WO2019230334A1 - 配線回路基板 - Google Patents

配線回路基板 Download PDF

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Publication number
WO2019230334A1
WO2019230334A1 PCT/JP2019/018713 JP2019018713W WO2019230334A1 WO 2019230334 A1 WO2019230334 A1 WO 2019230334A1 JP 2019018713 W JP2019018713 W JP 2019018713W WO 2019230334 A1 WO2019230334 A1 WO 2019230334A1
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WO
WIPO (PCT)
Prior art keywords
metal
wiring
circuit board
thickness direction
base
Prior art date
Application number
PCT/JP2019/018713
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
柴田　直樹
良介 笹岡
恭也 大薮
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020207033984A priority Critical patent/KR102791341B1/ko
Priority to CN201980036057.8A priority patent/CN112219455A/zh
Publication of WO2019230334A1 publication Critical patent/WO2019230334A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Definitions

  • the present invention relates to a printed circuit board.
  • a heat sink having a flat base portion and comb-like fins extending downward from the lower surface of the base portion is installed on the lower surface of the substrate on which the heating element is mounted on the upper surface, and heat generated from the heating element is transferred to the heat sink.
  • a heat dissipation structure that discharges from a fin is known (for example, see Patent Document 1 below).
  • the present invention provides a printed circuit board excellent in heat dissipation.
  • the present invention (1) includes a plurality of wiring bodies that are arranged in parallel at intervals, and each of the plurality of wiring bodies includes an insulating portion and a wiring portion that is disposed on one surface in the thickness direction of the insulating portion. And the ratio (T / W) of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies is 2 or more.
  • a printed circuit board including a support portion.
  • the heat generated in the wiring portion can be convected through the air between the plurality of wiring bodies to achieve efficient heat dissipation. it can.
  • the support portion increases the contact area with the air. Can do. Therefore, the heat dissipation efficiency based on the above convection is excellent.
  • T / W the support portion is made of a metal-based material
  • the heat conducted from the wiring portion to the insulating portion is efficiently directed toward the other side in the thickness direction. Can be released.
  • this wired circuit board is excellent in heat dissipation in the wiring body.
  • the one support portion has a side surface facing the one support portion and the other support portion adjacent in the parallel direction, and the area of the side surface is equal to the side surface.
  • the printed circuit board according to (1) which is larger than a projected area when projected in a direction, is included.
  • the present invention (3) includes the printed circuit board according to (1) or (2), wherein a material of the support portion is a metal.
  • the material of the support portion is a metal, the heat dissipation from the support portion is excellent.
  • connection body which connects the orthogonal
  • the said connection body is at the orthogonal
  • connection support portion when the connection support portion is projected in the thickness direction, the connection support portion continues in the parallel direction so as to include the plurality of terminal portions, so that the connection support portion can reliably support the plurality of terminal portions. it can.
  • the heat dissipation in the wiring body is excellent, and the mechanical strength of the terminal portion in the coupling body is also excellent.
  • the wired circuit board of the present invention is excellent in heat dissipation in the wiring body.
  • FIG. 1 shows a plan view of an embodiment of a printed circuit board according to the present invention.
  • 2A and 2B are cross-sectional views of the printed circuit board shown in FIG. 1.
  • FIG. 2A is a cross-sectional view taken along the line AA
  • FIG. 2B is a cross-sectional view taken along the line BB.
  • FIG. 1 An embodiment of the printed circuit board of the present invention will be described with reference to FIGS. 1, 2A, and 2B.
  • the base insulating layer 7 and the cover insulating layer 9 described later are omitted to clearly show the relative arrangement of the metal-based support layer 6 and the conductor layer 8 described later.
  • the printed circuit board 1 has one surface in the thickness direction and the other surface, and has a shape extending in the longitudinal direction perpendicular to the thickness direction. As shown in FIG. 1, the printed circuit board 1 integrally includes a first connection body 2 as an example of a connection body, a second connection body 3 as an example of a connection body, and a wiring body 4. Preferably, the printed circuit board 1 includes only the first connection body 2, the second connection body 3, and the wiring body 4.
  • the first connecting body 2 forms one end of the printed circuit board 1 in the longitudinal direction.
  • the first connector 2 has a substantially rectangular flat plate shape in plan view.
  • the dimension in the planar view of the 1st coupling body 2 is not specifically limited.
  • the second connection body 3 forms the other end portion in the longitudinal direction of the printed circuit board 1 and is disposed opposite to the first connection body 2 on the other side in the longitudinal direction with the wiring body 4 interposed therebetween.
  • the second connector 3 has a substantially rectangular flat plate shape in plan view. The dimension in planar view of the 2nd coupling body 3 is not specifically limited.
  • the wiring body 4 forms an intermediate portion (or central portion) in the longitudinal direction of the printed circuit board 1.
  • the wiring body 4 is disposed between the first connecting body 2 and the second connecting body 3 in plan view.
  • the wiring body 4 has a shape extending in the longitudinal direction.
  • the wiring body 4 bridges the first connecting body 2 and the second connecting body 3 in the longitudinal direction.
  • a plurality of wiring bodies 4 are arranged in parallel at intervals in the short direction (direction perpendicular to the longitudinal direction and the thickness direction) of the printed circuit board 1 (an example of the parallel direction of the wiring bodies 4). Yes.
  • An opening 5 is formed between adjacent wiring bodies 4.
  • the opening 5 divides the wiring body 4 in the short direction of the printed circuit board 1, for example.
  • the opening 5 has a slit shape extending in the longitudinal direction and penetrates the printed circuit board 1 in the thickness direction.
  • the longitudinal ends of the plurality of wiring bodies 4 are connected in the short direction by one first connecting body 2. Thereby, the longitudinal direction one end part of the some wiring body 4 is bundled by the one 1st connection body 2.
  • the length in the longitudinal direction of the wiring body 4 is an interval in the longitudinal direction of the first connecting body 2 and the second connecting body 3, and is appropriately set according to the use and purpose.
  • the length in the short-side direction of each of the plurality of wiring bodies 4 is, for example, 500 ⁇ m or less, preferably 300 ⁇ m or less, more preferably 100 ⁇ m or less, and for example, 10 ⁇ m or more.
  • the length in the short direction of the opening 5 is, for example, 10 ⁇ m or more, preferably 50 ⁇ m or more, more preferably 100 ⁇ m or more, and for example, 1000 ⁇ m or less.
  • the ratio of the length in the short direction of the wiring body 4 to the length in the short direction of the opening 5 is, for example, 40 or less, preferably 10 or less, for example, 0.1 or more, preferably 0. .5 or more.
  • this wired circuit board 1 includes a metal-based support layer 6, a base insulating layer 7 disposed on one surface in the thickness direction of the metal-based support layer 6, A conductor layer 8 disposed on one surface in the thickness direction of the base insulating layer 7 and a cover insulating layer 9 disposed on the one surface in the thickness direction of the base insulating layer 7 so as to partially cover the conductor layer 8 are provided.
  • the printed circuit board 1 preferably includes only the metal-based support layer 6, the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9.
  • the metal-based support layer 6 forms the other surface in the thickness direction of the printed circuit board 1. As shown in FIGS. 1, 2 ⁇ / b> A, and 2 ⁇ / b> B, the metal-based support layer 6 has the same outer shape as the printed circuit board 1. Specifically, the metal-based support layer 6 has an outer shape corresponding to the first connection body 2, the second connection body 3, and the wiring body 4.
  • the part forming the first connection body 2 is a first connection metal part 13 as an example of a connection support part
  • the part forming the second connection body 3 is an example of a connection support part.
  • the second connecting metal part 14 as a part, and the part forming the wiring body 4 is a wiring body metal part 15 as an example of a support part.
  • the first connecting metal portion 13 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of first terminal portions 11 to be described later in plan view.
  • the second connecting metal portion 14 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of second terminal portions 12 described later in plan view.
  • the wiring body metal portion 15 defines the other side portion of the opening 5 in the thickness direction.
  • the wiring body metal part 15 has a substantially rectangular shape that is long in the thickness direction on a cut surface (synonymous with a sectional view) cut along the thickness direction and the short direction.
  • the metal-based support layer 6 is a metal that is a first metal surface 21 that is one surface in the thickness direction, a second metal surface 22 that is the other surface in the thickness direction, and a side surface that connects the peripheral edges in the thickness direction.
  • a side surface 23 is integrally provided.
  • the first metal surface 21 and the second metal surface 22 are opposed to each other in the thickness direction and are parallel flat surfaces.
  • the metal side surface 23 is a flat surface that extends straight along the thickness direction. Further, the metal side surface 23 of the wiring body metal portion 15 is also a flat surface extending straight along the longitudinal direction.
  • the metal side surface 23 in the wiring body metal portion 15 includes a metal inner side surface 31 facing the opening 5 and a metal outer surface 32 facing the outer side in the lateral direction.
  • the metal inner side surface 31 is an example of a side surface facing one wiring body metal portion 15 and another wiring body metal portion 15 adjacent in the short direction.
  • the two metal inner side surfaces 31 facing (facing) across the opening 5 are parallel to each other, and are also parallel to a conductor side surface 29 of the main wiring portion 10 described later in plan view.
  • the area S0 of the metal inner side surface 31 is the same as the projected area S1 when the metal inner side surface 31 is projected in the lateral direction because the wiring body metal part 15 has a substantially rectangular shape in cross section.
  • the area S0 of the metal inner side surface 31 is a value obtained by multiplying the thickness T of the metal-based support layer 6 described below by the length in the longitudinal direction.
  • the thickness T of the metal-based support layer 6 is the opposing length of the first metal surface 21 and the second metal surface 22 and the length of the metal side surface 23 in the thickness direction. Specifically, the thickness T of the metal-based support layer 6 is, for example, 30 ⁇ m or more, preferably 50 ⁇ m or more, preferably 100 ⁇ m or more, preferably 250 ⁇ m or more, preferably 500 ⁇ m or more, preferably 1000 ⁇ m or more. Yes, for example, 10 mm or less.
  • the length W in the short direction of the wiring body metal portion 15 is appropriately selected from the range exemplified by the length in the short direction of the wiring body 4 described above, and specifically, the length in the short direction of the wiring body metal portion 15. W is the same as the length of the wiring body 4 in the short direction. Note that, in the plurality of wiring bodies 4, the short direction length W of the wiring body metal portion 15 is a distance (length) between two adjacent metal inner side surfaces 31.
  • the ratio (T / W) of the thickness T of the wiring body metal portion 15 to the length W in the short direction of the wiring body metal portion 15 is 2 or more.
  • the ratio (T / W) corresponds to the aspect ratio of the cut surface obtained by cutting the wiring body metal portion 15 along the thickness direction and the short side direction. If the aspect ratio (T / W) is less than 2, the heat generated in the main wiring portion 10 (described later) in the wiring body 4 cannot be efficiently released using the air in the opening 5.
  • the aspect ratio (T / W) is preferably 2.5 or more, more preferably 3 or more, still more preferably 3.5 or more, and 1000 or less, and further 100 or less. If the ratio (T / W) is equal to or greater than the lower limit described above, the heat generated in the main wiring portion 10 in the wiring body 4 can be efficiently released using the air in the opening 5.
  • the material for the metal-based support layer 6 can be appropriately selected from, for example, known or commonly used metal-based materials (specifically, metal materials).
  • the metal-based material include metal elements classified into Group 1 to Group 16 in the periodic table, and alloys containing two or more of these metal elements.
  • the metal-based material may be either a transition metal or a typical metal. More specifically, examples of the metal-based material include a Group 2 metal element such as calcium, a Group 4 metal element such as titanium and zirconium, a Group 5 metal element such as vanadium, chromium, molybdenum, and tungsten.
  • Group 6 metal elements Group 7 metal elements such as manganese, Group 8 metal elements such as iron, Group 9 metal elements such as cobalt, Group 10 metal elements such as nickel and platinum, Copper, Silver, Gold, etc.
  • Group 11 metal elements such as zinc, Group 12 metal elements such as zinc, Group 13 metal elements such as aluminum and gallium, and Group 14 metal elements such as germanium and tin. These can be used alone or in combination.
  • the material of the 1st connection support part 13, the 2nd connection support part 14, and the wiring body metal part 15 is the same.
  • the metal-based support layer 6 includes a metal support layer 6 whose material is a metal.
  • the thermal conductivity of the metal-based support layer 6 is, for example, 5 W / m ⁇ K or more, preferably 10 W / m ⁇ K or more, more preferably 15 W / m ⁇ K or more, 20 W / m ⁇ K or more, 25 W / m.
  • the thermal conductivity of the metal-based support layer 6 is equal to or greater than the lower limit described above, the heat conducted from the main wiring portion 10 to the wiring body base portion 18 can be efficiently released toward the other side in the thickness direction.
  • the thermal conductivity of the metal-based support layer 6 is obtained by JIS H 7903: 2008 (effective thermal conductivity measurement method).
  • the base insulating layer 7 is disposed, for example, on the entire first metal surface 21 of the metal-based support layer 6. Specifically, the base insulating layer 7 has an outer shape corresponding to the first connecting body 2, the second connecting body 3, and the wiring body 4.
  • the part forming the first connection body 2 is the first connection base part 16
  • the part forming the second connection body 3 is the second connection base part 17
  • the wiring body 4 A portion to be formed is a wiring body base portion 18 as an example of an insulating portion.
  • the first connection base portion 16 is disposed on the entire first metal surface 21 of the first connection metal portion 13.
  • the second connection base portion 17 is disposed on the entire first metal surface 21 of the second connection metal portion 14.
  • the wiring body base portion 18 is disposed on the entire first metal surface 21 of the wiring body metal portion 15.
  • the wiring body metal portion 15 is disposed on the other surface in the thickness direction of the wiring body base portion 18 (second base surface 25 described later). Further, the wiring body base portion 18 defines the opening 5 together with the wiring body metal portion 15 and the wiring body cover portion 33 described later.
  • the base insulating layer 7 includes a first base surface 24 that is one surface in the thickness direction, a second base surface 25 that is the other surface in the thickness direction, and a base side surface that is a side surface connecting the peripheral edges in the thickness direction. 26 are integrally provided.
  • the first base surface 24 is a flat surface parallel to the first metal surface 21.
  • the second base surface 25 is a flat surface that contacts the first metal surface 21.
  • the base side surface 26 is a flat surface that extends straight along the thickness direction. Further, the base side surface 26 is formed flush with the metal side surface 23 in the thickness direction in the wiring body base portion 18.
  • the base side surface 26 has a base inner side surface 37 that is formed flush with the metal inner side surface 31 in the wiring body base portion 18. The base inner side surface 37 partially defines the opening 5.
  • the thickness of the base insulating layer 7 is the length of the first base surface 24 and the first metal surface 21 facing each other, and the length of the base side surface 26 in the thickness direction, specifically, for example, 1 ⁇ m or more, Preferably, it is 5 ⁇ m or more, for example, 100 ⁇ m or less, preferably 50 ⁇ m or less.
  • the ratio of the thickness of the base insulating layer 7 to the thickness T of the metal-based support layer 6 is, for example, 10 or less, preferably 1 or less, more preferably 0.1 or less, and for example, 0.005 or more. It is.
  • Examples of the material of the base insulating layer 7 include an insulating resin such as polyimide.
  • the thermal conductivity of the base insulating layer 7 is lower than the thermal conductivity of the metal-based support layer 6, specifically, for example, 1 W / m ⁇ K or less, and further 0.5 W / m ⁇ K. For example, it is 0.01 W / m ⁇ K or more, preferably 0.1 W / m ⁇ K or more.
  • the thermal conductivity of the base insulating layer 7 is determined by JIS A 1412 (Method for measuring the thermal conductivity of a thermal insulating material).
  • the conductor layer 8 is disposed on the first base surface 24 of the base insulating layer 7. Specifically, the conductor layer 8 is disposed on the first base surface 24 of the first connection base portion 16, the second connection base portion 17, and the wiring body base portion 18.
  • the portions included in the first connection body 2 are the first terminal portion 11 and the first auxiliary wiring portion 19, and the portions included in the second connection body 3 are the second terminal portion 12 and the second auxiliary wiring.
  • the part 20 included in the wiring body 4 is a main wiring part 10 as an example of the wiring part.
  • a plurality of first terminal portions 11 are arranged in the first connecting body 2 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10).
  • the plurality of first terminal portions 11 are aligned and spaced apart in the lateral direction so as to be included in the first connecting metal portion 13 when projected in the thickness direction.
  • the first terminal portion 11 is disposed on the first base surface 24 of the first connection base portion 16.
  • the first terminal portion 11 has one end portion and a central portion in the longitudinal direction on the first base surface 24 so that a region where the first auxiliary wiring portion 19 is formed on the other longitudinal end portion in the first base surface 24 is secured. Is arranged.
  • the first terminal portion 11 has a substantially rectangular shape (corner land shape) in plan view.
  • the first auxiliary wiring portion 19 is disposed on the first base surface 24 of the first connection base portion 16 in the first connection body 2 so as to be continuous with the first terminal portion 11.
  • the first auxiliary wiring 19 has a substantially linear shape in a plan view extending from the other end in the longitudinal direction of the first terminal portion 11 toward the other side in the longitudinal direction.
  • the 1st auxiliary wiring part 19 connects the longitudinal direction other end edge of the 1st terminal part 11, and the longitudinal direction one end edge of the main wiring part 10 demonstrated below.
  • the length of the first auxiliary wiring 19 in the short direction is shorter than the length of the first terminal portion 11 in the short direction.
  • the ratio of the length in the short direction of the first auxiliary wiring 19 to the length in the short direction of the first terminal portion 11 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more.
  • the length of the first auxiliary wiring 19 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
  • a plurality of second terminal portions 12 are arranged in the second connecting body 3 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10).
  • the plurality of second terminal portions 12 are arranged in the short direction so as to be included in the second connecting metal portion 14 when projected in the thickness direction.
  • the second terminal portion 12 is disposed on the first base surface 24 of the second connection base portion 17.
  • the second terminal portion 12 has a longitudinal direction on the first base surface 24 such that a region where the second auxiliary wiring portion 20 is formed is secured at one longitudinal end portion of the first base surface 24. It is arrange
  • the second terminal portion 12 has a substantially rectangular shape (square land shape) in plan view.
  • the second auxiliary wiring part 20 is arranged on the first base surface 24 of the second connection base part 17 in the second connection body 3 so as to be continuous with the second terminal part 12.
  • the second auxiliary wiring 20 has a substantially linear shape in plan view extending from one longitudinal edge of the second terminal portion 12 toward one longitudinal side.
  • the 2nd auxiliary wiring part 20 connects the longitudinal direction one end edge of the 2nd terminal part 12, and the longitudinal direction other end edge of the main wiring part 10 demonstrated below.
  • the short direction length of the second auxiliary wiring part 20 is shorter than the short direction length of the second terminal part 12.
  • the ratio of the length in the short direction of the second auxiliary wiring portion 20 to the length in the short direction of the second terminal portion 12 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more.
  • the length of the second auxiliary wiring portion 20 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
  • the main wiring portion 10 is disposed on the first base surface 24 of the wiring body base portion 18. Specifically, each of the plurality of main wiring portions 10 is disposed at a substantially central portion in the short-side direction of the first base surface 24 of the plurality of wiring body base portions 18. The main wiring portion 10 is included in the wiring body base portion 18 when projected in the thickness direction. Specifically, each of the plurality of main wiring portions 10 secures a region where a cover insulating layer 9 described below is formed at both ends in the short direction of the first base surface 24 of the plurality of wiring body base portions 18. Are arranged to be.
  • the main wiring portion 10 is provided in one-to-one correspondence with the wiring body base portion 18 (or the wiring body metal portion 15).
  • one end edge in the longitudinal direction of the main wiring portion 10 is continuous with the other edge in the longitudinal direction of the first auxiliary wiring 19 in the first connector 2.
  • the other end edge in the longitudinal direction of the main wiring portion 10 is continuous with the one end edge in the longitudinal direction of the second auxiliary wiring portion 20 in the second connector 3.
  • the main wiring part 10 forms a substantially straight line shape in plan view extending in the longitudinal direction together with the first auxiliary wiring 19 and the second auxiliary wiring part 20, and the first terminal part 11 and the second terminal part 12 are arranged in the longitudinal direction. Wiring to be connected to is formed.
  • the length in the short direction of the main wiring portion 10 is the same as the length in the short direction of the first auxiliary wiring 19 and the second auxiliary wiring portion 20, for example.
  • the conductor layer 8 includes a first conductor surface 27 that is one surface in the thickness direction, a second conductor surface 28 that is the other surface in the thickness direction, and a conductor side surface 29 that is a side surface connecting the peripheral edges in the thickness direction. Provide one.
  • the first conductor surface 27 is a flat surface parallel to the first base surface 24.
  • the second conductor surface 28 is a flat surface that contacts the first base surface 24.
  • the conductor side surface 29 is disposed inside the base side surface 26 in plan view.
  • the conductor side surface 29 is disposed on the inner side in the lateral direction with respect to the base side surface 26.
  • Examples of the material of the conductor layer 8 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof.
  • copper is used from the viewpoint of obtaining good electrical characteristics.
  • the thickness of the conductor layer 8 is the opposing length of the first conductor surface 27 and the first base surface 24, and the length in the thickness direction of the conductor side surface 29. Specifically, for example, 1 ⁇ m or more is preferable. Is 5 ⁇ m or more, and is, for example, 50 ⁇ m or less, preferably 3 ⁇ m or less.
  • the length in the short direction of the main wiring portion 10 is, for example, 200 ⁇ m or less, preferably 100 ⁇ m or less, and for example, 1 ⁇ m or more, preferably 5 ⁇ m or more. Further, the ratio of the length in the short direction of the main wiring portion 10 to the length W in the short direction of the wiring body metal portion 15 is, for example, 2 or less, preferably 1 or less, for example, 0.01 As mentioned above, Preferably, it is 0.1 or more.
  • the insulating cover layer 9 is disposed on the first base surface 24 so as to cover the first conductor surface 27 and the conductor side surface 29 of the first auxiliary wiring 19, the second auxiliary wiring portion 20, and the main wiring portion 10. Yes. On the other hand, the insulating cover layer 9 exposes at least the first conductor surface 27 of the first terminal portion 11 and the second terminal portion 12.
  • the portion included in the first connecting body 2 is a first connecting cover portion (not shown in FIGS. 1 and 2), and the portion included in the second connecting body 3 is the second connecting cover portion 9.
  • a connecting cover portion (not shown in FIGS. 1 and 2), and a portion included in the wiring body 4 is a wiring body cover portion 33.
  • a first connection cover portion (not shown) exposes the first terminal portion 11 but covers the first auxiliary wiring 19.
  • the second connection cover portion exposes the second terminal portion 12 but covers the second auxiliary wiring portion 20.
  • the wiring body cover portion 33 covers the first conductor surface 27 and the conductor side surface 29 of the main wiring portion 10 and the portion of the first base surface 24 near the outer side in the short direction of the main wiring portion 10.
  • the insulating cover layer 9 includes a first cover surface 34 that is one surface in the thickness direction, a second cover surface 35 that is the other surface in the thickness direction, and a cover side surface 36 that is a side surface connecting these peripheral edges in the thickness direction. Is integrally provided.
  • the first cover surface 34 is a flat surface parallel to the first conductor surface 27.
  • the second cover surface 35 is in contact with the first conductor surface 27 and the conductor side surface 29 and the first base surface 24.
  • the cover side surface 36 is formed flush with the base side surface 26 in the thickness direction in the wiring body base portion 18.
  • the cover side surface 36 has a cover inner side surface 38 that is formed flush with the base inner side surface 37 in the wiring body cover portion 33.
  • each of the plurality of wiring bodies 4 has two wiring body side surfaces 50.
  • the wiring body side surface 50 is formed (configured) from the metal side surface 23, the base side surface 26, and the cover side surface 36, and is continuous in the thickness direction. Therefore, the wiring body 4 has a substantially linear shape that extends long in the thickness direction in a cross-sectional view.
  • the wiring body side surface 50 has a wiring body side surface 51 formed by the metal inner side surface 31, the base inner side surface 37, and the cover inner side surface 38 in a cross-sectional view. Is partitioned.
  • the thickness of the cover insulating layer 9 is the length of the first cover surface 34 and the first conductor surface 27 facing each other, specifically, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, and, for example, 100 ⁇ m or less. Preferably, it is 50 ⁇ m or less.
  • Examples of the material of the cover insulating layer 9 include an insulating resin such as polyimide.
  • the thickness of the printed circuit board 1 is, for example, 10 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 10 mm or less, preferably 1 mm or less.
  • the printed circuit board 1 In order to manufacture the printed circuit board 1, for example, first, a flat metal sheet is prepared, and then the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9 having the above-described shapes are sequentially formed. Thereafter, the metal sheet is externally processed to form the first connection metal part 13, the second connection metal part 14, and the wiring body metal part 15, thereby forming the metal-based support layer 6.
  • the outer shape processing is not particularly limited, and examples thereof include etching, laser processing, water jet (water cutter), and press punching.
  • the base insulating layer 7, the conductor layer 8, and the cover insulating layer are previously formed on the first metal surface 21 of the metal-based support layer 6 including the first connecting metal portion 13, the second connecting metal portion 14, and the wiring body metal portion 15. 9 can also be formed sequentially.
  • the first element 41 is then mounted on the first connector 2 and the second element 42 is mounted on the second connector 3 as indicated by the phantom line in FIG. 2B.
  • the first element 41 and / or the second element 42 are configured to be able to input / output a current having a high current value (for example, 1 A or more, and further, a large current of 10 A or more).
  • the first element 41 includes a first electrode 43 disposed on the other surface in the thickness direction.
  • the second element 42 includes a second electrode 44 disposed on the other surface in the thickness direction.
  • the first electrode 43 is electrically connected to the first terminal portion 11.
  • the second electrode 44 is electrically connected to the second terminal portion 12.
  • the wiring bodies 4 are arranged in parallel with a space therebetween, and thus are generated in the main wiring portion 10 based on the input of a large current from the first element 41 and / or the second element 42. Heat can be convected through the air between the plurality of wiring bodies 4 (openings 5), and in particular, convection in the thickness direction can be efficiently radiated.
  • the aspect ratio (T / W) of the wiring body metal part 15 is as high as 2 or more, the contact area with the air can be increased. Therefore, the heat dissipation efficiency based on the above convection is excellent.
  • the wiring body metal portion 15 has a high aspect ratio (T / W) of 2 or more and is made of a metal-based material
  • the heat conducted from the main wiring portion 10 to the wiring body base portion 18 is To the other side in the thickness direction of the wiring body base 18, specifically, from the first metal surface 21 of the wiring body metal portion 15 to the second metal surface 22, and further in the thickness direction of the second metal surface 22. It can discharge efficiently toward the side.
  • the printed circuit board 1 is excellent in heat dissipation in the wiring body 4.
  • the material of the wiring body metal part 15 is a metal, the heat dissipation from the wiring body metal part 15 is excellent.
  • the 1st connection metal part 13 since the 1st connection metal part 13 continues in a transversal direction so that the some 1st terminal part 11 may be included, when projected in the thickness direction, the 1st connection metal part 13 is included. Can reliably support the plurality of first terminal portions 11.
  • the 2nd connection metal part 14 continues in a transversal direction so that a plurality of 2nd terminal parts 12 may be included when projected in the thickness direction, the 2nd connection metal part 14 has a plurality of 2nd terminal parts 12 Can be reliably supported.
  • the mechanical strength of the first terminal portion 11 in the first connection body 2 and the mechanical strength of the second terminal portion 12 in the second connection body 3 are excellent while the heat dissipation in the wiring body 4 is excellent. Also excellent. Therefore, the connection reliability in the 1st terminal part 11 and the 2nd terminal part 12 is excellent.
  • the use of such a printed circuit board 1 is not particularly limited and is used in various fields.
  • the printed circuit board 1 is used in various applications such as a printed circuit board for electronic equipment (wired circuit board for electronic parts) and a wired circuit board for electrical equipment (wired circuit board for electrical parts).
  • Examples of the wiring circuit board for electronic equipment and the wiring circuit board for electric equipment include wiring circuit boards for sensors used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors, such as automobiles, trains, airplanes, and machine tools.
  • Wiring circuit boards for transportation vehicles used in transportation vehicles such as vehicles, for example, wiring circuit boards for video equipment used in video equipment such as flat panel displays, flexible displays, projection type video equipment, such as network equipment, large communication equipment
  • Wiring circuit boards for communication relay equipment used in communication relay equipment such as, for example, wiring circuit boards for information processing terminals used in information processing terminals such as computers, tablets, smartphones, home games, etc., such as drones, robots, etc.
  • Mobile equipment distribution used in mobile equipment Circuit boards for example, medical equipment wiring circuit boards used in medical equipment such as wearable medical devices and medical diagnostic equipment, for example, electrical equipment used in electric equipment such as refrigerators, washing machines, vacuum cleaners, and air conditioners
  • Wiring circuit boards for recording for example, wiring circuit boards for recording electronic equipment used in recording electronic equipment such as digital cameras and DVD recording devices.
  • the metal side surface 23, the base side surface 26, and the cover side surface 36 are flush, but not shown, but they may not be flush, that is, discontinuous.
  • the base side surface 26 and / or the cover side surface 36 do not overlap with the metal side surface 23 when projected in the thickness direction, and shift to either the short side outward or the inner side with respect to the metal side surface 23. May be located.
  • the metal side surface 23 of the wiring body metal portion 15 is a flat surface, but may be a curved surface, for example, although not shown.
  • the metal side surface that is a curved surface includes a concave surface that is recessed toward the inner side in the lateral direction as viewed from the both ends in the thickness direction toward the central portion in the thickness direction.
  • the metal side surface comprises only a concave surface. That is, the metal side surface is recessed toward the inner side in the lateral direction as it goes from the both end portions in the thickness direction to the central portion in the thickness direction when viewed in cross section.
  • the short direction length of a wiring body metal part becomes short as it goes to a thickness direction center part from the thickness direction both ends.
  • Each of the plurality of wiring body metal portions has a substantially drum (hourglass) cross section with a constricted central portion in the thickness direction.
  • Each of the plurality of wiring body metal portions is provided with two concave surfaces on both side surfaces in the short direction.
  • the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction. Therefore, the present invention includes an aspect in which the area S0 of the metal side surface is greater than or equal to the projected area S1 when the metal side surface is projected in the short direction. Specifically, the area S0 of the metal side surface 23 is This includes both an embodiment that is identical to the projected area S1 and a variation in which the metal side area S0 is greater than the metal side projected area S1.
  • the area ratio (S0 / S1) of the area S0 of the metal side surface to the projected area S1 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1. 2 or more, more preferably 1.3 or more, and for example, 2 or less.
  • the longitudinal length of the metal side surface and the longitudinal direction length of the projection surface of the metal side surface are the same. (Specifically, the length in the thickness direction from one end edge to the other end edge of the metal side surface in relation to the total length L along the curved surface (concave surface) from the one end edge to the other end edge in the thickness direction of the metal side surface) It is the same as the ratio (thickness T / total length L). Accordingly, the area ratio (S0 / S1) is obtained as the above-described length ratio (thickness T / total length L).
  • the length W in the short direction of the metal part of the wiring body is obtained as an average value of the lengths between the two metal side surfaces.
  • the metal side surface can have a bent surface.
  • one metal side surface is integrally provided with two concave surfaces adjacent in the thickness direction and a ridge line connecting them in the thickness direction.
  • a metal side surface is formed in a bending surface.
  • one metal side surface has a substantially W shape having a ridge line in the central portion in the thickness direction and concave surfaces on both sides in a cross-sectional view. Therefore, each of the plurality of wiring body metal portions has a cross-sectional shape in which two drums (hourglasses) are connected in the thickness direction.
  • the manufacturing method of the printed circuit board in the above modification will be specifically described.
  • the metal-based support layer 6 is formed by etching (subtractive method).
  • a laminate including a metal sheet and a base insulating layer, a conductor layer, and a cover insulating layer formed on the first metal surface is prepared.
  • an etching resist is disposed on the second metal surface of the metal sheet.
  • the plan view shape of the etching resist is, for example, the same shape as the plan view shape of the metal-based support layer 6 to be formed, and substantially the same as the plan view shapes of the base insulating layer and the cover insulating layer.
  • the resist laminate is immersed in an etching solution. Specifically, in the metal sheet, the etching solution is brought into contact with the first metal surface exposed from the base insulating layer and the cover insulating layer and the second metal surface exposed from the etching resist.
  • the etching rate at the center portion in the short direction is the etching rate at both ends in the short direction (however, outside in the short direction from the second metal surface).
  • it is expensive. This is because the etching solution tends to stay (stagnate) at both ends in the short direction of the exposed portion as compared with the peripheral portion in the short direction.
  • both the first metal surface and the second metal surface in the middle of etching are curved surfaces in which the central portion in the short direction is recessed toward the inside in the thickness direction.
  • the etching of the central portion in the short direction in the exposed portions of the first metal surface and the second metal surface is completed earlier than the etching of both ends in the short direction.
  • the first metal surface and the second metal surface disappear earlier at the center portion in the short direction than at both ends in the short direction. That is, first, an opening is formed at the center in the short direction, and then the opening widens toward both outer sides (both ends) in the short direction.
  • a metal side surface including two concave surfaces and a ridgeline is formed.
  • a metal side surface including two concave surfaces and a ridgeline is formed.
  • the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction.
  • the included printed circuit board that is, the printed circuit board in which the area S0 of the metal side surface 23 is equal to or larger than the projected area S1 of the metal side surface 23
  • the contact area between the metal side surface and the air can be further reliably increased as compared with the embodiment shown in FIG. 2A. Therefore, it is more excellent in the heat dissipation efficiency based on the convection from a wiring body metal part.
  • one metal side surface integrally includes a concave surface and a convex surface.
  • the concave surface and the convex surface are arranged in order in the thickness direction.
  • the concave surface on one side in the short direction is opposed to the convex surface on the other side in the short direction, and the convex surface on one side in the short direction is It faces the concave surface on the other side in the short direction in the short direction. Therefore, the wiring body metal part has a substantially S-shaped cross section.
  • the two concave surfaces on both sides on one side and the other side in the short side face each other in the short side direction.
  • Two convex surfaces on both sides on one side and the other side in the short direction face each other in the short direction.
  • the wiring body metal part 15 is cited as an example of the support part, and the wiring body metal part 15 is included in the metal-based support layer 6 whose material is metal.
  • a support layer is used, and the material of the support layer is, for example, a particle resin composition including particles having high thermal conductivity and a resin, for example, a fired composition such as ceramics. Also good.
  • the first connector 2 and the second connector 3 are both continuous in the short direction so as to include the first terminal portion 11 and the second terminal portion 12 in plan view.
  • either one may be continuous in the short direction and the other may be discontinuous in the short direction.
  • the other is divided into a plurality of parts at intervals in the short direction.
  • both the first connector 2 and the second connector 3 may be divided into a plurality at intervals in the lateral direction.
  • one main wiring portion 10 is provided in the wiring body base portion 18, but, for example, although not illustrated, a plurality of main wiring portions 10 may be provided in one wiring body base portion 18.
  • a plurality of main wiring portions 10 may be provided in one wiring body base portion 18.
  • the printed circuit board is used in various applications such as a printed circuit board for electronic equipment and a wired circuit board for electric equipment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
PCT/JP2019/018713 2018-05-31 2019-05-10 配線回路基板 WO2019230334A1 (ja)

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KR1020207033984A KR102791341B1 (ko) 2018-05-31 2019-05-10 배선 회로 기판
CN201980036057.8A CN112219455A (zh) 2018-05-31 2019-05-10 布线电路基板

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JP2018-104652 2018-05-31
JP2018104652A JP6985211B2 (ja) 2018-05-31 2018-05-31 配線回路基板

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KR (1) KR102791341B1 (enrdf_load_stackoverflow)
CN (1) CN112219455A (enrdf_load_stackoverflow)
TW (1) TWI823937B (enrdf_load_stackoverflow)
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JP2023024322A (ja) 2021-08-06 2023-02-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023034728A (ja) 2021-08-31 2023-03-13 日東電工株式会社 配線回路基板
JP2023042068A (ja) 2021-09-14 2023-03-27 日東電工株式会社 配線回路基板
JP2024046954A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法
JP2024046956A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板
JP2024046953A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2024046955A (ja) 2022-09-26 2024-04-05 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板
JP2025101669A (ja) 2023-12-25 2025-07-07 日東電工株式会社 配線回路基板、および、配線回路基板の製造方法
JP2025113054A (ja) 2024-01-22 2025-08-01 日東電工株式会社 配線回路基板
KR20250114906A (ko) 2024-01-22 2025-07-29 닛토덴코 가부시키가이샤 배선 회로 기판

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KR20210015809A (ko) 2021-02-10
JP6985211B2 (ja) 2021-12-22
JP7411621B2 (ja) 2024-01-11
TW202005483A (zh) 2020-01-16
CN112219455A (zh) 2021-01-12
JP2022020857A (ja) 2022-02-01
JP2019212656A (ja) 2019-12-12
KR102791341B1 (ko) 2025-04-03

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