CN100404579C - 单液型光热并用固化性树脂组合物及其用途 - Google Patents

单液型光热并用固化性树脂组合物及其用途 Download PDF

Info

Publication number
CN100404579C
CN100404579C CNB2004800348512A CN200480034851A CN100404579C CN 100404579 C CN100404579 C CN 100404579C CN B2004800348512 A CNB2004800348512 A CN B2004800348512A CN 200480034851 A CN200480034851 A CN 200480034851A CN 100404579 C CN100404579 C CN 100404579C
Authority
CN
China
Prior art keywords
liquid crystal
composition
weight
epoxy resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004800348512A
Other languages
English (en)
Chinese (zh)
Other versions
CN1886437A (zh
Inventor
竹内文人
宫胁孝久
池口太藏
伊藤健司
八城贤一
佐佐木伸夫
永田桂
伊藤壮太
中原真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemical Industry Co Ltd
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemical Industry Co Ltd, Sharp Corp filed Critical Mitsui Chemical Industry Co Ltd
Publication of CN1886437A publication Critical patent/CN1886437A/zh
Application granted granted Critical
Publication of CN100404579C publication Critical patent/CN100404579C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CNB2004800348512A 2003-11-26 2004-11-25 单液型光热并用固化性树脂组合物及其用途 Expired - Lifetime CN100404579C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003395683 2003-11-26
JP395683/2003 2003-11-26

Publications (2)

Publication Number Publication Date
CN1886437A CN1886437A (zh) 2006-12-27
CN100404579C true CN100404579C (zh) 2008-07-23

Family

ID=34631496

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800348512A Expired - Lifetime CN100404579C (zh) 2003-11-26 2004-11-25 单液型光热并用固化性树脂组合物及其用途

Country Status (6)

Country Link
US (2) US20070096056A1 (enExample)
JP (1) JP4652235B2 (enExample)
KR (1) KR100736240B1 (enExample)
CN (1) CN100404579C (enExample)
TW (1) TW200528515A (enExample)
WO (1) WO2005052021A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607989B (zh) * 2013-07-05 2017-12-11 味之素股份有限公司 Compounds containing thiol groups and single-liquid epoxy resin compositions

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4668538B2 (ja) * 2004-02-20 2011-04-13 積水化学工業株式会社 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
JP4944396B2 (ja) * 2005-06-21 2012-05-30 積水化学工業株式会社 液晶滴下工法用硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
JP2007178473A (ja) * 2005-12-27 2007-07-12 Mitsui Chemicals Inc 液晶滴下工法用シール剤およびそれを用いた液晶表示パネルの製造方法
JP2007225773A (ja) * 2006-02-22 2007-09-06 Mitsui Chemicals Inc 液晶滴下工法用液晶シール剤、それを用いた液晶表示パネルの製造方法及び液晶表示パネル
WO2007138870A1 (ja) * 2006-05-26 2007-12-06 Nippon Kayaku Kabushiki Kaisha 液晶シール剤およびそれを用いた液晶表示セル
JP5345393B2 (ja) * 2006-08-04 2013-11-20 三井化学株式会社 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
EP2079784A4 (en) * 2006-10-09 2010-11-10 Henkel Ag & Co Kgaa SEALING ARTICLES AND COMPOSITIONS USEFUL THEREIN
KR100727871B1 (ko) * 2006-11-17 2007-06-14 김재형 광경화형 수지 조성물 및 이를 이용한 도막의 형성 방법
KR20080047990A (ko) * 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
WO2008102550A1 (ja) * 2007-02-20 2008-08-28 Mitsui Chemicals, Inc. 液晶シール用硬化性樹脂組成物および、これを使用した液晶表示パネルの製造方法
KR101402018B1 (ko) 2007-06-25 2014-06-02 니폰 가야꾸 가부시끼가이샤 액정 실링제 및 그것을 이용한 액정 표시 셀
JP5121374B2 (ja) * 2007-09-28 2013-01-16 三井化学株式会社 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
JP2009126974A (ja) * 2007-11-26 2009-06-11 Three Bond Co Ltd 樹脂組成物
JP5221963B2 (ja) * 2008-01-21 2013-06-26 三井化学株式会社 液晶シール用硬化性樹脂組成物、およびこれを使用する液晶表示パネルの製造方法
TWI439482B (zh) * 2008-01-25 2014-06-01 Mitsui Chemicals Inc 環氧聚合性組成物以及含該組成物的密封材組成物
JP4528358B2 (ja) * 2008-11-21 2010-08-18 積水化学工業株式会社 液晶滴下工法用シール剤及び液晶表示素子
JP5008682B2 (ja) * 2009-01-21 2012-08-22 株式会社Ａｄｅｋａ 光硬化性樹脂と熱硬化性樹脂を含有する液晶滴下工法用シール剤
JP5337526B2 (ja) * 2009-02-24 2013-11-06 国立大学法人 東京大学 金属と樹脂との接着方法、及びそれを用いた回路形成部品の製法、並びに回路形成部品
JP5306860B2 (ja) * 2009-03-04 2013-10-02 株式会社ジャパンディスプレイウェスト 液晶表示装置およびその製造方法
US9567426B2 (en) * 2009-05-29 2017-02-14 Cytec Technology Corp. Engineered crosslinked thermoplastic particles for interlaminar toughening
KR101755597B1 (ko) * 2009-05-29 2017-07-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 표시 장치의 제작 방법
JP5393292B2 (ja) * 2009-06-26 2014-01-22 日本化薬株式会社 液晶滴下工法用液晶シール剤及びそれを用いた液晶表示セル
EP2455801A1 (en) * 2009-07-13 2012-05-23 Adeka Corporation Sealing agent for liquid crystal dripping method
JP5438473B2 (ja) * 2009-11-11 2014-03-12 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP5374324B2 (ja) * 2009-11-12 2013-12-25 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP5526732B2 (ja) 2009-11-25 2014-06-18 株式会社オートネットワーク技術研究所 ワイヤーハーネスの製造方法、及びワイヤーハーネス
KR101552739B1 (ko) * 2010-02-10 2015-09-14 (주)엘지하우시스 하드코팅 형성용 시트
KR101552740B1 (ko) * 2010-02-10 2015-09-14 (주)엘지하우시스 하드코팅 형성 방법
JP5993845B2 (ja) * 2010-06-08 2016-09-14 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
TWI488931B (zh) * 2010-06-08 2015-06-21 漢高智慧財產控股公司 含反應性硫化合物之晶圓背面塗料
KR101777900B1 (ko) * 2011-04-08 2017-09-12 세키스이가가쿠 고교가부시키가이샤 액정 적하 공법용 시일제, 상하 도통 재료, 및 액정 표시 소자
JP5772230B2 (ja) * 2011-05-30 2015-09-02 日油株式会社 硬化性樹脂組成物
JP5772229B2 (ja) * 2011-05-30 2015-09-02 日油株式会社 硬化性樹脂組成物
JP5790155B2 (ja) * 2011-05-30 2015-10-07 日油株式会社 硬化性樹脂組成物
JP5828225B2 (ja) * 2011-05-31 2015-12-02 日油株式会社 硬化性樹脂組成物
JP4976575B1 (ja) * 2011-07-07 2012-07-18 ナミックス株式会社 樹脂組成物
JP5996176B2 (ja) * 2011-10-12 2016-09-21 株式会社Adeka 耐熱性接着剤
CN102654689B (zh) * 2011-12-14 2015-03-11 北京京东方光电科技有限公司 封框胶、封框胶的光固化方法和液晶显示器件
US9632221B2 (en) * 2012-04-17 2017-04-25 Boe Technology Group Co., Ltd. Optical resin composition and use thereof
JP5842736B2 (ja) * 2012-06-06 2016-01-13 デクセリアルズ株式会社 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法
TWI464198B (zh) * 2012-06-07 2014-12-11 Nat Univ Chin Yi Technology 綠色環保奈米高分子複合基材配方及其製法
KR101588496B1 (ko) * 2012-06-29 2016-01-25 제일모직주식회사 편광판용 접착제 조성물, 이를 포함하는 편광판, 그 제조 방법 및 이를 포함하는 광학 부재
CN103525315B (zh) 2012-06-29 2016-06-22 第一毛织株式会社 用于偏振板的粘合剂组合物、使用其的偏振板和光学元件
CN102876275B (zh) * 2012-09-20 2013-10-02 吴江市天源塑胶有限公司 一种用于陶瓷与金属连接的胶粘剂
KR20140076778A (ko) * 2012-12-13 2014-06-23 엘지이노텍 주식회사 엘라스토머 조성물 및 그 조성물로 코팅된 페라이트 자성체
JP2015004056A (ja) * 2013-05-22 2015-01-08 積水化学工業株式会社 電子部品用硬化性組成物及び接続構造体
CN103305133B (zh) * 2013-06-18 2015-02-18 北京京东方光电科技有限公司 一种封框胶及其制备方法、液晶显示面板和液晶显示器
WO2015098875A1 (ja) 2013-12-24 2015-07-02 株式会社ブリヂストン 接着シート、その製造方法及び積層体
EP3088436B1 (en) * 2013-12-24 2019-04-24 Bridgestone Corporation Laminate body
WO2015111136A1 (ja) * 2014-01-21 2015-07-30 Dic株式会社 液晶表示装置
CN106662781B (zh) * 2014-07-24 2020-05-15 三井化学株式会社 液晶密封剂及液晶显示面板的制造方法
MX379665B (es) * 2015-01-16 2025-03-11 Halliburton Energy Services Inc Agentes de curado a base de hidrazida para uso en operaciones subterráneas.
CN104559813B (zh) * 2015-01-30 2016-05-25 中国工程物理研究院化工材料研究所 一种适用于超低温环境的双重固化胶粘剂及其制备方法
KR102451905B1 (ko) 2015-03-12 2022-10-06 나믹스 가부시끼가이샤 수지 조성물, 접착제 및 봉지제
JP6451500B2 (ja) * 2015-05-22 2019-01-16 Jnc株式会社 熱硬化性樹脂組成物およびその硬化膜
CN108291011B (zh) 2015-09-09 2021-03-02 卡本有限公司 用于增材制造的环氧双重固化树脂
EP3365318B1 (de) 2015-10-23 2021-01-06 Merck Patent GmbH Benzilmonoketale und deren verwendung
US20200292888A1 (en) * 2016-03-24 2020-09-17 Sharp Kabushiki Kaisha Liquid crystal cell and liquid crystal display
JP2018022052A (ja) * 2016-08-04 2018-02-08 日本化薬株式会社 液晶シール剤及びそれを用いた液晶表示セル
JP7070552B2 (ja) * 2017-03-29 2022-05-18 味の素株式会社 硬化性組成物および構造物
JP6601634B2 (ja) * 2017-03-31 2019-11-06 協立化学産業株式会社 変性樹脂及びそれを含む硬化性樹脂組成物
CN111093842B (zh) * 2017-09-15 2023-03-10 3M创新有限公司 包含具有可固化环氧/硫醇树脂组合物的(甲基)丙烯酸酯基质的粘合剂膜、带以及方法
EP3476882A1 (de) 2017-10-24 2019-05-01 Sika Technology Ag Hitzehärtende epoxidharzzusammensetzung mit hoher lagerstabilität
DE102017129780A1 (de) 2017-12-13 2019-06-13 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Lichtfixierbare und warmhärtende Massen auf Basis von Epoxidharzen und Thiolen
CN111527130B (zh) * 2018-01-30 2023-03-28 纳美仕有限公司 树脂组合物及其固化物、粘接剂、半导体装置、以及电子零部件
KR102102692B1 (ko) * 2018-04-25 2020-04-22 이아이씨티코리아 주식회사 자외선과 열 경화가 가능한 에폭시관능 아크릴레이트 수지 화합물, 이의 제조방법 및 경화성 수지 조성물
CN109705786A (zh) * 2018-12-26 2019-05-03 上海熙邦新材料有限公司 光通信器件用粘结剂
KR102155180B1 (ko) * 2019-04-10 2020-09-11 주식회사 케이씨씨 이중 경화 접착제 조성물
CN112745770B (zh) * 2019-10-31 2024-08-02 味之素株式会社 固化性组合物
JP7552221B2 (ja) * 2019-10-31 2024-09-18 味の素株式会社 硬化性組成物
DE102019133694A1 (de) 2019-12-10 2021-06-10 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Lichtfixierbare und feuchtigkeitshärtende Massen auf Basis von Epoxidharzen und Thiolen
CN111650794A (zh) * 2020-07-02 2020-09-11 大连龙宁科技有限公司 一种小形变胆甾相液晶显示装置及其制造方法
JP7437695B2 (ja) * 2020-07-30 2024-02-26 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、硬化物、機器、及び機器の製造方法
CN114525139B (zh) 2020-10-07 2025-07-25 默克专利股份有限公司 液晶介质
WO2022179867A1 (en) * 2021-02-25 2022-09-01 Basf Se Curable composition comprising light polymerizable liquid and epoxy precursor for coating, 2d object formation and 3d printing
WO2023276773A1 (ja) 2021-06-28 2023-01-05 ナミックス株式会社 樹脂組成物及び接着剤
TW202313911A (zh) 2021-08-10 2023-04-01 日商納美仕有限公司 樹脂組成物及接著劑
JP7655191B2 (ja) * 2021-10-29 2025-04-02 味の素株式会社 硬化性組成物
EP4488316A4 (en) 2022-03-01 2026-03-11 Namics Corp RESIN COMPOSITION, ADHESIVE, SEALANT MATERIAL, CURIFIED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENTS
EP4502010A4 (en) 2022-03-24 2025-06-25 Namics Corporation RESIN COMPOSITION, ADHESIVE, ENCAPSULATING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
JPWO2023181846A1 (enExample) 2022-03-24 2023-09-28
CN118984848A (zh) 2022-03-24 2024-11-19 纳美仕有限公司 树脂组合物、粘接剂、密封材料、固化物、半导体装置及电子部件
TW202519566A (zh) 2023-07-21 2025-05-16 日商納美仕有限公司 光硬化性樹脂組成物、接著劑、密封材、塗佈劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物之硬化、接著、密封及塗佈之方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295087A (ja) * 1992-04-17 1993-11-09 Kyoritsu Kagaku Sangyo Kk 液晶表示装置の枠シール剤組成物
JPH06148656A (ja) * 1992-11-06 1994-05-27 Sekisui Finechem Co Ltd 液晶注入口封止剤及び液晶表示セル
JP2000154251A (ja) * 1998-09-16 2000-06-06 Sekisui Chem Co Ltd 光硬化性樹脂組成物、液晶注入口封止剤及び液晶表示セル

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383090A (en) * 1981-09-28 1983-05-10 Diamond Shamrock Corporation Polyepoxide curing by polymercaptans and a reaction product of amino acids or lactams with amines
ATE45368T1 (de) * 1984-04-28 1989-08-15 Ciba Geigy Ag Haertbare zusammensetzungen.
JP2792298B2 (ja) * 1991-12-06 1998-09-03 東洋インキ製造株式会社 フォトソルダーレジスト組成物
DE69318369T2 (de) * 1992-10-22 1999-01-28 Ajinomoto Co., Inc., Tokio/Tokyo Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit
JP3367531B2 (ja) * 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
KR0163981B1 (ko) * 1993-06-29 1999-01-15 사또오 아키오 필름제 액정셀 봉지용 수지조성물
US5898041A (en) * 1995-03-01 1999-04-27 Matsushita Electric Industrial Co., Ltd. Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display
JP3084352B2 (ja) * 1995-08-28 2000-09-04 太陽インキ製造株式会社 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法
JP3583326B2 (ja) * 1999-11-01 2004-11-04 協立化学産業株式会社 Ｌｃｄパネルの滴下工法用シール剤
EP1293536A4 (en) * 2000-06-21 2005-03-23 Mitsui Chemicals Inc SEALING MATERIAL FOR PLASTIC FLUID CRYSTAL DISPLAY DEVICES
US7253131B2 (en) * 2001-05-16 2007-08-07 Sekisui Chemical Co., Ltd. Curing resin composition and sealants and end-sealing materials for displays
JP3909072B2 (ja) * 2002-09-19 2007-04-25 三井化学株式会社 液晶シール剤組成物及びそれを用いた液晶表示パネルの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295087A (ja) * 1992-04-17 1993-11-09 Kyoritsu Kagaku Sangyo Kk 液晶表示装置の枠シール剤組成物
JPH06148656A (ja) * 1992-11-06 1994-05-27 Sekisui Finechem Co Ltd 液晶注入口封止剤及び液晶表示セル
JP2000154251A (ja) * 1998-09-16 2000-06-06 Sekisui Chem Co Ltd 光硬化性樹脂組成物、液晶注入口封止剤及び液晶表示セル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607989B (zh) * 2013-07-05 2017-12-11 味之素股份有限公司 Compounds containing thiol groups and single-liquid epoxy resin compositions

Also Published As

Publication number Publication date
TW200528515A (en) 2005-09-01
JPWO2005052021A1 (ja) 2007-12-06
KR100736240B1 (ko) 2007-07-06
TWI337615B (enExample) 2011-02-21
JP4652235B2 (ja) 2011-03-16
KR20060103537A (ko) 2006-10-02
US20100022745A1 (en) 2010-01-28
US20070096056A1 (en) 2007-05-03
WO2005052021A1 (ja) 2005-06-09
CN1886437A (zh) 2006-12-27

Similar Documents

Publication Publication Date Title
CN100404579C (zh) 单液型光热并用固化性树脂组合物及其用途
CN100449379C (zh) 液晶密封剂组合物及使用它的液晶显示板的制造方法
JP5060544B2 (ja) 液晶シール用硬化性樹脂組成物および、これを使用した液晶表示パネルの製造方法
CN102472928B (zh) 液晶滴下工艺用液晶密封剂以及使用了该密封剂的液晶显示单元
JP4007961B2 (ja) 液晶表示セルの製造方法および液晶表示セル用シール剤
TWI453271B (zh) 液晶密封劑、使用該密封劑的液晶顯示面板與其製造方法、以及液晶顯示裝置
CN103477274B (zh) 液晶密封剂、使用其的液晶显示面板的制造方法及液晶显示面板
JP4531566B2 (ja) 液晶シール剤組成物及びそれを用いた液晶表示パネルの製造方法
CN104932155B (zh) 液晶滴下工艺用密封剂、上下导通材料、及液晶显示元件
JP2011219682A (ja) 硬化性樹脂組成物
KR101342155B1 (ko) 액정 실링제 및 이를 이용한 액정 표시 셀
CN101044184B (zh) 可辐射固化的树脂、液晶密封材料和使用该材料的液晶显示单元
CN101369098A (zh) 固化性树脂组合物、液晶显示元件用密封剂和液晶显示元件
KR100680067B1 (ko) 액정 시일제 조성물 및 이것을 사용한 액정 표시 패널의 제조 방법
CN113168057A (zh) 显示元件用密封剂、上下导通材料及显示元件
CN120936646A (zh) 树脂组合物、液晶密封剂以及使用其的液晶显示面板
JP2007225772A (ja) 液晶シール剤及びそれを用いた液晶表示パネル
HK1157451B (en) Liquid crystal sealing agent, liquid crystal display panel using same, method for producing the liquid crystal display panel, and liquid crystal display device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Free format text: FORMER OWNER: SHARP CORPORATION

Effective date: 20140226

TR01 Transfer of patent right

Effective date of registration: 20140226

Address after: Tokyo, Japan

Patentee after: MITSUI CHEMICALS, Inc.

Address before: Tokyo, Japan

Patentee before: MITSUI CHEMICALS, Inc.

Patentee before: Sharp Corp.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20080723

CX01 Expiry of patent term