TWI488931B - 含反應性硫化合物之晶圓背面塗料 - Google Patents
含反應性硫化合物之晶圓背面塗料 Download PDFInfo
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- TWI488931B TWI488931B TW100118178A TW100118178A TWI488931B TW I488931 B TWI488931 B TW I488931B TW 100118178 A TW100118178 A TW 100118178A TW 100118178 A TW100118178 A TW 100118178A TW I488931 B TWI488931 B TW I488931B
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- Prior art keywords
- epoxy resin
- acrylate
- adhesive composition
- resin
- integer
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- 238000000576 coating method Methods 0.000 title description 10
- 239000011248 coating agent Substances 0.000 title description 8
- 239000000203 mixture Substances 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 239000008199 coating composition Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
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- 239000001301 oxygen Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 5
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- 238000002844 melting Methods 0.000 claims description 4
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
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- 229930003836 cresol Natural products 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 25
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- 239000000463 material Substances 0.000 description 9
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- 239000000945 filler Substances 0.000 description 4
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- 239000012965 benzophenone Substances 0.000 description 3
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
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- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 150000001412 amines Chemical class 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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- YPWYKIZLWMBFKH-UHFFFAOYSA-N diamino(diphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](N)(N)C1=CC=CC=C1 YPWYKIZLWMBFKH-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 125000005022 dithioester group Chemical group 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- MKVYSRNJLWTVIK-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O.CC(=C)C(O)=O MKVYSRNJLWTVIK-UHFFFAOYSA-N 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
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- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZKEYULQFFYBZBG-UHFFFAOYSA-N lanthanum carbide Chemical compound [La].[C-]#[C] ZKEYULQFFYBZBG-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
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- DIDDVZFHORVZMG-UHFFFAOYSA-N methyl 2-methylprop-2-eneperoxoate Chemical compound COOC(=O)C(C)=C DIDDVZFHORVZMG-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- 238000001000 micrograph Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- ZWWQICJTBOCQLA-UHFFFAOYSA-N o-propan-2-yl (propan-2-yloxycarbothioyldisulfanyl)methanethioate Chemical compound CC(C)OC(=S)SSC(=S)OC(C)C ZWWQICJTBOCQLA-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001692 polycarbonate urethane Polymers 0.000 description 1
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- 229920002098 polyfluorene Polymers 0.000 description 1
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- 238000007639 printing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- KJRCEJOSASVSRA-UHFFFAOYSA-N propane-2-thiol Chemical class CC(C)S KJRCEJOSASVSRA-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
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- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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- 238000013517 stratification Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
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Description
本發明係關於用於半導體晶圓之非活性側(背面)之塗料,其中該塗料含有反應性硫化合物。
半導體封裝方面之新近進步已造成經由使用呈堆疊配置之較薄晶粒(兩個或兩個以上半導體晶粒安裝在彼此頂部)使封裝小型化。此晶粒堆疊使得能夠以小的佔據面積使功能性增加,從而使整個半導體封裝小型化。通常,在兩個半導體晶粒之間使用黏著劑或黏著膜以確保製造操作(諸如,導線結合、模製及回焊)期間及終端使用期間的封裝完整性。然而,晶粒稀薄會使其在製造程序之回焊步驟中易受翹曲及分層。翹曲及分層可用可經受回流製程且維持其完整性及功能性之糊狀或液體晶圓背面塗料加以控制。
本發明為用於半導體晶圓之非活性側(背面)之塗料組合物,其中該塗料包含(i)環氧樹脂及視情況該環氧樹脂之固化劑,(ii)含有烯系不飽和性之樹脂及該樹脂之光引發劑,(iii)反應性硫化合物,及(iv)視情況,非導電性填料。在一實施例中,反應性硫化合物為聚合硫醇-側位聚矽氧。在另一實施例中,本發明為用如上文所述之固化塗料組合物塗覆之半導體晶圓。
如本文所用,術語「B階段化」(及其變化形式)用以指代藉由加熱或照射加工材料,以使若該材料溶解或分散於溶劑中,則該溶劑伴隨或不伴隨該材料之部分固化而蒸發去除,或若該材料為無溶劑之純材料,則該材料部分固化成發黏或更堅硬狀態。若材料為可流動黏著劑,則B階段化將提供極低流動性而不會完全固化,以便在使用該黏著劑將1個物品與另一物品接合之後可執行額外固化。流動性降低可藉由蒸發溶劑、部分改進或固化樹脂或聚合物,或兩者來實現。
如本文所用,術語「固化劑」用以指代引發、擴展或加速組合物固化之任何材料或材料組合,且包括(但不限於)加速劑、催化劑、引發劑及硬化劑。
半導體晶圓可為如為特定工業用途所需之任何類型、尺寸或厚度。
適用於塗料組合物中之環氧樹脂為固體,且包括選自由以下各物組成之群之彼等環氧樹脂:甲酚酚醛環氧樹脂、苯酚酚醛環氧樹脂、雙酚-A環氧樹脂、及含有由酚系及稠合環系統(諸如,二環戊二烯基)組成之主鏈的縮水甘油基化樹脂。在一實施例中,環氧樹脂為熔點介於80℃與130℃之間的固體。在另一實施例中,環氧樹脂係以塗料之15重量%至40重量%之量存在。
合適之丙烯酸酯樹脂包括選自由以下各物組成之群之丙烯酸酯樹脂:(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷酯、(甲基)丙烯酸烷酯、(甲基)丙烯酸十三烷酯、(甲基)丙烯酸正十八烷酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸異冰片酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、(甲基)丙烯酸全氟辛基乙酯、1,10-癸二醇二(甲基)丙烯酸酯、聚丙氧基化壬基苯酚(甲基)丙烯酸酯。
其他丙烯酸酯樹脂包括聚戊氧基化丙烯酸四氫糠酯,可自Kyoeisha Chemical Co.,LTD購得;聚丁二烯二甲基丙烯酸胺基甲酸酯(CN302、NTX6513)及聚丁二烯二甲基丙烯酸酯(CN301、NTX6039、PRO6270),可自Sartomer Company,Inc購得;聚碳酸二丙烯酸胺基甲酸酯(ArtResin UN9200A),可自Negami Chemical Industries Co.,LTD購得;丙烯酸酯化脂族胺基甲酸酯寡聚物(Ebecryl 230、264、265、270、284、4830、4833、4834、4835、4866、4881、4883、8402、8800-20R、8803、8804),可自Radcure Specialities,Inc購得;聚酯丙烯酸酯寡聚物(Ebecryl 657、770、810、830、1657、1810、1830),可自Radcure Specialities,Inc.購得;及環氧丙烯酸酯樹脂(CN104、111、112、115、116、117、118、119、120、124、136),可自Sartomer Company,Inc購得。
其他丙烯酸酯樹脂包括單環縮醛丙烯酸酯、含有環狀縮醛之(甲基)丙烯酸酯(諸如,可自Sartomer購得之SR531);THF丙烯酸酯(諸如,可自Sartomer購得之SR285);經取代之(甲基)丙烯酸環己酯(諸如,可自Sartomer購得之CD420);甲基丙烯酸乙醯乙醯氧基乙酯、丙烯酸2-乙醯乙醯氧基乙酯、甲基丙烯酸2-乙醯乙醯氧基丙酯、丙烯酸2-乙醯乙醯氧基丙酯、甲基丙烯酸2-乙醯乙醯胺基乙酯及丙烯酸2-乙醯乙醯胺基乙酯;甲基丙烯酸2-氰基乙醯氧基乙酯、丙烯酸2-氰基乙醯氧基乙酯、N-(2-氰基乙醯氧基乙基)丙烯醯胺;丙烯酸2-丙醯基乙醯氧基乙酯、N-(2-丙醯基乙醯氧基乙基)甲基丙烯醯胺、N-4-(乙醯乙醯氧基苯甲基苯基)丙烯醯胺、乙酸乙基丙烯醯酯、乙酸丙烯醯基甲酯、N-乙基丙烯醯基氧基甲基乙醯乙醯胺、乙醯乙酸乙基甲基丙烯醯酯、N-烯丙基氰基乙醯胺、乙醯乙酸甲基丙烯醯酯、N-(2-甲基丙烯醯基氧基甲基)氰基乙醯胺、乙基-a-乙醯乙醯氧基甲基丙烯酸酯、N-丁基-N-丙烯醯基氧基乙基乙醯乙醯胺、單丙烯酸酯化多元醇、鄰苯二甲酸單甲基丙烯醯基氧基乙酯及其混合物。
在一實施例中,選擇黏度低(<50 mPas)且沸點大於150℃之丙烯酸酯。在一特定實施例中,低黏度高沸點之丙烯酸酯含有在環中含有至少1個氧之5或6員環。
在一實施例中,丙烯酸酯樹脂佔塗料組合物之15重量%至50重量%。
環氧樹脂之合適的固化劑係以介於大於0重量%與50重量%之間的量存在,且包括(但不限於)酚醛樹脂、芳族二胺、雙氰胺、過氧化物、胺、咪唑、三級胺及聚醯胺。合適之酚醛樹脂可自Schenectady International,Inc購得。合適之芳族二胺為一級二胺,且包括二胺基二苯基碸及二胺基二苯基甲烷,可自Sigma-Aldrich Co購得。合適之雙氰胺可自SKW Chemicals,Inc購得。合適之聚醯胺可自Air Products and Chemicals,Inc購得。合適之咪唑可自Air Products and Chemicals,Inc購得。合適之三級胺可自Sigma-Aldrich Co購得。
具有烯系不飽和性之樹脂之合適的固化劑係以介於0.1重量%至10重量%之間的量存在,且包括(但不限於)已知之基於苯乙酮、基於9-氧硫、基於安息香(benzoin)及基於過氧化物之光引發劑中的任一者。實例包括二乙氧基苯乙酮、4-苯氧基二氯苯乙酮、安息香、安息香乙醚、安息香異丙醚、苯甲基二甲基縮酮、二苯甲酮、4-苯基二苯甲酮、丙烯酸酯化二苯甲酮、9-氧硫、2-乙基蒽醌等。由BASF銷售之Irgacur及Darocur系列之光引發劑為適用光引發劑之實例。
反應性硫化合物包括硫醇及二硫酯。在一實施例中,反應性硫化合物係選自由以下各物組成之群:十二硫醇、第三-十二硫醇、巰基乙醇、辛硫醇、己硫醇、異丙基二硫化黃原醯(isopropyl xanthic disulfide)及硫醇-側位聚矽氧聚合物。反應性硫化合物將以0.1重量%至7重量%之量存在於塗料組合物中。
在一實施例中,反應性硫化合物為聚合硫醇-側位矽氧烷。硫醇-側位矽氧烷聚合物之一實例具有以下結構
其中表示重複單元聚合數之n表示介於5與500之間的整數,且m為1至5之整數。聚合硫醇-側位矽氧烷將以塗料組合物之0.1重量%至7重量%之量存在。
填料為視情況選用的。在一些實施例中,存在非導電性填料。合適之非導電性填料之實例包括氧化鋁、氫氧化鋁、二氧化矽、蛭石、雲母、矽灰石、碳酸鈣、二氧化鈦、砂粒、玻璃、硫酸鋇、鋯、碳黑、有機填料,及有機聚合物,包括(但不限於)鹵化乙烯聚合物,諸如四氟乙烯、三氟乙烯、偏二氟乙烯、氟乙烯、二氯亞乙烯及氯乙烯。
在其他實施例中,存在導電性填料。合適之導電性填料之實例包括碳黑、石墨、金、銀、銅、鉑、鈀、鎳、鋁、碳化矽、氮化硼、金剛石及氧化鋁。填料之特定類型並不關鍵且可由熟習此項技術者選擇以適合特定終端使用之需要,諸如應力減小及黏合層控制。
間隔劑亦可以由從業者選擇來滿足特定應用之需要之類型及量包括在調配物中,以控制經黏合部分的黏合層厚度。
填料可以由從業者確定為適於所選樹脂系統及終端使用之任何量存在;且當存在時通常在介於組合物之10重量%與30重量%之間的範圍內。
當存在時,填料較佳為球狀的,其平均粒子直徑大於2 μm且具有單峰粒度分佈。較小的粒度及雙峰式分佈會導致不可接受地高之搖變度(thixotropic index)。
塗料調配物中可以熟習此項技術者已知之類型及量包括其他添加劑,包括(但不限於)助黏劑、消泡劑、抗滲化劑(antibleed agent)、流變控制劑及助熔劑(fluxing agent)。在一較佳實施例中,不使用溶劑。
塗層可為適當保護、黏合或特定製造用途之加工效能所需之任何厚度,且通常將介於12 μm與60 μm之間。在一實施例中,塗層厚度為40 μm。
塗料係藉由工業中所使用之任何有效手段,諸如模板印刷、網板印刷、噴霧法(超音波、壓電、氣動)、噴射法(諸如,經由熱或壓電(聲)頭)或旋塗,安置至晶圓上。B階段固化可藉由光化照射或加熱實現。
在一較佳實施例中,塗料係藉由暴露於180 nm至800 nm下之脈衝式UV光源(總照射暴露量為0.01-10 J/cm2
)而B階段化。合適之脈衝式UV光源為氙氣燈(Xenon Corp.,Wilmington MA)。
實例:調配3種含有下表中所展示之組分之黏著組合物。在80℃下,將具有85℃之軟化點及203之環氧當量重量的縮水甘油基化鄰甲酚甲醛酚醛清漆混入丙烯酸四氫糠酯中,且向此中添加組合物之其餘組分。組合物中未使用溶劑。光引發劑混合物係由2,4,6-三甲基苯甲醯基-二苯基-膦氧化物及2-羥基-2-甲基-1-苯基-丙-1-酮組成。硫醇側位聚矽氧為來自Gilest Corp.之具有側位硫醇基團之聚合聚矽氧,具有4000-7000之分子量。熔融矽石為經乾篩至5微米之球狀粒子。混合物經手工混合且穿過三輥陶瓷研磨機4次。
3種調配物中之各者以40微米厚度旋塗(獨立地)至9 mm×9 mm之預切割15密耳(mil)(厚度)晶圓上。所使用之旋轉概況為:350 RPM,持續20秒;1000 RPM,持續30秒;接著300 RPM,持續5秒。使用切割膠帶使晶圓與第二未經切割晶圓黏著,且調配物藉由UV光(Fusion 558432HUSA UV燈,Fusion UV System Inc.)以總暴露量1.7 J/cm2
加以固化。
預切割晶粒自晶圓移除,且使用Toray FC-100M熱壓縮黏合機(Toray Engineering Co. Ltd),以針對調配物加以最佳化之以下黏合條件進行操作來黏合至光滑BT基板上:
在150℃下於烘箱中固化基板/晶粒總成1小時,勻變(ramp)30分鐘。使用Sonix UHR-2000儀器(Sonix Inc.)拍攝掃描聲學顯微照片(SAM)。基板/晶粒總成轉移至潮濕烘箱且在85℃及85%濕度下加熱24小時。基板/晶粒總成接著在260℃下3次穿過回流烘箱。再次拍攝SAM。
在初始熱固化之後,所有3種調配物皆展示極佳黏合、無分層及孔化。在85℃及85%濕度處理24小時及回流烘箱處理之後,不具有含硫醇聚矽氧之調配物A展示在6/6之樣品晶粒中嚴重分層;具有0.20%之含硫醇聚矽氧之調配物B展示在6/6之樣品晶粒中無不足。具有0.40%之含硫醇聚矽氧之調配物C展示在1/6之樣品晶粒中有較小分層。資料展示存在硫醇會有效抵抗分層。
Claims (9)
- 一種黏著組合物,其包含(i)環氧樹脂,(ii)具有烯系不飽和性之樹脂及光引發劑;及(iii)反應性硫化合物,其中該反應性硫化合物為具有以下結構之聚合硫醇-側位聚矽氧
- 如請求項1之黏著組合物,其中該環氧樹脂係選自由甲酚酚醛環氧樹脂、苯酚酚醛環氧樹脂及雙酚-A環氧樹脂組成之群。
- 如請求項2之黏著組合物,其中該環氧樹脂係以該黏著組合物之20重量%至40重量%之量存在。
- 如請求項1之黏著組合物,其中該環氧樹脂為熔點介於80℃與130℃之間的固體。
- 如請求項1之黏著組合物,其進一步包含該環氧樹脂之固化劑。
- 如請求項1之黏著組合物,其中該具有烯系不飽和性之樹脂為丙烯酸酯樹脂。
- 如請求項6之黏著組合物,其中該丙烯酸酯樹脂含有在環中含有至少1個氧之5或6員環,且具有小於50mPas之 黏度及大於150℃之沸點。
- 如請求項1之黏著組合物,其中(i)該環氧樹脂為熔點介於80℃與130℃之間的固體,(ii)該具有烯系不飽和性之樹脂為黏度小於50mPas且沸點大於150℃之丙烯酸酯樹脂,及(iii)該反應性硫化合物為具有以下結構之聚合硫醇-側位聚矽氧
- 一種經固化塗料組合物塗覆之半導體晶圓,其中該塗料組合物包含(i)熔點介於80℃與130℃之間的固體環氧樹脂;(ii)黏度小於50mPas且沸點大於150℃之丙烯酸酯樹脂;及(iii)具有以下結構之聚合硫醇-側位聚矽氧
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