CN106102985B - 透明材料和不透明材料的激光焊接 - Google Patents

透明材料和不透明材料的激光焊接 Download PDF

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Publication number
CN106102985B
CN106102985B CN201580015779.7A CN201580015779A CN106102985B CN 106102985 B CN106102985 B CN 106102985B CN 201580015779 A CN201580015779 A CN 201580015779A CN 106102985 B CN106102985 B CN 106102985B
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China
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shell
window
electronic equipment
side wall
hole
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CN106102985A (zh
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L·M·艾姆斯
M·M·李
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Apple Inc
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Apple Computer Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3888—Arrangements for carrying or protecting transceivers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B23K26/26—Seam welding of rectilinear seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B29C65/1638—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding focusing the laser beam on the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142—Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/724—User interfaces specially adapted for cordless or mobile telephones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
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    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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    • B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • Y10T428/24777—Edge feature

Abstract

本发明公开了电子设备中的透明材料的焊接。电子设备(100)可包括具有穿过壳体(102)的一部分形成的至少一个孔的壳体(102)。该电子设备(100)还可包括被定位在穿过壳体的一部分形成的孔内的部件(104)。该部件(104)可被激光焊接至穿过壳体形成的孔。此外，该部件(104)可包含透明材料。用于将部件固定在电子设备(100)内的方法可包括提供包括至少一个孔的电子设备壳体，并且将部件(104)定位在穿过壳体形成的孔内。被定位在孔内的部件(104)可包含透明材料。该方法还可包括将部件(104)焊接到电子设备壳体。

Description

透明材料和不透明材料的激光焊接
相关申请的交叉引用
本专利合作条约专利申请要求于2014年3月31日提交的发明名称为“LaserWelding of Transparent and Opaque Materials”的美国非临时专利申请No.14/230324的优先权，该专利申请的内容全文以引用方式并入本文。
技术领域
本公开整体涉及电子设备，并且更具体地涉及被包含在电子设备中的透明材料以及用于在电子设备中固定该透明材料的方法。
背景技术
常规电子设备通常包括多个工作或功能部件全部被包含在单个外壳或壳体内。这些部件允许用户与电子设备进行交互。电子设备的一些部件包括例如按钮、开关、屏幕显示器和相机。这些部件中的每个部件可包括在电子设备的外表面上可见或暴露的部分，并且可与位于电子设备内的该部件的各个部分进行交互或者可与其进行通信。例如，该按钮可包括被定位在电子设备的外表面上的接触部分并且可与内部部分进行通信，该内部部分可与电子设备或电子设备的不同部件(例如，处理器)进行交互。在另一个示例中，显示器和/或相机可包括透明窗口，该透明窗口保护部件，但是允许部件从电子设备的外部看到或者暴露至电子设备的外部。
电子设备的在其外表面上可看到或暴露的部件通常直接耦接至外壳或者包括直接耦接至外壳的窗口。例如，按钮可包括直接耦接至外壳的壳体部分，并且相机可包括邻近相机镜头被定位的直接耦接至外壳的窗口。通常使用粘合剂来将电子设备的部件耦接至外壳。更具体地，粘合剂通常被分配在部件和外壳之间，以将该部件耦接至电子设备的外壳，和/或使该部件在电子设备的工作寿命期间保持在外壳内。
唯独依靠粘合剂将部件耦接至电子设备的外壳可能导致操作问题。例如，随着电子设备的工作寿命推移，粘合剂可能被磨损或弱化。其可能使得部件(例如，按钮)或者部件的部分(例如，相机窗口)相对于电子设备的外壳发生位移或者从其脱离。在部件变得相对于外壳发生位移或者从其脱离时，电子设备可能无法按照预期工作或者根本无法工作。
此外，唯独依靠粘合剂将部件耦接至电子设备的外壳可能导致制造问题。即，在使用粘合剂将部件耦接至外壳时，通常要求对接触表面进行处理，以确保充分接触。更具体地，可对部件的接触表面和外壳的接收该部件的一部分的接触表面进行平坦化处理、抛光和/或表面重建，以便提供免除在部件的先前处理(例如，切割、成形)期间形成的缺陷的基本上平坦的接触表面。接触表面的处理步骤增加电子设备制造过程的时间，尤其是在必须对接触表面进行多次处理和/或接触表面必须经历多个处理过程时。
通过在部件的制造期间提供附加切割或成形过程来减少或消除这些缺陷。但是，这些附加切割或成形过程倾向于增加整个制造过程的时间，并且还可能根据部件的材料而增加成本。例如，在部件由通常被称为蓝宝石的金刚砂制成的情况下，可能要对该部件执行附加切割过程，以使接触表面上的缺陷最小化。但是，由于蓝宝石硬度(例如，9.0莫氏硬度等级)，可能难以对该材料进行切割，其耗时并且可能导致切割工具的快速磨损。切割工具的这种快速磨损可能导致在制造过程期间对切割工具不断进行更换和/或锐化。
包含用于将部件耦接至电子设备的外壳的粘合剂可能基于所使用的粘合剂的量和/或在电子设备内利用粘合剂的部件的数量而提高制造成本。即，粘合剂本身向电子设备添加附加部件，这也会提高制造电子设备的成本，并使制造时间延长向部件和/或电子设备的外壳施加粘合剂所耗费的时间量。
此外，包含用于将部件耦接至电子设备的外壳的粘合剂可能需要附加处理，以满足电子设备的美观要求。例如，在施加用于耦接电子设备的部件的粘合剂之后，可能要向电子设备施加装饰墨水，以隐藏部件之间的粘合剂。即，可能要向电子设备的表面和/或部件施加装饰墨水，以充分隐藏在审美上或者视觉上可能不太美观的粘合剂。与上述粘合剂类似，在电子设备上施加装饰墨水可能增加电子设备的制造时间以及提高电子设备的制造成本。
发明内容
一般来讲，本文讨论的实施方案涉及包含透明材料的装置、在电子设备中使用的透明材料以及用于将透明材料固定到电子设备中的方法。该装置和电子设备通常包括两个部件：具有孔的第一部件(例如，壳体)；以及包含透明材料的第二部件。该第二部件被定位在第一部件的孔内并被直接激光焊接到第一部件。更具体地，激光器被定位在第一部件和第二部件上方并且穿过包含透明材料的第二部件向第一部件发射射束，以在相应的部件之间形成激光焊接。通过将第一部件焊接到第二部件，将没有必要使用粘合剂对部件进行粘合，并且可在部件之间形成充分持久的耦接。此外，在一些实施方案中，通过穿过第二部件发射激光束而在第一部件和第二部件之间形成激光焊接，可将焊接相对于电子设备的用户隐藏起来。即，通过对相应的部件进行激光焊接，该焊接可基本上不被电子设备的用户察觉到，或者针对电子设备的用户将其隐藏起来。该激光焊接不仅将提高第一部件和第二部件之间的耦接强度，而且还可改进电子设备的美观修饰特征。
一个实施方案可包括一种装置。该装置可包括具有孔的第一部件以及包含透明材料的第二部件。第二部件可被定位在第一部件的孔内。此外，可将第二部件焊接到第一部件。
另一个实施方案可包括电子设备。该电子设备可包括壳体。该电子设备的壳体可包括穿过该壳体的一部分形成的至少一个孔。此外，该电子设备可包括被定位在穿过壳体的一部分形成的至少一个孔内的部件。可将该部件激光焊接至穿过壳体的一部分形成的至少一个孔。此外，该部件可包含透明材料。
另一实施方案可包括用于将部件固定到电子设备壳体内的方法。该方法可包括提供电子设备壳体。该电子设备壳体可包括至少一个孔。该方法还可包括将部件定位在穿过壳体形成的至少一个孔内，并将该部件焊接至壳体。该部件可包含透明材料。
附图说明
通过下文结合附图的详细描述将易于理解本公开，其中类似的附图标号指示类似的结构元件，并且其中：
图1A示出了根据实施方案的电子设备的前视图。
图1B示出了根据实施方案的图1A的电子设备的后视图。
图2A示出了根据实施方案的沿图1B的2-2线截取的图1B的电子设备的一部分的分解的前横截面视图。
图2B示出了根据实施方案的图2A所示的电子设备的窗口的经放大的一部分。
图2C示出了根据实施方案的沿2-2线截取的图1B的电子设备的一部分的前横截面视图。
图2D示出了根据实施方案的图2D所示的电子设备的窗口以及壳体的经放大的一部分。
图3示出了根据实施方案的沿图1A的3-3线截取的图1A的电子设备的一部分的前横截面视图。
图4示出了根据实施方案的沿图1A的4-4线截取的图1A的电子设备的一部分的前横截面视图。
图5示出了说明用于将部件固定到电子设备壳体内的方法的流程图。
图6A-6D示出了根据实施方案的经历了图5所示的固定过程的包括窗口和壳体的电子设备的一部分的说明图。
应当指出，本发明的附图未必是按比例绘制的。附图旨在仅描绘本发明的各个典型方面，因此不应被认为限制本发明的范围。在附图中，类似的附图标记在各附图之间表示类似的元件。
具体实施方式
现在将详细参考附图所示的代表性实施方案。应当理解，以下描述并非旨在将实施方案限制于一个优选实施方案。相反，其旨在涵盖可被包括在由所附权利要求限定的实施方案的实质和范围内的替代形式、修改形式和等同形式。
本公开总体上涉及电子设备，并且更具体地涉及被包含在电子设备中的透明材料以及用于在电子设备中固定透明材料的方法。
本文讨论了包含透明材料的装置、在电子设备中使用的透明材料以及用于在电子设备中固定透明材料的方法。该装置和电子设备通常包括两种部件：具有孔的第一部件(它的一个示例是壳体)；以及包含透明材料的第二部件。第二部件被定位在第一部件的孔内并被直接激光焊接到第一部件。
更具体地，激光器被定位在第一部件和第二部件上方并且透过包含透明材料的第二部件向第一部件发射射束，以在相应部件之间形成激光焊接。通过将第一部件焊接到第二部件，将没有必要使用粘合剂对部件进行接合，并且可在部件之间形成充分持久的耦接。此外，在一些实施方案中，通过穿过第二部件发射激光束而在第一部件和第二部件之间形成激光焊接，该焊接可从电子设备的用户基本上隐藏起来。即，通过对相应部件进行激光焊接，该焊接可基本上不被电子设备的用户察觉到，或者针对电子设备的用户将其隐藏起来。该激光焊接不仅可提高第一部件和第二部件之间的耦接强度，而且还可改进电子设备的美观修饰特征。
下文将参考图1A-6D讨论这些以及其他实施方案。然而，本领域的技术人员将容易地理解，本文相对于这些附图所给出的详细描述仅出于说明性目的，而不应被理解为是限制性的。
图1A和图1B分别示出了根据实施方案的电子设备100的正视图和后视图。在例示的实施方案中，电子设备100被实现为移动电话。电子设备100可包括或者可被连接至生物感测设备(未示出)。其他实施方案可以不同形式来实现电子设备100，诸如例如将其实现为膝上型电脑或台式计算机、平板计算设备、游戏设备、显示器、数字音乐播放器、可穿戴计算设备或显示器(诸如，手表或眼镜)、以及可从生物感测设备接收生物测定数据的其他类型的电子设备。
电子设备100可包括至少部分地包围显示器104以及一个或多个按钮106或输入设备的壳体102。壳体102可为电子设备100的内部部件形成外表面或部分外表面和保护性壳体，并可至少部分地围绕显示器104。壳体102可由可操作地连接在一起的一个或多个部件(诸如，前件和后件)形成。在壳体102可由多个部件形成的非限制性示例中，壳体102可包括修整件，该修整件可被耦接至被配置为可操作地进行连接以形成电子设备100的保护壳的附加部件，如本文所讨论的。另选地，壳体102可由可操作地连接到显示器104的单件形成。壳体102可包括多种不同的材料，包括但不限于：金属、玻璃塑料、或通常被称为蓝宝石的金刚砂。此外，壳体102可包括被设置在壳体102的外表面和/或内表面上的装饰层和/或涂覆层。装饰层和/或涂覆层可被设置在壳体102的一个或多个表面上，以保护该壳体，和/或为电子设备100提供装饰特征(例如，外部色彩)。
显示器104可使用任何合适的技术来实现，包括但不限于使用液晶显示器(LCD)技术、发光二极管(LED)技术、有机发光显示器(OLED)技术、有机电致发光(OEL)技术或其他类型的显示技术的多点触摸感测触摸屏技术。该显示器104可包括被定位在触摸屏上方的基本透明层108。即，如本文所讨论的，透明层108可被定位在显示器104的触摸屏上方，并且可被定位在壳体102的孔内，使得壳体102和透明层108与电子设备100的前表面112沿平面对准。透明层108可在不妨碍用户观看和/或用户与显示器104和/或电子设备100进行交互的能力的情况下保护显示器104不被弄脏。透明层108可由各种各样的基本上透明的材料构成，包括但不限于：蓝宝石、玻璃或塑料。
按钮106可包括用于电子设备100的任何常规输入/输出(I/O)设备。具体地，按钮106可包括与电子设备100的内部部件进行电通信和/或机械连通的致动部件(参见图4)，以提供用户输入和/或允许用户与电子设备100的各种功能进行交互。在实施方案中，按钮106可被配置作为由壳体102包围的单个部件。另选地，按钮106可具有包括致动部件的多个部件，该多个部件相互之间和/或与电子设备100的内部部件机械连通/电通信。按钮106可由与透明层108类似的透明材料形成。即，按钮106的至少一部分可由包括但不限于蓝宝石、玻璃或塑料的基本上透明的材料形成。
如图1A和图1B所示，电子设备100还可包括多个相机系统。更具体地，电子设备100可包括被定位在电子设备100的前表面112上的第一相机系统110(参见图1A)和被定位在电子设备100的后表面120上的第二相机系统118(参见图1B)。与电子设备100的显示器104类似，第一相机系统110和第二相机系统118可包括被定位在壳体102内的透明层。在图1B所示的非限制性示例中，第二相机系统118可包括窗口122，该窗口可被定位在第二相机系统118的内部部件之前，并且可被定位在壳体102内。如本文所讨论的，第二相机系统118的窗口122可被定位在壳体102的孔内，使得壳体102和窗口122与电子设备100的后表面120沿平面对准。也与显示器104的透明层108类似，窗口122可由多种包括但不限于蓝宝石、玻璃或塑料的基本上透明的材料形成。窗口122可被配置为为第二相机系统118提供透明保护层，其可在不妨碍电子设备100使用第二相机系统118拍摄图像和/或视频的能力的情况下保护第二相机系统118不受染污。
图2A示出了沿图1B中的2-2线截取的电子设备100的一部分的分解简化横截面视图。更具体地，图2A示出了壳体102以及包括电子设备100的窗口122的第二相机系统118的分解简化横截面视图。电子设备100的壳体102可包括形成在其内的或者穿过其形成的多个不同的孔。多个孔中的每个孔被配置为接收电子设备100的不同部件(例如，窗口122、显示器104的透明层108、按钮106)。
如图2A所示，并且如本文所讨论的，穿过壳体102形成的孔124可被配置为接收第二相机系统118的窗口122。孔124可以是穿过壳体102的主体而形成的，并且可在壳体102的暴露表面或外部表面(例如，后表面120)与内表面126之间形成通道。如图2A所示，该外表面可包括电子设备100的后表面120，并且内表面126可包括被定位在壳体102内和/或位于电子设备100的后表面120和前表面112(参见图1A)之间的表面。内表面126可被定位成与电子设备100的容纳电子设备100的内部部件的内部腔128相邻。
壳体102的多个孔(例如，孔124)可被配置为通过具有与部件互补的形状而接收电子设备100的一个或多个部件(诸如，窗口122、显示器的透明层108、按钮106)，与部件互补的形状包括被配置为接受和/或保持此类部件的任何形状。如本文所讨论的，通过包括互补形状，电子设备100的被定位在壳体102的孔内的部件还可被充分地耦接(例如，焊接)至电子设备100的壳体102。
在非限制性示例中，如图2A和图2B所示，壳体102的孔124可包括可与窗口122的侧壁132互补的成角度的侧壁130。更具体地，壳体102中的孔124的侧壁130所包含的角度基本上等于第二相机系统118的窗口122的侧壁132的角度。通过使侧壁在该侧壁的角度和形状方面互补，窗口122可被定位在壳体102的孔124内，并且孔124的侧壁130和窗口122的侧壁132可充分地相互接触。
第二相机系统118可包括与窗口122相邻定位的内部相机部件134。内部相机部件134可被定位在电子设备100的与壳体102的内部表面126相邻的内部腔128内。如图2A所示，内部相机部件134可包括在第二相机系统118内使用的一个或多个任何常规部件，包括镜头、放大镜、快门、光圈等。出于清楚起见，本文将省略对这些部件的附加解释。
第二相机系统118的窗口122可包括第一表面136和与第一表面136相对定位的第二表面138。如本文所讨论的，在窗口122被定位在壳体102内时，第一表面136可以是外表面并且其可充分暴露于电子设备100的外部，和/或可与电子设备100的外部表面或者后表面120沿平面对准。此外，如本文所讨论的，在窗口122可被定位在壳体102内时，第二表面138可包括与壳体102的内部表面126相邻定位的内表面，和/或可被定位在电子设备100的腔128内。
窗口122的第一表面136和第二表面138可包含表面处理。更具体地，在窗口122可被定位在壳体102内之前或者之后，第一表面136和第二表面138可经历表面处理过程，包括但不限于：打磨、平面刨削、研磨或抛光。在非限制性示例中，在窗口122可被定位在壳体102内之前可对第一表面136和第二表面138进行抛光，以充分确保窗口122具有不会妨碍第二相机系统118的可接受的透明度。可在窗口122的形成(例如，切割、成形)之前和/或之后对窗口122执行表面处理过程。
如图2A所示，窗口122的侧壁132可被定位在经处理的第一表面136和经处理的第二表面138之间，并且可具有显著的角度，如本文所讨论的。与经处理的第一表面136和经处理的第二表面138不同，窗口122的侧壁132可不被处理。即，在窗口122被定位在壳体102的孔124内之前，窗口122的侧壁132可不经历表面处理过程。
由于未对侧壁132执行表面处理过程，因而窗口122的未经处理的侧壁132可能包含缺陷140。图2B示出了如图2A所示的窗口122的侧壁132的经放大的一部分。如图2B所示，缺陷140可能是由于在形成窗口122时使用的形成过程(例如，切割、成形)而被形成在窗口122的侧壁132的表面上。在非限制性示例中，窗口122可由透明蓝宝石材料形成。更具体地，窗口122可以是通过从大的蓝宝石材料的薄片上切割下窗口122而形成的。由于蓝宝石材料硬且脆，因而用于形成窗口122的切割过程可能在蓝宝石的各个表面(例如，侧壁132、表面136、第二表面138)中的一个或多个表面上导致缺陷140。对第一表面136和第二表面138执行的表面处理过程可去除被形成在相应表面上的这些缺陷140。但是，窗口122的未经处理的侧壁132在被定位在壳体102的孔124内时可能保留缺陷140。如图2B所示，侧壁132的缺陷140可能包括多条裂纹142和/或多个凹陷144。如本文所讨论的，缺陷140可不对窗口122和壳体102之间的耦接造成不利影响。
图2C示出了被定位在壳体102的孔124内的第二相机系统118的窗口122的横截面视图。如本文所讨论的，壳体102的孔124可包括用于接收窗口122的互补形状(例如，成角度的侧壁130)。窗口122可被定位在孔124内，使得窗口122的经处理的第一表面136或外表面可与壳体102的外部表面或后表面120沿平面对准。即，如图2C所示，窗口122和壳体102的暴露表面(例如，经处理的第一表面136、后表面120)可沿平面对准，使得窗口122的经处理的第一表面136和壳体102的后表面120形成连续、平滑的表面。
还可将窗口122耦接至壳体102。更具体地，如图2C所示，可将窗口122焊接至壳体102，并且可将窗口122充分固定在壳体102的孔124内。如本文所讨论的，并且如图2C所示，壳体102可包括电子设备100的保护罩，其中将窗口122被焊接至形成所述保护罩的壳体102。在壳体102包括多个部件尤其是壳体102包括修整件的另一非限制性示例中，如本文所讨论的，可将窗口122焊接至构成壳体102的修整件。
在将窗口122耦接至壳体102的过程中，焊接表面146可存在于壳体102的侧壁130和窗口122的未经处理的侧壁132之间，以对电子设备100的部件进行耦接。如图2C所示，焊接界面146可被定位在窗口122的经处理的第一表面136或外表面与窗口122的经处理的第二表面138或内表面之间。此外，焊接界面146可被定位在壳体102的外部表面或后表面120与内部表面126之间。如图2C所示，焊接界面146可以是围绕孔124的侧壁130和/或窗口122的未经处理的侧壁132的整个周边形成的，以确保窗口122被充分耦接或固定至壳体102。焊接界面146可包括固化融池或者形成壳体102的材料的淀积，其可将壳体102耦接或焊接至窗口122。如本文所讨论的，可将壳体102的侧壁130的一部分暴露至激光束，这样可建立用于形成侧壁130的材料的一部分的融池，以将壳体102焊接至窗口102。
图2D示出了如图2C所示的焊接界面146的经放大的一部分。如本文所讨论的，可由形成壳体102的材料的固化融池将焊接界面146形成在壳体102的侧壁130和窗口122的未经处理的侧壁132之间。由于焊接是由形成壳体102的材料的固化融池形成的，因而还可在窗口122的未经处理的侧壁132的缺陷140内形成焊接界面146。更具体地，如图2D所示，可以将焊接界面146形成到先前在形成(例如，切割)窗口122时形成在窗口122的未经处理的侧壁132内的裂纹142和/或凹陷144内。通过将焊接界面146形成到窗口122的未经处理的侧壁132的缺陷140内，可使焊接界面146完全接触侧壁130的整个表面，以将窗口122附连至壳体102。此外，在将焊接界面146形成在窗口122的未经处理的侧壁132的缺陷140内时，可将缺陷140的潜在问题基本上降至最低。在非限制性示例中，形成在窗口122的未经处理的侧壁132中的凹陷144可能显著提高窗口122在不希望出现的撞击事件(例如，电子设备100发生跌落)中发生分裂的可能性。但是，焊接界面146可填充形成在窗口122的未经处理的侧壁132内的凹陷144，因而可为窗口122提供附加结构支撑，和/或可在凹陷144内提供约束力，以避免窗口122内的另外的缺陷。
由于窗口122的成角度的侧壁132和壳体102的对应的成角度的侧壁130，可使焊接界面146可不被电子设备100的用户看到。更具体地，由于窗口122和壳体102的相应的成角度的侧壁是朝内部腔128和/或壳体102延伸的，因而查看后表面120的电子设备100的用户可无法看到焊接界面146。照此可被形成以将窗口122耦接至电子设备100的壳体102的“隐藏焊接”。
图3示出了沿图1A中的3-3线截取的电子设备100的一部分的前横截面视图。更具体地，图3示出了被定位在电子设备100中的壳体102内的显示器104的透明层108的前横截面视图。应当理解，具有类似的命名和/或附图标记的部件可按照基本上类似的方式起作用。为了清楚起见省略对这些部件的过多的解释。
电子设备100的透明层108可包括可被暴露给用户的第一表面336。如本文所讨论的，如图3所示，透明层108可被定位在壳体102内，使得透明层108的第一表面336可以是外表面，并且第一表面336充分被暴露到电子设备100的外部，和/或与电子设备100的外部表面或前表面沿平面对准。此外，在透明层108可被定位在壳体102的孔324内时，透明层108和壳体102的暴露表面(即，经处理的第一表面336、前表面112)可沿平面对准，使得透明层108的经处理器的第一表面336和壳体102的前表面112形成连续、平滑的表面。
如图3所示，可包括触摸屏的显示器104可被定位在电子设备100的透明层108的第二表面338或内表面上或者与其相邻。此外，显示器104可被定位在内部腔128内和/或与壳体102的内部表面126相邻。如本文所讨论的，透明层108可被配置作为显示器104的保护层。
与本文相对于窗口122所作的讨论类似，透明层108的第一表面336和第二表面338可包含表面处理。即，透明层108的第一表面336和第二表面338可在透明层108被定位在壳体102的孔324内之前经历一次或多次表面处理。与经处理的第一表面336和经处理的第二表面338相反但与图2A-2D中的窗口122的侧壁132类似，透明层108的侧壁332可包括未经处理的侧壁332。因此，透明层108的未经处理的侧壁332可包含由于电子设备100的透明层108的形成(例如，切割)而导致的缺陷140。
与图2A-2D所示的窗口122类似，设备100的透明层108也可如图3所示耦接或焊接至壳体102。更具体地，可经由存在于壳体102的侧壁130和透明层108的未经处理的侧壁332之间的焊接界面146来将透明层108附连到壳体102的孔324内。如图3所示，并且与本文的讨论类似，焊接界面146可被定位在透明层108的外表面或经处理的第一表面336与内表面或经处理的第二表面138之间，并且可被定位在壳体102的外部表面或前表面112与内部表面126之间。此外，焊接界面146可以是围绕孔324的侧壁130和/或透明层108的未经处理的侧壁332的整个周边形成的，以确保透明层108被充分耦接或焊接至壳体102。如本文所讨论的，焊接界面146可包括形成壳体102的材料的固化融池，其可将透明层108耦接或焊接至壳体102。
如图3所示，粘合剂348可被定位在穿过壳体102和透明层108形成的孔324内。即，粘合剂348可被定位在壳体102的侧壁130和透明层108的未经处理的侧壁332之间，并且可被定位成与焊接界面146相邻。如图3所示，粘合剂348也可被定位在透明层108的外表面或经处理的第一表面336与内表面或经处理的第二表面138之间，并且被定位在壳体102的外部表面或前表面112与内部表面126之间。在非限制性示例中，粘合剂348可被定位在焊接界面146与透明层108的外表面或经处理的第一表面336和/或壳体102的外表面或前表面112之间。粘合剂348可被形成在焊接界面146与透明层108和/或壳体102的外表面之间，从而实现功能和/或美观修饰目的。就功能方面非限制性示例而言，将粘合剂348可被形成在壳体102和透明层108之间，从而遵守和/或辅助透明层108至壳体102的耦接。在美观修饰应用的非限制性示例中，粘合剂348可被形成在壳体102和透明层108之间，以隐藏焊接界面146。即，可在电子设备100(参考图1A)内提供粘合剂348，以基本上避免电子设备100的用户看到被形成在壳体102和透明层108之间的焊接界面146，其中由于电子设备100的部件(例如，壳体102、透明层108)的构造或形状而将焊接界面146相对于用户进行“隐藏”。被形成在壳体102的孔324中的粘合剂348可以是能够将透明层108粘附到壳体102的任何常规粘合剂材料。
尽管在本文被图示和讨论为与透明层108一起使用，但是应当理解，可将图3的粘合剂348与电子设备100内的被定位在壳体102内并被焊接至其上的任何部件一起使用。即，可如本文相对于图2A-2D所讨论的，将粘合剂348与窗口122一起使用，并且如本文相对于图4所讨论的，将粘合剂348与按钮106一起使用。
图4示出了沿图1A中的4-4线截取的电子设备100的一部分的前横截面视图。更具体地，图4示出了被定位在电子设备100中的壳体102内的按钮106的前横截面视图。按钮106可包括由基本上透明材料(例如，蓝宝石、玻璃、塑料)构成的按钮外壳452、以及被定位在按钮106的按钮外壳452内的致动部件450。致动部件450可被配置为在按钮外壳452基本上保持固定和/或焊接至壳体102时在按钮外壳452内沿方向(D)移动，如本文所讨论的。此外，按钮106的致动部件450可与电子设备100的内部按钮部件454机械连通和/或电子通信。在非限制性示例中，内部按钮部件454可包括可与致动部件450电机械连通的压电传感器。在用户对按钮106的致动部件450进行致动时，致动部件450接触压电传感器和/或使其变形，以将电子信号发送至电子设备100的不同的内部部件。
如图4所示，壳体102可包括沟缘部分456。更具体地，壳体102的侧壁130所包括的沟缘部分456可与按钮106的按钮外壳452的突出部分458互补。在按钮106包括突出部分458并且壳体102包括互补沟缘部分456时，焊接界面146可被形成在突出部分458和沟缘部分456上和/或两者之间，以将按钮106焊接到壳体102。更具体地，如图4所示，焊接界面146可被形成在壳体102的沟缘部分456的侧壁130的一部分与按钮106的突出部分458的未经处理的侧壁432的一部分之间，以将按钮106的按钮外壳452焊接至壳体102。焊接界面146可被定位在按钮106的外表面或经处理的第一表面436与内表面或经处理的第二表面438之间，并且被定位在壳体102的外部表面或前表面112与内部表面126之间。此外，可围绕壳体102的沟缘部分456和/或按钮外壳452的突出部分458的整个周边形成焊接界面146，以确保按钮106被充分耦接或焊接至壳体102。
通过在按钮外壳452的突出部分458和壳体102的沟缘部分456之间提供焊接界面146，焊接界面146可不被正在查看电子设备100的前表面112的用户看到，或者可将焊接界面146相对于用户进行“隐藏”。更具体地，壳体102的沟缘部分456可被定位在按钮外壳452的突出部分458顶部上，和/或可在该突出部分上方延伸，使得突出部分458不会被从电子设备100的前表面112看到。因此，由于沟缘部分456，焊接界面146也可被覆盖，和/或不会被从前表面112看到。
现在将参照图5讨论用于将部件固定在电子设备壳体内的方法(参考图1A和图1B)。具体地，图5是描绘用于将部件固定在如本文相对于图1A-4所讨论的电子设备壳体内的一种样本方法500的流程图。
在操作502中，提供包括至少一个孔的电子设备壳体。更具体地，可穿过电子设备的壳体形成至少一个孔，以允许电子设备的部件可被用户看到，和/或保护该部件不被弄脏。
在任选的操作504中，可向穿过电子设备壳体形成的至少一个孔中的至少一个孔和/或被配置为定位在该孔内的部件施加粘合剂。即，可向穿过电子设备壳体形成的孔的侧壁的一部分施加粘合剂。此外，可向部件的一部分施加粘合剂，在该部件定位在孔内时，该部件的一部分可接触孔的侧壁。如本文所讨论的，可向孔和/或部件施加粘合剂，以将部件粘附到壳体，和/或隐藏被形成在电子设备壳体和部件之间的焊接。
在操作506中，部件可被定位在穿过电子设备壳体形成的孔内。更具体地，电子设备的由透明材料形成的部件可被定位在电子设备壳体的孔内，和/或被该孔接收。如本文所讨论的，壳体的孔可包括部件的形状的互补形状。即，壳体的孔的侧壁可与被定位在壳体内的部件的侧壁互补。在非限制性示例中，如本文所讨论的，被定位在壳体的孔内的部件可包括用于相机系统的窗口(参见图2A-2D)、用于显示器的透明层(参见图3)或按钮(参见图4)。
被定位在电子设备壳体的孔内的部件可包含附加处理，该处理在操作506中的定位之前或之后。更具体地，部件的外表面可被处理，并且与外表面相对定位的部件的内表面可被处理。该外表面和内表面可经历表面处理，诸如打磨、平面刨削、研磨、或抛光。此外，在操作506中的定位之前、之后和/或期间，可基本上保持部件的未经处理的侧壁。更具体地，部件的侧壁可保持基本上不被处理，或者可不经历表面处理，使得该侧壁包含最初在创建部件的过程中形成的缺陷(例如，裂纹、凹陷)。
操作506中的定位还可包括使部件的经处理的外表面与电子设备壳体的外部表面对准。更具体地，在将部件定位在孔内时，部件的经处理的外表面可与壳体的外部表面沿平面对准。通过使部件的外表面与壳体的外部表面对准，包括部件和/或孔的电子设备的表面可为基本上连续和平坦的。
在操作508中，该部件可被焊接到电子设备壳体。更具体地，可穿过包含透明材料的部件投射激光束，并且可将穿过壳体形成的孔的侧壁的一部分暴露到所投射的激光束。激光束波长可取决于部件的材料成分，使得部件的材料对于激光束而言是透明的。由于穿过部件投射激光束，部件的材料还可包含比形成壳体的材料的熔点高的熔点。在激光束被暴露于穿过部件的壳体的侧壁的一部分时，该侧壁的受暴露部分可包括可将部件的侧壁焊接到壳体的孔的侧壁的固化融池。该焊接还可包括将部件的整个周边焊接到穿过壳体形成的至少一个孔。通过焊接部件的周边，可基本上确保将该部件被固定到壳体。
转到图6A-6D，其示出了经历图5的方法500的各个操作的包括壳体102和窗口122的电子设备100(参见图1A和1B)的样本部分。应当理解，具有类似的附图标记的部件可按照基本上类似的方式起作用。为了清楚起见，已省略对这些部件的过多解释。
如图6A所示，电子设备100(参见图1A和图1B)的壳体102可被提供并且可包括孔124，如本文所讨论的。如图6A所示，包括孔124的所提供的壳体102可对应于图5的操作502。壳体102的孔124可包括可与窗口122的未经处理的侧壁132互补或者与其对应的成角度的侧壁130，如本文所讨论的。
如图6A所示，窗口122可被定位在壳体102的孔124内，如本文所讨论的。更具体地，窗口122的未经处理的侧壁132可接触壳体102的侧壁130，并且经处理的外表面或第一表面136可与壳体102的外部表面或后表面120沿平面对准。如图6A所示，被定位在壳体102的孔124内的窗口122可对应于图5的操作506。
尽管图6A中未示出，但是应当理解，也可在将窗口122定位在壳体102的孔124内之前向穿过壳体102形成的孔施加粘合剂。更具体地，可向孔124的侧壁130施加粘合剂348(参见图4)，以辅助将窗口122粘附至壳体102，和/或隐藏被形成在壳体102和窗口122之间的焊接，如本文所讨论的。如果在图6A中被示出，则向孔施加粘合剂将对应于图5中的操作504。
转到图6B-6D，窗口122可被焊接到壳体102，如本文所讨论的。具体地，图6B-6D示出了用于将窗口122焊接到壳体102的孔124上的激光焊接过程的进程。如图6B-6D所示，焊接到壳体102的窗口122可对应于图5中的操作508。如图6B所示，焊接过程可开始于孔124的第一侧上。激光器660可穿过包含透明材料的窗口122投射激光束662，以暴露穿过壳体102形成的孔124的侧壁130的一部分。如本文所讨论的，激光器660可包括预先确定的波长，该预先确定的波长可取决于形成窗口122的材料的透明度属性，使得窗口122对于激光器660的激光束662为基本上透明的。此外，如本文所讨论的，形成窗口122的材料可包括比形成壳体102的材料的熔点高的熔点。因此，当在焊接过程期间穿过窗口122投射激光束662并且使壳体102的侧壁130的一部分暴露至激光束662时，窗口122可基本上不受影响。
在其中窗口122由蓝宝石形成并且壳体102由铝形成的非限制性示例中，激光器660可包括可生成具有1064nm的波长和150W的平均功率的激光束662的红外激光器。激光器660可以是能够按照微秒脉冲宽度脉发激光束662的脉冲激光器。由于蓝宝石的熔点(例如，大约2000℃)高于铝的熔点(例如，大约1220℃)，因而穿过窗口122脉发的激光束662可在侧壁130上形成最终可建立焊接界面146(参见图6C)的铝融池，而无需破坏用于形成窗口122的蓝宝石。在附加非限制性示例中，激光器660可以是连续波激光器。与脉冲激光器截然不同的是，连续波激光器可穿过包含透明材料的窗口122提供连续激光束662，以暴露穿过壳体102形成的孔124的侧壁130的一部分，如本文所讨论的。
窗口122可具有基本上为圆形的形状(参见图1B)。照此，如图6B和图6C所示，激光器660可沿方向(R)旋转，以执行对窗口122和壳体102的周边焊接。由激光器660执行的周边焊接可提供窗口122的完全的周边焊接，以确保将窗口122固定到壳体102上，如本文所讨论的。在周边焊接过程期间，如图6B和6C所示，壳体102的侧壁130的暴露部分可形成融池，该融池接下来可被固化以形成焊接界面146。具体地，在比较图6B和图6C时，可使侧壁130的在图6B中暴露至激光束662的一部分固化以形成焊接界面146，直到如图6C所示激光束662被投射到侧壁130的与焊接界面146相对定位的一部分上时。
如图6D所示，窗口122可被完全焊接到壳体102。更具体地，激光器660可焊接窗口122的整个周边并且可被向后定位为与侧壁130的最初暴露至激光束662的一部分(如图6B所示)对准。由于焊接了窗口122的整个周边，因而激光器660可不再利用激光束662来暴露穿过壳体102形成的孔124的侧壁130。此外，如图6D所示，可完全地围绕窗口122形成焊接界面146，以用于将窗口122焊接和/或固定至壳体122。
尽管本文将形成窗口122的材料讨论为具有比形成壳体102的材料高的熔点，但是应当理解，窗口122也可具有等于或者低于形成壳体102的材料的熔点的熔点。即，在非限制性示例中，形成窗口122的材料可具有等于或者低于形成壳体102的材料的熔点的熔点。在这些实施方案中，窗口122可以、如本文所讨论的在透过窗口122投射激光束662时保持基本上不受影响，或者可由激光束662进行最小程度的改变。在这些非限制性示例中，在窗口122被暴露至激光束662时，窗口122可如本文所讨论的基本上不受激光束662的影响，或者激光束662对窗口122造成最小程度的表面改变。尽管形成窗口122的材料可包括等于或者低于形成壳体102的材料的熔点的熔点，但是由于激光束662包含向激光器660的激光束662提供基本上透明的窗口122的波长，因而窗口122可保持基本上不受影响或者受到最小程度的影响。在窗口122由于激光束662而包含最小程度的表面改变的情况下，该最小程度的表面改变可在窗口122的第二表面138上保持不会被用户发现和/或看到，或者可通过对窗口122的第二表面138执行附加表面处理过程(例如，磨光或抛光)来去除最小程度的表面改变。
通过将电子设备的部件(例如，窗口、按钮)焊接至电子设备的壳体，将不再有必要使用粘合剂来粘合部件。而且，在将电子设备的部件焊接至壳体的过程中，由于焊接足够小和/或可不被电子设备的用户觉察到，因而可能没有必要再采取装饰墨水来隐藏耦接技术(例如，焊接)。此外，通过将部件焊接至电子设备的壳体，可在部件和壳体之间形成充分持久的耦接。此外，可通过穿过用于形成部件的透明材料发射激光束在部件和壳体之间形成激光焊接，借此该焊接相对于电子设备的用户充分隐藏起来。即，通过对相应的部件进行激光焊接，该焊接可基本上不被电子设备的用户察觉到，或者相对于电子设备的用户将其隐藏起来。该激光焊接不仅将提高第一部件和第二部件之间的耦接强度，而且还可改进电子设备的美观修饰特征。
在上述描述中，为了进行解释，使用具体的命名来提供对所述实施方案的彻底理解。然而，对于本领域的技术人员而言将显而易见的是，实践所述实施方案不需要这些具体细节。因此，出于说明和描述的目的呈现了对本文所述的具体实施方案的上述描述。它们并非旨在使穷举性的或将实施方案限制到所公开的精确形式。对于本领域的普通技术人员而言将显而易见的是，根据上述教导内容，许多修改和变型是可能的。

Claims (16)

1.一种电子设备，包括：
具有第一融化温度的壳体，所述壳体包括：
外部表面；
与所述外部表面相对的内部表面；以及
在所述外部表面和所述内部表面之间延伸并限定孔的壳体侧壁；和
被定位在所述孔内并具有比所述第一融化温度高的第二融化温度并限定具有至少一个表面缺陷的窗口侧壁的窗口；和
在所述窗口侧壁和所述壳体侧壁之间形成的激光焊缝，其中所述激光焊缝包括填充所述窗口的至少一个表面缺陷的部分壳体。
2.根据权利要求1所述的电子设备，其中所述壳体包括以下至少之一：
蓝宝石；
金属；
玻璃；或
塑料。
3.根据权利要求1所述的电子设备，其中所述窗口包括以下至少之一：
蓝宝石；
玻璃；或
塑料。
4.根据权利要求1所述的电子设备，其中所述孔在所述内部表面处的直径大于所述孔在所述外部表面处的直径。
5.根据权利要求1所述的电子设备，其中所述孔包括沟缘部分。
6.根据权利要求1所述的电子设备，其中所述窗口进一步包括沿所述窗口侧壁的经处理的表面。
7.根据权利要求1所述的电子设备，其中所述窗口进一步包括沿所述窗口侧壁定位的未经处理的表面。
8.一种电子设备，包括：
透明部件；
壳体，所述壳体形成所述电子设备的外部表面的一部分并限定具有围绕所述透明部件的侧壁的孔，其中：
所述透明部件具有比所述壳体的融化温度高的融化温度；
沿所述透明部件和所述壳体之间的侧壁形成的激光焊接的焊缝；和
所述激光焊接的焊缝包括沿所述侧壁的激光影响区域，所述激光影响区域包括填充所述透明部件的缺陷的部分壳体。
9.根据权利要求8所述的电子设备，其中所述透明部件至少形成电子设备的外部表面的一部分。
10.根据权利要求8所述的电子设备，所述孔是圆形的。
11.根据权利要求8所述的电子设备，其中所述侧壁是锥形的。
12.根据权利要求8所述的电子设备，其中所述透明部件包括以下至少之一：
按钮；
用于显示器的透明层；或
用于相机系统的窗口。
13.一种用于将窗口固定到壳体内的方法，包括：
提供具有第一融化温度的壳体，所述壳体包括：
外部表面；
与所述外部表面相对的内部表面；以及
在所述外部表面和所述内部表面之间延伸并限定孔的壳体侧壁；
在所述孔内定位具有比所述第一融化温度高的第二融化温度的窗口，所述窗口限定具有至少一个表面缺陷的窗口侧壁；以及
在所述窗口侧壁和所述壳体侧壁之间形成激光焊缝，所述激光焊缝包括填充所述窗口的至少一个表面缺陷的部分电子设备壳体，其中所述形成包括：
引导激光束穿过所述窗口并到达所述侧壁以将所述侧壁加热到比所述第一融化温度高但比所述第二融化温度低的温度。
14.根据权利要求13所述的方法，其中：
所述方法还包括：
对所述窗口的第一表面进行表面处理；以及
对所述窗口的与所述第一表面相对的第二表面进行表面处理；以及
其中所述窗口侧壁包括具有所述至少一个表面缺陷的未经处理的表面。
15.根据权利要求14所述的方法，其中所述定位包括使所述窗口的所述经处理的第一表面与所述壳体的外部表面对准。
16.根据权利要求13所述的方法，进一步包括：
在将所述窗口定位到所述孔中之前，将粘合剂施加到以下至少之一：
孔；或
窗口。
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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9785185B2 (en) 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
WO2015177827A1 (en) * 2014-05-21 2015-11-26 Kyocera Corporation Electronic apparatus
US10200516B2 (en) 2014-08-28 2019-02-05 Apple Inc. Interlocking ceramic and optical members
US20160270247A1 (en) * 2015-03-11 2016-09-15 Apple Inc. Laminating sapphire and glass using intermolecular force adhesion
US10623957B2 (en) * 2015-04-21 2020-04-14 Graham Dugoni System and apparatus for selectively limiting user control of an electronic device
CN106154393A (zh) * 2015-04-27 2016-11-23 深圳富泰宏精密工业有限公司 导光装置及具有该导光装置的电子装置
DE102016215406A1 (de) * 2016-08-17 2018-02-22 Conti Temic Microelectronic Gmbh Montageverfahren zur Herstellung einer elektronischen Schaltungsbaugruppe und elektronische Schaltungsbaugruppe
DE102016215413A1 (de) * 2016-08-17 2018-02-22 Conti Temic Microelectronic Gmbh Montageverfahren für eine elektronische Baugruppe und elektronische Baugruppe
USD857645S1 (en) * 2016-08-23 2019-08-27 Lg Electronics Inc. Mobile phone
CN110312671B (zh) * 2017-02-24 2021-06-11 三菱电机株式会社 电梯面板及电梯面板的制造方法
CN110312672B (zh) * 2017-02-24 2021-02-12 三菱电机株式会社 电梯面板及电梯面板的制造方法
CN106944694A (zh) * 2017-04-19 2017-07-14 陈卓 一种手机用蓝宝石屏与金属围框的连接方法
US20200189204A1 (en) * 2017-05-17 2020-06-18 Branson Ultrasonics Corporation Laser Welding Using Intersecting Laser Beams
US11027365B2 (en) * 2017-07-31 2021-06-08 Preco, Inc. Laser beam diverting aperture and reflection capture device
CN108581205B (zh) * 2018-06-22 2024-04-09 广东顺德华焯机械科技有限公司 Led灯管自动焊接线
CN112292168B (zh) * 2018-06-22 2023-11-28 赛诺菲 药物输送装置、用于制造药物输送装置的方法和焊接连接的用途
CN109108462A (zh) * 2018-08-02 2019-01-01 瑞声光电科技(常州)有限公司 发声器件及其装配方法
DE102018120011B4 (de) * 2018-08-16 2022-06-15 Trumpf Laser Und Systemtechnik Gmbh Schweißverfahren zum Verbinden eines transparenten, aluminiumoxidhaltigen ersten Substrats mit einem opaken zweiten Substrat
CN109334333A (zh) * 2018-11-30 2019-02-15 维沃移动通信有限公司 壳体的制备方法、壳体以及终端设备
KR102555577B1 (ko) * 2019-01-28 2023-07-18 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치
US11422310B2 (en) 2019-05-24 2022-08-23 Corning Incorporated Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same
CN113365447B (zh) * 2020-03-03 2023-05-16 华为机器有限公司 一种壳体、电子设备和壳体的制作方法

Family Cites Families (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3217088A (en) * 1962-11-30 1965-11-09 Owens Illinois Glass Co Joining glass members and encapsulation of small electrical components
NL6413441A (zh) * 1964-11-19 1966-05-20
US4036623A (en) * 1973-08-23 1977-07-19 American Optical Corporation Method of making hardened ophthalmic lenses by ion exchange
CH67374A4 (zh) * 1974-01-18 1975-09-15
US3955021A (en) * 1974-03-06 1976-05-04 Cleavenger Associates, Inc. Meter box window cover
JPS565363A (en) * 1979-06-21 1981-01-20 Seiko Instr & Electronics Ltd Bonding of cover glass for wrist watch case
JPS56164040A (en) * 1980-05-20 1981-12-16 Seiko Instr & Electronics Ltd Adhesion and fixation of covering glass for watch
JPS57108688A (en) * 1980-12-25 1982-07-06 Seiko Instr & Electronics Ltd Joining of casing parts for watch
CH649435GA3 (zh) * 1981-05-22 1985-05-31
US4424435A (en) * 1981-09-11 1984-01-03 Itek Corporation Low expansion laser welding arrangement
JPS6080784A (ja) * 1983-10-08 1985-05-08 Citizen Watch Co Ltd 装飾品の固定方法
JPS60214931A (ja) * 1984-04-10 1985-10-28 Toyota Motor Corp 異種合成樹脂材料の接合方法
JPS60247486A (ja) * 1984-05-22 1985-12-07 Citizen Watch Co Ltd レ−ザ−溶接側構造
JPS6177786A (ja) * 1984-09-26 1986-04-21 Seiko Instr & Electronics Ltd 時計用ケースの組み立て方法
JPS61294385A (ja) * 1985-06-21 1986-12-25 Citizen Watch Co Ltd 時計の側と風防の固着構造
JPS6264528A (ja) * 1985-09-18 1987-03-23 Toyota Motor Corp 合成樹脂材料と異種材料の接合方法
JPS6271626A (ja) * 1985-09-26 1987-04-02 Toyota Motor Corp 異種合成樹脂材料の接合方法
CH664665GA3 (zh) * 1986-06-19 1988-03-31
FR2624041A1 (fr) * 1987-12-02 1989-06-09 Otic Fischer & Porter Procede de soudage au moyen d'un faisceau laser, notamment applicable au soudage de pieces en verre
US5028162A (en) * 1988-02-29 1991-07-02 Ngk Insulators, Ltd. Metal-ceramic joined composite bodies
JPH0829457B2 (ja) * 1993-10-15 1996-03-27 工業技術院長 セラミックスと金属材料との接合体の製造方法
ES2119415T5 (es) * 1994-03-31 2005-03-16 Marquardt Gmbh Pieza de plastico y procedimiento de fabricacion para una pieza de esta clase.
DE4432081A1 (de) * 1994-09-09 1996-03-14 Basf Ag Verfahren zum Schweißverbinden von Kunststoffteilen
JP3162934B2 (ja) 1995-02-07 2001-05-08 三洋電機株式会社 携帯用通信機
JP2935233B2 (ja) * 1995-03-17 1999-08-16 カシオ計算機株式会社 携帯型電子機器
DK174275B1 (da) * 1998-01-29 2002-11-04 Thermoform As Fremgangsmåde til fremstilling af et plastvindue, samt et med fremgangsmåden fremstillet vindue
JPH11289169A (ja) * 1998-04-03 1999-10-19 Nec Shizuoka Ltd 電子機器の情報表示窓
US6379765B1 (en) 1998-09-14 2002-04-30 Richard S. Werner Framing device for displaying photographs, certificates and other sheet-like material
US6451398B1 (en) 1998-11-24 2002-09-17 Michael S. Sylvester Double-sided self-adhesive reinforced foam tape
DE19918672A1 (de) * 1999-04-23 2000-10-26 Inst Angewandte Photovoltaik G Verfahren zum Verschweißen von Oberflächen von Materialien
JP2001071384A (ja) * 1999-09-01 2001-03-21 Toyota Motor Corp 樹脂部材のレーザー溶着方法
JP3961737B2 (ja) * 2000-02-29 2007-08-22 株式会社小糸製作所 車両用灯具およびその製造方法
DE10027073C1 (de) * 2000-05-31 2001-08-23 Daimler Chrysler Ag Kunstoffgehäuse mit einem verschließenden Deckel aus mit Glaskugeln gefülltem Kunststoff
ATE323569T1 (de) 2001-03-22 2006-05-15 Xsil Technology Ltd Ein laserbearbeitungssystem und -verfahren
EP1397326A2 (en) * 2001-05-29 2004-03-17 Koninklijke Philips Electronics N.V. Metal-ceramic bond
EP1270183A1 (en) * 2001-06-29 2003-01-02 Nokia Corporation Housing construction
DE10137544A1 (de) 2001-08-01 2003-02-13 Basf Ag Primerschichten für EC-Fenster
US6752893B2 (en) * 2001-09-28 2004-06-22 Gentex Corporation Rimless spectacles and method for making the same
US20030071269A1 (en) * 2001-10-15 2003-04-17 Tseng Ampere A. Apparatus and method for laser selective bonding technique for making sealed or enclosed microchannel structures
US6670021B2 (en) 2001-11-14 2003-12-30 General Electric Company Monolithic ceramic attachment bushing incorporated into a ceramic matrix composite component and related method
JP4240891B2 (ja) 2002-02-28 2009-03-18 Ｄｉｃ株式会社 再剥離型両面粘着テープ
JP4042439B2 (ja) * 2002-03-18 2008-02-06 トヨタ自動車株式会社 レーザ溶着された組立体
US6627814B1 (en) * 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
CN1301528C (zh) 2002-04-26 2007-02-21 松下电器产业株式会社 等离子显示装置的制造方法及其拆解方法
DE10219951A1 (de) * 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
JP2003320585A (ja) 2002-05-07 2003-11-11 Tokai Rika Co Ltd 樹脂成形品
US20040150688A1 (en) * 2003-01-30 2004-08-05 Kin-Ming Kwan Measuring laser light transmissivity in a to-be-welded region of a work piece
JP2004333946A (ja) * 2003-05-08 2004-11-25 Matsushita Electric Ind Co Ltd 光学部品ユニットの製造方法、光学部品固定装置および光学部品ユニット
EP1479506B1 (de) * 2003-05-22 2005-08-24 Leister Process Technologies Laserfügeverfahren für strukturierte Kunststoffe
JP4561047B2 (ja) * 2003-05-27 2010-10-13 パナソニック株式会社 光学部品の接合方法および光学ユニット
JP4267378B2 (ja) * 2003-06-11 2009-05-27 トヨタ自動車株式会社 樹脂部材のレーザ溶着方法及びその装置およびレーザ溶着部材
DE10337441A1 (de) * 2003-08-14 2005-03-10 Bsh Bosch Siemens Hausgeraete Blende für ein Gerätegehäuse und Verfahren zu dessen Herstellung
DE10338588A1 (de) * 2003-08-22 2005-03-24 Bayer Ag Verfahren zum Verbinden von Formteilen aus Kunststoff und Metall
US20050067084A1 (en) * 2003-09-03 2005-03-31 Kagan Val A. Method and article for evaluating and optimizing joined thermoplastic parts
JP4312018B2 (ja) * 2003-10-02 2009-08-12 パナソニック株式会社 光学モジュールの製造方法
KR100572207B1 (ko) * 2003-12-18 2006-04-19 주식회사 디지탈바이오테크놀러지 플라스틱 마이크로 칩의 접합 방법
DE602005022414D1 (de) 2004-03-11 2010-09-02 Nitto Denko Corp Warm abziehbare haftklebefolie und verfahren zur verarbeitung von haftgrund mit der warm abziehbaren haftklebefolie
EP1724319B1 (en) 2004-03-11 2013-08-14 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
JP4596808B2 (ja) * 2004-04-07 2010-12-15 パナソニック株式会社 光学部品ユニットのレーザ接合方法および装置
JP4413059B2 (ja) * 2004-04-07 2010-02-10 パナソニック株式会社 光学部品ユニット用のレーザ接合装置および光学部品ユニットのレーザ接合方法
JP4434911B2 (ja) * 2004-10-08 2010-03-17 パナソニック株式会社 カメラモジュールの製造方法とカメラモジュール
FI20041414A0 (fi) 2004-11-03 2004-11-03 Valtion Teknillinen Laserhitsausmenetelmä
JP4451761B2 (ja) 2004-11-12 2010-04-14 マスプロ電工株式会社 電子機器ケース用防水キャップ
US7561350B2 (en) * 2004-12-17 2009-07-14 Panasonic Corporation Optical unit and its manufacturing method
FI20050218A0 (fi) * 2005-02-23 2005-02-23 Ruuttu Jari Menetelmä optisten tuotteiden, kuten kameroiden, silmälasien, aurinkolasien, matkapuhelimien jne. linssien valmistamiseksi
JP2006341515A (ja) * 2005-06-09 2006-12-21 Denso Corp 接合体及び接合方法
US8168031B2 (en) * 2005-09-01 2012-05-01 Osaka University Method for metal-resin joining and a metal-resin composite, a method for glass-resin joining and a glass-resin composite, and a method for ceramic-resin joining and a ceramic-resin composite
CN101263201B (zh) 2005-09-16 2012-10-17 松下电器产业株式会社 复合材料、及使用该材料的光学部件
CN1757468A (zh) 2005-10-28 2006-04-12 沈阳航空工业学院 金属或陶瓷基光导纤维及制备方法
JP4829637B2 (ja) * 2006-02-21 2011-12-07 株式会社東海理化電機製作所 ケース及び携帯機並びに樹脂成型品のレーザ溶着方法
JP4733542B2 (ja) * 2006-03-22 2011-07-27 株式会社東海理化電機製作所 ケース及び携帯機
DE102006027958A1 (de) 2006-06-14 2007-12-20 Schott Ag Optokeramiken, daraus hergestellte optische Elemente sowie Abbildungsoptiken
JP4716512B2 (ja) * 2006-06-26 2011-07-06 株式会社小糸製作所 車輌用灯具及び車輌用灯具の製造方法
JP5127171B2 (ja) * 2006-07-10 2013-01-23 キヤノン株式会社 光学機器及び光学機器の製造方法
JP2008033029A (ja) 2006-07-28 2008-02-14 Fujinon Corp 光学ユニットおよび撮影装置
JP5149496B2 (ja) * 2006-08-25 2013-02-20 リコー光学株式会社 レンズ溶着方法
EP2061589A2 (de) * 2006-08-31 2009-05-27 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Verfahren zur herstellung eines bioreaktors oder lab-on-a-chip-systems sowie damit hergestellte bioreaktoren oder lab-on-a-chip- systeme
TW200812807A (en) 2006-09-01 2008-03-16 Coretronic Corp Assemble structure of touch panel
US20080063218A1 (en) * 2006-09-11 2008-03-13 Weber Douglas J Machined window undercut
EP2066162B1 (en) * 2006-09-22 2012-02-22 Nissha Printing Co., Ltd. Method for manufacturing a housing case and glass insert molding die used in the method
US20080086033A1 (en) * 2006-10-05 2008-04-10 Smith & Nephew, Inc. Hermetic Bonding
DE102006050653A1 (de) * 2006-10-24 2008-04-30 Carl Zeiss Smt Ag Verfahren und Vorrichtung zum stoffschlüssigen Verbinden eines optischen Elementes mit einer Fassung
KR100863904B1 (ko) 2006-11-02 2008-10-16 삼성에스디아이 주식회사 양면 테이프, 플라즈마 디스플레이 모듈, 플라즈마디스플레이 패널과 섀시의 분리 방법
EP1921120B1 (en) 2006-11-10 2011-04-20 Nitto Denko Corporation Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet
JP4869150B2 (ja) * 2007-05-17 2012-02-08 浜松ホトニクス株式会社 樹脂・ガラス溶着方法及び樹脂・ガラス溶着装置
EP2176017B1 (en) 2007-07-12 2012-05-30 Apple Inc. Methods for integrally trapping a glass insert in a metal bezel
US8060168B2 (en) 2007-08-20 2011-11-15 Sony Ericsson Mobile Communications Ab Dust sealing tape and display using same and method of sealing
US7966785B2 (en) * 2007-08-22 2011-06-28 Apple Inc. Laminated display window and device incorporating same
CN101376262B (zh) * 2007-08-30 2011-05-04 深圳富泰宏精密工业有限公司 成型件及制成该成型件的双色成型方法
CN101489362A (zh) * 2008-01-14 2009-07-22 深圳富泰宏精密工业有限公司 电子装置壳体及其制造方法
JP2009226643A (ja) * 2008-03-19 2009-10-08 Aisin Seiki Co Ltd 接合方法及び接合体
JP4609512B2 (ja) * 2008-03-28 2011-01-12 ブラザー工業株式会社 表示装置、表示装置のカバー体及び表示装置の製造方法
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
JP4626687B2 (ja) * 2008-08-19 2011-02-09 トヨタ自動車株式会社 樹脂と金属との接合方法
US8346183B2 (en) * 2008-08-19 2013-01-01 Apple Inc. Seamless insert molding techniques
US7697281B2 (en) * 2008-09-05 2010-04-13 Apple Inc. Handheld computing device
JP4842358B2 (ja) 2008-12-04 2011-12-21 日東電工株式会社 両面粘着テープ
TWI339191B (en) 2009-01-14 2011-03-21 Kinik Co An integrated optical element and the production method thereof
CN102388003B (zh) * 2009-03-02 2014-11-19 苹果公司 用于强化用于便携式电子设备的玻璃盖的技术
JP2010241967A (ja) 2009-04-07 2010-10-28 Nitto Denko Corp 再剥離性粘着シート及びこれを用いた被着体の加工方法
JP2010263041A (ja) 2009-05-01 2010-11-18 Nitto Denko Corp ダイアタッチフィルム付きダイシングテープおよび半導体装置の製造方法
KR101171053B1 (ko) 2009-05-11 2012-08-03 (주)피플스 세라믹 결합체의 제조 방법
JP5690051B2 (ja) * 2009-05-27 2015-03-25 公益財団法人名古屋産業科学研究所 レーザを用いた部材の接合方法
CN101634186A (zh) 2009-05-31 2010-01-27 广东蒙娜丽莎陶瓷有限公司 一种大规格超薄玻璃-瓷质复合砖的制备方法
EP2263767A1 (en) 2009-06-17 2010-12-22 M-I Epcon As A separator tank for separating oil and gas from water
CN102006738A (zh) * 2009-09-03 2011-04-06 鸿富锦精密工业（深圳）有限公司 壳体
DE102009043200A1 (de) * 2009-09-26 2011-04-21 Continental Automotive Gmbh Verfahren zum Verschweißen eines Kunststoffgehäuses
CN201804749U (zh) 2009-10-26 2011-04-20 华为终端有限公司 触摸按键及终端设备
US20110111176A1 (en) * 2009-11-09 2011-05-12 Taiwan Green Point Enterprises Co., Ltd. Shell body with a plastic member molded onto a glass panel, and method for manufacturing the shell body
JP5308997B2 (ja) * 2009-11-11 2013-10-09 株式会社日立メディアエレクトロニクス 光学部品のレーザ溶着構造及び光ピックアップの製造方法
JP2011122458A (ja) * 2009-12-08 2011-06-23 Yamada Seisakusho Co Ltd クローズドインペラ
US8797721B2 (en) * 2010-02-02 2014-08-05 Apple Inc. Portable electronic device housing with outer glass surfaces
US8607444B2 (en) * 2010-03-06 2013-12-17 Apple Inc. Method for forming a housing of an electronic device
JP2011207056A (ja) * 2010-03-30 2011-10-20 Sumitomo Chemical Co Ltd 複合体の製造方法
KR101122856B1 (ko) * 2010-04-28 2012-06-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 그 제조방법
CN102348346A (zh) * 2010-08-03 2012-02-08 富泰华工业（深圳）有限公司 电子装置壳体
KR101707531B1 (ko) 2010-10-25 2017-02-17 엘지디스플레이 주식회사 디스플레이 장치
CN102548262B (zh) * 2010-12-14 2014-12-10 富泰华工业（深圳）有限公司 电子装置壳体及其制造方法
JP5437351B2 (ja) * 2010-12-27 2014-03-12 Ｈｏｙａ株式会社 携帯型電子機器用カバーガラスのガラス基板、携帯型電子機器用画像表示装置、携帯型電子機器
US8780579B2 (en) 2011-01-05 2014-07-15 Samsung Display Co., Ltd. Organic light emitting diode display
US8044942B1 (en) 2011-01-18 2011-10-25 Aevoe Inc. Touch screen protector
US20120244343A1 (en) * 2011-03-25 2012-09-27 Kurt Stiehl Bonding structural components for portable electronic devices using thermally activated adhesive
US8945335B2 (en) 2011-08-04 2015-02-03 Apple Inc. Adhesive stack with a central shear layer
US8859068B2 (en) 2011-08-04 2014-10-14 Apple Inc. Adhesive stack with a central shear layer
US10016562B2 (en) * 2011-11-16 2018-07-10 Sanofi-Aventis Deutschland Gmbh Medicament guiding assembly for a drug delivery device
JP5771516B2 (ja) * 2011-12-09 2015-09-02 株式会社日立製作所 レーザ接合方法
US9599787B2 (en) 2011-12-27 2017-03-21 Tera Xtal Technology Corporation Using sapphire lens to protect the lens module
US8684613B2 (en) * 2012-01-10 2014-04-01 Apple Inc. Integrated camera window
CN102528276B (zh) 2012-03-02 2015-03-04 江苏大学 一种提高tco膜光透射率的激光辅助表面处理方法
US10052848B2 (en) * 2012-03-06 2018-08-21 Apple Inc. Sapphire laminates
US9030440B2 (en) 2012-05-18 2015-05-12 Apple Inc. Capacitive sensor packaging
US20140023430A1 (en) * 2012-07-19 2014-01-23 Apple Inc. Attachment Techniques
US9538052B2 (en) * 2012-07-26 2017-01-03 Apple Inc. Electronic device with input-output component mounting structures
US9221289B2 (en) * 2012-07-27 2015-12-29 Apple Inc. Sapphire window
CN104885582A (zh) * 2012-08-28 2015-09-02 Mb微型技术股份公司 用于制造电子设备用的密封壳体的方法
US9785185B2 (en) 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
US9149998B2 (en) * 2012-10-24 2015-10-06 Nokia Technologies Oy Attaching window assembly using optical welding
JP6073643B2 (ja) * 2012-10-25 2017-02-01 株式会社小糸製作所 車両用ランプとその製造方法
JP2014095515A (ja) 2012-11-09 2014-05-22 Kyocera Corp ワーク収納用容器およびこれを用いた光学素子熱処理用容器ならびにワーク収納用容器の製造方法
US9718249B2 (en) 2012-11-16 2017-08-01 Apple Inc. Laminated aluminum oxide cover component
US9092187B2 (en) 2013-01-08 2015-07-28 Apple Inc. Ion implant indicia for cover glass or display component
KR101991839B1 (ko) * 2013-01-15 2019-06-24 삼성디스플레이 주식회사 커버 윈도우를 구비하는 표시 장치
JP2015093456A (ja) * 2013-11-13 2015-05-18 スタンレー電気株式会社 樹脂部材の溶着方法
JP6323013B2 (ja) * 2014-01-10 2018-05-16 船井電機株式会社 樹脂接合体および樹脂部材の接合方法
US10200516B2 (en) 2014-08-28 2019-02-05 Apple Inc. Interlocking ceramic and optical members
EP3153302A1 (en) * 2015-10-05 2017-04-12 C.R.F. Società Consortile per Azioni Method for obtaining a welded joint between elements of different materials, and a hybrid component obtained through this method

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