KR20060046627A - 반도체 집적 회로의 제조 방법 및 프로브 카드 - Google Patents

반도체 집적 회로의 제조 방법 및 프로브 카드 Download PDF

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Publication number
KR20060046627A
KR20060046627A KR1020050029316A KR20050029316A KR20060046627A KR 20060046627 A KR20060046627 A KR 20060046627A KR 1020050029316 A KR1020050029316 A KR 1020050029316A KR 20050029316 A KR20050029316 A KR 20050029316A KR 20060046627 A KR20060046627 A KR 20060046627A
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KR
South Korea
Prior art keywords
sheet
wiring
contact terminals
contact
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020050029316A
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English (en)
Korean (ko)
Inventor
마사요시 오까모또
히데유끼 마쯔모또
신고 요리사끼
아끼오 하세베
야스히로 모또야마
아끼라 시마세
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 르네사스 테크놀로지 filed Critical 가부시끼가이샤 르네사스 테크놀로지
Publication of KR20060046627A publication Critical patent/KR20060046627A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/22—Details
    • B65D77/30—Opening or contents-removing devices added or incorporated during filling or closing of containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/6802—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles
    • B65D2585/6835—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020050029316A 2004-04-09 2005-04-08 반도체 집적 회로의 제조 방법 및 프로브 카드 Withdrawn KR20060046627A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004115048A JP4521611B2 (ja) 2004-04-09 2004-04-09 半導体集積回路装置の製造方法
JPJP-P-2004-00115048 2004-04-09

Publications (1)

Publication Number Publication Date
KR20060046627A true KR20060046627A (ko) 2006-05-17

Family

ID=35061059

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050029316A Withdrawn KR20060046627A (ko) 2004-04-09 2005-04-08 반도체 집적 회로의 제조 방법 및 프로브 카드

Country Status (5)

Country Link
US (2) US7271015B2 (enExample)
JP (1) JP4521611B2 (enExample)
KR (1) KR20060046627A (enExample)
CN (3) CN101308820B (enExample)
TW (1) TW200605253A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9075083B2 (en) 2012-05-29 2015-07-07 Kabushiki Kaisha Nihon Micronics Probe card

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JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US7598100B2 (en) 2004-11-18 2009-10-06 Renesas Technology Corp. Manufacturing method of semiconductor integrated circuit device
WO2006097982A1 (ja) 2005-03-11 2006-09-21 Renesas Technology Corp. 半導体集積回路装置の製造方法
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4800007B2 (ja) * 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
JP4974021B2 (ja) * 2006-02-19 2012-07-11 軍生 木本 プローブ組立体
JP4974022B2 (ja) * 2006-02-22 2012-07-11 軍生 木本 格子状配列プローブ組立体
JP4936275B2 (ja) * 2006-04-06 2012-05-23 軍生 木本 接触子組立体
JP4692423B2 (ja) * 2006-07-10 2011-06-01 Ｊｓｒ株式会社 異方導電性コネクター及び検査装置用変換アダプタ並びに異方導電性コネクターの製造方法
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
US20080265428A1 (en) * 2007-04-26 2008-10-30 International Business Machines Corporation Via and solder ball shapes to maximize chip or silicon carrier strength relative to thermal or bending load zero point
US7847568B2 (en) * 2007-08-17 2010-12-07 Advanced Micro Devices, Inc. Multi-site probe
JP5424675B2 (ja) * 2008-03-18 2014-02-26 キヤノン株式会社 半導体装置の製造方法及び半導体装置
WO2009130793A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
WO2010048971A1 (en) * 2008-10-30 2010-05-06 Verigy (Singapore) Pte., Ltd. Test arrangement, pogo-pin and method for testing a device under test
JP2011149938A (ja) * 2010-01-22 2011-08-04 Kodi-S Co Ltd フィルムタイプのプローブユニット及びその製造方法
CN101846696B (zh) * 2010-03-19 2012-10-03 华映光电股份有限公司 探针及其制作方法
US8323992B2 (en) 2010-09-09 2012-12-04 Renesas Electronics Corporation Method of manufacturing semiconductor integrated circuit device
JP5707222B2 (ja) * 2011-05-20 2015-04-22 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101765656B1 (ko) * 2010-12-23 2017-08-08 삼성디스플레이 주식회사 구동 집적회로 및 이를 포함하는 표시장치
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
KR101439343B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
KR101439342B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
TWI503554B (zh) * 2013-06-04 2015-10-11 Mpi Corp 探針卡與其之製作方法
US10451652B2 (en) * 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
EP3304110A4 (en) * 2015-05-29 2019-01-23 R&D Circuits Inc. IMPROVED POWER FROM TRANSIENTER POWER SUPPLY (STREAM INTEGRITY) FOR A PROBE CARD ARRANGEMENT IN A TEST ENVIRONMENT INTEGRATED CIRCUIT
WO2017022035A1 (ja) * 2015-07-31 2017-02-09 日本電子材料株式会社 プローブカード
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
CN108663648A (zh) * 2017-03-27 2018-10-16 富泰华工业（深圳）有限公司 调校探针位置的测试板及测试方法
CN109507457B (zh) * 2017-09-15 2020-10-16 中华精测科技股份有限公司 探针卡装置
JP7237474B2 (ja) * 2018-06-18 2023-03-13 京セラ株式会社 セラミック配線基板およびプローブ基板
IT201800006903A1 (it) * 2018-07-04 2020-01-04 Scheda di misura per applicazioni ad alta frequenza
KR102605620B1 (ko) * 2018-09-13 2023-11-23 삼성전자주식회사 프로브 카드 검사용 웨이퍼, 프로브 카드 검사 시스템 및 프로브 카드 검사 방법
US10893605B2 (en) * 2019-05-28 2021-01-12 Seagate Technology Llc Textured test pads for printed circuit board testing
CN110412321B (zh) * 2019-07-17 2021-08-13 上海华力微电子有限公司 触点单元结构及其构成的矩阵探针卡
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
CN116953485B (zh) * 2023-08-08 2024-06-25 苏州法特迪科技股份有限公司 一种高温老化测试插座调节方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9075083B2 (en) 2012-05-29 2015-07-07 Kabushiki Kaisha Nihon Micronics Probe card

Also Published As

Publication number Publication date
US20050227383A1 (en) 2005-10-13
TW200605253A (en) 2006-02-01
CN101308820B (zh) 2010-06-02
US7271015B2 (en) 2007-09-18
US20070190671A1 (en) 2007-08-16
CN1681106A (zh) 2005-10-12
TWI351730B (enExample) 2011-11-01
CN100435317C (zh) 2008-11-19
CN101308819B (zh) 2010-09-15
JP4521611B2 (ja) 2010-08-11
CN101308819A (zh) 2008-11-19
US7517707B2 (en) 2009-04-14
JP2005302917A (ja) 2005-10-27
CN101308820A (zh) 2008-11-19

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20050408

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid