WO2022032778A1 - 拼接显示屏 - Google Patents

拼接显示屏 Download PDF

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Publication number
WO2022032778A1
WO2022032778A1 PCT/CN2020/113888 CN2020113888W WO2022032778A1 WO 2022032778 A1 WO2022032778 A1 WO 2022032778A1 CN 2020113888 W CN2020113888 W CN 2020113888W WO 2022032778 A1 WO2022032778 A1 WO 2022032778A1
Authority
WO
WIPO (PCT)
Prior art keywords
display screen
metal
circuit board
spliced display
spliced
Prior art date
Application number
PCT/CN2020/113888
Other languages
English (en)
French (fr)
Inventor
向昌明
Original Assignee
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tcl华星光电技术有限公司 filed Critical Tcl华星光电技术有限公司
Priority to US17/053,735 priority Critical patent/US11979984B2/en
Publication of WO2022032778A1 publication Critical patent/WO2022032778A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present application relates to the field of display technology, in particular to a splicing display screen.
  • the present application provides a spliced display screen, so as to solve the problem that the splicing seam of the spliced display screen is too large in the prior art, and improve the display effect of the spliced display screen.
  • the application provides a splicing display screen, which includes:
  • circuit board has a plurality of circuit areas, each circuit area includes a mounting area and an electrical connection area, and a plurality of first metal parts are arranged in the electrical connection area;
  • the display panels include metal connection pads disposed on the display surface of the display panel;
  • a plurality of first metal lines, the metal connection pads are electrically connected to the first metal part through the first metal lines.
  • the spliced display screen further includes a plurality of adhesive parts, the adhesive parts are located in the installation area of the circuit board, and the adhesive parts are adhered to the circuit board and the circuit board. between the display panels.
  • the circuit board further includes a binding area, the binding area is located on the side of the circuit board, and the binding area is provided with a plurality of second metal parts.
  • the spliced display screen further includes at least one chip-on-film, and the chip-on film is bound to the binding area and electrically connected to the second metal part.
  • the spliced display screen further includes a sealing layer, and the sealing layer covers the circuit board, the display panel, the first metal part and the first metal String.
  • the distance between every two adjacent display panels is 7 micrometers to 50 micrometers.
  • the display panel includes a substrate and light-emitting diodes, and the light-emitting diodes are arranged on the substrate.
  • the thickness of the adhesive portion is 100-200 microns.
  • the thickness of the first metal portion is 0.2 micrometers to 0.5 micrometers.
  • the diameter of the first metal wire is 1 ⁇ m-49 ⁇ m.
  • the spliced display screen further includes a via hole, the via hole penetrates the circuit board to expose the plurality of display panels, and the via hole is located in the installation area.
  • the spliced display screen further includes at least one chip-on film, and the chip-on film is located on a side of the circuit board away from the display panel.
  • the spliced display screen further includes a second metal wire, the second metal wire is arranged on the circuit board and in the via hole, and the second metal wire is electrically connecting the first metal portion and the chip on film.
  • the spliced display screen further includes a through hole, the through hole penetrates the circuit board, and the through hole is located in the binding area.
  • the spliced display screen further includes a second metal wire, the second metal wire is arranged on the circuit board and in the through hole, and the second metal wire is electrically connecting the second metal portion and the chip on film.
  • the present application provides a spliced display screen, including a circuit board, a plurality of display panels and a plurality of first metal wires, the circuit board has a plurality of circuit areas, each circuit area includes a mounting area and an electrical connection area, in the electrical A plurality of first metal parts are arranged in the connection area, each of the display panels is arranged on the circuit board and in the installation area, the display panel includes a metal connection pad arranged on the display surface of the display panel, the The metal connection pad is electrically connected to the first metal part through the first metal wire.
  • the metal connection pad on the display panel is electrically connected with the first metal part on the electrical connection circuit board through the first metal wire, so as to reduce the gap of the splicing seam.
  • FIG. 1 is a cross-sectional view of the first structure of the spliced display screen provided by the application.
  • FIG. 2 is a cross-sectional view of a second structure of the spliced display screen provided by the present application.
  • FIG. 3 is a cross-sectional view of a third structure of the spliced display screen provided by the present application.
  • FIG. 4 is a cross-sectional view of a fourth structure of the spliced display screen provided by the present application.
  • FIG. 1 is a cross-sectional view of the first structure of the spliced display screen provided by the present application.
  • the present application provides a spliced display screen 10 .
  • the spliced display screen 10 includes a circuit board 100 , a plurality of display panels 200 and a plurality of first metal wires 300 .
  • the circuit board 100 includes several circuit areas 110 and bonding areas 120 .
  • Each circuit area 110 includes a mounting area 111 and an electrical connection area 112 .
  • a plurality of first metal parts 400 are provided in the electrical connection region 112 .
  • the thickness D of the first metal portion 400 is 0.2 micrometers to 0.5 micrometers. Specifically, the thickness D of the first metal portion 400 may be 0.24 microns, 0.3 microns, and 0.45 microns.
  • the binding area 120 is located on the side of the circuit board 100 .
  • the binding area 120 is provided with a plurality of second metal parts 500 .
  • the spliced display screen 10 further includes a plurality of adhesive parts 600 .
  • the adhesive portion 600 is located in the mounting area 111 of the circuit board 100 .
  • the thickness H of the adhesive portion 600 is 100 micrometers to 200 micrometers.
  • the thickness H of the adhesive portion 600 may be 103 microns, 135 microns, 187 microns, or 196 microns.
  • the display panel 200 includes metal connection pads 210 disposed on the display surface 201 of the display panel 200 .
  • the distance L between every two adjacent display panels 200 is 7 micrometers to 50 micrometers. Specifically, the distance L between every two adjacent display panels 200 may be 8 microns, 20 microns, 27 microns, 39 microns, or 47 microns.
  • the display panel 200 includes a substrate 220 and light emitting diodes 230 .
  • the array of light emitting diodes 230 is disposed on the substrate 220 . Adhering the display panel with the adhesive part to the circuit board can make the device structure more compact.
  • the spliced display screen 10 further includes at least one chip on film 700 .
  • the chip on film 700 is bound to the binding region 120 and is electrically connected to the second metal portion 500 .
  • the metal connection pad 210 is electrically connected to the first metal part 400 through the first metal wire 300 .
  • the metal connection pad 210 is electrically connected to the second metal part 500 through the first metal wire.
  • the diameter R of the first metal wire 300 is 1 ⁇ m to 49 ⁇ m.
  • the diameter R of the first metal wire 300 may be 8 microns, 27 microns, 31 microns, 42 microns, or 45 microns, or the like.
  • the spliced display screen 10 further includes an encapsulant layer 800 .
  • the encapsulant layer 800 covers the circuit board 100 , the display panel 200 , the first metal portion 400 and the first metal wire 300 .
  • the first metal part is electrically connected to the metal connection pads on the display panel through the first metal wire, the driving signal is input into the plane, and then led out by the chip-on-film on the circuit board, so as to drive the display panel normally It can reduce the phenomenon that the splicing seam is too large due to the existence of the chip on film during splicing, thereby improving the display effect of the splicing display screen; and the first metal wire process can be compatible with the position accuracy within the resolution range.
  • FIG. 2 is a cross-sectional view of a second structure of the spliced display screen provided by the present application.
  • the mosaic display 10 in FIG. 2 further includes a second metal line 900 , a via hole 101 and a through hole 102 .
  • the via hole 101 is located in the mounting area 111 .
  • the through hole 102 is located in the binding area 120 .
  • the via hole 101 and the through hole 102 penetrate through the circuit board 100 .
  • the chip on film 700 is disposed on the bottom of the circuit board 100 .
  • the second metal wire 900 is disposed on the circuit board 100 and in the via hole 101 .
  • the first metal portion 400 is electrically connected to the chip on film 700 at the bottom of the circuit board 100 through the second metal wire 900 .
  • the second metal wire 900 is disposed in the through hole 102 on the circuit board 100 .
  • the second metal portion 500 is electrically connected to the chip on film 700 at the bottom of the circuit board 100 through the second metal wire 900 .
  • Other structures are shown in FIG. 1 and will not be repeated here.
  • the first metal portion is electrically connected to the metal connection pads on the display panel through the first metal wire, the driving signal is input into the plane, and the second metal wire is used to connect the chip on film to the first metal connection pad.
  • a metal part and the second metal part are electrically connected, so as to drive the display panel to work normally, avoid the voltage drop caused by the circuit being too long, and reduce the phenomenon that the splicing seam is too large due to the existence of the chip on film during splicing.
  • the display effect of the spliced display screen is improved and the cost is saved; and the first metal wire process can be compatible with the position accuracy within the resolution range.
  • FIG. 3 is a cross-sectional view of a third structure of the spliced display screen provided by the present application. It should be noted that the difference between FIG. 3 and FIG. 2 is that no punching design is performed on the binding area 120 , the chip on film 700 is not disposed on the bottom of the circuit board 100 , and the The chip on film 700 is electrically connected to the second metal portion 500 . No punching design is required to further reduce production costs.
  • FIG. 4 is a cross-sectional view of a fourth structure of the spliced display screen provided by the present application.
  • the difference between FIG. 4 and FIG. 2 is that the second metal wire 900 is directly filled in the via hole 101 and the through hole 102 , and is electrically connected to the bottom of the circuit board 100 The chip-on-film 700. The voltage drop caused by too long circuit is further avoided. And reduce the phenomenon that the splicing seam is too large due to the existence of the chip on film during splicing, thereby improving the display effect of the splicing display screen and saving the cost; and the first metal wire process can be compatible with the position accuracy within the resolution range.
  • the present application provides a spliced display screen
  • the spliced display screen includes a circuit board, a plurality of display panels and a plurality of first metal wires
  • the circuit board has a plurality of circuit areas, and each circuit area includes a mounting area and an electrical connection area , a plurality of first metal parts are arranged in the electrical connection area
  • each of the display panels is arranged on the circuit board and in the installation area
  • the display panel includes a metal part arranged on the display surface of the display panel A connection pad, the metal connection pad is electrically connected to the first metal part through a first metal wire.
  • the metal connection pad on the display panel is electrically connected to the first metal part on the electrical connection circuit board through the first metal wire, so as to reduce the gap of the splicing seam, thereby improving the display effect of the spliced display screen.

Abstract

一种拼接显示屏（10），包括电路板（100）、若干显示面板（200）以及若干第一金属线（300），电路板（100）具有若干电路区域（110），每一电路区域（110）包括一安装区域（111）和一电连接区域（112），在电连接区域（112）设置有若干第一金属部（400），每一显示面板（200）设置于电路板（100）且位于安装区域（111），显示面板（200）上的金属连接垫（210），金属连接垫（210）通过第一金属线（300）与第一金属部（400）电连接。

Description

拼接显示屏 技术领域
本申请涉及显示技术领域，具体涉及一种拼接显示屏。
 背景技术
目前，传统显示屏均需通过覆晶薄膜或柔性电路板绑定的模组工艺将面板所需讯号输入到面内。因面板设计上通常需要先通过扇形区将面内信号线进行收束，将其集中到一小块绑定区域，再将覆晶薄膜或柔性电路板绑定在绑定区域，在印刷电路板和玻璃基板之间形成电性连接，从而使得键合区宽度通常较大。进一步的，键合区过大时，会影响显示屏的外观品位，若用于拼接屏用途时，会有明显的拼缝，进而影响拼接显示的效果。由于覆晶薄膜或柔性电路板基材聚酰亚胺具有良好的回弹性，不易弯折，也会增加拼缝，影响拼接显示的效果。
 技术问题
本申请提供一种拼接显示屏，以解决现有技术中拼接显示屏拼接缝过大的问题，提高拼接显示屏的显示效果。
 技术解决方案
本申请提供一种拼接显示屏，其包括：
电路板，所述电路板具有若干电路区域，每一电路区域包括一安装区域和一电连接区域，在所述电连接区域设置有若干第一金属部；
若干显示面板，每一所述显示面板设置于所述电路板且位于所述安装区域，所述显示面板包括设置于所述显示面板的显示面的金属连接垫；以及
若干第一金属线，所述金属连接垫通过第一金属线与所述第一金属部电连接。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括若干胶黏部，所述胶黏部位于所述电路板的安装区域，所述胶黏部黏接于所述电路板和所述显示面板之间。
在本申请所提供的拼接显示屏中，所述电路板还包括绑定区域，所述绑定区域位于所述电路板的侧边，所述绑定区域设置有若干第二金属部。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括至少一个覆晶薄膜，所述覆晶薄膜绑定于所述绑定区域，且与所述第二金属部电连接。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括封胶层，所述封胶层覆盖所述电路板、所述显示面板、所述第一金属部以及所述第一金属线。
在本申请所提供的拼接显示屏中，所述每两相邻的所述显示面板之间的距离为7微米-50微米。
在本申请所提供的拼接显示屏中，所述显示面板包括基板和发光二极管，所述发光二极管设置于所述基板上。
在本申请所提供的拼接显示屏中，所述胶黏部的厚度为100微米-200微米。
在本申请所提供的拼接显示屏中，所述第一金属部的厚度为0.2微米-0.5微米。
在本申请所提供的拼接显示屏中，所述第一金属线的直径为1微米-49微米。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括过孔，所述过孔贯穿所述电路板以暴露所述若干显示面板，所述过孔位于所述安装区域。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括至少一个覆晶薄膜，所述覆晶薄膜位于所述电路板远离所述显示面板的一侧。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括第二金属线，所述第二金属线设置于所述电路板上以及所述过孔中，所述第二金属线电连接所述第一金属部以及所述覆晶薄膜。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括通孔，所述通孔贯穿所述电路板，所述通孔位于所述绑定区域。
在本申请所提供的拼接显示屏中，所述拼接显示屏还包括第二金属线，所述第二金属线设置于所述电路板上以及所述通孔中，所述第二金属线电连接所述第二金属部以及所述覆晶薄膜。
 有益效果
本申请提供一种拼接显示屏，包括电路板、若干显示面板以及若干第一金属线，所述电路板具有若干电路区域，每一电路区域包括一安装区域和一电连接区域，在所述电连接区域设置有若干第一金属部，每一所述显示面板设置于所述电路板且位于所述安装区，所述显示面板包括设置于所述显示面板的显示面的金属连接垫，所述金属连接垫通过第一金属线与所述第一金属部电连接。通过第一金属线将显示面板上的金属连接垫与电连接电路板上的第一金属部电连接，减小拼接缝的缝隙。
 附图说明
为了更清楚地说明本申请中的技术方案，下面将对实施方式描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请提供的拼接显示屏的第一种结构剖视图。
图2为本申请提供的拼接显示屏的第二种结构剖视图。
图3为本申请提供的拼接显示屏的第三种结构剖视图。
图4为本申请提供的拼接显示屏的第四种结构剖视图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，图1为本申请提供的拼接显示屏的第一种结构剖视图。本申请提供一种拼接显示屏10。所述拼接显示屏10包括电路板100、若干显示面板200以及若干第一金属线300。
所述电路板100包括若干电路区域110和绑定区域120。每一电路区域110包括一安装区域111和一电连接区域112。在所述电连接区域112设置有若干第一金属部400。所述第一金属部400的厚度D为0.2微米-0.5微米。具体的，所述第一金属部400的厚度D可以为0.24微米、0.3微米和0.45微米等。所述绑定区域120位于所述电路板100的侧边。所述绑定区域120设置有若干第二金属部500。
在一实施例中，所述拼接显示屏10还包括若干胶黏部600。所述胶黏部600位于所述电路板100的安装区域111。所述胶黏部600的厚度H为100微米-200微米。所述胶黏部600的厚度H可以为103微米、135微米、187微米或196微米等。
每一所述显示面板200黏接于一所述胶黏部600上。所述显示面板200包括设置于所述显示面板200的显示面201的金属连接垫210。所述每两相邻的所述显示面板200之间的距离L为7微米-50微米。具体的，所述每两相邻的所述显示面板200之间的距离L可以为8微米、20微米、27微米、39微米或47微米等。所述显示面板200包括基板220和发光二极管230。所述发光二极管230阵列设置于所述基板220上。将显示面板用胶黏部粘接与电路板上，可以使得器件结构更加紧凑。
在一实施例中，所述拼接显示屏10还包括至少一个覆晶薄膜700。所述覆晶薄膜700绑定于所述绑定区域120，且与所述第二金属部500电连接。
通过所述第一金属线300将所述金属连接垫210与所述第一金属部400电连接。所述金属连接垫210通过所述第一金属线与所述第二金属部500电连接。所述第一金属线300的直径R为1微米-49微米。所述第一金属线300的直径R可以为8微米、27微米、31微米、42微米或45微米等。
在一实施例中，所述拼接显示屏10还包括封胶层800。所述封胶层800覆盖所述电路板100、所述显示面板200、所述第一金属部400以及所述第一金属线300。
在本申请中，通过第一金属线将第一金属部与显示面板上的金属连接垫电连接，将驱动讯号输入到面内，再由电路板上的覆晶薄膜引出，进而驱动显示面板正常工作，减小拼接时因覆晶薄膜的存在导致拼接缝过大现象，进而提高了拼接显示屏的显示效果；并且，第一金属线工艺可以兼容该分辨率范围内的位置精度。
请参阅图2，图2为本申请提供的拼接显示屏的第二种结构剖视图。需要说明的是，图2与图1 的不同之处在于：图2中的拼接显示屏10还包括第二金属线900、过孔101以及通孔102。所述过孔101位于所述安装区域111。所述通孔102位于所述绑定区域120。所述过孔101以及所述通孔102贯穿所述电路板100。所述覆晶薄膜700设置于所述电路板100的底部。所述第二金属线900设置于所述电路板100上以及所述过孔101中。所述第一金属部400通过所述第二金属线900与所述电路板100底部的覆晶薄膜700电连接。在所述绑定区域120，所述第二金属线900设置于所述电路板100上一所述所述通孔102中。所述第二金属部500通过所述第二金属线900与所述电路板100底部的覆晶薄膜700电连接。其他结构如图1所示，此处不再赘述。
在本申请中，通过第一金属线将第一金属部与显示面板上的金属连接垫电连接，将驱动讯号输入到面内，再通过第二金属线将所述覆晶薄膜与所述第一金属部以及所述第二金属部电连接，进而驱动显示面板正常工作，避免电路过长造成的压降，并减小拼接时因覆晶薄膜的存在导致拼接缝过大现象，进而提高了拼接显示屏的显示效果以及节约成本；并且，第一金属线工艺可以兼容该分辨率范围内的位置精度。
请参阅图3，图3为本申请提供的拼接显示屏的第三种结构剖视图。需要说明的是，图3与图2 的不同之处在于：所述绑定区域120上不进行打孔设计，所述覆晶薄膜700不设置于所述电路板100的底部，直接将所述覆晶薄膜700与所述第二金属部500电连接。不进行打孔设计，进一步降低生产成本。
请参阅图4，图4为本申请提供的拼接显示屏的第四种结构剖视图。需要说明的是，图4与图2 的不同之处在于：所述第二金属线900直接填充于所述过孔101以及所述通孔102中，并电连接设置于所述电路板100底部的覆晶薄膜700。进一步避免了因电路过长造成的压降。并减小拼接时因覆晶薄膜的存在导致拼接缝过大现象，进而提高了拼接显示屏的显示效果以及节约成本；并且，第一金属线工艺可以兼容该分辨率范围内的位置精度。
本申请提供一种拼接显示屏，所述拼接显示屏包括电路板、若干显示面板以及若干第一金属线，所述电路板具有若干电路区域，每一电路区域包括一安装区域和一电连接区域，在所述电连接区域设置有若干第一金属部，每一所述显示面板设置于所述电路板且位于所述安装区域，所述显示面板包括设置于所述显示面板的显示面的金属连接垫，所述金属连接垫通过第一金属线与所述第一金属部电连接。通过第一金属线将显示面板上的金属连接垫与电连接电路板上的第一金属部电连接，减小拼接缝的缝隙，进而提高拼接显示屏的显示效果。
以上对本申请实施方式提供了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施方式的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (15)

  1. 一种拼接显示屏，其包括：
    电路板，所述电路板具有若干电路区域，每一电路区域包括一安装区域和一电连接区域，在所述电连接区域设置有若干第一金属部；
    若干显示面板，每一所述显示面板设置于所述电路板且位于所述安装区域，所述显示面板包括设置于所述显示面板的显示面的金属连接垫；以及
    若干第一金属线，所述金属连接垫通过第一金属线与所述第一金属部电连接。
  2. 如权利要求1所述的拼接显示屏，其中，所述拼接显示屏还包括若干胶黏部，所述胶黏部位于所述电路板的安装区域，所述胶黏部黏接于所述电路板和所述显示面板之间。
  3. 如权利要求1所述的拼接显示屏，其中，所述电路板还包括绑定区域，所述绑定区域位于所述电路板的侧边，所述绑定区域设置有若干第二金属部。
  4. 如权利要求3所述的拼接显示屏，其中，所述拼接显示屏还包括至少一个覆晶薄膜，所述覆晶薄膜绑定于所述绑定区域，且与所述第二金属部电连接。
  5. 如权利要求1所述的拼接显示屏，其中，所述拼接显示屏还包括封胶层，所述封胶层覆盖所述电路板、所述显示面板、所述第一金属部以及所述第一金属线。
  6. 如权利要求1所述的拼接显示屏，其中，所述每两相邻的所述显示面板之间的距离为7微米-50微米。
  7. 如权利要求1所述的拼接显示屏，其中，所述显示面板包括基板和发光二极管，所述发光二极管设置于所述基板上。
  8. 如权利要求1所述的拼接显示屏，其中，所述胶黏部的厚度为100微米-200微米。
  9. 如权利要求1所述的拼接显示屏，其中，所述第一金属部的厚度为0.2微米-0.5微米。
  10. 如权利要求1所述的拼接显示屏，其中，所述第一金属线的直径为1微米-49微米。
  11. 如权利要求1所述的拼接显示屏，其中，所述拼接显示屏还包括过孔，所述过孔贯穿所述电路板以暴露所述若干显示面板，所述过孔位于所述安装区域。
  12. 如权利要求11所述的拼接显示屏，其中，所述拼接显示屏还包括至少一个覆晶薄膜，所述覆晶薄膜位于所述电路板远离所述显示面板的一侧。
  13. 如权利要求12所述的拼接显示屏，其中，所述拼接显示屏还包括第二金属线，所述第二金属线设置于所述电路板上以及所述过孔中，所述第二金属线电连接所述第一金属部以及所述覆晶薄膜。
  14. 如权利要求12所述的拼接显示屏，其中，所述拼接显示屏还包括通孔，所述通孔贯穿所述电路板，所述通孔位于所述绑定区域。
  15. 如权利要求14所述的拼接显示屏，其中，所述拼接显示屏还包括第二金属线，所述第二金属线设置于所述电路板上以及所述通孔中，所述第二金属线电连接所述第二金属部以及所述覆晶薄膜。
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