CN108306138A - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN108306138A
CN108306138A CN201810019843.4A CN201810019843A CN108306138A CN 108306138 A CN108306138 A CN 108306138A CN 201810019843 A CN201810019843 A CN 201810019843A CN 108306138 A CN108306138 A CN 108306138A
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thickness
electric connector
terminal
contact site
interconnecting piece
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何建志
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to CN201810019843.4A priority Critical patent/CN108306138A/zh
Publication of CN108306138A publication Critical patent/CN108306138A/zh
Priority to CN201811501709.4A priority patent/CN109361094B/zh
Priority to US16/242,381 priority patent/US10547136B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2457Contacts for co-operating by abutting resilient; resiliently-mounted consisting of at least two resilient arms contacting the same counterpart
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • HELECTRICITY
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    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
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    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
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    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7076Coupling devices for connection between PCB and component, e.g. display
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Abstract

一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:一端子,所述端子具有一接触部用以接触所述芯片模块,和一导接部用以导接所述电路板,以及一连接部连接所述接触部和所述导接部;其中所述接触部、所述连接部和所述导接部一体成型,且三者其中之一的厚度与其余二者的厚度均不同,以调节所述端子的阻抗至一合适的范围,满足阻抗匹配的要求,从而提高所述电连接器的高频传输性能。

Description

电连接器
技术领域
本发明涉及一种电连接器,尤指一种改善高频性能的电连接器。
背景技术
专利号为CN201420377264.4的中国专利揭示了一种电连接器,包括一绝缘本体和设于绝缘本体的多个端子,每一端子具有一接触臂,所述接触臂具有一组装部,和由组装部向上弯折延伸的一弹性部用以接触一芯片模块,以及一连料部组装于接触臂,连料部的下端连接于组装部,上端用以连接于一料带。然而连料部与接触臂之间需要组装配合,导致生产周期长,而且二者容易相互碰撞,使得端子折损,导致次品率增加,更重要的是,连料部与接触臂之间产生新的接触界面,导致端子阻抗过高,高频性能差。
本发明针对以上问题,提供一种新的电连接器,采用新技术手段以解决这些问题。
发明内容
针对背景技术所面临的问题,本发明创作目的在于提供一种端子各部分具有不同厚度,以降低端子的阻抗,进而提高高频性能的电连接器。
为实现上述目的,本发明采用以下技术手段:
本发明提供一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:一端子,所述端子具有一接触部用以接触所述芯片模块,和一导接部用以导接所述电路板,以及一连接部连接所述接触部和所述导接部;其中,所述接触部、所述连接部和所述导接部一体成型,且三者其中之一的厚度与其余二者的厚度均不同,以调节所述端子的阻抗至一合适的范围,满足所述电连接器阻抗匹配的要求。
进一步,所述端子由厚薄料冲切而成,所述连接部的厚度T1与所述接触部的厚度T2或所述导接部的厚度T3不同。
进一步,所述连接部的厚度T1大于所述接触部的厚度T2和所述导接部的厚度T3,较厚的所述连接部可降低所述端子的自感,从而降低所述端子的阻抗至一合适的范围。
进一步,所述连接部具有一主体部,和沿所述主体部的厚度方向由所述主体部凸伸的一凸部。
进一步,所述凸部的厚度t1大于所述主体部的厚度t2。
进一步,所述凸部的厚度t1大于所述接触部的厚度T2或所述导接部的厚度T3。
进一步,所述连接部包括由所述主体部向上延伸的一弹臂连接于所述接触部,在所述连接部的侧面投影中,所述凸部的纵轴线L穿过所述弹臂。
进一步,一绝缘本体,具有多个上下贯穿的端子孔,所述凸部夹设于所述主体部和所述端子孔的一侧壁之间,且与所述侧壁之间具有一间隙D。
进一步,所述主体部向上延伸一连料部用以连接于料带,所述连料部整体高于所述凸部。
进一步,所述端子由粉末冶金技术制成,所述连接部的厚度T1大于所述接触部的厚度T2和所述导接部的厚度T3。
与现有技术相比,本发明具有以下有益效果:所述接触部、所述连接部和所述导接部三者一体成型,连接紧密、不会松脱,且三者其中之一的厚度与其余二者的厚度均不同,以调节所述端子的阻抗至一合适的范围,满足阻抗匹配的要求,从而提高所述电连接器的高频传输性能。
【附图说明】
图1为本发明电连接器中,由厚薄料成型端子的示意图;
图2为本发明电连接器的立体图;
图3为图2中沿A-A方向的局部剖视图;
图4为图3中的电连接器电性连接芯片模块和电路板的示意图。
具体实施方式的附图标号说明:
电连接器100 绝缘本体1 端子孔2 侧壁S
卡槽3 端子4 接触部5 连接部6
主体部7 凸部8 导接部9 连料部10
弹臂11 卡点12 纵轴线L 间距D
厚薄料P 厚部p1 薄部p2 芯片模块13
导电片14 电路板15 焊料16
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
如图1至图4所示,为本发明电连接器100,用以电性连接一芯片模块13至一电路板15,其主要元件包括:多个端子4和用以收容多个所述端子4的一绝缘本体1。
如图1所示,所述端子4由一厚薄料P冲切而成,所述厚薄料P具有一薄部p2和凸设于所述薄部p2的一厚部p1。
请继续参考图1,所述端子4包括一连接部6,所述连接部6具有一主体部7和由所述主体部7沿厚度方向凸伸的一凸部8,所述厚部p1冲切形成所述凸部8,所述薄部p2冲切形成形成所述端子4的所述主体部7。
所述端子4进一步包括由所述主体部7向上并排延伸的一弹臂11和一连料部10,所述连料部10整体位于所述凸部8的上方,用以连接料带,所述端子4的两侧、于所述连料部10和所述主体部7上分别设有一卡点12;所述端子4还包括由所述弹臂11向上弯折延伸的一接触部5,以及由所述主体部7向下弯折延伸的一导接部9呈水平平板状设置,所述弹臂11、所述连料部10和所述导接部9均由所述薄部p2冲切而成。
请参照图3,可清楚显示所述连接部6的侧视图,所述连接部6的厚度T1大于所述接触部5的厚度T2和所述导接部9的厚度T3,使得所述连接部6具有较大的体积;所述凸部8的厚度t1大于所述主体部7的厚度t2,所述凸部8的纵轴线L向上延伸穿过所述弹臂11,且向下延伸穿过所述导接部9,使得所述弹臂11和所述导接部9都均衡设于所述纵轴线L的两侧,结构紧凑,占用较小的空间,可提高所述端子4的排布密度。
如图2和图3所示,所述绝缘本体1具有上下贯通的多个端子孔2,所述端子孔2具有多个侧壁S,相对的两个侧壁S上分别设有一卡槽3。
如图2和图3所示,将多个所述端子4从上至下组装于所述端子孔2,两个所述卡槽3导引对应的所述卡点12分别卡持于对应的所述卡槽3,所述凸部8夹设于所述主体部7和一所述侧壁S之间,并与这一所述侧壁S之间形成一间隙D,避免所述凸部8与所述侧壁S干涉,导致所述端子4偏斜,同时也避免所述凸部8刮伤所述侧壁S;所述弹臂11向上延伸出所述端子孔2,使得所述接触部5位于所述端子孔2外,所述导接部9向下延伸出所述端子孔2,一焊料16附接于所述导接部9的下表面。
如图4所示,将所述电连接器100通过所述焊料16回流焊接于所述电路板15,再将所述芯片模块13压接于所述电连接器100上,所述芯片模块13的多个导电片14分别电性接触对应的多个所述接触部5,使所述芯片模块13和所述电路板15电性导通。
本实施例中,厚薄料P可直接从原材料厂商处购买,使得所述端子4的厚度不同的所述连接部6、所述接触部5和所述导接部9可直接由所述厚薄料P不同厚度的厚部p1和薄部p2一体冲切成型,所述端子4的各部分连接紧密、不会松脱,具有优良的高频性能,同时无需再次组装,缩短所述端子4的生产周期。
本实施例中,所述主体部7的厚度t2等于所述接触部5的厚度T2和所述导接部9的厚度T3,其它实施例中,所述主体部7的厚度t2和所述接触部5的厚度T2或所述导接部9的厚度T3可以不相等;本实施例中,仅设有一个所述凸部8设于所述连接部6,其它实施例中,所述凸部8的数量可为多个,多个所述凸部8可分别设于所述连接部6、或所述弹臂11、或所述导接部9、或所述接触部5。
其它实施例中(未图示),所述端子4可由粉末冶金技术、3D打印等一体成型,而结构可与上述实施例一致,随着这些新技术的成熟,可进一步优化所述电连接器100的制程,如在所述绝缘本体1成型之后,将所述端子4直接3D打印成型于所述端子孔2中,而不需再组装。
综上所述,本发明电连接器有下列有益效果:
1、所述接触部5、所述连接部6和所述导接部9三者一体成型,连接紧密、不会松脱,且三者其中之一的厚度与其余二者的厚度均不同,以调节所述端子4的阻抗至一合适的范围,满足所述电连接器100阻抗匹配的要求,从而提高所述电连接器100的高频传输性能。
2、所述端子4由厚薄料P冲切而成,所述连接部6的厚度T1大于所述接触部5的厚度T2和所述导接部9的厚度T3,使得所述连接部6具有较大的体积,从而降低所述端子4的自感,且拉近相邻所述端子4的所述连接部6的距离,增加所述电连接器100的电容,降低其阻抗,进而提高高频性能;同时,所述接触部5的厚度T2和所述导接部9的厚度T3均小于所述连接部6的厚度T1,使得所述接触部5和所述导接部9具有较好的弹性。
3、在所述连接部6的侧面投影中,所述凸部8的纵轴线L穿过所述弹臂11,使得所述弹臂11均衡设于所述纵轴线L的两侧,相对于所述弹臂11完全设于所述纵轴线L的一侧而言,结构紧凑,占用较小的空间。
4、所述凸部8与所述端子孔2的一侧壁S间具有一间隙D,是所述端子4组装于所述端子孔2时,所述凸部8不会与所述侧壁S干涉,避免所述端子4偏斜而造成多个所述端子4的平面度较差。
以上详细说明仅为本发明之较佳实施例的说明,非因此局限本发明之专利范围,所以,凡运用本创作说明书及图示内容所为之等效技术变化,均包含于本创作之专利范围内。

Claims (10)

1.一种电连接器,用以电性连接一芯片模块至一电路板,其特征在于,包括:
一端子,所述端子具有一接触部用以接触所述芯片模块,和一导接部用以导接所述电路板,以及一连接部连接所述接触部和所述导接部;其中,
所述接触部、所述连接部和所述导接部一体成型,且三者其中之一的厚度与其余二者的厚度均不同,以调节所述端子的阻抗至一合适的范围,满足所述电连接器阻抗匹配的要求。
2.如权利要求1所述的电连接器,其特征在于:所述端子由厚薄料冲切而成,所述连接部的厚度T1与所述接触部的厚度T2或所述导接部的厚度T3不同。
3.如权利要求2所述的电连接器,其特征在于:所述连接部的厚度T1大于所述接触部的厚度T2和所述导接部的厚度T3,较厚的所述连接部可降低所述端子的自感,从而降低所述端子的阻抗至一合适的范围。
4.如权利要求1所述的电连接器,其特征在于:所述连接部具有一主体部,和沿所述主体部的厚度方向由所述主体部凸伸的一凸部。
5.如权利要求4所述的电连接器,其特征在于:所述凸部的厚度t1大于所述主体部的厚度t2。
6.如权利要求4所述的电连接器,其特征在于:所述凸部的厚度t1大于所述接触部的厚度T2或所述导接部的厚度T3。
7.如权利要求4所述的电连接器,其特征在于:所述连接部包括由所述主体部向上延伸的一弹臂连接于所述接触部,在所述连接部的侧面投影中,所述凸部的纵轴线L穿过所述弹臂。
8.如权利要求4所述的电连接器,其特征在于:一绝缘本体,具有多个上下贯穿的端子孔,所述凸部夹设于所述主体部和所述端子孔的一侧壁之间,且与所述侧壁之间具有一间隙D。
9.如权利要求4所述的电连接器,其特征在于:所述主体部向上延伸一连料部用以连接于料带,所述连料部整体高于所述凸部。
10.如权利要求1所述的电连接器,其特征在于:所述端子由粉末冶金技术制成,所述连接部的厚度T1大于所述接触部的厚度T2和所述导接部的厚度T3。
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