CA2408582A1 - Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors - Google Patents

Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors Download PDF

Info

Publication number
CA2408582A1
CA2408582A1 CA002408582A CA2408582A CA2408582A1 CA 2408582 A1 CA2408582 A1 CA 2408582A1 CA 002408582 A CA002408582 A CA 002408582A CA 2408582 A CA2408582 A CA 2408582A CA 2408582 A1 CA2408582 A1 CA 2408582A1
Authority
CA
Canada
Prior art keywords
layer
type epitaxial
forming
epitaxial layer
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002408582A
Other languages
English (en)
French (fr)
Inventor
Scott T. Allen
John W. Palmour
Terrence S. Alcorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2408582A1 publication Critical patent/CA2408582A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H01L29/8128Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate with recessed gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/7605Making of isolation regions between components between components manufactured in an active substrate comprising AIII BV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/1608Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/47Schottky barrier electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66053Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
    • H01L29/66068Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
CA002408582A 2000-05-10 2001-02-15 Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors Abandoned CA2408582A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/567,717 2000-05-10
US09/567,717 US6686616B1 (en) 2000-05-10 2000-05-10 Silicon carbide metal-semiconductor field effect transistors
PCT/US2001/004957 WO2001086727A2 (en) 2000-05-10 2001-02-15 Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors

Publications (1)

Publication Number Publication Date
CA2408582A1 true CA2408582A1 (en) 2001-11-15

Family

ID=24268352

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002408582A Abandoned CA2408582A1 (en) 2000-05-10 2001-02-15 Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors

Country Status (9)

Country Link
US (2) US6686616B1 (ja)
EP (2) EP1285464A2 (ja)
JP (2) JP5255743B2 (ja)
KR (1) KR100726365B1 (ja)
CN (1) CN1286184C (ja)
AU (1) AU2001238351A1 (ja)
CA (1) CA2408582A1 (ja)
TW (1) TW492198B (ja)
WO (1) WO2001086727A2 (ja)

Families Citing this family (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6686616B1 (en) 2000-05-10 2004-02-03 Cree, Inc. Silicon carbide metal-semiconductor field effect transistors
AU2002246934A1 (en) * 2001-01-03 2002-07-16 Mississippi State University Silicon carbide and related wide-bandgap transistors on semi-insulating epitaxy for high-speed, high-power applications
CN1557024B (zh) 2001-07-24 2010-04-07 美商克立股份有限公司 绝缘栅铝镓氮化物/氮化钾高电子迁移率晶体管(hemt)
US6906350B2 (en) * 2001-10-24 2005-06-14 Cree, Inc. Delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure
JP4009106B2 (ja) * 2001-12-27 2007-11-14 浜松ホトニクス株式会社 半導体受光素子、及びその製造方法
JP2003228320A (ja) * 2002-02-05 2003-08-15 Matsushita Electric Ind Co Ltd プラズマディスプレイ装置
DE10304722A1 (de) * 2002-05-11 2004-08-19 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements
US6833556B2 (en) * 2002-08-12 2004-12-21 Acorn Technologies, Inc. Insulated gate field effect transistor having passivated schottky barriers to the channel
US7084423B2 (en) 2002-08-12 2006-08-01 Acorn Technologies, Inc. Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
US6956239B2 (en) * 2002-11-26 2005-10-18 Cree, Inc. Transistors having buried p-type layers beneath the source region
US7026650B2 (en) 2003-01-15 2006-04-11 Cree, Inc. Multiple floating guard ring edge termination for silicon carbide devices
US9515135B2 (en) * 2003-01-15 2016-12-06 Cree, Inc. Edge termination structures for silicon carbide devices
US7112860B2 (en) 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
US7898047B2 (en) * 2003-03-03 2011-03-01 Samsung Electronics Co., Ltd. Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
CN1532943B (zh) * 2003-03-18 2011-11-23 松下电器产业株式会社 碳化硅半导体器件及其制造方法
DE10312214B4 (de) * 2003-03-19 2008-11-20 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von mindestens einer Mesa- oder Stegstruktur oder von mindestens einem elektrisch gepumpten Bereich in einer Schicht oder Schichtenfolge
JP4109159B2 (ja) * 2003-06-13 2008-07-02 浜松ホトニクス株式会社 半導体受光素子
WO2004112150A1 (ja) * 2003-06-13 2004-12-23 Sumitomo Electric Industries, Ltd. 電界効果トランジスタ
JP4530171B2 (ja) * 2003-08-08 2010-08-25 サンケン電気株式会社 半導体装置
US20050104072A1 (en) * 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
US7501669B2 (en) * 2003-09-09 2009-03-10 Cree, Inc. Wide bandgap transistor devices with field plates
KR100448352B1 (ko) * 2003-11-28 2004-09-10 삼성전기주식회사 GaN 기반 질화막의 형성방법
US7084475B2 (en) * 2004-02-17 2006-08-01 Velox Semiconductor Corporation Lateral conduction Schottky diode with plural mesas
US7470967B2 (en) * 2004-03-12 2008-12-30 Semisouth Laboratories, Inc. Self-aligned silicon carbide semiconductor devices and methods of making the same
US7275357B2 (en) * 2004-03-30 2007-10-02 Cnh America Llc Cotton module program control using yield monitor signal
US7550783B2 (en) * 2004-05-11 2009-06-23 Cree, Inc. Wide bandgap HEMTs with source connected field plates
US7573078B2 (en) * 2004-05-11 2009-08-11 Cree, Inc. Wide bandgap transistors with multiple field plates
US9773877B2 (en) * 2004-05-13 2017-09-26 Cree, Inc. Wide bandgap field effect transistors with source connected field plates
WO2005114746A1 (en) * 2004-05-21 2005-12-01 Nanyang Technological University Novel structures of silicon carbide metal semiconductor field effect transistors for high voltage and high power applications
US7345309B2 (en) * 2004-08-31 2008-03-18 Lockheed Martin Corporation SiC metal semiconductor field-effect transistor
US7238224B2 (en) * 2004-10-29 2007-07-03 Hewlett-Packard Development Company, L.P. Fluid-gas separator
US20060091606A1 (en) * 2004-10-28 2006-05-04 Gary Paugh Magnetic building game
US7348612B2 (en) * 2004-10-29 2008-03-25 Cree, Inc. Metal-semiconductor field effect transistors (MESFETs) having drains coupled to the substrate and methods of fabricating the same
US7265399B2 (en) * 2004-10-29 2007-09-04 Cree, Inc. Asymetric layout structures for transistors and methods of fabricating the same
US7326962B2 (en) * 2004-12-15 2008-02-05 Cree, Inc. Transistors having buried N-type and P-type regions beneath the source region and methods of fabricating the same
US11791385B2 (en) * 2005-03-11 2023-10-17 Wolfspeed, Inc. Wide bandgap transistors with gate-source field plates
US7476594B2 (en) * 2005-03-30 2009-01-13 Cree, Inc. Methods of fabricating silicon nitride regions in silicon carbide and resulting structures
DE102005023361A1 (de) * 2005-05-20 2006-11-23 Robert Bosch Gmbh Feldeffekttransistor
US7858481B2 (en) 2005-06-15 2010-12-28 Intel Corporation Method for fabricating transistor with thinned channel
US8203185B2 (en) * 2005-06-21 2012-06-19 Cree, Inc. Semiconductor devices having varying electrode widths to provide non-uniform gate pitches and related methods
US7598576B2 (en) * 2005-06-29 2009-10-06 Cree, Inc. Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
US7525122B2 (en) * 2005-06-29 2009-04-28 Cree, Inc. Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
US7855401B2 (en) * 2005-06-29 2010-12-21 Cree, Inc. Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides
US7282401B2 (en) * 2005-07-08 2007-10-16 Micron Technology, Inc. Method and apparatus for a self-aligned recessed access device (RAD) transistor gate
US20070018199A1 (en) 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
US7867851B2 (en) 2005-08-30 2011-01-11 Micron Technology, Inc. Methods of forming field effect transistors on substrates
JP5011493B2 (ja) * 2005-09-14 2012-08-29 関西電力株式会社 炭化珪素半導体素子の製造方法
JP2009509339A (ja) 2005-09-16 2009-03-05 クリー インコーポレイテッド 炭化ケイ素パワーデバイスを有する半導体ウェハを処理する方法
CN100593243C (zh) 2005-10-19 2010-03-03 三菱电机株式会社 Mosfet以及mosfet的制造方法
US7402844B2 (en) * 2005-11-29 2008-07-22 Cree, Inc. Metal semiconductor field effect transistors (MESFETS) having channels of varying thicknesses and related methods
US7368971B2 (en) * 2005-12-06 2008-05-06 Cree, Inc. High power, high frequency switch circuits using strings of power transistors
US7419892B2 (en) * 2005-12-13 2008-09-02 Cree, Inc. Semiconductor devices including implanted regions and protective layers and methods of forming the same
US7964514B2 (en) * 2006-03-02 2011-06-21 Applied Materials, Inc. Multiple nitrogen plasma treatments for thin SiON dielectrics
DE102006012369A1 (de) * 2006-03-17 2007-09-20 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements mit einer metallischen Steuerelektrode und Halbleiterbauelement
US8269262B2 (en) * 2006-05-02 2012-09-18 Ss Sc Ip Llc Vertical junction field effect transistor with mesa termination and method of making the same
US7274083B1 (en) * 2006-05-02 2007-09-25 Semisouth Laboratories, Inc. Semiconductor device with surge current protection and method of making the same
US7880166B2 (en) 2006-05-10 2011-02-01 Ho-Yuan Yu Fast recovery reduced p-n junction rectifier
US8669554B2 (en) 2006-05-10 2014-03-11 Ho-Yuan Yu Fast recovery reduced p-n junction rectifier
US9040398B2 (en) * 2006-05-16 2015-05-26 Cree, Inc. Method of fabricating seminconductor devices including self aligned refractory contacts
JP5061506B2 (ja) * 2006-06-05 2012-10-31 富士電機株式会社 炭化珪素半導体装置の製造方法
US7602001B2 (en) 2006-07-17 2009-10-13 Micron Technology, Inc. Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells
US7646043B2 (en) * 2006-09-28 2010-01-12 Cree, Inc. Transistors having buried p-type layers coupled to the gate
JP4844330B2 (ja) * 2006-10-03 2011-12-28 富士電機株式会社 炭化珪素半導体装置の製造方法および炭化珪素半導体装置
JP5520432B2 (ja) * 2006-10-03 2014-06-11 古河電気工業株式会社 半導体トランジスタの製造方法
CN100411141C (zh) * 2006-10-16 2008-08-13 中国电子科技集团公司第五十五研究所 碳化硅器件的电学隔离方法
US8823057B2 (en) 2006-11-06 2014-09-02 Cree, Inc. Semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices
JP5105160B2 (ja) 2006-11-13 2012-12-19 クリー インコーポレイテッド トランジスタ
US7692263B2 (en) 2006-11-21 2010-04-06 Cree, Inc. High voltage GaN transistors
JP5183913B2 (ja) * 2006-11-24 2013-04-17 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
US8878245B2 (en) 2006-11-30 2014-11-04 Cree, Inc. Transistors and method for making ohmic contact to transistors
JP4751308B2 (ja) 2006-12-18 2011-08-17 住友電気工業株式会社 横型接合型電界効果トランジスタ
US7880172B2 (en) * 2007-01-31 2011-02-01 Cree, Inc. Transistors having implanted channels and implanted P-type regions beneath the source region
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
ITTO20070099A1 (it) * 2007-02-09 2008-08-10 St Microelectronics Srl Procedimento per la realizzazione di un'interfaccia tra carburo di silicio e ossido di silicio con bassa densita' di stati
US7737476B2 (en) * 2007-02-15 2010-06-15 Cree, Inc. Metal-semiconductor field effect transistors (MESFETs) having self-aligned structures
US8212290B2 (en) * 2007-03-23 2012-07-03 Cree, Inc. High temperature performance capable gallium nitride transistor
FR2914500B1 (fr) * 2007-03-30 2009-11-20 Picogiga Internat Dispositif electronique a contact ohmique ameliore
WO2008137724A1 (en) * 2007-05-03 2008-11-13 Dsm Solutions, Inc. Strained channel p-type jfet and fabrication method thereof
KR100898225B1 (ko) * 2007-09-07 2009-05-18 주식회사 동부하이텍 반도체 소자 및 이의 제조방법
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US7935620B2 (en) * 2007-12-05 2011-05-03 Freescale Semiconductor, Inc. Method for forming semiconductor devices with low leakage Schottky contacts
WO2009073866A1 (en) * 2007-12-07 2009-06-11 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Gate after diamond transistor
US9024327B2 (en) 2007-12-14 2015-05-05 Cree, Inc. Metallization structure for high power microelectronic devices
JP2009176804A (ja) * 2008-01-22 2009-08-06 Nippon Steel Corp 電力変換素子
US9711633B2 (en) * 2008-05-09 2017-07-18 Cree, Inc. Methods of forming group III-nitride semiconductor devices including implanting ions directly into source and drain regions and annealing to activate the implanted ions
CN101320601B (zh) * 2008-06-18 2011-08-17 西北工业大学 碳化硅肖特基结式核电池及其制作方法
CN101740388B (zh) * 2008-11-10 2011-05-11 中芯国际集成电路制造(上海)有限公司 金属半导体场效应晶体管的制造方法
WO2010082272A1 (ja) * 2009-01-16 2010-07-22 日本電気株式会社 半導体装置及びその製造方法
JP5682556B2 (ja) * 2009-10-05 2015-03-11 住友電気工業株式会社 半導体装置
JP2011119512A (ja) * 2009-12-04 2011-06-16 Denso Corp 半導体装置およびその製造方法
US8936976B2 (en) * 2009-12-23 2015-01-20 Intel Corporation Conductivity improvements for III-V semiconductor devices
JP4985757B2 (ja) * 2009-12-25 2012-07-25 株式会社デンソー 炭化珪素半導体装置
JP2011159714A (ja) * 2010-01-29 2011-08-18 Denso Corp 炭化珪素半導体装置およびその製造方法
US8890277B2 (en) 2010-03-15 2014-11-18 University Of Florida Research Foundation Inc. Graphite and/or graphene semiconductor devices
CN101834206B (zh) * 2010-04-12 2012-10-10 清华大学 半导体器件结构及其形成方法
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN102446861B (zh) * 2010-10-11 2013-10-23 上海华虹Nec电子有限公司 利用选择性碳化硅外延来提升sonos擦写速度的方法
JP2012164790A (ja) * 2011-02-07 2012-08-30 Sumitomo Electric Ind Ltd 炭化珪素半導体装置およびその製造方法
US10367089B2 (en) * 2011-03-28 2019-07-30 General Electric Company Semiconductor device and method for reduced bias threshold instability
CN102290434B (zh) * 2011-09-01 2013-08-14 西安电子科技大学 带栅下缓冲层结构的金属半导体场效应晶体管及制作方法
WO2013035842A1 (ja) 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
EP2765610B1 (en) 2011-09-08 2018-12-26 Tamura Corporation Ga2o3 semiconductor element
US9991399B2 (en) 2012-10-04 2018-06-05 Cree, Inc. Passivation structure for semiconductor devices
US8994073B2 (en) 2012-10-04 2015-03-31 Cree, Inc. Hydrogen mitigation schemes in the passivation of advanced devices
US9812338B2 (en) 2013-03-14 2017-11-07 Cree, Inc. Encapsulation of advanced devices using novel PECVD and ALD schemes
JP6178065B2 (ja) * 2012-10-09 2017-08-09 株式会社東芝 半導体装置
TW201417149A (zh) * 2012-10-31 2014-05-01 Lg Innotek Co Ltd 磊晶晶圓
CN102931272A (zh) * 2012-11-23 2013-02-13 中国科学院微电子研究所 一种具有增益的紫外探测器结构及其制备方法
US9293627B1 (en) * 2012-12-03 2016-03-22 Sandia Corporation Sub-wavelength antenna enhanced bilayer graphene tunable photodetector
JP5803979B2 (ja) 2013-05-29 2015-11-04 住友電気工業株式会社 炭化珪素基板および炭化珪素半導体装置ならびに炭化珪素基板および炭化珪素半導体装置の製造方法
US9847411B2 (en) 2013-06-09 2017-12-19 Cree, Inc. Recessed field plate transistor structures
US9755059B2 (en) 2013-06-09 2017-09-05 Cree, Inc. Cascode structures with GaN cap layers
US9679981B2 (en) 2013-06-09 2017-06-13 Cree, Inc. Cascode structures for GaN HEMTs
JP6241915B2 (ja) * 2013-07-31 2017-12-06 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
JP6156241B2 (ja) * 2014-04-11 2017-07-05 新日鐵住金株式会社 炭化ケイ素ショットキーバリアダイオード
WO2016002386A1 (ja) * 2014-07-02 2016-01-07 富士電機株式会社 炭化珪素半導体素子の製造方法
WO2016013471A1 (ja) * 2014-07-23 2016-01-28 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2016031953A (ja) 2014-07-25 2016-03-07 株式会社タムラ製作所 半導体素子及びその製造方法、半導体基板、並びに結晶積層構造体
JP6292104B2 (ja) * 2014-11-17 2018-03-14 三菱電機株式会社 窒化物半導体装置の製造方法
CN104900716B (zh) * 2015-05-18 2018-07-20 杭州士兰集成电路有限公司 单向tvs器件结构及其制作方法
JP6873926B2 (ja) * 2015-06-09 2021-05-19 アーベーベー・シュバイツ・アーゲーABB Schweiz AG 炭化ケイ素パワー半導体デバイスのエッジ終端部を製造する方法
CN105161798B (zh) * 2015-07-01 2017-12-26 东南大学 硅基低漏电流悬臂梁栅的开关电容滤波器及制备方法
CN105261642B (zh) * 2015-08-21 2019-04-12 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
CN105304705B (zh) * 2015-08-21 2019-01-11 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
CN105261641A (zh) * 2015-08-21 2016-01-20 西安电子科技大学 异质结高电子迁移率自旋场效应晶体管及制造方法
CN105161531A (zh) * 2015-08-26 2015-12-16 西安电子科技大学 4H-SiC金属半导体场效应晶体管及其制作方法
CN105336686B (zh) * 2015-09-30 2019-10-25 中国电子科技集团公司第五十五研究所 一种复合结构SiC衬底器件的切割方法
JP6400618B2 (ja) * 2016-03-09 2018-10-03 株式会社東芝 半導体装置
US10243039B2 (en) 2016-03-22 2019-03-26 General Electric Company Super-junction semiconductor power devices with fast switching capability
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
US10002958B2 (en) * 2016-06-08 2018-06-19 The United States Of America, As Represented By The Secretary Of The Navy Diamond on III-nitride device
US9620611B1 (en) 2016-06-17 2017-04-11 Acorn Technology, Inc. MIS contact structure with metal oxide conductor
JP2016197737A (ja) * 2016-06-29 2016-11-24 株式会社タムラ製作所 半導体素子及びその製造方法、並びに結晶積層構造体
US10170627B2 (en) 2016-11-18 2019-01-01 Acorn Technologies, Inc. Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height
US10297557B2 (en) * 2017-06-30 2019-05-21 Sanken Electric Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
US10217831B1 (en) * 2017-08-31 2019-02-26 Vanguard International Semiconductor Corporation High electron mobility transistor devices
JP7009147B2 (ja) * 2017-09-29 2022-01-25 富士電機株式会社 炭化珪素半導体基板、炭化珪素半導体基板の製造方法および炭化珪素半導体装置
CN108962418B (zh) * 2018-02-08 2022-04-26 长安大学 一种Pm-147碳化硅缓变肖特基同位素电池及其制造方法
US10818659B2 (en) 2018-10-16 2020-10-27 Globalfoundries Inc. FinFET having upper spacers adjacent gate and source/drain contacts
US10580701B1 (en) 2018-10-23 2020-03-03 Globalfoundries Inc. Methods of making a self-aligned gate contact structure and source/drain metallization structures on integrated circuit products
CN113990549B (zh) * 2021-10-09 2023-08-08 西安电子科技大学 具有减薄P型区的分布电极PiN型β辐照电池及制备方法
CN117712124B (zh) * 2024-02-05 2024-04-26 中国科学院长春光学精密机械与物理研究所 一种基于4H-SiC衬底的高性能CMOS器件

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US612680A (en) * 1898-10-18 House
DE2324780C3 (de) * 1973-05-16 1978-07-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen eines Halbleiterbauelements
JPS6051213B2 (ja) 1978-05-30 1985-11-13 株式会社フジクラ 伸縮自在なテ−プ電線の製造装置
JPS59134874A (ja) * 1983-01-21 1984-08-02 Hitachi Ltd 半導体装置の製造方法
JPS60142568A (ja) 1983-12-29 1985-07-27 Sharp Corp 炭化珪素電界効果トランジスタの製造方法
US4762806A (en) 1983-12-23 1988-08-09 Sharp Kabushiki Kaisha Process for producing a SiC semiconductor device
US4737469A (en) 1984-01-19 1988-04-12 Honeywell Inc. Controlled mode field effect transistors and method therefore
JPS60154674A (ja) 1984-01-25 1985-08-14 Hitachi Ltd 電子装置の製造方法
JPS60189250A (ja) 1984-03-08 1985-09-26 Fujitsu Ltd 半導体装置
EP0181091B1 (en) 1984-11-02 1990-06-13 Kabushiki Kaisha Toshiba Schottky gate field effect transistor and manufacturing method thereof
JP2615390B2 (ja) 1985-10-07 1997-05-28 工業技術院長 炭化シリコン電界効果トランジスタの製造方法
DE3685495D1 (de) 1986-07-11 1992-07-02 Ibm Verfahren zur herstellung einer unteraetzten maskenkontur.
US5229625A (en) 1986-08-18 1993-07-20 Sharp Kabushiki Kaisha Schottky barrier gate type field effect transistor
JPS6347983A (ja) 1986-08-18 1988-02-29 Sharp Corp 炭化珪素電界効果トランジスタ
JPS6459961A (en) 1987-08-31 1989-03-07 Toshiba Corp Semiconductor device
JPH0797659B2 (ja) 1987-10-20 1995-10-18 三洋電機株式会社 SiC青色発光ダイオード
JPH0797660B2 (ja) 1987-10-20 1995-10-18 三洋電機株式会社 SiC青色発光ダイオード
US4947218A (en) 1987-11-03 1990-08-07 North Carolina State University P-N junction diodes in silicon carbide
JPH0798684B2 (ja) 1988-01-19 1995-10-25 日本碍子株式会社 高密度SiC焼結体の製造方法
JPH01196873A (ja) * 1988-02-02 1989-08-08 Sharp Corp 炭化珪素半導体装置
JP2612040B2 (ja) 1988-06-28 1997-05-21 株式会社豊田中央研究所 β−SiCを用いたMOS・FET及びその製造方法
JP2815642B2 (ja) * 1989-11-29 1998-10-27 沖電気工業株式会社 電界効果トランジスタ
US5014108A (en) 1990-05-15 1991-05-07 Harris Corporation MESFET for dielectrically isolated integrated circuits
JPH04225534A (ja) 1990-12-27 1992-08-14 Fujitsu Ltd 半導体装置及びその製造方法
JPH0547798A (ja) 1991-01-31 1993-02-26 Texas Instr Inc <Ti> 抵抗性AlGaAsを有するGaAs FET
US5289015A (en) 1991-04-25 1994-02-22 At&T Bell Laboratories Planar fet-seed integrated circuits
US5270554A (en) 1991-06-14 1993-12-14 Cree Research, Inc. High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide
US5264713A (en) * 1991-06-14 1993-11-23 Cree Research, Inc. Junction field-effect transistor formed in silicon carbide
US5925895A (en) 1993-10-18 1999-07-20 Northrop Grumman Corporation Silicon carbide power MESFET with surface effect supressive layer
US5510630A (en) * 1993-10-18 1996-04-23 Westinghouse Electric Corporation Non-volatile random access memory cell constructed of silicon carbide
US5611955A (en) * 1993-10-18 1997-03-18 Northrop Grumman Corp. High resistivity silicon carbide substrates for high power microwave devices
US5396085A (en) 1993-12-28 1995-03-07 North Carolina State University Silicon carbide switching device with rectifying-gate
US5399883A (en) * 1994-05-04 1995-03-21 North Carolina State University At Raleigh High voltage silicon carbide MESFETs and methods of fabricating same
US5686737A (en) * 1994-09-16 1997-11-11 Cree Research, Inc. Self-aligned field-effect transistor for high frequency applications
SE9404452D0 (sv) 1994-12-22 1994-12-22 Abb Research Ltd Semiconductor device having an insulated gate
JPH08316164A (ja) * 1995-05-17 1996-11-29 Hitachi Ltd 半導体素子の作成方法
JP3158973B2 (ja) * 1995-07-20 2001-04-23 富士電機株式会社 炭化けい素縦型fet
US5821576A (en) * 1995-10-18 1998-10-13 Northrop Grumman Corporation Silicon carbide power field effect transistor
US5972801A (en) 1995-11-08 1999-10-26 Cree Research, Inc. Process for reducing defects in oxide layers on silicon carbide
JP2728126B2 (ja) 1995-12-25 1998-03-18 日本電気株式会社 電界効果トランジスタ
JPH09260405A (ja) * 1996-03-27 1997-10-03 Mitsubishi Electric Corp 半導体装置とその製造方法
US5719409A (en) * 1996-06-06 1998-02-17 Cree Research, Inc. Silicon carbide metal-insulator semiconductor field effect transistor
DE19644821C1 (de) 1996-10-29 1998-02-12 Daimler Benz Ag Steuerbare Halbleiterstruktur mit verbesserten Schalteigenschaften
US5742082A (en) 1996-11-22 1998-04-21 Motorola, Inc. Stable FET with shielding region in the substrate
WO1998035389A1 (en) * 1997-02-07 1998-08-13 Northrop Grumman Corporation Silicon carbide power mesfet
US5891769A (en) 1997-04-07 1999-04-06 Motorola, Inc. Method for forming a semiconductor device having a heteroepitaxial layer
US6121633A (en) * 1997-06-12 2000-09-19 Cree Research, Inc. Latch-up free power MOS-bipolar transistor
JPH11135522A (ja) * 1997-08-28 1999-05-21 Nec Corp 化合物半導体装置の製造方法
JPH11150124A (ja) 1997-09-12 1999-06-02 Toshiba Corp 電界効果トランジスタおよびその製造方法
JP3216804B2 (ja) * 1998-01-06 2001-10-09 富士電機株式会社 炭化けい素縦形fetの製造方法および炭化けい素縦形fet
JP4120899B2 (ja) * 1998-02-17 2008-07-16 富士通株式会社 化合物半導体電界効果トランジスタ及びその製造方法
US6107649A (en) * 1998-06-10 2000-08-22 Rutgers, The State University Field-controlled high-power semiconductor devices
US6316793B1 (en) * 1998-06-12 2001-11-13 Cree, Inc. Nitride based transistors on semi-insulating silicon carbide substrates
JP2000012560A (ja) * 1998-06-22 2000-01-14 Furukawa Electric Co Ltd:The メサ型化合物半導体電界効果トランジスタ及びその作製方法
US6246076B1 (en) * 1998-08-28 2001-06-12 Cree, Inc. Layered dielectric on silicon carbide semiconductor structures
US6646265B2 (en) * 1999-02-08 2003-11-11 General Electric Company Optical spectrometer and method for combustion flame temperature determination
US6218680B1 (en) * 1999-05-18 2001-04-17 Cree, Inc. Semi-insulating silicon carbide without vanadium domination
AU1416601A (en) 2000-03-03 2001-09-17 Matsushita Electric Industrial Co., Ltd. Semiconductor device
US6686616B1 (en) 2000-05-10 2004-02-03 Cree, Inc. Silicon carbide metal-semiconductor field effect transistors
US6458640B1 (en) 2001-06-04 2002-10-01 Anadigics, Inc. GaAs MESFET having LDD and non-uniform P-well doping profiles
US6906350B2 (en) * 2001-10-24 2005-06-14 Cree, Inc. Delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure
US6956239B2 (en) * 2002-11-26 2005-10-18 Cree, Inc. Transistors having buried p-type layers beneath the source region

Also Published As

Publication number Publication date
EP1976020A3 (en) 2010-08-04
AU2001238351A1 (en) 2001-11-20
WO2001086727A3 (en) 2002-03-21
KR20020092445A (ko) 2002-12-11
JP2012147005A (ja) 2012-08-02
EP1285464A2 (en) 2003-02-26
US7067361B2 (en) 2006-06-27
JP5255743B2 (ja) 2013-08-07
US6686616B1 (en) 2004-02-03
TW492198B (en) 2002-06-21
EP1976020A2 (en) 2008-10-01
CN1286184C (zh) 2006-11-22
KR100726365B1 (ko) 2007-06-11
WO2001086727A2 (en) 2001-11-15
CN1441965A (zh) 2003-09-10
US20040159865A1 (en) 2004-08-19
JP2003533051A (ja) 2003-11-05

Similar Documents

Publication Publication Date Title
US7067361B2 (en) Methods of fabricating silicon carbide metal-semiconductor field effect transistors
US6902964B2 (en) Methods of fabricating delta doped silicon carbide metal-semiconductor field effect transistors having a gate disposed in a double recess structure
EP1565946B1 (en) Transistors having buried p-type layers beneath the source region and methods of fabricating the same
US5270554A (en) High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide
US7348612B2 (en) Metal-semiconductor field effect transistors (MESFETs) having drains coupled to the substrate and methods of fabricating the same
US8049272B2 (en) Transistors having implanted channel layers and methods of fabricating the same
EP1825517B1 (en) Transistors having buried n-type and p-type regions beneath the source region and methods of fabricating the same
KR100563884B1 (ko) 접합형 전계 효과 트랜지스터의 제조 방법

Legal Events

Date Code Title Description
EEER Examination request
FZDE Dead