WO2022082651A1 - 显示装置 - Google Patents

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Publication number
WO2022082651A1
WO2022082651A1 PCT/CN2020/122972 CN2020122972W WO2022082651A1 WO 2022082651 A1 WO2022082651 A1 WO 2022082651A1 CN 2020122972 W CN2020122972 W CN 2020122972W WO 2022082651 A1 WO2022082651 A1 WO 2022082651A1
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WO
WIPO (PCT)
Prior art keywords
pads
pad
row
length
display device
Prior art date
Application number
PCT/CN2020/122972
Other languages
English (en)
French (fr)
Other versions
WO2022082651A9 (zh
Inventor
龚雪瑞
喻勇
张昌
汪江胜
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to DE112020007231.2T priority Critical patent/DE112020007231T5/de
Priority to PCT/CN2020/122972 priority patent/WO2022082651A1/zh
Priority to US17/427,420 priority patent/US11886085B2/en
Priority to CN202080002412.2A priority patent/CN115605994A/zh
Publication of WO2022082651A1 publication Critical patent/WO2022082651A1/zh
Publication of WO2022082651A9 publication Critical patent/WO2022082651A9/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body

Definitions

  • the present disclosure relates to the field of display devices, and in particular, to a display device.
  • Mobile phones, monitors, etc. are common display devices in life, and the display devices can display rich picture information.
  • the display device includes a display panel and a circuit connector, where the circuit connector may be COF (English: Chip on film, Chinese: chip on film) or FPC (English: Flexible Printed Circuit, Chinese: flexible circuit board).
  • the display panel usually has a bonding area, the bonding area is located at the edge of the display panel, and the COF or FPC is bound and connected to the display panel in the bonding area.
  • Embodiments of the present disclosure provide a display device, including a display panel and a circuit connector bound and connected to the display panel;
  • the circuit connector includes a flexible substrate and a binding structure, and the edge of the flexible substrate has a first binding area;
  • the bonding structure is located in the first bonding area, the bonding structure includes a first row of pads and a second row of pads, and the first row of pads includes a plurality of pads arranged along an edge of the flexible substrate. a first pad, the second row of pads is located on the side of the first row of pads close to the middle of the flexible substrate, the second row of pads includes an arrangement along the plurality of first pads a plurality of second pads arranged in the direction;
  • the length of the first pad is less than the length of the second pad, and the first direction is the arrangement direction of the first row of pads and the second row of pads;
  • the edge of the display panel has a second binding area, the first binding area is bound with the second binding area, and the orthographic projection of the plurality of first pads on the display panel is located at the In the second binding area, a third row of pads and a fourth row of pads are distributed in the second binding area, and the third row of pads includes a one-to-one correspondence with the plurality of first pads a plurality of third pads, the fourth row of pads includes a plurality of fourth pads connected to the plurality of second pads in a one-to-one correspondence, and in the first direction, the third pads The length of the pad is the same as the length of the fourth pad.
  • the ratio of the length of the first pad to the length of the second pad is 8:10 ⁇ 9:10.
  • the ratio of the length of the first pad to the length of the second pad is 8:9.
  • the length of the first pad is 800 ⁇ m
  • the length of the second pad is 900 ⁇ m.
  • the ratio of the distance between the first row of pads and the second row of pads to the length of the first pad is 1:10 ⁇ 1.5:10 .
  • the distance between the adjacent first pads located in the middle is greater than that between the adjacent first pads located on both sides.
  • the distance between the adjacent second pads located in the middle is greater than the distance between the adjacent second pads located on both sides.
  • the distance between the first row of pads and the second row of pads, the distance between the third row of pads and the fourth row of pads is 2:5 to 3:5.
  • the ratio of the length of the third pad to the length of the first pad is 7:20 ⁇ 8:20, and the length of the fourth pad is the same as the length of the first pad.
  • the ratio of the lengths of the second pads is 3:10 ⁇ 4:10.
  • the spacing between adjacent third pads is the same;
  • the distances between the adjacent fourth pads are the same.
  • the width of the third pad is greater than the width of the first pad
  • the width of the fourth pad is greater than the width of the second pad
  • the second pad The direction is parallel to the surface of the flexible substrate and perpendicular to the first direction.
  • the width of the first pad is 13 ⁇ m
  • the width of the second pad is 13 ⁇ m
  • the included angle between the length direction of the first pad and the first direction is 0° ⁇ 10°, and the plurality of first pads are symmetrical with respect to the center line of the first bonding area distribution, the centerline extends along the first direction;
  • the included angle between the length direction of the second pad and the first direction is 0° ⁇ 10°, and the plurality of second pads are symmetrically distributed with respect to the center line of the first bonding area.
  • extension lines of the plurality of first pads in the length direction intersect at one point;
  • extension lines of the plurality of second pads in the longitudinal direction intersect at one point.
  • the flexible substrate is covered with a solder resist, the solder resist is located outside the first binding area, and an orthographic projection of the solder resist on the plane where the display panel is located is located outside the display panel.
  • the circuit connector is a chip on film or a flexible circuit board.
  • a driver integrated circuit is arranged on the display panel, or a driver integrated circuit is arranged on the chip on film;
  • the driving integrated circuit is a quadruple high-definition resolution integrated circuit QHD-IC.
  • the length of the first pad is smaller than the length of the second pad, which is beneficial to prevent the first pad from extending to the wiring area of the display panel and ensure multiple first pads.
  • the orthographic projection of the pad on the display panel is located in the second binding area, so as to avoid the situation that the wiring area of the display panel is short-circuited by the first pad.
  • FIG. 1 is a top view of a display device in the related art
  • Fig. 2 is a partial enlarged schematic diagram within the range of the dotted line in Fig. 1;
  • FIG. 3 is a cross-sectional view of a chip-on-film
  • FIG. 4 is a schematic diagram of a partial structure of a display panel
  • FIG. 5 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of a partial structure of a chip-on-film provided by an embodiment of the present disclosure
  • FIG. 7 is a schematic diagram of binding between a first binding area and a second binding area provided by an embodiment of the present disclosure
  • FIG. 8 is a schematic structural diagram of another display device provided by an embodiment of the present disclosure.
  • Words like "connected” or “connected” are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Up”, “Down”, “Left”, “Right”, etc. are only used to indicate the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
  • FIG. 1 is a top view of a display device in the related art.
  • the display device includes a display panel 20 and a circuit connector bound and connected to the display panel 20 .
  • the circuit connector here may be a chip on film COF or a flexible circuit board FPC; for example, as shown in FIG. 1 , the chip on film 10 is bound on the display panel 20 .
  • the display device generally includes a display device in a COF (English: Chip On Film, Chinese: chip on film) packaging process and a display device in a COP (English: Chip On Panel, Chinese: chip on a panel) packaging process.
  • the display driver integrated circuit (IC) 14 of the display device using the COF packaging process is located on the COF 10; one end of the COF 10 is bound and connected to the display panel 20, and the other end is bound and connected to a circuit board, which may be a PCB (English: Printed Circuit). Board, Chinese: printed circuit board), or FPC.
  • the drive IC 14 of the display device in the COP packaging process is located on the display panel 20 ; the display panel 20 is directly bound and connected to the flexible circuit board FPC.
  • FIG. 2 is a partial enlarged schematic diagram within the range of the dotted line in FIG. 1 .
  • the embodiment of the present disclosure is described by taking a display device using a COF packaging process as an example.
  • FIG. 3 is a cross-sectional view of the chip-on-chip film, and FIG. 3 shows a section I-I in FIG. 2 .
  • the chip on film 10 includes a flexible substrate 11 and a binding structure 12 .
  • the bonding structure 12 includes a plurality of first pads 121 and a plurality of second pads 122; the first pads 121 and the second pads 122 are located on the metal wiring layer of the flip-chip film, and are exposed through openings on the protective layer , which can be electrically connected with the display panel 20 .
  • FIG. 4 is a schematic diagram of a partial structure of a display panel. As shown in FIG. 4 , there is a second binding area 201 at the edge of one side of the display panel 20 , and a wiring area 202 inside the second binding area 201 (ie, the side near the middle of the display panel 20 ). A plurality of third pads 210 and a plurality of fourth pads 220 are distributed in the second bonding area 201 . There are also a plurality of signal lines 230 distributed on the display panel 20 . The third pad 210 and the fourth pad 220 are respectively connected to the signal lines 230 , and the signal lines 230 extend from the second bonding area 201 to the wiring area 202 .
  • the same signal line 230 may include two sections, one of which is located on the surface of the display panel 20 , and the other section is located in the display panel 20 , and the two sections are connected through a via hole 240 .
  • the distribution of the signal lines 230 and the via holes 240 shown in FIG. 4 is only for illustration. For different display panels, the distribution of the signal lines 230 and the via holes 240 will also be different.
  • the first bonding area 101 is bound to the second bonding area 201 , the plurality of first pads 121 are connected to the plurality of third pads 210 in one-to-one correspondence, and the plurality of second pads 122 are connected to the plurality of fourth pads 220 one-to-one connection.
  • the width D of the second bonding area 201 has to be set smaller, so that during bonding, a part of the first pad 121 may be It will enter the routing area 202 .
  • FIG. 4 schematically shows a first pad 121 partially entering the wiring area 202 , and the part of the first pad 121 entering the wiring area 202 may contact the via hole 240 , resulting in a short circuit of the signal line 230 .
  • FIG. 5 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • the display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, and a navigator.
  • the display device includes a display panel 20 and a circuit connector bound and connected to the display panel 20 .
  • the circuit connector in the embodiment of the present disclosure may be a chip on film or a flexible circuit board.
  • the solution in the present disclosure will be described by taking the circuit connection member as the chip-on-film 10 as an example.
  • FIG. 6 is a partial structural schematic diagram of a chip on film provided by an embodiment of the present disclosure.
  • the chip on film 10 includes a flexible substrate 11 and a binding structure 12 , and the edge of the flexible substrate 11 has a first binding area 101 .
  • the bonding structure 12 is located in the first bonding area 101, and the bonding structure 12 includes a first row of pads 12a and a second row of pads 12b.
  • the first row of pads 12a includes a plurality of first pads 121 arranged along the edge of the flexible substrate 11, the second row of pads 12b is located on the side of the first row of pads 12a close to the middle of the flexible substrate 11, and the second row of pads 12b
  • the pads 12 b include a plurality of second pads 122 arranged along the arrangement direction of the plurality of first pads 121 .
  • the length m of the first pad 121 is smaller than the length n of the second pad 122 .
  • the first direction A is the arrangement direction of the first row of pads 12a and the second row of pads 12b.
  • the edge of the display panel 20 has a second binding area 201 .
  • the dotted line b in FIG. 5 is the boundary line between the second binding area 201 and the wiring area 202 .
  • FIG. 7 is a schematic diagram of binding between a first binding area and a second binding area provided by an embodiment of the present disclosure.
  • the third row of pads 21 a includes a plurality of third pads 210 connected to the plurality of first pads 121 in a one-to-one correspondence
  • the fourth row of pads 22 a includes a plurality of second pads 122 A plurality of fourth pads 220 are connected correspondingly.
  • the length d of the third pad 210 is the same as the length e of the fourth pad 220 .
  • the chip on film 10 and the display panel 20 are usually connected in an OLB (English: Outer Lead Bonding, Chinese: Outer Lead Bonding) process.
  • OLB Organic Lead Bonding
  • the chip on film 10 and the surface to be contacted with the display panel 20 are arranged Anisotropic Conductive Film (English: Anisotropic Conductive Film, abbreviation: ACF)
  • the first binding area 101 refers to the area on the chip on film 10 in contact with the anisotropic conductive film
  • the second binding area 201 refers to The area on the display panel 20 in contact with the anisotropic conductive adhesive film.
  • the length of the first pad is smaller than the length of the second pad, which is beneficial to prevent the first pad from extending to the wiring area of the display panel , to ensure that the orthographic projections of the plurality of first pads on the display panel are located in the second binding area, so as to prevent the wiring area of the display panel from being short-circuited by the first pads.
  • the flexible substrate 11 may be covered with a solder resist 13 (the filled area in FIG. 6 ), the solder resist 13 is located outside the first binding area 101 , and the orthographic projection of the solder resist 13 on the plane where the display panel 20 is located outside the display panel 20 .
  • the dotted line a is the boundary of the distribution of the solder resist 13 .
  • the plurality of first pads 121 there may be gaps between the plurality of first pads 121 and the edge of the flexible substrate 11 .
  • a part of the flexible substrate 11 extends above the boundary line b between the second bonding area 201 and the wiring area 202 , and the plurality of first pads 121 are located in the second bonding area 201 and the wiring area 202 Below the boundary line b, since the areas on the flexible substrate 11 outside the first binding area 101 are insulated, this part of the flexible substrate 11 will not cause a short circuit in the wiring area 202 .
  • the display device further includes a display driver IC 14; the driver IC 14 may be located on the chip-on-film 10 as shown in FIG.
  • the driver IC14 is a QHD (English: Quad High Definition, Chinese: Quad High Definition)-IC.
  • QHD is a screen resolution with a resolution of 2560 ⁇ 1440, which is more suitable for handheld mobile terminals, such as mobile phones.
  • the bonding structure 12 of the chip-on-film 10 includes two rows of pads.
  • the display device may also have other driving ICs 14 , and the bonding structure 12 includes two rows. Pad display device.
  • the plurality of first pads 121 and the plurality of second pads 122 are respectively connected to the driving IC 14 through the signal lines 15 .
  • Three signal lines 15 are schematically shown in FIG. 6 .
  • the cross-sectional area of the signal line 15 is positively related to the length of the signal line 15 .
  • the cross-sectional area of the line 15 is set to be larger.
  • the cross-sectional area of the signal line 15 is set to be smaller, which can reduce the resistance difference between different signal lines 15, and even can The resistances of the signal lines 15 are made the same.
  • the flexible substrate 11 may be a multi-layer substrate, that is, the flexible substrate 11 includes alternately stacked insulating dielectric layers and conductive layers.
  • Different signal lines 15 may be located in the same conductive layer, or may be located in different conductive layers. When the number of the first pads 121 and the second pads 122 is large, more signal lines 15 need to be arranged.
  • Using a multi-layer substrate and arranging the signal lines 15 in a plurality of conductive layers can facilitate the arrangement of the signal lines 15 .
  • the signal lines 15 of different layers may also be connected through via holes.
  • the conductive layer can be made of copper foil, or can also be made of other conductive materials, such as gold, silver, etc.
  • a plurality of fifth pads 16 may also be distributed on the flexible substrate 11, and the plurality of fifth pads 16 are arranged along one side of the flexible substrate 11.
  • the plurality of fifth pads 16 may be located in the ILB (English: Inner Lead Bonding, Chinese : Inner pin combination) in the process of connecting with other structures, such as PCB (English: Printed Circuit Board, Chinese: Printed Circuit Board).
  • the length direction of the plurality of first pads 121 and the length direction of the plurality of second pads 122 both form an acute angle with the first direction A, and the first direction A is the first row of pads 12a and the second The arrangement direction of the row pads 12b.
  • the orthographic projections of the first pad 121 and the second pad 122 on the second bonding area 201 are both rectangles, and the length direction of the first pad 121 refers to the orthographic projection of the first pad 121 on the second bonding area 201 Among them, the extension direction of the longer side and the length direction of the second pad 122 refer to the extension direction of the longer side in the orthographic projection of the second pad 122 in the second bonding area 201 .
  • the length of the first pad 121 can be appropriately increased by slanting the first pad 121 at a certain angle, thereby increasing the length of the first pad 121 and the display panel.
  • the contact area of 20 makes the bonding between the chip on film 10 and the display panel 20 more firmly.
  • the width of the first binding area 101 refers to the width of the first binding area 101 in the first direction A.
  • the included angle between the length direction of the first pad 121 and the first direction A is 0° ⁇ 10°
  • the plurality of first pads 121 are symmetrically distributed with respect to the center line o of the first bonding area 101 , and the center The line o extends along the first direction A, and the center line o is a symmetry axis of the first binding region 101 .
  • the included angle between the length direction of the second pads 122 and the first direction A is 0° ⁇ 10°
  • the plurality of second pads 122 are also symmetrically distributed with respect to the center line o of the first bonding area 101 .
  • the included angle between the length direction of the first pad 121 and the first direction A may be gradual, and the included angle between the length direction of the second pad 122 and the first direction A may also be gradual.
  • the angle between the length direction of the first pad 121 located in the middle and the first direction A may be smaller than that of the first pads 121 located on both sides.
  • An included angle between the length direction of a pad 121 and the first direction A may be gradual.
  • the extension lines of the plurality of first pads 121 in the length direction intersect at one point.
  • the extension lines of the plurality of second pads 122 in the length direction intersect at one point, which can improve the bonding yield and reliability of the display device.
  • the intersection of the extension lines of the plurality of first pads 121 in the longitudinal direction and the intersection of the extension lines of the plurality of second pads 122 in the longitudinal direction may be the same point, or may be two different points.
  • the spacing ⁇ between adjacent first pads 121 may be gradual, where the spacing ⁇ is the length of the connection line between the geometric centers of the adjacent first pads 121 .
  • the distance ⁇ between the adjacent first pads 121 located in the middle may be greater than the distance ⁇ between the adjacent first pads 121 located on both sides ;
  • the distance between the adjacent second pads 122 located in the middle is greater than the distance between the adjacent second pads 122 located on both sides.
  • the ratio of the length m of the first pad 121 to the length n of the second pad 122 may be 8:10 ⁇ 9:10, that is, the ratio of the length m to the length n It can be 0.8 to 0.9.
  • a straight line between the first row of pads 12a and the second row of pads 12b (for example, straight line c in FIG. 7 , the distances from straight line c to straight line L 2 and straight line L 3 are equal) Align with a certain line on the display panel 20 to position the chip on film 10 .
  • the lengths of the second pads 122 are the same, if the ratio of the length of the first pads 121 to the length of the second pads 122 in the first direction A is too small, the length of the first pads 121 will be too short , it is prone to the problem of weak binding. If in the first direction A, the ratio of the length of the first pad 121 to the length of the second pad 122 is too large, the first pad 121 enters the wiring area 202 of the display panel 20 and causes a short circuit. risk.
  • Both ends of the plurality of first pads 121 are generally aligned, and both ends of the plurality of second pads 122 are also aligned.
  • one end of the plurality of first pads 121 is aligned with a straight line L 1
  • the other ends of the plurality of first pads 121 are aligned with a straight line L 2 .
  • One end of the plurality of second pads 122 is aligned with a straight line L 3
  • the other ends of the plurality of second pads 122 are aligned with a straight line L 4 .
  • the straight line L 1 , the straight line L 2 , the straight line L 3 and the straight line L 4 are parallel to each other and are all perpendicular to the first direction A.
  • the length m of the first pad 121 is the distance between the straight line L1 and the straight line L2
  • the length n of the second pad 122 is the distance between the straight line L3 and the straight line L4 .
  • the ratio of the length m of the first pad 121 to the length n of the second pad 122 is 8:9. With this ratio, the firmness of the binding and the risk of short circuit can be taken into account.
  • the length m of the first pad 121 is 800 ⁇ m
  • the length n of the second pad 122 is 900 ⁇ m.
  • the width of the first pad 121 may be 13 ⁇ m
  • the width of the second pad 122 may be 13 ⁇ m
  • the second direction B is parallel to the surface of the flexible substrate 11 and is parallel to the first direction.
  • A is vertical.
  • the widths of the plurality of first pads 121 and the widths of the plurality of second pads 122 may be the same.
  • the ratio of the distance t between the first row of pads 12a and the second row of pads 12b to the length m of the first pad 121 may be 1:10 ⁇ 1.5: 10, that is, the ratio of the spacing t to the length m can be 0.1-0.15.
  • the distance t between the first row of pads 12a and the second row of pads 12b is equivalent to the distance between the straight line L2 and the straight line L3.
  • the length of 122 in the first direction A is also smaller, which is prone to the problem of weak bonding, and the distance t between the first row of pads 12a and the second row of pads 12b is too small. The risk of short circuit between the first pad 121 and the second pad 122 is increased.
  • the ratio of the distance t between the first row of pads 12a and the second row of pads 12b to the length m of the first pads 121 is 1:8. With this ratio, the firmness of the binding and the risk of short circuit can be taken into account.
  • the spacing t between the first row of pads 12a and the second row of pads 12b is 100 ⁇ m.
  • a third row of pads 21a connected to the first row of pads 12a and a fourth row of pads connected to the second row of pads 12b are distributed in the second bonding area 201 22a.
  • the third row of pads 21a includes a plurality of third pads 210 connected to the plurality of first pads 121 in a one-to-one correspondence
  • the fourth row of pads 22a includes a plurality of second pads 122 connected to a one-to-one correspondence The fourth pad 220 .
  • the first pads 121 and the second pads 122 on the chip on film 10 are respectively connected to the third pads 210 and the fourth pads 220 on the display panel 20 in a one-to-one correspondence.
  • the pitch T between the third row of pads 21a and the fourth row of pads 22a may be greater than the pitch t between the first row of pads 12a and the second row of pads 12b.
  • Both ends of the plurality of third pads 210 are generally aligned, and both ends of the plurality of fourth pads 220 are also aligned.
  • one end of the plurality of third pads 210 is aligned with a straight line L 5
  • the other ends of the plurality of third pads 210 are aligned with a straight line L 6
  • One end of the plurality of fourth pads 220 is aligned with a straight line L 7
  • the other ends of the plurality of fourth pads 220 are aligned with a straight line L 8 .
  • the straight line L 5 , the straight line L 6 , the straight line L 7 and the straight line L 8 are parallel to each other and are all perpendicular to the first direction A.
  • the length d of the third pad 210 is the distance between the straight line L 5 and the straight line L 6
  • the length e of the fourth pad 220 is the distance between the straight line L 7 and the straight line L 8 .
  • the ratio of the pitch t between the first row of pads 12a and the second row of pads 12b to the pitch T between the third row of pads 21a and the fourth row of pads 22a may be 2:5 ⁇ 3 : 5, that is, the ratio of the pitch t to the pitch T can be 0.4 to 0.6.
  • the ratio of the pitch t between the first row of pads 12a and the second row of pads 12b to the pitch T between the third row of pads 21a and the fourth row of pads 22a is 1:2 .
  • the distance between the first row of pads 12a and the second row of pads 12b is 100 ⁇ m, and the distance between the third row of pads 21a and the fourth row of pads 22a is 200 ⁇ m.
  • the length d of the third pad 210 may be smaller than the length m of the first pad 121
  • the length e of the fourth pad 220 may be smaller than the length n of the second pad 122 .
  • the ratio of the length d of the third pad 210 to the length m of the first pad 121 may be 7:20 ⁇ 8:20. That is, the ratio of the length d to the length m may be 0.35 ⁇ 0.4, and the ratio of the length e of the fourth pad 220 to the length n of the second pad 122 may be 3:10 ⁇ 4:10, that is, the ratio of the length e to the length n may be 3:10 ⁇ 4:10. The ratio may be 0.3 to 0.4.
  • the ratio of the length m of the first pad 121, the length n of the second pad 122, the length d of the third pad 210, and the length e of the fourth pad 220 is 8 :9:6:6.
  • the length d of the third pad 210 and the length e of the fourth pad 220 are the same, and both are 600 ⁇ m.
  • the width of the third pad 210 may be greater than that of the first pad 121
  • the width of the fourth pad 220 may be greater than that of the second pad 122 .
  • the widths of the plurality of third pads 210 may be different, and the widths of the plurality of fourth pads 220 may also be different.
  • the width of the third pads 210 located in the middle of the third row of pads 21a is greater than the width of the third pads 210 located on both sides;
  • the width of the fourth pad 220 in the middle of the row of pads 22 a is larger than the width of the fourth pad 220 located on both sides.
  • the width of the third pads 210 located in the middle of the third row of pads 21a is smaller than the width of the third pads 210 located on both sides; the width of the fourth pads 220 located in the middle of the fourth row of pads 22a is smaller than the width of the fourth pad 220 on the side.
  • the average width of the third pads 210 may be 20.5 ⁇ m
  • the average width of the fourth pads 220 may be 20.5 ⁇ m.
  • the average width of the third pads 210 refers to the ratio of the sum of the widths of all the third pads 210 to the number of the third pads 210
  • the average width of the fourth pads 220 refers to the width of all the fourth pads 220 The ratio of the sum to the number of the fourth pads 220 .
  • the spacing between adjacent third pads 210 may be the same; in the arrangement direction of the plurality of fourth row pads 22a, the adjacent fourth pads 220 The spacing can be the same.
  • the distance between adjacent third pads 210 is the length of the line connecting the geometric centers of adjacent third pads 210
  • the distance between adjacent fourth pads 220 is the geometric center of adjacent fourth pads 220 the length of the connection.
  • FIG. 8 is a schematic structural diagram of another display device provided by an embodiment of the present disclosure. The difference between the display device and the display device shown in FIG. 6 is that in FIG. 8 , the length direction of the first pad 121 and the length direction of the second pad 122 are both parallel to the first direction A.
  • the first pad 121 and the second pad 122 may adopt the arrangement shown in FIG. 6 or the arrangement shown in FIG. 8 .

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Abstract

本公开提供了一种显示装置，属于显示设备领域。该显示装置包括显示面板和与所述显示面板绑定连接的电路连接件；所述电路连接件包括柔性基板和绑定结构，柔性基板的边缘具有第一绑定区；绑定结构位于第一绑定区，绑定结构包括第一排焊盘和第二排焊盘，第一排焊盘包括多个第一焊盘，第二排焊盘位于第一排焊盘靠近柔性基板中部的一侧，第二排焊盘包括多个第二焊盘，第一绑定区与第二绑定区绑定时，第一焊盘的长度小于第二焊盘的长度，有利于避免第一焊盘伸到显示面板的走线区，确保多个第一焊盘在显示面板上的正投影位于第二绑定区内，避免显示面板的走线区出现被第一焊盘短路的情况。

Description

显示装置 技术领域
本公开涉及显示设备领域，特别涉及一种显示装置。
背景技术
手机、显示器等是生活中常见的显示装置，显示装置可以显示丰富的画面信息。
显示装置包括显示面板和电路连接件，这里的电路连接件可以是COF(英文：Chip on film，中文：覆晶薄膜)或者FPC(英文：Flexible Printed Circuit，中文：柔性电路板)。显示面板上通常具有绑定区(bonding area)，绑定区位于显示面板的边缘，COF或者FPC与显示面板在绑定区进行绑定连接。
发明内容
本公开实施例提供了一种显示装置，包括显示面板和与所述显示面板绑定连接的电路连接件；
所述电路连接件包括柔性基板和绑定结构，所述柔性基板的边缘具有第一绑定区；
所述绑定结构位于所述第一绑定区，所述绑定结构包括第一排焊盘和第二排焊盘，所述第一排焊盘包括沿所述柔性基板的边缘排列的多个第一焊盘，所述第二排焊盘位于所述第一排焊盘靠近所述柔性基板中部的一侧，所述第二排焊盘包括沿所述多个第一焊盘的排列方向排列的多个第二焊盘；
在第一方向上，所述第一焊盘的长度小于所述第二焊盘的长度，所述第一方向为所述第一排焊盘和所述第二排焊盘的排列方向；
所述显示面板的边缘具有第二绑定区，所述第一绑定区与所述第二绑定区绑定，所述多个第一焊盘在所述显示面板上的正投影位于所述第二绑定区内，所述第二绑定区分布有第三排焊盘和第四排焊盘，所述第三排焊盘包括与所述多个第一焊盘一一对应相连的多个第三焊盘，所述第四排焊盘包括与所述多个 第二焊盘一一对应相连的多个第四焊盘，在所述第一方向上，所述第三焊盘的长度与所述第四焊盘的长度相同。
可选地，在所述第一方向上，所述第一焊盘的长度与所述第二焊盘的长度之比为8∶10～9∶10。
可选地，在所述第一方向上，所述第一焊盘的长度与所述第二焊盘的长度的比为8∶9。
可选地，在所述第一方向上，所述第一焊盘的长度为800μm，所述第二焊盘的长度为900μm。
可选地，在所述第一方向上，所述第一排焊盘和所述第二排焊盘之间的间距与所述第一焊盘的长度之比为1∶10～1.5∶10。
可选地，在所述多个第一焊盘的排列方向上，位于中部的相邻的所述第一焊盘之间的间距大于位于两侧的相邻的所述第一焊盘之间的间距；
在所述多个第二焊盘的排列方向上，位于中部的相邻的所述第二焊盘之间的间距大于位于两侧的相邻的所述第二焊盘之间的间距。
可选地，在所述第一方向上，所述第一排焊盘和所述第二排焊盘之间的间距、所述第三排焊盘和所述第四排焊盘之间的间距之比为2∶5～3∶5。
可选地，在所述第一方向上，所述第三焊盘的长度与所述第一焊盘的长度之比为7∶20～8∶20，所述第四焊盘的长度与所述第二焊盘的长度之比为3∶10～4∶10。
可选地，在所述多个第三焊盘的排列方向上，相邻的所述第三焊盘之间的间距相同；
在所述多个第四焊盘的排列方向上，相邻的所述第四焊盘之间的间距相同。
可选地，在第二方向上，所述第三焊盘的宽度大于所述第一焊盘的宽度，所述第四焊盘的宽度大于所述第二焊盘的宽度，所述第二方向平行于所述柔性基板的表面，且与所述第一方向垂直。
可选地，在所述第二方向上，所述第一焊盘的宽度为13μm，所述第二焊盘的宽度为13μm。
可选地，所述第一焊盘的长度方向与所述第一方向的夹角为0°～10°，且所述多个第一焊盘关于所述第一绑定区的中心线对称分布，所述中心线沿所述第一方向延伸；
所述第二焊盘的长度方向与所述第一方向的夹角为0°～10°，且所述多个第二焊盘关于所述第一绑定区的中心线对称分布。
可选地，所述多个第一焊盘在长度方向上的延长线相交于一点；
所述多个第二焊盘在长度方向上的延长线相交于一点。
可选地，所述柔性基板上覆盖有阻焊剂，所述阻焊剂位于所述第一绑定区外，所述阻焊剂在所述显示面板所在平面的正投影位于所述显示面板外。
可选地，所述电路连接件为覆晶薄膜或者柔性电路板。
可选地，所述显示面板上设有驱动集成电路，或者所述覆晶薄膜上设置有驱动集成电路；
所述驱动集成电路为四倍高清分辨率集成电路QHD-IC。
本公开实施例提供的技术方案带来的有益效果至少包括：
第一绑定区与第二绑定区绑定时，第一焊盘的长度小于第二焊盘的长度，有利于避免第一焊盘伸到显示面板的走线区，确保多个第一焊盘在显示面板上的正投影位于第二绑定区内，避免显示面板的走线区出现被第一焊盘短路的情况。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术中的一种显示装置的俯视图；
图2是图1中虚线范围内的局部放大示意图；
图3是覆晶薄膜的截面图；
图4是显示面板的局部结构示意图；
图5是本公开实施例提供的一种显示装置的结构示意图；
图6是本公开实施例提供的一种覆晶薄膜的局部结构示意图；
图7是本公开实施例提供的第一绑定区与第二绑定区的绑定示意图；
图8是本公开实施例提供的另一种显示装置的结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施方式作进一步地详细描述。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”、“第三”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。
图1是相关技术中的一种显示装置的俯视图。如图1所示，该显示装置包括显示面板20和与显示面板20绑定连接的电路连接件。这里的电路连接件可以是覆晶薄膜COF或者柔性电路板FPC；例如图1中所示，覆晶薄膜10绑定在显示面板20上。
显示装置通常包括COF(英文：Chip On Film，中文：覆晶薄膜)封装工艺的显示装置和COP(英文：Chip On Panel，中文：芯片绑定在面板上)封装工艺的显示装置。COF封装工艺的显示装置的显示驱动集成电路(IC)14位于COF10上；COF10的一端与显示面板20绑定连接，另一端与电路板绑定连接，该电路板可以是PCB(英文：Printed Circuit Board，中文：印刷线路板)，也可以是FPC。COP封装工艺的显示装置的驱动IC14位于显示面板20上；显示面板20与柔性电路板FPC直接进行绑定连接。
图2是图1中虚线范围内的局部放大示意图。如图2所示，本公开实施例以COF封装工艺的显示装置为例进行说明。
图3是覆晶薄膜的截面图，图3所示为图2中的Ⅰ-Ⅰ截面。结合图2和图3所示，覆晶薄膜10包括柔性基板11和绑定结构12。在柔性基板11的一面，位于柔性基板11一侧的边缘处具有第一绑定区101，绑定结构12位于第一绑定 区101中。绑定结构12包括多个第一焊盘121和多个第二焊盘122；第一焊盘121和第二焊盘122位于覆晶薄膜的金属走线层，并通过保护层上的开口裸露，进而可以跟显示面板20进行电性连接。
图4是显示面板的局部结构示意图。如图4所示，在显示面板20一侧的边缘处具有第二绑定区201，在第二绑定区201的内侧(即靠近显示面板20中部的一侧)具有走线区202。在第二绑定区201分布有多个第三焊盘210和多个第四焊盘220。在显示面板20上还分布有多根信号线230，第三焊盘210和第四焊盘220分别与信号线230相连，信号线230从第二绑定区201延伸至走线区202内。同一根信号线230可以包括两段，其中一段位于显示面板20的表面，另一段位于显示面板20内，两段之间通过过孔240相连。图4中所示的信号线230、过孔240的分布仅是示意，对于不同的显示面板，信号线230、过孔240的分布也会不同。
第一绑定区101与第二绑定区201绑定，多个第一焊盘121与多个第三焊盘210一一对应连接，多个第二焊盘122与多个第四焊盘220一一对应连接。
相关技术中，为了进一步缩小显示装置的边框，以及提高显示面板的切割率，第二绑定区201的宽度D不得不设置得更小，使得在绑定时，第一焊盘121的一部分可能会进入到走线区202。图4中示意性地示出了一个部分进入走线区202的第一焊盘121，第一焊盘121进入到走线区202的部分可能会与过孔240接触，导致信号线230短路。
图5是本公开实施例提供的一种显示装置的结构示意图。该显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。如图5所示，该显示装置包括显示面板20和与显示面板20绑定连接的电路连接件。本公开实施例中的电路连接件可以是覆晶薄膜，也可以是柔性电路板。在后续的实施例中，以电路连接件为覆晶薄膜10作为示例来对本公开中的方案进行说明。
图6是本公开实施例提供的一种覆晶薄膜的局部结构示意图。如图6所示，覆晶薄膜10包括柔性基板11和绑定结构12，柔性基板11的边缘具有第一绑定区101。
绑定结构12位于第一绑定区101，绑定结构12包括第一排焊盘12a和第二 排焊盘12b。其中，第一排焊盘12a包括沿柔性基板11的边缘排列的多个第一焊盘121，第二排焊盘12b位于第一排焊盘12a靠近柔性基板11中部的一侧，第二排焊盘12b包括沿多个第一焊盘121的排列方向排列的多个第二焊盘122。
在第一方向A上，第一焊盘121的长度m小于第二焊盘122的长度n。第一方向A为第一排焊盘12a和第二排焊盘12b的排列方向。
显示面板20的边缘具有第二绑定区201。图5中的虚线b为第二绑定区201与走线区202的分界线。
第一绑定区101与第二绑定区201绑定，多个第一焊盘121在显示面板20上的正投影位于第二绑定区201内。第二绑定区201分布有第三排焊盘21a和第四排焊盘22a。图7是本公开实施例提供的第一绑定区与第二绑定区的绑定示意图。如图7所示，第三排焊盘21a包括与多个第一焊盘121一一对应相连的多个第三焊盘210，第四排焊盘22a包括与多个第二焊盘122一一对应相连的多个第四焊盘220。在本申请的一个实施例中，在第一方向A上，第三焊盘210的长度d与第四焊盘220的长度e相同。
覆晶薄膜10与显示面板20通常在OLB(英文：Outer Lead Bonding，中文：外引脚结合)制程中连接，在工艺制程中，覆晶薄膜10和显示面板20待接触的表面之间会设置异方性导电胶膜(英文：Anisotropic Conductive Film，缩写：ACF)，第一绑定区101即指覆晶薄膜10上与异方性导电胶膜接触的区域，第二绑定区201即指显示面板20上与异方性导电胶膜接触的区域。
第一绑定区与第二绑定区绑定时，在第一方向上，第一焊盘的长度小于第二焊盘的长度，有利于避免第一焊盘伸到显示面板的走线区，确保多个第一焊盘在显示面板上的正投影位于第二绑定区内，避免显示面板的走线区出现被第一焊盘短路的情况。
如图6所示，柔性基板11上可以覆盖有阻焊剂13(如图6中的填充区域)，阻焊剂13位于第一绑定区101外，阻焊剂13在显示面板20所在平面的正投影位于显示面板20外。图5中，虚线a为阻焊剂13分布的边界。通过使阻焊剂在显示面板所在平面的正投影位于显示面板20外，使阻焊剂不会与显示面板20接触而影响绑定。此处所指的阻焊剂13在显示面板20所在平面的正投影，是柔性基板11展平至与显示面板20所在平面平行时的正投影。
示例性地，多个第一焊盘121与柔性基板11的边缘之间可以具有间隙。例 如在图5中，柔性基板11的一部分延伸至第二绑定区201与走线区202的分界线b上方，而多个第一焊盘121位于第二绑定区201与走线区202的分界线b的下方，由于柔性基板11上位于第一绑定区101之外的区域均绝缘，因此柔性基板11的该部分不会造成走线区202的短路。
可选地，该显示装置还包括显示驱动IC14；该驱动IC 14可以是如图5所示，位于覆晶薄膜10上，也可以是设置在显示面板20上。该驱动IC14为QHD(英文：Quad High Definition，中文：四倍高清分辨率)-IC。QHD是一种屏幕分辨率，分辨率为2560×1440，比较适用于手持移动终端，例如手机。通常具有QHD-IC的显示装置，覆晶薄膜10的绑定结构12包括两排焊盘，在本申请的其他示例中，显示装置也可以是具有其他驱动IC14，且绑定结构12包括两排焊盘的显示装置。
如图6所示，多个第一焊盘121和多个第二焊盘122分别通过信号线15与驱动IC14连接。图6中示意性地示出了3根信号线15。
示例性地，信号线15的横截面积与信号线15的长度正相关。信号线15的长度越长，信号线15的电阻就越大，而在长度相同的情况下，横截面积越大，信号线15的电阻越小，对于长度较长的信号线15，将信号线15的横截面积设置的较大一些，对于长度较短的信号线15，将信号线15的横截面积设置的较小一些，能够减小不同信号线15之间的电阻差异，甚至可以使各信号线15的电阻大小相同。
可选地，柔性基板11可以是多层基板，即柔性基板11包括交替堆叠的绝缘介质层和导电层。不同的信号线15可以位于相同的导电层中，也可以位于不同的导电层中。在第一焊盘121和第二焊盘122数量较多时，需要布置的信号线15也较多，采用多层基板，将信号线15设置在多个导电层中，可以方便信号线15的布置。不同层的信号线15之间还可以通过过孔进行连接。
导电层可以采用铜箔制作，或者也可以采用其他导电材料制作，例如：金、银等。
柔性基板11上还可以分布有多个第五焊盘16，多个第五焊盘16沿柔性基板11的一条边排列，多个第五焊盘16可以在ILB(英文：Inner Lead Bonding，中文：内引脚结合)制程中与其他结构，例如PCB(英文：Printed Circuit Board，中文：印刷电路板)进行连接。
如图6所示，多个第一焊盘121的长度方向和多个第二焊盘122的长度方向均与第一方向A呈锐角，第一方向A为第一排焊盘12a和第二排焊盘12b的排列方向。
第一焊盘121和第二焊盘122在第二绑定区201的正投影均为长方形，第一焊盘121的长度方向是指第一焊盘121在第二绑定区201的正投影中，较长的一条侧边的延伸方向，第二焊盘122的长度方向指第二焊盘122在第二绑定区201的正投影中，较长的一条侧边的延伸方向。
在第一绑定区101的宽度相同的情况下，将第一焊盘121以一定的角度倾斜设置，可以适当增大第一焊盘121的长度，从而增大第一焊盘121与显示面板20的接触面积，使覆晶薄膜10与显示面板20之间绑定得更牢固。其中，第一绑定区101的宽度是指在第一方向A上，第一绑定区101的宽度。
示例性地，第一焊盘121的长度方向与第一方向A的夹角为0°～10°，且多个第一焊盘121关于第一绑定区101的中心线o对称分布，中心线o沿第一方向A延伸，该中心线o为第一绑定区101的一条对称轴。第二焊盘122的长度方向与第一方向A的夹角为0°～10°，且多个第二焊盘122也关于第一绑定区101的中心线o对称分布。
可选地，第一焊盘121的长度方向与第一方向A的夹角可以是渐变的，第二焊盘122的长度方向与第一方向A的夹角也可以是渐变的。以多个第一焊盘121为例，在多个第一焊盘121的排列方向上，位于中部的第一焊盘121的长度方向与第一方向A的夹角可以小于位于两侧的第一焊盘121的长度方向与第一方向A的夹角。
在一种示例中，多个第一焊盘121在长度方向上的延长线相交于一点。多个第二焊盘122在长度方向上的延长线相交于一点，可以提升显示装置的绑定良率和可靠性。多个第一焊盘121在长度方向上的延长线的交点与多个第二焊盘122在长度方向上的延长线的交点可以是同一点，也可以是不同的两个点。
在第一排焊盘12a中，相邻的第一焊盘121的间距Δ可以是渐变的，这里的间距Δ是相邻的第一焊盘121的几何中心的连线的长度。例如，在多个第一焊盘121的排列方向上，位于中部的相邻的第一焊盘121之间的间距Δ可以大于位于两侧的相邻的第一焊盘121之间的间距Δ；在多个第二焊盘122的排列方向上，位于中部的相邻的第二焊盘122之间的间距大于位于两侧的相邻的第 二焊盘122之间的间距。
如图7所示，在第一方向A上，第一焊盘121的长度m与第二焊盘122的长度n之比可以为8∶10～9∶10，即长度m与长度n的比值可以为0.8～0.9。在进行绑定时，通常会将第一排焊盘12a和第二排焊盘12b之间的一条直线(例如图7中的直线c，直线c到直线L 2和直线L 3的距离相等)与显示面板20上的某一条直线对齐，以对覆晶薄膜10进行定位。在第二焊盘122长度相同的情况下，如果在第一方向A上，第一焊盘121的长度与第二焊盘122的长度的比值过小，会使得第一焊盘121长度过短，容易出现绑定不牢固的问题。如果在第一方向A上，第一焊盘121的长度与第二焊盘122的长度的比值过大，又增大了第一焊盘121进入显示面板20的走线区202，引发短路的风险。
多个第一焊盘121的两端通常是对齐的，多个第二焊盘122的两端也是对齐的。例如在图7中，多个第一焊盘121的一端均对齐于一条直线L 1，多个第一焊盘121的另一端均对齐于一条直线L 2。多个第二焊盘122的一端均对齐于一条直线L 3，多个第二焊盘122的另一端均对齐于一条直线L 4。直线L 1、直线L 2、直线L 3和直线L 4相互平行且均垂直于第一方向A。在第一方向A上，第一焊盘121的长度m也就是直线L 1和直线L 2之间的间距，第二焊盘122的长度n也就是直线L 3和直线L 4之间的间距。
示例性地，本公开实施例中，在第一方向A上，第一焊盘121的长度m与第二焊盘122的长度n的比为8∶9。采用这一比例，能兼顾绑定的牢固程度和短路风险。
示例性地，在第一方向A上，第一焊盘121的长度m为800μm，第二焊盘122的长度n为900μm。
示例性地，在第二方向B上，第一焊盘121的宽度可以为13μm，第二焊盘122的宽度可以为13μm，第二方向B平行于柔性基板11的表面，且与第一方向A垂直。多个第一焊盘121的宽度和多个第二焊盘122的宽度均可以相同。
以第一焊盘121为例，第一焊盘121在第一方向A上的长度确定的情况下，第一焊盘121在第二方向B上的宽度越大，在绑定时第一焊盘121与显示面板20的接触面积也就越大，绑定的也就越牢固，但是在第一绑定区101确定的情况下，第一焊盘121的宽度越大，相邻第一焊盘121之间所能预留的间隙也就越小，间隙越小，在进行绑定时也就越容易出现第一焊盘121短路的情况。
如图7所示，在第一方向A上，第一排焊盘12a和第二排焊盘12b之间的间距t与第一焊盘121的长度m之比可以为1∶10～1.5∶10，即间距t与长度m的比值可以为0.1～0.15。第一排焊盘12a和第二排焊盘12b之间的间距t就相当于是直线L 2和直线L 3之间的间距。
在第一绑定区101的面积大小确定的情况下，第一排焊盘12a和第二排焊盘12b之间的间距t越大，所能布置的第一焊盘121和第二焊盘122在第一方向A上的长度也就越小，容易出现绑定不牢固的问题，而第一排焊盘12a和第二排焊盘12b之间的间距t过小，在绑定时，会增大第一焊盘121与第二焊盘122的短路风险。
示例性地，本公开实施例中，第一排焊盘12a和第二排焊盘12b之间的间距t与第一焊盘121的长度m的比为1∶8。采用这一比例，能兼顾绑定的牢固程度和短路风险。
示例性地，第一排焊盘12a和第二排焊盘12b之间的间距t为100μm。
如图7所示，显示面板20上，在第二绑定区201分布有与第一排焊盘12a相连的第三排焊盘21a和与第二排焊盘12b相连的第四排焊盘22a。
第三排焊盘21a包括与多个第一焊盘121一一对应相连的多个第三焊盘210，第四排焊盘22a包括与多个第二焊盘122一一对应相连的多个第四焊盘220。
通过绑定工艺，覆晶薄膜10上的第一焊盘121和第二焊盘122分别一一对应连接至显示面板20上的第三焊盘210和第四焊盘220。
第三排焊盘21a和第四排焊盘22a之间的间距T可以大于第一排焊盘12a和第二排焊盘12b之间的间距t。
多个第三焊盘210的两端通常是对齐的，多个第四焊盘220的两端也是对齐的。例如在图7中，多个第三焊盘210的一端均对齐于一条直线L 5，多个第三焊盘210的另一端均对齐于一条直线L 6。多个第四焊盘220的一端均对齐于一条直线L 7，多个第四焊盘220的另一端均对齐于一条直线L 8。直线L 5、直线L 6、直线L 7和直线L 8相互平行且均垂直于第一方向A。在第一方向A上，第三焊盘210的长度d也就是直线L 5和直线L 6之间的间距，第四焊盘220的长度e也就是直线L 7和直线L 8之间的间距。
示例性地，第一排焊盘12a和第二排焊盘12b之间的间距t、第三排焊盘21a 和第四排焊盘22a之间的间距T之比可以为2∶5～3∶5，即间距t与间距T的比值可以为0.4～0.6。
在本公开实施例中，第一排焊盘12a和第二排焊盘12b之间的间距t与第三排焊盘21a和第四排焊盘22a之间的间距T的比为1∶2。第一排焊盘12a和第二排焊盘12b之间的间距为100μm，第三排焊盘21a和第四排焊盘22a之间的间距为200μm。
如图7所示，在第一方向A上，第三焊盘210的长度d可以小于第一焊盘121的长度m，第四焊盘220的长度e可以小于第二焊盘122的长度n。
可选地，在第一方向A上，第三焊盘210的长度d与第一焊盘121的长度m之比可以为7∶20～8∶20。即长度d与长度m的比值可以为0.35～0.4，第四焊盘220的长度e与第二焊盘122的长度n之比可以为3∶10～4∶10，即长度e与长度n的比值可以为0.3～0.4。
示例性地，在第一方向A上，第一焊盘121的长度m、第二焊盘122的长度n、第三焊盘210的长度d和第四焊盘220的长度e之比为8∶9∶6∶6。
在本公开实施例中，第三焊盘210的长度d与第四焊盘220的长度e相同，均为600μm。
如图7所示，在第二方向B上，第三焊盘210的宽度可以大于第一焊盘121的宽度，第四焊盘220的宽度可以大于第二焊盘122的宽度。
多个第三焊盘210的宽度可以不同，多个第四焊盘220的宽度也可以不同。例如在多个第三焊盘210中，在第一方向A上，位于第三排焊盘21a中部的第三焊盘210的宽度大于位于两侧的第三焊盘210的宽度；位于第四排焊盘22a中部的第四焊盘220的宽度大于位于两侧的第四焊盘220的宽度。或者，位于第三排焊盘21a中部的第三焊盘210的宽度小于位于两侧的第三焊盘210的宽度；位于第四排焊盘22a中部的第四焊盘220的宽度小于位于两侧的第四焊盘220的宽度。
示例性地，在第二方向B上，第三焊盘210的平均宽度可以为20.5μm，第四焊盘220的平均宽度可以为20.5μm。第三焊盘210的平均宽度是指所有第三焊盘210的宽度之和与第三焊盘210的个数的比值，第四焊盘220的平均宽度是指所有第四焊盘220的宽度之和与第四焊盘220的个数的比值。
在多个第三排焊盘21a的排列方向上，相邻的第三焊盘210的间距可以相 同；在多个第四排焊盘22a的排列方向上，相邻的第四焊盘220的间距可以相同。相邻的第三焊盘210的间距是相邻的第三焊盘210的几何中心的连线的长度，相邻的第四焊盘220的间距是相邻的第四焊盘220的几何中心的连线的长度。
图8是本公开实施例提供的另一种显示装置的结构示意图。该显示装置与图6所示的显示装置的区别在于，图8中，第一焊盘121的长度方向、第二焊盘122的长度方向均平行于第一方向A。
根据不同的显示装置，第一焊盘121和第二焊盘122可以采用图6所示的布置方式，也可以采用图8所示的布置方式。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (16)

  1. 一种显示装置，包括显示面板(20)和与所述显示面板(20)绑定连接的电路连接件；
    所述电路连接件包括柔性基板(11)和绑定结构(12)，所述柔性基板(11)的边缘具有第一绑定区(101)；
    所述绑定结构(12)位于所述第一绑定区(101)，所述绑定结构(12)包括第一排焊盘(12a)和第二排焊盘(12b)，所述第一排焊盘(12a)包括沿所述柔性基板(11)的边缘排列的多个第一焊盘(121)，所述第二排焊盘(12b)位于所述第一排焊盘(12a)靠近所述柔性基板(11)中部的一侧，所述第二排焊盘(12b)包括沿所述多个第一焊盘(121)的排列方向排列的多个第二焊盘(122)；
    在第一方向(A)上，所述第一焊盘(121)的长度小于所述第二焊盘(122)的长度，所述第一方向(A)为所述第一排焊盘(12a)和所述第二排焊盘(12b)的排列方向；
    所述显示面板(20)的边缘具有第二绑定区(201)，所述第一绑定区(101)与所述第二绑定区(201)绑定，所述多个第一焊盘(121)在所述显示面板(20)上的正投影位于所述第二绑定区(201)内，所述第二绑定区(201)分布有第三排焊盘(21a)和第四排焊盘(22a)，所述第三排焊盘(21a)包括与所述多个第一焊盘(121)一一对应相连的多个第三焊盘(210)，所述第四排焊盘(22a)包括与所述多个第二焊盘(122)一一对应相连的多个第四焊盘(220)，在所述第一方向(A)上，所述第三焊盘(210)的长度与所述第四焊盘(220)的长度相同。
  2. 根据权利要求1所述的显示装置，其中，在所述第一方向(A)上，所述第一焊盘(121)的长度与所述第二焊盘(122)的长度之比为8∶10～9∶10。
  3. 根据权利要求2所述的显示装置，其中，在所述第一方向(A)上，所述第一焊盘(121)的长度与所述第二焊盘(122)的长度的比为8∶9。
  4. 根据权利要求3所述的显示装置，其中，在所述第一方向(A)上，所述第一焊盘(121)的长度为800μm，所述第二焊盘(122)的长度为900μm。
  5. 根据权利要求3所述的显示装置，其中，在所述第一方向(A)上，所述第一排焊盘(12a)和所述第二排焊盘(12b)之间的间距与所述第一焊盘(121)的长度之比为1∶10～1.5∶10。
  6. 根据权利要求1～5任一项所述的显示装置，其中，在所述多个第一焊盘(121)的排列方向上，位于中部的相邻的所述第一焊盘(121)之间的间距大于位于两侧的相邻的所述第一焊盘(121)之间的间距；
    在所述多个第二焊盘(122)的排列方向上，位于中部的相邻的所述第二焊盘(122)之间的间距大于位于两侧的相邻的所述第二焊盘(122)之间的间距。
  7. 根据权利要求1～5任一项所述的显示装置，其中，
    在所述第一方向(A)上，所述第一排焊盘(12a)和所述第二排焊盘(12b)之间的间距、所述第三排焊盘(21a)和所述第四排焊盘(22a)之间的间距之比为2∶5～3∶5。
  8. 根据权利要求1～5任一项所述的显示装置，其中，
    在所述第一方向(A)上，所述第三焊盘(210)的长度与所述第一焊盘(121)的长度之比为7∶20～8∶20，所述第四焊盘(220)的长度与所述第二焊盘(122)的长度之比为3∶10～4∶10。
  9. 根据权利要求8所述的显示装置，其中，在所述多个第三焊盘(210)的排列方向上，相邻的所述第三焊盘(210)之间的间距相同；
    在所述多个第四焊盘(220)的排列方向上，相邻的所述第四焊盘(220)之间的间距相同。
  10. 根据权利要求8所述的显示装置，其中，在第二方向(B)上，所述第三焊盘(210)的宽度大于所述第一焊盘(121)的宽度，所述第四焊盘(220) 的宽度大于所述第二焊盘(122)的宽度，所述第二方向(B)平行于所述柔性基板(11)的表面，且与所述第一方向(A)垂直。
  11. 根据权利要求10所述的显示装置，其中，在所述第二方向(B)上，所述第一焊盘(121)的宽度为13μm，所述第二焊盘(122)的宽度为13μm。
  12. 根据权利要求1～5任一项或9～11任一项所述的显示装置，其中，所述第一焊盘(121)的长度方向与所述第一方向的夹角为0°～10°，且所述多个第一焊盘(121)关于所述第一绑定区(101)的中心线(o)对称分布，所述中心线(o)沿所述第一方向(A)延伸；
    所述第二焊盘(122)的长度方向与所述第一方向的夹角为0°～10°，且所述多个第二焊盘(122)关于所述第一绑定区(101)的中心线(o)对称分布。
  13. 根据权利要求12所述的显示装置，其中，所述多个第一焊盘(121)在长度方向上的延长线相交于一点；
    所述多个第二焊盘(122)在长度方向上的延长线相交于一点。
  14. 根据权利要求1～5任一项或9～11、13任一项所述的显示装置，其中，所述柔性基板(11)上覆盖有阻焊剂(13)，所述阻焊剂(13)位于所述第一绑定区(101)外，所述阻焊剂(13)在所述显示面板(20)所在平面的正投影位于所述显示面板(20)外。
  15. 根据权利要求1～5任一项或9～11、13任一项所述的显示装置，其中，所述电路连接件为覆晶薄膜(10)或者柔性电路板。
  16. 根据权利要求15所述的显示装置，其中，所述显示面板(20)上设有驱动集成电路(14)，或者所述覆晶薄膜上设置有驱动集成电路(14)；
    所述驱动集成电路(14)为四倍高清分辨率集成电路QHD-IC。
PCT/CN2020/122972 2020-10-22 2020-10-22 显示装置 WO2022082651A1 (zh)

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