ZA200309166B - IC card. - Google Patents
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- ZA200309166B ZA200309166B ZA200309166A ZA200309166A ZA200309166B ZA 200309166 B ZA200309166 B ZA 200309166B ZA 200309166 A ZA200309166 A ZA 200309166A ZA 200309166 A ZA200309166 A ZA 200309166A ZA 200309166 B ZA200309166 B ZA 200309166B
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- South Africa
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- card
- chip
- reinforcing
- reinforcing film
- resin
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- 238000005530 etching Methods 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- FARYTWBWLZAXNK-WAYWQWQTSA-N ethyl (z)-3-(methylamino)but-2-enoate Chemical compound CCOC(=O)\C=C(\C)NC FARYTWBWLZAXNK-WAYWQWQTSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- FWQHNLCNFPYBCA-UHFFFAOYSA-N fluoran Chemical compound C12=CC=CC=C2OC2=CC=CC=C2C11OC(=O)C2=CC=CC=C21 FWQHNLCNFPYBCA-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229940098695 palmitic acid Drugs 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
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- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000008053 sultones Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06046—Constructional details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K2019/06215—Aspects not covered by other subgroups
- G06K2019/06281—Aspects not covered by other subgroups rewritable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001172267A JP3478281B2 (ja) | 2001-06-07 | 2001-06-07 | Ｉｃカード |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ZA200309166B true ZA200309166B (en) | 2004-09-17 |
Family
ID=19013915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ZA200309166A ZA200309166B (en) | 2001-06-07 | 2003-11-25 | IC card. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US7131594B2 (zh) |
| EP (1) | EP1394734B1 (zh) |
| JP (1) | JP3478281B2 (zh) |
| CN (1) | CN1270272C (zh) |
| AT (1) | ATE441161T1 (zh) |
| DE (1) | DE60233488D1 (zh) |
| HK (1) | HK1069469A1 (zh) |
| MX (1) | MXPA03011118A (zh) |
| RU (1) | RU2004100242A (zh) |
| WO (1) | WO2002101642A1 (zh) |
| ZA (1) | ZA200309166B (zh) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG106050A1 (en) * | 2000-03-13 | 2004-09-30 | Megic Corp | Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby |
| JP2004185208A (ja) * | 2002-12-02 | 2004-07-02 | Sony Corp | Ｉｃカード |
| JP2004229752A (ja) * | 2003-01-28 | 2004-08-19 | Aruze Corp | ゲーム装置、トレーディングカード及びゲームシステム |
| JP2005014302A (ja) * | 2003-06-24 | 2005-01-20 | Sony Corp | 合成樹脂カード及びその製造方法 |
| JP2005101356A (ja) * | 2003-09-25 | 2005-04-14 | Toshiba Corp | 無線カード |
| KR20060100199A (ko) * | 2003-11-11 | 2006-09-20 | 토레 엔지니어링 가부시키가이샤 | 비접촉 아이디 카드 및 그의 제조 방법 |
| US20050116034A1 (en) * | 2003-11-28 | 2005-06-02 | Masato Satake | Printing system |
| WO2005088697A1 (ja) * | 2004-03-17 | 2005-09-22 | Konica Minolta Photo Imaging, Inc. | Ｉｃカード及びｉｃカードの製造方法 |
| JP2006068143A (ja) * | 2004-08-31 | 2006-03-16 | Aruze Corp | 遊技機および遊技システム |
| US7501381B2 (en) * | 2004-09-14 | 2009-03-10 | Ricoh Company, Ltd. | Reversible thermosensitive recording medium, image processing method, and image processing apparatus |
| US20060151615A1 (en) * | 2005-01-12 | 2006-07-13 | Taiwan Name Plate Co., Ltd. | Radio identifiable mark |
| JP2006277178A (ja) * | 2005-03-29 | 2006-10-12 | Aruze Corp | ゲーム用カード |
| WO2006124400A2 (en) * | 2005-05-13 | 2006-11-23 | University Of Pittsburgh - Of The Commonwealth System Of Higher Education | Method of making an electronic device using an electrically conductive polymer, and associated products |
| US7571862B2 (en) * | 2005-06-02 | 2009-08-11 | Avery Dennison Corporation | RFID tag that provides a flat print area and a pinch roller that enables the same |
| WO2006133380A2 (en) * | 2005-06-07 | 2006-12-14 | University Of Pittsburgh - Of The Commonwealth System Of Higher Education | Manufacturing of electronic devices using conductive polymer |
| DE102005032489B3 (de) * | 2005-07-04 | 2006-11-16 | Schweizer Electronic Ag | Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren |
| JP4123251B2 (ja) * | 2005-07-07 | 2008-07-23 | セイコーエプソン株式会社 | 半導体装置製造用基板、半導体装置の製造方法 |
| US7224278B2 (en) * | 2005-10-18 | 2007-05-29 | Avery Dennison Corporation | Label with electronic components and method of making same |
| DE102005061553B4 (de) * | 2005-12-22 | 2013-07-11 | Infineon Technologies Ag | Chipmodul |
| JP5209602B2 (ja) * | 2006-04-10 | 2013-06-12 | イノベイティア インコーポレイテッド | 電子カードおよび電子タグ用の電子埋込物モジュール |
| US8162231B2 (en) * | 2006-11-01 | 2012-04-24 | Dai Nippon Printing Co., Ltd. | Noncontact IC tag label and method of manufacturing the same |
| US8511571B2 (en) * | 2007-03-19 | 2013-08-20 | Nagraid S.A. | Intermediate product intervening in the manufacturing of electronic cards |
| CN102129601B (zh) * | 2007-03-19 | 2015-03-04 | 纳格雷德股份有限公司 | 具有数字显示器的卡 |
| GB0705287D0 (en) * | 2007-03-20 | 2007-04-25 | Conductive Inkjet Tech Ltd | Electrical connection of components |
| MX2009010232A (es) * | 2007-03-23 | 2009-11-18 | Innovatier Inc | Una tarjeta gradual y metodo para fabricar una tarjeta gradual. |
| WO2009026998A2 (de) * | 2007-08-27 | 2009-03-05 | Att Technology Gmbh | Verbindung eines mit anschlussflächen und bumps versehenen chips mit einem mit metallischen leiterbahnen versehenen substrat |
| WO2009036406A1 (en) * | 2007-09-13 | 2009-03-19 | Nigel Power, Llc | Antennas for wireless power applications |
| CN101946254B (zh) * | 2008-02-22 | 2014-05-07 | 凸版印刷株式会社 | 应答器及册子体 |
| JP2009301099A (ja) * | 2008-06-10 | 2009-12-24 | Toppan Forms Co Ltd | Ｒｆ−ｉｄメディア |
| JP2010044604A (ja) * | 2008-08-13 | 2010-02-25 | Sony Corp | アンテナモジュールおよびアンテナモジュールの製造装置、並びに、非接触ｉｃカードおよび非接触ｉｃカードの製造装置 |
| DE102009009263A1 (de) * | 2009-02-17 | 2010-08-19 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung einer ein Fenster enthaltenden Abschlußschicht für einen tragbaren Datenträger und Abschlußschicht |
| JP5454869B2 (ja) * | 2009-05-11 | 2014-03-26 | 日立化成株式会社 | 非接触式ｉｃカード製造方法及び非接触式ｉｃカード。 |
| TWI407462B (zh) * | 2009-05-15 | 2013-09-01 | Cyntec Co Ltd | 電感器及其製作方法 |
| DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
| EP2461275A1 (en) * | 2010-12-02 | 2012-06-06 | Gemalto SA | Security Document and method of manufacturing security document |
| JP5637004B2 (ja) * | 2011-02-23 | 2014-12-10 | 株式会社村田製作所 | 半導体集積回路モジュール、無線通信モジュール及び無線通信デバイス |
| JP2013206122A (ja) * | 2012-03-28 | 2013-10-07 | Toppan Printing Co Ltd | Ｉｃモジュールとこれを搭載したｉｃカード |
| US9122968B2 (en) * | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US20140042230A1 (en) * | 2012-08-09 | 2014-02-13 | Infineon Technologies Ag | Chip card module with separate antenna and chip card inlay using same |
| JP2014178875A (ja) * | 2013-03-14 | 2014-09-25 | Hitachi Maxell Ltd | Ｉｃパッケージ、ｉｃモジュール、及び、非接触ｉｃカード |
| DE102013105729A1 (de) * | 2013-06-04 | 2014-12-04 | Infineon Technologies Ag | Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls |
| JP6056978B2 (ja) * | 2013-08-15 | 2017-01-11 | 富士通株式会社 | Ｒｆｉｄタグ及びその製造方法 |
| JP6713289B2 (ja) * | 2016-01-28 | 2020-06-24 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
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| US5581445A (en) * | 1994-02-14 | 1996-12-03 | Us3, Inc. | Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |
| JPH1185938A (ja) * | 1997-07-17 | 1999-03-30 | Denso Corp | Ｉｃカード |
| JPH11353442A (ja) * | 1998-06-11 | 1999-12-24 | Toppan Printing Co Ltd | 可逆性感熱記録層付き非接触ｉｃカード |
| JP2000076110A (ja) | 1998-08-28 | 2000-03-14 | Hitachi Ltd | 分散ファイルシステムにおける回復処理システム |
| JP2000099678A (ja) * | 1998-09-18 | 2000-04-07 | Hitachi Ltd | Ｉｃカード及びその製造方法 |
| JP2000113141A (ja) * | 1998-10-01 | 2000-04-21 | Mitsubishi Plastics Ind Ltd | 非接触式ｉｃカード |
| US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
| JP2000141957A (ja) | 1998-11-05 | 2000-05-23 | Toppan Forms Co Ltd | 熱可逆性表示部を有するカード |
| US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
| JP2000276567A (ja) | 1999-03-26 | 2000-10-06 | Hitachi Ltd | 非接触ｉｃカード |
| JP3513452B2 (ja) * | 1999-07-02 | 2004-03-31 | 新光電気工業株式会社 | 非接触型ｉｃカードと非接触型ｉｃカードの製造方法と非接触型ｉｃカード用平面コイル |
-
2001
- 2001-06-07 JP JP2001172267A patent/JP3478281B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-30 CN CN02814246.2A patent/CN1270272C/zh not_active Expired - Fee Related
- 2002-05-30 DE DE60233488T patent/DE60233488D1/de not_active Expired - Lifetime
- 2002-05-30 EP EP02730779A patent/EP1394734B1/en not_active Expired - Lifetime
- 2002-05-30 WO PCT/JP2002/005265 patent/WO2002101642A1/ja active Application Filing
- 2002-05-30 MX MXPA03011118A patent/MXPA03011118A/es unknown
- 2002-05-30 RU RU2004100242/09A patent/RU2004100242A/ru not_active Application Discontinuation
- 2002-05-30 US US10/479,915 patent/US7131594B2/en not_active Expired - Lifetime
- 2002-05-30 AT AT02730779T patent/ATE441161T1/de not_active IP Right Cessation
-
2003
- 2003-11-25 ZA ZA200309166A patent/ZA200309166B/en unknown
-
2005
- 2005-03-07 HK HK05101951A patent/HK1069469A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATE441161T1 (de) | 2009-09-15 |
| JP2002366922A (ja) | 2002-12-20 |
| WO2002101642A1 (en) | 2002-12-19 |
| JP3478281B2 (ja) | 2003-12-15 |
| HK1069469A1 (en) | 2005-05-20 |
| EP1394734A1 (en) | 2004-03-03 |
| CN1270272C (zh) | 2006-08-16 |
| US7131594B2 (en) | 2006-11-07 |
| CN1529872A (zh) | 2004-09-15 |
| MXPA03011118A (es) | 2004-03-19 |
| RU2004100242A (ru) | 2005-06-10 |
| EP1394734A4 (en) | 2004-08-25 |
| EP1394734B1 (en) | 2009-08-26 |
| DE60233488D1 (de) | 2009-10-08 |
| US20040169086A1 (en) | 2004-09-02 |
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