CN104037156B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN104037156B
CN104037156B CN201410239237.5A CN201410239237A CN104037156B CN 104037156 B CN104037156 B CN 104037156B CN 201410239237 A CN201410239237 A CN 201410239237A CN 104037156 B CN104037156 B CN 104037156B
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CN
China
Prior art keywords
wiring
semiconductor chip
group
salient pole
long side
Prior art date
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Active
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CN201410239237.5A
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English (en)
Chinese (zh)
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CN104037156A (zh
Inventor
江川秀范
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Renesas Electronics Corp
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Renesas Electronics Corp
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Publication date
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Publication of CN104037156A publication Critical patent/CN104037156A/zh
Application granted granted Critical
Publication of CN104037156B publication Critical patent/CN104037156B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN201410239237.5A 2009-07-15 2010-06-30 半导体装置 Active CN104037156B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-166975 2009-07-15
JP2009166975A JP5325684B2 (ja) 2009-07-15 2009-07-15 半導体装置
CN201010222675.2A CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201010222675.2A Division CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置

Publications (2)

Publication Number Publication Date
CN104037156A CN104037156A (zh) 2014-09-10
CN104037156B true CN104037156B (zh) 2019-01-11

Family

ID=43464699

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201410239237.5A Active CN104037156B (zh) 2009-07-15 2010-06-30 半导体装置
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN201010222675.2A Active CN101958295B (zh) 2009-07-15 2010-06-30 半导体装置
CN201410486030.8A Active CN104332454B (zh) 2009-07-15 2010-06-30 半导体装置
CN201310356421.3A Active CN103500735B (zh) 2009-07-15 2010-06-30 半导体装置

Country Status (3)

Country Link
US (5) US8384230B2 (https=)
JP (1) JP5325684B2 (https=)
CN (4) CN104037156B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
JP5405679B2 (ja) * 2013-01-25 2014-02-05 ルネサスエレクトロニクス株式会社 半導体装置
JP2016115751A (ja) * 2014-12-12 2016-06-23 ラピスセミコンダクタ株式会社 半導体パッケージ
WO2017195605A1 (ja) * 2016-05-10 2017-11-16 オリンパス株式会社 電子回路ユニット、撮像ユニット、撮像モジュールおよび内視鏡
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR102628847B1 (ko) * 2019-06-12 2024-01-25 삼성디스플레이 주식회사 디스플레이 장치
JP6973861B2 (ja) * 2019-08-28 2021-12-01 Ｎｅｃプラットフォームズ株式会社 半導体装置、電子機器及び半導体装置の製造方法
TWI873949B (zh) * 2022-11-11 2025-02-21 財團法人工業技術研究院 模塑電子組件
JP2024169133A (ja) * 2023-05-25 2024-12-05 オムロン株式会社 基板及びモジュール

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CN1290002A (zh) * 1999-09-27 2001-04-04 精工爱普生株式会社 光电装置和使用该装置的电子设备以及显示驱动集成电路
CN1507053A (zh) * 2002-09-26 2004-06-23 ��ʽ���������Ƽ� 半导体集成电路器件

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JP4781097B2 (ja) * 2005-12-05 2011-09-28 ルネサスエレクトロニクス株式会社 テープキャリアパッケージ及びそれを搭載した表示装置
KR100987479B1 (ko) * 2005-12-19 2010-10-13 삼성전자주식회사 반도체 칩 및 이를 이용한 반도체 칩 패키지
KR100681398B1 (ko) * 2005-12-29 2007-02-15 삼성전자주식회사 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지
KR100729537B1 (ko) 2006-02-28 2007-06-18 주식회사 탑 엔지니어링 본딩 장비의 테잎 피딩 방법
JP4806313B2 (ja) * 2006-08-18 2011-11-02 Ｎｅｃ液晶テクノロジー株式会社 テープキャリア、液晶表示装置用テープキャリア、及び液晶表示装置
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CN1253077A (zh) * 1998-11-04 2000-05-17 松下电器产业株式会社 喷墨印头及其制造方法
CN1290002A (zh) * 1999-09-27 2001-04-04 精工爱普生株式会社 光电装置和使用该装置的电子设备以及显示驱动集成电路
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Also Published As

Publication number Publication date
CN103500735A (zh) 2014-01-08
HK1199554A1 (zh) 2015-07-03
CN103500735B (zh) 2015-05-06
US8384230B2 (en) 2013-02-26
US20150123274A1 (en) 2015-05-07
JP5325684B2 (ja) 2013-10-23
CN101958295A (zh) 2011-01-26
US8686574B2 (en) 2014-04-01
CN104332454B (zh) 2017-04-12
HK1204507A1 (en) 2015-11-20
US20200066611A1 (en) 2020-02-27
CN104332454A (zh) 2015-02-04
US8975762B2 (en) 2015-03-10
CN101958295B (zh) 2014-10-01
US20140167258A1 (en) 2014-06-19
JP2011023528A (ja) 2011-02-03
US20110012265A1 (en) 2011-01-20
US20130147039A1 (en) 2013-06-13
CN104037156A (zh) 2014-09-10
US11244883B2 (en) 2022-02-08

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