CN102867821B - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN102867821B
CN102867821B CN201210331265.0A CN201210331265A CN102867821B CN 102867821 B CN102867821 B CN 102867821B CN 201210331265 A CN201210331265 A CN 201210331265A CN 102867821 B CN102867821 B CN 102867821B
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China
Prior art keywords
wiring substrate
conductive pad
conductive pads
wiring
upper conductive
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CN201210331265.0A
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English (en)
Chinese (zh)
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CN102867821A (zh
Inventor
石川智和
冈田三香子
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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US9330942B2 (en) 2016-05-03
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