KR940006397A - 고체촬상장치 및 그 제조방법 - Google Patents

고체촬상장치 및 그 제조방법 Download PDF

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KR940006397A
KR940006397A KR1019930011357A KR930011357A KR940006397A KR 940006397 A KR940006397 A KR 940006397A KR 1019930011357 A KR1019930011357 A KR 1019930011357A KR 930011357 A KR930011357 A KR 930011357A KR 940006397 A KR940006397 A KR 940006397A
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base
solid
state imaging
imaging device
resin
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KR1019930011357A
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히데오 야마나까
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오가 노리오
소니 가부시기가이샤
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Priority claimed from JP04189965A external-priority patent/JP3127584B2/ja
Priority claimed from JP26081692A external-priority patent/JP3270862B2/ja
Application filed by 오가 노리오, 소니 가부시기가이샤 filed Critical 오가 노리오
Publication of KR940006397A publication Critical patent/KR940006397A/ko

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Abstract

고정밀도이고, 또한 코스트다운이 가능한 중공패키지를 사용한 고체촬상장치와 소형화 양산에 적합한 고체촬상장치의 제조방법을 제공한다.
수지제의 기대(3)에 배설된 탑재부에 고체촬상소자(2)를 접속하고, 본딩와이어(7)를 통해 고체촬상소자(2)와 접속되는 리드(6)를 기대(3)에 부착하고, 개대(3)상면에 하부개구의 요부(凹部)(40)가 형성된 커버(4)를 부착한 것이며, 리드(6)중 본딩와이어(7)와 접속되는 인너리드(61)의 접속부(61a)이외를 기대(3) 내에 매입하고, 인너리드(61)로부터 아우터리드(62)를 연장배설한다. 또, 프레임부(41)와 개대(3)와를 초음파나 레이저광을 사용하여 용착하는 제조방법이다.

Description

고체촬상장치 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 중공패키지를 사용한 고체촬상장치를 설명하는 단면도,
제2도는 리드프레임을 설명하는 사시도, 제3도는 기대의 형성공정을 설명하는 단면도.

Claims (16)

  1. 상면의 탑재부에 고체촬상소자가 접속된 수지제의 기대(基臺)와, 상기 기대에 부착되고, 상기 고체촬상소자와 본딩와이어로 접속된 리드와, 상기 기대의 상면에 접속되고, 상기 고체촬상소자와 상기 본딩와이어의 주위를 포위하는 하부개구의 요부(凹部)가 형성된 커버로 이루어지는 수지제 중공(中空)패키지를 사용한 고체촬상장치에 있어서, 상기 리드중 상기 본딩와이어와 접속되는 인너리드의 접속부이외가 상기 기대내에 매입되어 있는 동시에, 상기 인너리드로부터 아우터리드가 연장배설되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  2. 제1항에 있어서, 상기 탑재부가 상기 기대의 상면보다 약간 높은 철형(凸形)으로 되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  3. 제1항에 있어서, 상기 탑재부가 상기 기대의 상면보다 낮은 요형(凹形)으로 되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  4. 제1항에 있어서, 상기 탑재부 아래쪽의 기대가 두께가 다른 위치의 개대의 두께보다 얇게 되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  5. 제1항에 있어서, 상기 탑재부에는 금속재의 다이패드가 배설되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  6. 제5항에 있어서, 상기 다이패드 아래쪽이 기대의 두께가 다른 위치의 기대의 두께보다 얇게 되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  7. 제5항에 있어서, 상기 다이패드 아래쪽의 기대에는 상기 다이패드의 배면이 노출되는 방열공(放熱孔)이 형성되 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  8. 제1항에 있어서, 상기 기대의 상면중 상기 커버와의 접합부분이 다른 부분에 비해 낮게 되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  9. 제1항에 있어서, 상기 아우터리드가 상기 기대의 배면측에 피착된 상태로 설치되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  10. 제1항에 있어서, 상기 아우터리드가 상기 기대의 측면으로 부터 외측으로 연출되어 있는 동시에, 상기 아우터리드의 선단부가 상기 기대의 배면측으로 절곡되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  11. 제1항에 있어서, 상기 커버의 외측에 상기 기대의 상면을 기준으로 한 광학렌즈계의 지지대가 설치되어 있는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치.
  12. 수지제의 기대 상면에 고체촬상소자를 탑재하고, 소정 높이의 프레임부가 배설된 수지제의 커버를 상기 기대상에 피착하여, 상기 고체촬상소자의 위쪽을 상기 커버로 덮는 고체촬상장치의 제조방법에 있어서, 열가소성 수지를 사용하여 상기 기대를 형성함에 있어서, 상기 기대내에 리드프레임을 매입하고, 이 리드프레임의 인너리드부만을 상기 기대의 상면에 노출시키는 공정과, 이어서, 상기 기대상에 고체촬상소자를 탑재하고, 이 고체촬상소자와 상기 인너리드부와를 본딩와이어로 배선하는 공정과, 다음에, 열가소성 수지를 사용하여 형성된 상기 커버의 프레임부와, 상기 기대상의 주연부와를 용착하는 공정으로 이루어지는 것을 특징으로 하는 수지제 중공패키지를 사용한 고체촬상장치의 제조방법..
  13. 제12항에 있어서, 초음파를 이용하여 상기 커버의 프레임부와 상기 기대상의 주연부와의 용착을 행하는 것을 특징으로 하는 고체촬상장치의 제조방법.
  14. 제12항에 있어서, 레이저광을 이용하여 상기 커버의 프레임부와 상기 기대상의 주연부와의 용착을 행하는것을 특징으로 하는 고체 촬상장치의 제조방법.
  15. 제12항에 있어서, 자외선조사경화형 접착제를 사용하여 상기 커버의 프레임부와 상기 기대상의 주연부와의 접착을 행하는 것을 특징으로 하는 고체 촬상장치의 제조방법.
  16. 수지제의 기대 상면에 고체촬상소자를 탑재하고, 소정 높이의 프레임부가 배설된 수지제의 커버를 상기 기대상에 피착하여, 상기 고체촬상소자의 위쪽을 상기 커버로 덮는 고체활상소자의 위쪽을 상기 커버로 덮는 고체촬상장치의 제조방법에 있어서, 열경화형 수지를 사용하여 상기 기대를 형서하메 있어서, 상기 기대내에 리드프레임을 매입하고, 이 리드프레임의 인너리드부만을 상기 기대의 상면에 노출시키는 공정과, 이어서 상기 기대상에 고체촬상소자를 탑재하고, 이 고체촬상소자와 상기 인너리드부와를 본딩와이어로 배선하는 공정과, 다음에, 열경화형 수지를 사용하여 형성된 상기 커버의 프레임부와, 상기 기대상의 주연부와를 자외선조사경화형 접착제로 접착하는 공정으로 이루어지는 것을 특징으로 하는 고체촬상장치의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930011357A 1992-06-23 1993-06-22 고체촬상장치 및 그 제조방법 KR940006397A (ko)

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JP04189965A JP3127584B2 (ja) 1992-06-23 1992-06-23 樹脂製中空パッケージを用いた半導体装置
JP92-189965 1992-06-23
JP26081692A JP3270862B2 (ja) 1992-09-02 1992-09-02 固体撮像装置の製造方法
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US5529959A (en) 1996-06-25
US5436492A (en) 1995-07-25
TW332348B (en) 1998-05-21

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