TWI823937B - 配線電路基板 - Google Patents
配線電路基板 Download PDFInfo
- Publication number
- TWI823937B TWI823937B TW108117072A TW108117072A TWI823937B TW I823937 B TWI823937 B TW I823937B TW 108117072 A TW108117072 A TW 108117072A TW 108117072 A TW108117072 A TW 108117072A TW I823937 B TWI823937 B TW I823937B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- wiring
- thickness direction
- circuit board
- base
- Prior art date
Links
- 239000007769 metal material Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 211
- 239000002184 metal Substances 0.000 claims description 198
- 239000000463 material Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 description 40
- 238000005530 etching Methods 0.000 description 20
- 230000017525 heat dissipation Effects 0.000 description 17
- 230000008878 coupling Effects 0.000 description 15
- 238000010168 coupling process Methods 0.000 description 15
- 238000005859 coupling reaction Methods 0.000 description 15
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910021482 group 13 metal Inorganic materials 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-104652 | 2018-05-31 | ||
| JP2018104652A JP6985211B2 (ja) | 2018-05-31 | 2018-05-31 | 配線回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202005483A TW202005483A (zh) | 2020-01-16 |
| TWI823937B true TWI823937B (zh) | 2023-12-01 |
Family
ID=68697476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108117072A TWI823937B (zh) | 2018-05-31 | 2019-05-17 | 配線電路基板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6985211B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102791341B1 (enrdf_load_stackoverflow) |
| CN (1) | CN112219455A (enrdf_load_stackoverflow) |
| TW (1) | TWI823937B (enrdf_load_stackoverflow) |
| WO (1) | WO2019230334A1 (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7211930B2 (ja) * | 2019-12-17 | 2023-01-24 | 日東電工株式会社 | 配線回路基板の製造方法 |
| JP7651335B2 (ja) * | 2021-03-23 | 2025-03-26 | 日東電工株式会社 | 配線回路基板の製造方法 |
| JP2023024322A (ja) | 2021-08-06 | 2023-02-16 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| JP2023034728A (ja) | 2021-08-31 | 2023-03-13 | 日東電工株式会社 | 配線回路基板 |
| JP2023042068A (ja) | 2021-09-14 | 2023-03-27 | 日東電工株式会社 | 配線回路基板 |
| JP2024046954A (ja) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | 配線回路基板の製造方法 |
| JP2024046956A (ja) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | 配線回路基板 |
| JP2024046953A (ja) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | 配線回路基板の製造方法、および、配線回路基板 |
| JP2024046955A (ja) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | 配線回路基板の製造方法、および、配線回路基板 |
| JP2025101669A (ja) | 2023-12-25 | 2025-07-07 | 日東電工株式会社 | 配線回路基板、および、配線回路基板の製造方法 |
| JP2025113054A (ja) | 2024-01-22 | 2025-08-01 | 日東電工株式会社 | 配線回路基板 |
| KR20250114906A (ko) | 2024-01-22 | 2025-07-29 | 닛토덴코 가부시키가이샤 | 배선 회로 기판 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201006334A (en) * | 2008-07-16 | 2010-02-01 | Ibiden Co Ltd | Flex-rigid wiring board and electronic device |
| TW201249269A (en) * | 2011-05-23 | 2012-12-01 | Sumitomo Electric Industries | Wiring board |
| JP2013069390A (ja) * | 2011-09-26 | 2013-04-18 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JP2014191845A (ja) * | 2013-03-27 | 2014-10-06 | Dainippon Printing Co Ltd | サスペンション用基板 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55140255A (en) | 1979-04-18 | 1980-11-01 | Nec Corp | Heat sink structure |
| JP2001110951A (ja) * | 1999-10-08 | 2001-04-20 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP2003321796A (ja) * | 2002-04-30 | 2003-11-14 | Nitto Denko Corp | めっき装置およびそれを用いた配線基板の製造方法 |
| JP2009152238A (ja) * | 2007-12-18 | 2009-07-09 | Nitto Denko Corp | 配線回路基板の製造方法 |
| JP2011176075A (ja) * | 2010-02-24 | 2011-09-08 | Nitto Denko Corp | 配線回路基板集合体シートおよびその製造方法 |
| JP2011198402A (ja) * | 2010-03-18 | 2011-10-06 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JP2015126112A (ja) * | 2013-12-26 | 2015-07-06 | 日東電工株式会社 | 配線回路基板、配線回路基板の製造方法および配線回路基板の検査方法 |
| JP6376556B2 (ja) * | 2014-06-10 | 2018-08-22 | 日東電工株式会社 | 光電気混載基板 |
| JP2016018577A (ja) * | 2014-07-08 | 2016-02-01 | 日東電工株式会社 | 配線回路基板 |
-
2018
- 2018-05-31 JP JP2018104652A patent/JP6985211B2/ja active Active
-
2019
- 2019-05-10 WO PCT/JP2019/018713 patent/WO2019230334A1/ja active Application Filing
- 2019-05-10 CN CN201980036057.8A patent/CN112219455A/zh active Pending
- 2019-05-10 KR KR1020207033984A patent/KR102791341B1/ko active Active
- 2019-05-17 TW TW108117072A patent/TWI823937B/zh active
-
2021
- 2021-11-25 JP JP2021191207A patent/JP7411621B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201006334A (en) * | 2008-07-16 | 2010-02-01 | Ibiden Co Ltd | Flex-rigid wiring board and electronic device |
| TW201249269A (en) * | 2011-05-23 | 2012-12-01 | Sumitomo Electric Industries | Wiring board |
| JP2013069390A (ja) * | 2011-09-26 | 2013-04-18 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JP2014191845A (ja) * | 2013-03-27 | 2014-10-06 | Dainippon Printing Co Ltd | サスペンション用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210015809A (ko) | 2021-02-10 |
| JP6985211B2 (ja) | 2021-12-22 |
| JP7411621B2 (ja) | 2024-01-11 |
| WO2019230334A1 (ja) | 2019-12-05 |
| TW202005483A (zh) | 2020-01-16 |
| CN112219455A (zh) | 2021-01-12 |
| JP2022020857A (ja) | 2022-02-01 |
| JP2019212656A (ja) | 2019-12-12 |
| KR102791341B1 (ko) | 2025-04-03 |
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