CN100477141C - 半导体封装器件及其制造和测试方法 - Google Patents

半导体封装器件及其制造和测试方法 Download PDF

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Publication number
CN100477141C
CN100477141C CNB028245296A CN02824529A CN100477141C CN 100477141 C CN100477141 C CN 100477141C CN B028245296 A CNB028245296 A CN B028245296A CN 02824529 A CN02824529 A CN 02824529A CN 100477141 C CN100477141 C CN 100477141C
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integrated circuit
pad
chip
substrate
packaged device
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Expired - Fee Related
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CNB028245296A
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Chinese (zh)
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CN1602548A (zh
Inventor
马克·A.·吉伯
肖恩·M.·奥＇康纳
特兰特·A.·汤普森
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NXP USA Inc
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Freescale Semiconductor Inc
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB028245296A 2001-11-08 2002-10-16 半导体封装器件及其制造和测试方法 Expired - Fee Related CN100477141C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/008,800 US6916682B2 (en) 2001-11-08 2001-11-08 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing
US10/008,800 2001-11-08

Publications (2)

Publication Number Publication Date
CN1602548A CN1602548A (zh) 2005-03-30
CN100477141C true CN100477141C (zh) 2009-04-08

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CNB028245296A Expired - Fee Related CN100477141C (zh) 2001-11-08 2002-10-16 半导体封装器件及其制造和测试方法

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US (1) US6916682B2 (enExample)
EP (1) EP1481421A2 (enExample)
JP (1) JP2005535103A (enExample)
KR (1) KR100926002B1 (enExample)
CN (1) CN100477141C (enExample)
AU (1) AU2002337875A1 (enExample)
TW (1) TWI260076B (enExample)
WO (1) WO2003041158A2 (enExample)

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SG108245A1 (en) 2001-03-30 2005-01-28 Micron Technology Inc Ball grid array interposer, packages and methods
JP2003243604A (ja) * 2002-02-13 2003-08-29 Sony Corp 電子部品及び電子部品の製造方法
US7573136B2 (en) * 2002-06-27 2009-08-11 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor device components
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