CA2649841C - Resin composition, prepreg, laminate, and wiring board - Google Patents

Resin composition, prepreg, laminate, and wiring board Download PDF

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Publication number
CA2649841C
CA2649841C CA2649841A CA2649841A CA2649841C CA 2649841 C CA2649841 C CA 2649841C CA 2649841 A CA2649841 A CA 2649841A CA 2649841 A CA2649841 A CA 2649841A CA 2649841 C CA2649841 C CA 2649841C
Authority
CA
Canada
Prior art keywords
resin
resin composition
epoxy resin
laminate
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2649841A
Other languages
English (en)
French (fr)
Other versions
CA2649841A1 (en
Inventor
Koji Morita
Shin Takanezawa
Kazunaga Sakai
Yuusuke Kondou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CA2649841A1 publication Critical patent/CA2649841A1/en
Application granted granted Critical
Publication of CA2649841C publication Critical patent/CA2649841C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA2649841A 2006-04-28 2007-04-26 Resin composition, prepreg, laminate, and wiring board Expired - Fee Related CA2649841C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006125603 2006-04-28
JP2006-125603 2006-04-28
PCT/JP2007/059022 WO2007125979A1 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

Publications (2)

Publication Number Publication Date
CA2649841A1 CA2649841A1 (en) 2007-11-08
CA2649841C true CA2649841C (en) 2013-11-26

Family

ID=38655504

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2649841A Expired - Fee Related CA2649841C (en) 2006-04-28 2007-04-26 Resin composition, prepreg, laminate, and wiring board

Country Status (10)

Country Link
US (1) US9078365B2 (https=)
JP (6) JP4950142B2 (https=)
KR (1) KR101398342B1 (https=)
CN (5) CN103342876A (https=)
CA (1) CA2649841C (https=)
DE (1) DE112007001047B4 (https=)
MY (2) MY169438A (https=)
SG (1) SG173402A1 (https=)
TW (1) TWI417337B (https=)
WO (1) WO2007125979A1 (https=)

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JP5588646B2 (ja) * 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
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SG183365A1 (en) * 2010-02-24 2012-09-27 Hitachi Chemical Co Ltd Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
JP5558885B2 (ja) * 2010-03-30 2014-07-23 電気化学工業株式会社 樹脂複合組成物及びその用途
KR101473556B1 (ko) * 2012-03-27 2014-12-16 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
KR20160029900A (ko) * 2014-09-05 2016-03-16 삼성전자주식회사 반도체 소자의 제조 방법
ES2726680T3 (es) * 2014-12-16 2019-10-08 Cytec Ind Inc Composición de resina basada en epoxi para materiales de materiales compuestos
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JP6735505B2 (ja) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
EP3644950A2 (en) 2017-06-30 2020-05-06 The Procter and Gamble Company Deodorant and antiperspirant compositions
US10543164B2 (en) 2017-06-30 2020-01-28 The Procter & Gamble Company Deodorant compositions
WO2019006233A1 (en) 2017-06-30 2019-01-03 The Procter & Gamble Company HAIR CARE COMPOSITIONS COMPRISING 2-PYRIDINOL-N-OXIDE TYPE MATERIAL AND IRON CHELATOR
KR102372638B1 (ko) * 2017-07-10 2022-03-10 디아이씨 가부시끼가이샤 적층체, 그것을 사용한 프린트 배선판, 플렉서블 프린트 배선판 및 성형품
JP7163605B2 (ja) * 2018-03-26 2022-11-01 味の素株式会社 樹脂組成物
CN112513180A (zh) * 2018-08-09 2021-03-16 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板
CN116635456A (zh) * 2020-12-21 2023-08-22 富士胶片株式会社 层叠体及聚合物膜

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Also Published As

Publication number Publication date
JP5505485B2 (ja) 2014-05-28
JP4950141B2 (ja) 2012-06-13
JP5316267B2 (ja) 2013-10-16
KR101398342B1 (ko) 2014-05-22
JP2009280823A (ja) 2009-12-03
JP4950142B2 (ja) 2012-06-13
KR20090014173A (ko) 2009-02-06
US20090200071A1 (en) 2009-08-13
JP5338187B2 (ja) 2013-11-13
CN102134303A (zh) 2011-07-27
SG173402A1 (en) 2011-08-29
JP2009007576A (ja) 2009-01-15
JP2013080931A (ja) 2013-05-02
CN103333459A (zh) 2013-10-02
CN103342876A (zh) 2013-10-09
JP5505486B2 (ja) 2014-05-28
MY169438A (en) 2019-04-10
TWI417337B (zh) 2013-12-01
CN103342877A (zh) 2013-10-09
WO2007125979A1 (ja) 2007-11-08
DE112007001047T5 (de) 2009-04-16
US9078365B2 (en) 2015-07-07
TW200801111A (en) 2008-01-01
JP2008303397A (ja) 2008-12-18
JP2009024177A (ja) 2009-02-05
CA2649841A1 (en) 2007-11-08
MY154552A (en) 2015-06-30
CN101432330A (zh) 2009-05-13
CN103333459B (zh) 2016-06-01
JP2013080930A (ja) 2013-05-02
CN103342877B (zh) 2016-05-04
CN101432330B (zh) 2011-08-03
DE112007001047B4 (de) 2020-06-04

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