WO2021238443A1 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2021238443A1
WO2021238443A1 PCT/CN2021/086177 CN2021086177W WO2021238443A1 WO 2021238443 A1 WO2021238443 A1 WO 2021238443A1 CN 2021086177 W CN2021086177 W CN 2021086177W WO 2021238443 A1 WO2021238443 A1 WO 2021238443A1
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WIPO (PCT)
Prior art keywords
reinforcing plate
pad
display module
display
display panel
Prior art date
Application number
PCT/CN2021/086177
Other languages
English (en)
French (fr)
Inventor
白枭
杨盛际
黄冠达
卢鹏程
Original Assignee
京东方科技集团股份有限公司
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Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2022524217A priority Critical patent/JP2023527600A/ja
Priority to US17/598,232 priority patent/US20220322524A1/en
Priority to EP21813156.3A priority patent/EP4036981A4/en
Publication of WO2021238443A1 publication Critical patent/WO2021238443A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
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    • H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05647—Copper [Cu] as principal constituent
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/05666—Titanium [Ti] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/0568—Molybdenum [Mo] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/32227—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a bond pad of the item
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display module and a display device.
  • the present disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a display module and a display device.
  • a display module including:
  • a display panel the display panel includes a display area and a binding area, the binding area is located on at least one side of the display area, the display panel includes: a substrate, a driving circuit and a first pad, the driving The circuit and the first pad are both disposed on the substrate, and the first pad is located in the bonding area; the driving circuit is electrically connected to the first pad, and the driving circuit at least includes A transistor located in the display area, the semiconductor layer of the transistor is embedded on the substrate;
  • a flexible circuit board comprising: a flexible substrate, a first wiring layer and a first reinforcement board, the first wiring layer is disposed on the flexible substrate, and the first wiring layer includes a main wiring portion And a second pad, the first reinforcing plate is arranged on a side of the first wiring layer away from the flexible substrate;
  • the orthographic projection of the main wiring portion on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate; the second pad is connected to the main wiring portion , And at least a part of the second pad is electrically connected to the first pad through conductive glue, and the conductive glue includes conductive particles;
  • the first reinforcing plate is located outside the display panel, the first reinforcing plate has a first edge facing the display panel, and the first edge includes: facing the display The curved convex part of the panel and the concave part bent away from the display panel, the concave part and the convex part are alternately arranged in the second direction, forming a wave shape; the first direction is the second welding The direction of the disc away from the display panel, the second direction intersects the first direction.
  • the protruding portion and the recessed portion are both arc-shaped.
  • the radius of the convex portion and the radius of the concave portion are both between 1.0 mm and 1.5 mm.
  • the arc length of a single protruding part and the arc length of a single recessed part are both between 1.0 mm and 1.6 mm.
  • the length of the single protrusion in the second direction and the length of the single recess in the second direction are equal.
  • the distance between any position of the first edge and the display panel is between 200 ⁇ m and 1500 ⁇ m.
  • the flexible circuit board further includes a second reinforcing plate located on a side of the flexible base away from the first wiring layer, and the second reinforcing plate is at least It includes a first reinforcing part, and the orthographic projection of the second pad on the flexible substrate is located within the orthographic projection of the first reinforcing part on the flexible substrate.
  • the second reinforcing plate further includes a second reinforcing part, the second reinforcing part and the first reinforcing part are arranged in sequence in the first direction, and the The orthographic projection of the second reinforcing part on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate.
  • the first reinforcement part and the second reinforcement part of the second reinforcement plate are an integral structure.
  • the size of the second reinforcing part in the first direction is not less than 500 ⁇ m.
  • the flexible circuit board further includes a second wiring layer and a third reinforcing plate, and the second wiring layer is located on a side of the flexible substrate away from the first wiring layer and passes through a via hole. Electrically connected to the main wiring part; the third reinforcing plate is arranged on a side of the second wiring layer away from the flexible substrate;
  • the orthographic projection of the second wiring layer on the flexible substrate is located in the orthographic projection of the first reinforcing plate on the flexible substrate, and the third reinforcing plate is positioned on the flexible substrate. In the orthographic projection.
  • a part of the third reinforcing plate is located on a side of the second wiring layer facing the second reinforcing portion.
  • the conductive adhesive is anisotropic conductive adhesive.
  • the display panel further includes:
  • the light-emitting element located in the display area the light-emitting element is arranged on the side of the driving circuit away from the substrate, and the light-emitting element is electrically connected to the transistor.
  • the embodiment of the present disclosure also provides a display device including the above-mentioned display module.
  • FIG. 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure.
  • FIG. 2 is a schematic diagram of a display panel provided in some embodiments of the present disclosure.
  • FIG. 3 is a bottom view of a flexible circuit board provided in some embodiments of the disclosure.
  • Fig. 4 is an enlarged view of area I in Fig. 3.
  • Fig. 5 is a cross-sectional view taken along line AA' in Fig. 4;
  • FIG. 6 is a schematic diagram of the connection between the flexible circuit board and the display panel provided in some embodiments of the present disclosure.
  • Fig. 7 is a bottom view of a partial area of a flexible circuit board provided in a pair of scales.
  • FIG. 8 is a schematic diagram of the connection between the flexible circuit board and the display panel in a pair of scales.
  • FIG. 1 is a schematic diagram of a display module provided in some embodiments of the present disclosure.
  • the display module includes a display panel and a flexible circuit board.
  • 2 is a schematic diagram of a display panel provided in some embodiments of the present disclosure.
  • the display panel 10 includes a display area 10a and a binding area 10b located on at least one side of the display area 10a.
  • the display panel 10 includes a substrate 102, a driving circuit, and a first pad 101, and the driving circuit and the first pad 101 are both disposed on the substrate 102.
  • the first pad 101 is located in the bonding area 10b, the first pad 101 may be a single-layer or multi-layer structure, and the first pad 101 may be made of materials such as metal or alloy, for example: A metal single-layer or multi-layer structure formed of copper, molybdenum, aluminum, titanium, etc., but not limited to this, the first pad 101 can also be made of other conductive materials.
  • the first pad 101 is usually used for bonding with an external element (for example, the flexible circuit board 20) after the device in the display area 10a is completed, so as to provide a signal for the display panel 10.
  • the number of first pads is multiple, each first pad may be elongated, the length direction of the first pad may be along the first direction (the X direction in FIG. 1 and FIG. 2), and there are multiple
  • the first pads are arranged along a second direction (the Y direction in FIGS. 1 and 2) that crosses the first direction, for example, the second direction is perpendicular to the first direction.
  • the substrate 102 is a silicon-based substrate, and the silicon substrate is, for example, single crystal silicon or high-purity silicon.
  • the driving circuit may be formed on the substrate 102 so that it is integrally formed as the driving substrate 105. It should be understood that the driving circuit may include a circuit structure located in the display area 10a, and may also include a circuit structure located in the binding area 10b. The driving circuit may be electrically connected to the first bonding pad 101 of the bonding area 10 b, and the first bonding pad 101 is bonded to the second bonding pad 202 a of the flexible circuit board 20 to provide a signal for the display panel 10.
  • the driving circuit may include at least a pixel circuit located in the display area 10a, the pixel circuit includes a plurality of transistors 103, and the pixel circuit may be formed on a silicon substrate by a semiconductor process, for example: a doping process on the silicon substrate.
  • the semiconductor layer 1031 (that is, the active layer), the source electrode 1032 and the drain electrode 1033 of the transistor 103 are formed thereon, and the insulating layer 1034 is formed by a silicon oxidation process, and the gate electrode 1035 and a plurality of conductive materials are formed by a sputtering process or other processes. Layers 106, 107, etc.
  • the semiconductor layer 1031 of the transistor 103 is embedded on the substrate 102; that is, when the substrate 102 is a silicon substrate, the semiconductor layer 1031 may belong to a part of the silicon substrate.
  • the driving circuit may further include a gate driving circuit and a data driving circuit, and the data driving circuit and the gate driving circuit are connected to the pixel circuit in the display area 10a to provide electrical signals for the pixel circuit.
  • the data driving circuit is used to provide data signals
  • the gate driving circuit is used to provide scan signals, and can also be further used to provide various control signals, power signals, and the like.
  • the gate driving circuit and the data driving circuit can also be integrated in the silicon substrate through the above-mentioned semiconductor process.
  • a silicon substrate is used as the substrate 102 in the display panel 10, and the pixel circuit, the gate driving circuit, and the data driving circuit can all be integrated on the silicon substrate.
  • the gate drive circuit and the data drive circuit can also be arranged in the area corresponding to the display area 10a of the display panel 10, and not necessarily located in the non-display area. District 10b.
  • the display panel may further include a plurality of light-emitting elements, such as organic light-emitting diodes (OLED) or micro-light-emitting diodes (Micro/Mini OLED).
  • OLED organic light-emitting diodes
  • Micro/Mini OLED micro-light-emitting diodes
  • the light-emitting element 104 is arranged on the side of the driving circuit away from the substrate 102 and located in the display area 10a, and the light-emitting element 104 can be electrically connected to the transistor 103 in the pixel circuit.
  • the light-emitting element 104 may include an anode 1041, a light-emitting layer 1042, and a cathode 1043 sequentially formed on the driving substrate 105.
  • the anode 1041 may pass through a contact hole 108 filled with a conductive material (such as metal tungsten, etc.) and a plurality of conductive layers 106 , 107 and the drain electrode 1033 in the transistor 103 are electrically connected.
  • the anodes 1041 of the multiple light-emitting elements 104 are spaced apart from each other, and the cathodes 1043 of the multiple light-emitting elements 104 can be formed as a whole layer of film.
  • a pixel defining part (PDL) may be provided between adjacent anodes 1041, or a pixel defining part (PDL) may not be provided, depending on the specific situation.
  • the first pad 101 on the substrate 102 can be arranged in the same layer as the conductive structure in the display area 10a to save process.
  • the first pad 101 may be provided in the same layer as the conductive layer 107 of the topmost layer (farthest away from the substrate 102) below the light-emitting element 104 in the display area 10a.
  • the conductive layer 107 is reflective, for example, a laminated structure of titanium/titanium nitride/aluminum.
  • the conductive layer 107 includes a plurality of sub-layers arranged at intervals, which are respectively arranged in a one-to-one correspondence with the anode 1041 of each light-emitting element 104.
  • the conductive layer 107 can be set as a reflective layer for reflecting the light emitted by the light-emitting element 104 and improving the light extraction efficiency.
  • the orthographic projection of the anode 1041 of each light-emitting element 104 on the substrate 102 falls within the orthographic projection of the portion of the corresponding conductive layer on the substrate 102.
  • the anode 1041 may use a transparent conductive oxide material with a high work function, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and the like.
  • the display panel 10 further includes an encapsulation layer 109, a color film layer 110, a cover 111, etc. on the side of the light-emitting element 104 away from the substrate 102.
  • the first encapsulation layer 109 is configured to seal the light-emitting element 104 to prevent external moisture and oxygen from penetrating the light-emitting element 104 and the pixel circuit and causing damage to the device.
  • the first encapsulation layer 109 includes an inorganic thin film or a structure in which organic thin films and inorganic thin films are alternately stacked.
  • the color film layer 110 may include color blocks such as R (red), G (green), and B (blue).
  • the cover 111 is, for example, a glass cover. Wherein, an encapsulation layer 109 can also be provided between the color filter layer 110 and the cover plate 111 to encapsulate the color filter layer 110.
  • FIG. 3 is a bottom view of a flexible circuit board provided in some embodiments of the present disclosure
  • FIG. 4 is an enlarged view of area I in FIG. 3
  • FIG. 5 is a cross-sectional view along line AA' in FIG. 4
  • FIG. 6 is a view of the present disclosure
  • the schematic diagram of the connection between the flexible circuit board and the display panel provided in some embodiments is shown in conjunction with FIG. 3 to FIG.
  • the first wiring layer is disposed on the flexible substrate 201, the first wiring layer may include a main wiring portion 202b and a second pad 202a, and the first reinforcing plate 203 is disposed on a side of the first wiring layer away from the flexible substrate 201.
  • the orthographic projection of the main wiring portion 202b on the flexible substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201, and the first reinforcing plate 203 can be opposed to the main wiring portion 202b on the flexible circuit board 20. It has a protective effect, and in addition, it can also ensure the structural stability of the flexible circuit board 20, which facilitates the overall assembly of the product.
  • the number of the second pads 202a is multiple, and they are connected to the first pads 101 in a one-to-one correspondence (for example, connected by pressure bonding), and the length direction of each second pad 202a is the same as that of the first pad.
  • the length direction of the pad 101 may be the same, for example, extending along the X direction in FIGS. 1 and 3.
  • the second pad 202a is connected to the main wiring portion 202b, and at least a part of the second pad 202a is electrically connected to the first pad 101 through conductive glue, where the conductive glue includes conductive particles 30.
  • the conductive particles 30 are doped in colloid.
  • the second pad 202a includes a first connection portion 202a1 and a second connection portion 202a2 arranged along its length.
  • the first connection portion 202a1 is connected to the main wiring portion 202b, and the second connection portion 202a2 It is electrically connected to the first pad 101. It should be noted that FIG.
  • the first reinforcing plate 203 can be made to cover the part of the first connecting portion 202a1 close to the main wiring portion 202b, so as to avoid the main wiring portion 202b and the second The contact portion of the pad 202a is exposed.
  • the flexible substrate 201 and the first reinforcing plate 203 of the flexible circuit board 20 may have a single-layer structure or a multilayer structure; and the flexible substrate 201 and the first reinforcing plate 203 may adopt PI (poly (Imide) and other materials.
  • the first wiring layer can be made of materials such as Al (aluminum) or Cu (copper).
  • the thickness of the first reinforcing plate 203 may be greater than the thickness of the second pad 202a.
  • an anti-oxidation film layer with good conductivity such as a gold (Au) material film
  • Au gold
  • the conductive adhesive may be an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the anisotropic conductive film uses conductive particles 30 to connect the second pad 202a of the flexible circuit board 20 to the display
  • the first pad 101 of the panel 10 is bound to electrically conduct the flexible circuit board 20 and the display panel 10.
  • the anisotropic conductive glue is only conducted in the thickness direction of the flexible substrate 201, Therefore, it is possible to avoid short circuits between adjacent pads in the horizontal direction, so as to ensure the stability of the electrical connection between the flexible circuit board 20 and the display panel 10.
  • the anisotropic conductive adhesive is only conductive in the thickness direction of the flexible substrate 201, in the process of realizing the binding of multiple pairs of the first pad 101 and the second pad 202a, the anisotropy can be set on the entire surface. Conductive glue to reduce the difficulty of binding.
  • the first reinforcing plate 203 is located outside the display panel 10 in the first direction.
  • the first reinforcing plate 203 has a first edge facing the display panel 10.
  • the first direction is the length direction of the first pad 101, that is, the direction in which the second pad 202a is away from the display panel 10.
  • the first edge facing the display panel 10 means that the first edge E1 is an edge close to the display panel 10, and the overall direction of the first edge E1 is along the second direction.
  • FIG. 7 is a top view of a partial area of a flexible circuit board provided in a pair of scales
  • FIG. 8 is a schematic diagram of a connection between the flexible circuit board and a display panel in a pair of scales.
  • FIG. 7 shows an area of the same size as in FIG. 4, as shown in FIG. 7, in the comparative example, the first reinforcing plate 203 An edge E1 is straight. At this time, as shown in FIG.
  • the first edge E1 may be set to be wavy.
  • the first edge E1 includes: The curved protrusions E11 of the display panel 10 and the recesses E12 curved away from the display panel 10, the protrusions E11 and the recesses E12 are alternately arranged in the second direction, forming a wave shape.
  • the first edge E1 is set to be wavy, which can increase the length of the first edge E1. Therefore, when the conductive particles 30 in the conductive adhesive are discharged outward under the pressing force, It can be dispersed along the first edge E1, thereby reducing or preventing the accumulation of conductive particles, and improving the reliability of the flexible circuit board.
  • the protrusions E11 and the recesses E12 are both smooth patterns to prevent the conductive particles 30 from accumulating at a certain position of the protrusions E11 and the recesses E12, for example, the protrusions E11 and the recesses E12.
  • E12 are all arc-shaped, so that the conductive particles in the conductive adhesive can be evenly dispersed along the protrusion E11 and the recess E12.
  • the radius of the convex portion E11 and the radius of the concave portion E12 are both between 1.0 mm and 1.5 mm, for example, the radius of the convex portion E11 and the radius of the concave portion E12 are both 1.3 mm.
  • the radius of the protrusion E11 (or recess) refers to the radius of the circle where the arc protrusion E12 (or recess) is located.
  • the length of the single protrusion E11 in the second direction and the length of the single recess E12 in the second direction are equal. It is understandable that when the length of the convex portion E11 in the second direction and the length of the concave portion E12 in the second direction are equal, and the radius of the convex portion E11 and the radius of the concave portion E12 are also equal, a single convex The arc length of the portion E11 is equal to the arc length of the single recessed portion E12, which is more favorable for the conductive particles 30 to be uniformly dispersed along the first edge E1.
  • the connecting lines of the plurality of second pads 202a close to one end of the first reinforcing plate 203 may have substantially the same shape as the first edge E1.
  • one end of the plurality of second pads 202a close to the main wiring portion 202b is aligned with the first reinforcing plate 203, or a portion of each second pad 202a close to the main wiring portion 202b is covered by the first reinforcing plate 203
  • the length of each second pad 202a covered by the first reinforcing plate 203 is equal.
  • any position of the first edge E1 of the first reinforcing plate 203 and the display panel 10 that is, any position of the first edge E1 of the first reinforcing plate 203 will not be with
  • the display panel 10 is in contact, so as to ensure that part of the conductive particles 30 can be smoothly discharged to the space between the first edge E1 and the first reinforcing plate 203 when pressed together, and are dispersed along the wavy edge to further ensure the flexible circuit The reliability of the board 20.
  • the interval H1 between any position of the first edge E1 and the display panel 10 is between 200 ⁇ m and 1500 ⁇ m.
  • glue is applied to the space between the first edge E1 of the first reinforcing plate 203 and the display panel 10, so that the first The wiring layer is covered by the exposed part of the first reinforcing plate 203.
  • the interval between the first edge E1 and the display panel 203 can be set according to the width of the glue head.
  • the width of the glue applicator head of the glue applicator is 1000 ⁇ m
  • the closest distance between the protrusion E11 of the first edge E1 and the display panel 10 is at least 200 ⁇ m to prevent the conductive particles 30 in the conductive glue from accumulating
  • the farthest distance between the recessed portion E12 of one edge E1 and the display panel does not exceed 1000 ⁇ m, so as to ensure that when the glue applicator applies glue to the gap area between the first edge E1 and the display panel 10, the glue can remove the first wiring layer by the first wiring layer.
  • a reinforcing plate 203 covers the exposed part.
  • the flexible circuit board 20 further includes a second reinforcing plate 204, and the second reinforcing plate 204 can be made of materials such as PI (polyimide).
  • the second reinforcing plate 204 is located on the side of the flexible substrate 201 away from the first wiring layer.
  • the second reinforcing plate 204 includes at least a first reinforcing portion 204a.
  • the orthographic projection of the second pad 202a on the flexible substrate 201 is located on the first A reinforcing portion 204a is in the orthographic projection on the flexible substrate 201, and this design can increase the structural strength of the area where the second pad 202a is provided in the flexible circuit board 20.
  • the second reinforcing plate 204 further includes a second reinforcing portion 204b.
  • the second reinforcing portion 204b and the first reinforcing portion 204a are arranged in sequence in the first direction, and the second reinforcing portion 204b is flexible
  • the orthographic projection on the substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201.
  • a part of the second reinforcing plate 204 can also extend to the area where the main wiring portion 202b is provided in the flexible circuit board 20, and the part of the second reinforcing plate 204 that extends to the area where the main wiring portion 202b is located is the first Two reinforcement part 204.
  • the dimension H2 of the second reinforcing portion 204b in the first direction is not less than 500 ⁇ m, so as to further prevent the problem that the connection between the second pad 202a and the second pad 202a and the main wiring portion 202b is prone to breakage , To ensure the structural stability of the flexible circuit board 20 during the binding process.
  • the edge of the second reinforcing portion 204b away from the first reinforcing portion 203 may be linear, and since the first edge E1 of the first reinforcing plate 203 is not linear, the second reinforcing portion The width at different positions of 204b is different.
  • the above-mentioned “H2 is not less than 500 ⁇ m” means that the minimum width of the overlapping portion of the second reinforcing plate 204 and the first reinforcing plate 203 in the thickness direction of the flexible substrate 201 is not less than 500 ⁇ m.
  • the flexible circuit board 20 further includes a second wiring layer 205 and a third reinforcing plate 206, the second wiring layer 205 is located on the side of the flexible substrate 201 away from the first wiring layer, and The via 207 is electrically connected to the main wiring portion 202b, and the second wiring layer 205 can be made of materials such as Al (aluminum) or Cu (copper).
  • the third reinforcing plate 206 is arranged on the side of the second wiring layer 205 away from the flexible substrate 201.
  • the third reinforcing plate 206 can be made of materials such as PI (polyimide); among them, the second wiring layer 205 is The orthographic projection on the flexible substrate 201 is located in the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201 and in the orthographic projection of the third reinforcing plate 206 on the flexible substrate 201.
  • the flexible circuit board 20 is provided with two wiring layers to facilitate wiring, and the third reinforcing plate 206 can protect the second wiring layer 205, and in addition, the flexible circuit can be strengthened. The structural strength of the board 20.
  • the flexible circuit board 20 can not only be provided with two wiring layers, but also can be provided with more layers according to actual needs, such as three layers, four layers, etc., which are not specifically limited here.
  • multiple via holes 207 for connecting the first wiring layer and the second wiring layer 205 may be provided to ensure the stability of the connection between the first wiring layer and the second wiring layer 205.
  • the width of the interval 208 may be determined according to actual needs, and the embodiment of the present disclosure does not specifically limit it here.
  • a part of the third reinforcing plate 206 is located on the side of the second wiring layer 205 facing the second reinforcing portion 204b, so as to cover the end of the second wiring layer 205 close to the second reinforcing portion 204b to avoid
  • the second wiring layer 205 is oxidized, so as to ensure that the second wiring layer 205 has good conductivity; at the same time, it can also prevent the second wiring layer 205 from accidentally touching other conductive components at the interval 208.
  • the second reinforcing portion 204b and the first reinforcing portion 204a of the second reinforcing plate 204 may be an integral structure, which is beneficial to simplify the manufacturing process.
  • a full-surface film layer can be made on the side of the flexible substrate 201 away from the first circuit layer, and then cut at the position of the entire surface film layer corresponding to the interval 208 Or etch to form the second reinforcing plate 204 and the third reinforcing plate 206 that are disconnected from each other.
  • the manufacturing process of the second reinforcing plate 204 and the third reinforcing plate 206 is not limited to this, and the two can also be formed independently, depending on the specific situation.
  • An embodiment of the present disclosure also provides a display device, which includes the display module described in any of the foregoing embodiments.
  • the specific type of the display device is not particularly limited.
  • the types of display devices commonly used in this field can be used, such as display screens, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc., according to those skilled in the art
  • the specific purpose of the display device is selected accordingly, which will not be repeated here.

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Abstract

公开一种显示模组和一种显示装置，显示模组包括：显示面板，显示面板包括：衬底、驱动电路和第一焊盘，柔性电路板，柔性电路板包括：柔性基底、第一布线层及第一补强板，第一布线层设置在柔性基底上，第一布线层包括主走线部和第二焊盘，第一补强板设置在所述第一布线层背离柔性基底的一侧；主走线部在柔性基底上的正投影位于第一补强板在柔性基底上的正投影内；第二焊盘与所述主走线部连接，第二焊盘的至少一部分与第一焊盘通过导电胶电连接，导电胶包括导电颗粒；在第一方向上，第一补强板位于显示面板的外侧，第一补强板具有朝向显示面板的第一边缘，所述第一边缘包括：凸出部和凹陷部，凹陷部和凸出部在第二方向上交替设置，形成波浪状。

Description

显示模组和显示装置 技术领域
本公开涉及显示技术领域，具体涉及一种显示模组和显示装置。
背景技术
随着虚拟现实(Virtual Reality,简称VR)技术和增强现实(Augmented Reality，简称AR)技术的日益进步，适用于VR/AR领域的显示装置也正在向微型化、高像素密度(Pixel Per Inch,简称PPI)、快速响应和高色域的方向发展。硅基微显示OLED(Organic Light-Emitting Diode，有机电激光显示)面板正是其中突出的一个方向。
为了方便模组组装，柔性电路板(Flexible Printed Circuit；简称：FPC)成为硅基OLED与驱动端连接的主要方式，因此，对柔性电路板的设计及柔性电路板与硅基OLED的绑定工艺提出了更高的要求。
发明内容
本公开旨在至少解决现有技术中存在的技术问题之一，提出了一种显示模组和显示装置。
为了实现上述目的，本公开提供一种显示模组，包括：
显示面板，所述显示面板包括显示区和绑定区，所述绑定区位于所述显示区的至少一侧，所述显示面板包括：衬底、驱动电路和第一焊盘，所述驱动电路和所述第一焊盘均设置在所述衬底上，所述第一焊盘位于所述绑定区；所述驱动电路与所述第一焊盘电连接，所述驱动电路至少包括位于所述显示区的晶体管，所述晶体管的半导体层嵌设于所述衬底上；
柔性电路板，所述柔性电路板包括：柔性基底、第一布线层及第一补强板，所述第一布线层设置在所述柔性基底上，所述第一布线层 包括主走线部和第二焊盘，所述第一补强板设置在所述第一布线层背离所述柔性基底的一侧；
其中，所述主走线部在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内；所述第二焊盘与所述主走线部连接，且所述第二焊盘的至少一部分与所述第一焊盘通过导电胶电连接，所述导电胶包括导电颗粒；
在第一方向上，所述第一补强板位于所述显示面板的外侧，所述第一补强板具有朝向所述显示面板的第一边缘，所述第一边缘包括：朝向所述显示面板弯曲的凸出部和背离所述显示面板弯曲的凹陷部，所述凹陷部和所述凸出部在第二方向上交替设置，形成波浪状；所述第一方向为所述第二焊盘远离显示面板的方向，所述第二方向与所述第一方向交叉。
在一些实施例中，所述凸出部和所述凹陷部均为弧形。
在一些实施例中，所述凸出部的半径和所述凹陷部的半径均在1.0mm～1.5mm之间。
在一些实施例中，单个所述凸出部的弧长和单个所述凹陷部的弧长均在1.0mm～1.6mm之间。
在一些实施例中，单个所述凸起部在所述第二方向上的长度和单个所述凹陷部在所述第二方向上的长度相等。
在一些实施例中，所述第一边缘的任意位置与所述显示面板之间均具有间隔。
在一些实施例中，所述第一边缘的任意位置与所述显示面板之间的间隔在200μm～1500μm之间。
在一些实施例中，所述柔性电路板还包括第二补强板，所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板至少包括第一补强部，所述第二焊盘在所述柔性基底上的正投影位于所述第一补强部在所述柔性基底上的正投影内。
在一些实施例中，所述第二补强板还包括第二补强部，所述第二 补强部与所述第一补强部在所述第一方向上依次排布，且所述第二补强部在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
在一些实施例中，所述第二补强板的第一补强部和第二补强部为一体结构。
在一些实施例中，所述第二补强部在所述第一方向上的尺寸不小于500μm。
在一些实施例中，所述柔性电路板还包括第二布线层和第三补强板，所述第二布线层位于所述柔性基底背离所述第一布线层的一侧，并通过过孔与所述主走线部电连接；所述第三补强板设置在所述第二布线层背离所述柔性基底的一侧；
其中，所述第二布线层在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内，且位于所述第三补强板在所述柔性基底上的正投影内。
在一些实施例中，所述第三补强板与所述第二补强板之间具有间隔。
在一些实施例中，所述第三补强板的一部分位于所述第二布线层朝向所述第二补强部的一侧。
在一些实施例中，所述导电胶为异方性导电胶。
在一些实施例中，所述显示面板还包括：
位于所述显示区的发光元件，所述发光元件设置在所述驱动电路背离衬底的一侧，所述发光元件与所述晶体管电连接。
本公开实施例还提供一种显示装置，包括上述的显示模组。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1为本公开的一些实施例中提供的显示模组的示意图。
图2为本公开的一些实施例中提供的显示面板的示意图。
图3为本公开的一些实施例中提供的柔性电路板的仰视图。
图4为图3中I区域的放大图。
图5为沿图4中AA'线的剖视图。
图6为本公开的一些实施例中提供的柔性电路板与显示面板连接的示意图。
图7为一对比例中提供的柔性电路板的局部区域仰视图。
图8为一对比例中柔性电路板与显示面板的连接示意图。
具体实施方式
以下结合附图对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
这里用于描述本公开的实施例的术语并非旨在限制和/或限定本公开的范围。例如，除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。应该理解的是，本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。除非上下文另外清楚地指出，否则单数形式“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前 面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。
图1为本公开的一些实施例中提供的显示模组的示意图，如图1所示，显示模组包括显示面板和柔性电路板。图2为本公开的一些实施例中提供的显示面板的示意图，结合图1和图2所示，显示面板10包括显示区10a及位于显示区10a至少一侧的绑定区10b。显示面板10包括：衬底102、驱动电路和第一焊盘101，驱动电路和第一焊盘101均设置在衬底102上。
在一些实施例中，第一焊盘101位于绑定区10b，第一焊盘101可为单层或多层结构，且第一焊盘101可采用金属或合金等材料制作而成，例如：由铜、钼、铝及钛等形成的金属单层或多层结构，但不限于此，第一焊盘101也可采用其他导电材料制作而成。第一焊盘101通常用于在显示区10a的器件制作完成后，与外部元件(例如：柔性电路板20)进行绑定(Bonding)，从而为显示面板10提供信号。其中，第一焊盘的数量为多个，每个第一焊盘可以为长条形，第一焊盘的长度方向可以沿第一方向(图1和图2中的X方向)，多个第一焊盘沿与第一方向交叉的第二方向(图1和图2中的Y方向)排列，例如，第二方向与第一方向垂直。
在一些实施例中，衬底102为硅基衬底，该硅基板例如为单晶硅或高纯度硅。驱动电路可形成在衬底102上，以使其整体形成为驱动基板105。应当理解的是，驱动电路可包括位于显示区10a的电路结构，也可包括位于绑定区10b的电路结构。驱动电路可与绑定区10b的第一焊盘101电连接，该第一焊盘101与柔性电路板20的第二焊盘202a进行绑定，从而为显示面板10提供信号。
其中，如图2所示，驱动电路至少可包括位于显示区10a的像素 电路，像素电路包括多个晶体管103，像素电路可通过半导体工艺形成于硅基板上，例如：通过掺杂工艺在硅基板上形成晶体管103的半导体层1031(即：有源层)、源电极1032和漏电极1033，并通过硅氧化工艺形成绝缘层1034，以及通过溅射工艺或其他工艺形成栅极1035和多个导电层106、107等。晶体管103的半导体层1031嵌设于衬底102上；即，在衬底102为硅基板时，半导体层1031可属于硅基板的部分。
需要说明的是，驱动电路还可包括栅极驱动电路和数据驱动电路，数据驱动电路和栅极驱动电路与显示区10a中的像素电路连接，从而为像素电路提供电信号。例如，数据驱动电路用于提供数据信号，栅极驱动电路用于提供扫描信号，还可以进一步用于提供各种控制信号、电源信号等。
其中，栅极驱动电路和数据驱动电路也可以通过上述半导体工艺集成在硅基板中。也就是说，在显示面板10采用硅基板作为衬底102，该像素电路、该栅极驱动电路和数据驱动电路都可以集成于该硅基板上。在此情形下，由于硅基电路可以实现较高的精度，栅极驱动电路和数据驱动电路例如也可以设置在对应于该显示面板10的显示区10a的区域中，而并不一定位于非显示区10b。
可选地，显示面板还可以包括多个发光元件，发光元件例如为有机发光二极管(OLED)或微型发光二极管(Micro/Mini OLED)。
发光元件104设置在驱动电路背离衬底102的一侧并位于显示区10a，发光元件104可与像素电路中的晶体管103电连接。例如，发光元件104可包括依次形成在驱动基板105上的阳极1041、发光层1042及阴极1043，阳极1041可通过填充有导电材料(例如：金属钨等)的接触孔108及多个导电层106、107与晶体管103中的漏电极1033实现电连接。
其中，多个发光元件104的阳极1041相互间隔开，而多个发光元件104的阴极1043可形成为整层膜层。其中，相邻阳极1041之间可以设置像素界定部(PDL)，也可不设置像素界定部(PDL)，视具体情 况而定。
衬底102上的第一焊盘101可以和显示区10a中的导电结构同层设置以节省工艺。例如，第一焊盘101可以与显示区10a中发光元件104以下的最顶层(最远离衬底102)的导电层107同层设置。
在一些实施例中，导电层107具有反射性，例如为钛/氮化钛/铝的层叠结构。例如，该导电层107包括间隔设置的多个子层，分别与各发光元件104的阳极1041一一对应设置。在顶发射结构中，该导电层107可以设置为反射层，用于反射发光元件104发出的光线，提高出光效率。例如，每个发光元件104的阳极1041在衬底102上的正投影落入其对应的导电层的部分在该衬底102上的正投影内。在这种情形，阳极1041可以采用具有高功函数的透明导电氧化物材料，例如ITO(氧化铟锡)、IZO(氧化铟锌)等。
在一些实施例中，显示面板10还包括位于发光元件104远离衬底102一侧的封装层109、彩膜层110以及盖板111等。例如，第一封装层109配置为对发光元件104进行密封以防止外界的湿气和氧向该发光元件104及像素电路的渗透而造成对器件的损坏。例如，第一封装层109包括无机薄膜或者包括有机薄膜及无机薄膜交替层叠的结构。彩膜层110可包括R(红)、G(绿)、B(蓝)等色块。盖板111例如为玻璃盖板。其中，在彩膜层110以及盖板111之间也可设置封装层109，以对彩膜层110进行封装。
图3为本公开的一些实施例中提供的柔性电路板的仰视图，图4为图3中I区域的放大图，图5为沿图4中AA'线的剖视图，图6为本公开的一些实施例中提供的柔性电路板与显示面板连接的示意图，结合图3至图6所示，柔性电路板20包括柔性基底201、第一布线层及第一补强板203。第一布线层设置在柔性基底201上，第一布线层可包括主走线部202b和第二焊盘202a，第一补强板203设置在第一布线层背离柔性基底201的一侧。
例如，主走线部202b在柔性基底201上的正投影位于第一补强板203在柔性基底201的正投影内，第一补强板203可对柔性电路板20 上的主走线部202b起到保护作用，另外，还可保证柔性电路板20的结构稳定性，方便产品的整体组装。
例如，第二焊盘202a的数量为多个，且与第一焊盘101一一对应连接(例如，通过压合绑定的方式连接)，每个第二焊盘202a的长度方向与第一焊盘101的长度方向可以相同，例如，沿图1和图3中的X方向延伸。
第二焊盘202a与主走线部202b连接，且第二焊盘202a的至少一部分与第一焊盘101通过导电胶电连接，其中，导电胶包括导电颗粒30。例如，导电颗粒30掺杂在胶体中。应当理解的是，由于第二连接部202a2与第一焊盘101电连接，因此，第二连接部202a2的至少一部分在柔性基底201上的正投影与第一补强板203在柔性基底201上的正投影无交叠。
例如，如图6所示，第二焊盘202a包括沿其长度方向排列的第一连接部202a1和第二连接部202a2，第一连接部202a1与主走线部202b连接，第二连接部202a2与第一焊盘101电连接。需要说明的是，图6中示出了第二焊盘202a未被第一补强板203覆盖的情况，但应当理解的是，为了避免主走线部202b中与第二焊盘202a相接的部位被氧化，在制作柔性电路板20的过程中，可使第一补强板203覆盖第一连接部202a1中靠近主走线部202b的部分，以避免主走线部202b中与第二焊盘202a相接的部位露出。
在一些实施例中，柔性电路板20的柔性基底201、第一补强板203可为单层结构，也可为多层结构；且柔性基底201、第一补强板203可采用PI(聚酰亚胺)等材料制作而成。第一布线层可采用Al(铝)或Cu(铜)等材料制作而成。为了保证柔性电路板20的结构稳定性，第一补强板203的厚度可以大于第二焊盘202a的厚度。
在一些实施例中，可在第二焊盘202a上涂覆具有良好导电性的抗氧化膜层，例如：金(Au)材料薄膜等，从而防止第二焊盘202a上未被第一补强板203覆盖的部分发生氧化，以保证第二焊盘202a具有良好的导电性能。由于第二焊盘202a上涂覆有抗氧化膜层，因此，第二 焊盘202a的厚度大于主走线部202b的厚度。
在一些实施例中，导电胶可为异方性导电胶膜(Anisotropic Conductive Film，简称：ACF)，该异方性导电胶膜利用导电粒子30将柔性电路板20的第二焊盘202a与显示面板10的第一焊盘101进行绑定，以使柔性电路板20与显示面板10之间电性导通，同时，由于异方性导电胶只在柔性基底201的厚度方向上导通，因此，可避免在水平方向上相邻焊盘间出现短路的情况，以保证柔性电路板20与显示面板10之间电性连接稳定性。此外，由于异方性导电胶只在柔性基底201的厚度方向上导通，因此，在实现多对第一焊盘101与第二焊盘202a绑定的过程中，可整面设置异方性导电胶，以降低绑定难度。
在一些实施例中，在第一方向上，第一补强板203位于显示面板10的外侧。第一补强板203具有朝向显示面板10的第一边缘。如上文所述，第一方向为第一焊盘101的长度方向，也即第二焊盘202a远离显示面板10的方向。需要说明的是，朝向显示面板10的第一边缘是指，第一边缘E1为靠近显示面板10的边缘，且第一边缘E1的整体走向沿第二方向。
图7为一对比例中提供的柔性电路板的局部区域俯视图，图8为一对比例中柔性电路板与显示面板的连接示意图。为体现本公开实施例与对比例中柔性电路板的区别，图7中示出了与图4中相同大小的区域，如图7所示，在对比例中，第一补强板203的第一边缘E1为直线状。此时，如图8所示，在柔性线路板20与显示面板10的压合绑定的过程中，导电胶中的导电粒子30由于受到压合力会向外排出，从而在柔性电路板20朝向显示面板10的断面处堆积大量的导电粒子30，进而导致柔性电路板20的信赖性变差。
为了对柔性电路板20断面处的导电粒子进行分散，在本公开实施例中，可将第一边缘E1设置为波浪状，例如，结合图4和图6所示，第一边缘E1包括：朝向显示面板10弯曲的凸出部E11和背离显示面板10弯曲的凹陷部E12，凸出部E11和凹陷部E12在第二方向上交替设置，形成波浪状。和图7中直线状的边缘相比，将第一边缘E1设置 为波浪状，可以增加第一边缘E1的长度，因此，当导电胶中的导电粒子30在受到压合力而向外排出时，可以沿第一边缘E1分散开，从而减少或防止导电粒子发生堆积的情况，提高柔性电路板的信赖性。
在一些实施例中，凸出部E11和凹陷部E12均为平滑的图形，以防止导电粒子30在凸出部E11和凹陷部E12的某一位置产生堆积，例如，凸出部E11和凹陷部E12均为弧形，从而使导电胶中的导电粒子可以沿凸出部E11和凹陷部E12均匀分散开。
可选地，凸出部E11的半径和凹陷部E12的半径均在1.0mm～1.5mm之间，例如，凸出部E11的半径和凹陷部E12的半径均为1.3mm。应当理解的是，凸出部E11(或凹陷部)的半径是指，呈弧形的凸出部E12(或凹陷部)所在圆的半径。
在一些实施例中，单个凸起部E11在第二方向上的长度和单个凹陷部E12在第二方向上的长度相等。可以理解的是，当凸起部E11在第二方向上的长度和凹陷部E12在第二方向上的长度相等，且凸起部E11的半径和凹陷部E12的半径也相等时，单个凸起部E11的弧长和单个凹陷部E12的弧长相等，从而更有利于导电粒子30沿第一边缘E1进行均匀分散。
在一些实施例中，多个第二焊盘202a靠近第一补强板203的一端的连线可以与第一边缘E1的形状大致相同。例如，多个第二焊盘202a靠近主走线部202b的一端与第一补强板203对齐，或者，每个第二焊盘202a靠近主走线部202b的一部分被第一补强板203覆盖，且每个第二焊盘202a被第一补强板203所覆盖的长度相等。
在一些实施例中，第一补强板203的第一边缘E1的任意位置与显示面板10之间均具有间隔，即，第一补强板203的第一边缘E1的任意位置均不会与显示面板10接触，从而保证部分导电粒子30在受到压合时可以顺利排出至第一边缘E1与第一补强板203之间的间隔处，并沿波浪形的边缘分散开，进一步保证柔性电路板20的信赖性。
例如，第一边缘E1的任意位置与显示面板10之间的间隔H1在200μm～1500μm之间。示例性地，在生产过程中，将柔性电路板20 与显示面板10绑定之后，还在第一补强板203的第一边缘E1与显示面板10的间隔区域进行涂胶，从而将第一布线层被第一补强板203暴露出的部分覆盖。此时，第一边缘E1与显示面板203之间的间隔可以根据涂胶头的宽度设置。例如，涂胶设备的涂胶头的宽度为1000μm，则第一边缘E1的凸出部E11与显示面板10的最近距离至少为200μm，以防止导电胶中的导电粒子30发生堆积；另外，第一边缘E1的凹陷部E12与显示面板的最远距离不超过1000μm，以保证涂胶设备在第一边缘E1与显示面板10之间的间隔区域涂胶时，胶体可以将第一布线层被第一补强板203暴露出的部分覆盖。
在一些实施例中，如图6所示，柔性电路板20还包括第二补强板204，此第二补强板204可采用PI(聚酰亚胺)等材料制作而成。此第二补强板204位于柔性基底201背离第一布线层的一侧，第二补强板204至少包括第一补强部204a，第二焊盘202a在柔性基底201上的正投影位于第一补强部204a在柔性基底201上的正投影内，这样设计可增加柔性电路板20中设置第二焊盘202a的区域的结构强度。
可选地，第二补强板204还包括第二补强部204b，此第二补强部204b与第一补强部204a在第一方向上依次排列，且第二补强部204b在柔性基底201上的正投影位于第一补强板203在柔性基底201上的正投影内。也就是说，第二补强板204的一部分还可延伸至柔性电路板20中设置主走线部202b的区域，第二补强板204延伸至主走线部202b所在区域的部分即为第二补强部204。这样可以避免柔性电路板20中第二焊盘202a所在区域与主走线部202b所在区域的交界处出现刚性突变，因此可以避免在第二焊盘202a与第一焊盘101压合绑定过程中，交界处容易损坏的情况，即：避免第二焊盘202a及第二焊盘202a与主走线部202b的连接处容易发生断裂的问题，以保证柔性电路板20在绑定过程中的结构稳定性。
可选地，第二补强部204b在第一方向上的尺寸H2不小于500μm，以进一步防止第二焊盘202a及第二焊盘202a与主走线部202b的连接处容易发生断裂的问题，保证柔性电路板20在绑定过程中的结构稳定 性。
需要说明的是，第二补强部204b远离第一补强部203的边缘可以为直线形，而由于第一补强板203的第一边缘E1并不是直线形，因此，第二补强部204b不同位置的宽度是不同的，上述“H2不小于500μm”是指，第二补强板204与第一补强板203在柔性基底201的厚度方向上交叠部分的最小宽度不小于500μm。
在一些实施例中，如图6所示，柔性电路板20还包括第二布线层205和第三补强板206，第二布线层205位于柔性基底201背离第一布线层的一侧，并通过过孔207与主走线部202b电连接，此第二布线层205可采用Al(铝)或Cu(铜)等材料制作而成。第三补强板206设置在第二布线层205背离柔性基底201的一侧，第三补强板206可采用PI(聚酰亚胺)等材料制作而成；其中，第二布线层205在柔性基底201上的正投影位于第一补强板203在柔性基底201的正投影内，且位于第三补强板206在柔性基底201的正投影内。本公开实施例中，通过将柔性电路板20设置两层走线层可方便布线，且通过设置第三补强板206可以对第二布线层205起到保护的作用，另外还可加强柔性电路板20的结构强度。
需要说明的是，柔性电路板20不仅可以设置两层走线层，还可根据实际需要设置更多层，例如：三层、四层等等，在此不做具体限定。
另外，用于连接第一布线层和第二布线层205的过孔207可设置有多个，以保证第一布线层和第二布线层205之间的连接稳定性。
在一些实施例中，第三补强板206与第二补强部204b之间具有间隔208，从而提高柔性电路板20的弯折能力。间隔208的宽度可以根据实际需要而定，本公开实施例在此不做具体限定。
在一些实施例中，第三补强板206的一部分位于第二布线层205朝向第二补强部204b的一侧，从而将第二布线层205靠近第二补强部204b的一端覆盖，避免第二布线层205被氧化，从而保证第二布线层205具有良好导电性；同时还可避免第二布线层205在间隔208处与其他导电部件发生误触的情况。
其中，第二补强板204的第二补强部204b与第一补强部204a可以为一体结构，从而有利于简化制作工艺。在制作第二补强板204和第三补强板206时，可先在柔性基底201背离第一电路层的一侧制作一整面膜层，然后在整面膜层对应于间隔208的位置进行切割或刻蚀，以形成相互断开的第二补强板204和第三补强板206。需要说明的是，第二补强板204和第三补强板206的制作过程不限于此，二者也可分别独立形成，视具体情况而定。
本公开的实施例还提供一种显示装置，其包括上述任一实施例所述的显示模组。所述显示装置的具体类型不受特别的限制，本领域常用的显示装置类型均可，具体例如显示屏、手机等移动装置、手表等可穿戴设备、VR装置等等，本领域技术人员可根据该显示装置的具体用途进行相应地选择，在此不再赘述。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (17)

  1. 一种显示模组，包括：
    显示面板，所述显示面板包括显示区和绑定区，所述绑定区位于所述显示区的至少一侧，所述显示面板包括：衬底、驱动电路和第一焊盘，所述驱动电路和所述第一焊盘均设置在所述衬底上，所述第一焊盘位于所述绑定区；所述驱动电路与所述第一焊盘电连接，所述驱动电路至少包括位于所述显示区的晶体管，所述晶体管的半导体层嵌设于所述衬底上；
    柔性电路板，所述柔性电路板包括：柔性基底、第一布线层及第一补强板，所述第一布线层设置在所述柔性基底上，所述第一布线层包括主走线部和第二焊盘，所述第一补强板设置在所述第一布线层背离所述柔性基底的一侧；
    其中，所述主走线部在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内；所述第二焊盘与所述主走线部连接，且所述第二焊盘的至少一部分与所述第一焊盘通过导电胶电连接，所述导电胶包括导电颗粒；
    在第一方向上，所述第一补强板位于所述显示面板的外侧，所述第一补强板具有朝向所述显示面板的第一边缘，所述第一边缘包括：朝向所述显示面板弯曲的凸出部和背离所述显示面板弯曲的凹陷部，所述凹陷部和所述凸出部在第二方向上交替设置，形成波浪状；所述第一方向为所述第二焊盘远离显示面板的方向，所述第二方向与所述第一方向交叉。
  2. 根据权利要求1所述的显示模组，其中，所述凸出部和所述凹陷部均为弧形。
  3. 根据权利要求2所述的显示模组，其中，所述凸出部的半径和 所述凹陷部的半径均在1.0mm～1.5mm之间。
  4. 根据权利要求2所述的显示模组，其中，单个所述凸出部的弧长和单个所述凹陷部的弧长均在1.0mm～1.6mm之间。
  5. 根据权利要求1至4中任意一项所述的显示模组，其中，单个所述凸起部在所述第二方向上的长度和单个所述凹陷部在所述第二方向上的长度相等。
  6. 根据权利要求1至4所述的显示模组，其中，所述第一边缘的任意位置与所述显示面板之间均具有间隔。
  7. 根据权利要求1至4中任意一项所述的显示模组，其中，所述第一边缘的任意位置与所述显示面板之间的间隔在200μm～1500μm之间。
  8. 根据权利要求1至4中任意一项所述的显示模组，其中，所述柔性电路板还包括第二补强板，所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板至少包括第一补强部，所述第二焊盘在所述柔性基底上的正投影位于所述第一补强部在所述柔性基底上的正投影内。
  9. 根据权利要求8所述的显示模组，其中，所述第二补强板还包括第二补强部，所述第二补强部与所述第一补强部在所述第一方向上依次排布，且所述第二补强部在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
  10. 根据权利要求9所述的显示模组，其中，所述第二补强板的第一补强部和第二补强部为一体结构。
  11. 根据权利要求9所述的显示模组，其中，所述第二补强部在所述第一方向上的尺寸不小于500μm。
  12. 根据权利要求8所述的显示模组，其中，所述柔性电路板还包括第二布线层和第三补强板，所述第二布线层位于所述柔性基底背离所述第一布线层的一侧，并通过过孔与所述主走线部电连接；所述第三补强板设置在所述第二布线层背离所述柔性基底的一侧；
    其中，所述第二布线层在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内，且位于所述第三补强板在所述柔性基底上的正投影内。
  13. 根据权利要求12所述的显示模组，其中，所述第三补强板与所述第二补强板之间具有间隔。
  14. 根据权利要求12所述的显示模组，其中，所述第三补强板的一部分位于所述第二布线层朝向所述第二补强部的一侧。
  15. 根据权利要求1至4中任意一项所述的显示模组，其中，所述导电胶为异方性导电胶。
  16. 根据权利要求1至4中任意一项所述的显示模组，其中，所述显示面板还包括：
    位于所述显示区的发光元件，所述发光元件设置在所述驱动电路背离衬底的一侧，所述发光元件与所述晶体管电连接。
  17. 一种显示装置，包括权利要求1至16中任意一项所述的显示模组。
PCT/CN2021/086177 2020-05-25 2021-04-09 显示模组和显示装置 WO2021238443A1 (zh)

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