JP2010512665A - プラスチック電子素子パッケージ - Google Patents

プラスチック電子素子パッケージ Download PDF

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Publication number
JP2010512665A
JP2010512665A JP2009541372A JP2009541372A JP2010512665A JP 2010512665 A JP2010512665 A JP 2010512665A JP 2009541372 A JP2009541372 A JP 2009541372A JP 2009541372 A JP2009541372 A JP 2009541372A JP 2010512665 A JP2010512665 A JP 2010512665A
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JP
Japan
Prior art keywords
frame
lid
plastic
lead frame
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009541372A
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English (en)
Japanese (ja)
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JP2010512665A5 (https=
Inventor
マイケル， エイ． ツィマーマン，
キース スミス，
ジャコブ シュヴァーディン，
Original Assignee
インタープレックス，キューエルピー，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by インタープレックス，キューエルピー，インコーポレイテッド filed Critical インタープレックス，キューエルピー，インコーポレイテッド
Publication of JP2010512665A publication Critical patent/JP2010512665A/ja
Publication of JP2010512665A5 publication Critical patent/JP2010512665A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2009541372A 2006-12-12 2007-12-12 プラスチック電子素子パッケージ Pending JP2010512665A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87445006P 2006-12-12 2006-12-12
PCT/US2007/025452 WO2008073485A2 (en) 2006-12-12 2007-12-12 Plastic electronic component package

Publications (2)

Publication Number Publication Date
JP2010512665A true JP2010512665A (ja) 2010-04-22
JP2010512665A5 JP2010512665A5 (https=) 2011-02-10

Family

ID=39512337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009541372A Pending JP2010512665A (ja) 2006-12-12 2007-12-12 プラスチック電子素子パッケージ

Country Status (5)

Country Link
US (3) US20080150064A1 (https=)
EP (1) EP2100323A4 (https=)
JP (1) JP2010512665A (https=)
CN (1) CN101589454B (https=)
WO (1) WO2008073485A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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JP2013539502A (ja) * 2010-07-27 2013-10-24 コーニング インコーポレイテッド 自己不動態化する機械的に安定な気密薄膜
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
KR20210153361A (ko) * 2020-06-10 2021-12-17 엘지이노텍 주식회사 이미지 센서 패키지 및 이를 포함하는 카메라 장치

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JP2010228441A (ja) * 2009-03-06 2010-10-14 Sumitomo Chemical Co Ltd 液晶ポリマーの成形体とガラス基材とを溶着する方法、及び、これにより製造された複合体
US20110057216A1 (en) * 2009-09-10 2011-03-10 Tong Hsing Electric Industries Ltd. Low profile optoelectronic device package
US9337360B1 (en) 2009-11-16 2016-05-10 Solar Junction Corporation Non-alloyed contacts for III-V based solar cells
US8587107B2 (en) 2010-02-09 2013-11-19 Microsemi Corporation Silicon carbide semiconductor
US8237171B2 (en) * 2010-02-09 2012-08-07 Microsemi Corporation High voltage high package pressure semiconductor package
US9214586B2 (en) 2010-04-30 2015-12-15 Solar Junction Corporation Semiconductor solar cell package
US8962989B2 (en) 2011-02-03 2015-02-24 Solar Junction Corporation Flexible hermetic semiconductor solar cell package with non-hermetic option
US8481420B2 (en) 2011-03-15 2013-07-09 Stats Chippac Ltd. Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
US20130025745A1 (en) * 2011-07-27 2013-01-31 Texas Instruments Incorporated Mask-Less Selective Plating of Leadframes
JP2014528492A (ja) 2011-09-30 2014-10-27 サン−ゴバン パフォーマンス プラスティックス コーポレイション 溶融加工したフルオロポリマー物品及びフルオロポリマーの溶融加工方法
CN102610585B (zh) * 2011-12-19 2015-01-14 佛山市蓝箭电子股份有限公司 一种封装硅芯片的方法及其形成的电子元件
KR20130087249A (ko) * 2012-01-27 2013-08-06 삼성전자주식회사 반도체 장치 및 이를 이용한 이미지 센서 패키지
CN102820409A (zh) * 2012-08-13 2012-12-12 深圳市灏天光电有限公司 一种大功率led支架及大功率led封装结构
WO2014027955A1 (en) * 2012-08-16 2014-02-20 Unisteel Technology International Limited A novel method of making a novel lcp nanocomposite
US9466544B2 (en) 2013-01-30 2016-10-11 Freescale Semiconductor, Inc. Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device
EP2790213A3 (en) * 2013-04-11 2015-04-01 Chun Ho Fan Cavity package
DE102015108078A1 (de) 2015-05-21 2016-11-24 Aesculap Ag Elektrochirurgisches Koagulationsinstrument
US10090420B2 (en) 2016-01-22 2018-10-02 Solar Junction Corporation Via etch method for back contact multijunction solar cells
CN107614753B (zh) * 2016-03-03 2018-09-28 三井金属矿业株式会社 覆铜层叠板的制造方法
US9680035B1 (en) 2016-05-27 2017-06-13 Solar Junction Corporation Surface mount solar cell with integrated coverglass
US20180076118A1 (en) * 2016-09-09 2018-03-15 Advanced Semiconductor Engineering, Inc. Semiconductor device package
CN106252289B (zh) * 2016-09-29 2019-02-01 山东盛品电子技术有限公司 一种提高气密性的塑封管壳产品及制备方法
CN106298685B (zh) * 2016-09-29 2019-01-04 中国船舶重工集团公司第七一九研究所 一种采用超声波焊接的电子芯片封装结构
WO2018209269A1 (en) * 2017-05-12 2018-11-15 Iqlp, Llc Liquid crystal polymer enclosure material
CN107301988B (zh) * 2017-05-27 2023-06-13 格科微电子（上海）有限公司 摄像头模组及其装配方法
JP6892796B2 (ja) * 2017-07-07 2021-06-23 新光電気工業株式会社 電子部品装置及びその製造方法
JP6923423B2 (ja) * 2017-11-21 2021-08-18 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置及び樹脂成形品の製造方法
JP7170498B2 (ja) * 2018-10-24 2022-11-14 株式会社三井ハイテック リードフレーム、及びリードフレームパッケージ
DE102019201228B4 (de) * 2019-01-31 2023-10-05 Robert Bosch Gmbh Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung
TWI721837B (zh) * 2020-03-26 2021-03-11 勝麗國際股份有限公司 感測器封裝結構
CN112002683A (zh) * 2020-08-25 2020-11-27 湖南方彦半导体有限公司 一种半导体框架

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JPH04233260A (ja) * 1990-12-28 1992-08-21 Ibiden Co Ltd 電子部品搭載用基板におけるリードフレームの表面処理方法
JPH07506391A (ja) * 1992-05-04 1995-07-13 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー 任意にガラス繊維強化／充填材を含有するサーモトロピック液晶ポリエステル組成物
JPH0677526A (ja) * 1992-08-25 1994-03-18 Nippondenso Co Ltd 樹脂封止形光電変換装置及びその製造方法
JPH0685221A (ja) * 1992-08-31 1994-03-25 Sony Corp 固体撮像装置
JPH0685097A (ja) * 1992-09-02 1994-03-25 Sony Corp 固体撮像装置の製造方法
JPH07206983A (ja) * 1994-01-25 1995-08-08 Matsushita Electric Works Ltd エポキシ樹脂組成物及びその製造方法及びそれを用いた半導体装置
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JP2002094035A (ja) * 2000-09-14 2002-03-29 Shinko Electric Ind Co Ltd 光透過用キャップ及びその製造方法
JP2002363395A (ja) * 2001-05-31 2002-12-18 Toray Ind Inc 封止用樹脂組成物、成形品および電子封止部品
JP2006303484A (ja) * 2005-03-25 2006-11-02 Sumitomo Chemical Co Ltd 固体撮像装置、固体撮像素子収納用ケース及び製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013539502A (ja) * 2010-07-27 2013-10-24 コーニング インコーポレイテッド 自己不動態化する機械的に安定な気密薄膜
JP2017518640A (ja) * 2014-05-23 2017-07-06 マテリオン コーポレイション エアキャビティパッケージ
KR20210153361A (ko) * 2020-06-10 2021-12-17 엘지이노텍 주식회사 이미지 센서 패키지 및 이를 포함하는 카메라 장치
KR102839929B1 (ko) * 2020-06-10 2025-07-29 엘지이노텍 주식회사 이미지 센서 패키지 및 이를 포함하는 카메라 장치

Also Published As

Publication number Publication date
US8039945B2 (en) 2011-10-18
US20110064881A1 (en) 2011-03-17
EP2100323A2 (en) 2009-09-16
WO2008073485A4 (en) 2008-12-31
US20080305355A1 (en) 2008-12-11
WO2008073485A3 (en) 2008-11-13
CN101589454B (zh) 2012-05-16
EP2100323A4 (en) 2011-12-07
WO2008073485A2 (en) 2008-06-19
US20080150064A1 (en) 2008-06-26
CN101589454A (zh) 2009-11-25

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