CN101308820B - 半导体集成电路器件的制造方法及探针卡 - Google Patents

半导体集成电路器件的制造方法及探针卡 Download PDF

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Publication number
CN101308820B
CN101308820B CN200810131804XA CN200810131804A CN101308820B CN 101308820 B CN101308820 B CN 101308820B CN 200810131804X A CN200810131804X A CN 200810131804XA CN 200810131804 A CN200810131804 A CN 200810131804A CN 101308820 B CN101308820 B CN 101308820B
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China
Prior art keywords
wiring
sheet
contact terminals
probe
integrated circuit
Prior art date
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Expired - Lifetime
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CN200810131804XA
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English (en)
Chinese (zh)
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CN101308820A (zh
Inventor
冈元正芳
松本秀幸
寄崎真吾
长谷部昭男
本山康博
岛濑朗
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Renesas Electronics Corp
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Renesas Technology Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/30—Opening or contents-removing devices added or incorporated during filling or closing of containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/6802—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles
    • B65D2585/6835—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN200810131804XA 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡 Expired - Lifetime CN101308820B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004115048A JP4521611B2 (ja) 2004-04-09 2004-04-09 半導体集積回路装置の製造方法
JP115048/2004 2004-04-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100635208A Division CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

Publications (2)

Publication Number Publication Date
CN101308820A CN101308820A (zh) 2008-11-19
CN101308820B true CN101308820B (zh) 2010-06-02

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN200810131804XA Expired - Lifetime CN101308820B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CN2008101318035A Expired - Lifetime CN101308819B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CNB2005100635208A Expired - Lifetime CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

Family Applications After (2)

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CN2008101318035A Expired - Lifetime CN101308819B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CNB2005100635208A Expired - Lifetime CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

Country Status (5)

Country Link
US (2) US7271015B2 (enExample)
JP (1) JP4521611B2 (enExample)
KR (1) KR20060046627A (enExample)
CN (3) CN101308820B (enExample)
TW (1) TW200605253A (enExample)

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JP2005136246A (ja) * 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP4755597B2 (ja) 2004-11-18 2011-08-24 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
WO2006097982A1 (ja) 2005-03-11 2006-09-21 Renesas Technology Corp. 半導体集積回路装置の製造方法
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4800007B2 (ja) * 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4936275B2 (ja) * 2006-04-06 2012-05-23 軍生 木本 接触子組立体
JP4974021B2 (ja) * 2006-02-19 2012-07-11 軍生 木本 プローブ組立体
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JP4692423B2 (ja) * 2006-07-10 2011-06-01 Ｊｓｒ株式会社 異方導電性コネクター及び検査装置用変換アダプタ並びに異方導電性コネクターの製造方法
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
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WO2009130793A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
WO2010048971A1 (en) * 2008-10-30 2010-05-06 Verigy (Singapore) Pte., Ltd. Test arrangement, pogo-pin and method for testing a device under test
JP2011149938A (ja) * 2010-01-22 2011-08-04 Kodi-S Co Ltd フィルムタイプのプローブユニット及びその製造方法
CN101846696B (zh) * 2010-03-19 2012-10-03 华映光电股份有限公司 探针及其制作方法
JP5707222B2 (ja) * 2011-05-20 2015-04-22 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US8323992B2 (en) 2010-09-09 2012-12-04 Renesas Electronics Corporation Method of manufacturing semiconductor integrated circuit device
KR101765656B1 (ko) * 2010-12-23 2017-08-08 삼성디스플레이 주식회사 구동 집적회로 및 이를 포함하는 표시장치
JP2013246153A (ja) 2012-05-29 2013-12-09 Micronics Japan Co Ltd プローブカード
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
KR101439343B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
KR101439342B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
TWI503554B (zh) * 2013-06-04 2015-10-11 Mpi Corp 探針卡與其之製作方法
US10451652B2 (en) * 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
EP3304110A4 (en) * 2015-05-29 2019-01-23 R&D Circuits Inc. IMPROVED POWER FROM TRANSIENTER POWER SUPPLY (STREAM INTEGRITY) FOR A PROBE CARD ARRANGEMENT IN A TEST ENVIRONMENT INTEGRATED CIRCUIT
JP6360502B2 (ja) * 2015-07-31 2018-07-18 日本電子材料株式会社 プローブカード
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
CN108663648A (zh) * 2017-03-27 2018-10-16 富泰华工业（深圳）有限公司 调校探针位置的测试板及测试方法
CN111913019A (zh) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 探针卡装置的圆形探针
JP7237474B2 (ja) * 2018-06-18 2023-03-13 京セラ株式会社 セラミック配線基板およびプローブ基板
IT201800006903A1 (it) * 2018-07-04 2020-01-04 Scheda di misura per applicazioni ad alta frequenza
KR102605620B1 (ko) * 2018-09-13 2023-11-23 삼성전자주식회사 프로브 카드 검사용 웨이퍼, 프로브 카드 검사 시스템 및 프로브 카드 검사 방법
US10893605B2 (en) * 2019-05-28 2021-01-12 Seagate Technology Llc Textured test pads for printed circuit board testing
CN110412321B (zh) * 2019-07-17 2021-08-13 上海华力微电子有限公司 触点单元结构及其构成的矩阵探针卡
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
CN116953485B (zh) * 2023-08-08 2024-06-25 苏州法特迪科技股份有限公司 一种高温老化测试插座调节方法

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US6305230B1 (en) * 1997-05-09 2001-10-23 Hitachi, Ltd. Connector and probing system
CN1472885A (zh) * 2002-07-29 2004-02-04 ������������ʽ���� 使内置驱动器小型化的半导体装置
CN1477691A (zh) * 2002-07-23 2004-02-25 ��ʿͨ��ʽ���� 探针板和半导体芯片的测试方法、电容器及其制造方法

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US5180977A (en) * 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
US6305230B1 (en) * 1997-05-09 2001-10-23 Hitachi, Ltd. Connector and probing system
CN1477691A (zh) * 2002-07-23 2004-02-25 ��ʿͨ��ʽ���� 探针板和半导体芯片的测试方法、电容器及其制造方法
CN1472885A (zh) * 2002-07-29 2004-02-04 ������������ʽ���� 使内置驱动器小型化的半导体装置

Also Published As

Publication number Publication date
US20050227383A1 (en) 2005-10-13
JP2005302917A (ja) 2005-10-27
US7517707B2 (en) 2009-04-14
TWI351730B (enExample) 2011-11-01
US20070190671A1 (en) 2007-08-16
KR20060046627A (ko) 2006-05-17
US7271015B2 (en) 2007-09-18
CN100435317C (zh) 2008-11-19
JP4521611B2 (ja) 2010-08-11
CN101308820A (zh) 2008-11-19
CN101308819A (zh) 2008-11-19
CN101308819B (zh) 2010-09-15
TW200605253A (en) 2006-02-01
CN1681106A (zh) 2005-10-12

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