CN109361094A - 电连接器 - Google Patents
电连接器 Download PDFInfo
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Abstract
一种电连接器,用以电性连接具有多个导电片的一芯片模块至一电路板,包括:一绝缘本体,具有相对的一上表面面对芯片模块和一下表面面对电路板,及多个端子孔贯穿所述上表面和所述下表面;多个端子,每一端子具有一连接部对应定位于端子孔中,自连接部延伸形成一导接部用以导接电路板,自连接部向上弯折延伸形成至少一弹臂向上伸出端子孔,自每一弹臂向上弯折延伸一接触部,当芯片模块下压时,导电片的底面向下抵接接触部的顶面且弹臂向下压缩变形;其中,接触部、弹臂、连接部和导接部一体成型,且连接部的厚度大于接触部的厚度,以调节端子的阻抗至一合适的范围,满足所述电连接器阻抗匹配的要求,从而提高所述电连接器的高频传输性能。
Description
【技术领域】
本发明涉及一种电连接器,尤指一种改善高频性能的电连接器。
【背景技术】
专利号为CN201420377264.4的中国专利揭示了一种电连接器,包括一绝缘本体和设于绝缘本体的多个端子,每一端子具有一接触臂,所述接触臂具有一组装部,和由组装部向上弯折延伸的一弹性部用以接触一芯片模块,以及一连料部组装于接触臂,连料部的下端连接于组装部,上端用以连接于一料带。然而连料部与接触臂之间需要组装配合,导致生产周期长,而且二者容易相互碰撞,使得端子折损,导致次品率增加,更重要的是,连料部与接触臂之间产生新的接触界面,导致端子阻抗过高,高频性能差。
本发明针对以上问题,提供一种新的电连接器,采用新技术手段以解决这些问题。
【发明内容】
针对背景技术所面临的问题,本发明创作目的在于提供一种端子各部分具有不同厚度,以降低端子的阻抗,进而提高高频性能的电连接器。
为实现上述目的,本发明采用以下技术手段:
本发明提供一种电连接器,用以电性连接具有多个导电片的一芯片模块至一电路板,其特征在于,包括:一绝缘本体,具有相对的一上表面面对芯片模块和一下表面面对电路板,及多个端子孔贯穿所述上表面和所述下表面;多个端子,每一端子具有一连接部对应定位于所述端子孔中,自所述连接部延伸形成一导接部用以导接所述电路板,自所述连接部向上弯折延伸形成至少一弹臂向上伸出所述端子孔,自每一所述弹臂向上弯折延伸一接触部,当所述芯片模块下压时,所述导电片的底面向下抵接所述接触部的顶面且所述弹臂向下压缩变形;其中,所述接触部、所述弹臂、所述连接部和所述导接部一体成型,且所述连接部的厚度大于所述接触部的厚度。
进一步,所述连接部的厚度大于所述弹臂的厚度。
进一步,所述连接部的厚度大于所述导接部的厚度。
进一步,所述电路板对应每一所述导接部设有一插孔,所述导接部为鱼眼结构且与所述插孔过盈配合。
进一步,所述连接部具有一主体部,和沿所述主体部的厚度方向由所述主体部凸伸的一凸部,所述弹臂由所述主体部向上弯折延伸,所述主体部的厚度等于所述弹臂的厚度。
进一步,所述凸部的厚度大于所述主体部的厚度。
进一步,所述凸部的顶端低于所述主体部的顶端,所述主体部的厚度等于所述接触部的厚度和所述导接部的厚度。
进一步,在所述连接部的侧面投影中,所述凸部的纵轴线穿过所述弹臂。
进一步,所述凸部夹设于所述主体部和所述端子孔的一侧壁之间,且与所述侧壁之间具有一间隙。
进一步,所述主体部向上延伸一连料部用以连接于料带,所述连料部整体高于所述凸部。
进一步,在所述连接部的侧面投影中,所述凸部的纵轴线穿过所述导接部。
进一步,所述导接部的厚度等于所述连接部的厚度,且所述导接部的底端与所述电路板的一导接片相接触。
进一步,所述导接部的厚度大于所述接触部的厚度,所述导接部凹设形成多个凹槽,多个焊料对应收容于多个所述凹槽且与所述电路板的同一个导接片相焊接。
进一步,自所述连接部向上弯折形成多个所述弹臂,同一个所述端子的多个所述接触部向上抵接同一个所述导电片。
进一步,同一个所述端子的相邻两个所述弹臂之间具有一沟槽,所述沟槽由激光冲切形成,且所述沟槽的宽度小于所述弹臂的厚度。
进一步,多个所述端子包括至少一信号端子和至少一电源端子。
与现有技术相比,本发明具有以下有益效果:
所述接触部、所述弹臂、所述连接部和所述导接部一体成型,连接紧密、不会松脱,且所述连接部的厚度大于所述接触部的厚度,以调节所述端子的阻抗至一合适的范围,满足阻抗匹配的要求,从而提高所述电连接器的高频传输性能。
【附图说明】
图1为本发明第一实施例的电连接器中,由厚薄料成型端子的示意图;
图2为本发明第一实施例的电连接器的立体图;
图3为图2中沿A-A方向的局部剖视图;
图4为图3中的电连接器电性连接芯片模块和电路板的示意图。
图5为本发明第二实施例的电连接器中,由厚薄料成型端子的示意图;图6为本发明第二实施例的电连接器的示意图;
图7为图6中的电连接器在另一角度且电性连接芯片模块和电路板的示意图;
图8为本发明第三实施例的电连接器中,由厚薄料成型端子的示意图;
图9为本发明第三实施例的电连接器的示意图;
图10为图9中的电连接器在另一角度且电性连接芯片模块和电路板的示意图;
图11为本发明第四实施例的电连接器中,由厚薄料成型端子的示意图;
图12为本发明第四实施例的电连接器的示意图;
图13为图12中的电连接器在另一角度且电性连接芯片模块和电路板的示意图。
具体实施方式的附图标号说明:
电连接器100 | 绝缘本体1 | 端子孔2 | |
卡槽3 | 端子4 | 信号端子4a | 电源端子4b |
接触部5 | 连接部6 | 主体部7 | 凸部8 |
导接部9 | 连料部10 | 弹臂11 | 卡点12 |
纵轴线L | 间距D | 厚薄料P | 厚部p1 |
薄部p2 | 芯片模块13 | 导电片14 | 电路板15 |
焊料16 | 导接片17 | 沟槽18 | 凹槽19 |
插孔20 | 导电层21 | 上表面1a | 下表面1b |
第一侧壁S1 | 第二侧壁S2 | 宽度d |
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
如图1至图4所示,为本发明第一实施例的电连接器100,用以电性连接一芯片模块13至一电路板15,其主要元件包括:多个端子4和用以收容多个所述端子4的一绝缘本体1。
如图1所示,所述端子4由一厚薄料P冲切而成,所述厚薄料P具有一薄部p2和凸设于所述薄部p2的一厚部p1。
请继续参考图1和图2,多个所述端子4包括多个信号端子4a和多个电源端子4b,所述信号端子4a和所述电源端子4b的结构相同。在其它实施例中,多个所述端子4包括一个所述信号端子4a和多个所述电源端子4b,或者多个所述端子4包括一个所述电源端子4b和多个所述信号端子4a,或者多个所述端子4仅包括一个所述信号端子4a和一个所述电源端子4b。每一所述端子4包括一连接部6,所述连接部6具有一主体部7和由所述主体部7沿厚度方向凸伸的一凸部8,所述凸部8的顶端M低于所述主体部7的顶端N,所述厚部p1冲切形成所述凸部8,所述薄部p2冲切形成所述端子4的所述主体部7。
每一所述端子4进一步包括由所述主体部7向上并排延伸的一弹臂11和一连料部10,所述连料部10整体位于所述凸部8的上方,用以连接料带,所述端子4的两侧、于所述连料部10和所述主体部7上分别设有一卡点12;所述端子4还包括由所述弹臂11向上弯折延伸的一接触部5,以及由所述主体部7弯折延伸的一导接部9呈水平平板状设置,所述弹臂11、所述连料部10和所述导接部9均由所述薄部p2冲切而成。
请参照图3,可清楚显示所述连接部6的侧视图,所述连接部6的厚度T1大于所述接触部5的厚度T2和所述导接部9的厚度T3,使得所述连接部6具有较大的体积;所述凸部8的厚度t1大于所述主体部7的厚度t2,所述凸部8的纵轴线L向上延伸穿过所述弹臂11,且向下延伸穿过所述导接部9,使得所述弹臂11和所述导接部9都均衡设于所述纵轴线L的两侧,结构紧凑,占用较小的空间,可提高所述端子4的排布密度。
如图2和图3所示,所述绝缘本体1具有相对的一上表面1a面对芯片模块13和一下表面1b面对电路板15,及多个端子孔2上下贯穿所述上表面1a和所述下表面1b,所述端子孔2具有相对的两第一侧壁S1及连接第一侧壁S1和一第二侧壁S2,两第一侧壁S1上分别设有一卡槽3。
如图2和图3所示,将多个所述端子4从上至下组装于所述端子孔2,所述卡点12卡持于对应的所述卡槽3,以将所述端子4定位于所述端子孔2(当然在其它实施例中,所述连接部6也可通过其它方式以将所述端子4固定于所述端子孔2),所述凸部8夹设于所述主体部7和所述第二侧壁S2之间,并与所述第二侧壁S2之间形成一间隙D,避免所述凸部8与所述第二侧壁S2干涉,导致所述端子4偏斜,同时也避免所述凸部8刮伤所述第二侧壁S2;所述弹臂11向上延伸出所述端子孔2,使得所述接触部5位于所述端子孔2外,所述导接部9向下延伸出所述端子孔2,一焊料16附接于所述导接部9的下表面,以将所述导接部9对应与所述电路板15的一导接片17相焊接。
如图4所示,将所述电连接器100通过所述焊料16回流焊接于所述电路板15,再将所述芯片模块13压接于所述电连接器100上,所述芯片模块13的多个导电片14的底面分别抵接对应的所述接触部5的顶面且所述弹臂11向下压缩变形,使所述芯片模块13和所述电路板15电性导通。
本实施例中,厚薄料P可直接从原材料厂商处购买,使得所述端子4的厚度不同的所述连接部6、所述接触部5和所述导接部9可直接由所述厚薄料P不同厚度的厚部p1和薄部p2一体冲切成型,所述端子4的各部分连接紧密、不会松脱,具有优良的高频性能,同时无需再次组装,缩短所述端子4的生产周期。
本实施例中,所述主体部7的厚度t2等于所述接触部5的厚度T2和所述导接部9的厚度T3和所述弹臂11的厚度T4,其它实施例中,所述主体部7的厚度t2和所述接触部5的厚度T2或所述导接部9的厚度T3可以不相等;本实施例中,仅设有一个所述凸部8设于所述连接部6,其它实施例中,所述凸部8的数量可为多个,多个所述凸部8可分别设于所述连接部6、或所述弹臂11、或所述导接部9。
其它实施例中(未图示),所述端子4可由粉末冶金技术、3D打印等一体成型,而结构可与上述实施例一致,随着这些新技术的成熟,可进一步优化所述电连接器100的制程,如在所述绝缘本体1成型之后,将所述端子4直接3D打印成型于所述端子孔2中,而不需再组装。
如图5至图7所示,为本发明第二实施例的电连接器100,其与第一实施例的电连接器100的不同之处主要在于:每一所述端子4包括自所述连接部6向上弯折形成的多个所述弹臂11,多个所述弹臂11的厚度T4均相等,同一个所述端子4的相邻两个所述弹臂11之间具有一沟槽18,所述沟槽18由激光冲切形成,且所述沟槽18的宽度d小于所述弹臂11的厚度T4,同一个所述端子4的多个所述接触部5向上抵接同一个所述导电片14。所述导接部9自所述连接部6向下竖直延伸形成,所述导接部9的厚度T3大于所述接触部5的厚度T2且等于所述连接部6的厚度T1,所述导接部9的底端与所述电路板15的所述导接片17相接触。由于第二实施中的其余结构与第一实施例相同,故不再作重复描述。
如图8至图10所示,为本发明第三实施例的电连接器100,其与第二实施例的电连接器100的不同之处主要在于:每一所述导接部9的底端向上凹设形成的多个凹槽19,多个所述焊料16对应收容于多个所述凹槽19且与所述电路板15的同一个所述导接片17相焊接。由于第三实施中的其余结构与第二实施例相同,故不再作重复描述。
如图11至图13所示,为本发明第四实施例的电连接器100,其与第二实施例的电连接器100的不同之处主要在于:每一所述端子4包括自所述连接部6竖直向下延伸形成的两个所述导接部9,所述导接部9为鱼眼结构,且所述导接部9的厚度T3小于所述连接部6的厚度T1且等于所述弹臂11的厚度T4。当然在其它实施例中,所述导接部9的数量可以为一个或者两个以上。所述电路板15对应每一所述导接部9设有一插孔20,所述插孔20上下贯穿所述电路板15,所述导接部9与所述插孔20过盈配合且与所述插孔20内的导电层21相导接。由于第四实施中的其余结构与第二实施例相同,故不再作重复描述。
综上所述,本发明电连接器有下列有益效果:
1、所述接触部5、所述弹臂11、所述连接部6和所述导接部9一体成型,连接紧密、不会松脱,且所述连接部6的厚度大于所述接触部5的厚度,以调节所述端子4的阻抗至一合适的范围,满足所述电连接器100阻抗匹配的要求,从而提高所述电连接器100的高频传输性能。
2、所述端子4由厚薄料P冲切而成,所述连接部6的厚度T1大于所述接触部5的厚度T2和所述导接部9的厚度T3,使得所述连接部6具有较大的体积,从而降低所述端子4的自感,且拉近相邻所述端子4的所述连接部6的距离,增加所述电连接器100的电容,降低其阻抗,进而提高高频性能;同时,所述接触部5的厚度T2和所述导接部9的厚度T3均小于所述连接部6的厚度T1,使得所述接触部5和所述导接部9具有较好的弹性。
3、在所述连接部6的侧面投影中,所述凸部8的纵轴线L穿过所述弹臂11,使得所述弹臂11均衡设于所述纵轴线L的两侧,相对于所述弹臂11完全设于所述纵轴线L的一侧而言,结构紧凑,占用较小的空间。
4、所述凸部8与所述端子孔2的第二侧壁S2间具有一间隙D,使所述端子4组装于所述端子孔2时,所述凸部8不会与所述第二侧壁S2干涉,避免所述端子4偏斜而造成多个所述端子4的平面度较差。
5、每一所述端子4均设有多个所述弹臂11对应与同一个所述导接片17相导接,以进一步提高所述电连接器100与所述芯片模块13之间的高频传输性能。
6、所述导接部9的厚度T3等于所述连接部6的厚度T1,且所述导接部9的底端与所述导接片17相接触,以进一步提高所述电连接器100与所述电路板15之间的高频传输性能。
7、由于所述电源端子4b的所述连接部6的厚度T1较大,可增强所述电源端子4b的耐高温性能,从而使所述电源端子4b可传输更大的电流。
以上详细说明仅为本发明之较佳实施例的说明,非因此局限本发明之专利范围,所以,凡运用本创作说明书及图示内容所为之等效技术变化,均包含于本创作之专利范围内。
Claims (16)
1.一种电连接器,用以电性连接具有多个导电片的一芯片模块至一电路板,其特征在于,包括:一绝缘本体,具有相对的一上表面面对芯片模块和一下表面面对电路板,及多个端子孔贯穿所述上表面和所述下表面;多个端子,每一端子具有一连接部对应位于所述端子孔中,自所述连接部延伸形成一导接部用以导接所述电路板,自所述连接部向上弯折延伸形成至少一弹臂向上伸出所述端子孔,自每一所述弹臂向上弯折延伸一接触部,当所述芯片模块下压时,所述导电片的底面向下抵接所述接触部的顶面且所述弹臂向下压缩变形;其中,所述接触部、所述弹臂、所述连接部和所述导接部一体成型,且所述连接部的厚度大于所述接触部的厚度。
2.如权利要求1所述的电连接器,其特征在于:所述连接部的厚度大于所述弹臂的厚度。
3.如权利要求1所述的电连接器,其特征在于:所述连接部的厚度大于所述导接部的厚度。
4.如权利要求3所述的电连接器,其特征在于:所述电路板对应每一所述导接部设有一插孔,所述导接部为鱼眼结构且与所述插孔过盈配合。
5.如权利要求1所述的电连接器,其特征在于:所述连接部具有一主体部,和沿所述主体部的厚度方向由所述主体部凸伸的一凸部,所述弹臂由所述主体部向上弯折延伸,所述主体部的厚度等于所述弹臂的厚度。
6.如权利要求5所述的电连接器,其特征在于:所述凸部的厚度大于所述主体部的厚度。
7.如权利要求5所述的电连接器,其特征在于:所述凸部的顶端低于所述主体部的顶端,所述主体部的厚度等于所述接触部的厚度和所述导接部的厚度。
8.如权利要求5所述的电连接器,其特征在于:在所述连接部的侧面投影中,所述凸部的纵轴线穿过所述弹臂。
9.如权利要求5所述的电连接器,其特征在于:所述凸部夹设于所述主体部和所述端子孔的一侧壁之间,且与所述侧壁之间具有一间隙。
10.如权利要求5所述的电连接器,其特征在于:所述主体部向上延伸一连料部用以连接于料带,所述连料部整体高于所述凸部。
11.如权利要求5所述的电连接器,其特征在于:在所述连接部的侧面投影中,所述凸部的纵轴线穿过所述导接部。
12.如权利要求1所述的电连接器,其特征在于:所述导接部的厚度等于所述连接部的厚度,且所述导接部的底端与所述电路板的一导接片相接触。
13.如权利要求1所述的电连接器,其特征在于:所述导接部的厚度大于所述接触部的厚度,所述导接部凹设形成多个凹槽,多个焊料对应收容于多个所述凹槽且与所述电路板的同一个导接片相焊接。
14.如权利要求1所述的电连接器,其特征在于:自所述连接部向上弯折形成多个所述弹臂,同一个所述端子的多个所述接触部向上抵接同一个所述导电片。
15.如权利要求14所述的电连接器,其特征在于:同一个所述端子的相邻两个所述弹臂之间具有一沟槽,所述沟槽由激光冲切形成,且所述沟槽的宽度小于所述弹臂的厚度。
16.如权利要求1所述的电连接器,其特征在于:多个所述端子包括至少一信号端子和至少一电源端子。
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US10547136B2 (en) | 2020-01-28 |
CN109361094B (zh) | 2020-12-22 |
US20190214761A1 (en) | 2019-07-11 |
CN108306138A (zh) | 2018-07-20 |
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