CN110382636B - 具有改善的热稳定性的分子油墨 - Google Patents

具有改善的热稳定性的分子油墨 Download PDF

Info

Publication number
CN110382636B
CN110382636B CN201880016048.8A CN201880016048A CN110382636B CN 110382636 B CN110382636 B CN 110382636B CN 201880016048 A CN201880016048 A CN 201880016048A CN 110382636 B CN110382636 B CN 110382636B
Authority
CN
China
Prior art keywords
ink
silver
traces
substrate
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880016048.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN110382636A (zh
Inventor
阿诺德·J·凯尔
尚塔尔·帕凯
奥尔加·莫森桑
帕特里克·罗兰·卢西恩·马朗方
巴瓦纳·代奥雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Council of Canada
Original Assignee
National Research Council of Canada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Council of Canada filed Critical National Research Council of Canada
Publication of CN110382636A publication Critical patent/CN110382636A/zh
Application granted granted Critical
Publication of CN110382636B publication Critical patent/CN110382636B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/22—Metallic printing; Printing with powdered inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C09D11/104—Polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201880016048.8A 2017-02-08 2018-02-08 具有改善的热稳定性的分子油墨 Active CN110382636B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762456300P 2017-02-08 2017-02-08
US62/456,300 2017-02-08
PCT/IB2018/050789 WO2018146617A1 (en) 2017-02-08 2018-02-08 Molecular ink with improved thermal stability

Publications (2)

Publication Number Publication Date
CN110382636A CN110382636A (zh) 2019-10-25
CN110382636B true CN110382636B (zh) 2023-12-08

Family

ID=63107342

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880016048.8A Active CN110382636B (zh) 2017-02-08 2018-02-08 具有改善的热稳定性的分子油墨

Country Status (9)

Country Link
US (1) US11472980B2 (https=)
EP (1) EP3580283B1 (https=)
JP (1) JP7353185B2 (https=)
KR (1) KR102605046B1 (https=)
CN (1) CN110382636B (https=)
CA (1) CA3052749A1 (https=)
FI (1) FI3580283T3 (https=)
TW (1) TW201842087A (https=)
WO (1) WO2018146617A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11993719B2 (en) 2017-10-27 2024-05-28 National Research Council Of Canada Boron nitride nanotube coated substrates for sintering of metallic traces by intense pulse light
EP3597707B1 (de) * 2018-07-19 2021-10-06 Heraeus Deutschland GmbH & Co. KG Formulierung zum applizieren auf glas, porzellan, fliesen, metallen und kunststofffolien
KR20240170540A (ko) * 2022-03-04 2024-12-03 일렉트로닌크스 인코포레이티드 개선된 전도성 잉크 조성물
CN116321774A (zh) * 2023-02-17 2023-06-23 潍坊东大电子材料有限公司 一种基于无颗粒墨水制备超细导电线路的工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074978A (en) * 1990-02-23 1991-12-24 E. I. Du Pont De Nemours And Company Hydroxy terminated polyester additive in cathodic electrocoat compositions
WO2013036519A1 (en) * 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
CN104263082A (zh) * 2014-08-29 2015-01-07 南京航空航天大学 一种石墨烯有机银导电油墨及其制备方法
WO2015192248A1 (en) * 2014-06-19 2015-12-23 National Research Council Of Canada Molecular inks

Family Cites Families (130)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099376A (en) 1955-06-29 1978-07-11 The B.F. Goodrich Company Gas generator and solid propellant with a silicon-oxygen compound as a burning rate modifier, and method for making the same
US3228897A (en) 1961-10-26 1966-01-11 Minnesota Mining & Mfg Reflective coating compositions containing glass beads, metal flake pigment and binder
US3729339A (en) 1970-11-25 1973-04-24 Owens Illinois Inc Hydroxy functional acrylic ink
US3702259A (en) 1970-12-02 1972-11-07 Shell Oil Co Chemical production of metallic silver deposits
JPS5413260B2 (https=) 1973-09-04 1979-05-29
US3989644A (en) 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
US4088801A (en) 1976-04-29 1978-05-09 General Electric Company U.V. Radiation curable electrically conductive ink and circuit boards made therewith
US4180407A (en) 1977-03-28 1979-12-25 Gibson Donald M Ink for application to unglazed paper surfaces
DE2728465C2 (de) 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4487811A (en) 1980-12-29 1984-12-11 General Electric Company Electrical conductor
US4396666A (en) 1981-11-02 1983-08-02 Cts Corporation Solderable conductive employing an organic binder
JPS604552A (ja) 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
JPS61136978A (ja) 1984-12-06 1986-06-24 アルプス電気株式会社 厚膜回路形成用導電ペ−スト
US4687597A (en) 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions
US4775594A (en) 1986-06-20 1988-10-04 James River Graphics, Inc. Ink jet transparency with improved wetting properties
DE3706860A1 (de) 1987-03-04 1988-09-15 Byk Chemie Gmbh Thixotrope zubereitungen, verwendung von polycarbonsaeureamiden zu ihrer herstellung und mit polycarbonsaeureamiden beschichtetes siliciumdioxid
JPS63278983A (ja) 1987-05-09 1988-11-16 Toyota Autom Loom Works Ltd 金属有機物インク
JPH01174573A (ja) * 1987-12-28 1989-07-11 Shin Etsu Polymer Co Ltd 導電性インキ組成物
DE3810958A1 (de) 1988-03-31 1989-10-12 Basf Ag Tinten fuer ink-jet-aufzeichnungsverfahren
US5064921A (en) 1989-06-07 1991-11-12 Bayer Aktiengesellschaft Hydroxy functional copolymers, a process for the preparation and their use as binders or binder components
JP2619289B2 (ja) 1989-06-20 1997-06-11 三井金属鉱業株式会社 銅導電性組成物
JP2660937B2 (ja) 1990-07-16 1997-10-08 三井金属鉱業株式会社 銅導電性組成物
CN1071182A (zh) 1991-09-28 1993-04-21 胡贵友 热敏变色油墨
US5306590A (en) 1991-12-23 1994-04-26 Xerox Corporation High solids liquid developer containing carboxyl terminated polyester toner resin
JPH08113696A (ja) 1994-10-14 1996-05-07 Toray Dow Corning Silicone Co Ltd 粉体塗料用樹脂組成物
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5989700A (en) 1996-01-05 1999-11-23 Tekscan Incorporated Pressure sensitive ink means, and methods of use
DE69724107T2 (de) 1996-03-04 2004-06-24 DuPont Displays, Inc., Santa Barbara Polyfluorene als materialien für photolumineszenz und elektrolumineszenz
AU5561696A (en) 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
JP3912844B2 (ja) 1997-04-09 2007-05-09 キヤノン株式会社 有機金属を含有するインク並びに電極、電子放出素子および画像形成装置の製造方法
US5980622A (en) 1997-08-29 1999-11-09 Hewlett-Packard Company Magenta dyes for ink-jet inks
US6048389A (en) 1998-02-18 2000-04-11 Eastman Kodak Company Ink jet inks containing modifiers for improved drop formation
JP3813750B2 (ja) 1998-08-27 2006-08-23 大日精化工業株式会社 カラーフィルターの製造方法及びカラーフィルター
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
ES2185549T3 (es) 1999-09-27 2003-05-01 Ciba Sc Holding Ag Tintas de color rojo carmesi (magenta) que contienen colorantes azoicos de complejo de cobre basados en acidos 1-naftol-di- o -trisulfonicos.
US6663799B2 (en) 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
KR100893564B1 (ko) 2001-10-05 2009-04-17 캐보트 코포레이션 저점도 전구체 조성물 및 전도성 전자 형상의 증착 방법
JP2005513117A (ja) 2001-12-12 2005-05-12 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 銅ホルメート錯体を用いる銅の沈着
JP2005520053A (ja) 2002-01-18 2005-07-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 原子層堆積によって銅薄膜を堆積させるための揮発性銅（ｉｉ）錯体
EP1528920B1 (en) 2002-08-12 2013-07-24 Yuuichi Murayama Suppression of abnormal proliferation of prion proteins with leucine, isoleucine or valine
JP2004162110A (ja) 2002-11-12 2004-06-10 Mitsubishi Paper Mills Ltd 銅／アミン組成物
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US20040178391A1 (en) 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
US7141104B2 (en) 2003-06-05 2006-11-28 Agfa-Gevaert UV-absorbing ink composition for ink-jet printing
US20050070629A1 (en) 2003-08-06 2005-03-31 Roberts C. Chad Inkjet ink
US7683107B2 (en) 2004-02-09 2010-03-23 E.I. Du Pont De Nemours And Company Ink jet printable thick film compositions and processes
US7731812B2 (en) 2004-10-19 2010-06-08 E.I. Du Pont De Nemours And Company Thick film conductor case compositions for LTCC tape
US7960037B2 (en) 2004-12-03 2011-06-14 The Regents Of The University Of California Carbon nanotube polymer composition and devices
JP4799881B2 (ja) 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
PL1853671T3 (pl) 2005-03-04 2014-01-31 Inktec Co Ltd Tusze przewodzące i sposób ich wytwarzania
CA2604726C (en) 2005-04-20 2012-01-24 Phibro-Tech, Inc. Production of fine particle copper powders
DE602005025037D1 (de) 2005-09-07 2011-01-05 Exax Inc Silber-organo-sol-farbstoff zum bilden elektrisch leitfähiger muster
KR100815028B1 (ko) 2005-10-05 2008-03-18 삼성전자주식회사 탄소나노튜브용 분산제 및 이를 포함하는 조성물
US8017863B2 (en) 2005-11-02 2011-09-13 The Regents Of The University Of Michigan Polymer wrapped carbon nanotube near-infrared photoactive devices
TWI312799B (en) 2005-12-30 2009-08-01 Ind Tech Res Inst Viscosity controllable highly conductive ink composition and method for fabricating a metal conductive pattern
KR101263003B1 (ko) 2006-02-13 2013-05-09 주식회사 이그잭스 도전선 패턴 형성을 위한 은 오르가노 졸 잉크
JP5205717B2 (ja) 2006-07-04 2013-06-05 セイコーエプソン株式会社 ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法
JP5045015B2 (ja) 2006-07-28 2012-10-10 セイコーエプソン株式会社 ギ酸銅の製造方法、銅粒子の製造方法および配線基板の製造方法
EP2052043B1 (en) 2006-08-07 2016-10-12 Inktec Co., Ltd. Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same
JP2008205430A (ja) 2007-01-26 2008-09-04 Konica Minolta Holdings Inc 金属パターン形成方法及び金属塩混合物
KR20080083790A (ko) 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
JP2009062523A (ja) 2007-08-10 2009-03-26 Think Laboratory Co Ltd 導電性インキ組成物
EP2042536A1 (en) 2007-09-20 2009-04-01 Hexion Specialty Chemicals Research Belgium S.A. Hydroxyl polyester resins for dye ink sublimation
WO2009079004A1 (en) 2007-12-18 2009-06-25 Lumimove, Inc., Dba Crosslink Flexible electroluminescent devices and systems
CN101519356A (zh) 2008-02-28 2009-09-02 华东理工大学 螺环双亚胺和制备方法及其应用
JP5292857B2 (ja) 2008-03-03 2013-09-18 東レ株式会社 有機半導体コンポジット、有機トランジスタ材料ならびに有機電界効果型トランジスタ
US8506849B2 (en) * 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
KR101683026B1 (ko) 2008-04-11 2016-12-07 닛산 가가쿠 고교 가부시키 가이샤 도핑된 공액 중합체, 소자, 및 소자의 제조 방법
JP2009256218A (ja) 2008-04-14 2009-11-05 Toray Ind Inc 銅前駆体組成物およびそれを用いた銅膜の製造方法。
CN101271929B (zh) 2008-05-04 2012-02-01 常州亿晶光电科技有限公司 无铅太阳能电池银浆及其制备方法
JP5470763B2 (ja) 2008-07-10 2014-04-16 東レ株式会社 カーボンナノチューブ分散溶液、有機半導体コンポジット溶液、有機半導体薄膜ならびに有機電界効果型トランジスタ
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
WO2010128107A1 (en) 2009-05-07 2010-11-11 Neodec B.V. Process for manufacturing conductive tracks
JP5699447B2 (ja) 2009-10-09 2015-04-08 東洋インキＳｃホールディングス株式会社 導電性インキ
JP5685372B2 (ja) * 2009-10-27 2015-03-18 石原産業株式会社 金属インキ並びにそれを用いた金属含有膜及びその製造方法
CN102822385B (zh) 2009-11-09 2016-09-07 卡内基·梅隆大学 金属墨水组合物、导电性图案、方法和器件
WO2011156095A2 (en) 2010-06-10 2011-12-15 The Regents Of The University Of California Textile-based printable electrodes for electrochemical sensing
JP5906027B2 (ja) 2010-07-30 2016-04-20 トッパン・フォームズ株式会社 装飾用又は鏡面用インク組成物、基材及び金属銀層を表面に供えた基材の製造方法
JP5788003B2 (ja) 2010-08-27 2015-09-30 エルジー・ケム・リミテッド 導電性金属インク組成物および導電性パターンの形成方法
KR20120046457A (ko) 2010-11-02 2012-05-10 삼성전자주식회사 금속 잉크 조성물, 이를 이용한 전도성 금속막 형성방법 및 이를 이용한 전도성 금속막
KR101276237B1 (ko) 2010-12-02 2013-06-20 한국기계연구원 저온소결 전도성 금속막 및 이의 제조방법
EP2691963B1 (en) 2011-03-29 2015-02-18 Sun Chemical Corporation High-aspect ratio screen printable thick film paste compositions containing wax thixotropes
JP6041517B2 (ja) 2011-04-22 2016-12-07 トッパン・フォームズ株式会社 銀インク組成物
CN102270514A (zh) 2011-05-03 2011-12-07 华中科技大学 一种均相导电浆料
JP2012236870A (ja) 2011-05-10 2012-12-06 Seiko Epson Corp インクジェット記録方法、記録物およびインクセット
KR20120132424A (ko) 2011-05-27 2012-12-05 한양대학교 산학협력단 전도성 구리 나노잉크의 광소결 방법
WO2013063320A1 (en) 2011-10-28 2013-05-02 Liquid X Printed Metals, Inc. Transparent conductive- and ito-replacement materials and structures
KR101986866B1 (ko) 2011-11-15 2019-06-07 니치유 가부시키가이샤 구리 패턴 형성용 조성물 및 구리 패턴의 제조 방법
WO2013073331A1 (ja) 2011-11-17 2013-05-23 Jsr株式会社 銅膜形成方法、銅膜、回路基板および銅膜形成組成物溶液
US9039942B2 (en) 2011-12-21 2015-05-26 E I Du Pont De Nemours And Company Lead-free conductive paste composition and semiconductor devices made therewith
US9469773B2 (en) 2011-12-23 2016-10-18 The Board Of Trustees Of The University Of Illinois Ink composition for making a conductive silver structure
CN104284952A (zh) 2012-02-29 2015-01-14 耶路撒冷希伯来大学伊森姆研究发展有限公司 包含金属前体纳米颗粒的油墨
JP5923351B2 (ja) 2012-03-16 2016-05-24 株式会社Adeka 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法
CN102618033B (zh) 2012-03-28 2013-09-11 成都多吉昌新材料有限公司 一种组合物、含该组合物的led线路板基材和制作方法
JP6027613B2 (ja) 2012-07-09 2016-11-16 四国化成工業株式会社 銅被膜形成剤及び銅被膜の形成方法
KR101941450B1 (ko) 2012-08-02 2019-01-23 엘지디스플레이 주식회사 발광 다이오드 패키지
US8948839B1 (en) 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
US8945328B2 (en) 2012-09-11 2015-02-03 L.I.F.E. Corporation S.A. Methods of making garments having stretchable and conductive ink
KR20140044743A (ko) 2012-10-04 2014-04-15 한양대학교 산학협력단 전도성 하이브리드 구리잉크 및 이를 이용한 광소결 방법
CN102863845A (zh) 2012-10-11 2013-01-09 复旦大学 印制电子用银有机导电油墨
CN103084581B (zh) 2013-01-08 2015-02-04 河南大学 一种铜纳米线的制备方法
KR101350507B1 (ko) 2013-01-09 2014-01-17 (주)쎄미시스코 금속 나노입자를 포함하는 전기전도성 잉크 및 이의 광 소결 방법
JP2014148732A (ja) 2013-02-04 2014-08-21 Yamagata Univ 新規被覆銅微粒子及びその製造方法
US20140255707A1 (en) 2013-03-06 2014-09-11 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
JP2014182913A (ja) 2013-03-19 2014-09-29 Fujifilm Corp 導電膜形成用組成物およびこれを用いる導電膜の製造方法
US9198288B2 (en) 2013-05-15 2015-11-24 Xerox Corporation Method of making silver carboxylates for conductive ink
US9283618B2 (en) 2013-05-15 2016-03-15 Xerox Corporation Conductive pastes containing silver carboxylates
US20140349025A1 (en) 2013-05-23 2014-11-27 E I Du Pont De Nemours And Company Conductive compositions and methods relating thereto
CN105611986B (zh) 2013-08-20 2018-05-11 加拿大国家研究委员会 用于纯化半导体单壁碳纳米管的方法
KR20150045605A (ko) 2013-10-21 2015-04-29 전자부품연구원 구리 잉크 조성물 및 이를 이용한 도전 패턴 형성 방법
US9540734B2 (en) * 2013-11-13 2017-01-10 Xerox Corporation Conductive compositions comprising metal carboxylates
KR101597651B1 (ko) 2013-12-30 2016-02-25 전자부품연구원 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법
KR102233293B1 (ko) 2014-01-15 2021-03-29 (주)창성 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법
EP2918370A1 (en) 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Soldering method for polymer thick film compositions
EP2918371A1 (en) 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition
JP6468889B2 (ja) 2014-03-11 2019-02-13 三井金属鉱業株式会社 導電性組成物、及びそれを用いた導電体の製造方法
US20150298248A1 (en) 2014-04-17 2015-10-22 Electroninks Incorporated Bonded structure including a conductive bonding layer and low-temperature method of forming a bonded structure
JP6599891B2 (ja) 2014-04-17 2019-10-30 エレクトロニンクス インコーポレイテッド 導電性インク組成物
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
US9460824B2 (en) 2014-04-23 2016-10-04 Xerox Corporation Stretchable conductive film based on silver nanoparticles
KR102321619B1 (ko) 2014-04-25 2021-11-05 주식회사 다이셀 은 입자 도료 조성물
CN106661360A (zh) 2014-05-30 2017-05-10 电子墨水书写公司 用于滚珠笔的导电墨水和衬底上形成的导电迹线
US10672531B2 (en) 2014-07-22 2020-06-02 Alpha Assembly Solutions Inc. Stretchable interconnects for flexible electronic surfaces
US9809489B2 (en) 2014-09-12 2017-11-07 Jsr Corporation Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
CN104479463B (zh) 2015-01-09 2017-07-21 东北大学 一种含有草酸银的透明导电无颗粒银基墨水及其制备方法
CN106147405A (zh) 2016-07-06 2016-11-23 复旦大学 铜导电油墨及铜导电油墨、铜导电薄膜的制备方法
TWI842668B (zh) 2017-02-08 2024-05-21 加拿大國家研究委員會 具低黏度與低加工溫度之銀分子油墨

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074978A (en) * 1990-02-23 1991-12-24 E. I. Du Pont De Nemours And Company Hydroxy terminated polyester additive in cathodic electrocoat compositions
WO2013036519A1 (en) * 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
WO2015192248A1 (en) * 2014-06-19 2015-12-23 National Research Council Of Canada Molecular inks
CN104263082A (zh) * 2014-08-29 2015-01-07 南京航空航天大学 一种石墨烯有机银导电油墨及其制备方法

Also Published As

Publication number Publication date
TW201842087A (zh) 2018-12-01
EP3580283B1 (en) 2023-11-15
CN110382636A (zh) 2019-10-25
FI3580283T3 (fi) 2023-12-28
EP3580283A1 (en) 2019-12-18
CA3052749A1 (en) 2018-08-16
EP3580283A4 (en) 2020-12-09
JP7353185B2 (ja) 2023-09-29
US11472980B2 (en) 2022-10-18
KR102605046B1 (ko) 2023-11-22
WO2018146617A1 (en) 2018-08-16
JP2020507669A (ja) 2020-03-12
KR20190112803A (ko) 2019-10-07
US20200010706A1 (en) 2020-01-09

Similar Documents

Publication Publication Date Title
US11525066B2 (en) Molecular inks
CN110382636B (zh) 具有改善的热稳定性的分子油墨
KR102671577B1 (ko) 인쇄가능한 분자 잉크
JP2018048324A (ja) 透明な導電性コーティングを調製するためのエマルション
KR102568858B1 (ko) 낮은 점도 및 낮은 처리 온도를 갖는 실버 분자 잉크
JP2015007230A (ja) ポリビニルブチラールバインダーを含む導電性金属インク
JP2009088122A (ja) 導電性基板
JP5354037B2 (ja) 導電性基板の製造方法
HK40033666B (en) Molecular inks
HK1236556B (en) Molecular inks
HK1236556A1 (en) Molecular inks

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant