CN109108462A - 发声器件及其装配方法 - Google Patents

发声器件及其装配方法 Download PDF

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CN109108462A
CN109108462A CN201810873819.7A CN201810873819A CN109108462A CN 109108462 A CN109108462 A CN 109108462A CN 201810873819 A CN201810873819 A CN 201810873819A CN 109108462 A CN109108462 A CN 109108462A
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cover plate
shell
upper cover
sounding monomer
microphone device
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王程良
陈志胜
沈泉
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AAC Microtech Changzhou Co Ltd
AAC Optoelectronic Changzhou Co Ltd
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AAC Optoelectronic Changzhou Co Ltd
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Priority to US16/524,208 priority patent/US10869147B2/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006Interconnection of transducer parts
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/20Uniting glass pieces by fusing without substantial reshaping
    • C03B23/24Making hollow glass sheets or bricks
    • C03B23/245Hollow glass sheets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/026Supports for loudspeaker casings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • H04R9/045Mounting
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

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  • Acoustics & Sound (AREA)
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  • Organic Chemistry (AREA)
  • Telephone Set Structure (AREA)
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Abstract

本发明提供一种发声器件,包括壳体、以及收容于所述壳体内的发声单体,所述壳体包括具有收容空间的上盖板,所述上盖板为3D玻璃,所述上盖板与所述发声单体之间通过激光焊接固定。本发明提供的发声器件将壳体改为3D玻璃壳体,增强了壳体的强度,而且由于3D玻璃的透明属性,以激光焊接的方式实现密封和固定,有效避免打胶和超声波焊接带来的溢胶和溢料的问题,同时可以保证腔体最大化,也不会影响天线的使用。

Description

发声器件及其装配方法
【技术领域】
本发明涉及电声转换技术领域,尤其涉及一种发声器件及其装配方法。
【背景技术】
近年来,信息科技迅猛发展,音频设备的普及率越来越高,人们对音频设备的要求不仅仅限于视频音频的播放,更要求对音频设备的可靠性提出更多要求,尤其是5G时代的到来,移动多媒体技术也随之发展,很多音频设备具有多种娱乐功能,如视频播放、数码摄像、游戏、GPS导航等,随着功能需求越来越多,其内的元器件集成化程度越来越高,对产品的质量也要求越来越严格。
在音频设备中,发声器件是一种常用的电子元器件,主要用于音频信号的播放,其结构设计直接影响音频播放质量。相关技术的发声器件包括具有收容空间的壳体、以及收容于所述收容空间内的发声单体。
相关技术的所述发声器件中,壳体通常采用塑料壳体或将钢片内嵌于塑料壳体中,以保证壳体的强度,但塑料壳体壁厚受限,一般为0.50mm以上,收容空间就容易不足,而受制于天线影响,钢片也无法大面积使用。
因此,实有必须提供一种新的发声器件解决上述技术问题。
【发明内容】
本发明的目的在于提供一种可以改变壳体结构以兼顾强度和空间的发声器件。
为了达到上述目的,本发明提供了一种发声器件,包括壳体、以及收容于所述壳体内的发声单体,所述壳体包括具有收容空间的上盖板,所述上盖板为3D玻璃,所述上盖板与所述发声单体之间通过激光焊接固定。
优选的,所述发声单体设有外壳,所述外壳为塑料外壳。
优选的,所述壳体还包括与所述上盖板配合的下盖板,所述下盖板为3D玻璃。
优选的,所述上盖板与所述下盖板通过激光焊接固定。
本发明还提供一种发声器件的装配方法,包括如下步骤:
提供发声单体和壳体,所述壳体为3D玻璃;
将所述发声单体放置于所述壳体内,在所述壳体外部通过激光焊接将所述发声单体和所述壳体固定,装配形成发声器件。
优选的,所述壳体包括上盖板、以及与所述上盖板配合的下盖板,所述发声单体和所述壳体的装配步骤包括:
将所述发声单体放置于所述上盖板内,以所述发声单体和所述上盖板的配合面为路径在所述上盖板的外部通过激光焊接将所述发声单体和所述上盖板固定;
将所述下盖板与所述上盖板装配形成壳体,以所述上盖板和下盖板的配合面为路径在所述壳体的外部通过激光焊接将所述上盖板和所述下盖板固定。
优选的,所述发声单体和所述上盖板的装配步骤包括:
将所述发声单体放置于所述上盖板内;
沿所述发声单体的侧面填补密封胶;
待所述密封胶固化后翻转;
以所述发声单体和所述上盖板的配合面为路径在所述上盖板的外部通过激光焊接将所述发声单体和所述上盖板固定。
与相关技术相比,本发明提供的发声器件将壳体改为3D玻璃壳体,增强了壳体的强度,而且由于3D玻璃的透明属性,以激光焊接的方式实现密封和固定,有效避免打胶和超声波焊接带来的溢胶和溢料的问题,同时可以保证腔体最大化,也不会影响天线的使用。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图,其中:
图1为本发明提供的发声器件的立体组装示意图;
图2为图1所示发声器件立体分解示意图的;
图3为图1所示发声器件沿A-A线的剖视图;
图4为基于图1所示发声器件的装配方法的流程示意图;
图5为图4所示发声器件的装配方法中步骤S2的流程示意图;
图6为图5所示步骤S2中步骤S21的流程示意图。
【具体实施方式】
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
请参阅图1至图3,其中,图1为本发明提供的发声器件的立体组装示意图;图2为图1所示发声器件的立体分解示意图;图3为图1所示发声器件沿A-A线的剖视图。本发明提供一种发声器件1,包括壳体11、以及收容于所述壳体11内的发声单体13。
所述壳体11包括具有收容空间110的上盖板111、与所述上盖板111配合的下盖板113,所述发声单体13收容于所述收容空间110内,所述上盖板111和所述下盖板113均为3D玻璃,即所述壳体11为3D玻璃壳体,所述上盖板111与所述发声单体13之间通过激光焊接固定,所述上盖板111与所述下盖板113之间也通过激光焊接固定。
具体的,3D玻璃是通过热弯成型处理过的非等壁厚的玻璃产品,具有弧度和透明的特性,与所述发声单体13之间装配时利用激光的能量选择性的对某区域进行加热,激光可以穿过所述3D玻璃,调整激光的焦距,使得激光的焦点与所述发声单体13的音模台阶面重合,调整激光的能量,加热使得与所述发声单体13接触的3D玻璃融化,形成密封和固定圈,进而完成所述上盖板111与所述发声单体13之间固定和密封的过程,有效避免打胶和超声波焊接带来的溢胶和溢料的问题。3D玻璃的强度更好,便于使用薄壁厚成型(0.30mm以下),最大化保证所述壳体11内的腔体,不会出现壳振等现象,同时3D玻璃为非金属材质,也不会影响客户端天线的使用。
所述发声单体13设有外壳,所述外壳为塑料外壳。
请参阅图4,图4为基于图1所示发声器件的装配方法的流程示意图。本发明还提供一种发声器件的装配方法,包括如下步骤:
步骤S1、提供所述发声单体13和所述壳体11,所述壳体11为3D玻璃;
步骤S2、将所述发声单体13放置于所述壳体11内,在所述壳体11外部通过激光焊接将所述发声单体13和所述壳体11固定,装配形成发声器件1。
请参阅图5,图5为图4所示发声器件的装配方法中步骤S2的流程示意图。具体的,步骤S2中,所述发声单体13和所述壳体11的装配步骤包括:
步骤S21、将所述发声单体13放置于所述上盖板111内,以所述发声单体13和所述上盖板111的配合面为路径在所述上盖板111的外部通过激光焊接将所述发声单体13和所述上盖板111固定;
请参阅图6,图6为图5所示步骤S2中步骤S21的流程示意图。步骤S21中,所述发声单体13和所述上盖板111的装配步骤包括:
步骤S211、将所述发声单体13放置于所述上盖板111内;
步骤S212、沿所述发声单体13的侧面填补密封胶;
步骤S213、待所述密封胶固化后翻转;
步骤S214、以所述发声单体13和所述上盖板111的配合面为路径在所述上盖板111的外部通过激光焊接将所述发声单体13和所述上盖板111固定。
步骤S22、将所述下盖板113与所述上盖板111装配形成所述壳体11,以所述上盖板111和下盖板113的配合面为路径在所述壳体11的外部通过激光焊接将所述上盖板111和所述下盖板113固定。
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。

Claims (7)

1.一种发声器件,包括壳体、以及收容于所述壳体内的发声单体,其特征在于,所述壳体包括具有收容空间的上盖板,所述上盖板为3D玻璃,所述上盖板与所述发声单体之间通过激光焊接固定。
2.根据权利要求1所述的发声器件,其特征在于,所述发声单体设有外壳,所述外壳为塑料外壳。
3.根据权利要求1所述的发声器件,其特征在于,所述壳体还包括与所述上盖板配合的下盖板,所述下盖板为3D玻璃。
4.根据权利要求3所述的发声器件,其特征在于,所述上盖板与所述下盖板通过激光焊接固定。
5.一种发声器件的装配方法,其特征在于,包括如下步骤:
提供发声单体和壳体,所述壳体为3D玻璃;
将所述发声单体放置于所述壳体内,在所述壳体外部通过激光焊接将所述发声单体和所述壳体固定,装配形成发声器件。
6.根据权利要求5所述的发声器件的装配方法,其特征在于,所述壳体包括上盖板、以及与所述上盖板配合的下盖板,所述发声单体和所述壳体的装配步骤包括:
将所述发声单体放置于所述上盖板内,以所述发声单体和所述上盖板的配合面为路径在所述上盖板的外部通过激光焊接将所述发声单体和所述上盖板固定;
将所述下盖板与所述上盖板装配形成壳体,以所述上盖板和下盖板的配合面为路径在所述壳体的外部通过激光焊接将所述上盖板和所述下盖板固定。
7.根据权利要求6所述的发声器件的装配方法,其特征在于,所述发声单体和所述上盖板的装配步骤包括:
将所述发声单体放置于所述上盖板内;
沿所述发声单体的侧面填补密封胶;
待所述密封胶固化后翻转;
以所述发声单体和所述上盖板的配合面为路径在所述上盖板的外部通过激光焊接将所述发声单体和所述上盖板固定。
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