JP2008529261A - 長方形または正方形の断面を有する導体を有するワイヤ・プリント回路基板またはカード - Google Patents
長方形または正方形の断面を有する導体を有するワイヤ・プリント回路基板またはカード Download PDFInfo
- Publication number
- JP2008529261A JP2008529261A JP2007551635A JP2007551635A JP2008529261A JP 2008529261 A JP2008529261 A JP 2008529261A JP 2007551635 A JP2007551635 A JP 2007551635A JP 2007551635 A JP2007551635 A JP 2007551635A JP 2008529261 A JP2008529261 A JP 2008529261A
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- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductor
- section
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 73
- 239000002826 coolant Substances 0.000 claims description 3
- 239000012809 cooling fluid Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
Abstract
Description
本発明の利点
本発明は、カードまたはプリント回路基板上に配線される導体の少なくともいくつかを長方形または正方形の断面を有するように形成するという発想に基づく。これに関連した円形の断面を有する導体に比べた利点は、個々の導体間の間隔をより小さくできるので、より高い実装密度を達成できることに特に見出せる。さらに、同じ構造空間において線の断面積をより大きくすることが達成できる。このことは、導体の断面積を大きくすることが温度の理由から重要である、電力エレクトロニクスに導体を使用する場合に特に有利である。さらに、線の断面積をより大きくした場合、非常に高い電流でも低損失で伝達できるように、線の抵抗をより低くすることも達成される。したがって、電力エレクトロニクスと回路エレクトロニクスの両方を単一のプリント回路基板上に配置することも可能である。
Claims (7)
- 接続ポイント(4)間に回路基板(1)またはカードの面上および/または内部に配線される導体(6)を有するワイヤ・プリント回路基板(1)またはカードにおいて、
前記導体(6)の少なくとも一つが長方形または正方形の断面を有する、
ことを特徴とするワイヤ・プリント回路基板(1)またはカード。 - 前記導体の二つ以上が正方形または長方形の断面を有することを特徴とする、ワイヤ・プリント回路基板。
- 長方形の断面を有する前記導体(6)の少なくともいくつかのより大きい拡がりを有する面が、前記回路基板(1)またはカードに対向することを特徴とする、請求項1または請求項2に記載のワイヤ・プリント回路基板(1)またはカード。
- 前記導体(6)の少なくともいくつかが中空の断面(8)を有することを特徴とする、前請求項の少なくとも一つに記載のワイヤ・プリント回路基板(1)またはカード。
- 前記導体の前記中空の断面(8)の内部には、媒体(10)、好ましくは冷却剤が循環することを特徴とする、請求項4に記載のワイヤ・プリント回路基板(1)またはカード。
- エッチングされたストリップ導体(2)をさらに有することを特徴とする、前請求項の少なくとも一つに記載のワイヤ・プリント回路基板(1)またはカード。
- 長方形または正方形の断面を有する前記導体は、前記回路基板の内部に配設されることを特徴とする、前請求項の少なくとも一つに記載のワイヤ・プリント回路基板(1)またはカード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200520001161 DE202005001161U1 (de) | 2005-01-24 | 2005-01-24 | Drahtgeschriebene Leiterplatte oder Platine mit Leiterdrähten mit rechteckigem oder quadratischem Querschnitt |
DE202005001161.4 | 2005-01-24 | ||
PCT/EP2006/000612 WO2006077163A2 (de) | 2005-01-24 | 2006-01-24 | Drahtbeschriebene leiterplatte oder platine mit leitungsdrähten mit rechteckigem oder quadratischem querschnitt |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011132244A Division JP4892637B2 (ja) | 2005-01-24 | 2011-06-14 | ワイヤ・プリント回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008529261A true JP2008529261A (ja) | 2008-07-31 |
JP4909905B2 JP4909905B2 (ja) | 2012-04-04 |
Family
ID=34400318
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007551635A Active JP4909905B2 (ja) | 2005-01-24 | 2006-01-24 | 長方形または正方形の断面を有する導体を有するワイヤ・プリント回路基板またはカード |
JP2011132244A Active JP4892637B2 (ja) | 2005-01-24 | 2011-06-14 | ワイヤ・プリント回路基板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011132244A Active JP4892637B2 (ja) | 2005-01-24 | 2011-06-14 | ワイヤ・プリント回路基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8354594B2 (ja) |
EP (2) | EP1842402B2 (ja) |
JP (2) | JP4909905B2 (ja) |
CN (2) | CN104302101B (ja) |
AT (2) | ATE426317T1 (ja) |
DE (4) | DE202005001161U1 (ja) |
WO (1) | WO2006077163A2 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006004322A1 (de) * | 2006-01-31 | 2007-08-16 | Häusermann GmbH | Leiterplatte mit zusätzlichen funktionalen Elementen sowie Herstellverfahren und Anwendung |
DE102006050785A1 (de) * | 2006-10-27 | 2008-05-08 | Robert Bosch Gmbh | Leiterkarte |
DE102006053696A1 (de) * | 2006-11-13 | 2008-05-29 | Häusermann GmbH | Anlage zur Herstellung einer Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen |
DE102006053697A1 (de) * | 2006-11-13 | 2008-05-29 | Häusermann GmbH | Leiterplatte mit additiven und integrierten und mittels Ultraschall kontaktierten Kupferelementen und Herstellverfahren und Anwendung |
DE102008057478A1 (de) * | 2008-11-14 | 2010-05-20 | Kiekert Ag | Trägerelement für Elektrokomponenten |
DE102011102484B4 (de) * | 2011-05-24 | 2020-03-05 | Jumatech Gmbh | Leiterplatte mit Formteil und Verfahren zu dessen Herstellung |
DE102012002945B4 (de) | 2012-02-16 | 2017-07-13 | Häusermann GmbH | Multifunktionelle Mehrlagenleiterplatten mit einer elektrisch leitfähigen Hochstrom-Leitstruktur und Verfahren zur Herstellung |
DE102012216926A1 (de) * | 2012-09-20 | 2014-03-20 | Jumatech Gmbh | Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement |
DE102013220951A1 (de) | 2012-12-12 | 2014-06-26 | Robert Bosch Gmbh | Leiterplatte mit einer drahtgeschriebenen Wärmesenke |
US9883578B1 (en) * | 2016-12-21 | 2018-01-30 | Deere & Company | Cooling conductive trace with pressurized air or gas |
EP3364428A1 (en) | 2017-02-16 | 2018-08-22 | Mitsubishi Electric R&D Centre Europe B.V. | Inductive device |
EP3364429B1 (en) | 2017-02-16 | 2019-08-14 | Mitsubishi Electric R&D Centre Europe B.V. | Inductive assembly |
JP7244531B2 (ja) | 2018-03-12 | 2023-03-22 | ユマテック ゲーエムベーハー | 導体要素用モールドを用いたプリント回路基板の製造方法 |
DE102018203715A1 (de) | 2018-03-12 | 2019-09-12 | Jumatech Gmbh | Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer Form für Leiterelemente |
USD941786S1 (en) * | 2019-11-22 | 2022-01-25 | T-Worx Holdings, LLC | Circuit board |
DE102020001615A1 (de) | 2020-03-11 | 2021-09-16 | Jumatech Gmbh | Verbindungsmittelabschnitt zur Verbindung von Leiterelementen mit elektrisch leitenden Flächenelementen |
USD909319S1 (en) | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
DE102020125140A1 (de) | 2020-09-25 | 2022-03-31 | Jumatech Gmbh | Verfahren zur Herstellung einer Leiterplatte sowie ein Formteil zur Verwendung in diesem Verfahren |
DE102021100398A1 (de) * | 2021-01-12 | 2022-07-14 | Airbus Defence and Space GmbH | Leiterplatte zur Übertragung von elektrischer Energie und zur Signalübertragung sowie System mit einer solchen Leiterplatte |
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JPS63195A (ja) * | 1986-06-19 | 1988-01-05 | 日立化成工業株式会社 | 配線板の製造法 |
JPH03242996A (ja) * | 1990-02-21 | 1991-10-29 | Hitachi Cable Ltd | 導体埋設型配線部品 |
JPH0461364A (ja) * | 1990-06-29 | 1992-02-27 | Mitsubishi Shindoh Co Ltd | 冷却手段を備えた半導体素子、およびそれを用いた装置 |
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JPH10215093A (ja) * | 1997-01-31 | 1998-08-11 | Mitsubishi Electric Corp | ヒートパイプ埋め込みハニカムサンドイッチパネル |
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JP2002299918A (ja) * | 2001-01-29 | 2002-10-11 | Murata Mfg Co Ltd | マイクロストリップ線路及びそれを用いた共振素子、フィルタ、高周波回路並びにそれらを用いた電子回路、回路モジュール及び通信装置 |
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-
2005
- 2005-01-24 DE DE200520001161 patent/DE202005001161U1/de not_active Expired - Lifetime
-
2006
- 2006-01-24 EP EP06706388A patent/EP1842402B2/de active Active
- 2006-01-24 DE DE502006003181T patent/DE502006003181D1/de active Active
- 2006-01-24 CN CN201410468502.7A patent/CN104302101B/zh active Active
- 2006-01-24 DE DE202006019812U patent/DE202006019812U1/de not_active Expired - Lifetime
- 2006-01-24 US US11/814,425 patent/US8354594B2/en active Active
- 2006-01-24 DE DE502006008303T patent/DE502006008303D1/de active Active
- 2006-01-24 WO PCT/EP2006/000612 patent/WO2006077163A2/de active Application Filing
- 2006-01-24 AT AT06706388T patent/ATE426317T1/de active
- 2006-01-24 EP EP09003831A patent/EP2076100B1/de active Active
- 2006-01-24 JP JP2007551635A patent/JP4909905B2/ja active Active
- 2006-01-24 AT AT09003831T patent/ATE488120T1/de active
- 2006-01-24 CN CNA2006800030621A patent/CN101107888A/zh active Pending
-
2011
- 2011-06-14 JP JP2011132244A patent/JP4892637B2/ja active Active
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JPS63195A (ja) * | 1986-06-19 | 1988-01-05 | 日立化成工業株式会社 | 配線板の製造法 |
JPH03242996A (ja) * | 1990-02-21 | 1991-10-29 | Hitachi Cable Ltd | 導体埋設型配線部品 |
JPH0461364A (ja) * | 1990-06-29 | 1992-02-27 | Mitsubishi Shindoh Co Ltd | 冷却手段を備えた半導体素子、およびそれを用いた装置 |
JPH0946006A (ja) * | 1995-07-26 | 1997-02-14 | Hitachi Ltd | 信号伝送構造 |
JPH10215093A (ja) * | 1997-01-31 | 1998-08-11 | Mitsubishi Electric Corp | ヒートパイプ埋め込みハニカムサンドイッチパネル |
JP2001176967A (ja) * | 1999-12-21 | 2001-06-29 | Nec Corp | 半導体装置及びその製造方法 |
JP2002299918A (ja) * | 2001-01-29 | 2002-10-11 | Murata Mfg Co Ltd | マイクロストリップ線路及びそれを用いた共振素子、フィルタ、高周波回路並びにそれらを用いた電子回路、回路モジュール及び通信装置 |
Also Published As
Publication number | Publication date |
---|---|
DE502006008303D1 (de) | 2010-12-23 |
EP1842402B2 (de) | 2012-11-28 |
EP1842402A2 (de) | 2007-10-10 |
CN104302101A (zh) | 2015-01-21 |
JP2011176377A (ja) | 2011-09-08 |
WO2006077163A3 (de) | 2007-02-15 |
CN101107888A (zh) | 2008-01-16 |
ATE488120T1 (de) | 2010-11-15 |
JP4892637B2 (ja) | 2012-03-07 |
CN104302101B (zh) | 2020-02-14 |
EP1842402B1 (de) | 2009-03-18 |
JP4909905B2 (ja) | 2012-04-04 |
EP2076100A1 (de) | 2009-07-01 |
DE502006003181D1 (de) | 2009-04-30 |
US8354594B2 (en) | 2013-01-15 |
DE202006019812U1 (de) | 2007-04-12 |
ATE426317T1 (de) | 2009-04-15 |
EP2076100B1 (de) | 2010-11-10 |
WO2006077163A2 (de) | 2006-07-27 |
DE202005001161U1 (de) | 2005-03-31 |
US20080128158A1 (en) | 2008-06-05 |
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