CN101123853A - 内置有电容器的互连体及其制造方法以及电子元件装置 - Google Patents

内置有电容器的互连体及其制造方法以及电子元件装置 Download PDF

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Publication number
CN101123853A
CN101123853A CNA2007101397441A CN200710139744A CN101123853A CN 101123853 A CN101123853 A CN 101123853A CN A2007101397441 A CNA2007101397441 A CN A2007101397441A CN 200710139744 A CN200710139744 A CN 200710139744A CN 101123853 A CN101123853 A CN 101123853A
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CN
China
Prior art keywords
capacitor
electrode
base resin
resin layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101397441A
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English (en)
Chinese (zh)
Inventor
真篠直宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101123853A publication Critical patent/CN101123853A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/236—Terminals leading through the housing, i.e. lead-through
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CNA2007101397441A 2006-08-07 2007-07-30 内置有电容器的互连体及其制造方法以及电子元件装置 Pending CN101123853A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006214205A JP4920335B2 (ja) 2006-08-07 2006-08-07 キャパシタ内蔵インターポーザ及びその製造方法と電子部品装置
JP2006214205 2006-08-07

Publications (1)

Publication Number Publication Date
CN101123853A true CN101123853A (zh) 2008-02-13

Family

ID=38962662

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101397441A Pending CN101123853A (zh) 2006-08-07 2007-07-30 内置有电容器的互连体及其制造方法以及电子元件装置

Country Status (4)

Country Link
US (1) US7755910B2 (https=)
EP (1) EP1895588A3 (https=)
JP (1) JP4920335B2 (https=)
CN (1) CN101123853A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282441A (zh) * 2013-07-10 2015-01-14 财团法人工业技术研究院 内藏电容模块
CN111968959A (zh) * 2020-08-06 2020-11-20 长江存储科技有限责任公司 半导体器件及其制作方法
CN112820719A (zh) * 2019-11-15 2021-05-18 爱思开海力士有限公司 半导体装置以及半导体装置的制造方法

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JP4783692B2 (ja) * 2006-08-10 2011-09-28 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法と電子部品装置
TWI375999B (en) * 2007-06-07 2012-11-01 Advanced Semiconductor Eng Substrate with bumps process and structure
KR101143837B1 (ko) * 2007-10-15 2012-07-12 삼성테크윈 주식회사 전자 소자를 내장하는 회로기판 및 회로기판의 제조 방법
KR101015704B1 (ko) * 2008-12-01 2011-02-22 삼성전기주식회사 칩 내장 인쇄회로기판 및 그 제조방법
JP4853530B2 (ja) * 2009-02-27 2012-01-11 株式会社豊田中央研究所 可動部を有するマイクロデバイス
US8389870B2 (en) * 2010-03-09 2013-03-05 International Business Machines Corporation Coreless multi-layer circuit substrate with minimized pad capacitance
TWI446497B (zh) * 2010-08-13 2014-07-21 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法
KR20120026855A (ko) 2010-09-10 2012-03-20 삼성전기주식회사 임베디드 볼 그리드 어레이 기판 및 그 제조 방법
US8830689B2 (en) 2010-09-16 2014-09-09 Samsung Electro-Mechanics Co., Ltd. Interposer-embedded printed circuit board
JP2013149948A (ja) * 2011-12-20 2013-08-01 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US9035194B2 (en) * 2012-10-30 2015-05-19 Intel Corporation Circuit board with integrated passive devices
JP5940965B2 (ja) * 2012-11-27 2016-06-29 株式会社日本自動車部品総合研究所 ノイズ低減構造
US20140167900A1 (en) 2012-12-14 2014-06-19 Gregorio R. Murtagian Surface-mount inductor structures for forming one or more inductors with substrate traces
JP2015049985A (ja) * 2013-08-30 2015-03-16 富士通株式会社 Ｉｃソケット及び接続端子
US9553059B2 (en) 2013-12-20 2017-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Backside redistribution layer (RDL) structure
US9853524B2 (en) * 2014-07-29 2017-12-26 Regal Beloit America, Inc. Motor and controller with isolation members between electrical components and associated method
US20170011979A1 (en) * 2015-07-07 2017-01-12 Diodes Incorporated Chip Scale Package
JP6967005B2 (ja) * 2016-08-22 2021-11-17 有限会社アイピーシステムズ キャパシタの製造方法及びキャパシタ内蔵基板の製造方法並びにキャパシタ内蔵基板及び半導体装置実装部品
WO2018125241A1 (en) * 2016-12-30 2018-07-05 Intel Corporation Microelectronic devices designed with capacitive and enhanced inductive bumps
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JP7279538B2 (ja) * 2019-06-19 2023-05-23 富士フイルムビジネスイノベーション株式会社 発光装置
CN114600209B (zh) * 2019-10-24 2024-07-23 株式会社村田制作所 复合电容器
KR20230056455A (ko) 2021-10-20 2023-04-27 삼성전자주식회사 집적 회로 반도체 소자
TWI860794B (zh) * 2023-07-26 2024-11-01 欣興電子股份有限公司 電容元件、包含其的線路載板及其製作方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104282441A (zh) * 2013-07-10 2015-01-14 财团法人工业技术研究院 内藏电容模块
CN112820719A (zh) * 2019-11-15 2021-05-18 爱思开海力士有限公司 半导体装置以及半导体装置的制造方法
CN112820719B (zh) * 2019-11-15 2024-06-07 爱思开海力士有限公司 半导体装置以及半导体装置的制造方法
CN111968959A (zh) * 2020-08-06 2020-11-20 长江存储科技有限责任公司 半导体器件及其制作方法

Also Published As

Publication number Publication date
US20080030968A1 (en) 2008-02-07
EP1895588A2 (en) 2008-03-05
JP2008041930A (ja) 2008-02-21
EP1895588A3 (en) 2008-05-07
JP4920335B2 (ja) 2012-04-18
US7755910B2 (en) 2010-07-13

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Application publication date: 20080213