CN100365794C - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN100365794C
CN100365794C CNB200480001617XA CN200480001617A CN100365794C CN 100365794 C CN100365794 C CN 100365794C CN B200480001617X A CNB200480001617X A CN B200480001617XA CN 200480001617 A CN200480001617 A CN 200480001617A CN 100365794 C CN100365794 C CN 100365794C
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CN
China
Prior art keywords
substrate
chamber
tote box
processing
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200480001617XA
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English (en)
Chinese (zh)
Other versions
CN1717796A (zh
Inventor
野泽俊久
松冈孝明
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1717796A publication Critical patent/CN1717796A/zh
Application granted granted Critical
Publication of CN100365794C publication Critical patent/CN100365794C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB200480001617XA 2003-09-01 2004-08-26 基板处理装置 Expired - Fee Related CN100365794C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP309367/2003 2003-09-01
JP2003309367A JP4493955B2 (ja) 2003-09-01 2003-09-01 基板処理装置及び搬送ケース

Publications (2)

Publication Number Publication Date
CN1717796A CN1717796A (zh) 2006-01-04
CN100365794C true CN100365794C (zh) 2008-01-30

Family

ID=34269559

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200480001617XA Expired - Fee Related CN100365794C (zh) 2003-09-01 2004-08-26 基板处理装置

Country Status (5)

Country Link
US (1) US7874781B2 (cg-RX-API-DMAC7.html)
JP (1) JP4493955B2 (cg-RX-API-DMAC7.html)
KR (1) KR100770232B1 (cg-RX-API-DMAC7.html)
CN (1) CN100365794C (cg-RX-API-DMAC7.html)
WO (1) WO2005022627A1 (cg-RX-API-DMAC7.html)

Families Citing this family (36)

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WO2003096410A1 (en) * 2002-05-10 2003-11-20 Tokyo Electron Limited Substrate processing device
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US8029226B2 (en) 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
JP4908771B2 (ja) * 2005-04-27 2012-04-04 東京エレクトロン株式会社 処理装置システム
JP4754304B2 (ja) * 2005-09-02 2011-08-24 東京エレクトロン株式会社 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
KR101341211B1 (ko) * 2006-12-29 2013-12-12 엘지전자 주식회사 건조 공정 중 평판표시장치 유리기판의 지지장치, 이를이용한 유리기판의 건조 방법 및 건조 방법을 이용한평판표시장치의 제조방법
US20080206020A1 (en) * 2007-02-27 2008-08-28 Smith John M Flat-panel display processing tool with storage bays and multi-axis robot arms
KR102216638B1 (ko) * 2007-05-08 2021-02-17 브룩스 오토메이션 인코퍼레이티드 기계적 스위치 메카니즘을 이용한 복수의 가동 암들을 갖는 기판 이송 장치
TW201013760A (en) * 2008-09-17 2010-04-01 Inotera Memories Inc A wafer base clean room and a method of using the wafer base clean room
JP5173699B2 (ja) * 2008-09-25 2013-04-03 株式会社日立ハイテクノロジーズ 有機ｅｌデバイス製造装置
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
KR101146981B1 (ko) * 2009-06-02 2012-05-22 삼성모바일디스플레이주식회사 증착 장치 및 그 제어 방법
KR101010196B1 (ko) * 2010-01-27 2011-01-21 에스엔유 프리시젼 주식회사 진공 증착 장비
JP2012028659A (ja) * 2010-07-27 2012-02-09 Hitachi High-Technologies Corp 真空処理装置
KR101233290B1 (ko) 2010-09-27 2013-02-14 강창수 피처리모듈 공정시스템
KR102618895B1 (ko) 2011-03-11 2023-12-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
JP6013792B2 (ja) * 2012-06-12 2016-10-25 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
KR101408164B1 (ko) * 2012-12-26 2014-06-17 주식회사 싸이맥스 웨이퍼 이송위치 측정 범위를 최소화하는 트랜스퍼 모듈
US9281222B2 (en) * 2013-03-15 2016-03-08 Applied Materials, Inc. Wafer handling systems and methods
US20150041062A1 (en) * 2013-08-12 2015-02-12 Lam Research Corporation Plasma processing chamber with removable body
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP6677884B2 (ja) * 2015-12-15 2020-04-08 シンフォニアテクノロジー株式会社 搬送装置
TW201740466A (zh) * 2016-05-03 2017-11-16 系統科技公司 基板處理裝置及基板處理方法
JP6838319B2 (ja) * 2016-08-31 2021-03-03 株式会社デンソーウェーブ 生産システム
JP6601360B2 (ja) * 2016-09-30 2019-11-06 株式会社ダイフク 物品搬送設備
JP6900862B2 (ja) * 2017-09-22 2021-07-07 株式会社デンソーウェーブ 移動ロボット
JP7177585B2 (ja) * 2017-09-22 2022-11-24 株式会社デンソーウェーブ 移動ロボット
US11282737B2 (en) * 2018-02-15 2022-03-22 Lam Research Corporation Moving substrate transfer chamber
JP7154986B2 (ja) * 2018-12-11 2022-10-18 平田機工株式会社 基板搬送装置及び基板搬送システム
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7341822B2 (ja) * 2019-09-26 2023-09-11 株式会社アルバック 真空処理装置
CN113314448B (zh) * 2021-05-13 2022-07-22 长江存储科技有限责任公司 半导体传输设备及其控制方法
KR102822951B1 (ko) 2021-09-09 2025-06-20 삼성전자주식회사 Efem을 포함하는 웨이퍼 처리 장치 및 웨이퍼 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JPH09162263A (ja) * 1995-10-05 1997-06-20 Dainippon Screen Mfg Co Ltd 基板処理装置及びこれに用いる基板搬送装置
JPH1056051A (ja) * 1996-08-08 1998-02-24 Canon Sales Co Inc 基板処理装置
JPH11284048A (ja) * 1998-03-31 1999-10-15 Shibaura Mechatronics Corp ロボット装置および処理装置

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US4976610A (en) * 1988-12-05 1990-12-11 Cryco Twenty-Two, Inc. Purge cantilevered wafer loading system for LP CVD processes
JP2901672B2 (ja) 1989-12-13 1999-06-07 株式会社日立製作所 複数真空処理装置
JP2548062B2 (ja) * 1992-11-13 1996-10-30 日本エー・エス・エム株式会社 縦型熱処理装置用ロードロックチャンバー
JPH07231028A (ja) 1994-02-18 1995-08-29 Ebara Corp 搬送装置および搬送方法
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
JP4533462B2 (ja) 1998-04-04 2010-09-01 東京エレクトロン株式会社 処理方法
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
KR100551806B1 (ko) * 1999-09-06 2006-02-13 동경 엘렉트론 주식회사 반도체 처리용 반송 장치 및 수용 장치와, 반도체 처리시스템
WO2003096410A1 (en) * 2002-05-10 2003-11-20 Tokyo Electron Limited Substrate processing device
WO2004010476A2 (en) * 2002-07-22 2004-01-29 Brooks Automation, Inc. Substrate processing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697258A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 連続真空処理装置
JPH09162263A (ja) * 1995-10-05 1997-06-20 Dainippon Screen Mfg Co Ltd 基板処理装置及びこれに用いる基板搬送装置
JPH1056051A (ja) * 1996-08-08 1998-02-24 Canon Sales Co Inc 基板処理装置
JPH11284048A (ja) * 1998-03-31 1999-10-15 Shibaura Mechatronics Corp ロボット装置および処理装置

Also Published As

Publication number Publication date
KR100770232B1 (ko) 2007-10-26
US20070000612A1 (en) 2007-01-04
WO2005022627A1 (ja) 2005-03-10
CN1717796A (zh) 2006-01-04
KR20050114209A (ko) 2005-12-05
JP2005079409A (ja) 2005-03-24
JP4493955B2 (ja) 2010-06-30
US7874781B2 (en) 2011-01-25

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Granted publication date: 20080130

Termination date: 20140826

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