JP3270862B2 - 固体撮像装置の製造方法 - Google Patents

固体撮像装置の製造方法

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Publication number
JP3270862B2
JP3270862B2 JP26081692A JP26081692A JP3270862B2 JP 3270862 B2 JP3270862 B2 JP 3270862B2 JP 26081692 A JP26081692 A JP 26081692A JP 26081692 A JP26081692 A JP 26081692A JP 3270862 B2 JP3270862 B2 JP 3270862B2
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JP
Japan
Prior art keywords
base
solid
imaging device
state imaging
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP26081692A
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English (en)
Other versions
JPH0685097A (ja
Inventor
英雄 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP26081692A priority Critical patent/JP3270862B2/ja
Priority to US08/078,846 priority patent/US5436492A/en
Priority to TW085110784A priority patent/TW332348B/zh
Priority to KR1019930011357A priority patent/KR940006397A/ko
Publication of JPH0685097A publication Critical patent/JPH0685097A/ja
Priority to US08/392,222 priority patent/US5529959A/en
Application granted granted Critical
Publication of JP3270862B2 publication Critical patent/JP3270862B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1648—Laser beams characterised by the way of heating the interface radiating the edges of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/05—Particular design of joint configurations
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    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/05—Particular design of joint configurations
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/1162—Single bevel to bevel joints, e.g. mitre joints
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
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    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1226—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least one bevelled joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
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    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
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    • H—ELECTRICITY
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、樹脂製の基台と蓋とか
ら成る中空型パッケージ内に固体撮像素子を収納して成
る固体撮像装置の製造方法に関するものである。
【０００２】
【従来の技術】Ｃｈａｒｇｅ Ｃｏｕｐｌｅｄ Ｄｅｖ
ｉｃｅ（以下、ＣＣＤとする）エリアおよびリニアセン
サー等の固体撮像装置は、ビデオカメラやコピー機等に
使用されており、パッケージ内に収納された固体撮像素
子にて受光した光信号を電気信号に変換するものであ
る。この固体撮像装置は、主に固体撮像素子を搭載する
ための基台と、基台上に取り付けられた蓋とから成るも
ので、蓋として光の透過率が高いものが用いられてい
る。
【０００３】固体撮像素子を搭載するための基台の材質
としては、従来セラミックスが用いられており、蓋の材
質としてはガラスが用いられている。また、コストダウ
ンや加工性向上等の観点から基台の材質として熱硬化型
樹脂を用いたものや、蓋の材質として熱可塑性樹脂を用
いたものがあり、この熱硬化型樹脂の基台と熱可塑性樹
脂の蓋とを用いた樹脂製パッケージから成る固体撮像装
置もある。
【０００４】このような固体撮像装置の製造方法は、先
ず、基台上の搭載部にチップ状の固体撮像素子を低温硬
化タイプの銀ペースト等のエポキシ系接着剤等により接
着する。例えば、セラミックスを用いた基台には、予め
リードフレームが低融点ガラス等を用いて取り付けられ
ており、さらに基台上の周縁部に所定高さの枠が取り付
けられている。また、樹脂を用いた基台においては、熱
硬化型樹脂にて形成される基台内に予めリードフレーム
が埋め込まれており、インナーリード部のみが基台の上
面から露出した状態となっている。
【０００５】次に、このような基台上に搭載された固体
撮像素子とリードフレームのインナーリード部とをボン
ディングワイヤーにて配線する。次いで、基台上に取り
付けられた所定高さの枠を介して透光性を有する蓋を接
続する。樹脂製の蓋の場合には、接続として主に低温硬
化のエポキシ系接着剤が用いられ、ガラス製の蓋の場合
には低温硬化のエポキシ系Ｂステージシーラーや低融点
ガラスが用いられており、基台上に蓋を接着した後、所
定の温度に加熱して硬化させる。このようにして基台と
蓋との間の空間に固体撮像素子が収納された固体撮像装
置を製造する。
【０００６】
【発明が解決しようとする課題】しかしながら、このよ
うな固体撮像装置の製造方法には次のような問題があ
る。すなわち、セラミックスの基台とガラスの蓋とを用
いた場合には、基台および蓋の加工性の問題やゴミ等の
付着、さらには品質等の問題があり、コストダウンや歩
留り向上を図るのが困難である。また、熱硬化型樹脂の
基台とガラスの蓋とを用いた場合には、固体撮像装置の
小型化を図るうえで基台の加工性は向上するが、ガラス
の蓋を小さく加工して研磨したりするのが非常に困難と
なる。また、セラミックスの基台と樹脂の蓋とを用いた
場合には、これらを十分な接着力で接着する適当な接着
剤が少なく、十分な接着力が得られないため気密性の低
下を招いてしまう。
【０００７】このようなことから、熱硬化型樹脂の基台
と熱可塑性樹脂の蓋とを用いた場合には加工性の向上や
コストダウン、および固体撮像装置の小型化が図れる
が、基台の材質と蓋の材質との間に熱膨張係数の違いが
あるため、接着剤の加熱硬化の際や周囲の温度変化によ
り基台と蓋との剥がれが生じてしまい実用化が困難であ
る。よって、本発明は、小型化を図れ量産に適した固体
撮像装置の製造方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】本発明は、このような課
題を解決するためになされた固体撮像装置の製造方法で
ある。すなわち、樹脂製の断面が略矩形状の基台上面に
固体撮像素子を搭載し、所定高さの枠部が設けられた樹
脂製の蓋をこの基台上に被着して、固体撮像素子の上方
を蓋にて覆う固体撮像装置の製造方法で、先ず、熱可塑
性樹脂を用いて基台を形成するに際し、この基台内にリ
ードフレームを埋め込み、リードフレームのインナーリ
ード部を基台の上面における周縁部より内側のみに露出
させ、次いで、この基台上に固体撮像素子を搭載し、固
体撮像素子とインナーリード部とをボンディングワイヤ
ーにて配線する。次に、熱可塑性樹脂を用いて形成され
た蓋の枠部と、基台の上面におけるインナーリード部が
露出していない周縁部とを超音波やレーザ光を用いて溶
着したり、紫外線照射硬化型接着剤を用いて接着するも
のである。
【０００９】また、熱硬化型樹脂を用いて前記基台を形
成する場合には、この形成に際し、基台内にリードフレ
ームを埋め込み、リードフレームのインナーリード部を
基台の上面における周縁部より内側のみに露出させ、次
いで、この基台上に固体撮像素子を搭載し、固体撮像素
子とインナーリード部とをボンディングワイヤーにて配
線する。次に、熱硬化型樹脂を用いて形成された蓋の枠
部と、基台の上面におけるインナーリード部が露出して
いない周縁部とを紫外線照射硬化型接着剤にて接着する
ものである。
【００１０】
【作用】基台と蓋の材質として熱可塑性樹脂、または熱
硬化型樹脂のどちらか一方を用いているため、基台と蓋
との熱膨張係数の差が小さくなり、温度変化による基台
と蓋との接続面へのストレスが小さくなる。また、基台
と蓋の材質として熱可塑性樹脂を用いた場合において、
基台上の周縁部と蓋の枠との接続面に超音波やレーザ光
を与えることにより、全体的に加熱することなく基台と
蓋とが溶着することになる。基台と蓋との材質として熱
硬化型樹脂または熱可塑性樹脂のどちらか一方を用いた
場合には、これらの接触面に紫外線照射硬化型接着剤を
塗布し、これに所定波長の紫外線を照射すれば、全体的
に加熱することなく基台と蓋とが接着することになる。
【００１１】
【実施例】以下に、本発明の固体撮像装置の製造方法を
図に基づいて説明する。図１〜図３に示す断面図は、本
発明の固体撮像装置の製造方法を工程順に示すものであ
り、基台と蓋との材質として熱可塑性樹脂を用いた場合
である。先ず、基台の形成工程として図１に示すよう
に、熱可塑性樹脂から成る基台１を射出成形等により形
成する。この際、基台１内にリードフレーム２を埋め込
み、リードフレーム２のインナーリード部２１を基台１
上面の搭載部１１の周辺に露出させた状態にする。ま
た、アウターリード部２２は、例えば基台１の側面から
下方に向けて延出する。なお、小型化を図る場合には、
アウターリード部２２を基台１の下面から延出してもよ
い（図示せず）。
【００１２】基台１内に埋め込まれるリードフレーム２
としては、４２アロイ材または銅材等に錫メッキまたは
ハンダメッキを施したものを用い、インナーリード部２
１となる部分にアルミニウムのクラッド層を形成してお
く。これを所定のプレス金型により打ち抜き加工して、
複数のインナーリード部２１およびアウターリード部２
２を形成する。また、基台１の材質としては、ポリオレ
フィン系やノルボルネン系、ポリカーボネートやアクリ
ル系等を用い、リードフレーム２との密着性を向上させ
る付与材や、耐熱性や機械的強度向上等のためにフィラ
ー等の添加物を混入したものでもよい。
【００１３】次に、搭載工程として図２に示すように、
基台１の搭載部１１に固体撮像素子３を接着する。この
接着としては、低温硬化型接着剤や紫外線照射硬化型接
着剤を用い、加熱による基台１の変形を極力抑える。そ
して、この固体撮像素子３と基台１の上面に露出してい
るリードフレーム２のインナーリード部２１とをボンデ
ィングワイヤー３１により配線する。ボンディングワイ
ヤー３１として２５〜３０μｍの金線を使用して、金ボ
ールボンドを行ったり、アルミニウム線を使用して常温
によるアルミウェッジボンドを行う。なお、ボンディン
グワイヤー３１によるフレア防止対策および後述する超
音波溶着時の振動変形および断線防止対策としてボンデ
ィングワイヤー３１を低アーチタイプワイヤーにするの
が望ましい。
【００１４】次に、溶着工程として図３に示すように、
基台１上に熱可塑性樹脂から成る蓋４を搭載して、これ
らを超音波により溶着して、基台１と蓋４との間の空間
に固体撮像素子３が収納された固体撮像装置を製造す
る。この蓋４としては、光の透過率の高い材質のものが
使用されており、その下面側に、ボンディングワイヤー
３１の高さよりも高い枠部４１が設けられている。この
枠部４１と基台１の周縁部２１とが接触するように蓋４
を搭載し、蓋４の上から超音波溶着装置の振動子５を押
圧状態に載置する。そして、振動子５に例えば２８ｋＨ
ｚの上下振動を１秒間位（０．５〜数秒間）与え、枠部
４１と周縁部１２との間で溶着を行う。
【００１５】この超音波による溶着を効率良く行うた
め、枠部４１の形状を例えば断面視三角形にしておく。
また、他の接続面として図４の拡大断面図に示すに、基
台１の周縁部１２と枠部４１とを斜めに面接触させるも
のや、図５に示すように、基台１の周縁部１２と枠部４
１とを振動方向に面接触させるもの、また、図６に示す
ように、基台１の周縁部１２にＲが付けられたもので、
周縁部１２と枠部４１とがせん断して溶着されるものな
どがある。なお、この接続面の形状はこれらに限定され
ず、周縁部１２と枠部４１との材質等により最適なもの
にすればよい。いずれの場合であっても、超音波を用い
ることで、基台１と蓋４とを加熱することなく溶着する
ことができ、基台１や蓋４の熱変形を抑制できる。
【００１６】ところで、このような超音波による溶着を
行うには、基台１および蓋４の材質として熱可塑性樹脂
を用い、しかも基台１と蓋４との樹脂の種類を同一にす
るのが最適である。しかし、熱可塑性樹脂のなかの異種
どうしでも溶着可能であり、例えば基台１としてＡＢＳ
（アクリロニトリル−ブタジエン−スチレン）樹脂を用
い、蓋４としてＰＣ（ポリカーボネート）を用いた場合
や、基台１にＡＢＳ樹脂、蓋４にＰＭＭＡ（ポリメチル
メタクリレート）を用いた場合などである。したがっ
て、固体撮像装置の用途に応じて選択すればよい。
【００１７】また、他の溶着方法として図７の断面図に
示すようなレーザ溶着がある。これは、基台１の周縁部
１２と蓋４の枠部４１との接続面を平面とし、ここにレ
ーザ光を照射して、レーザ光のエネルギーにより周縁部
１２と枠部４１との接続面を局部的に加熱して溶着する
ものである。このようなレーザ溶着により、基台１や蓋
４を全体的に加熱する必要がないため、熱変形を抑える
ことができる。なお、この接着面の形状は、これらに限
定されず周縁部１２と枠部４１との材質等により最適な
ものにすればよい。
【００１８】次に、基台１と蓋４の材質として熱硬化型
樹脂を用いた場合について説明する。図８の断面図は、
例えばエポキシ系の熱硬化型樹脂を用いた基台１と蓋４
との接着工程を示すもので、リードフレーム２が埋め込
まれた基台１上に固体撮像素子３を搭載し、ボンディン
グワイヤー３１にて配線した後、エポキシ系の熱硬化型
樹脂から成る蓋４を紫外線照射硬化型接着剤から成る接
着剤６を用いて接着するものである。
【００１９】接着の手順としは、基台１上の周縁部１２
に接着剤６を塗布し、この接着剤６上に蓋４の枠部４１
を載置する。次に、この接着剤６に所定波長の紫外線を
照射して接着剤６を硬化させる。なお、基台１と蓋４の
材質として熱可塑性樹脂を用い、これらを紫外線照射硬
化型接着剤で接着させる場合も同様の手順で行えばよ
い。基台１と蓋４の材質として熱硬化型樹脂または熱可
塑性樹脂のどちらか一方を用いた場合において、熱硬化
型接着剤で接着し加熱硬化すると、熱変形やストレスを
発生させ気密性を損ないやすい。このため、上述の方法
によれば基台１と蓋４とを加熱することなく接着するこ
とがきるため、熱変形や不要なストレスを発生させるこ
となく固体撮像装置を製造できることになる。
【００２０】いずれの固体撮像装置の製造方法において
も、基台１と蓋４との熱膨張係数の差が小さく、しかも
これらを全体的に加熱する必要がないため、熱変形によ
る基台１と蓋４との剥がれが発生しない。このため、基
台１と蓋４との間の空間の気密性を保持できるため、固
体撮像素子３に与える悪影響を低減できることになる。
また、樹脂による加工性および精度の向上等からパッケ
ージの小型化、軽量化が容易に行えることになり、特に
熱可塑性樹脂を用いた場合には基台と蓋とを溶着できる
ため、接着剤を塗布する必要がない。なお、本実施例で
説明した樹脂の種類は一例であり、これに限定されるも
のではなく、基台１および蓋４として熱可塑性樹脂を用
いる場合には、超音波溶着やレーザ溶着がし易い種類の
ものを選択すればよく、また、基台１および蓋４として
熱硬化型樹脂を用いる場合には、紫外線照射硬化型接着
剤による接着力が十分に得られる種類のものを選択すれ
ばよい。
【００２１】
【発明の効果】以上説明したように、本発明の固体撮像
装置の製造方法によれば次のような効果がある。すなわ
ち、基台と蓋とを樹脂を用いて製造するため、小型で軽
量な固体撮像装置となる。また、基台および蓋の材質と
して熱可塑性樹脂を用いた場合には、これらを超音波溶
着やレーザ溶着することで短時間で確実に基台と蓋とを
溶着することが可能となる。また、熱硬化型樹脂または
熱可塑性樹脂のどちらか一方を用いた場合には、紫外線
照射硬化型接着剤により容易に接着することができる。
【００２２】いずれの材質を用いても、基台と蓋との熱
膨張係数の差をほとんど無くすことができるとともに、
基台と蓋とを全体的に加熱することがないため、熱変形
による剥がれが発生せず気密性の高い高品質な固体撮像
装置を製造できる。したがって、本発明により小型、軽
量で品質の高い固体撮像装置を大量生産することが可能
となる。
【図面の簡単な説明】
【図１】基台の形成工程を説明する断面図である。
【図２】搭載工程を説明する断面図である。
【図３】溶着工程を説明する断面図である。
【図４】他の接続面を説明する拡大断面図（その１）で
ある。
【図５】他の接続面を説明する拡大断面図（その２）で
ある。
【図６】他の接続面を説明する拡大断面図（その３）で
ある。
【図７】他の例を説明する断面図（その１）である。
【図８】他の例を説明する断面図（その２）である。
【符号の説明】
１ 基台 ２ リードフレーム ３ 固体撮像素子 ４ 蓋 ５ 振動子 ６ 接着剤 １１ 搭載部 １２ 周縁部 ２１ インナーリード部 ２２ アウターリード部 ３１ ボンディングワイヤー ４１ 枠部
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/053 H01L 23/08

Claims (5)

    (57)【特許請求の範囲】
  1. 【請求項１】 樹脂製の断面が略矩形状の基台上面に固
    体撮像素子を搭載し、所定高さの枠部が設けられた樹脂
    製の蓋を前記基台上に被着して、前記固体撮像素子の上
    方を前記蓋にて覆う固体撮像装置の製造方法において、 熱可塑性樹脂を用いて前記基台を形成するに際し、前記
    基台内にリードフレームを埋め込み、該リードフレーム
    のインナーリード部を前記基台の上面における周縁部よ
    り内側のみに露出させる工程と、 次いで、前記基台上に固体撮像素子を搭載し、該固体撮
    像素子と前記インナーリード部とをボンディングワイヤ
    ーにて配線する工程と、 次に、熱可塑性樹脂を用いて形成された前記蓋の枠部
    と、前記基台の上面における前記インナーリード部が露
    出していない周縁部とを溶着する工程とから成ることを
    特徴とする固体撮像装置の製造方法。
  2. 【請求項２】 超音波を利用して、前記蓋の枠部と前記
    基台上の周縁部との溶着を行うことを特徴とする請求項
    １記載の固体撮像装置の製造方法。
  3. 【請求項３】 レーザ光を利用して、前記蓋の枠部と前
    記基台上の周縁部との溶着を行うことを特徴とする請求
    項１記載の固体撮像装置の製造方法。
  4. 【請求項４】 紫外線照射硬化型接着剤を用いて、前記
    蓋の枠部と前記基台上の周縁部との接着を行うことを特
    徴とする請求項１記載の固体撮像装置の製造方法。
  5. 【請求項５】 樹脂製の断面が略矩形状の基台上面に固
    体撮像素子を搭載し、所定高さの枠部が設けられた樹脂
    製の蓋を前記基台上に被着して、前記固体撮像素子の上
    方を前記蓋にて覆う固体撮像装置の製造方法において、 熱硬化型樹脂を用いて前記基台を形成するに際し、前記
    基台内にリードフレームを埋め込み、該リードフレーム
    のインナーリード部を前記基台の上面における周縁部よ
    り内側のみに露出させる工程と、 次いで、前記基台上に固体撮像素子を搭載し、該固体撮
    像素子と前記インナーリード部とをボンディングワイヤ
    ーにて配線する工程と、 次に、熱硬化型樹脂を用いて形成された前記蓋の枠部
    と、前記基台の上面における前記インナーリード部が露
    出していない周縁部とを紫外線照射硬化型接着剤にて接
    着する工程とから成ることを特徴とする固体撮像装置の
    製造方法。
JP26081692A 1992-06-23 1992-09-02 固体撮像装置の製造方法 Expired - Lifetime JP3270862B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26081692A JP3270862B2 (ja) 1992-09-02 1992-09-02 固体撮像装置の製造方法
US08/078,846 US5436492A (en) 1992-06-23 1993-06-21 Charge-coupled device image sensor
TW085110784A TW332348B (en) 1992-06-23 1993-06-21 Manufacturing method for solid state motion picture device provides a highly accurate and low cost solid state motion picture device by use of empty package made of resin.
KR1019930011357A KR940006397A (ko) 1992-06-23 1993-06-22 고체촬상장치 및 그 제조방법
US08/392,222 US5529959A (en) 1992-06-23 1995-02-22 Charge-coupled device image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26081692A JP3270862B2 (ja) 1992-09-02 1992-09-02 固体撮像装置の製造方法

Publications (2)

Publication Number Publication Date
JPH0685097A JPH0685097A (ja) 1994-03-25
JP3270862B2 true JP3270862B2 (ja) 2002-04-02

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Country Link
JP (1) JP3270862B2 (ja)

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KR20010058590A (ko) * 1999-12-30 2001-07-06 마이클 디. 오브라이언 리드 프레임을 이용한 전하결합소자용 패키지 및 그 주연리드 구조
JP4893281B2 (ja) * 2006-04-03 2012-03-07 株式会社デンソー カバーキャップの取付構造
WO2008073485A2 (en) * 2006-12-12 2008-06-19 Quantum Leap Packaging, Inc. Plastic electronic component package
JP5193492B2 (ja) * 2007-04-25 2013-05-08 浜松ホトニクス株式会社 光半導体デバイス
JP2010087055A (ja) * 2008-09-30 2010-04-15 Panasonic Corp 半導体パッケージおよび半導体装置
JP2010113938A (ja) * 2008-11-06 2010-05-20 Yamatake Corp 光電センサの筐体組立方法および光電センサ
JP5722161B2 (ja) * 2011-08-24 2015-05-20 株式会社東海理化電機製作所 筐体
DE102015208529B3 (de) * 2015-02-10 2016-08-04 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zu deren Herstellung

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