JP2010512665A5 - - Google Patents
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- Publication number
- JP2010512665A5 JP2010512665A5 JP2009541372A JP2009541372A JP2010512665A5 JP 2010512665 A5 JP2010512665 A5 JP 2010512665A5 JP 2009541372 A JP2009541372 A JP 2009541372A JP 2009541372 A JP2009541372 A JP 2009541372A JP 2010512665 A5 JP2010512665 A5 JP 2010512665A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87445006P | 2006-12-12 | 2006-12-12 | |
| PCT/US2007/025452 WO2008073485A2 (en) | 2006-12-12 | 2007-12-12 | Plastic electronic component package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010512665A JP2010512665A (ja) | 2010-04-22 |
| JP2010512665A5 true JP2010512665A5 (https=) | 2011-02-10 |
Family
ID=39512337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009541372A Pending JP2010512665A (ja) | 2006-12-12 | 2007-12-12 | プラスチック電子素子パッケージ |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US20080150064A1 (https=) |
| EP (1) | EP2100323A4 (https=) |
| JP (1) | JP2010512665A (https=) |
| CN (1) | CN101589454B (https=) |
| WO (1) | WO2008073485A2 (https=) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009176894A (ja) * | 2008-01-23 | 2009-08-06 | Panasonic Corp | 光学半導体装置 |
| US8059404B2 (en) * | 2008-10-09 | 2011-11-15 | GM Global Technology Operations LLC | Power inverters |
| JP2010228441A (ja) * | 2009-03-06 | 2010-10-14 | Sumitomo Chemical Co Ltd | 液晶ポリマーの成形体とガラス基材とを溶着する方法、及び、これにより製造された複合体 |
| US20110057216A1 (en) * | 2009-09-10 | 2011-03-10 | Tong Hsing Electric Industries Ltd. | Low profile optoelectronic device package |
| US9337360B1 (en) | 2009-11-16 | 2016-05-10 | Solar Junction Corporation | Non-alloyed contacts for III-V based solar cells |
| US8587107B2 (en) | 2010-02-09 | 2013-11-19 | Microsemi Corporation | Silicon carbide semiconductor |
| US8237171B2 (en) * | 2010-02-09 | 2012-08-07 | Microsemi Corporation | High voltage high package pressure semiconductor package |
| US9214586B2 (en) | 2010-04-30 | 2015-12-15 | Solar Junction Corporation | Semiconductor solar cell package |
| US20120028011A1 (en) * | 2010-07-27 | 2012-02-02 | Chong Pyung An | Self-passivating mechanically stable hermetic thin film |
| US8962989B2 (en) | 2011-02-03 | 2015-02-24 | Solar Junction Corporation | Flexible hermetic semiconductor solar cell package with non-hermetic option |
| US8481420B2 (en) | 2011-03-15 | 2013-07-09 | Stats Chippac Ltd. | Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof |
| US20130025745A1 (en) * | 2011-07-27 | 2013-01-31 | Texas Instruments Incorporated | Mask-Less Selective Plating of Leadframes |
| JP2014528492A (ja) | 2011-09-30 | 2014-10-27 | サン−ゴバン パフォーマンス プラスティックス コーポレイション | 溶融加工したフルオロポリマー物品及びフルオロポリマーの溶融加工方法 |
| CN102610585B (zh) * | 2011-12-19 | 2015-01-14 | 佛山市蓝箭电子股份有限公司 | 一种封装硅芯片的方法及其形成的电子元件 |
| KR20130087249A (ko) * | 2012-01-27 | 2013-08-06 | 삼성전자주식회사 | 반도체 장치 및 이를 이용한 이미지 센서 패키지 |
| CN102820409A (zh) * | 2012-08-13 | 2012-12-12 | 深圳市灏天光电有限公司 | 一种大功率led支架及大功率led封装结构 |
| WO2014027955A1 (en) * | 2012-08-16 | 2014-02-20 | Unisteel Technology International Limited | A novel method of making a novel lcp nanocomposite |
| US9466544B2 (en) | 2013-01-30 | 2016-10-11 | Freescale Semiconductor, Inc. | Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device |
| EP2790213A3 (en) * | 2013-04-11 | 2015-04-01 | Chun Ho Fan | Cavity package |
| JP2017518640A (ja) * | 2014-05-23 | 2017-07-06 | マテリオン コーポレイション | エアキャビティパッケージ |
| DE102015108078A1 (de) | 2015-05-21 | 2016-11-24 | Aesculap Ag | Elektrochirurgisches Koagulationsinstrument |
| US10090420B2 (en) | 2016-01-22 | 2018-10-02 | Solar Junction Corporation | Via etch method for back contact multijunction solar cells |
| CN107614753B (zh) * | 2016-03-03 | 2018-09-28 | 三井金属矿业株式会社 | 覆铜层叠板的制造方法 |
| US9680035B1 (en) | 2016-05-27 | 2017-06-13 | Solar Junction Corporation | Surface mount solar cell with integrated coverglass |
| US20180076118A1 (en) * | 2016-09-09 | 2018-03-15 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| CN106252289B (zh) * | 2016-09-29 | 2019-02-01 | 山东盛品电子技术有限公司 | 一种提高气密性的塑封管壳产品及制备方法 |
| CN106298685B (zh) * | 2016-09-29 | 2019-01-04 | 中国船舶重工集团公司第七一九研究所 | 一种采用超声波焊接的电子芯片封装结构 |
| WO2018209269A1 (en) * | 2017-05-12 | 2018-11-15 | Iqlp, Llc | Liquid crystal polymer enclosure material |
| CN107301988B (zh) * | 2017-05-27 | 2023-06-13 | 格科微电子(上海)有限公司 | 摄像头模组及其装配方法 |
| JP6892796B2 (ja) * | 2017-07-07 | 2021-06-23 | 新光電気工業株式会社 | 電子部品装置及びその製造方法 |
| JP6923423B2 (ja) * | 2017-11-21 | 2021-08-18 | Towa株式会社 | 搬送装置、樹脂成形装置及び樹脂成形品の製造方法 |
| JP7170498B2 (ja) * | 2018-10-24 | 2022-11-14 | 株式会社三井ハイテック | リードフレーム、及びリードフレームパッケージ |
| DE102019201228B4 (de) * | 2019-01-31 | 2023-10-05 | Robert Bosch Gmbh | Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung |
| TWI721837B (zh) * | 2020-03-26 | 2021-03-11 | 勝麗國際股份有限公司 | 感測器封裝結構 |
| KR102839929B1 (ko) * | 2020-06-10 | 2025-07-29 | 엘지이노텍 주식회사 | 이미지 센서 패키지 및 이를 포함하는 카메라 장치 |
| CN112002683A (zh) * | 2020-08-25 | 2020-11-27 | 湖南方彦半导体有限公司 | 一种半导体框架 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826381B2 (ja) * | 1979-04-28 | 1983-06-02 | 信越ポリマ−株式会社 | 電磁気シ−ルドガスケットおよびその製造方法 |
| US4880591A (en) * | 1988-04-05 | 1989-11-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing speaker vibration member |
| EP0388157B1 (en) * | 1989-03-15 | 1994-02-16 | Ngk Insulators, Ltd. | Ceramic lid for sealing semiconductor element and method of sealing a semiconductor element in a ceramic package |
| CA2047486C (en) * | 1990-07-21 | 2002-03-05 | Shigeru Katayama | Semiconductor device and method for manufacturing the same |
| JP2876092B2 (ja) * | 1990-12-28 | 1999-03-31 | イビデン株式会社 | 電子部品搭載用基板におけるリードフレームの表面処理方法 |
| US5250654A (en) * | 1992-05-04 | 1993-10-05 | E. I. Du Pont De Nemours And Company | Thermotropic liquid crystalline polyester compositions |
| US5436492A (en) * | 1992-06-23 | 1995-07-25 | Sony Corporation | Charge-coupled device image sensor |
| JP3270862B2 (ja) * | 1992-09-02 | 2002-04-02 | ソニー株式会社 | 固体撮像装置の製造方法 |
| JPH0677526A (ja) * | 1992-08-25 | 1994-03-18 | Nippondenso Co Ltd | 樹脂封止形光電変換装置及びその製造方法 |
| JPH0685221A (ja) * | 1992-08-31 | 1994-03-25 | Sony Corp | 固体撮像装置 |
| JP2853550B2 (ja) * | 1994-01-25 | 1999-02-03 | 松下電工株式会社 | エポキシ樹脂組成物及びその製造方法及びそれを用いた半導体装置 |
| US5586214A (en) * | 1994-12-29 | 1996-12-17 | Energy Convertors, Inc. | Immersion heating element with electric resistance heating material and polymeric layer disposed thereon |
| US5691689A (en) * | 1995-08-11 | 1997-11-25 | Eaton Corporation | Electrical circuit protection devices comprising PTC conductive liquid crystal polymer compositions |
| US6011294A (en) * | 1996-04-08 | 2000-01-04 | Eastman Kodak Company | Low cost CCD packaging |
| JPH1131751A (ja) * | 1997-07-10 | 1999-02-02 | Sony Corp | 中空パッケージとその製造方法 |
| US6409859B1 (en) * | 1998-06-30 | 2002-06-25 | Amerasia International Technology, Inc. | Method of making a laminated adhesive lid, as for an Electronic device |
| JP3407218B2 (ja) * | 1998-12-09 | 2003-05-19 | 富士電機株式会社 | 半導体光センサデバイス |
| JP2001127229A (ja) * | 1999-11-01 | 2001-05-11 | Nec Corp | リードフレーム及びそのリードフレームを用いた樹脂封止型半導体装置 |
| US6455774B1 (en) * | 1999-12-08 | 2002-09-24 | Amkor Technology, Inc. | Molded image sensor package |
| JP2001210776A (ja) * | 2000-01-24 | 2001-08-03 | Fujitsu Ltd | 半導体装置とその製造方法及びリードフレームとその製造方法 |
| US6525405B1 (en) * | 2000-03-30 | 2003-02-25 | Alphatec Holding Company Limited | Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| JP2001335708A (ja) * | 2000-05-26 | 2001-12-04 | Matsushita Electric Works Ltd | 熱可塑性樹脂組成物、その製造方法、並びに半導体素子収納用パッケージ |
| JP2002094035A (ja) * | 2000-09-14 | 2002-03-29 | Shinko Electric Ind Co Ltd | 光透過用キャップ及びその製造方法 |
| TW473951B (en) * | 2001-01-17 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Non-leaded quad flat image sensor package |
| JP2002334944A (ja) * | 2001-05-08 | 2002-11-22 | Nec Corp | 中空構造パッケージ |
| JP2002363395A (ja) * | 2001-05-31 | 2002-12-18 | Toray Ind Inc | 封止用樹脂組成物、成形品および電子封止部品 |
| JP3831322B2 (ja) * | 2001-12-25 | 2006-10-11 | 日本碍子株式会社 | Iii族窒化物膜の製造方法、エピタキシャル成長用基板、iii族窒化物膜、iii族窒化物素子用エピタキシャル基板、及びiii族窒化物素子 |
| SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
| JP3883543B2 (ja) * | 2003-04-16 | 2007-02-21 | 新光電気工業株式会社 | 導体基材及び半導体装置 |
| US20040245590A1 (en) * | 2003-06-05 | 2004-12-09 | Jackson Hsieh | Image sensor package |
| US7615563B2 (en) * | 2003-08-08 | 2009-11-10 | Gonzalez Iii Jesus E | Compositions useful as inhibitors of voltage-gated sodium channels |
| US7645635B2 (en) * | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
| US7224047B2 (en) * | 2004-12-18 | 2007-05-29 | Lsi Corporation | Semiconductor device package with reduced leakage |
| JP2006303484A (ja) * | 2005-03-25 | 2006-11-02 | Sumitomo Chemical Co Ltd | 固体撮像装置、固体撮像素子収納用ケース及び製造方法 |
-
2007
- 2007-12-12 US US12/001,792 patent/US20080150064A1/en not_active Abandoned
- 2007-12-12 WO PCT/US2007/025452 patent/WO2008073485A2/en not_active Ceased
- 2007-12-12 EP EP07853355A patent/EP2100323A4/en not_active Withdrawn
- 2007-12-12 JP JP2009541372A patent/JP2010512665A/ja active Pending
- 2007-12-12 CN CN2007800497879A patent/CN101589454B/zh not_active Expired - Fee Related
-
2008
- 2008-07-25 US US12/220,543 patent/US20080305355A1/en not_active Abandoned
-
2010
- 2010-11-19 US US12/950,528 patent/US8039945B2/en active Active
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