层30的表面并不是与多孔模板10表面平行，绝缘胶层30仅包裹在每根导电管20的外表面，但本实施例的绝缘胶层30覆盖在多孔模板10设有通孔100的两相对侧，并完全覆盖导电管20。
多孔模板10每侧的绝缘胶层30的覆盖面积均小于多孔模板10，且绝缘胶层30的每侧端面均缩进于多孔模板10的边缘，以便在Bonding过程中，胶材在合适的压力作用下受挤压而向四周扩散，以充分粘结COF(Chip On Film，覆晶薄膜)、FPC(Flexible PrintedCircuit，柔性电路板)等元件，此时，CNTs突破绝缘胶层30的表面而导通上下电路，如此，即完成ACF胶在厚度方向上的电路导通。
本发明通过采用轴向导电性优越、原料廉价易得的碳纳米管作为导电物质形成在具有通孔的多孔模板内，通过在制备过程中控制多孔模板中孔洞的疏密程度，即可控制导电管的分布状态，实现对异方性导电胶中导电物质分布状态的精确控制，可避免传统ACF胶中导电粒子分布不均匀、易局部团聚等问题，同时可以降低ACF胶的生产成本，并提高其导电性能。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (9)

1.一种导电物质分布状态可控的异方性导电胶，其特征在于，包括多孔模板(10)、若干导电管(20)以及绝缘胶层(30)，所述多孔模板(10)的厚度方向贯穿设置有若干通孔(100)，每根所述导电管(20)分别插设于一个所述通孔(100)内且两端伸出，所述绝缘胶层(30)包裹所述导电管(20)伸出所述多孔模板(10)的部分。
2.根据权利要求1所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述绝缘胶层(30)覆盖在所述多孔模板(10)设有所述通孔(100)的两相对侧，并完全覆盖导电管(20)。
3.根据权利要求2所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述通孔(100)阵列地形成在所述多孔模板(10)上，每个所述导电管(20)分别对应一个所述通孔(100)。
4.根据权利要求1所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述多孔模板(10)为SiO2或多孔阳极氧化铝。
5.根据权利要求1所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述绝缘胶层(30)为环氧树脂或亚克力胶。
6.根据权利要求1-5任一所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述导电管(20)为碳纳米管。
7.根据权利要求6所述的导电物质分布状态可控的异方性导电胶，其特征在于，所述多孔模板(10)每侧的所述绝缘胶层(30)的覆盖面积均小于所述多孔模板(10)，且所述绝缘胶层(30)的每侧端面均缩进于所述多孔模板(10)的边缘。
8.一种权利要求1-7任一所述的导电物质分布状态可控的异方性导电胶的制备方法，其特征在于，包括：
提供一具有若干通孔(100)的多孔模板(10)；
在所述多孔模板(10)的各所述通孔(100)内制作出导电管阵列，并使得每根导电管(20)的两端均伸出于所述通孔(100)外；
在所述多孔模板(10)的两侧分别涂布覆盖所述导电管(20)两端的绝缘胶层(30)。
9.根据权利要求8所述的导电物质分布状态可控的异方性导电胶的制备方法，其特征在于，所述导电管(20)为甲烷或乙炔经化学气相沉积反应得到。
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