JP4956128B2 - 電子装置の製造方法 - Google Patents
電子装置の製造方法 Download PDFInfo
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- JP4956128B2 JP4956128B2 JP2006271164A JP2006271164A JP4956128B2 JP 4956128 B2 JP4956128 B2 JP 4956128B2 JP 2006271164 A JP2006271164 A JP 2006271164A JP 2006271164 A JP2006271164 A JP 2006271164A JP 4956128 B2 JP4956128 B2 JP 4956128B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Description
支持基板上に、第1の配線層を形成する第1配線層形成工程と、
前記第1の配線層上に電子部品を配置する工程と、
前記電子部品を配置する前記工程後、前記支持基板を除去する支持基板除去工程と、
前記支持基板除去工程よりも後に、前記第1の配線層の前記支持基板が設けられていた面上に、前記第1の配線層を構成する樹脂よりも熱分解温度が低い樹脂を用いて、第2の配線層を形成する第2配線層形成工程と、を含み、
前記第2配線層形成工程は、前記第1の配線層中に第1の導電プラグを形成する工程を含むことを特徴とする電子装置の製造方法が提供される。
第1の配線層と、
前記第1の配線層の第1面上に実装している電子部品と、
前記第1の配線層の第2面上に設けられ、外部電極端子を有する第2の配線層と、
前記第1の配線層中に設けられた第1の導電プラグと、
前記第2の配線層中に設けられた第2の導電プラグと、
を備え、
前記第1の配線層を構成する樹脂は、前記第2の配線層を構成する樹脂よりも熱分解温度が高く、
前記第1の導電プラグ及び第2の導電プラグのうち少なくとも一部は、一体の導電プラグとして設けられており、その前記第2の配線層側の端面が、その反対側の端面よりも面積が大きい、電子装置が提供される。
(第1実施形態)
(第2実施形態)
(第3実施形態)
2 電子装置
3 電子装置
10 配線層
12 ビアプラグ
12a ビアプラグ
12b ビアプラグ
14 絶縁樹脂
16 導体配線
20 配線層
22a ビアプラグ
22b ビアプラグ
24 絶縁樹脂
26 導体配線
28 ビアプラグ
32 ICチップ
33 バンプ
34 アンダーフィル樹脂
36 ICチップ
37 バンプ
38 アンダーフィル樹脂
42 ICチップ
44 受動部品
52 封止樹脂
54 封止樹脂
56 樹脂
60 半田ボール
62 ソルダーレジスト
68a ビアホール
68b ビアホール
69 ビアホール
72 密着金属膜
73 密着金属膜
74 密着金属膜
75 密着金属膜
76 密着金属膜
80 配線層
82 ビアプラグ
83 ビアプラグ
84 ソルダーレジスト
84a 絶縁樹脂
84b ソルダーレジスト
86 導体配線
90 支持基板
91 支持シート
92 ICチップ
93 バンプ
94 アンダーフィル樹脂
Claims (5)
- 支持基板上に、第1の配線層を形成する第1配線層形成工程と、
前記第1の配線層上に電子部品を配置する工程と、
前記電子部品を配置する前記工程後、前記支持基板を除去する支持基板除去工程と、
前記支持基板除去工程よりも後に、前記第1の配線層の前記支持基板が設けられていた面上に、前記第1の配線層を構成する樹脂よりも熱分解温度が低い樹脂を用いて、第2の配線層を形成する第2配線層形成工程と、を含み、
前記第2配線層形成工程は、前記第1の配線層中に第1の導電プラグを形成する工程を含むことを特徴とする電子装置の製造方法。 - 請求項1に記載の電子装置の製造方法において、
前記電子部品載置工程と前記支持基板除去工程との間に、前記電子部品を覆うように前記第1の配線層上に封止樹脂を形成する封止樹脂形成工程を含む、電子装置の製造方法。 - 請求項1または2に記載の電子装置の製造方法において、
前記第2配線層形成工程は、前記第2の配線層中に設けられる第2の導電プラグを形成する工程を含み、
前記第1および第2の導電プラグは、一体の導電プラグとして同時に形成される、電子装置の製造方法。 - 請求項1または2に記載の電子装置の製造方法において、
前記第2配線層形成工程は、前記第2の配線層中に設けられる配線を形成する工程を含み、
前記第1の導電プラグおよび前記配線は、一体の導電部材として同時に形成される、電子装置の製造方法。 - 請求項1乃至4いずれか1項に記載の電子装置の製造方法において、
前記支持基板はシリコン基板である、電子装置の製造方法。
Priority Applications (4)
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JP2006271164A JP4956128B2 (ja) | 2006-10-02 | 2006-10-02 | 電子装置の製造方法 |
US11/856,730 US8685796B2 (en) | 2006-10-02 | 2007-09-18 | Electronic device and method of manufacturing the same |
CNB2007101499712A CN100555590C (zh) | 2006-10-02 | 2007-10-08 | 电子器件制造方法 |
CN2009101518110A CN101604682B (zh) | 2006-10-02 | 2007-10-08 | 电子器件及其制造方法 |
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JP2006271164A JP4956128B2 (ja) | 2006-10-02 | 2006-10-02 | 電子装置の製造方法 |
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Cited By (5)
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US9607919B2 (en) | 2014-03-04 | 2017-03-28 | Amkor Technology, Inc. | Semiconductor device with thin redistribution layers |
US9818708B2 (en) | 2014-03-04 | 2017-11-14 | Amkor Technology, Inc. | Semiconductor device with thin redistribution layers |
US10269744B2 (en) | 2014-03-04 | 2019-04-23 | Amkor Technology, Inc. | Semiconductor device with thin redistribution layers |
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US11270965B2 (en) | 2014-03-04 | 2022-03-08 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor device with thin redistribution layers |
Also Published As
Publication number | Publication date |
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CN101159239A (zh) | 2008-04-09 |
CN101604682A (zh) | 2009-12-16 |
US20080079157A1 (en) | 2008-04-03 |
CN101604682B (zh) | 2011-10-26 |
JP2008091640A (ja) | 2008-04-17 |
CN100555590C (zh) | 2009-10-28 |
US8685796B2 (en) | 2014-04-01 |
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