CN101589454B - 电子元件的塑料封装体 - Google Patents

电子元件的塑料封装体 Download PDF

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Publication number
CN101589454B
CN101589454B CN2007800497879A CN200780049787A CN101589454B CN 101589454 B CN101589454 B CN 101589454B CN 2007800497879 A CN2007800497879 A CN 2007800497879A CN 200780049787 A CN200780049787 A CN 200780049787A CN 101589454 B CN101589454 B CN 101589454B
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CN
China
Prior art keywords
frame
plastic
lid
lead wire
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800497879A
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English (en)
Chinese (zh)
Other versions
CN101589454A (zh
Inventor
M·A·齐莫尔曼
K·史密斯
J·什维尔丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IQLP LLC
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Interplex QLP Inc
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Filing date
Publication date
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Publication of CN101589454A publication Critical patent/CN101589454A/zh
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Publication of CN101589454B publication Critical patent/CN101589454B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN2007800497879A 2006-12-12 2007-12-12 电子元件的塑料封装体 Expired - Fee Related CN101589454B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US87445006P 2006-12-12 2006-12-12
US60/874,450 2006-12-12
PCT/US2007/025452 WO2008073485A2 (en) 2006-12-12 2007-12-12 Plastic electronic component package

Publications (2)

Publication Number Publication Date
CN101589454A CN101589454A (zh) 2009-11-25
CN101589454B true CN101589454B (zh) 2012-05-16

Family

ID=39512337

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800497879A Expired - Fee Related CN101589454B (zh) 2006-12-12 2007-12-12 电子元件的塑料封装体

Country Status (5)

Country Link
US (3) US20080150064A1 (https=)
EP (1) EP2100323A4 (https=)
JP (1) JP2010512665A (https=)
CN (1) CN101589454B (https=)
WO (1) WO2008073485A2 (https=)

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US8481420B2 (en) 2011-03-15 2013-07-09 Stats Chippac Ltd. Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
US20130025745A1 (en) * 2011-07-27 2013-01-31 Texas Instruments Incorporated Mask-Less Selective Plating of Leadframes
JP2014528492A (ja) 2011-09-30 2014-10-27 サン−ゴバン パフォーマンス プラスティックス コーポレイション 溶融加工したフルオロポリマー物品及びフルオロポリマーの溶融加工方法
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KR20130087249A (ko) * 2012-01-27 2013-08-06 삼성전자주식회사 반도체 장치 및 이를 이용한 이미지 센서 패키지
CN102820409A (zh) * 2012-08-13 2012-12-12 深圳市灏天光电有限公司 一种大功率led支架及大功率led封装结构
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DE102015108078A1 (de) 2015-05-21 2016-11-24 Aesculap Ag Elektrochirurgisches Koagulationsinstrument
US10090420B2 (en) 2016-01-22 2018-10-02 Solar Junction Corporation Via etch method for back contact multijunction solar cells
CN107614753B (zh) * 2016-03-03 2018-09-28 三井金属矿业株式会社 覆铜层叠板的制造方法
US9680035B1 (en) 2016-05-27 2017-06-13 Solar Junction Corporation Surface mount solar cell with integrated coverglass
CN106252289B (zh) * 2016-09-29 2019-02-01 山东盛品电子技术有限公司 一种提高气密性的塑封管壳产品及制备方法
CN106298685B (zh) * 2016-09-29 2019-01-04 中国船舶重工集团公司第七一九研究所 一种采用超声波焊接的电子芯片封装结构
WO2018209269A1 (en) * 2017-05-12 2018-11-15 Iqlp, Llc Liquid crystal polymer enclosure material
CN107301988B (zh) * 2017-05-27 2023-06-13 格科微电子（上海）有限公司 摄像头模组及其装配方法
JP6892796B2 (ja) * 2017-07-07 2021-06-23 新光電気工業株式会社 電子部品装置及びその製造方法
JP6923423B2 (ja) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP7170498B2 (ja) * 2018-10-24 2022-11-14 株式会社三井ハイテック リードフレーム、及びリードフレームパッケージ
DE102019201228B4 (de) * 2019-01-31 2023-10-05 Robert Bosch Gmbh Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung
TWI721837B (zh) * 2020-03-26 2021-03-11 勝麗國際股份有限公司 感測器封裝結構
KR102839929B1 (ko) * 2020-06-10 2025-07-29 엘지이노텍 주식회사 이미지 센서 패키지 및 이를 포함하는 카메라 장치
CN112002683A (zh) * 2020-08-25 2020-11-27 湖南方彦半导体有限公司 一种半导体框架

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CN107808866A (zh) * 2016-09-09 2018-03-16 日月光半导体制造股份有限公司 半导体装置封装
CN107808866B (zh) * 2016-09-09 2022-01-28 日月光半导体制造股份有限公司 半导体装置封装

Also Published As

Publication number Publication date
US8039945B2 (en) 2011-10-18
US20110064881A1 (en) 2011-03-17
JP2010512665A (ja) 2010-04-22
EP2100323A2 (en) 2009-09-16
WO2008073485A4 (en) 2008-12-31
US20080305355A1 (en) 2008-12-11
WO2008073485A3 (en) 2008-11-13
EP2100323A4 (en) 2011-12-07
WO2008073485A2 (en) 2008-06-19
US20080150064A1 (en) 2008-06-26
CN101589454A (zh) 2009-11-25

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