WO2017130825A1 - 組成物、膜、近赤外線カットフィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置、赤外線センサおよびカラーフィルタ - Google Patents
組成物、膜、近赤外線カットフィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置、赤外線センサおよびカラーフィルタ Download PDFInfo
- Publication number
- WO2017130825A1 WO2017130825A1 PCT/JP2017/001678 JP2017001678W WO2017130825A1 WO 2017130825 A1 WO2017130825 A1 WO 2017130825A1 JP 2017001678 W JP2017001678 W JP 2017001678W WO 2017130825 A1 WO2017130825 A1 WO 2017130825A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- compound
- infrared
- ring
- infrared absorbing
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 278
- 238000000034 method Methods 0.000 title claims abstract description 80
- 230000007261 regionalization Effects 0.000 title abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 547
- 238000010521 absorption reaction Methods 0.000 claims abstract description 100
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- -1 pyrrolopyrrole compound Chemical class 0.000 claims description 308
- 125000001424 substituent group Chemical group 0.000 claims description 174
- 125000000217 alkyl group Chemical group 0.000 claims description 158
- 229920005989 resin Polymers 0.000 claims description 137
- 239000011347 resin Substances 0.000 claims description 137
- 125000003118 aryl group Chemical group 0.000 claims description 118
- 239000010949 copper Substances 0.000 claims description 79
- 229910052802 copper Inorganic materials 0.000 claims description 76
- 125000001072 heteroaryl group Chemical group 0.000 claims description 74
- 239000003086 colorant Substances 0.000 claims description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 68
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 68
- 238000002835 absorbance Methods 0.000 claims description 40
- 239000002904 solvent Substances 0.000 claims description 34
- 229910052757 nitrogen Inorganic materials 0.000 claims description 29
- 238000003384 imaging method Methods 0.000 claims description 21
- 238000001312 dry etching Methods 0.000 claims description 18
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical class C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 claims description 16
- 229910052717 sulfur Inorganic materials 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 238000000206 photolithography Methods 0.000 claims description 14
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical class [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 claims description 14
- 230000003595 spectral effect Effects 0.000 abstract description 29
- 125000004432 carbon atom Chemical group C* 0.000 description 162
- 239000010408 film Substances 0.000 description 139
- 239000010410 layer Substances 0.000 description 94
- 239000000049 pigment Substances 0.000 description 79
- 239000002253 acid Substances 0.000 description 61
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 60
- 239000000975 dye Substances 0.000 description 47
- 239000006185 dispersion Substances 0.000 description 46
- 125000003342 alkenyl group Chemical group 0.000 description 43
- 150000004699 copper complex Chemical class 0.000 description 42
- 238000002834 transmittance Methods 0.000 description 38
- 239000004094 surface-active agent Substances 0.000 description 37
- 125000005843 halogen group Chemical group 0.000 description 36
- 150000001450 anions Chemical class 0.000 description 35
- 230000005540 biological transmission Effects 0.000 description 35
- 229920000642 polymer Polymers 0.000 description 35
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- 239000000463 material Substances 0.000 description 33
- 239000002245 particle Substances 0.000 description 33
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 31
- 150000002500 ions Chemical class 0.000 description 31
- 125000004122 cyclic group Chemical group 0.000 description 30
- 239000003999 initiator Substances 0.000 description 30
- 239000003446 ligand Substances 0.000 description 27
- 229940126062 Compound A Drugs 0.000 description 26
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 26
- 239000000047 product Substances 0.000 description 26
- 239000000243 solution Substances 0.000 description 26
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 25
- 125000004433 nitrogen atom Chemical group N* 0.000 description 25
- 230000015572 biosynthetic process Effects 0.000 description 24
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 24
- 239000007788 liquid Substances 0.000 description 24
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 24
- 125000003545 alkoxy group Chemical group 0.000 description 23
- 125000003710 aryl alkyl group Chemical group 0.000 description 23
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 22
- 239000011324 bead Substances 0.000 description 22
- 229910052731 fluorine Inorganic materials 0.000 description 22
- 125000002252 acyl group Chemical group 0.000 description 21
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 21
- 125000003700 epoxy group Chemical group 0.000 description 21
- 125000002947 alkylene group Chemical group 0.000 description 20
- 125000004430 oxygen atom Chemical group O* 0.000 description 20
- 125000000304 alkynyl group Chemical group 0.000 description 19
- 238000001914 filtration Methods 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 18
- 230000008569 process Effects 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- 125000005370 alkoxysilyl group Chemical group 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000007787 solid Substances 0.000 description 17
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- 239000000178 monomer Substances 0.000 description 15
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 15
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 15
- 239000013078 crystal Substances 0.000 description 14
- 125000001153 fluoro group Chemical group F* 0.000 description 14
- 125000005842 heteroatom Chemical group 0.000 description 14
- 125000000623 heterocyclic group Chemical group 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 13
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 13
- 150000001768 cations Chemical class 0.000 description 13
- 239000002270 dispersing agent Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 13
- 229920001778 nylon Polymers 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 13
- 239000004677 Nylon Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 125000001624 naphthyl group Chemical group 0.000 description 12
- 239000011148 porous material Substances 0.000 description 12
- 125000004434 sulfur atom Chemical group 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 11
- 229910052799 carbon Inorganic materials 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000009833 condensation Methods 0.000 description 11
- 230000005494 condensation Effects 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 11
- 125000004093 cyano group Chemical group *C#N 0.000 description 11
- 238000001035 drying Methods 0.000 description 11
- 239000003112 inhibitor Substances 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 11
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 10
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 10
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- 125000005647 linker group Chemical group 0.000 description 10
- 239000012528 membrane Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 10
- 125000000962 organic group Chemical group 0.000 description 10
- 239000012074 organic phase Substances 0.000 description 10
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 230000002829 reductive effect Effects 0.000 description 9
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 125000003277 amino group Chemical group 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- 125000001309 chloro group Chemical group Cl* 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- 239000010954 inorganic particle Substances 0.000 description 8
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 7
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 7
- 150000001408 amides Chemical group 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 7
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 7
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 7
- 150000001721 carbon Chemical group 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 150000003949 imides Chemical group 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 125000002950 monocyclic group Chemical group 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 125000003367 polycyclic group Chemical group 0.000 description 7
- 238000010992 reflux Methods 0.000 description 7
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 6
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 238000000862 absorption spectrum Methods 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- 125000005161 aryl oxy carbonyl group Chemical group 0.000 description 6
- 125000000732 arylene group Chemical group 0.000 description 6
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 6
- 238000004040 coloring Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 125000006575 electron-withdrawing group Chemical group 0.000 description 6
- 229920000578 graft copolymer Polymers 0.000 description 6
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine group Chemical group N1=CCC2=CC=CC=C12 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 6
- 229910052740 iodine Inorganic materials 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical class N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000010452 phosphate Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- 239000001062 red colorant Substances 0.000 description 6
- 239000011163 secondary particle Substances 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- 239000005749 Copper compound Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 239000007983 Tris buffer Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 125000004442 acylamino group Chemical group 0.000 description 5
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 5
- 239000001055 blue pigment Substances 0.000 description 5
- 238000004440 column chromatography Methods 0.000 description 5
- 239000013065 commercial product Substances 0.000 description 5
- 150000001880 copper compounds Chemical class 0.000 description 5
- 230000006837 decompression Effects 0.000 description 5
- VPXSRGLTQINCRV-UHFFFAOYSA-N dicesium;dioxido(dioxo)tungsten Chemical compound [Cs+].[Cs+].[O-][W]([O-])(=O)=O VPXSRGLTQINCRV-UHFFFAOYSA-N 0.000 description 5
- 235000011187 glycerol Nutrition 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 125000001841 imino group Chemical group [H]N=* 0.000 description 5
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000000269 nucleophilic effect Effects 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 5
- 150000002923 oximes Chemical class 0.000 description 5
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 5
- 239000001054 red pigment Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 229910001930 tungsten oxide Inorganic materials 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 239000001060 yellow colorant Substances 0.000 description 5
- WNWHHMBRJJOGFJ-UHFFFAOYSA-N 16-methylheptadecan-1-ol Chemical compound CC(C)CCCCCCCCCCCCCCCO WNWHHMBRJJOGFJ-UHFFFAOYSA-N 0.000 description 4
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical group CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 4
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 4
- 125000000641 acridinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 125000005577 anthracene group Chemical group 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 4
- HYGWNUKOUCZBND-UHFFFAOYSA-N azanide Chemical compound [NH2-] HYGWNUKOUCZBND-UHFFFAOYSA-N 0.000 description 4
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 4
- 239000000038 blue colorant Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000000040 green colorant Substances 0.000 description 4
- 239000001056 green pigment Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 125000002883 imidazolyl group Chemical group 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 150000003568 thioethers Chemical class 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- HEQOJEGTZCTHCF-UHFFFAOYSA-N 2-amino-1-phenylethanone Chemical class NCC(=O)C1=CC=CC=C1 HEQOJEGTZCTHCF-UHFFFAOYSA-N 0.000 description 3
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- FZEYVTFCMJSGMP-UHFFFAOYSA-N acridone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3NC2=C1 FZEYVTFCMJSGMP-UHFFFAOYSA-N 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910001413 alkali metal ion Inorganic materials 0.000 description 3
- 125000004466 alkoxycarbonylamino group Chemical group 0.000 description 3
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 3
- 125000004414 alkyl thio group Chemical group 0.000 description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 3
- 125000005162 aryl oxy carbonyl amino group Chemical group 0.000 description 3
- 125000005135 aryl sulfinyl group Chemical group 0.000 description 3
- 125000005110 aryl thio group Chemical group 0.000 description 3
- 125000004104 aryloxy group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 125000005150 heteroarylsulfinyl group Chemical group 0.000 description 3
- 125000005143 heteroarylsulfonyl group Chemical group 0.000 description 3
- 125000005368 heteroarylthio group Chemical group 0.000 description 3
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 3
- 125000001041 indolyl group Chemical group 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000005525 methide group Chemical group 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 125000001484 phenothiazinyl group Chemical group C1(=CC=CC=2SC3=CC=CC=C3NC12)* 0.000 description 3
- 125000001644 phenoxazinyl group Chemical group C1(=CC=CC=2OC3=CC=CC=C3NC12)* 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 125000003373 pyrazinyl group Chemical group 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 3
- 125000000714 pyrimidinyl group Chemical group 0.000 description 3
- 125000000168 pyrrolyl group Chemical group 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 125000000213 sulfino group Chemical group [H]OS(*)=O 0.000 description 3
- 125000006296 sulfonyl amino group Chemical group [H]N(*)S(*)(=O)=O 0.000 description 3
- 239000003930 superacid Substances 0.000 description 3
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- CKXILIWMLCYNIX-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate;triethylazanium Chemical compound CC[NH+](CC)CC.[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CKXILIWMLCYNIX-UHFFFAOYSA-N 0.000 description 2
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 2
- XTEGVFVZDVNBPF-UHFFFAOYSA-N 1,5-naphthalene disulfonic acid Natural products C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1S(O)(=O)=O XTEGVFVZDVNBPF-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- VYTVPRWAGRDIIR-UHFFFAOYSA-N 2-aminoethyl diphenyl borate Chemical compound C=1C=CC=CC=1OB(OCCN)OC1=CC=CC=C1 VYTVPRWAGRDIIR-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- AZYGEWXDKHFOKB-UHFFFAOYSA-N 2-chloro-1,3,2-benzodioxaborole Chemical compound C1=CC=C2OB(Cl)OC2=C1 AZYGEWXDKHFOKB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical class OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- JYAKNSNAABYQBU-UHFFFAOYSA-N 2h-dibenzofuran-1-one Chemical class O1C2=CC=CC=C2C2=C1C=CCC2=O JYAKNSNAABYQBU-UHFFFAOYSA-N 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- 229910021594 Copper(II) fluoride Inorganic materials 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- FFOPEPMHKILNIT-UHFFFAOYSA-N Isopropyl butyrate Chemical compound CCCC(=O)OC(C)C FFOPEPMHKILNIT-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 239000012359 Methanesulfonyl chloride Substances 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- RRJHFUHAKCSNRY-UHFFFAOYSA-L [Cu+2].[O-]P([O-])=O Chemical compound [Cu+2].[O-]P([O-])=O RRJHFUHAKCSNRY-UHFFFAOYSA-L 0.000 description 2
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 2
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 2
- 150000008051 alkyl sulfates Chemical class 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 229940051881 anilide analgesics and antipyretics Drugs 0.000 description 2
- 150000003931 anilides Chemical class 0.000 description 2
- 150000001449 anionic compounds Chemical class 0.000 description 2
- 239000003945 anionic surfactant Substances 0.000 description 2
- 125000005129 aryl carbonyl group Chemical group 0.000 description 2
- 125000003828 azulenyl group Chemical group 0.000 description 2
- MYONAGGJKCJOBT-UHFFFAOYSA-N benzimidazol-2-one Chemical compound C1=CC=CC2=NC(=O)N=C21 MYONAGGJKCJOBT-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 125000000609 carbazolyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 2
- 125000005587 carbonate group Chemical group 0.000 description 2
- 150000001728 carbonyl compounds Chemical class 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229940125898 compound 5 Drugs 0.000 description 2
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- 229940116318 copper carbonate Drugs 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- LTGBYAPCOUAFDM-UHFFFAOYSA-M copper(1+);phenoxide Chemical compound [Cu+].[O-]C1=CC=CC=C1 LTGBYAPCOUAFDM-UHFFFAOYSA-M 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- GWFAVIIMQDUCRA-UHFFFAOYSA-L copper(ii) fluoride Chemical compound [F-].[F-].[Cu+2] GWFAVIIMQDUCRA-UHFFFAOYSA-L 0.000 description 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940105990 diglycerin Drugs 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- YPLYFEUBZLLLIY-UHFFFAOYSA-N dipropan-2-yl butanedioate Chemical compound CC(C)OC(=O)CCC(=O)OC(C)C YPLYFEUBZLLLIY-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005303 fluorophosphate glass Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- 125000005553 heteroaryloxy group Chemical group 0.000 description 2
- 125000005226 heteroaryloxycarbonyl group Chemical group 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Inorganic materials Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 2
- 125000003406 indolizinyl group Chemical group C=1(C=CN2C=CC=CC12)* 0.000 description 2
- 229910001412 inorganic anion Inorganic materials 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate Chemical compound [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002527 isonitriles Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- QARBMVPHQWIHKH-UHFFFAOYSA-N methanesulfonyl chloride Chemical compound CS(Cl)(=O)=O QARBMVPHQWIHKH-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 description 2
- 125000006366 methylene oxy carbonyl group Chemical group [H]C([H])([*:1])OC([*:2])=O 0.000 description 2
- 125000005699 methyleneoxy group Chemical group [H]C([H])([*:1])O[*:2] 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000001061 orange colorant Substances 0.000 description 2
- 150000002891 organic anions Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- SMYREFDDLSTNKQ-UHFFFAOYSA-N oxocan-2-ol Chemical compound OC1CCCCCCO1 SMYREFDDLSTNKQ-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N p-toluenesulfonic acid Substances CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Chemical compound [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000005365 phosphate glass Substances 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 2
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 2
- PTMHPRAIXMAOOB-UHFFFAOYSA-N phosphoric acid amide group Chemical group P(N)(O)(O)=O PTMHPRAIXMAOOB-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 125000005543 phthalimide group Chemical group 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 description 2
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 2
- 239000001057 purple pigment Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 2
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 150000003564 thiocarbonyl compounds Chemical class 0.000 description 2
- 125000000101 thioether group Chemical group 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- CSRZQMIRAZTJOY-UHFFFAOYSA-N trimethylsilyl iodide Chemical compound C[Si](C)(C)I CSRZQMIRAZTJOY-UHFFFAOYSA-N 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 239000001052 yellow pigment Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- YSWBUABBMRVQAC-UHFFFAOYSA-N (2-nitrophenyl)methanesulfonic acid Chemical class OS(=O)(=O)CC1=CC=CC=C1[N+]([O-])=O YSWBUABBMRVQAC-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MRUDPRFGMHTPFJ-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) acetate Chemical compound CC(=O)ON=C(C)C(C)=O MRUDPRFGMHTPFJ-UHFFFAOYSA-N 0.000 description 1
- SKCKRZWCOYHBEC-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) benzoate Chemical compound CC(=O)C(C)=NOC(=O)C1=CC=CC=C1 SKCKRZWCOYHBEC-UHFFFAOYSA-N 0.000 description 1
- JFFCVOSCPLKMLG-UHFFFAOYSA-N (3-oxobutan-2-ylideneamino) propanoate Chemical compound CCC(=O)ON=C(C)C(C)=O JFFCVOSCPLKMLG-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- LAGFFDVBFWIIQU-UHFFFAOYSA-N (pentan-2-ylideneamino) acetate Chemical compound CCCC(C)=NOC(C)=O LAGFFDVBFWIIQU-UHFFFAOYSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- FLBAYUMRQUHISI-UHFFFAOYSA-N 1,8-naphthyridine Chemical group N1=CC=CC2=CC=CN=C21 FLBAYUMRQUHISI-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical group C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical group C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- JQCSUVJDBHJKNG-UHFFFAOYSA-N 1-methoxy-ethyl Chemical group C[CH]OC JQCSUVJDBHJKNG-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- PSYVYZXKAVCUSY-UHFFFAOYSA-N 10h-[1,3]oxazolo[5,4-a]carbazole Chemical group C1=CC=C2NC3=C(OC=N4)C4=CC=C3C2=C1 PSYVYZXKAVCUSY-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- USYCQABRSUEURP-UHFFFAOYSA-N 1h-benzo[f]benzimidazole Chemical group C1=CC=C2C=C(NC=N3)C3=CC2=C1 USYCQABRSUEURP-UHFFFAOYSA-N 0.000 description 1
- XWIYUCRMWCHYJR-UHFFFAOYSA-N 1h-pyrrolo[3,2-b]pyridine Chemical group C1=CC=C2NC=CC2=N1 XWIYUCRMWCHYJR-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- ZMZSYUSDGRJZNT-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)acetonitrile Chemical compound C1=CC=C2SC(CC#N)=NC2=C1 ZMZSYUSDGRJZNT-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- UXGVMFHEKMGWMA-UHFFFAOYSA-N 2-benzofuran Chemical group C1=CC=CC2=COC=C21 UXGVMFHEKMGWMA-UHFFFAOYSA-N 0.000 description 1
- CLEOKTJHYLXEKQ-UHFFFAOYSA-N 2-chloro-6-methyl-1,3-benzoxazole Chemical compound CC1=CC=C2N=C(Cl)OC2=C1 CLEOKTJHYLXEKQ-UHFFFAOYSA-N 0.000 description 1
- ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 2-dodecanoyloxyethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCC ZVUNTIMPQCQCAQ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- WLXYHLHNIRJAIG-UHFFFAOYSA-N 2h-benzo[e]isoindole Chemical compound C1=CC=C2C3=CNC=C3C=CC2=C1 WLXYHLHNIRJAIG-UHFFFAOYSA-N 0.000 description 1
- XBNVWXKPFORCRI-UHFFFAOYSA-N 2h-naphtho[2,3-f]quinolin-1-one Chemical compound C1=CC=CC2=CC3=C4C(=O)CC=NC4=CC=C3C=C21 XBNVWXKPFORCRI-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- JRXXEXVXTFEBIY-UHFFFAOYSA-N 3-ethoxypropanoic acid Chemical compound CCOCCC(O)=O JRXXEXVXTFEBIY-UHFFFAOYSA-N 0.000 description 1
- SGHBRHKBCLLVCI-UHFFFAOYSA-N 3-hydroxybenzonitrile Chemical compound OC1=CC=CC(C#N)=C1 SGHBRHKBCLLVCI-UHFFFAOYSA-N 0.000 description 1
- HTNUUDFQRYBJPH-UHFFFAOYSA-N 3-methoxypropanehydrazide Chemical compound COCCC(=O)NN HTNUUDFQRYBJPH-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- YELMWJNXDALKFE-UHFFFAOYSA-N 3h-imidazo[4,5-f]quinoxaline Chemical group N1=CC=NC2=C(NC=N3)C3=CC=C21 YELMWJNXDALKFE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- CVNOWLNNPYYEOH-UHFFFAOYSA-N 4-cyanophenol Chemical compound OC1=CC=C(C#N)C=C1 CVNOWLNNPYYEOH-UHFFFAOYSA-N 0.000 description 1
- ZMGMDXCADSRNCX-UHFFFAOYSA-N 5,6-dihydroxy-1,3-diazepan-2-one Chemical group OC1CNC(=O)NCC1O ZMGMDXCADSRNCX-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- GDALETGZDYOOGB-UHFFFAOYSA-N Acridone Natural products C1=C(O)C=C2N(C)C3=CC=CC=C3C(=O)C2=C1O GDALETGZDYOOGB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- KYNSBQPICQTCGU-UHFFFAOYSA-N Benzopyrane Chemical compound C1=CC=C2C=CCOC2=C1 KYNSBQPICQTCGU-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- SYSPOOPLPCVGLD-UHFFFAOYSA-N C1(=CC=C(C=C1)S(=O)(=O)OC(C(C=N)=O)C)C Chemical compound C1(=CC=C(C=C1)S(=O)(=O)OC(C(C=N)=O)C)C SYSPOOPLPCVGLD-UHFFFAOYSA-N 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- YYLLIJHXUHJATK-UHFFFAOYSA-N Cyclohexyl acetate Chemical compound CC(=O)OC1CCCCC1 YYLLIJHXUHJATK-UHFFFAOYSA-N 0.000 description 1
- 229920003270 Cymel® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KIWBPDUYBMNFTB-UHFFFAOYSA-N Ethyl hydrogen sulfate Chemical compound CCOS(O)(=O)=O KIWBPDUYBMNFTB-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- FPVVYTCTZKCSOJ-UHFFFAOYSA-N Ethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOC(=O)CCCCCCCCCCCCCCCCC FPVVYTCTZKCSOJ-UHFFFAOYSA-N 0.000 description 1
- 241000511976 Hoya Species 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- SYEIQVTUQQJHIZ-UHFFFAOYSA-L O(C1=CC=CC=C1)[Cu]Cl Chemical compound O(C1=CC=CC=C1)[Cu]Cl SYEIQVTUQQJHIZ-UHFFFAOYSA-L 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- DIQMPQMYFZXDAX-UHFFFAOYSA-N Pentyl formate Chemical compound CCCCCOC=O DIQMPQMYFZXDAX-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920002035 Pluronic® L 10 Polymers 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- 229920002359 Tetronic® Polymers 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- DPQRMIPRAHPPNE-UHFFFAOYSA-N [(1-oxo-1-phenylpropan-2-ylidene)amino] acetate Chemical compound CC(=O)ON=C(C)C(=O)C1=CC=CC=C1 DPQRMIPRAHPPNE-UHFFFAOYSA-N 0.000 description 1
- ZNZDJSGUWLGTLA-UHFFFAOYSA-N [(1-oxo-1-phenylpropan-2-ylidene)amino] benzoate Chemical compound C=1C=CC=CC=1C(=O)C(C)=NOC(=O)C1=CC=CC=C1 ZNZDJSGUWLGTLA-UHFFFAOYSA-N 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical group C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- HIVQCJOGAHNXBO-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] propanoate Chemical compound CCC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C HIVQCJOGAHNXBO-UHFFFAOYSA-N 0.000 description 1
- USDJGQLNFPZEON-UHFFFAOYSA-N [[4,6-bis(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(NCO)=NC(NCO)=N1 USDJGQLNFPZEON-UHFFFAOYSA-N 0.000 description 1
- 125000004062 acenaphthenyl group Chemical group C1(CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000004450 alkenylene group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000004691 alkyl thio carbonyl group Chemical group 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- 125000004419 alkynylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical compound [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- JGFLAAWSLCPCDY-UHFFFAOYSA-N benzene;cyclopenta-1,3-diene;iron Chemical class [Fe].C1C=CC=C1.C1=CC=CC=C1 JGFLAAWSLCPCDY-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- KXNQKOAQSGJCQU-UHFFFAOYSA-N benzo[e][1,3]benzothiazole Chemical group C1=CC=C2C(N=CS3)=C3C=CC2=C1 KXNQKOAQSGJCQU-UHFFFAOYSA-N 0.000 description 1
- WMUIZUWOEIQJEH-UHFFFAOYSA-N benzo[e][1,3]benzoxazole Chemical group C1=CC=C2C(N=CO3)=C3C=CC2=C1 WMUIZUWOEIQJEH-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 1
- 125000000649 benzylidene group Chemical group [H]C(=[*])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004305 biphenyl Chemical group 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- ZEFSGHVBJCEKAZ-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphite Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C ZEFSGHVBJCEKAZ-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229940063013 borate ion Drugs 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- JHRWWRDRBPCWTF-OLQVQODUSA-N captafol Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)C(Cl)Cl)C(=O)[C@H]21 JHRWWRDRBPCWTF-OLQVQODUSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- QZHPTGXQGDFGEN-UHFFFAOYSA-N chromene Chemical group C1=CC=C2C=C[CH]OC2=C1 QZHPTGXQGDFGEN-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 125000005578 chrysene group Chemical group 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- IPHJYJHJDIGARM-UHFFFAOYSA-M copper phthalocyaninesulfonic acid, dioctadecyldimethylammonium salt Chemical compound [Cu+2].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC.C=1C(S(=O)(=O)[O-])=CC=C(C(=NC2=NC(C3=CC=CC=C32)=N2)[N-]3)C=1C3=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 IPHJYJHJDIGARM-UHFFFAOYSA-M 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- YRNNKGFMTBWUGL-UHFFFAOYSA-L copper(ii) perchlorate Chemical compound [Cu+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O YRNNKGFMTBWUGL-UHFFFAOYSA-L 0.000 description 1
- SEKCXMNFUDONGJ-UHFFFAOYSA-L copper;2-ethylhexanoate Chemical compound [Cu+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O SEKCXMNFUDONGJ-UHFFFAOYSA-L 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- WFIPUECTLSDQKU-UHFFFAOYSA-N copper;ethyl 3-oxobutanoate Chemical compound [Cu].CCOC(=O)CC(C)=O WFIPUECTLSDQKU-UHFFFAOYSA-N 0.000 description 1
- BSXVKCJAIJZTAV-UHFFFAOYSA-L copper;methanesulfonate Chemical compound [Cu+2].CS([O-])(=O)=O.CS([O-])(=O)=O BSXVKCJAIJZTAV-UHFFFAOYSA-L 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 150000003950 cyclic amides Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- FWBOFUGDKHMVPI-UHFFFAOYSA-K dicopper;2-oxidopropane-1,2,3-tricarboxylate Chemical compound [Cu+2].[Cu+2].[O-]C(=O)CC([O-])(C([O-])=O)CC([O-])=O FWBOFUGDKHMVPI-UHFFFAOYSA-K 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- PPSZHCXTGRHULJ-UHFFFAOYSA-N dioxazine Chemical compound O1ON=CC=C1 PPSZHCXTGRHULJ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- WNIHNYUROPJCLW-UHFFFAOYSA-N ethyl 2-ethoxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)OCC WNIHNYUROPJCLW-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- JLEKJZUYWFJPMB-UHFFFAOYSA-N ethyl 2-methoxyacetate Chemical compound CCOC(=O)COC JLEKJZUYWFJPMB-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- FJAKCEHATXBFJT-UHFFFAOYSA-N ethyl 2-oxobutanoate Chemical compound CCOC(=O)C(=O)CC FJAKCEHATXBFJT-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- YDMWUMUNUXUYKT-UHFFFAOYSA-N ethyl [(1-oxo-1-phenylpropan-2-ylidene)amino] carbonate Chemical compound CCOC(=O)ON=C(C)C(=O)C1=CC=CC=C1 YDMWUMUNUXUYKT-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- HSZCIIHXQDBPOI-UHFFFAOYSA-N fluorourea Chemical compound NC(=O)NF HSZCIIHXQDBPOI-UHFFFAOYSA-N 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229940100608 glycol distearate Drugs 0.000 description 1
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 1
- 125000001046 glycoluril group Chemical class [H]C12N(*)C(=O)N(*)C1([H])N(*)C(=O)N2* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- ISNICOKBNZOJQG-UHFFFAOYSA-O guanidinium ion Chemical compound C[NH+]=C(N(C)C)N(C)C ISNICOKBNZOJQG-UHFFFAOYSA-O 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 125000002192 heptalenyl group Chemical group 0.000 description 1
- 125000005549 heteroarylene group Chemical group 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 125000003427 indacenyl group Chemical group 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002183 isoquinolinyl group Chemical group C1(=NC=CC2=CC=CC=C12)* 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 125000000842 isoxazolyl group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- AKWHOGIYEOZALP-UHFFFAOYSA-N methyl 2-methoxy-2-methylpropanoate Chemical compound COC(=O)C(C)(C)OC AKWHOGIYEOZALP-UHFFFAOYSA-N 0.000 description 1
- XPIWVCAMONZQCP-UHFFFAOYSA-N methyl 2-oxobutanoate Chemical compound CCC(=O)C(=O)OC XPIWVCAMONZQCP-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 125000004674 methylcarbonyl group Chemical group CC(=O)* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- ZBOYHAZRFJBUEL-UHFFFAOYSA-N n-[2-(4-benzhydryloxypiperidin-1-yl)ethyl]-3-hydroxy-5-(pyridin-3-ylmethoxy)naphthalene-2-carboxamide Chemical compound C1=CC=C2C=C(C(=O)NCCN3CCC(CC3)OC(C=3C=CC=CC=3)C=3C=CC=CC=3)C(O)=CC2=C1OCC1=CC=CN=C1 ZBOYHAZRFJBUEL-UHFFFAOYSA-N 0.000 description 1
- RMTGISUVUCWJIT-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine;hydrochloride Chemical compound Cl.NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 RMTGISUVUCWJIT-UHFFFAOYSA-N 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical class O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- UPHWVVKYDQHTCF-UHFFFAOYSA-N octadecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCCCCCCCN UPHWVVKYDQHTCF-UHFFFAOYSA-N 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 239000001053 orange pigment Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical group C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 125000005582 pentacene group Chemical group 0.000 description 1
- GUVXZFRDPCKWEM-UHFFFAOYSA-N pentalene group Chemical group C1=CC=C2C=CC=C12 GUVXZFRDPCKWEM-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical compound C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- RDOWQLZANAYVLL-UHFFFAOYSA-N phenanthridine Chemical group C1=CC=C2C3=CC=CC=C3C=NC2=C1 RDOWQLZANAYVLL-UHFFFAOYSA-N 0.000 description 1
- 125000001791 phenazinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3N=C12)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- GJSGGHOYGKMUPT-UHFFFAOYSA-N phenoxathiine Chemical group C1=CC=C2OC3=CC=CC=C3SC2=C1 GJSGGHOYGKMUPT-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical group C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 229940075930 picrate Drugs 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-M picrate anion Chemical compound [O-]C1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-M 0.000 description 1
- 229940110337 pigment blue 1 Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000412 polyarylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000000244 polyoxyethylene sorbitan monooleate Substances 0.000 description 1
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000053 polysorbate 80 Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- NARVIWMVBMUEOG-UHFFFAOYSA-N prop-1-en-2-ol Chemical group CC(O)=C NARVIWMVBMUEOG-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- GZTPJDLYPMPRDF-UHFFFAOYSA-N pyrrolo[3,2-c]pyrazole Chemical compound N1=NC2=CC=NC2=C1 GZTPJDLYPMPRDF-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- BFNYNEMRWHFIMR-UHFFFAOYSA-N tert-butyl 2-cyanoacetate Chemical compound CC(C)(C)OC(=O)CC#N BFNYNEMRWHFIMR-UHFFFAOYSA-N 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001935 tetracenyl group Chemical group C1(=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C12)* 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 125000003831 tetrazolyl group Chemical group 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1803—C3-(meth)acrylate, e.g. (iso)propyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
- C09B23/0016—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being a halogen atom
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
- C09B23/0025—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being bound through an oxygen atom
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
- C09B23/0033—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being bound through a sulfur atom
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
- C09B23/0041—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being bound through a nitrogen atom
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0008—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain
- C09B23/005—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being a COOH and/or a functional derivative thereof
- C09B23/0058—Methine or polymethine dyes, e.g. cyanine dyes substituted on the polymethine chain the substituent being a COOH and/or a functional derivative thereof the substituent being CN
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0066—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain being part of a carbocyclic ring,(e.g. benzene, naphtalene, cyclohexene, cyclobutenene-quadratic acid)
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/0075—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain being part of an heterocyclic ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/02—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups
- C09B23/08—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines
- C09B23/083—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines five >CH- groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/02—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups
- C09B23/08—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines
- C09B23/086—Methine or polymethine dyes, e.g. cyanine dyes the polymethine chain containing an odd number of >CH- or >C[alkyl]- groups more than three >CH- groups, e.g. polycarbocyanines more than five >CH- groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
- C09B23/14—Styryl dyes
- C09B23/145—Styryl dyes the ethylene chain carrying an heterocyclic residue, e.g. heterocycle-CH=CH-C6H5
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B57/00—Other synthetic dyes of known constitution
- C09B57/004—Diketopyrrolopyrrole dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B57/00—Other synthetic dyes of known constitution
- C09B57/007—Squaraine dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B57/00—Other synthetic dyes of known constitution
- C09B57/008—Triarylamine dyes containing no other chromophores
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14875—Infrared CCD or CID imagers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
Definitions
- the present invention relates to a composition, a film, a near-infrared cut filter, a laminate, a pattern forming method, a solid-state imaging device, an image display device, an infrared sensor, and a color filter.
- Video cameras, digital still cameras, mobile phones with camera functions, etc. use CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor), which are solid-state imaging devices for color images. Since these solid-state imaging devices use silicon photodiodes having sensitivity to infrared rays in their light receiving portions, visual sensitivity correction may be performed using a near-infrared cut filter.
- CCD Charge Coupled Device
- CMOS Complementary Metal Oxide Semiconductor
- Patent Documents 1 and 2 As the near-infrared absorbing compounds, pyrrolopyrrole compounds and cyanine compounds are known (for example, Patent Documents 1 and 2).
- Patent Document 2 describes that a near-infrared cut filter is produced using a near-infrared absorbing composition containing two or more water-soluble cyanine compounds.
- An object of the present invention is to provide a composition that can form a film that is excellent in infrared shielding properties and hardly causes spectral fluctuations.
- Another object of the present invention is to provide a film, a near-infrared cut filter, a laminate, a pattern formation method, a solid-state imaging device, an image display device, an infrared sensor, and a color filter.
- the present inventors have conducted intensive studies, and as a result, have a maximum absorption wavelength in the wavelength range of 650 to 1000 nm and have a near-infrared absorption having a solubility in water at 23 ° C. of 0.1% by mass or less.
- the inventors have found that the above object can be achieved by using two or more compounds, and have completed the present invention.
- the present invention provides the following. ⁇ 1> including two or more near-infrared absorbing compounds having a maximum absorption wavelength in a wavelength range of 650 to 1000 nm and a solubility in water at 23 ° C.
- Two or more near infrared absorbing compounds A first near infrared absorbing compound having a maximum absorption wavelength in the wavelength range of 650 to 1000 nm; A second near-infrared absorbing compound that is shorter than the maximum absorption wavelength of the first near-infrared absorbing compound and has a maximum absorption wavelength in the wavelength range of 650 to 1000 nm, A composition wherein the difference between the maximum absorption wavelength of the first near-infrared absorbing compound and the maximum absorption wavelength of the second near-infrared absorbing compound is 1 to 150 nm.
- the ratio A1 / A2 between the absorbance A1 at the wavelength of 500 nm and the absorbance A2 at the maximum absorption wavelength is 0.04 or less, respectively.
- At least one of the first near-infrared absorbing compound and the second near-infrared absorbing compound contains at least one selected from a pyrrolopyrrole compound, a cyanine compound, a squarylium compound, a phthalocyanine compound, a naphthalocyanine compound, and a rylene compound. ⁇ 1> or ⁇ 2>.
- a 1 and A 2 each independently represent a heteroaryl group
- B 1 and B 2 each independently represent a —BR 1 R 2 group
- R 1 and R 2 each independently represent a substituent
- R 1 and R 2 may be bonded to each other to form a ring
- C 1 and C 2 each independently represents an alkyl group, an aryl group, or a heteroaryl group
- D 1 and D 2 each independently represents a substituent.
- At least one of the first near-infrared absorbing compound and the second near-infrared absorbing compound is at least selected from a compound represented by the following formula (II) and a compound represented by the following formula (III)
- X 1 and X 2 each independently represent O, S, NR X1 or CR X2 R X3 , R X1 to R X3 each independently represent a hydrogen atom or a substituent, R 3 to R 6 each independently represents a hydrogen atom or a substituent, R 3 and R 4 , or R 5 and R 6 may be bonded to each other to form a ring,
- B 1 and B 2 each independently represent a —BR 1 R 2 group, R 1 and R 2 each independently represent a substituent, and R 1 and R 2 may be bonded to each other to form a ring;
- C 1 and C 2 each independently represents an alkyl group, an alkyl
- composition according to any one of ⁇ 1> to ⁇ 6>, wherein the first near-infrared absorbing compound and the second near-infrared absorbing compound are compounds having a common dye skeleton.
- first near-infrared absorbing compound and the second near-infrared absorbing compound are compounds having a common dye skeleton.
- second near-infrared absorbing compound is a pyrrolopyrrole compound, or both are cyanine compounds.
- composition according to any one of ⁇ 1> to ⁇ 8> wherein the difference between the maximum absorption wavelength of the first near-infrared absorbing compound and the maximum absorption wavelength of the second near-infrared absorbing compound is 1 to 90 nm. object.
- ⁇ 10> The composition according to any one of ⁇ 1> to ⁇ 9>, further comprising a curable compound.
- ⁇ 11> The composition according to any one of ⁇ 1> to ⁇ 10>, further comprising a resin and a solvent.
- ⁇ 12> The composition according to any one of ⁇ 1> to ⁇ 11>, further comprising a chromatic colorant.
- a film comprising the composition according to any one of ⁇ 1> to ⁇ 12>.
- a near-infrared cut filter comprising the composition according to any one of ⁇ 1> to ⁇ 12>.
- the near-infrared cut filter according to ⁇ 14> further including a layer containing copper.
- a pattern is formed on the composition layer by a step of forming a composition layer containing the composition according to any one of ⁇ 1> to ⁇ 12> on a support, and a photolithography method or a dry etching method. And a pattern forming method.
- a solid-state imaging device having the film according to ⁇ 13>.
- An image display device having the film according to ⁇ 13>.
- An infrared sensor having the film according to ⁇ 13>.
- a color filter comprising a pixel comprising the composition according to any one of ⁇ 1> to ⁇ 12> and a pixel selected from red, green, blue, magenta, yellow, cyan, black and colorless.
- the present invention it has become possible to provide a composition capable of forming a film having excellent infrared shielding properties and moisture resistance.
- a film a near-infrared cut filter, a laminate, a pattern forming method, a solid-state imaging device, an image display device, an infrared sensor, and a color filter.
- FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is a figure (plan view) showing the formation process of a pattern.
- FIG. 5 is a cross-sectional view taken along the line AA in FIG. 4. It is a figure (plan view) showing the formation process of a pattern.
- FIG. 7 is a cross-sectional view taken along line AA in FIG. 6. It is the schematic which shows other embodiment of an infrared sensor.
- ⁇ is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
- the notation which does not describe substitution and non-substitution includes a group (atomic group) having a substituent together with a group (atomic group) having no substituent.
- the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
- light means actinic rays or radiation.
- Actinic light or “radiation” means, for example, an emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays (EUV light), X-rays, electron beams, and the like.
- exposure means not only exposure using a mercury lamp emission line spectrum, far ultraviolet rays typified by an excimer laser, X-rays, EUV light, etc. Drawing using particle beams is also included in the exposure.
- “(meth) acrylate” represents acrylate and methacrylate
- (meth) acryl represents acryl and methacryl
- (meth) acryloyl” represents acryloyl and methacryloyl.
- a weight average molecular weight and a number average molecular weight are defined as a polystyrene conversion value measured by gel permeation chromatography (GPC).
- the weight average molecular weight (Mw) and the number average molecular weight (Mn) are, for example, HLC-8220 (manufactured by Tosoh Corporation), and TSKgel Super AWM-H (manufactured by Tosoh Corporation, 6) as a column.
- 0.0 mm ID (inner diameter) ⁇ 15.0 cm) can be obtained by using a 10 mmol / L lithium bromide NMP (N-methylpyrrolidinone) solution as an eluent.
- Me in the chemical formula represents a methyl group
- Et represents an ethyl group
- Bu represents a butyl group
- Ph represents a phenyl group.
- Near-infrared light refers to light (electromagnetic wave) having a maximum absorption wavelength region of 700 to 2500 nm.
- the total solid content refers to the total mass of components obtained by removing the solvent from all components of the composition.
- the term “process” is not limited to an independent process, and is included in the term if the intended action of the process is achieved even when it cannot be clearly distinguished from other processes. .
- the composition of the present invention comprises two or more near infrared absorbing compounds having a maximum absorption wavelength in the wavelength range of 650 to 1000 nm and a solubility in water at 23 ° C. of 0.1% by mass or less, Two or more near infrared absorbing compounds A first near infrared absorbing compound having a maximum absorption wavelength in the wavelength range of 650 to 1000 nm; A second near-infrared absorbing compound that is shorter than the maximum absorption wavelength of the first near-infrared absorbing compound and has a maximum absorption wavelength in the wavelength range of 650 to 1000 nm, The difference between the maximum absorption wavelength of the first near-infrared absorbing compound and the maximum absorption wavelength of the second near-infrared absorbing compound is 1 to 150 nm.
- “having a maximum absorption wavelength in the wavelength range of 650 to 1000 nm” means a wavelength exhibiting the maximum absorbance in the wavelength range of 650 to 1000 nm in the absorption spectrum of the near-infrared absorbing compound solution. It means having.
- the measurement solvent used for measuring the absorption spectrum of the near-infrared absorbing compound solution include chloroform, methanol, dimethyl sulfoxide, ethyl acetate, and tetrahydrofuran. In the case of a compound dissolved in chloroform, chloroform is used as a measurement solvent. For compounds that do not dissolve in chloroform, use methanol.
- dimethyl sulfoxide is used when it does not dissolve in either chloroform or methanol.
- solubility with respect to the water of 23 degreeC of a near-infrared absorption compound means the value measured by the method shown in the Example mentioned later.
- composition of this invention contains the above-mentioned 1st near-infrared absorption compound and 2nd near-infrared absorption compound, it can form the film
- the first near-infrared absorbing compound and the second near-infrared absorbing compound have maximum absorption wavelengths in different wavelength ranges in the wavelength range of 650 to 1000 nm, and the difference between the maximum absorption wavelengths is 1 to Since the thickness is 150 nm, the waveform of the absorption spectrum of the film in the wavelength range of 650 to 1000 nm is wider than when one kind of infrared absorbing compound is used, and infrared rays in a wide wavelength range can be shielded. Further, it was found that a film containing two or more kinds of near-infrared absorbing compounds is likely to cause spectral fluctuations.
- the near-infrared absorbing compound contained in the film bleeds out to the film surface or the association state of the near-infrared absorbing compound changes.
- a compound having a solubility in water at 23 ° C. of 0.1% by mass or less is used as the near-infrared absorbing compound, so that the moisture resistance of the resulting film is improved. Even when the film obtained using the composition of the present invention is placed in a high-temperature and high-humidity environment, the bleed-out of the near-infrared absorbing compound and the change in the association state can be suppressed, and the spectral fluctuation can be suppressed.
- the first near infrared absorbing compound when a compound having excellent light resistance (for example, a pyrrolopyrrole compound) is used as the first near infrared absorbing compound, even if a compound having poor light resistance is used as the second near infrared absorbing compound, the light resistance is excellent.
- Membranes can be manufactured. The mechanism for obtaining such an effect is that the energy absorbed by the second near-infrared absorbing compound having the maximum absorption wavelength on the shorter wavelength side than the first near-infrared absorbing compound is the first near-infrared light excellent in light resistance. It is presumed that this is because it moved to the absorbing compound side and the decomposition of the second near-infrared absorbing compound could be suppressed.
- each component of the composition will be described.
- the composition of the present invention has a maximum absorption wavelength in the wavelength range of 650 to 1000 nm and has a solubility in water at 23 ° C. of 0.1% by mass or less (hereinafter also referred to as near infrared absorption compound A). 2) or more.
- the near-infrared absorbing compound A preferably has a maximum absorption wavelength in the range of 660 to 1000 nm, more preferably in the range of 670 to 1000 nm, and particularly preferably in the range of 710 to 1000 nm.
- the solubility of the near-infrared absorbing compound A in water at 23 ° C. is 0.1% by mass or less, more preferably 0.05% by mass or less, and further preferably 0.01% by mass or less. According to this aspect, it is possible to manufacture a film in which spectral fluctuation is further suppressed. In particular, spectral fluctuations can be more effectively suppressed even when exposed to high temperature and high humidity environments.
- the ratio A1 / A2 between the absorbance A1 at a wavelength of 500 nm and the absorbance A2 at the maximum absorption wavelength is preferably 0.08 or less, and more preferably 0.04 or less. According to this aspect, a film excellent in visible transparency and infrared shielding properties can be produced.
- the absorbance A1 at a wavelength of 500 nm and the absorbance A2 at the maximum absorption wavelength are values obtained from an absorption spectrum of a near-infrared absorbing compound solution.
- Two or more kinds of near infrared absorbing compounds A are shorter than the maximum absorbing wavelength of the first near infrared absorbing compound having the maximum absorption wavelength in the wavelength range of 650 to 1000 nm and the first near infrared absorbing compound.
- At least a second near-infrared absorbing compound having a maximum absorption wavelength in the wavelength range of 650 to 1000 nm, the maximum absorption wavelength of the first near-infrared absorption compound, and the maximum absorption wavelength of the second near-infrared absorption compound The difference is 1 to 150 nm.
- the maximum absorption wavelength of the first near-infrared absorbing compound and the maximum absorption wavelength of the second near-infrared absorbing compound is preferably 5 to 100 nm, more preferably 30 to 90 nm. According to this aspect, it is suitable for manufacturing a film that can shield infrared rays in a wide wavelength range.
- the maximum absorption wavelength of the first near infrared absorbing compound, the maximum absorption wavelength of the second near infrared absorbing compound, The difference is preferably 5 to 100 nm, and more preferably 20 to 60 nm. According to this aspect, it is suitable for manufacturing a film that can selectively shield infrared rays in a specific wavelength range. In addition, you may contain 3 or more types of near-infrared absorption compounds which have the maximum absorption wavelength in the above-mentioned wavelength range.
- the near-infrared absorbing compound having the maximum absorption wavelength on the longest wavelength side is the first near-infrared absorbing compound, and the maximum absorption is on the shorter wavelength side than the first near-infrared absorbing compound.
- All the near-infrared absorbing compounds having a wavelength are defined as the second near-infrared absorbing compound.
- these are regarded as the first near-infrared absorbing compound.
- the near-infrared absorbing compound A is not particularly limited as long as it has a maximum absorption wavelength in the wavelength range of 650 to 1000 nm and has a solubility in water of 23 ° C. of 0.1% by mass or less.
- pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds and rylene compounds are preferred, pyrrolopyrrole compounds, cyanine compounds and squarylium compounds are more preferred, and pyrrolopyrrole compounds are more preferred.
- the first near-infrared absorbing compound and the second near-infrared absorbing compound may be compounds having a common dye skeleton or compounds having different dye skeletons.
- dye skeleton means the same compound seed
- both the first near-infrared absorbing compound and the second near-infrared absorbing compound are pyrrolopyrrole compounds (compounds having a pyrrolopyrrole dye skeleton)
- the first near-infrared absorbing compound and the second near-infrared absorbing compound Corresponds to a compound having a common dye skeleton.
- the first near-infrared absorbing compound is preferably a pyrrolopyrrole compound.
- the second near-infrared absorbing compound may be a pyrrolopyrrole compound or a compound other than the pyrrolopyrrole compound.
- Examples of compounds other than the pyrrolopyrrole compound include cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, and rylene compounds, and cyanine compounds and squarylium compounds are preferred.
- the second near infrared absorbing compound is more preferably a pyrrolopyrrole compound.
- the first near-infrared absorbing compound is a pyrrolopyrrole compound and the second near-infrared absorbing compound is at least one selected from a pyrrolopyrrole compound, a squarylium compound, and a cyanine compound is more preferable.
- the second near-infrared absorbing compound is more preferably a pyrrolopyrrole compound or a squarylium compound, and particularly preferably a pyrrolopyrrole compound.
- the pyrrolopyrrole compound is excellent in light resistance, as described above, when the pyrrolopyrrole compound is used as the first near-infrared absorbing compound, the second near-infrared absorbing compound is more light resistant than the pyrrolopyrrole compound. Even when a compound having poor properties is used, a film excellent in light resistance can be produced. In particular, when both the first near-infrared absorbing compound and the second near-infrared absorbing compound are pyrrolopyrrole compounds, a film excellent in light resistance can be produced.
- the first near-infrared absorbing compound is preferably a squarylium compound.
- the second near-infrared absorbing compound may be a squarylium compound or a compound other than a squarylium compound. Examples of compounds other than squarylium compounds include pyrrolopyrrole compounds, cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, and rylene compounds, and pyrrolopyrrole compounds and cyanine compounds are preferred.
- the second near-infrared absorbing compound is more preferably a pyrrolopyrrole compound or a squarylium compound.
- the first near-infrared absorbing compound is a squarylium compound and the second near-infrared absorbing compound is at least one selected from a pyrrolopyrrole compound, a squarylium compound, and a cyanine compound is more preferable.
- the second near-infrared absorbing compound is more preferably a pyrrolopyrrole compound or a squarylium compound.
- the first near-infrared absorbing compound is preferably a cyanine compound.
- the second near-infrared absorbing compound may be a cyanine compound or a compound other than the cyanine compound. Examples of compounds other than cyanine compounds include pyrrolopyrrole compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, and rylene compounds, and pyrrolopyrrole compounds and squarylium compounds are preferred.
- the second near-infrared absorbing compound is more preferably a pyrrolopyrrole compound or a squarylium compound.
- the first near-infrared absorbing compound is a cyanine compound and the second near-infrared absorbing compound is at least one selected from a pyrrolopyrrole compound, a squarylium compound, and a cyanine compound is more preferable.
- the second near-infrared absorbing compound is more preferably a pyrrolopyrrole compound or a cyanine compound, and more preferably a cyanine compound.
- the content of the near-infrared absorbing compound A in the composition is 0.01 to 60 mass% is preferable.
- the lower limit is preferably 0.1% by mass or more, and more preferably 0.5% by mass or more.
- the upper limit is preferably 30% by mass or less, and more preferably 15% by mass or less. By setting it within this range, it is possible to impart good near-infrared absorbing ability.
- the ratio of the first near-infrared absorbing compound and the second near-infrared absorbing compound is not particularly limited.
- the amount of the second near-infrared absorbing compound is preferably 5 to 500 parts by weight, more preferably 10 to 300 parts by weight, and further preferably 30 to 200 parts by weight with respect to 100 parts by weight of the first near-infrared absorbing compound.
- 1 type may be sufficient as a 1st near-infrared absorption compound, and it may contain 2 or more types.
- the total of these is preferably in the above range.
- the second near-infrared absorbing compound may be only one type or may contain two or more types.
- the second near-infrared absorbing compound it is preferable to include two or more kinds of the second near-infrared absorbing compound.
- the difference in the maximum absorption wavelength of the compound A a + 1 having the maximum absorption wavelength on the (a + 1) th long wavelength side is preferably 1 to 90 nm, and more preferably 5 to 60 nm.
- a represents an integer of 1 to n-1
- n represents an integer of 2 or more.
- the maximum absorption wavelength of the compound A 1 (the compound having the maximum absorption wavelength on the longest wavelength side) having the maximum absorption wavelength on the longest wavelength side first and
- the difference in the maximum absorption wavelength of compound A 2 (the compound having the maximum absorption wavelength on the shorter wavelength side than compound A 1 ) having the second maximum absorption wavelength on the second long wavelength side is preferably 1 to 90 nm. More preferably, it is ⁇ 60 nm.
- the maximum absorption wavelength of the compound A 2 having the second maximum absorption wavelength on the long wavelength side and the compound A 3 having the third maximum absorption wavelength on the long wavelength side is preferably from 1 to 90 nm, more preferably from 5 to 60 nm.
- the first near-infrared absorbing compound and the second near-infrared absorbing compound are also preferably used as a dye multimer.
- the dye multimer has two or more near-infrared absorbing dye structures in one molecule, and preferably has three or more near-infrared absorbing dye structures.
- the upper limit of the number of near-infrared absorbing dye structures in one molecule is not particularly limited, but may be 100 or less.
- the pyrrolopyrrole compound used as the near-infrared absorbing compound A is preferably a compound represented by the formula (I).
- a 1 and A 2 each independently represent a heteroaryl group
- B 1 and B 2 each independently represent a —BR 1 R 2 group
- R 1 and R 2 each independently represent a substituent
- R 1 and R 2 may be bonded to each other to form a ring
- C 1 and C 2 each independently represents an alkyl group, an aryl group, or a heteroaryl group
- D 1 and D 2 each independently represents a substituent.
- a 1 and A 2 each independently represents a heteroaryl group.
- a 1 and A 2 may be the same group or different groups.
- a 1 and A 2 are preferably the same group.
- the heteroaryl group is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring having a condensation number of 2 to 8, more preferably a single ring or a condensed ring having a condensation number of 2 to 4. .
- the number of heteroatoms constituting the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the number of carbon atoms constituting the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, still more preferably 3 to 12, and particularly preferably 3 to 10.
- the heteroaryl group is preferably a 5-membered ring or a 6-membered ring.
- the heteroaryl group is preferably a group represented by the following formula (A-1) and a group represented by (A-2).
- X 1 each independently represents O, S, NR X1 or CR X2 R X3 , R X1 to R X3 each independently represents a hydrogen atom or a substituent, and R 3 and R 4 Each independently represents a hydrogen atom or a substituent, and R 3 and R 4 may be bonded to each other to form a ring.
- * Represents a bonding position in the formula (I).
- the substituents represented by R 3 , R 4 and R X1 to R X3 are alkyl groups, alkenyl groups, aryl groups, heteroaryl groups, alkoxy groups, aryloxy groups, heteroaryloxy groups, acyl groups, alkoxycarbonyl groups, aryls.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and still more preferably 1 to 8 carbon atoms.
- the alkyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described above, and examples thereof include a halogen atom and an aryl group.
- the aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and still more preferably 6 to 12 carbon atoms.
- the aryl group may have a substituent or may be unsubstituted.
- Examples of the substituent include the groups described above, and examples include a halogen atom and an alkyl group.
- examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the ring formed by combining R 3 and R 4 is preferably an aromatic ring.
- (A-1) includes the group represented by the following (A-1-1), the group represented by (A-1-2), etc. .
- each X 1 independently represents O, S, NR X1 or CR X2 R X3
- R X1 to R X3 each independently represents a hydrogen atom or a substituent
- R 101 to R 109 each independently represents hydrogen.
- Y 1 to Y 4 each independently represent N or CR Y1 , at least two of Y 1 to Y 4 are CR Y1 , R Y1 represents a hydrogen atom or a substituent, Adjacent R Y1 may be bonded to each other to form a ring.
- * Represents a bonding position in the formula (I).
- the substituent represented by R Y1 include the substituents described above, and an alkyl group, an aryl group, and a halogen atom are preferable.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and still more preferably 1 to 8 carbon atoms.
- the alkyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the alkyl group may have a substituent or may be unsubstituted.
- Examples of the substituent include the substituents described above, and examples thereof include a halogen atom and an aryl group.
- the aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and still more preferably 6 to 12 carbon atoms.
- the aryl group may have a substituent or may be unsubstituted.
- Examples of the substituent include the above-described substituents, and examples thereof include a halogen atom and an alkyl group.
- Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- At least two of Y 1 to Y 4 are CR Y1 , and adjacent R Y1 may be bonded to each other to form a ring.
- the ring formed by bonding of adjacent R Y1 is preferably an aromatic ring.
- examples of (A-2) include groups represented by the following (A-2-1) to (A-2-5).
- R 201 to R 227 each independently represent a hydrogen atom or a substituent, and * represents a bonding position in the formula (I).
- a 1 and A 2 include the following.
- Bu represents a butyl group. * Represents a bonding position in the formula (I).
- B 1 and B 2 each independently represent a —BR 1 R 2 group, and R 1 and R 2 each independently represent a substituent.
- R 1 and R 2 may be bonded to each other to form a ring.
- substituent include the groups described above for A 1 and A 2.
- a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an aryl group or a heteroaryl group is preferable, and a halogen atom, an aryl group or a heteroaryl group is preferred.
- R 1 and R 2 may be the same group or different groups.
- R 1 and R 2 are preferably the same group.
- B 1 and B 2 may be the same group or different groups.
- B 1 and B 2 are preferably the same group.
- the alkyl group preferably has 1 to 40 carbon atoms.
- the lower limit is more preferably 3 or more.
- the upper limit is more preferably 30 or less, and further preferably 25 or less.
- the alkyl group may be linear, branched or cyclic, but is preferably linear or branched.
- the alkenyl group preferably has 2 to 40 carbon atoms.
- the lower limit is preferably 3 or more, more preferably 5 or more, still more preferably 8 or more, and particularly preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkenyl group may be linear, branched or cyclic.
- the alkoxy group preferably has 1 to 40 carbon atoms.
- the lower limit is more preferably 3 or more.
- the upper limit is more preferably 30 or less, and further preferably 25 or less.
- the alkoxy group may be linear, branched or cyclic.
- the aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms.
- the aryl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, and a halogen atom.
- the heteroaryl group may be monocyclic or polycyclic.
- the number of heteroatoms constituting the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the number of carbon atoms constituting the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, still more preferably 3 to 12, and particularly preferably 3 to 5.
- the heteroaryl group is preferably a 5-membered ring or a 6-membered ring.
- the heteroaryl group may have a substituent or may be unsubstituted. Examples of the substituent include an alkyl group, an alkoxy group, and a halogen atom.
- R 1 and R 2 of the —BR 1 R 2 group may be bonded to each other to form a ring.
- R represents a substituent
- R a1 to R a4 each independently represents a hydrogen atom or a substituent
- m1 to m3 each independently represents an integer of 0 to 4
- * represents a bond in the formula (I) Represents the position.
- substituent represented by R and R a1 to R a4 include the substituents described for R 1 and R 2 , and a halogen atom and an alkyl group are preferable.
- B 1 and B 2 include the following.
- Me represents a methyl group and Bu represents a butyl group. * Represents a bonding position in the formula (I).
- C 1 and C 2 each independently represents an alkyl group, an aryl group, or a heteroaryl group.
- C 1 and C 2 may be the same group or different groups.
- C 1 and C 2 are preferably the same group.
- C 1 and C 2 are each independently preferably an aryl group or a heteroaryl group, more preferably an aryl group.
- the alkyl group preferably has 1 to 40 carbon atoms, more preferably 1 to 30 carbon atoms, and particularly preferably 1 to 25 carbon atoms.
- the alkyl group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably branched.
- the aryl group is preferably an aryl group having 6 to 20 carbon atoms, and more preferably an aryl group having 6 to 12 carbon atoms.
- a phenyl group or a naphthyl group is particularly preferred.
- the heteroaryl group may be monocyclic or polycyclic.
- the number of heteroatoms constituting the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the number of carbon atoms constituting the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and still more preferably 3 to 12.
- the alkyl group, aryl group and heteroaryl group described above may have a substituent or may be unsubstituted. It preferably has a substituent. Moreover, you may have two or more substituents. For example, when C 1 and C 2 are phenyl groups, they may have substituents at two meta positions or ortho positions with respect to the pyrrolopyrrole ring, respectively, and one meta position or ortho position May have a substituent only. Moreover, you may have a substituent in any one of meta position or ortho position, and para position. Moreover, you may have a substituent in two places, meta position or ortho position, and para position.
- substituents examples include a hydrocarbon group which may contain an oxygen atom, an amino group, an acylamino group, an alkoxycarbonylamino group, an aryloxycarbonylamino group, a heteroaryloxycarbonylamino group, a sulfonylamino group, a sulfamoyl group, a carbamoyl group, an alkylthio group.
- arylthio group, heteroarylthio group alkylsulfonyl group, arylsulfonyl group, heteroarylsulfonyl group, alkylsulfinyl group, arylsulfinyl group, heteroarylsulfinyl group, ureido group, phosphoric acid amide group, mercapto group, sulfo group, Examples thereof include a carboxyl group, a nitro group, a hydroxamic acid group, a sulfino group, a hydrazino group, an imino group, a silyl group, a hydroxyl group, a halogen atom, and a cyano group.
- Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- Examples of the hydrocarbon group include an alkyl group, an alkenyl group, and an aryl group.
- the alkyl group preferably has 1 to 40 carbon atoms.
- the lower limit is more preferably 3 or more, more preferably 5 or more, still more preferably 8 or more, and particularly preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkyl group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably branched.
- the branched alkyl group preferably has 3 to 40 carbon atoms.
- the lower limit is more preferably 5 or more, still more preferably 8 or more, and still more preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the number of branches of the branched alkyl group is preferably 2 to 10, for example, and more preferably 2 to 8.
- the alkenyl group preferably has 2 to 40 carbon atoms.
- the lower limit is preferably 3 or more, more preferably 5 or more, still more preferably 8 or more, and particularly preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkenyl group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably branched.
- the branched alkenyl group preferably has 3 to 40 carbon atoms.
- the lower limit is more preferably 5 or more, still more preferably 8 or more, and still more preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the number of branches of the branched alkenyl group is preferably 2 to 10, and more preferably 2 to 8.
- the aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and still more preferably 6 to 12 carbon atoms.
- Examples of the hydrocarbon group containing an oxygen atom include a group represented by -LRx1 .
- L represents —O—, —CO—, —COO—, —OCO—, — (OR x2 ) m — or — (R x2 O) m —.
- R x1 represents an alkyl group, an alkenyl group or an aryl group.
- R x2 represents an alkylene group or an arylene group.
- m represents an integer of 2 or more, and m R x2 may be the same or different.
- L is preferably —O—, — (OR x2 ) m — or — (R x2 O) m —, more preferably —O—.
- R x1 is preferably an alkyl group or an alkenyl group, and more preferably an alkyl group.
- the alkylene group represented by R x2 preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms, and still more preferably 1 to 5 carbon atoms.
- the alkylene group may be linear, branched or cyclic, but is preferably linear or branched.
- the number of carbon atoms of the arylene group represented by R x2 is preferably 6-20, and more preferably 6-12.
- R x2 is preferably an alkylene group.
- m represents an integer of 2 or more, preferably 2 to 20, and more preferably 2 to 10.
- the substituent which the alkyl group, aryl group and heteroaryl group may have is preferably a group having a branched alkyl structure.
- the substituent is preferably a hydrocarbon group that may contain an oxygen atom, and more preferably a hydrocarbon group containing an oxygen atom.
- the hydrocarbon group containing an oxygen atom is preferably a group represented by —O—R x1 .
- R x1 is preferably an alkyl group or an alkenyl group, more preferably an alkyl group, and particularly preferably a branched alkyl group. That is, the substituent is more preferably an alkoxy group, and particularly preferably a branched alkoxy group.
- the alkoxy group preferably has 1 to 40 carbon atoms.
- the lower limit is preferably 3 or more, more preferably 5 or more, still more preferably 8 or more, and particularly preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkoxy group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably branched.
- the number of carbon atoms of the branched alkoxy group is preferably 3 to 40.
- the lower limit is more preferably 5 or more, still more preferably 8 or more, and still more preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the number of branched alkoxy groups is preferably 2 to 10, more preferably 2 to 8.
- C 1 and C 2 include the following.
- Me represents a methyl group and Bu represents a butyl group. * Represents a bonding position in the formula (I).
- optical isomers having the following structures can also be suitably used.
- D 1 and D 2 each independently represent a substituent.
- D 1 and D 2 may be the same group or different groups.
- D 1 and D 2 are preferably the same group.
- the substituent include an alkyl group, an alkenyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heteroaryloxycarbonyl group, Acyloxy group, amino group, acylamino group, alkoxycarbonylamino group, aryloxycarbonylamino group, heteroaryloxycarbonylamino group, sulfonylamino group, sulfamoyl group, carbamoyl group, alkylthio group, arylthio group, heteroarylthio group, alkylsulfonyl Group, arylsulfonyl group, heteroaryl
- a substituent having a positive Hammett ⁇ p value acts as an electron-attracting group.
- a substituent having a Hammett ⁇ p value of 0.2 or more can be exemplified as an electron withdrawing group.
- the ⁇ p value is preferably 0.25 or more, more preferably 0.3 or more, and particularly preferably 0.35 or more.
- the upper limit is not particularly limited, but is preferably 0.80.
- a cyano group As the electron withdrawing group, a cyano group, an alkylcarbonyl group, an alkylsulfonyl group and an arylsulfonyl group are preferable, and a cyano group is more preferable.
- Me represents a methyl group
- Ph represents a phenyl group.
- paragraph numbers 0024 to 0025 of JP-A-2009-263614 can be referred to, the contents of which are incorporated herein.
- D 1 and D 2 include the following. * Represents a bonding position in the formula (I).
- the pyrrolopyrrole compound is preferably a compound represented by the following formula (II) or a compound represented by the following formula (III). According to this aspect, it is possible to produce a film having excellent infrared shielding properties and light resistance.
- X 1 and X 2 each independently represent O, S, NR X1 or CR X2 R X3 , R X1 to R X3 each independently represent a hydrogen atom or a substituent, R 3 to R 6 each independently represents a hydrogen atom or a substituent, R 3 and R 4 , or R 5 and R 6 may be bonded to each other to form a ring, B 1 and B 2 each independently represent a —BR 1 R 2 group, R 1 and R 2 each independently represent a substituent, and R 1 and R 2 may be bonded to each other to form a ring; C 1 and C 2 each independently represents an alkyl group, an aryl group, or a heteroaryl group, D 1 and D 2 each independently represents a substituent.
- B 1, B 2, C 1 , C 2, D 1 and D 2 of formula (II) has the same meaning as B 1, B 2, C 1 , C 2, D 1 and D 2 of formula (I)
- the preferable range is also the same.
- X 1 and X 2 in formula (II) have the same meaning as X 1 in formula (A-1) described above, and the preferred range is also the same.
- R 3 to R 6 in formula (II) have the same meanings as R 3 and R 4 in formula (A-1) described above, and the preferred ranges are also the same.
- Y 1 to Y 8 each independently represent N or CR Y1 , at least two of Y 1 to Y 4 are CR Y1 , and at least two of Y 5 to Y 8 are CR Y1
- R Y1 represents a hydrogen atom or a substituent, and adjacent R Y1 may be bonded to each other to form a ring
- B 1 and B 2 each independently represent a —BR 1 R 2 group, R 1 and R 2 each independently represent a substituent, and R 1 and R 2 may be bonded to each other to form a ring
- C 1 and C 2 each independently represents an alkyl group, an aryl group, or a heteroaryl group
- D 1 and D 2 each independently represents a substituent.
- B 1, B 2, C 1 , C 2, D 1 and D 2 of formula (III) has the same meaning as B 1, B 2, C 1 , C 2, D 1 and D 2 of formula (I)
- the preferable range is also the same.
- Y 1 to Y 8 in formula (III) have the same meanings as Y 1 to Y 4 in formula (A-2) described above, and the preferred ranges are also the same.
- pyrrolopyrrole compound examples include the following compounds.
- the symbols described in the B 1 , B 2 structure, C 1 , C 2 structure in the following table are the groups shown in the specific examples of B 1 , B 2 , C 1 , C 2 described above.
- Specific examples of the pyrrolopyrrole compound include the compounds described in paragraph numbers 0049 to 0058 of JP-A-2009-263614, the contents of which are incorporated herein.
- the squarylium compound used as the near-infrared absorbing compound A is preferably a compound represented by the formula (SQ).
- a 1 and A 2 each independently represent an aryl group, a heteroaryl group or a group represented by the following formula (2);
- Z 1 represents a nonmetallic atomic group forming a nitrogen-containing heterocycle
- R 2 represents an alkyl group, an alkenyl group or an aralkyl group
- d represents 0 or 1
- the wavy line represents the formula (SQ ) Represents a connecting hand with a 4-membered ring.
- a 1 and A 2 in the formula (SQ) each independently represent an aryl group, a heteroaryl group or a group represented by the formula (2), and a group represented by the formula (2) is preferable.
- the number of carbon atoms of the aryl group represented by A 1 and A 2 is preferably 6 to 48, more preferably 6 to 24, and particularly preferably 6 to 12. Specific examples include a phenyl group and a naphthyl group. When the aryl group has a substituent, the carbon number of the aryl group means the number excluding the carbon number of the substituent.
- the heteroaryl group represented by A 1 and A 2 is preferably a 5-membered ring or a 6-membered ring.
- the heteroaryl group is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring having 2 to 8 condensations, still more preferably a single ring or a condensed ring having 2 to 4 condensations, a single ring or A condensed ring having a condensation number of 2 or 3 is particularly preferred.
- a hetero atom contained in a heteroaryl group a nitrogen atom, an oxygen atom, and a sulfur atom are illustrated, and a nitrogen atom and a sulfur atom are preferable.
- the number of heteroatoms is preferably 1 to 3, and more preferably 1 to 2.
- Specific examples include a heteroaryl group derived from a monocyclic or polycyclic aromatic ring such as a 5-membered or 6-membered ring containing at least one of a nitrogen atom, an oxygen atom and a sulfur atom.
- the aryl group and heteroaryl group may have a substituent.
- the aryl group and heteroaryl group may have two or more substituents, the plurality of substituents may be the same or different.
- Substituents include halogen atoms, cyano groups, nitro groups, alkyl groups, alkenyl groups, alkynyl groups, aryl groups, heteroaryl groups, aralkyl groups, —OR 10 , —COR 11 , —COOR 12 , —OCOR 13 , — NR 14 R 15 , —NHCOR 16 , —CONR 17 R 18 , —NHCONR 19 R 20 , —NHCOOR 21 , —SR 22 , —SO 2 R 23 , —SO 2 OR 24 , —NHSO 2 R 25 or —SO 2 NR 26 R 27 may be mentioned.
- R 10 to R 27 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heteroaryl group, or an aralkyl group.
- R 12 of —COOR 12 is hydrogen (ie, a carboxyl group)
- the hydrogen atom may be dissociated (ie, a carbonate group) or may be in a salt state.
- R 24 of —SO 2 OR 24 is a hydrogen atom (ie, a sulfo group)
- the hydrogen atom may be dissociated (ie, a sulfonate group) or may be in a salt state.
- halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, and still more preferably 1 to 8 carbon atoms.
- the alkyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the alkenyl group preferably has 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkenyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the alkynyl group has preferably 2 to 40 carbon atoms, more preferably 2 to 30 carbon atoms, and particularly preferably 2 to 25 carbon atoms.
- the alkynyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and still more preferably 6 to 12 carbon atoms.
- the alkyl part of the aralkyl group is the same as the above alkyl group.
- the aryl part of the aralkyl group is the same as the above aryl group.
- the number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and still more preferably 7 to 25.
- the heteroaryl group is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring having 2 to 8 condensations, and still more preferably a single ring or a condensed ring having 2 to 4 condensations.
- the number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the ring of the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the heteroaryl group is preferably a 5-membered ring or a 6-membered ring.
- the number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and still more preferably 3 to 12.
- alkyl group, alkenyl group, alkynyl group, aralkyl group, aryl group and heteroaryl group may have a substituent or may be unsubstituted.
- substituents include the above-described substituents.
- R 2 represents an alkyl group, an alkenyl group or an aralkyl group, and an alkyl group is preferable.
- the alkyl group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, still more preferably 1 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkenyl group preferably has 2 to 30 carbon atoms, more preferably 2 to 20 carbon atoms, and still more preferably 2 to 12 carbon atoms.
- the alkyl group and the alkenyl group may be linear, branched or cyclic, and are preferably linear or branched.
- the aralkyl group preferably has 7 to 30 carbon atoms, more preferably 7 to 20 carbon atoms.
- the nitrogen-containing heterocycle formed by Z 1 is preferably a 5-membered ring or a 6-membered ring.
- the nitrogen-containing heterocycle is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring having 2 to 8 condensations, further preferably a single ring or a condensed ring having 2 to 4 condensations, Is particularly preferably a fused ring of 2 or 3.
- the nitrogen-containing heterocyclic ring may contain a sulfur atom in addition to the nitrogen atom.
- the nitrogen-containing heterocycle may have a substituent. Examples of the substituent include the above-described substituents.
- a halogen atom, an alkyl group, a hydroxyl group, an amino group, and an acylamino group are preferable, and a halogen atom and an alkyl group are more preferable.
- the halogen atom is preferably a chlorine atom.
- the alkyl group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and still more preferably 1 to 12 carbon atoms.
- the alkyl group is preferably linear or branched.
- the group represented by the formula (2) is preferably a group represented by the following formula (3) or the formula (4).
- R 11 represents an alkyl group, an alkenyl group or an aralkyl group
- R 12 represents a substituent.
- m represents an integer of 0 to 4, and when m is 2 or more, R 12 may be linked to form a ring.
- X represents a nitrogen atom or CR 13 R 14
- R 13 and R 14 each independently represent a hydrogen atom or a substituent.
- a wavy line represents a joint with a four-membered ring in formula (SQ).
- R 11 in Formula (3) and Formula (4) has the same meaning as R 2 in Formula (2), and the preferred range is also the same.
- R 12 in Formula (3) and Formula (4) represents a substituent.
- the substituent include the substituents described in the above formula (SQ).
- a halogen atom, an alkyl group, a hydroxyl group, an amino group, and an acylamino group are preferable, and a halogen atom and an alkyl group are more preferable.
- the halogen atom is preferably a chlorine atom.
- the alkyl group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and still more preferably 1 to 12 carbon atoms.
- the alkyl group is preferably linear or branched.
- R 12 may be linked to form a ring.
- the ring include an alicyclic ring (non-aromatic hydrocarbon ring), an aromatic ring, and a heterocyclic ring.
- the ring may be monocyclic or polycyclic.
- the linking group is a group consisting of —CO—, —O—, —NH—, a divalent aliphatic group, a divalent aromatic group, and combinations thereof. They can be linked by a divalent linking group selected from the above.
- R 12 are connected to each other to form a benzene ring.
- X in Formula (3) represents a nitrogen atom or CR 13 R 14 , and R 13 and R 14 each independently represent a hydrogen atom or a substituent.
- substituents include the substituents described in the above formula (SQ).
- SQ an alkyl group etc. are mentioned.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 10, more preferably 1 to 5, particularly preferably 1 to 3, and most preferably 1.
- the alkyl group is preferably linear or branched, and particularly preferably linear.
- m represents an integer of 0 to 4, preferably 0 to 2.
- the squarylium compound used as the near-infrared absorbing compound A is more preferably a compound represented by the formula (SQ-1).
- Formula (SQ-1) In formula (SQ-1), ring A and ring B each independently represent an aromatic ring, X A and X B each independently represent a substituent, G A and G B each independently represent a substituent, kA represents an integer of 0 to nA, kB represents an integer of 0 to nB, nA represents the largest integer that can be substituted on ring A, nB represents the largest integer that can be substituted on ring B, and X A and G A, X B and G B may combine with each other to form a ring, if G A and G B are present in plural may be bonded to each other to form a ring.
- G A and G B each independently represent a substituent.
- the substituent include a halogen atom, cyano group, nitro group, alkyl group, alkenyl group, alkynyl group, aralkyl group, aryl group, heteroaryl group, —OR c1 , —COR c2 , —COOR c3 , —OCOR c4 , — NR c5 R c6 , —NHCOR c7 , —CONR c8 R c9 , —NHCONR c10 R c11 , —NHCOOR c12 , —SR c13 , —SO 2 R c14 , —SO 2 OR c15 , —NHSO 2 R c16 or —SO 2 NR c17 R c18 may be mentioned.
- R c1 to R c18 each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heteroaryl group.
- R c3 of —COOR c3 is a hydrogen atom (that is, a carboxyl group)
- the hydrogen atom may be dissociated (that is, a carbonate group) or may be in a salt state.
- R c15 of —SO 2 OR c15 is a hydrogen atom (ie, a sulfo group)
- the hydrogen atom may be dissociated (ie, a sulfonate group) or may be in a salt state.
- halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms, and particularly preferably 1 to 8 carbon atoms.
- the alkyl group may be linear, branched or cyclic.
- the alkyl group may be unsubstituted or may have a substituent.
- the alkenyl group has preferably 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkenyl group may be linear, branched or cyclic.
- the alkynyl group has preferably 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkynyl group may be linear, branched or cyclic.
- the aryl group preferably has 6 to 25 carbon atoms, more preferably 6 to 15 carbon atoms, and most preferably 6 to 10 carbon atoms.
- the alkyl part of the aralkyl group is the same as the above alkyl group.
- the aryl part of the aralkyl group is the same as the above aryl group.
- the number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and still more preferably 7 to 25.
- the heteroaryl group is preferably a single ring or a condensed ring, more preferably a single ring or a condensed ring having 2 to 8 condensations, and still more preferably a single ring or a condensed ring having 2 to 4 condensations.
- the number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the ring of the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the heteroaryl group is preferably a 5-membered ring or a 6-membered ring.
- the number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and still more preferably 3 to 12.
- the alkyl group, alkenyl group, alkynyl group, aralkyl group, aryl group and heteroaryl group may have a substituent or may be unsubstituted.
- the substituent groups include substituents exemplified in G A and G B described above, for example, a halogen atom, a hydroxyl group, a carboxyl group, a sulfo group, an alkoxy group, an amino group, and the like.
- X A and X B each independently represent a substituent.
- the substituent is preferably a group having active hydrogen, —OH, —SH, —COOH, —SO 3 H, —NHR x1 , —NR x1 R x2 , —NHCOR x1 , —CONR x1 R x2 , —NHCONR x1 R x2, -NHCOOR x1, -NHSO 2 R x1, -B (OH) 2, -PO (OH) 3 and -NHBR x1 R x2 are preferred, -OH, -NHCOR x1, -NHCONR x1 R x2, -NHCOOR x1 , —NHSO 2 R x1 and —NHBR x1 R x2 are more preferred.
- R x1 and R x2 each independently represent a substituent.
- the substituent include an alkyl group and an aryl group, and an alkyl group is preferable.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 15 carbon atoms, still more preferably 1 to 8 carbon atoms, and particularly preferably 1 to 5 carbon atoms.
- the alkyl group may be linear, branched or cyclic, and is preferably linear or branched.
- the aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and still more preferably 6 to 12 carbon atoms.
- the alkyl group and the aryl group may have a substituent or may be unsubstituted, but preferably have a substituent.
- substituents include substituents exemplified in G A and G B described above. For example, a halogen atom, an aryl group, an alkoxy group, etc. are mentioned.
- ring A and ring B each independently represent an aromatic ring.
- the aromatic ring may be a single ring or a condensed ring.
- the aromatic ring may be an aromatic hydrocarbon ring or an aromatic heterocyclic ring.
- Specific examples of the aromatic ring include benzene ring, naphthalene ring, pentalene ring, indene ring, azulene ring, heptalene ring, indacene ring, perylene ring, pentacene ring, acenaphthylene ring, phenanthrene ring, anthracene ring, naphthacene ring, chrysene ring , Triphenylene ring, fluorene ring, biphenyl ring, pyrrole ring, furan ring, thiophene ring, imidazole ring, thiazole ring, thiazole ring, pyridine ring, pyra
- X A and G A, X B and G B may combine with each other to form a ring, if G A and G B are present in plural is, G A or between, , G B together may form a ring together.
- the ring is preferably a 5-membered ring or a 6-membered ring.
- the ring may be monocyclic or polycyclic.
- X A and G A, X B and G B when forming a G A or between G B are bonded to each other rings, may be they are attached directly to form a ring, an alkylene group, -CO-, A ring may be formed by bonding via a divalent linking group selected from the group consisting of —O—, —NH—, —BR— and combinations thereof.
- X A and G A , X B and G B , G A or G B are preferably bonded via —BR— to form a ring.
- R represents a hydrogen atom or a substituent. Examples of the substituent include an alkyl group, an alkenyl group, an alkynyl group, an aryl group, and a heteroaryl group. Alkyl group, an alkenyl group, an alkynyl group, an aryl group and that details of the heteroaryl group, is as defined and ranges described for the G A and G B.
- kA represents an integer of 0 to nA
- kB represents an integer of 0 to nB
- nA represents the largest integer that can be substituted for ring A
- nB can be substituted for ring B Represents the largest integer.
- kA and kB are each independently preferably 0 to 4, more preferably 0 to 2, and particularly preferably 0 to 1.
- the squarylium compound is preferably a compound represented by the following formula (SQ-A). This compound is excellent in heat resistance and light resistance.
- Formula (SQ-A) In the formula, R 1 and R 2 each independently represents an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, R 3 and R 4 each independently represents a hydrogen atom or an alkyl group, X 1 and X 2 each independently represents an oxygen atom or —N (R 5 ) —, R 5 represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, Y 1 to Y 4 each independently represent a substituent, Y 1 and Y 2 , and Y 3 and Y 4 may be bonded to each other to form a ring, Y 1 to Y 4 may be bonded to each other to form a ring when a plurality of Y 1 to Y 4 are present, p and s each independently represent an integer of 0 to 3,
- the alkyl group represented by R 1 and R 2 preferably has 1 to 40 carbon atoms.
- the lower limit is more preferably 3 or more, more preferably 5 or more, still more preferably 10 or more, and particularly preferably 13 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkyl group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably branched.
- the number of branches of the branched alkyl group is preferably 2 to 10, for example, and more preferably 2 to 8.
- the alkenyl group represented by R 1 and R 2 preferably has 2 to 40 carbon atoms.
- the lower limit is preferably 3 or more, more preferably 5 or more, still more preferably 8 or more, and particularly preferably 10 or more.
- the upper limit is more preferably 35 or less, and still more preferably 30 or less.
- the alkenyl group is preferably straight-chain or branched, particularly preferably branched.
- the number of branches of the branched alkenyl group is preferably 2 to 10, and more preferably 2 to 8.
- the number of carbon atoms of the aryl group represented by R 1 and R 2 is preferably 6-30, more preferably 6-20, and still more preferably 6-12.
- the heteroaryl group represented by R 1 and R 2 may be monocyclic or polycyclic. The number of heteroatoms constituting the ring of the heteroaryl group is preferably 1 to 3.
- the hetero atom constituting the ring of the heteroaryl group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
- the number of carbon atoms constituting the ring of the heteroaryl group is preferably 3 to 30, more preferably 3 to 18, and still more preferably 3 to 12.
- the alkyl group, alkenyl group, aryl group and heteroaryl group represented by R 1 and R 2 may be unsubstituted or may have a substituent. Examples of the substituent include the substituents described in G A and G B described above. Alkoxy groups are preferred.
- R 3 and R 4 each independently represents a hydrogen atom or an alkyl group.
- R 3 and R 4 may be the same or different groups. More preferably, R 3 and R 4 are the same group.
- the number of carbon atoms of the alkyl group represented by R 3 and R 4 is preferably 1-20, more preferably 1-10, still more preferably 1-4, and particularly preferably 1-2.
- the alkyl group may be linear or branched.
- R 3 and R 4 are each independently preferably a hydrogen atom, a methyl group or an ethyl group, more preferably a hydrogen atom or a methyl group, and particularly preferably a hydrogen atom.
- X 1 and X 2 each independently represent an oxygen atom or —N (R 5 ) —.
- X 1 and X 2 may be the same or different, but are preferably the same.
- R 5 represents a hydrogen atom, an alkyl group, an aryl group or a heteroaryl group, preferably a hydrogen atom, an alkyl group or an aryl group. Details of the alkyl group, aryl group, and heteroaryl group represented by R 5 are the same as the ranges described for R 3 and R 4 .
- the alkyl group, aryl group and heteroaryl group represented by R 5 may be unsubstituted or may have a substituent. Examples of the substituent include the substituents described in G A and G B described above.
- Y 1 to Y 4 each independently represents a substituent.
- Y 1 and Y 2 , and Y 3 and Y 4 may be bonded to each other to form a ring.
- Y 1 and Y 2 may be bonded to each other and may be combined with a naphthalene ring directly connected to Y 1 and Y 2 to form, for example, a tricyclic ring such as an acenaphthene ring or an acenaphthylene ring.
- a plurality of Y 1 to Y 4 may be bonded to each other to form a ring structure.
- Y 1 there are plural, Y 1 bonded to each other to each other, together with naphthalene ring is directly bonded to Y 1 and Y 2, for example, it has become an anthracene ring, tricyclic, etc. phenanthrene ring, Also good.
- Y 1 is bonded to each other to form a ring structure, a plurality of substituents Y 2 to Y 4 other than Y 1 are not necessarily present. Y 2 to Y 4 may not exist.
- p and s each independently represent an integer of 0 to 3, preferably 0 to 1, and particularly preferably 0.
- q and r each independently represents an integer of 0 to 2, preferably 0 to 1, and particularly preferably 0.
- squarylium compound examples include the following compounds. Further, compounds described in paragraph numbers 0044 to 0049 of JP 2011-208101 A can be mentioned, the contents of which are incorporated herein.
- the cyanine compound used as the near-infrared absorbing compound A is preferably a compound represented by the formula (C).
- Formula (C) In formula (C), Z 1 and Z 2 are each a nonmetallic atomic group that forms a 5-membered or 6-membered nitrogen-containing heterocyclic ring that may be independently condensed, R 101 and R 102 each independently represents an alkyl group, an alkenyl group, an alkynyl group, an aralkyl group or an aryl group, L 1 represents a methine chain having an odd number of methine groups, a and b are each independently 0 or 1, When a is 0, a carbon atom and a nitrogen atom are bonded by a double bond, and when b is 0, a carbon atom and a nitrogen atom are bonded by a single bond, When the site represented by Cy in the formula is a cation moiety, X 1 represents an anion, c represents the number necessary for balancing the charge
- Z 1 and Z 2 each represents a nonmetallic atomic group that forms a 5-membered or 6-membered nitrogen-containing heterocyclic ring that may be independently condensed.
- the nitrogen-containing heterocycle may be condensed with another heterocycle, aromatic ring or aliphatic ring.
- the nitrogen-containing heterocycle is preferably a 5-membered ring.
- a structure in which a benzene ring or a naphthalene ring is condensed to a 5-membered nitrogen-containing heterocycle is more preferable.
- nitrogen-containing heterocycle examples include an oxazole ring, an isoxazole ring, a benzoxazole ring, a naphthoxazole ring, an oxazolocarbazole ring, an oxazodibenzobenzofuran ring, a thiazole ring, a benzothiazole ring, a naphthothiazole ring, an indolenine ring, Examples include benzoindolenin ring, imidazole ring, benzimidazole ring, naphthimidazole ring, quinoline ring, pyridine ring, pyrrolopyridine ring, furopyrrole ring, indolizine ring, imidazoquinoxaline ring, quinoxaline ring, quinoline ring, indolenine ring Benzoindolenine ring, benzoxazole ring, benzothiazole ring and benzimi
- R 101 and R 102 each independently represents an alkyl group, an alkenyl group, an alkynyl group, an aralkyl group or an aryl group.
- the alkyl group preferably has 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms, and particularly preferably 1 to 8 carbon atoms.
- the alkyl group may be linear, branched or cyclic.
- the alkenyl group has preferably 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkenyl group may be linear, branched or cyclic.
- the alkynyl group has preferably 2 to 20 carbon atoms, more preferably 2 to 12 carbon atoms, and particularly preferably 2 to 8 carbon atoms.
- the alkynyl group may be linear, branched or cyclic.
- the aryl group preferably has 6 to 25 carbon atoms, more preferably 6 to 15 carbon atoms, and most preferably 6 to 10 carbon atoms.
- the aryl group may be unsubstituted or may have a substituent.
- the alkyl part of the aralkyl group is the same as the above alkyl group.
- the aryl part of the aralkyl group is the same as the above aryl group.
- the number of carbon atoms in the aralkyl group is preferably 7 to 40, more preferably 7 to 30, and still more preferably 7 to 25.
- the alkyl group, alkenyl group, alkynyl group, aralkyl group and aryl group may have a substituent or may be unsubstituted. Examples of the substituent include a halogen atom, a hydroxyl group, a carboxyl group, a sulfo group, an alkoxy group, and an amino group.
- a carboxyl group and a sulfo group are preferable, and a sulfo group is particularly preferable.
- the carboxyl group and the sulfo group may have a hydrogen atom dissociated or a salt state.
- L 1 represents a methine chain having an odd number of methine groups.
- L 1 is preferably a methine chain having 3, 5 or 7 methine groups.
- the methine group may have a substituent.
- the methine group having a substituent is preferably a central (meso-position) methine group.
- Specific examples of the substituent include a substituent that the nitrogen-containing heterocycle of Z 1 and Z 2 may have, a group represented by the formula (a), and the like. Further, two substituents of the methine chain may be bonded to form a 5- or 6-membered ring.
- * represents a connecting portion with a methine chain
- a 1 represents an oxygen atom or a sulfur atom.
- a and b are each independently 0 or 1. When a is 0, the carbon atom and the nitrogen atom are bonded by a double bond, and when b is 0, the carbon atom and the nitrogen atom are bonded by a single bond. Both a and b are preferably 0. When both a and b are 0, the formula (C) is expressed as follows.
- X 1 represents an anion
- c represents a number necessary for balancing the charge.
- anions include halide ions (Cl ⁇ , Br ⁇ , I ⁇ ), p-toluenesulfonate ions, ethyl sulfate ions, PF 6 ⁇ , BF 4 ⁇ or ClO 4 ⁇ , tris (halogenoalkylsulfonyl) methide anions ( For example, (CF 3 SO 2 ) 3 C ⁇ ), di (halogenoalkylsulfonyl) imide anion (for example, (CF 3 SO 2 ) 2 N ⁇ ), tetracyanoborate anion and the like can be mentioned.
- X 1 represents a cation
- c represents a number necessary for balancing the charge.
- the cation include alkali metal ions (Li + , Na + , K + etc.), alkaline earth metal ions (Mg 2+ , Ca 2+ , Ba 2+ , Sr 2+ etc.), transition metal ions (Ag + , Fe 2+ , Co 2+ , Ni 2+ , Cu 2+ , Zn 2+ ), other metal ions (such as Al 3+ ), ammonium ion, triethylammonium ion, tributylammonium ion, pyridinium ion, tetrabutylammonium Ion, guanidinium ion, tetramethylguanidinium ion, diazabicycloundecenium and the like.
- the cyanine compound is also preferably a compound represented by the following (C-1) to (C-3).
- R 1A , R 2A , R 1B and R 2B each independently represents an alkyl group, an alkenyl group, an alkynyl group, an aralkyl group or an aryl group
- L 1A and L 1B each independently represent a methine chain having an odd number of methine groups
- Y 1 and Y 2 each independently represent —S—, —O—, —NR X1 — or —CR X2 R X3 —
- R X1 , R X2 and R X3 each independently represent a hydrogen atom or an alkyl group
- V 1A , V 2A , V 1B and V 2B each independently represent a substituent
- m1 and m2 each independently represents 0 to 4
- X 1 represents an anion
- c represents a number necessary to balance
- R 1A , R 2A , R 1B and R 2B are synonymous with the alkyl group, alkenyl group, alkynyl group, aralkyl group and aryl group described for R 101 and R 102 in formula (C), and are preferably in a preferred range. Is the same. These groups may be unsubstituted or may have a substituent. Examples of the substituent include a halogen atom, a hydroxyl group, a carboxyl group, a sulfo group, an alkoxy group, and an amino group. A carboxyl group and a sulfo group are preferable, and a sulfo group is particularly preferable.
- the carboxyl group and the sulfo group may have a hydrogen atom dissociated or a salt state.
- R 1A , R 2A , R 1B and R 2B represent an alkyl group, it is more preferably a linear alkyl group.
- R X1 , R X2 and R X3 each independently represent a hydrogen atom or an alkyl group, preferably an alkyl group.
- the alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, and particularly preferably 1 to 3 carbon atoms.
- the alkyl group may be linear, branched or cyclic, but is preferably linear or branched, particularly preferably linear.
- the alkyl group is particularly preferably a methyl group or an ethyl group.
- L 1A and L 1B have the same meaning as L 1 in formula (C), and the preferred range is also the same.
- Examples of the substituent represented by V 1A , V 2A , V 1B and V 2B include the substituents described in formula (SQ), and the preferred ranges are also the same.
- m1 and m2 each independently represents 0 to 4, preferably 0 to 2.
- the anion and cation represented by X 1 are synonymous with the range described for X 1 in formula (C), and the preferred range is also the same.
- cyanine compound examples include the following compounds. Further, compounds described in JP-A-2015-172004 and JP-A-2015-172102 can be mentioned.
- the composition may further include a near-infrared absorbing compound other than the above-described near-infrared absorbing compound A (also referred to as other near-infrared absorbing compound).
- a near-infrared absorbing compound other than the above-described near-infrared absorbing compound A also referred to as other near-infrared absorbing compound.
- Other near infrared absorbing compounds include, for example, copper compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, rylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, diimmonium compounds, dithiol compounds, triarylmethane compounds, Examples include pyromethene compounds, azomethine compounds, anthraquinone compounds, and dibenzofuranone compounds.
- the copper compound is preferably a copper complex.
- a copper complex represented by the formula (Cu-1) can be used.
- This copper complex is a copper compound in which a ligand L is coordinated to copper as a central metal, and copper is usually divalent copper. For example, it can be obtained by mixing, reacting, or the like with a compound serving as the ligand L or a salt thereof with respect to the copper component.
- Cu (L) n1 ⁇ (X) n2 formula (Cu-1) In the above formula, L represents a ligand coordinated to copper, and X represents a counter ion. n1 represents an integer of 1 to 4.
- n2 represents an integer of 0 to 4.
- X represents a counter ion.
- the copper compound may become a cation complex or an anion complex in addition to a neutral complex having no charge.
- counter ions are present as necessary to neutralize the charge of the copper compound.
- the counter ion is a negative counter ion (counter anion)
- an inorganic anion or an organic anion may be used.
- Specific examples include hydroxide ions, halogen anions (eg, fluoride ions, chloride ions, bromide ions, iodide ions, etc.), substituted or unsubstituted alkyl carboxylate ions (acetate ions, trifluoroacetate ions).
- the counter anion is preferably a low nucleophilic anion.
- a low nucleophilic anion is an anion formed by dissociating a proton from an acid having a low pKa, generally called a super acid.
- the definition of superacid differs depending on the literature, but is a general term for acids having a lower pKa than methanesulfonic acid. Org. Chem.
- the structure described in 2011, 76, 391-395 Equilibrium Acids of Super Acids is known.
- the pKa of the low nucleophilic anion is, for example, preferably ⁇ 11 or less, and more preferably ⁇ 11 to ⁇ 18.
- pKa is, for example, J.P. Org. Chem.
- Low nucleophilic anions include tetrafluoroborate ion, tetraarylborate ion (including tetraarylborate ion having an aryl group substituted with a halogen atom or a fluoroalkyl group as an alkyl group), hexafluorophosphate ion,
- An imide ion including an imide substituted with an acyl group or a sulfonyl group
- a methide ion including a metide ion substituted with an acyl group or a sulfonyl group
- a tetraarylborate ion, an imide ion, or a methide ion is particularly preferable.
- the counter ion is a positive counter ion (counter cation), for example, inorganic or organic ammonium ion (for example, tetraalkylammonium ion such as tetrabutylammonium ion, triethylbenzylammonium ion, pyridinium ion, etc.), phosphonium ion (for example, , Tetraalkylphosphonium ions such as tetrabutylphosphonium ion, alkyltriphenylphosphonium ions, triethylphenylphosphonium ions, etc.), alkali metal ions or protons.
- the counter ion may be a metal complex ion, and in particular, the counter ion may be a copper complex, that is, a salt of a cationic copper complex and an anionic copper complex.
- the ligand L is a compound having a coordination site with respect to copper, and is selected from a coordination site that coordinates with copper by an anion, and a coordination atom that coordinates with copper by an unshared electron pair.
- the compound which has the above is mentioned.
- the coordination site coordinated by an anion may be dissociated or non-dissociated.
- the ligand L is preferably a compound (multidentate ligand) having two or more coordination sites for copper.
- it is preferable that the ligand L is not continuously bonded with a plurality of ⁇ -conjugated systems such as aromatic groups in order to improve visible transparency.
- Ligand L can also use together the compound (monodentate ligand) which has one coordination site
- the monodentate ligand include a monodentate ligand coordinated by an anion or an unshared electron pair.
- ligands coordinated with anions include halide anions, hydroxide anions, alkoxide anions, phenoxide anions, amide anions (including amides substituted with acyl groups and sulfonyl groups), and imide anions (acyl groups and sulfonyl groups).
- Substituted imides anilide anions (including acylides and sulfonyl substituted anilides), thiolate anions, bicarbonate anions, carboxylate anions, thiocarboxylate anions, dithiocarboxylate anions, hydrogen sulfate anions, sulfones Acid anion, phosphate dihydrogen anion, phosphate diester anion, phosphonate monoester anion, hydrogen phosphonate anion, phosphinate anion, nitrogen-containing heterocyclic anion, nitrate anion, hypochlorite anion, cyanide anion Cyanate anion, isocyanate anion, thiocyanate anion, isothiocyanate anions, such as azide anions.
- Monodentate ligands coordinated by lone pairs include water, alcohol, phenol, ether, amine, aniline, amide, imide, imine, nitrile, isonitrile, thiol, thioether, carbonyl compound, thiocarbonyl compound, sulfoxide, Examples include heterocycles, carbonic acid, carboxylic acid, sulfuric acid, sulfonic acid, phosphoric acid, phosphonic acid, phosphinic acid, nitric acid, and esters thereof.
- the copper complex preferably has a compound having at least two coordination sites (hereinafter also referred to as compound (A)) as a ligand.
- the compound (A) preferably has at least three coordination sites, and more preferably has 3 to 5 coordination sites.
- Compound (A) acts as a chelate ligand for the copper component. That is, at least two coordination atoms of compound (A) are chelate-coordinated with copper, so that the structure of the copper complex is distorted, high transparency in the visible region is obtained, and infrared absorption ability can be improved. The color value is also expected to improve.
- the copper complex may have two or more compounds (A). When it has two or more compounds (A), each compound (A) may be the same or different.
- the copper complex is exemplified by 4-coordination, 5-coordination, and 6-coordination, and 4-coordination and 5-coordination are more preferable, and 5-coordination is more preferable.
- the copper complex forms a 5-membered ring and / or a 6-membered ring with copper and a ligand. Such a copper complex is stable in shape and excellent in complex stability.
- the copper complex can be obtained, for example, by mixing and / or reacting the compound (A) with a copper component (copper or a compound containing copper).
- the copper component is preferably a compound containing divalent copper.
- a copper component may use only 1 type and may use 2 or more types.
- copper oxide or copper salt can be used as the copper component.
- the copper salt include copper carboxylate (eg, copper acetate, copper ethyl acetoacetate, copper formate, copper benzoate, copper stearate, copper naphthenate, copper citrate, copper 2-ethylhexanoate), copper sulfonate (For example, copper methanesulfonate), copper phosphate, phosphate copper, phosphonate copper, phosphonate copper, phosphinate, amide copper, sulfonamido copper, imide copper, acylsulfonimide copper, bissulfonimide Copper, methido copper, alkoxy copper, phenoxy copper, copper hydroxide, copper carbonate, copper sulfate, copper nitrate, copper perchlorate, copper fluoride, copper chloride, copper bromide are preferred, copper carboxylate, copper sulfonate, Sulfonamide copper, imide copper
- the amount of the copper component to be reacted with the compound (A) is preferably 1: 0.5 to 1: 8 in a molar ratio (compound (A): copper component), and is 1: 0.5 to 1: 4. More preferably.
- the reaction conditions for reacting the copper component with the compound (A) are preferably, for example, 20 to 100 ° C. and 0.5 hours or longer.
- the copper complex may have a ligand other than the compound (A).
- the ligand other than the compound (A) include a monodentate ligand coordinated by an anion or an unshared electron pair.
- Examples of ligands coordinated with anions include halide anions, hydroxide anions, alkoxide anions, phenoxide anions, amide anions (including amides substituted with acyl groups and sulfonyl groups), and imide anions (acyl groups and sulfonyl groups).
- Substituted imides anilide anions (including acylides and sulfonyl substituted anilides), thiolate anions, bicarbonate anions, carboxylate anions, thiocarboxylate anions, dithiocarboxylate anions, hydrogen sulfate anions, sulfones Acid anion, phosphate dihydrogen anion, phosphate diester anion, phosphonate monoester anion, hydrogen phosphonate anion, phosphinate anion, nitrogen-containing heterocyclic anion, nitrate anion, hypochlorite anion, cyanide anion Cyanate anion, isocyanate anion, thiocyanate anion, isothiocyanate anions, such as azide anions.
- Monodentate ligands coordinated by lone pairs include water, alcohol, phenol, ether, amine, aniline, amide, imide, imine, nitrile, isonitrile, thiol, thioether, carbonyl compound, thiocarbonyl compound, sulfoxide, Examples include heterocycles, carbonic acid, carboxylic acid, sulfuric acid, sulfonic acid, phosphoric acid, phosphonic acid, phosphinic acid, nitric acid, and esters thereof.
- the kind and number of monodentate ligands can be appropriately selected according to the compound (A) coordinated to the copper complex.
- the copper complex may become a cation complex or an anion complex in addition to a neutral complex having no charge.
- counter ions are present as necessary to neutralize the charge of the copper complex.
- the counter ion is a negative counter ion, for example, an inorganic anion or an organic anion may be used. Specific examples include hydroxide ions, halogen anions (eg, fluoride ions, chloride ions, bromide ions, iodide ions, etc.), substituted or unsubstituted alkyl carboxylate ions (acetate ions, trifluoroacetate ions).
- the counter ion is a positive counter ion, for example, inorganic or organic ammonium ion (for example, tetraalkylammonium ion such as tetrabutylammonium ion, triethylbenzylammonium ion, pyridinium ion, etc.), phosphonium ion (for example, tetrabutylphosphonium) Tetraalkylphosphonium ions such as ions, alkyltriphenylphosphonium ions, triethylphenylphosphonium ions, etc.), alkali metal ions or protons.
- the counter ion may be a metal complex ion.
- the following aspects (1) to (5) are preferred examples of the copper complex, (2) to (5) are more preferred, (3) to (5) are more preferred, and (4) is preferred. Even more preferred.
- (1) Copper complex having one or two compounds having two coordination sites as ligands (2) Copper complex having a compound having three coordination sites as ligands (3) Three coordinations Copper complex having a compound having a coordination site and a compound having two coordination sites as a ligand (4) Copper complex having a compound having four coordination sites as a ligand (5) Five coordination sites Copper complex having a compound containing
- the copper complex examples include the following. Further, as the copper complex, the copper complexes described in paragraph numbers 0013 to 0056 of JP-A-2014-41318 and paragraph numbers 0012 to 0030 of JP-A-2014-32380 may be used. Embedded in the book.
- inorganic particles can also be used as other near infrared absorbing compounds.
- the inorganic particles are preferably metal oxide particles or metal particles in terms of better infrared shielding properties.
- the metal oxide particles include indium tin oxide (ITO) particles, antimony tin oxide (ATO) particles, zinc oxide (ZnO) particles, Al-doped zinc oxide (Al-doped ZnO) particles, and fluorine-doped tin dioxide (F-doped).
- ITO indium tin oxide
- ATO antimony tin oxide
- ZnO zinc oxide
- Al-doped zinc oxide Al-doped zinc oxide
- F-doped fluorine-doped tin dioxide
- SnO 2 niobium-doped titanium dioxide (Nb-doped TiO 2 ) particles, and the like.
- the metal particles include silver (Ag) particles, gold (Au) particles, copper (Cu) particles, and nickel (Ni) particles.
- the shape of the inorganic particles is not particularly limited, and may be a sheet shape, a wire shape, or a tube shape regardless of spherical or non-spherical.
- a tungsten oxide compound can be used as the inorganic particles.
- a tungsten oxide compound represented by the following general formula (composition formula) (W-1) is more preferable.
- M x W y O z (W-1) M represents a metal, W represents tungsten, and O represents oxygen.
- alkali metal alkaline earth metal, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al , Ga, In, Tl, Sn, Pb, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi, alkali metals are preferable, Rb or Cs is more preferable, and Cs is particularly preferable. .
- the metal of M may be one type or two or more types.
- infrared rays can be sufficiently shielded, and when 1.1 or less, the generation of an impurity phase in the tungsten oxide compound is more reliably avoided. can do.
- z / y is 2.2 or more, chemical stability as a material can be further improved, and when it is 3.0 or less, infrared rays can be sufficiently shielded.
- the tungsten oxide compound examples include Cs 0.33 WO 3 , Rb 0.33 WO 3 , K 0.33 WO 3 , Ba 0.33 WO 3 and the like, and Cs 0.33 WO 3 or Rb 0.33 WO 3 is preferable. Cs 0.33 WO 3 is more preferable.
- the tungsten oxide compound is available as a dispersion of tungsten fine particles such as YMF-02 manufactured by Sumitomo Metal Mining Co., Ltd.
- the average particle size of the inorganic particles is preferably 800 nm or less, more preferably 400 nm or less, and even more preferably 200 nm or less.
- the average particle diameter of the inorganic particles is preferably as small as possible.
- the average particle size of the inorganic particles is usually 1 nm or more.
- the content of other near-infrared absorbing compounds is preferably 0.01 to 50% by mass with respect to the total solid content of the composition.
- the lower limit is preferably 0.1% by mass or more, and more preferably 0.5% by mass or more.
- the upper limit is preferably 30% by mass or less, and more preferably 15% by mass or less.
- the composition can contain a chromatic colorant.
- the chromatic colorant means a colorant other than the white colorant and the black colorant.
- the chromatic colorant is preferably a colorant having an absorption maximum in a wavelength range of 400 nm or more and less than 650 nm.
- the chromatic colorant may be a pigment or a dye.
- the pigment preferably has an average particle diameter (r) of preferably 20 nm ⁇ r ⁇ 300 nm, more preferably 25 nm ⁇ r ⁇ 250 nm, and particularly preferably 30 nm ⁇ r ⁇ 200 nm.
- the “average particle size” here means the average particle size of secondary particles in which primary particles of the pigment are aggregated.
- the particle size distribution of the secondary particles of the pigment that can be used (hereinafter also simply referred to as “particle size distribution”) is such that the secondary particles falling into (average particle size ⁇ 100) nm are 70% by mass or more of the whole, Preferably it is 80 mass% or more.
- the particle size distribution of the secondary particles can be measured using the scattering intensity distribution.
- the average particle size of the primary particles is observed with a scanning electron microscope (SEM) or a transmission electron microscope (TEM), and 100 particle sizes are measured at a portion where the particles are not aggregated, and an average value is calculated.
- SEM scanning electron microscope
- TEM transmission electron microscope
- the pigment is preferably an organic pigment, and examples thereof include the following. However, the present invention is not limited to these. Color Index (CI) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170 171,172,173,174,175,176,177
- C. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48: 1, 48: 2, 48: 3, 48: 4 49, 49: 1, 49: 2, 52: 1, 52: 2, 53: 1, 57: 1, 60: 1, 63: 1, 66, 67, 81: 1, 81: 2, 81: 3 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 22
- the dye is not particularly limited, and a known dye can be used.
- Chemical structures include pyrazole azo, anilino azo, triaryl methane, anthraquinone, anthrapyridone, benzylidene, oxonol, pyrazolotriazole azo, pyridone azo, cyanine, phenothiazine, pyrrolopyrazole azomethine, Xanthene, phthalocyanine, benzopyran, indigo, and pyromethene dyes can be used. Moreover, you may use the multimer of these dyes. Further, the dyes described in JP-A-2015-028144 and JP-A-2015-34966 can also be used.
- the content of the chromatic colorant is preferably 0.1 to 70% by mass in the total solid content of the composition.
- the lower limit is preferably 0.5% by mass or more, and more preferably 1.0% by mass or more.
- the upper limit is preferably 60% by mass or less, and more preferably 50% by mass or less.
- the content of the chromatic colorant is preferably 10 to 1000 parts by mass and more preferably 50 to 800 parts by mass with respect to 100 parts by mass of the near infrared absorbing compound A.
- the total amount of the chromatic colorant and the near-infrared absorbing compound A is preferably 1 to 80% by mass in the total solid content of the composition.
- the lower limit is preferably 5% by mass or more, and more preferably 10% by mass or more.
- the upper limit is preferably 70% by mass or less, and more preferably 60% by mass or less.
- the total amount is preferably within the above range.
- the composition can also contain a colorant that blocks visible light.
- the colorant that shields visible light has a pigment content of preferably 90% by weight or more, more preferably 95% by weight or more, and more preferably 99% by weight or more based on the total weight of the colorant that blocks visible light. preferable.
- the color material that shields visible light preferably exhibits black, gray, or a color close to them by a combination of a plurality of color materials.
- the colorant that blocks visible light is preferably a material that absorbs light in the wavelength range from purple to red.
- the color material that blocks visible light is preferably a color material that blocks light in the wavelength range of 450 to 650 nm.
- the color material that blocks visible light preferably satisfies at least one of the following requirements (1) and (2), and more preferably satisfies the requirement (1).
- an organic black colorant as a colorant that blocks visible light is visible.
- the organic black colorant as a coloring material that blocks visible light includes carbon black and titanium black, which are black colorants that absorb both light in the infrared region and light in the visible region. Absent.
- Examples of chromatic colorants include those described above.
- Examples of the organic black colorant include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, and bisbenzofuranone compounds and perylene compounds are preferable.
- Examples of the bisbenzofuranone compounds include those described in JP-T 2010-534726, JP-2012-515233, JP-2012-515234, and the like, for example, “Irgaphor Black” manufactured by BASF It is available.
- Examples of perylene compounds include C.I. I. Pigment Black 31, 32 and the like.
- Examples of the azomethine compound include those described in JP-A-1-170601, JP-A-2-34664, etc., and can be obtained, for example, as “Chromofine Black A1103” manufactured by Dainichi Seika Co., Ltd.
- the colorant that blocks visible light has an A / B ratio of 4.5 or more, which is the ratio of the minimum absorbance A in the wavelength range of 450 to 650 nm and the minimum absorbance B in the wavelength range of 900 to 1300 nm. It is preferable that The above characteristics may be satisfied by one kind of material, or may be satisfied by a combination of a plurality of materials. For example, in the case of the above aspect (1), it is preferable that a plurality of chromatic colorants are combined to satisfy the spectral characteristics.
- the chromatic colorants are red colorants, green colorants, blue colorants, yellow colorants, purple colorants, and orange colorants. It is preferable that it is a coloring agent chosen from these.
- Examples of combinations of chromatic colorants in the case of forming a color material that shields visible light with a combination of two or more chromatic colorants include the following. (1) Embodiment containing yellow colorant, blue colorant, purple colorant and red colorant (2) Embodiment containing yellow colorant, blue colorant and red colorant (3) Yellow colorant, purple colorant And (4) an embodiment containing a yellow colorant and a purple colorant (5) an embodiment containing a green colorant, a blue colorant, a purple colorant and a red colorant (6) a purple colorant And an embodiment containing an orange colorant (7) an embodiment containing a green colorant, a purple colorant and a red colorant (8) an embodiment containing a green colorant and a red colorant
- ratio (mass ratio) of each colorant examples include the following.
- the content of the colorant that blocks visible light is preferably 30% by mass or less, more preferably 20% by mass or less, based on the total solid content of the composition. Preferably, 15 mass% or less is still more preferable.
- the lower limit may be 0.01% by mass or more, and may be 0.5% by mass or more.
- the composition may be in a form that does not substantially contain a colorant that blocks visible light.
- substantially free of a colorant that blocks visible light means that the content of the colorant that blocks visible light is preferably 0.005% by mass or less, and 0.001% by mass in the total solid content of the composition. The following is more preferable, and it is more preferable not to include a colorant that blocks visible light.
- Pigment derivative When the composition contains a pigment, it can further contain a pigment derivative.
- a pigment derivative a compound having a structure in which a part of the pigment is substituted with an acidic group, a basic group or a phthalimidomethyl group is preferable, and a pigment derivative represented by the formula (B1) is more preferable.
- P represents a dye structure
- L represents a single bond or a linking group
- X represents an acidic group, a basic group, a group having a salt structure, or a phthalimide group.
- m represents an integer of 1 or more
- n represents an integer of 1 or more.
- the plurality of L and X may be different from each other, and when n is 2 or more, the plurality of X may be different from each other.
- P represents a dye structure, and pyrrolopyrrole dye structure, diketopyrrolopyrrole dye structure, quinacridone dye structure, anthraquinone dye structure, dianthraquinone dye structure, benzoisoindole dye structure, thiazine indigo dye structure Azo dye structure, quinophthalone dye structure, phthalocyanine dye structure, naphthalocyanine dye structure, dioxazine dye structure, perylene dye structure, perinone dye structure, benzimidazolone dye structure, benzothiazole dye structure, benzimidazole dye structure and benzoxazole dye structure At least one selected from the group consisting of pyrrolopyrrole dye structure, diketopyrrolopyrrole dye structure, quinacridone dye structure and benzoimidazolone dye structure is more preferable. Pyrrole dye structure is particularly preferred.
- L represents a single bond or a linking group.
- the linking group is preferably a group consisting of 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. These may be unsubstituted or may further have a substituent.
- X represents an acidic group, a basic group, a group having a salt structure, or a phthalimide group.
- the content of the pigment derivative is preferably 1 to 50 parts by mass with respect to 100 parts by mass of the pigment contained in the composition.
- the lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more.
- the upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. If the content of the pigment derivative is within the above range, the dispersibility of the pigment can be improved and the aggregation of particles can be efficiently suppressed. Only one type of pigment derivative may be used, or two or more types may be used, and in the case of two or more types, the total amount is preferably within the above range.
- the composition preferably contains a curable compound.
- a curable compound a known compound that can be cured by radical, acid, or heat can be used. Examples thereof include a compound having a group having an ethylenically unsaturated bond, a compound having an epoxy group, a compound having a methylol group, a compound having an alkoxysilyl group, and the like. Examples of the group having an ethylenically unsaturated bond include a vinyl group, a (meth) allyl group, a (meth) acryloyl group, and a (meth) acryloyloxy group.
- alkoxysilyl group examples include a monoalkoxysilyl group, a dialkoxysilyl group, and a trialkoxysilyl group.
- the group having an ethylenically unsaturated bond is preferably a (meth) acryloyl group or a (meth) acryloyloxy group.
- the alkoxysilyl group is preferably a dialkoxysilyl group or a trialkoxysilyl group.
- the number of carbon atoms of the alkoxy group in the alkoxysilyl group is preferably 1 to 5, more preferably 1 to 3, and particularly preferably 1 or 2.
- the curable compound may be in the form of either a monomer or a polymer, but is preferably a monomer.
- the monomer type curable compound preferably has a molecular weight of 100 to 3,000.
- the upper limit is preferably 2000 or less, and more preferably 1500 or less.
- the lower limit is preferably 150 or more, and more preferably 250 or more.
- the curable compound is also preferably a compound having substantially no molecular weight distribution.
- “having substantially no molecular weight distribution” means that the dispersity of the compound (weight average molecular weight (Mw) / number average molecular weight (Mn)) is preferably 1.0 to 1.5. 0.0 to 1.3 is more preferable.
- a compound having a group having an ethylenically unsaturated bond As the curable compound, a compound having a group having an ethylenically unsaturated bond can be used.
- the compound having a group having an ethylenically unsaturated bond is preferably a monomer.
- the molecular weight of the compound having a group having an ethylenically unsaturated bond is preferably from 100 to 3,000.
- the upper limit is preferably 2000 or less, and more preferably 1500 or less.
- the lower limit is preferably 150 or more, and more preferably 250 or more.
- the compound having a group having an ethylenically unsaturated bond is preferably a 3 to 15 functional (meth) acrylate compound, and more preferably a 3 to 6 functional (meth) acrylate compound.
- descriptions in paragraph numbers 0033 to 0034 of JP2013-253224A can be referred to, and the contents thereof are incorporated in the present specification.
- Examples of the compound include ethyleneoxy-modified pentaerythritol tetraacrylate (as a commercial product, NK ester ATM-35E; manufactured by Shin-Nakamura Chemical Co., Ltd.), dipentaerythritol triacrylate (as a commercial product, KAYARAD D-330; Nippon Kayaku).
- Glycol structures linked via a propylene glycol residue are preferable. These oligomer types can also be used.
- the description of polymerizable compounds in paragraph numbers 0034 to 0038 of JP2013-253224A can be referred to, and the contents thereof are incorporated in the present specification.
- polymerizable monomers described in paragraph No. 0477 of JP2012-208494A paragraph No. 0585 of the corresponding US Patent Application Publication No. 2012/0235099
- diglycerin EO ethylene oxide
- meth commercially available product is M-460; manufactured by Toagosei Co., Ltd.
- Pentaerythritol tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., A-TMMT) and 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA) are also preferable. These oligomer types can also be used. Examples thereof include RP-1040 (manufactured by Nippon Kayaku Co., Ltd.).
- the compound having a group having an ethylenically unsaturated bond may have an acid group such as a carboxyl group, a sulfo group, or a phosphate group.
- the compound having an acid group include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids.
- a compound in which an unreacted hydroxyl group of an aliphatic polyhydroxy compound is reacted with a non-aromatic carboxylic acid anhydride to give an acid group is preferred, and in this ester, the aliphatic polyhydroxy compound is preferably pentaerythritol. And / or dipentaerythritol.
- Examples of commercially available products include Aronix series M-305, M-510, and M-520 as polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd.
- the acid value of the compound having an acid group is preferably 0.1 to 40 mgKOH / g.
- the lower limit is preferably 5 mgKOH / g or more.
- the upper limit is preferably 30 mgKOH / g or less.
- the compound having a group having an ethylenically unsaturated bond is also preferably a compound having a caprolactone structure.
- the compound having a caprolactone structure is not particularly limited as long as it has a caprolactone structure in the molecule.
- a polyhydric alcohol such as trimethylolethane, ditrimethylolethane, trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, tripentaerythritol, glycerin, diglycerol, trimethylolmelamine, (meth) acrylic acid and Mention may be made of ⁇ -caprolactone-modified polyfunctional (meth) acrylates obtained by esterifying ⁇ -caprolactone.
- the description of paragraph numbers 0042 to 0045 of JP2013-253224A can be referred to, and the contents thereof are incorporated herein.
- Compounds having a caprolactone structure include, for example, DPCA-20, DPCA-30, DPCA-60, DPCA-120, etc. commercially available from Nippon Kayaku Co., Ltd. as KAYARAD DPCA series.
- SR-494 which is a tetrafunctional acrylate having four
- TPA-330 which is a trifunctional acrylate having three isobutyleneoxy chains.
- Examples of the compound having a group having an ethylenically unsaturated bond include urethanes described in JP-B-48-41708, JP-A-51-37193, JP-B-2-32293, and JP-B-2-16765. Also suitable are acrylates and urethane compounds having an ethylene oxide skeleton described in JP-B-58-49860, JP-B-56-17654, JP-B-62-39417, and JP-B-62-39418. is there. Further, addition polymerizable compounds having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-1-105238 are used.
- urethane oligomers UAS-10, UAB-140 (manufactured by Sanyo Kokusaku Pulp Co., Ltd.), UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA -306T, UA-306I, AH-600, T-600, AI-600 (manufactured by Kyoeisha Chemical Co., Ltd.) and the like.
- a compound having an epoxy group can also be used as the curable compound.
- the compound having an epoxy group include monofunctional or polyfunctional glycidyl ether compounds and polyfunctional aliphatic glycidyl ether compounds.
- the compound which has glycidyl groups such as glycidyl (meth) acrylate and allyl glycidyl ether, and the compound which has an alicyclic epoxy group can also be used.
- Examples of the compound having an epoxy group include compounds having one or more epoxy groups in one molecule, and compounds having two or more are preferable. It is preferable to have 1 to 100 epoxy groups in one molecule.
- the upper limit may be 10 or less, and may be 5 or less.
- the lower limit is preferably 2 or more.
- the compound having an epoxy group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even a molecular weight of less than 1000), or a macromolecule (for example, a molecular weight of 1000 or more, in the case of a polymer, the weight average molecular weight is 1000 or more).
- the weight average molecular weight of the compound having an epoxy group is preferably 200 to 100,000, more preferably 500 to 50,000.
- the upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5000 or less, and still more preferably 3000 or less.
- bisphenol A type epoxy resin jER825, jER827, jER828, jER834, jER1001, jER1002, jER1003, jER1055, jER1007, jER1009, jER1010 (above, manufactured by Mitsubishi Chemical Corporation), EPICLON860, EPICLON1050 , EPICLON1051, EPICLON1055 (manufactured by DIC Corporation), etc.
- bisphenol F-type epoxy resins include jER806, jER807, jER4004, jER4005, jER4007, jER4010 (above, Mitsubishi Chemical Corporation), EPICLON830, EPICLON835.
- Cresol novolac type epoxy resins include EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLON N-690, EPICLON N-695 (or more DIC Co., Ltd.), EOCN-1020 (Nippon Kayaku Co., Ltd.), etc., and aliphatic epoxy resins are ADEKA RESIN EP-4080S, EP-4085S, etc.
- P-4088S (above, manufactured by ADEKA Corporation), Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, EHPE3150, EPOLEEAD PB 3600, PB 4700 (above, manufactured by Daicel Corporation), Denacol EX-212L, EX -214L, EX-216L, EX-321L, EX-850L (manufactured by Nagase ChemteX Corporation).
- ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (manufactured by ADEKA Corporation), jER1031S (manufactured by Mitsubishi Chemical Corporation), OXT-221 (manufactured by Toagosei Co., Ltd.) and the like.
- the compound having an epoxy group those having a glycidyl group as an epoxy group such as glycidyl (meth) acrylate and allyl glycidyl ether can be used, but preferred are unsaturated compounds having an alicyclic epoxy group.
- a compound for example, description in paragraph No. 0045 of JP2009-265518A can be referred to, and the contents thereof are incorporated in the present specification.
- a compound having alkoxysilyl group As the curable compound, a compound having an alkoxysilyl group can also be used.
- the number of carbon atoms of the alkoxy group in the alkoxysilyl group is preferably 1 to 5, more preferably 1 to 3, and particularly preferably 1 or 2.
- the number of alkoxysilyl groups is preferably 2 or more, more preferably 2 to 3 in a molecule.
- the compound having an alkoxysilyl group include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n- Propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis (trimethoxysilyl) hexane, trifluoropropyltrimethoxysilane, hexamethyldisilazane, vinyl Trimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxy
- a compound having a methylol group can also be used as the curable compound.
- Examples of the compound having a methylol group include compounds in which a methylol group is bonded to a nitrogen atom or a carbon atom that forms an aromatic ring.
- the compounds in which the methylol group is bonded to the nitrogen atom include alkoxymethylated melamine, methylolated melamine, alkoxymethylated benzoguanamine, methylolated benzoguanamine, alkoxymethylated glycoluril, methylolated glycoluril, alkoxymethylated urea and methylol.
- Preferred is urea fluoride. 1,3,4,6-tetramethoxymethyl glycoluril is also preferred.
- paragraph numbers 0134 to 0147 in Japanese Patent Application Laid-Open No. 2004-295116 and paragraph numbers 0095 to 0126 in Japanese Patent Application Laid-Open No. 2004-089408 can be referred to, and the contents thereof are incorporated in this specification.
- Preferable structures of the compound having a methylol group include compounds represented by the following formulas (8-1) to (8-4).
- X 2 represents a divalent organic group
- R 7 to R 11 each independently represents a hydrogen atom or a monovalent organic group.
- Examples of the compound having a methylol group include those represented by the following formulas (4) to (5).
- X represents a single bond or a monovalent to tetravalent organic group
- R 11 and R 12 each independently represents a hydrogen atom or a monovalent organic group
- n is an integer of 1 to 4.
- p and q are each independently an integer of 0 to 4. However, when n is 1, p is an integer of 1 to 4. When n is an integer of 2 to 4, p is 0. (It is an integer of ⁇ 4, but one or more —CH 2 OR 11 is included in the formula (4).)
- two Y's each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may contain an oxygen atom or a fluorine atom.
- R 13 to R 16 are each independently A hydrogen atom or a monovalent organic group, m and n are each independently an integer of 1 to 3, and p and q are each independently an integer of 0 to 4)
- Examples of commercially available compounds having a methylol group include Cymel 300, 301, 303, 370, 325, 327, 701, 266, 267, 238, 1141, 272, 202, 1156, 1158, 1123, 1170, 1174, UFR65, 300 (above, Mitsui Cyanamid Co., Ltd.), Nicarax MX-750, -032, -706, -708, -40, -31, -270, -280, -290, -750LM, Nicarak MS-11 Nicalac MW-30HM, -100LM, -390 (manufactured by Sanwa Chemical Co., Ltd.) and the like can be preferably used.
- the content of the curable compound is preferably 0.1 to 40% by mass with respect to the total solid content of the composition.
- the lower limit is more preferably 0.5% by mass or more, and further preferably 1% by mass or more.
- the upper limit is more preferably 30% by mass or less, and still more preferably 20% by mass or less.
- One curable compound may be used alone, or two or more curable compounds may be used in combination. When using 2 or more types together, it is preferable that a total amount becomes the said range.
- the composition can contain a resin.
- the resin is blended, for example, for the purpose of dispersing a pigment or the like in the composition and the purpose of a binder.
- a resin used mainly for dispersing pigments is also called a dispersant.
- a resin can be used for purposes other than such use.
- the weight average molecular weight (Mw) of the resin is preferably 2,000 to 2,000,000.
- the upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less.
- the lower limit is preferably 3,000 or more, and more preferably 5,000 or more.
- the weight average molecular weight (Mw) of the epoxy resin is preferably 100 or more, and more preferably 200 to 2,000,000.
- the upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less.
- the lower limit is preferably 100 or more, and more preferably 200 or more.
- (meth) acrylic resin, epoxy resin, ene thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyparaphenylene resin, polyarylene ether phosphine oxide resin examples thereof include a polyimide resin, a polyamideimide resin, a polyolefin resin, a cyclic olefin resin, a polyester resin, and a styrene resin.
- One of these resins may be used alone, or two or more thereof may be mixed and used.
- Examples of the (meth) acrylic resin include a polymer containing a structural unit derived from (meth) acrylic acid and / or its ester. Specific examples include polymers obtained by polymerizing at least one selected from (meth) acrylic acid, (meth) acrylic acid esters, (meth) acrylamide and (meth) acrylonitrile.
- Polyester resins include polyols (eg, ethylene glycol, propylene glycol, glycerin, trimethylol propane), polybasic acids (eg, aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, and aromatic rings thereof.
- polyols eg, ethylene glycol, propylene glycol, glycerin, trimethylol propane
- polybasic acids eg, aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, and aromatic rings thereof.
- the styrene resin include polyhydroxystyrene.
- the resin may have an acid group.
- the acid group include a carboxyl group, a phosphoric acid group, a sulfonic acid group, and a phenolic hydroxyl group. These acid groups may be used alone or in combination of two or more. Resins having acid groups can also be used as alkali-soluble resins. It can also be used as a dispersant.
- a polymer having a carboxyl group in the side chain is preferred, and a methacrylic acid copolymer, an acrylic acid copolymer, an itaconic acid copolymer, a crotonic acid copolymer, a maleic acid copolymer, a partial Examples include esterified maleic acid copolymers, alkali-soluble phenol resins such as novolak resins, acidic cellulose derivatives having a carboxyl group in the side chain, and polymers having a hydroxyl group added with an acid anhydride.
- a copolymer of (meth) acrylic acid and another monomer copolymerizable therewith is suitable.
- Examples of other monomers copolymerizable with (meth) acrylic acid include alkyl (meth) acrylates, aryl (meth) acrylates, and vinyl compounds.
- alkyl (meth) acrylate and aryl (meth) acrylate methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, pentyl (meth) acrylate
- Examples of vinyl compounds such as hexyl (meth) acrylate, octyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, tolyl (meth) acrylate, naphthyl (meth) acrylate, cyclohexyl (meth) acrylate, styrene, ⁇ -methylstyrene, vinylto
- Examples of the other monomer include N-substituted maleimide monomers described in JP-A-10-300922. Examples thereof include N-phenylmaleimide and N-cyclohexylmaleimide. Only one kind of these other monomers copolymerizable with (meth) acrylic acid may be used, or two or more kinds may be used.
- Resins having an acid group include benzyl (meth) acrylate / (meth) acrylic acid copolymer, benzyl (meth) acrylate / (meth) acrylic acid / 2-hydroxyethyl (meth) acrylate copolymer, benzyl (meth) Multi-component copolymers composed of acrylate / (meth) acrylic acid / other monomers can be preferably used.
- the resin having an acid group is a monomer containing a compound represented by the following formula (ED1) and / or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as “ether dimers”). It is also preferable to include a polymer obtained by polymerizing the components.
- R 1 and R 2 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
- R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms.
- the description in JP 2010-168539 A can be referred to.
- the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R 1 and R 2 is not particularly limited, and examples thereof include methyl, ethyl, n- Linear or branched alkyl groups such as propyl, isopropyl, n-butyl, isobutyl, tert-butyl, tert-amyl, stearyl, lauryl, 2-ethylhexyl; aryl groups such as phenyl; cyclohexyl, tert-butylcyclohexyl, Alicyclic groups such as dicyclopentadienyl, tricyclodecanyl, isobornyl, adamantyl and 2-methyl-2-adamantyl; alkyl groups substituted with alkoxy such as 1-methoxyethyl and 1-ethoxyethyl; benzyl and the like An alkyl group substituted with an aryl group of
- ether dimer for example, paragraph number 0317 of JP2013-29760A can be referred to, and the contents thereof are incorporated in the present specification. Only one type of ether dimer may be used, or two or more types may be used.
- the resin having an acid group may contain a structural unit derived from a compound represented by the following formula (X).
- R 1 represents a hydrogen atom or a methyl group
- R 2 represents an alkylene group having 2 to 10 carbon atoms
- R 3 represents an alkyl group having 1 to 20 carbon atoms which may contain a hydrogen atom or a benzene ring. Represents a group.
- n represents an integer of 1 to 15.
- the alkylene group of R 2 preferably has 2 to 3 carbon atoms.
- the alkyl group of R 3 has 1 to 20 carbon atoms, more preferably 1 to 10, and the alkyl group of R 3 may contain a benzene ring.
- Examples of the alkyl group containing a benzene ring represented by R 3 include a benzyl group and a 2-phenyl (iso) propyl group.
- Examples of the resin having an acid group include those described in JP-A-2012-208494, paragraphs 0558 to 0571 (corresponding to US Patent Application Publication No. 2012/0235099, paragraphs 0685 to 0700), JP-A-2012-198408.
- the description of paragraph numbers 0076 to 0099 of the publication can be referred to, and the contents thereof are incorporated in the present specification. Moreover, the following resin is also mentioned.
- the acid value of the resin having an acid group is preferably 30 to 200 mgKOH / g.
- the lower limit is preferably 50 mgKOH / g or more, and more preferably 70 mgKOH / g or more.
- the upper limit is preferably 150 mgKOH / g or less, and more preferably 120 mgKOH / g or less.
- the resin may have a curable group.
- the curable group include a group having an ethylenically unsaturated bond, an epoxy group, a methylol group, and an alkoxysilyl group.
- the group having an ethylenically unsaturated bond include a vinyl group, a (meth) allyl group, a (meth) acryloyl group, and a (meth) acryloyloxy group.
- Examples of the alkoxysilyl group include a monoalkoxysilyl group, a dialkoxysilyl group, and a trialkoxysilyl group.
- the structural unit having a curable group include the following formulas (A2-1) to (A2-4).
- R 1 represents a hydrogen atom or an alkyl group.
- the alkyl group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and particularly preferably 1 carbon atom.
- R 1 is preferably a hydrogen atom or a methyl group.
- L 51 represents a single bond or a divalent linking group.
- the divalent linking group include an alkylene group, an arylene group, —O—, —S—, —CO—, —COO—, —OCO—, —SO 2 —, —NR 10 — (R 10 represents a hydrogen atom or Represents a hydrogen atom, preferably a hydrogen atom), or a group composed of a combination thereof, and a group composed of a combination of at least one of an alkylene group, an arylene group, and an alkylene group and —O— is preferable.
- the alkylene group preferably has 1 to 30 carbon atoms, more preferably 1 to 15 carbon atoms, and still more preferably 1 to 10 carbon atoms.
- the alkylene group may have a substituent, but is preferably unsubstituted.
- the alkylene group may be linear, branched or cyclic. Further, the cyclic alkylene group may be monocyclic or polycyclic.
- the number of carbon atoms of the arylene group is preferably 6 to 18, more preferably 6 to 14, and still more preferably 6 to 10.
- P 1 represents a curable group.
- the curable group include a group having an ethylenically unsaturated bond, an epoxy group, a methylol group, and an alkoxysilyl group.
- the group having an ethylenically unsaturated bond include a vinyl group, a (meth) allyl group, a (meth) acryloyl group, and a (meth) acryloyloxy group.
- the alkoxysilyl group include a monoalkoxysilyl group, a dialkoxysilyl group, and a trialkoxysilyl group.
- Examples of the resin containing a curable group include Dianal NR series (manufactured by Mitsubishi Rayon Co., Ltd.), Photomer 6173 (COOH-containing polyurethane acrylic oligomer. Diamond Shammock Co., Ltd.), Viscoat R-264, and KS resist 106 (all). Also manufactured by Osaka Organic Chemical Co., Ltd.), Cyclomer P series (for example, ACA230AA), Plaxel CF200 series (both manufactured by Daicel Corporation), Ebecryl 3800 (manufactured by Daicel UCB Co., Ltd.), Acryl RD-F8 (( (Manufactured by Nippon Shokubai Co., Ltd.). Moreover, the epoxy resin mentioned above, the following resin, etc. are mentioned.
- the resin preferably has structural units represented by the following formulas (A3-1) to (A3-7).
- R 5 represents a hydrogen atom or an alkyl group
- L 4 to L 7 each independently represents a single bond or a divalent linking group
- R 10 to R 13 each independently represents an alkyl group or an aryl group.
- R 14 and R 15 each independently represents a hydrogen atom or a substituent.
- R 5 has the same meaning as R 1 in formulas (A2-1) to (A2-4), and the preferred range is also the same.
- L 4 to L 7 have the same meaning as L 51 in formulas (A2-1) to (A2-4), and the preferred ranges are also the same.
- the alkyl group represented by R 10 may be linear, branched or cyclic, and is preferably cyclic.
- the alkyl group may have the above-described substituent and may be unsubstituted.
- the alkyl group preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and still more preferably 1 to 10 carbon atoms.
- the aryl group represented by R 10 preferably has 6 to 18 carbon atoms, more preferably 6 to 12 carbon atoms, and still more preferably 6 carbon atoms.
- R 10 is preferably a cyclic alkyl group or an aryl group.
- the alkyl group represented by R 11 and R 12 may be linear, branched or cyclic, and is preferably linear or branched.
- the alkyl group may have the above-described substituent and may be unsubstituted.
- the alkyl group preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, and still more preferably 1 to 4 carbon atoms.
- the aryl group represented by R 11 and R 12 preferably has 6 to 18 carbon atoms, more preferably 6 to 12 carbon atoms, and still more preferably 6 carbon atoms.
- R 11 and R 12 are preferably a linear or branched alkyl group.
- the alkyl group represented by R 13 may be linear, branched or cyclic, and is preferably linear or branched.
- the alkyl group may have the above-described substituent and may be unsubstituted.
- the alkyl group preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, and still more preferably 1 to 4 carbon atoms.
- the aryl group represented by R 13 preferably has 6 to 18 carbon atoms, more preferably 6 to 12 carbon atoms, and still more preferably 6 carbon atoms.
- R 13 is preferably a linear or branched alkyl group or an aryl group. The ru group is preferred.
- R 14 and R 15 examples include the groups described in the above formula (SQ). Among these, at least one of R 14 and R 15 preferably represents a cyano group or —COORa.
- Ra represents a hydrogen atom or a substituent. The substituent mentioned above is mentioned. For example, an alkyl group and an aryl group are preferable.
- Examples of commercially available resins having the structural unit represented by (A3-7) include ARTON F4520 (manufactured by JSR Corporation). Further, resins are Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (Nippon Oil ( It is also preferred to use an epoxy group-containing polymer).
- the resin When the composition contains a pigment, the resin preferably contains a dispersant.
- the resin acting as a dispersant is preferably an acid type resin and / or a basic type resin.
- the acidic resin represents a resin in which the amount of acid groups is larger than the amount of basic groups.
- the acid type resin preferably has an acid group content of 70 mol% or more when the total amount of acid groups and basic groups in the resin is 100 mol%. What consists only of group is more preferable.
- the acid group possessed by the acidic resin is preferably a carboxyl group.
- the acid value of the acid type resin is preferably 40 to 105 mgKOH / g, more preferably 50 to 105 mgKOH / g, and still more preferably 60 to 105 mgKOH / g.
- the basic type resin is a resin in which the amount of basic groups is larger than the amount of acid groups.
- the basic type resin preferably occupies 50 mol% or more of the basic group when the total amount of the acid group and the basic group in the resin is 100 mol%.
- the basic group possessed by the basic type resin is preferably an amine.
- Resins can be further classified into linear polymers, terminal-modified polymers, graft polymers, and block polymers based on their structures.
- the terminal-modified polymer include a polymer having a phosphate group at the terminal end described in JP-A-3-112992 and JP-T-2003-533455, and JP-A-2002-273191.
- examples thereof include a polymer having a sulfonic acid group at the terminal and a polymer having a partial skeleton of organic dye or a heterocyclic ring described in JP-A-9-77994.
- polymers having two or more pigment surface anchor sites (acid groups, basic groups, organic dye partial skeletons, heterocycles, etc.) introduced at the polymer ends described in JP-A-2007-277514 are also available. It is preferable because of excellent dispersion stability.
- the graft polymer include reaction products of poly (lower alkyleneimine) and polyester described in JP-A-54-37082, JP-A-8-507960, JP-A-2009-258668, and the like.
- macromonomer examples include macromonomer AA-6 (polymethyl methacrylate whose terminal group is a methacryloyl group), AS-6 (polystyrene whose terminal group is a methacryloyl group), AN-6S manufactured by Toagosei Co., Ltd.
- a graft copolymer containing a structural unit represented by any one of the following formulas (1) to (4) can also be used.
- X 1 , X 2 , X 3 , X 4 , and X 5 each independently represent a hydrogen atom or a monovalent organic group.
- a hydrogen atom or an alkyl group having 1 to 12 carbon atoms is preferable, a hydrogen atom or a methyl group is more preferable, and a methyl group is particularly preferable.
- W 1 , W 2 , W 3 , and W 4 each independently represent an oxygen atom or NH, preferably an oxygen atom.
- R 3 represents a branched or straight-chain alkylene group (preferably having 1 to 10 carbon atoms, more preferably 2 or 3), and —CH 2 —CH (CH 3 ) — from the viewpoint of dispersion stability.
- R 4 represents a hydrogen atom or a monovalent group.
- Y 1 , Y 2 , Y 3 , and Y 4 each independently represent a divalent linking group.
- Z 1 , Z 2 , Z 3 , and Z 4 each independently represent a monovalent group.
- n, m, p, and q each independently represents an integer of 1 to 500, and j and k each independently represents an integer of 2 to 8.
- the description of paragraphs 0025 to 0069 of JP2012-255128A can be referred to, and the above contents are incorporated in this specification. Specific examples of the graft copolymer include the following. Further, resins described in JP-A-2012-255128, paragraphs 0072 to 0094 can be used.
- an oligoimine resin containing a nitrogen atom in at least one of the main chain and the side chain can also be used.
- the oligoimine-based resin includes a structural unit having a partial structure X having a functional group of pKa14 or less, a side chain containing a side chain Y having 40 to 10,000 atoms, and at least a main chain and a side chain.
- a resin having a basic nitrogen atom on one side is preferred.
- the basic nitrogen atom is not particularly limited as long as it is a basic nitrogen atom.
- the oligoimine resin includes, for example, a structural unit represented by the following formula (I-1), a structural unit represented by the formula (I-2), and / or a structure represented by the formula (I-2a). Examples include resins containing units.
- R 1 and R 2 each independently represents a hydrogen atom, a halogen atom or an alkyl group (preferably having 1 to 6 carbon atoms).
- a represents an integer of 1 to 5 independently.
- * represents a connecting part between structural units.
- R 8 and R 9 are the same groups as R 1 .
- L is a single bond, an alkylene group (preferably having 1 to 6 carbon atoms), an alkenylene group (preferably having 2 to 6 carbon atoms), an arylene group (preferably having 6 to 24 carbon atoms), a heteroarylene group (having 1 to 6 carbon atoms).
- an imino group preferably having a carbon number of 0 to 6
- an ether group preferably having a carbon number of 0 to 6
- a thioether group preferably having a carbonyl group, or a combination group thereof.
- a single bond or —CR 5 R 6 —NR 7 — is preferable.
- R 5 and R 6 each independently represent a hydrogen atom, a halogen atom, or an alkyl group (preferably having 1 to 6 carbon atoms).
- R 7 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- L a is a structural site to form a ring structure together with CR 8 CR 9 and N, be combined with the carbon atoms of CR 8 CR 9 is a structural site that form a non-aromatic heterocyclic ring having 3 to 7 carbon atoms preferable. More preferably, it is a structural part that forms a 5- to 7-membered non-aromatic heterocyclic ring by combining the carbon atom of CR 8 CR 9 and N (nitrogen atom), more preferably a 5-membered non-aromatic heterocyclic ring. It is a structural part to be formed, and a structural part to form pyrrolidine is particularly preferable. This structural part may further have a substituent such as an alkyl group.
- X represents a group having a functional group of pKa14 or less.
- Y represents a side chain having 40 to 10,000 atoms.
- the resin oligoimine-based resin
- the resin further contains one or more selected from structural units represented by formula (I-3), formula (I-4), and formula (I-5) as a copolymerization component. It may be. When the resin contains such a structural unit, the pigment dispersion performance can be further improved.
- R 1 , R 2 , R 8 , R 9 , L, La, a and * are as defined in the formulas (I-1), (I-2) and (I-2a).
- Ya represents a side chain having an anionic group having 40 to 10,000 atoms.
- the structural unit represented by the formula (I-3) is reacted by adding an oligomer or polymer having a group that reacts with an amine to form a salt to a resin having a primary or secondary amino group in the main chain. Can be formed.
- oligoimine-based resin described above, the description of paragraph numbers 0102 to 0166 in JP 2012-255128 A can be referred to, and the above contents are incorporated in this specification. Specific examples of the oligoimine resin include the following. In addition, resins described in JP-A-2012-255128, paragraph numbers 0168 to 0174 can be used.
- a resin containing a structural unit represented by the formula (P1) can also be used.
- R 1 represents hydrogen or a methyl group
- R 2 represents an alkylene group
- Z represents a nitrogen-containing heterocyclic structure.
- the alkylene group represented by R 2 is not particularly limited.
- methylene group, ethylene group, trimethylene group, tetramethylene group, hexamethylene group, 2-hydroxypropylene group, methyleneoxy group, ethyleneoxy group, methyleneoxycarbonyl Group, a methylenethio group, etc. are mentioned suitably, A methylene group, a methyleneoxy group, a methyleneoxycarbonyl group, a methylenethio group is more preferable.
- the nitrogen-containing heterocyclic structure represented by Z is, for example, pyridine ring, pyrazine ring, pyrimidine ring, pyrrole ring, imidazole ring, triazole ring, tetrazole ring, indole ring, quinoline ring, acridine ring, phenothiazine ring, phenoxazine ring, acridone Examples thereof include those having a ring, a benzimidazole structure, a benzotriazole structure, a benzothiazole structure, a cyclic amide structure, a cyclic urea structure, and a cyclic imide structure.
- the nitrogen-containing heterocyclic structure represented by Z is preferably a structure represented by the following formula (P2) or (P3).
- X is a single bond, an alkylene group (for example, a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, etc.), —O—, —S—, —NR—, and —C ( ⁇ O )-.
- R represents a hydrogen atom or an alkyl group.
- R represents an alkyl group, for example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, t-butyl group, n-hexyl group, n-octyl group, 2-ethylhexyl group And n-octadecyl group.
- X is preferably a single bond, a methylene group, —O— or —C ( ⁇ O) —, and particularly preferably —C ( ⁇ O) —.
- ring A, ring B, and ring C each independently represent an aromatic ring.
- the aromatic ring include benzene ring, naphthalene ring, indene ring, azulene ring, fluorene ring, anthracene ring, pyridine ring, pyrazine ring, pyrimidine ring, pyrrole ring, imidazole ring, indole ring, quinoline ring, acridine ring, phenothiazine.
- Ring, phenoxazine ring, acridone ring, anthraquinone ring, etc. among which benzene ring, naphthalene ring, anthracene ring, pyridine ring, phenoxazine ring, acridine ring, phenothiazine ring, acridone ring, anthraquinone ring are preferable, benzene A ring, a naphthalene ring, and a pyridine ring are particularly preferable.
- resin containing the structural unit represented by the formula (P1) include the following.
- the dispersant is also available as a commercial product. Specific examples thereof include “DA-7301” manufactured by Enomoto Kasei Co., Ltd., “Disperbyk-101 (polyamidoamine phosphate)” manufactured by BYK Chemie, 107 (carboxylic acid).
- Ester 110 (copolymer containing an acid group), 111 (phosphate dispersing agent), 130 (polyamide), 161, 162, 163, 164, 165, 166, 170 (polymer copolymer) ”, “BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid)” manufactured by BYK Chemie, “EFKA 4047, 4050-4165 (polyurethane)”, EFKA 4330-4340 (block copolymer), 4400-4402 (modified poly) manufactured by EFKA Acrylate), 5010 (polyesteramide), 5765 (high molecular weight) Recarboxylate), 6220 (fatty acid polyester), 6745 (phthalocyanine derivative), 6750 (azo pigment derivative) ”,“ Ajisper PB821, PB822, PB880, PB881 ”manufactured by Ajinomoto Fine Techno Co.,“ Floren TG-710 manufactured by Kyoeisha Chemical Co., Ltd
- the content of the resin in the composition is preferably 1 to 80% by mass with respect to the total solid content of the composition.
- the lower limit is preferably 5% by mass or more, and more preferably 7% by mass or more.
- the upper limit is preferably 50% by mass or less, and more preferably 30% by mass or less.
- the composition can contain a photopolymerization initiator.
- a photopolymerization initiator when the composition contains a radical polymerizable component such as a resin having a group having an ethylenically unsaturated bond or a curable compound, it preferably contains a photopolymerization initiator.
- a photoinitiator There is no restriction
- the photopolymerization initiator is preferably a photoradical polymerization initiator.
- the photopolymerization initiator preferably contains at least one compound having a molar extinction coefficient of at least about 50 within a range of about 300 nm to 800 nm (more preferably 330 nm to 500 nm).
- the photopolymerization initiator examples include halogenated hydrocarbon derivatives (for example, those having a triazine skeleton, those having an oxadiazole skeleton), acylphosphine compounds such as acylphosphine oxide, hexaarylbiimidazoles, oxime derivatives, etc. Oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ketoxime ethers, aminoacetophenone compounds, hydroxyacetophenones, and the like.
- halogenated hydrocarbon compound having a triazine skeleton examples include those described in Wakabayashi et al., Bull. Chem. Soc.
- trihalomethyltriazine compounds trihalomethyltriazine compounds, benzyldimethylketal compounds, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, oniums
- compounds selected from the group consisting of compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and derivatives thereof, cyclopentadiene-benzene-iron complexes and salts thereof, halomethyloxadiazole compounds, and 3-aryl substituted coumarin compounds are preferred.
- hydroxyacetophenone compounds ⁇ -hydroxyketone compounds
- aminoacetophenone compounds ⁇ -aminoketone compounds
- acylphosphine compounds can also be suitably used.
- aminoacetophenone initiators described in JP-A-10-291969 and acylphosphine initiators described in Japanese Patent No. 4225898 can also be used.
- hydroxyacetophenone compound ( ⁇ -hydroxyketone compound) IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, IRGACURE-127 (trade names, all manufactured by BASF) can be used.
- aminoacetophenone compound ⁇ -aminoketone compound
- commercially available products IRGACURE-907, IRGACURE-369, and IRGACURE-379EG (trade names, all manufactured by BASF) can be used.
- aminoacetophenone compound ( ⁇ -aminoketone compound) a compound described in JP-A-2009-191179 in which an absorption wavelength is matched with a light source of 365 nm or 405 nm can also be used.
- acylphosphine compound commercially available products such as IRGACURE-819 and DAROCUR-TPO (trade names, both manufactured by BASF) can be used.
- More preferable examples of the photopolymerization initiator include oxime compounds.
- Specific examples of the oxime compound include compounds described in JP-A No. 2001-233842, compounds described in JP-A No. 2000-80068, and compounds described in JP-A No. 2006-342166.
- oxime compounds examples include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, and 2-acetoxyiminopentane.
- 3-benzoyloxyiminobutan-2-one 2-acetoxyimino-1-phenylpropan-1-one
- 2-benzoyloxyimino-1-phenylpropan-1-one 3- (4-toluenesulfonyloxy) iminobutan-2-one
- 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one J.H. C. S. Perkin II (1979) pp. 1653-1660
- IRGACURE-OXE01 manufactured by BASF
- IRGACURE-OXE02 manufactured by BASF
- IRGACURE-OXE03 manufactured by BASF
- IRGACURE-OXE04 manufactured by BASF
- TR-PBG-304 manufactured by Changzhou Powerful Electronic New Materials Co., Ltd.
- Adeka Arcles NCI-930 manufactured by ADEKA
- oxime compounds other than those described above compounds described in JP-T 2009-519904, in which an oxime is linked to the N-position of the carbazole ring, and those described in US Pat. No. 7,626,957 in which a hetero substituent is introduced into the benzophenone moiety
- a nitro group is introduced into the dye moiety
- ketoxime compounds described in International Publication WO2009 / 131189 triazine skeleton and oxime skeleton
- JP2014 No. 137466 paragraph numbers 0076 to 007
- the oxime compound is preferably a compound represented by the following formula (OX-1).
- the oxime compound may be an oxime compound in which the oxime N—O bond is an (E) isomer, or the oxime N—O bond may be a (Z) oxime compound. Z) It may be a mixture with the body.
- R and B each independently represent a monovalent substituent
- A represents a divalent organic group
- Ar represents an aryl group.
- the monovalent substituent represented by R is preferably a monovalent nonmetallic atomic group.
- the monovalent nonmetallic atomic group include an alkyl group, an aryl group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic group, an alkylthiocarbonyl group, and an arylthiocarbonyl group.
- these groups may have one or more substituents.
- the substituent mentioned above may be further substituted by another substituent.
- the substituent examples include a halogen atom, an aryloxy group, an alkoxycarbonyl group or an aryloxycarbonyl group, an acyloxy group, an acyl group, an alkyl group, and an aryl group.
- the monovalent substituent represented by B is preferably an aryl group, a heterocyclic group, an arylcarbonyl group, or a heterocyclic carbonyl group. These groups may have one or more substituents. Examples of the substituent include the above-described substituents.
- the divalent organic group represented by A is preferably an alkylene group having 1 to 12 carbon atoms, a cycloalkylene group, or an alkynylene group. These groups may have one or more substituents. Examples of the substituent include the above-described substituents.
- An oxime compound having a fluorene ring can also be used as a photopolymerization initiator.
- Specific examples of the oxime compound having a fluorene ring include compounds described in JP-A-2014-137466. This content is incorporated herein.
- An oxime compound having a fluorine atom can also be used as a photopolymerization initiator.
- Specific examples of the oxime compound having a fluorine atom include compounds described in JP 2010-262028 A, compounds 24 and 36 to 40 described in JP-A-2014-500852, and JP-A 2013-164471. Compound (C-3). This content is incorporated herein.
- An oxime compound having a nitro group can be used as a photopolymerization initiator.
- the oxime compound having a nitro group is also preferably a dimer.
- Specific examples of the oxime compound having a nitro group include compounds described in paragraphs 0031 to 0047 of JP2013-114249A, paragraphs 0008 to 0012 and 0070 to 0079 of JP2014-137466A, A compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071, Adeka Arcles NCI-831 (manufactured by ADEKA) can be mentioned.
- oxime compounds that are preferably used are shown below, but the present invention is not limited thereto.
- the oxime compound is preferably a compound having a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, more preferably a compound having an absorption wavelength in a wavelength region of 360 nm to 480 nm, and particularly preferably a compound having high absorbance at 365 nm and 405 nm.
- the molar extinction coefficient at 365 nm or 405 nm of the oxime compound is preferably 1,000 to 300,000, more preferably 2,000 to 300,000, more preferably 5,000 to 200, from the viewpoint of sensitivity. Is particularly preferred.
- a known method can be used. Specifically, for example, an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian) is used and an ethyl acetate solvent is used. It is preferable to measure at a concentration of 0.01 g / L.
- the content of the photopolymerization initiator is preferably 0.1 to 50% by mass, more preferably 0.5 to 30% by mass, and further preferably 1 to 20% by mass with respect to the total solid content of the composition. . Within this range, better sensitivity and pattern formability can be obtained.
- the composition may contain only one type of photopolymerization initiator or two or more types. When two or more types are included, the total amount is preferably within the above range.
- the composition can contain an acid generator.
- an acid generator is preferably contained.
- the acid generator is preferably a compound that generates an acid upon irradiation with light (photoacid generator). Acid generators decompose by light irradiation to generate acids, onium salt compounds such as diazonium salts, phosphonium salts, sulfonium salts, iodonium salts, imide sulfonates, oxime sulfonates, diazodisulfones, disulfones, o-nitrobenzyl sulfonates, etc.
- the sulfonate compound examples include compounds described in paragraph numbers 0066 to 0122 of JP-A-2008-13646, and these can be applied to the present invention. it can. For example, triethylammonium nonaflate and the like can be mentioned.
- Preferred compounds as the acid generator include compounds represented by the following formulas (b1), (b2), and (b3).
- R 201 to R 207 each independently represents an organic group.
- X ⁇ represents a non-nucleophilic anion, preferably a sulfonate anion, a carboxylate anion, a bis (alkylsulfonyl) amide anion, a tris (alkylsulfonyl) methide anion, BF 4 ⁇ , PF 6 ⁇ , SbF 6 ⁇ or the following And the like, and BF 4 ⁇ , PF 6 ⁇ and SbF 6 ⁇ are preferable.
- Examples of commercially available acid generators include WPAG-469 (manufactured by Wako Pure Chemical Industries, Ltd.) and CPI-100P (manufactured by San Apro Co., Ltd.).
- the content of the acid generator is preferably 0.1 to 50% by mass, more preferably 0.5 to 30% by mass, and further preferably 1 to 20% by mass with respect to the total solid content of the composition.
- the composition may contain only one type of acid generator or two or more types of acid generators. When two or more types are included, the total amount is preferably within the above range.
- the composition can further contain a catalyst.
- a catalyst when a compound having an alkoxysilyl group is used as the curable compound, by containing a catalyst, the sol-gel reaction is promoted and a strong cured film is obtained.
- the catalyst include an acid catalyst and a base catalyst.
- Acid catalysts include hydrochloric acid, nitric acid, sulfuric acid, sulfurous acid, hydrogen sulfide, perchloric acid, hydrogen peroxide, carbonic acid, carboxylic acids such as formic acid and acetic acid, and R in the structural formula shown by RCOOH substituted with other elements or substituents.
- carboxylic acids such as benzenesulfonic acid, phosphoric acid and the like.
- Lewis acids such as aluminum chloride, aluminum acetylacetonate, zinc chloride, tin chloride, boron trifluoride diethyl ether complex, iodotrimethylsilane, etc.
- the base catalyst include ammoniacal basic compounds such as aqueous ammonia and organic amines such as ethylamine and aniline.
- the catalysts described in paragraph numbers 0070 to 0076 of JP2013-201007A can also be used.
- the content of the catalyst is preferably 0.1 to 100 parts by mass, more preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the curable compound (preferably 100 parts by mass of the compound having an alkoxysilyl group). More preferably 0.1 to 20 parts by mass.
- the composition may contain only one type of catalyst or two or more types of catalyst. When two or more types are included, the total amount is preferably within the above range.
- the composition can contain a solvent.
- the solvent include organic solvents.
- the solvent is basically not particularly limited as long as it satisfies the solubility of each component and the applicability of the composition, but is preferably selected in consideration of the applicability and safety of the composition.
- Examples of the organic solvent include the following.
- Examples of esters include ethyl acetate, n-butyl acetate, isobutyl acetate, cyclohexyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, alkyloxyalkyl acetate (Eg, methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (eg, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate)), alkyl 3-alkyloxypropionate Esters (eg, methyl 3-alkyloxypropionate, ethyl 3-alkyloxypropionate
- Organic solvents may be used alone or in combination of two or more.
- It is a mixed solution composed of two or more selected from methyl, 2-heptanone, cyclohexanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol methyl ether, and propylene glycol methyl ether acetate.
- a solvent having a low metal content it is preferable to use a solvent having a low metal content, and the metal content of the solvent is preferably 10 ppb or less, for example. If necessary, a ppt level solvent may be used, and such a high-purity solvent is provided by Toyo Gosei Co., Ltd., for example.
- Examples of methods for removing impurities such as metals from the solvent include distillation (molecular distillation, thin film distillation, etc.) and filtration using a filter.
- the filter pore diameter in filtration using a filter is preferably 10 nm or less, more preferably 5 nm or less, and still more preferably 3 nm or less.
- the filter material is preferably a polytetrafluoroethylene, polyethylene, or nylon filter.
- the solvent may contain isomers (compounds having the same number of atoms and different structures). Only one kind of isomer may be contained, or a plurality of isomers may be contained.
- the organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.
- the content of the solvent is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, and still more preferably 25 to 75% by mass with respect to the total amount of the composition.
- the composition may contain a polymerization inhibitor in order to prevent unwanted thermal polymerization of the curable compound during manufacture or storage of the composition.
- Polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4′-thiobis (3-methyl-6-tert-butylphenol), Examples include 2,2′-methylenebis (4-methyl-6-tert-butylphenol) and N-nitrosophenylhydroxyamine salts (ammonium salt, primary cerium salt, etc.). Of these, p-methoxyphenol is preferred.
- the content of the polymerization inhibitor is preferably 0.01 to 5% by mass with respect to the total solid content of the composition.
- the composition may contain various surfactants from the viewpoint of further improving coatability.
- various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used.
- the liquid properties (particularly fluidity) when prepared as a coating liquid can be further improved, and the uniformity of coating thickness and liquid saving can be further improved. it can. That is, in the case of forming a film using a coating liquid to which a composition containing a fluorosurfactant is applied, the interfacial tension between the coated surface and the coating liquid decreases, and the wettability to the coated surface is reduced. It improves and the applicability
- the fluorine content in the fluorosurfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass.
- a fluorine-based surfactant having a fluorine content within this range is effective in terms of uniformity of coating film thickness and liquid-saving properties, and has good solubility in the composition.
- fluorosurfactant examples include surfactants described in JP 2014-41318 A, paragraphs 0060 to 0064 (paragraph numbers 0060 to 0064 of the corresponding international publication WO 2014/17669), and the like. Examples include surfactants described in paragraphs 0117 to 0132 of JP2011-132503A, the contents of which are incorporated herein.
- fluorosurfactants include, for example, Megafac F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, F780, RS-72-K (above DIC Corporation), Florard FC430, FC431, FC171 (above, Sumitomo 3M Limited), Surflon S-382 SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC-383, S393, KH-40 (above, manufactured by Asahi Glass Co., Ltd.) PolyFox PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA), and the like.
- a block polymer can be used as the fluorosurfactant. Specific examples thereof include compounds described in JP-A-2011-89090.
- the fluorine-based surfactant has a repeating unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy group or propyleneoxy group) (meth).
- a fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used.
- the following compounds are also exemplified as the fluorosurfactant used in the present invention.
- the weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000.
- a fluoropolymer having an ethylenically unsaturated group in the side chain can also be used.
- Specific examples thereof include compounds described in JP-A 2010-164965, paragraph numbers 0050 to 0090 and 0289 to 0295, such as MegaFac RS-101, RS-102, RS-718K, RS-72- manufactured by DIC. K etc. are mentioned.
- the fluorine-based surfactant compounds described in paragraph numbers 0015 to 0158 of JP-A No. 2015-117327 can also be used.
- the fluorine-based surfactant has a molecular structure having a functional group containing a fluorine atom, and an acrylic compound in which the fluorine atom is volatilized by cleavage of the functional group containing the fluorine atom when heated is suitably used.
- a fluorosurfactant include Megafac DS series manufactured by DIC Corporation (Chemical Industry Daily, February 22, 2016) (Nikkei Sangyo Shimbun, February 23, 2016). -21, which can be used.
- nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and ethoxylates and propoxylates thereof (for example, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene Stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester (Pluronic L10, L31, L61, L62 manufactured by BASF, 10R5, 17R2, 25R2, Tetronic 304, 701, 704, 901, 904, 150R1) Solsperse 20000 (manufactured by Nippon Lubrizol Corporation), and the like. Also, NCW-101, NCW-1001, NCW-1002 manufactured by Wako Pure Chemical Industries, Ltd. can be used
- organosiloxane polymer KP341 manufactured by Shin-Etsu Chemical Co., Ltd.
- (meth) acrylic acid (co) polymer polyflow No. 75, no. 90, no. 95 manufactured by Kyoeisha Chemical Co., Ltd.
- W001 Yusho Co., Ltd.
- anionic surfactants include W004, W005, W017 (Yusho Co., Ltd.), Sandet BL (manufactured by Sanyo Kasei Co., Ltd.), and the like.
- silicone-based surfactants include Torre Silicone DC3PA, Torre Silicone SH7PA, Torre Silicone DC11PA, Torresilicone SH21PA, Torree Silicone SH28PA, Torree Silicone SH29PA, Torree Silicone SH30PA, Torree Silicone SH8400 (above, Toray Dow Corning Co., Ltd.) )), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4442 (above, manufactured by Momentive Performance Materials), KP341, KF6001, KF6002 (above, manufactured by Shin-Etsu Silicone Co., Ltd.) , BYK307, BYK323, BYK330 (above, manufactured by BYK Chemie) and the like.
- the content of the surfactant is preferably 0.001 to 2.0 mass%, more preferably 0.005 to 1.0 mass%, based on the total solid content of the composition.
- the composition may contain an ultraviolet absorber.
- the ultraviolet absorber is preferably a conjugated diene compound, and more preferably a compound represented by the following formula (1).
- R 1 and R 2 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and R 1 and R 2 may be the same or different from each other. However, they do not represent hydrogen atoms at the same time.
- R 3 and R 4 represent an electron withdrawing group.
- the electron-withdrawing group is preferably a group having a Hammett's substituent constant ⁇ p value (hereinafter simply referred to as “ ⁇ p value”) of 0.20 or more and 1.0 or less, and a ⁇ p value of 0.30 or more. A group of 0.8 or less is more preferable.
- R 3 and R 4 are preferably an acyl group, a carbamoyl group, an alkyloxycarbonyl group, an aryloxycarbonyl group, a cyano group, a nitro group, an alkylsulfonyl group, an arylsulfonyl group, a sulfonyloxy group, and a sulfamoyl group, particularly an acyl group.
- a carbamoyl group, an alkyloxycarbonyl group, an aryloxycarbonyl group, a cyano group, an alkylsulfonyl group, an arylsulfonyl group, a sulfonyloxy group, and a sulfamoyl group are preferred.
- the description of paragraph numbers 0148 to 0158 of JP 2010-049029 A can be referred to, and the contents thereof are incorporated in the present specification.
- the compound represented by the above formula (1) include compounds described in paragraph numbers 0160 to 0162 of JP 2010-049029 A, the contents of which are incorporated herein.
- an ultraviolet absorber As a commercial item of an ultraviolet absorber, UV503 (Daito Chemical Co., Ltd.) etc. are mentioned, for example.
- the content of the ultraviolet absorber is preferably from 0.01 to 10% by mass, more preferably from 0.01 to 5% by mass, based on the total solid content of the composition.
- the composition may include a dispersant, a sensitizer, a curing accelerator, a filler, a thermosetting accelerator, a thermal polymerization inhibitor, a plasticizer, an adhesion promoter, and other auxiliary agents (for example, conductive particles). , Fillers, antifoaming agents, flame retardants, leveling agents, peeling accelerators, antioxidants, fragrances, surface tension adjusting agents, chain transfer agents, and the like.
- auxiliary agents for example, conductive particles.
- the antioxidant examples include a phenol compound, a phosphite compound, and a thioether compound.
- a phenol compound having a molecular weight of 500 or more, a phosphite compound having a molecular weight of 500 or more, or a thioether compound having a molecular weight of 500 or more is more preferable. You may use these in mixture of 2 or more types.
- the phenol compound any phenol compound known as a phenol-based antioxidant can be used.
- Preferable phenolic compounds include hindered phenolic compounds.
- a compound having a substituent at a site (ortho position) adjacent to the phenolic hydroxyl group is preferable.
- a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferable.
- t-pentyl group hexyl group, octyl group, isooctyl group and 2-ethylhexyl group are more preferable.
- a compound (antioxidant) having a phenol group and a phosphite group in the same molecule is also preferred.
- phosphorus antioxidant can also be used suitably for antioxidant.
- phosphorus-based antioxidant tris [2-[[2,4,8,10-tetrakis (1,1-dimethylethyl) dibenzo [d, f] [1,3,2] dioxaphosphine-6 -Yl] oxy] ethyl] amine, tris [2-[(4,6,9,11-tetra-tert-butyldibenzo [d, f] [1,3,2] dioxaphosphin-2-yl And at least one compound selected from the group consisting of) oxy] ethyl] amine and ethyl bis (2,4-di-tert-butyl-6-methylphenyl) phosphite.
- the content of the antioxidant is preferably 0.01 to 20% by mass, and more preferably 0.3 to 15% by mass, based on the total solid content of the composition. Only one type of antioxidant may be used, or two or more types may be used. In the case of two or more types, the total amount is preferably within the above range.
- the composition can be prepared by mixing the aforementioned components.
- the components may be blended together, or the components may be blended sequentially after being dissolved and / or dispersed in a solvent.
- the composition may be prepared by dissolving and / or dispersing all of the components in a solvent at the same time, and if necessary, each component is suitably used as two or more solutions or dispersions at the time of use (at the time of application). ) May be prepared by mixing them.
- a filter for the purpose of removing foreign substances or reducing defects.
- a filter will not be specifically limited if it is conventionally used for the filtration use etc.
- fluororesin such as polytetrafluoroethylene (PTFE), polyamide resin such as nylon (eg nylon-6, nylon-6,6), polyolefin resin such as polyethylene and polypropylene (PP) (high density, ultra high molecular weight)
- PP polypropylene
- polypropylene including high density polypropylene
- nylon are preferable.
- the pore size of the filter is suitably about 0.01 to 7.0 ⁇ m, preferably about 0.01 to 3.0 ⁇ m, more preferably about 0.05 to 0.5 ⁇ m. By setting it within this range, it becomes possible to reliably remove fine foreign substances that can hinder the preparation of a uniform composition and the formation of a smooth film in the subsequent steps. Further, it is also preferable to use a fiber-like filter medium, and examples of the filter medium include polypropylene fiber, nylon fiber, glass fiber, and the like. Specifically, SBP type series (SBP008 etc.), TPR type series (TPR002) manufactured by Loki Techno Co., Ltd. , TPR005, etc.) and SHPX type series (SHPX003 etc.) filter cartridges can be used.
- the filtering by the first filter may be performed only once or may be performed twice or more.
- the pore diameter here can refer to the nominal value of the filter manufacturer.
- select from various filters provided by Nippon Pole Co., Ltd. DFA4201NXEY, etc.
- Advantech Toyo Co., Ltd. Japan Integris Co., Ltd. (former Nihon Microlith Co., Ltd.) can do.
- the second filter a filter formed of the same material as the first filter described above can be used.
- the filtering by the first filter may be performed only with the dispersion, and the second filtering may be performed after mixing other components.
- the viscosity (23 ° C.) of the composition is preferably in the range of 1 to 3000 mPa ⁇ s, for example, when a film is formed by coating.
- the lower limit is preferably 3 mPa ⁇ s or more, and more preferably 5 mPa ⁇ s or more.
- the upper limit is preferably 2000 mPa ⁇ s or less, and more preferably 1000 mPa ⁇ s or less.
- the composition of the present invention includes a near-infrared cut filter (for example, a near-infrared cut filter for a wafer level lens) on the light-receiving side of a solid-state image sensor, and a near-infrared cut on the back side (the side opposite to the light-receiving side) of the solid-state image sensor. It can also be used for filters and the like.
- the composition may be applied directly on an image sensor to form a coating film. Since the composition can be supplied in a coatable state, a near-infrared cut filter can be easily formed at a desired member or position of the solid-state imaging device. Further, the composition of the present invention may be applied to a glass substrate or a layer containing copper.
- compositions when a composition contains a chromatic colorant, it can also be used for pixel formation of a color filter.
- a pixel using the composition may be combined with a pixel selected from red, green, blue, magenta, yellow, cyan, black, and colorless to form a color filter.
- the film of the present invention is formed using the composition described above.
- the film of the present invention has excellent infrared shielding properties and visible transparency, and hardly causes spectral fluctuations (particularly, even when exposed to high-temperature and high-humidity environments). Can be preferably used. It can also be used as a heat ray shielding filter.
- the film may have a pattern, or may be a film without a pattern (flat film). Further, the membrane may be used in a state of being laminated on the support, or the membrane may be peeled off from the support.
- examples of the infrared transmission filter include a filter that blocks visible light and transmits light having a wavelength of 900 nm or more.
- the above-mentioned near-infrared absorbing compound A and a colorant that shields visible light preferably a colorant containing two or more chromatic colorants, or an organic black color
- a color material containing at least a colorant or a filter containing a layer of a color material that blocks visible light in addition to the layer containing the near-infrared absorbing compound A. It is preferable.
- the near-infrared absorption compound A When using a film
- the film thickness of the film of the present invention can be appropriately adjusted according to the purpose.
- the film thickness is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 5 ⁇ m or less.
- the lower limit of the film thickness is preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and further preferably 0.3 ⁇ m or more.
- the film of the present invention can also be used in combination with a color filter containing a chromatic colorant.
- a color filter can be manufactured using the coloring composition containing a chromatic colorant.
- the chromatic colorant include the chromatic colorant described in the above composition.
- the coloring composition can further contain a resin, a curable compound, a photopolymerization initiator, a surfactant, a solvent, a polymerization inhibitor, an ultraviolet absorber, and the like. About these details, the material demonstrated by the above-mentioned composition is mentioned. Moreover, it is good also as a filter provided with the function as a near-infrared cut filter and a color filter by making the film
- the laminate of the present invention has the near infrared cut filter of the present invention and a color filter containing a chromatic colorant.
- the near-infrared cut filter and the color filter may or may not be adjacent in the thickness direction.
- the near-infrared cut filter may be formed on a base material different from the base material on which the color filter is formed.
- Other members for example, a microlens, a flattening layer, etc. constituting the solid-state imaging device may be interposed between the color filter and the color filter.
- the near-infrared cut filter means a filter that transmits light having a wavelength in the visible light region (visible light) and shields at least part of light having a wavelength in the near-infrared region (near infrared light). .
- the near-infrared cut filter may transmit all light having a wavelength in the visible light region, and transmits light in a specific wavelength region out of light having a wavelength in the visible light region, and transmits light in a specific wavelength region. May be shielded from light.
- the color filter means a filter that allows light in a specific wavelength region to pass through and blocks light in a specific wavelength region out of light having a wavelength in the visible light region.
- the infrared transmission filter means a filter that blocks light having a wavelength in the visible region and transmits at least part of light having a wavelength in the near infrared region (near infrared).
- the film of the present invention when used as a near-infrared cut filter, in addition to the film of the present invention, it may further have a layer containing copper, a dielectric multilayer film, an ultraviolet absorbing layer, and the like.
- the near-infrared cut filter further has a layer containing copper and / or a dielectric multilayer film, a near-infrared cut filter having a wide viewing angle and excellent infrared shielding properties can be obtained.
- it can be set as the near-infrared cut filter excellent in ultraviolet-shielding property because a near-infrared cut filter has an ultraviolet absorption layer further.
- the ultraviolet absorbing layer for example, the absorbing layer described in paragraph Nos.
- the glass base material (copper containing glass base material) comprised with the glass containing copper and the layer (copper complex containing layer) containing a copper complex can also be used.
- the copper-containing glass substrate include a phosphate glass containing copper and a fluorophosphate glass containing copper.
- the copper complex is preferably a compound having a maximum absorption wavelength in a wavelength region of 700 to 1200 nm.
- the maximum absorption wavelength of the copper complex is more preferably in the wavelength region of 720 to 1200 nm, and still more preferably in the wavelength region of 800 to 1100 nm.
- Examples of the copper complex include the materials described in the other near infrared absorbing compounds described above.
- the film of the present invention when used as a near-infrared cut filter, the film preferably has a maximum absorption wavelength in the wavelength range of 650 to 1000 nm.
- the preferable range of visible transparency of the near-infrared cut filter is that the average transmittance at a wavelength of 400 to 550 nm is preferably 70% or more, more preferably 80% or more, still more preferably 85% or more, and 90% or more. Is particularly preferred.
- the transmittance in the entire range of wavelengths from 400 to 550 nm is preferably 70% or more, more preferably 80% or more, and further preferably 90% or more.
- the preferable range of the infrared shielding property of the near-infrared cut filter varies depending on the application, but the transmittance at at least one point in the wavelength range of 700 to 1000 nm is preferably 20% or less, more preferably 15% or less, 10% or less is more preferable.
- the infrared ray shielding property of the near-infrared cut filter is that the lowest transmittance value in the wavelength range of 700 to 800 nm is 20% or less. Is preferably 10% or less, more preferably 5% or less, and particularly preferably 1% or less.
- a near-infrared cut filter having such spectral characteristics has excellent infrared shielding properties in the wavelength range of 700 to 800 nm.
- the near-infrared cut filter having such spectral characteristics may be achieved only by the film of the present invention, or may be achieved by combining the film of the present invention and another layer.
- a preferable example is a combination of the film of the present invention and a layer containing copper.
- the preferred range of the infrared ray shielding property of the near-infrared cut filter is the average in the range of the maximum absorption wavelength ⁇ 25 nm of the near-infrared cut filter.
- the transmittance is preferably 20% or less, more preferably 15% or less, and even more preferably 10% or less. Such spectral characteristics may be achieved only by the film of the present invention, or may be achieved by combining the film of the present invention and other layers.
- the film of the present invention When used as an infrared transmission filter, it preferably has the following spectral characteristics (1). According to this aspect, it is possible to form a film that can transmit infrared rays with less visible light-derived noise.
- the maximum value of light transmittance in the thickness direction of the film in the wavelength range of 400 to 830 nm is 20% or less, and the minimum value of light transmittance in the thickness direction of the film in the wavelength range of 1000 to 1300 nm is 80%. % Or more.
- a film having such spectral characteristics can be preferably used as an infrared transmission filter that blocks light in the wavelength range of 400 to 750 nm and transmits light having a wavelength of 900 nm or more.
- the spectral characteristic of the film is a value obtained by measuring the transmittance in the wavelength range of 300 to 1300 nm using an ultraviolet-visible near-infrared spectrophotometer (U-4100, manufactured by Hitachi High-Technologies Corporation).
- the film of the present invention When the film of the present invention is used as a near infrared cut filter or an infrared transmission filter, it can be used in combination with a near infrared cut filter and an infrared transmission filter.
- a near-infrared cut filter and an infrared transmission filter By using a combination of a near-infrared cut filter and an infrared transmission filter, it can be preferably used for an infrared sensor that detects infrared rays having a specific wavelength.
- both filters are used in combination, both the near-infrared cut filter and the infrared transmission filter can be formed using the composition of the present invention, and only one of them is formed using the composition of the present invention. You can also.
- the film of the present invention can be used for various devices such as a solid-state imaging device such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor), an infrared sensor, and an image display device.
- a solid-state imaging device such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor), an infrared sensor, and an image display device.
- the film of the present invention includes a lens having a function of absorbing or cutting near infrared rays (a lens for a camera such as a digital camera, a mobile phone, an in-vehicle camera, an optical lens such as an f- ⁇ lens, a pickup lens) and a semiconductor light receiving element
- a lens having a function of absorbing or cutting near infrared rays a lens for a camera such as a digital camera, a mobile phone, an in-vehicle camera, an optical lens such as an f- ⁇ lens, a pickup lens
- Optical filters agricultural coatings for selective use of sunlight, recording media using near infrared absorption heat, near infrared filters for electronic devices and photographs, protective glasses, sunglasses, heat ray blocking filters Used for optical character reading recording, confidential document copy prevention, electrophotographic photosensitive member, laser welding, and the like. It is also useful as a noise cut filter for CCD cameras and a filter for CMOS image sensors.
- the pattern forming method of the present invention includes a step of forming a composition layer on a support using the composition of the present invention, and a step of forming a pattern on the composition layer by photolithography or dry etching. ,including.
- the film pattern formation and the color filter pattern formation may be performed separately. Moreover, you may form pattern with respect to the laminated body of the film
- the case where the film (near infrared cut filter) and the color filter are separately formed means the following mode.
- a pattern is formed on either the film (near infrared cut filter) or the color filter.
- the other filter layer is formed on the patterned filter layer. Subsequently, pattern formation is performed with respect to the filter layer which has not performed pattern formation.
- the pattern formation method may be a pattern formation method by photolithography or a pattern formation method by dry etching.
- a dry etching process is unnecessary, and thus the number of processes can be reduced.
- the composition of the present invention does not require a photolithographic function, so that it is possible to increase the concentration of a near-infrared absorber or the like.
- each filter layer may be performed only by a photolithography method or only by a dry etching method. .
- one filter layer may be patterned by photolithography, and the other filter layer may be patterned by dry etching.
- pattern formation is performed using both dry etching and photolithography, the first layer pattern is formed by dry etching, and the second and subsequent patterns are formed by photolithography. It is preferable.
- Pattern formation by the photolithography method includes a step of forming a composition layer on a support using each composition, a step of exposing the composition layer in a pattern, and developing and removing unexposed portions to form a pattern. It is preferable to include the process to do. If necessary, a step of baking the composition layer (pre-bake step) and a step of baking the developed pattern (post-bake step) may be provided.
- pattern formation by the dry etching method includes forming a composition layer on a support using each composition and curing to form a cured product layer, and forming a photoresist layer on the cured product layer.
- Step of Forming Composition Layer In the step of forming the composition layer, the composition layer is formed on the support using each composition.
- a solid-state image sensor substrate in which a solid-state image sensor (light receiving element) such as a CCD or CMOS is provided on a substrate (for example, a silicon substrate) can be used.
- the pattern may be formed on the solid-state image sensor formation surface side (front surface) of the solid-state image sensor substrate, or may be formed on the solid-state image sensor non-formation surface side (back surface).
- an undercoat layer may be provided on the support for improving adhesion with the upper layer, preventing diffusion of substances, or flattening the substrate surface.
- a known method can be used as a method for applying the composition to the support.
- a dropping method drop casting
- a slit coating method for example, a spray method; a roll coating method; a spin coating method (spin coating); a casting coating method; a slit and spin method; a pre-wet method (for example, JP 2009-145395 A).
- Methods described in the publication inkjet (for example, on-demand method, piezo method, thermal method), ejection printing such as nozzle jet, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing method, etc.
- Various printing methods transfer methods using a mold or the like; nanoimprint methods and the like.
- the application method by inkjet is not particularly limited as long as the composition can be ejected.
- it is shown in “Expanded and usable inkjet-unlimited possibilities seen in patents, published in February 2005, Sumibe Techno Research”. Described in Japanese Patent Publications (especially pages 115 to 133), JP2003-262716, JP2003-185831, JP2003-261627, JP2012-126830, JP2006-169325, etc. A method is mentioned.
- the composition layer formed on the support may be dried (prebaked).
- pre-baking may not be performed.
- the prebaking temperature is preferably 150 ° C. or lower, more preferably 120 ° C. or lower, and even more preferably 110 ° C. or lower.
- the lower limit may be 50 ° C. or higher, and may be 80 ° C. or higher.
- the prebake time is preferably 10 seconds to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Drying can be performed with a hot plate, oven, or the like.
- Exposure process When forming a pattern by photolithography, ⁇ Exposure process >> Next, the composition layer is exposed in a pattern (exposure process). For example, pattern exposure can be performed by exposing the composition layer through a mask having a predetermined mask pattern using an exposure apparatus such as a stepper. Thereby, an exposed part can be hardened.
- the radiation light beam
- ultraviolet rays such as g-line and i-line are preferable (particularly preferably i-line).
- Irradiation dose (exposure dose) for example, preferably 0.03 ⁇ 2.5J / cm 2, more preferably 0.05 ⁇ 1.0J / cm 2, most preferably 0.08 ⁇ 0.5J / cm 2 .
- the oxygen concentration at the time of exposure can be appropriately selected.
- the exposure illuminance can be set as appropriate, and can usually be selected from the range of 1000 W / m 2 to 100,000 W / m 2 (for example, 5000 W / m 2 , 15000 W / m 2 , 35000 W / m 2 ). .
- Oxygen concentration and exposure illuminance may appropriately combined conditions, for example, illuminance 10000 W / m 2 at an oxygen concentration of 10 vol%, oxygen concentration of 35 vol% can be such illuminance 20000W / m 2.
- the unexposed portion is developed and removed to form a pattern.
- the development removal of the unexposed portion can be performed using a developer.
- the composition layer of the unexposed part in an exposure process elutes in a developing solution, and only the photocured part remains.
- the developer an organic alkali developer that does not damage the underlying solid-state imaging device or circuit is desirable.
- the temperature of the developer is preferably 20 to 30 ° C., for example.
- the development time is preferably 20 to 180 seconds.
- the process of shaking off the developer every 60 seconds and supplying a new developer may be repeated several times.
- alkaline agent used in the developer examples include ammonia water, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, benzyltrimethylammonium hydroxide.
- organic alkaline compounds such as choline, pyrrole, piperidine and 1,8-diazabicyclo [5.4.0] -7-undecene.
- the inorganic alkali for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium hydrogen carbonate, sodium silicate, sodium metasilicate and the like are preferable.
- a surfactant may be used for the developer. Examples of the surfactant include the surfactant described in the above-described composition, and a nonionic surfactant is preferable.
- the developer may be once produced as a concentrated solution from the viewpoint of convenience of transportation and storage, and diluted to a necessary magnification at the time of use.
- the dilution factor is not particularly limited, but can be set, for example, in the range of 1.5 to 100 times.
- clean (rinse) with a pure water after image development.
- Post-baking is a heat treatment after development for complete film curing.
- the post-baking temperature is preferably 100 to 240 ° C., for example. From the viewpoint of film curing, 200 to 230 ° C. is more preferable.
- the post-bake temperature is preferably 150 ° C. or lower, more preferably 120 ° C. or lower. Preferably, it is 100 ° C. or less, and particularly preferably 90 ° C. or less.
- the lower limit can be, for example, 50 ° C. or higher.
- Post-baking can be carried out continuously or batchwise using a heating means such as a hot plate, a convection oven (hot air circulation dryer), a high-frequency heater, etc., so that the film after development is in the above-mentioned condition. . Further, when a pattern is formed by a low temperature process, post baking is not necessary.
- the pattern formation by the dry etching method is performed by curing the composition layer formed on the support to form a cured product layer, and then forming a patterned photoresist layer on the obtained cured product layer, Using the photoresist layer as a mask, the cured product layer can be etched using an etching gas.
- the photoresist layer is preferably formed by applying a positive or negative radiation-sensitive composition on the cured product layer and drying it.
- a mode in which heat treatment after exposure and heat treatment after development (post-bake treatment) are desirable.
- pattern formation by the dry etching method the description of paragraph numbers 0010 to 0067 of JP2013-064993A can be referred to, and the contents thereof are incorporated in the present specification.
- the solid-state imaging device of the present invention has the above-described film of the present invention.
- the configuration of the solid-state imaging device is a configuration having the film of the present invention (near infrared cut filter), and is not particularly limited as long as the configuration functions as a solid-state imaging device. .
- the device On the support, there are a plurality of photodiodes that constitute the light receiving area of the solid-state imaging device, and transfer electrodes made of polysilicon, etc., and light shielding made of tungsten or the like that opens only the light receiving part of the photodiodes on the photodiodes and transfer electrodes.
- the device has a device protective film made of silicon nitride or the like formed so as to cover the entire surface of the light shielding film and the photodiode light receiving portion on the light shielding film, and the film of the present invention is formed on the device protective film. is there.
- the color filter may have a structure in which a cured film that forms each color pixel is embedded in a space partitioned by a partition, for example, in a lattice shape.
- the partition in this case preferably has a low refractive index for each color pixel. Examples of the image pickup apparatus having such a structure include apparatuses described in JP 2012-227478 A and JP 2014-179577 A.
- the film of the present invention can also be used for image display devices such as liquid crystal display devices and organic electroluminescence (organic EL) display devices.
- image display devices such as liquid crystal display devices and organic electroluminescence (organic EL) display devices.
- organic EL organic electroluminescence
- each colored pixel for example, red, green, blue
- the infrared light contained in the backlight of the display device for example, white light emitting diode (white LED)
- white LED white light emitting diode
- It can be used for the purpose of forming an infrared pixel in addition to each colored display pixel.
- display devices For the definition of display devices and details of each display device, refer to, for example, “Electronic Display Device (Akio Sasaki, Kogyo Kenkyukai, 1990)”, “Display Device (Junsho Ibuki, Industrial Books Co., Ltd.) Issued in the first year).
- the liquid crystal display device is described, for example, in “Next-generation liquid crystal display technology (edited by Tatsuo Uchida, Industrial Research Co., Ltd., published in 1994)”.
- the liquid crystal display device to which the present invention can be applied is not particularly limited, and can be applied to, for example, various types of liquid crystal display devices described in the “next generation liquid crystal display technology”.
- the image display device may have a white organic EL element.
- the white organic EL element preferably has a tandem structure.
- JP 2003-45676 A supervised by Akiyoshi Mikami, “Frontier of Organic EL Technology Development-High Brightness, High Precision, Long Life, Know-how Collection”, Technical Information Association, 326-328 pages, 2008, etc.
- the spectrum of white light emitted from the organic EL element preferably has a strong maximum emission peak in the blue region (430 nm to 485 nm), the green region (530 nm to 580 nm) and the yellow region (580 nm to 620 nm). In addition to these emission peaks, those having a maximum emission peak in the red region (650 nm to 700 nm) are more preferable.
- the infrared sensor of the present invention has the above-described film of the present invention.
- the configuration of the infrared sensor is not particularly limited as long as it has the film of the present invention and functions as an infrared sensor.
- reference numeral 110 denotes a solid-state image sensor.
- the imaging region provided on the solid-state imaging device 110 includes a near infrared cut filter 111 and an infrared transmission filter 114.
- a color filter 112 is laminated on the near infrared cut filter 111.
- a micro lens 115 is disposed on the incident light h ⁇ side of the color filter 112 and the infrared transmission filter 114.
- a planarization layer 116 is formed so as to cover the microlens 115.
- the characteristics of the near-infrared cut filter 111 are selected according to the emission wavelength of an infrared light-emitting diode (infrared LED) described later.
- the near-infrared cut filter 111 transmits visible light (for example, light having a wavelength of 400 to 700 nm) and blocks light having a wavelength exceeding 850 nm.
- the emission wavelength of the infrared LED is 940 nm
- the near-infrared cut filter 111 transmits visible light (for example, light having a wavelength of 400 to 700 nm) and blocks light having a wavelength exceeding 940 nm. It is preferable that
- the color filter 112 is a color filter in which pixels that transmit and absorb light of a specific wavelength in the visible region are formed, and is not particularly limited, and a conventionally known color filter for pixel formation can be used.
- a color filter in which red (R), green (G), and blue (B) pixels are formed is used.
- R red
- G green
- B blue
- the description in paragraphs 0214 to 0263 of JP 2014-043556 A can be referred to, and the contents thereof are incorporated in the present specification.
- the characteristics of the infrared transmission filter 114 are selected according to the emission wavelength of an infrared LED to be described later.
- the infrared transmission filter 114 preferably has a maximum light transmittance of 30% or less in the thickness direction of the film in the wavelength range of 400 to 650 nm, 20% More preferably, it is more preferably 10% or less, and particularly preferably 0.1% or less.
- This transmittance preferably satisfies the above conditions throughout the wavelength range of 400 to 650 nm.
- the maximum value of light transmittance in the wavelength range of 400 to 650 nm is usually 0.1% or more.
- the minimum value of the light transmittance in the thickness direction of the film in the wavelength range of 800 nm or more is preferably 70% or more, more preferably 80% or more, More preferably, it is 90% or more.
- This transmittance preferably satisfies the above condition in a part of the wavelength range of 800 nm or more, and preferably satisfies the above condition at a wavelength corresponding to the emission wavelength of the infrared LED.
- the minimum value of light transmittance in the wavelength range of 900 to 1300 nm is usually 99.9% or less.
- the film thickness of the infrared transmission filter 114 is preferably 100 ⁇ m or less, more preferably 15 ⁇ m or less, further preferably 5 ⁇ m or less, and particularly preferably 1 ⁇ m or less.
- the lower limit is preferably 0.1 ⁇ m.
- a method for measuring the spectral characteristics, film thickness, etc. of the infrared transmission filter 114 is shown below.
- the film thickness was measured using a stylus type surface shape measuring instrument (DEKTAK150 manufactured by ULVAC) for the dried substrate having the film.
- the spectral characteristic of the film is a value obtained by measuring the transmittance in the wavelength range of 300 to 1300 nm using an ultraviolet-visible near-infrared spectrophotometer (U-4100, manufactured by Hitachi High-Technologies Corporation).
- the infrared transmission filter 114 having the spectral characteristics described above can be formed using a composition containing a colorant that blocks visible light.
- the details of the color material that blocks visible light are the same as those described in the above-described composition.
- the infrared transmission filter 114 has a maximum light transmittance of 20% or less in the film thickness direction in the wavelength range of 450 to 650 nm and a wavelength of 835 nm.
- the light transmittance in the thickness direction of the film is preferably 20% or less, and the minimum value of the light transmittance in the thickness direction of the film in the wavelength range of 1000 to 1300 nm is preferably 70% or more.
- the infrared transmission filter 114 having the spectral characteristics described above can be manufactured using a composition containing a colorant that blocks visible light and a near-infrared compound having an absorption maximum in the wavelength range of 750 to 950 nm.
- the details of the color material that blocks visible light are the same as those described in the above-described composition.
- a near-infrared compound the near-infrared compound demonstrated with the composition mentioned above is mentioned.
- the patterns of the near-infrared cut filter, color filter, and infrared transmission filter used in the infrared sensor shown in FIG. 1 can be formed as follows, for example.
- a near-infrared absorbing composition layer is formed on a support 151 by applying a composition for forming a near-infrared cut filter (near-infrared absorbing composition).
- the near-infrared absorbing composition layer is patterned.
- the pattern forming method may be either a photolithography method or a dry etching method. 2 and 3, the near-infrared absorbing composition layer forms a Bayer (lattice) pattern, but the shape of the pattern can be appropriately selected depending on the application.
- a color filter forming composition (colored composition) is applied on the Bayer pattern (near infrared cut filter 111) of the near-infrared absorbing composition layer to form a colored composition layer.
- the colored composition layer is patterned, and the Bayer pattern (color filter) of the colored composition layer is formed on the Bayer pattern (near infrared cut filter 111) of the near infrared absorbing composition layer. 112).
- the pattern forming method may be either photolithography or dry etching, but photolithography is preferred.
- a composition layer is formed on the film on which the color filter 112 is formed by applying a composition for forming an infrared transmission filter.
- the pattern of the composition layer is formed, and the pattern of the infrared transmission filter 114 is formed in the portion where the Bayer pattern of the near infrared cut filter 111 is missing.
- the color filter 112 is provided on the incident light h ⁇ side from the near-infrared cut filter 111, but the order of the near-infrared cut filter 111 and the color filter 112 is changed,
- the near-infrared cut filter 111 may be provided closer to the incident light h ⁇ than the color filter 112.
- the infrared transmission filter 114 is a single-layer film, but may be composed of two or more layers.
- the near-infrared cut filter 111 and the color filter 112 are stacked adjacent to each other. However, both filters are not necessarily adjacent to each other, and the support on which the color filter 112 is formed is provided.
- Near-infrared cut filter 111 may be formed on a support different from the above. If the said support body is a transparent base material, all can be used preferably. Moreover, the transparent base material containing copper, the base material which has a transparent layer containing copper, and the base material in which the band pass filter was formed can also be used. In addition, when the near infrared cut filter 111 has a function as a color filter, in addition to the near infrared absorbing compound, the near infrared cut filter 111 further includes a chromatic colorant. As described above, the color filter 112 may be omitted. In FIG. 8, reference numeral 111a is a near-infrared cut filter containing a chromatic colorant, and is a near-infrared cut filter having a color filter function.
- the reaction solution was poured into 1000 parts by mass of water, 100 parts by mass of acetic acid was added, and the precipitate was collected by filtration and washed with hexane. The crystals were blown and dried at 50 ° C. to obtain 39 parts by mass of Intermediate A. 39 parts by mass of Intermediate A, 50 parts by mass of trifluoroacetic acid, and 300 parts by mass of chloroform were placed in a flask and stirred at 60 ° C. for 1 hour. After the reaction, an aqueous sodium carbonate solution was added, and the organic phase was taken out by a liquid separation operation. The organic phase was washed with a saturated aqueous sodium chloride solution, and then the solvent was distilled off under reduced pressure to obtain a pale yellow solid.
- the resulting pale yellow solid was purified by silica column chromatography (hexane / chloroform solvent) to obtain 13 parts by mass of intermediate a-1.
- 21.6 parts by mass of isooctadecanol (Fine Oxocol 180, manufactured by Nissan Chemical Industries, Ltd.) and 80 parts by mass of triethylamine were stirred in 80 parts by mass of toluene, and 10 parts by mass of methanesulfonyl chloride was added dropwise at -10 ° C. .
- the reaction was carried out at 30 ° C. for 2 hours.
- the organic phase was removed by a liquid separation operation, and the solvent was distilled off under reduced pressure.
- the obtained crystals were blown and dried at 40 ° C. for 12 hours to obtain 13 parts by mass of Compound C.
- 10.5 parts by mass of titanium chloride was added and stirred at 35 ° C. for 30 minutes.
- 9 parts by mass of Compound C was added, and the mixture was further stirred for 2 hours under heating and refluxing conditions.
- the mixture was cooled to room temperature, 100 parts by mass of methanol was added, and the mixture was further stirred for 30 minutes.
- the precipitated crystals were collected by filtration and purified by silica column chromatography (chloroform solvent) to obtain 8.8 parts by mass of Compound II-186.
- Synthesis Example 3 Synthesis of Compound II-408
- Compound D was synthesized using intermediate a-2 synthesized in the same manner as intermediate a-1. After adding 20 parts by mass of Compound D to 200 parts by mass of toluene containing 10 parts by mass of 2-chloro-1,3,2-benzodioxaborole, 11 parts by mass of diisopropylethylamine was added, and the mixture was added at 100 ° C. Stir for 1 hour. After cooling to room temperature, 400 parts by mass of methanol was added, and the mixture was further stirred for 30 minutes. The precipitated crystals were collected by filtration and purified by silica column chromatography (chloroform solvent) to obtain 13 parts by mass of Compound II-408.
- the precipitated crystals were separated by filtration and washed with 400 parts by mass of methanol. The obtained crystal was blown and dried at 50 ° C. for 12 hours to obtain 3.1 parts by mass of Compound I.
- 3.1 parts by mass of titanium chloride was added to 20 parts by mass of toluene containing 2.2 parts by mass of 2-aminoethyl diphenylborate and stirred at 35 ° C. for 30 minutes.
- 1.7 parts by mass of Compound I was added, and the mixture was further stirred under heating under reflux conditions for 3 hours. The mixture was cooled to room temperature, 40 parts by mass of methanol was added, and the mixture was further stirred for 30 minutes.
- the obtained copper complex-containing composition 1 was applied on a glass wafer using a spin coater so that the film thickness after drying was 100 ⁇ m, and heat-treated for 3 hours using a 150 ° C. hot plate, A layer containing copper was prepared.
- composition (Preparation of composition) The following composition was mixed and stirred, and then filtered through a nylon filter (manufactured by Nippon Pole Co., Ltd.) having a pore size of 0.45 ⁇ m to prepare a composition.
- Curable compound 1 (dipentaerythritol hexaacrylate (product name: KAYARAD DPHA) manufactured by Nippon Kayaku Co., Ltd.) ... 1.28 parts photopolymerization initiator (IRGACURE-OXE02, manufactured by BASF) ... 1 .40 parts
- Surfactant 1 (Megafac RS-72-K (manufactured by DIC, 30% propylene glycol monomethyl ether acetate solution)) 1.59 parts cyclohexanone 86.3 parts
- ⁇ Composition 3> First near-infrared absorbing compound (compound shown in the table below) ... 0.96 parts Second near-infrared absorbing compound (compound shown in the table below) ... 0.96 parts Resin 5 (shown below) Resin of structure (ratio in structural units is molar ratio), Mw 18,000)... 12.9 parts Acid catalyst (phosphoric acid) ... 2.5 parts Surfactant 2 ... 0.04 parts cyclohexanone ... 58.9 parts propylene glycol monomethyl ether acetate ... 22. 9 copies
- ⁇ Composition 4> First near-infrared absorbing compound (compound shown in the table below) ... 0.96 parts Second near-infrared absorbing compound (compound shown in the table below) ... 0.96 parts Resin 6: Poly Hydroxystyrene (manufactured by Sigma Aldrich, Mw 10,000) ... 12.9 parts curable compound 3: 1,3,4,6-tetramethoxymethylglycoluril (manufactured by Tokyo Chemical Industry) ... 12.9 parts acid generator 2 (triethylammonium nonaflate) 2.5 parts surfactant 3 (FC-4430, manufactured by Sumitomo 3M) 0.04 parts cyclohexanone .... 49.6 parts propylene glycol monomethyl ether acetate ... 19.3 parts
- Comparative Example 1-1 the content of the first near-infrared absorbing compound was 1.92 parts.
- Comparative Example 1-2 the content of the first near-infrared absorbing compound was 3.84 parts.
- Example 1-19 The composition of Example 1-19 was applied onto the copper-containing layer using a spin coater so that the film thickness after drying was 0.8 ⁇ m, and 120 ° C. using a hot plate at 100 ° C. Heat treatment (pre-baking) was performed for 2 seconds to produce a near-infrared cut filter.
- Infrared shielding evaluation >> The transmittance of the near-infrared cut filter at a wavelength of 700 nm to 800 nm was measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation). Infrared shielding was evaluated according to the following criteria. The results are shown in the table below.
- A The lowest transmittance at a wavelength of 700 to 800 nm ⁇ 1%
- B 1% ⁇ lowest transmittance at wavelength 700 to 800 nm ⁇ 5%
- C 5% ⁇ lowest transmittance at wavelength 700 to 800 nm ⁇ 10%
- D 10% ⁇ lowest transmittance at wavelength 700 to 800 nm ⁇ 20%
- E 20% ⁇ lowest transmittance at a wavelength of 700 to 800 nm
- ⁇ Spectral variability evaluation >> The near-infrared cut filter was left for 1 hour in a high-temperature and high-humidity environment at 85 ° C. and a relative humidity of 85%. Before and after the moisture resistance test, the maximum absorbance (Abs ⁇ max) at a wavelength of 700 to 1400 nm and the minimum absorbance (Abs ⁇ min) at a wavelength of 400 to 700 nm of the near-infrared cut filter were measured with a spectrophotometer U-4100. (Abstract of Hitachi High-Technologies) was used to determine the absorbance ratio represented by “Abs ⁇ max / Abs ⁇ min”.
- Absorbance ratio change rate represented by
- ⁇ light resistance >> The near-infrared cut filter was irradiated with a xenon lamp at 50,000 lux for 20 hours (equivalent to 1 million lux ⁇ h), and then the ⁇ Eab value of the color difference before and after the light resistance test was measured. It shows that light resistance is so favorable that (DELTA) Eab value is small.
- the results are shown in the table below.
- the ⁇ Eab value is a value obtained from the following color difference formula based on the CIE 1976 (L *, a *, b *) space color system (Japanese Color Society edited by New Color Science Handbook (Showa 60) p.266). .
- ⁇ Eab ⁇ ( ⁇ L *) 2 + ( ⁇ a *) 2 + ( ⁇ b *) 2 ⁇ 1/2
- the examples were excellent in spectral variability, infrared shielding and visible transparency. Moreover, the light resistance was especially excellent in the Example which uses the pyrrolopyrrole compound as a 1st near-infrared absorption compound. On the other hand, in the comparative example, at least one of spectral variability and infrared shielding was inferior to the examples.
- the same effects as in the examples can be obtained. Further, in the examples, even if a film is formed on the phosphate glass containing copper or the fluorophosphate glass containing copper instead of the copper-containing layer using the composition of the example, the example The same effect can be obtained. Moreover, even if a film was formed using the above-mentioned composition on a glass substrate using a composition further blended with the copper complex used for forming the copper-containing layer in the composition of the example, it was carried out. The same effect as the example can be obtained.
- the same effect as in the example can be obtained by forming a layer using the composition of the example on the glass substrate and forming the above-described copper-containing layer on the obtained layer.
- membrane is formed using the composition of an Example on the single side
- (Copper complex-containing composition 2) 28.9 parts by mass of tetraethoxysilane, 28.9 parts by mass of phenyltriethoxysilane, and 30.6 parts by mass of 10% by mass hydrochloric acid were mixed at room temperature for 4 hours to obtain a sol.
- a solution prepared by dissolving 26.0 parts by mass of copper complex 1 in 85.5 parts by mass of cyclopentanone at room temperature over 20 minutes was added to the sol, and a nylon filter having a pore diameter of 0.45 ⁇ m (Japan)
- the copper complex containing composition 2 was prepared by filtering with Pall Co., Ltd.
- the film of the composition containing cesium tungsten oxide is formed on the film of the composition of the example by the following method, the same effect as the example can be obtained.
- the following cesium tungsten oxide containing composition was apply
- composition containing cesium tungsten oxide 49.84 parts by mass of YMS-01A-2 (manufactured by Sumitomo Metal Mining Co., Ltd .: cesium tungsten oxide particle dispersion), 39.5 parts by mass of the following resin (solid content 40% PGMEA solution), and KAYARAD DPHA (Japan) 6.80 parts by mass of Kayaku), 2.18 parts by mass of IRGACURE 369 (manufactured by BASF) and 1.68 parts by mass of PGMEA were mixed and stirred to prepare a cesium tungsten oxide-containing composition.
- Example 1-32 Even if a near-infrared cut filter composed of two layers of films was formed by the following method, the same effect as in Example 1-30 was obtained.
- the composition of composition 6 was applied onto the copper-containing layer using a spin coater so that the film thickness after drying was 0.8 ⁇ m, and heat-treated for 120 seconds using a 100 ° C. hot plate. (Pre-baking) was performed. Next, the entire surface was exposed at 1000 mJ / cm 2 using an i-line stepper. Subsequently, post-heating (post-baking) was performed at 200 ° C. for 300 seconds to produce a first near-infrared cut filter layer.
- composition 7 was applied onto the first near-infrared cut filter layer using a spin coater so that the film thickness after drying was 0.8 ⁇ m, and a hot plate at 100 ° C. was applied. Heat treatment (pre-baking) was performed for 120 seconds using it. Next, the entire surface was exposed at 1000 mJ / cm 2 using an i-line stepper. Next, post-heating (post-baking) was performed at 200 ° C. for 300 seconds to produce a two-layer near-infrared cut filter.
- Example 1-33 Even when a near-infrared cut filter composed of two layers of films was formed by the following method, the same effect as in Example 1-31 was obtained.
- the composition of composition 8 was applied onto the copper-containing layer using a spin coater so that the film thickness after drying was 0.8 ⁇ m, and heat-treated for 120 seconds using a hot plate at 100 ° C. (Pre-baking) was performed. Next, the entire surface was exposed at 1000 mJ / cm 2 using an i-line stepper. Subsequently, post-heating (post-baking) was performed at 200 ° C. for 300 seconds to produce a first near-infrared cut filter layer.
- composition of composition 9 was applied onto the first near-infrared cut filter layer using a spin coater so that the film thickness after drying was 0.8 ⁇ m, and a hot plate at 100 ° C. was applied.
- Heat treatment was performed for 120 seconds using it.
- the entire surface was exposed at 1000 mJ / cm 2 using an i-line stepper.
- post-heating was performed at 200 ° C. for 300 seconds to produce a two-layer near-infrared cut filter.
- composition First near-infrared absorbing compound (compound shown in the table) ... 2.38 parts Second near-infrared absorbing compound (compound shown in the table) ...
- Resin 1 shown in the table, Resin 2 or Resin 3 (resins shown in the following table): 6.86 parts
- Resin 2 ARTON F4520 (manufactured by JSR Corporation)
- the compound was synthesized by the method described in paragraph Nos. 0247 to 0249 of JP2012-198408A. Curable compound (dipentaerythritol hexaacrylate (product name: KAYADAD DPHA) manufactured by Nippon Kayaku Co., Ltd.) ...
- Photopolymerization initiator (the following compound) ... 1.55 parts
- Surfactant (Megafac RS-72-K (manufactured by DIC, 30% propylene glycol monomethyl ether acetate solution)) 2.71 parts polymerization inhibitor (p-methoxyphenol) 001 parts cyclopentanone: 84.11 parts
- Example 2-21 using three dyes used 1.12 parts of II-507 as the first near infrared absorbing compound, and II-43 and II-589 as the second near infrared absorbing compound. In a mass ratio, 1.12 parts were used.
- Example 2-23 using three kinds of dyes 1.12 parts of II-673 were used as the first near infrared absorbing compound, and II-507 and II-43 were used as the second near infrared absorbing compound. 1.12 parts were used.
- Example 2-34 did not contain a photopolymerization initiator.
- Comparative Example 2-1 the content of the first near-infrared absorbing compound was 2.38 parts.
- Comparative Example 2-2 the content of the first near-infrared absorbing compound was 4.0 parts.
- Example 2-39 17.6 parts of the pigment dispersion prepared as follows was used as the first near-infrared absorbing compound. -Preparation of pigment dispersion. Using a zirconia bead having a diameter of 0.3 mm, a mixed liquid having the following composition was averaged in a pyrrolopyrrole compound with a bead mill (high-pressure disperser NANO-3000-10 with a decompression mechanism (manufactured by Nippon BEE Co., Ltd.)). A pigment dispersion was prepared by mixing and dispersing until the (secondary particles) became 75 nm or less.
- the average particle size of the pigment in the pigment dispersion was measured on a volume basis using MICROTRACUPA 150 manufactured by Nikkiso Co., Ltd. ⁇ Pyrrolopyrrole compound (II-524) ⁇ ⁇ ⁇ 13.5 parts by mass ⁇ Resin (Disperbyk-111 (by BYK Chemie)) ⁇ ⁇ ⁇ 4 parts by mass ⁇ Propylene glycol monomethyl ether acetate (PGMEA) ⁇ ⁇ ⁇ 82.5 Parts by mass
- Example 2-34 The composition of Example 2-34 was applied on a glass substrate (Corning Corporation 1737) using a spin coater so that the film thickness after drying was 1.0 ⁇ m, and using a hot plate at 100 ° C. A heat treatment (pre-baking) was performed for 120 seconds to produce a near-infrared cut filter.
- Infrared shielding evaluation >> The transmittance of the near-infrared cut filter was measured using a spectrophotometer U-4100 (manufactured by Hitachi High-Technologies Corporation). Infrared shielding was evaluated according to the following criteria. The results are shown in the table below.
- C 15% ⁇ average transmittance in the range of maximum absorption wavelength ⁇ max ⁇ 25 nm ⁇
- D Average transmittance in the range of 20% ⁇ maximum absorption wavelength ⁇ max ⁇ 25 nm
- ⁇ Spectral variability evaluation >> The near-infrared cut filter was left for 1 hour in a high-temperature and high-humidity environment at 85 ° C. and a relative humidity of 85%. Before and after the moisture resistance test, the maximum absorbance (Abs ⁇ max) at a wavelength of 700 to 1400 nm and the minimum absorbance (Abs ⁇ min) at a wavelength of 400 to 700 nm of the near-infrared cut filter were measured with a spectrophotometer U-4100. (Abstract of Hitachi High-Technologies) was used to determine the absorbance ratio represented by “Abs ⁇ max / Abs ⁇ min”.
- ⁇ light resistance >> The near-infrared cut filter was irradiated with a xenon lamp at 50,000 lux for 20 hours (equivalent to 1 million lux ⁇ h), and then the ⁇ Eab value of the color difference before and after the light resistance test was measured. A smaller ⁇ Eab value indicates better light resistance. The results are shown in the table below.
- the ⁇ Eab value is a value obtained from the following color difference formula based on the CIE 1976 (L *, a *, b *) space color system (Japanese Color Society edited by New Color Science Handbook (Showa 60) p.266). .
- ⁇ Eab ⁇ ( ⁇ L *) 2 + ( ⁇ a *) 2 + ( ⁇ b *) 2 ⁇ 1/2
- the examples were excellent in spectral variability, infrared shielding and visible transparency. Moreover, the light resistance was especially excellent in the Example which uses the pyrrolopyrrole compound as a 1st near-infrared absorption compound. On the other hand, in the comparative example, at least one of spectral variability and infrared shielding was inferior to the examples.
- a filter with excellent spectral variability can be obtained by further blending a chromatic colorant with good transmittance and infrared shielding properties other than specific visible light.
- a laminated film obtained by combining a dielectric multilayer film and a film obtained from the compositions of Examples 2-1 to 2-39 can also provide a preferable effect.
- an infrared transmission filter having excellent spectral variability can be obtained by further blending a colorant that blocks visible light.
- Examples 2-1 to 2-39 a curable compound (dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., product name: KAYARAD DPHA)) was converted into diglycerin EO (ethylene oxide) -modified (meth) acrylate (manufactured by Toagosei Co., Ltd.). The same effect can be obtained even if the product name is changed to M-460).
- composition 10 The following composition was mixed and stirred, and then filtered through a nylon filter (manufactured by Nippon Pole Co., Ltd.) having a pore size of 0.45 ⁇ m to prepare a composition.
- First near-infrared absorbing compound compound shown in the table
- Second near-infrared absorbing compound compound shown in the table
- 0.98 parts Resin 1, Resin 2 or Resin 3 ⁇ 7.52 parts curable compound (dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., product name KAYARAD DPHA)) ⁇ 1.41 parts photopolymerization initiator (the following compound) ) ...
- Example 3 The composition of Example 2-5 or Example 2-26 was applied onto a silicon wafer by spin coating so that the film thickness after film formation was 1.0 ⁇ m. Then, it heated at 100 degreeC for 2 minute (s) using the hotplate. Subsequently, it heated at 200 degreeC for 5 minute (s) using the hotplate. Next, a 2 ⁇ m Bayer pattern (near infrared cut filter) was formed by dry etching. Next, the Red composition was applied onto the Bayer pattern of the near-infrared cut filter by spin coating so that the film thickness after film formation was 1.0 ⁇ m. Subsequently, it heated at 100 degreeC for 2 minute (s) using the hotplate.
- a 2 ⁇ m dot pattern was exposed through a mask at 1000 mJ / cm 2 .
- paddle development was performed at 23 ° C. for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH).
- TMAH tetramethylammonium hydroxide
- the Red composition was patterned on the Bayer pattern of the near-infrared cut filter by heating at 200 ° C. for 5 minutes using a hot plate.
- the Green composition and the Blue composition were sequentially patterned to form red, blue and green coloring patterns.
- an infrared transmission filter forming composition (Composition 100 or Composition 101) was applied on the patterned film by spin coating so that the film thickness after film formation was 2.0 ⁇ m. Subsequently, it heated at 100 degreeC for 2 minute (s) using the hotplate. Next, using an i-line stepper exposure apparatus FPA-3000i5 + (manufactured by Canon Inc.), a 2 ⁇ m Bayer pattern was exposed through a mask at 1000 mJ / cm 2 . Subsequently, paddle development was performed at 23 ° C. for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH). Then, it rinsed with the spin shower and further washed with pure water.
- TMAH tetramethylammonium hydroxide
- the infrared transmission filter was patterned in the portion where the Bayer pattern of the near infrared cut filter was removed by heating at 200 ° C. for 5 minutes using a hot plate. This was incorporated into a solid-state imaging device according to a known method. The obtained solid-state imaging device had good incident angle dependency. Furthermore, the recognition evaluation was also good.
- a near-infrared cut filter was produced using the composition of Example 2-5, an infrared transmission filter forming composition having the composition 100 was used.
- a near-infrared cut filter was produced using the composition of Example 2-26, the composition for forming an infrared transmission filter having the composition 101 was used.
- the Red composition, Green composition, Blue composition, and infrared transmission filter forming composition used in Test Example 3 are as follows.
- Red composition The following components were mixed and stirred, and then filtered through a nylon filter (manufactured by Nippon Pole Co., Ltd.) having a pore size of 0.45 ⁇ m to prepare a Red composition.
- Green composition The following components were mixed and stirred, and then filtered through a nylon filter (manufactured by Nippon Pole Co., Ltd.) having a pore size of 0.45 ⁇ m to prepare a Green composition.
- Green pigment dispersion ... 73.7 parts by mass Resin 4 (40% PGMEA solution) ... 0.3 parts by mass Curable compound 1 ... 1.2 parts by mass Photopolymerization initiator 1 ... 0. 6 parts by mass Surfactant 1 ... 4.2 parts by mass Ultraviolet absorber 1 ... 0.5 parts by mass PGMEA ... 19.5 parts by mass
- Blue composition The following components were mixed and stirred, and then filtered through a nylon filter (manufactured by Nippon Pole Co., Ltd.) having a pore size of 0.45 ⁇ m to prepare a Blue composition.
- composition 100 Pigment dispersion 1-1 ... 46.5 parts by mass Pigment dispersion 1-2 ... 37.1 parts by mass Curing compound 5 ... 1.8 parts by mass Resin 4 ... 1.1 parts by mass Photopolymerization initiator 2 ... 0.9 parts by mass Surfactant 1 ... 4.2 parts by mass Polymerization inhibitor 1 ... 0.001 parts by mass Substrate adhesion agent ...
- the raw materials used in the Red composition, the Green composition, the Blue composition, and the infrared transmission filter forming composition are as follows.
- Red pigment dispersion C.I. I. Pigment Red 254, 9.6 parts by mass, C.I. I. Pigment Yellow 139 (4.3 parts by mass), a dispersant (Disperbyk-161, manufactured by BYK Chemie) (6.8 parts by mass) and PGMEA (79.3 parts by mass) were mixed in a bead mill (zirconia bead 0.3 mm diameter).
- the pigment dispersion was prepared by mixing and dispersing for 3 hours. Thereafter, the dispersion treatment was further performed at a flow rate of 500 g / min under a pressure of 2000 kg / cm 3 using a high-pressure disperser NANO-3000-10 with a decompression mechanism (manufactured by Nippon BEE Co., Ltd.). This dispersion treatment was repeated 10 times to obtain a Red pigment dispersion.
- Blue pigment dispersion C.I. I. Pigment Blue 15: 6 is 9.7 parts by mass, C.I. I. Pigment Violet 23, 2.4 parts by mass, a dispersant (Disperbyk-161, manufactured by BYK Chemie) 5.5 parts, and PGMEA 82.4 parts were mixed with a bead mill (zirconia beads 0.3 mm diameter) 3
- a pigment dispersion was prepared. Thereafter, the dispersion treatment was further performed at a flow rate of 500 g / min under a pressure of 2000 kg / cm 3 using a high-pressure disperser NANO-3000-10 with a decompression mechanism (manufactured by Nippon BEE Co., Ltd.). This dispersion treatment was repeated 10 times to obtain a Blue pigment dispersion.
- Pigment dispersion 1-1 A mixed solution having the following composition was mixed and dispersed for 3 hours using a zirconia bead having a diameter of 0.3 mm in a bead mill (high pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)). Thus, a pigment dispersion 1-1 was prepared. -Mixed pigment consisting of red pigment (CI Pigment Red 254) and yellow pigment (CI Pigment Yellow 139) ... 11.8 parts by mass-Resin (Disperbyk-111, manufactured by BYKChemie) ... 9.1 parts by mass / PGMEA 79.1 parts by mass
- Pigment dispersion 1-2 A mixed solution having the following composition was mixed and dispersed for 3 hours using a zirconia bead having a diameter of 0.3 mm in a bead mill (high pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)). Thus, a pigment dispersion 1-2 was prepared. -Mixed pigment consisting of blue pigment (CI Pigment Blue 15: 6) and purple pigment (CI Pigment Violet 23) ...
- Pigment dispersion 2-1 Using a zirconia bead having a diameter of 0.3 mm, a mixed liquid having the following composition was bead milled (high pressure disperser NANO-3000-10 with a decompression mechanism (manufactured by Nippon BEE Co., Ltd.)) with an average particle diameter of pyrrolopyrrole pigment. A pigment dispersion was prepared by mixing and dispersing until the (secondary particles) became 75 nm or less. The average particle size of the pigment in the pigment dispersion was measured on a volume basis using MICROTRACUPA 150 manufactured by Nikkiso Co., Ltd.
- Pirropyrrole pigment 13.5 parts by mass ⁇ Resin (Disperbyk-111, manufactured by BYK Chemie): 4 parts by mass ⁇ PGMEA: 82.5 parts by mass ⁇ Pyropyrrole pigment: Compound having the following structure
- Pigment dispersion 3-1 A mixed liquid having the following composition was mixed and dispersed with a bead mill (high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment. A liquid was prepared. ⁇ C. I.
- Resin 11 Resin having the following structure (Mw: 7950, the numerical value attached to the main chain is the molar ratio, and the numerical value attached to the side chain is the number of repeating units)
- Resin 12 Resin having the following structure (Mw: 12,000, the ratio in the structural unit is a molar ratio)
- Pigment dispersion 3-2 A mixed liquid having the following composition was mixed and dispersed with a bead mill (high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment. A liquid was prepared.
- Pigment dispersion 3-3 A mixed liquid having the following composition was mixed and dispersed with a bead mill (high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment. A liquid was prepared.
- a bead mill high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment.
- a liquid was prepared.
- Pigment dispersion 3-4 A mixed liquid having the following composition was mixed and dispersed with a bead mill (high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment. A liquid was prepared.
- a bead mill high-pressure disperser NANO-3000-10 with a pressure reducing mechanism (manufactured by Nippon BEE Co., Ltd.)) using zirconia beads having a diameter of 0.3 mm to disperse the pigment.
- a liquid was prepared.
- ⁇ C. I. Pigment Violet 23 ... 14.8 parts by mass Resin (Disperbyk-111, manufactured by BYK Chemie) ... 3 parts by mass Resin 12 ... 2.2 parts by mass PGMEA ... 80 parts by mass
- Curing compound 1 KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.)
- Curing compound 4 Compound having the following structure
- Curing compound 5 Compound having the following structure (a mixture in which the molar ratio of the left compound to the right compound is 7: 3)
- Curing compound 6 M-305 (55 to 63% by mass of triacrylate, manufactured by Toagosei Co., Ltd.)
- Photopolymerization initiator 1 IRGACURE-OXE01 (manufactured by BASF)
- Photopolymerization initiator 2 Compound having the following structure
- Substrate adhesion agent Compound of the following structure
- 110 solid-state imaging device
- 111, 111a near-infrared cut filter
- 112 color filter
- 114 infrared transmission filter
- 115 microlens
- 116 planarization layer
- 151 support
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Optical Filters (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
<1> 波長650~1000nmの範囲に極大吸収波長を有し、23℃の水に対する溶解度が0.1質量%以下である近赤外線吸収化合物を2種類以上含み、
2種類以上の近赤外線吸収化合物は、
波長650~1000nmの範囲に極大吸収波長を有する第1の近赤外線吸収化合物と、
第1の近赤外線吸収化合物の極大吸収波長よりも短波長側であって、波長650~1000nmの範囲に極大吸収波長を有する第2の近赤外線吸収化合物とを含み、
第1の近赤外線吸収化合物の極大吸収波長と、第2の近赤外線吸収化合物の極大吸収波長との差が1~150nmである、組成物。
<2> 第1の近赤外線吸収化合物および第2の近赤外線吸収化合物は、波長500nmにおける吸光度A1と極大吸収波長における吸光度A2との比率A1/A2が、それぞれ0.04以下である<1>に記載の組成物。
<3> 第1の近赤外線吸収化合物および第2の近赤外線吸収化合物の少なくとも一方が、ピロロピロール化合物、シアニン化合物、スクアリリウム化合物、フタロシアニン化合物、ナフタロシアニン化合物、およびリレン化合物から選ばれる少なくとも一種を含む、<1>または<2>に記載の組成物。
<4> 第1の近赤外線吸収化合物が、ピロロピロール化合物である、<1>~<3>のいずれかに記載の組成物。
<5> 第1の近赤外線吸収化合物および第2の近赤外線吸収化合物の少なくとも一方が、下記式(I)で表される化合物を含む、<1>~<4>のいずれかに記載の組成物;
式(I)中、A1およびA2はそれぞれ独立にヘテロアリール基を表し、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。
<6> 第1の近赤外線吸収化合物および第2の近赤外線吸収化合物の少なくとも一方が、下記式(II)で表される化合物、および、下記式(III)で表される化合物から選ばれる少なくとも1種を含む、<1>~<4>のいずれかに記載の組成物;
式(II)中、X1およびX2はそれぞれ独立にO、S、NRX1またはCRX2RX3を表し、RX1~RX3はそれぞれ独立に水素原子または置換基を表し、
R3~R6はそれぞれ独立に水素原子または置換基を表し、
R3とR4、またはR5とR6は互いに結合して環を形成してよく、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す;
式(III)中、Y1~Y8はそれぞれ独立にNまたはCRY1を表し、Y1~Y4の少なくとも2つはCRY1であり、Y5~Y8の少なくとも2つはCRY1であり、RY1は水素原子または置換基を表し、隣接するRY1同士は互いに結合して環を形成してよく、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。
<7> 第1の近赤外線吸収化合物と第2の近赤外線吸収化合物が、共通の色素骨格を有する化合物である、<1>~<6>のいずれかに記載の組成物。
<8> 第1の近赤外線吸収化合物と第2の近赤外線吸収化合物とがいずれもピロロピロール化合物であるか、または、いずれもシアニン化合物である、<1>~<3>のいずれかに記載の組成物。
<9> 第1の近赤外線吸収化合物の極大吸収波長と第2の近赤外線吸収化合物の極大吸収波長との差が、1~90nmである<1>~<8>のいずれかに記載の組成物。
<10> 更に、硬化性化合物を含む、<1>~<9>のいずれかに記載の組成物。
<11> 更に、樹脂および溶剤を含む<1>~<10>のいずれかに記載の組成物。
<12> 更に、有彩色着色剤を含む、<1>~<11>のいずれかに記載の組成物。
<13> <1>~<12>のいずれかに記載の組成物を含む膜。
<14> <1>~<12>のいずれかに記載の組成物を含む近赤外線カットフィルタ。
<15> 更に、銅を含む層を有する、<14>に記載の近赤外線カットフィルタ。
<16> <14>または<15>に記載の近赤外線カットフィルタと、有彩色着色剤を含むカラーフィルタと、を有する積層体。
<17> <1>~<12>のいずれかに記載の組成物を含む組成物層を支持体上に形成する工程と、フォトリソグラフィ法またはドライエッチング法により、組成物層にパターンを形成する工程と、を含む、パターン形成方法。
<18> <13>に記載の膜を有する固体撮像素子。
<19> <13>に記載の膜を有する画像表示装置。
<20> <13>に記載の膜を有する赤外線センサ。
<21> <1>~<12>のいずれかに記載の組成物を含む画素と、赤、緑、青、マゼンタ、黄、シアン、黒および無色から選ばれる画素とを有するカラーフィルタ。
本明細書において、「~」とはその前後に記載される数値を下限値および上限値として含む意味で使用される。
本明細書における基(原子団)の表記に於いて、置換および無置換を記していない表記は、置換基を有さない基(原子団)と共に置換基を有する基(原子団)をも包含する。例えば、「アルキル基」とは、置換基を有さないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含する。
本明細書において光とは、活性光線または放射線を意味する。また、「活性光線」または「放射線」とは、例えば、水銀灯の輝線スペクトル、エキシマレーザーに代表される遠紫外線、極紫外線(EUV光)、X線、電子線等を意味する。
本明細書において「露光」とは、特に断らない限り、水銀灯の輝線スペクトル、エキシマレーザーに代表される遠紫外線、X線、EUV光などを用いた露光のみならず、電子線、イオンビーム等の粒子線を用いた描画も露光に含める。
本明細書において、「(メタ)アクリレート」は、アクリレートおよびメタクリレートを表し、「(メタ)アクリル」は、アクリルおよびメタクリルを表し、「(メタ)アクリロイル」は、アクリロイルおよびメタクリロイルを表す。
本明細書において、重量平均分子量および数平均分子量は、ゲルパーミエーションクロマトグラフィ(GPC)により測定したポリスチレン換算値として定義される。本明細書において、重量平均分子量(Mw)及び数平均分子量(Mn)は、例えば、HLC-8220(東ソー(株)製)を用い、カラムとしてTSKgel Super AWM―H(東ソー(株)製、6.0mmID(内径)×15.0cm)を、溶離液として10mmol/L リチウムブロミドNMP(N-メチルピロリジノン)溶液を用いることによって求めることができる。
本明細書において、化学式中のMeはメチル基を表し、Etはエチル基を表し、Buはブチル基を表し、Phはフェニル基を表す。
近赤外線とは、極大吸収波長領域が波長700~2500nmの光(電磁波)をいう。
本明細書において、全固形分とは、組成物の全成分から溶剤を除いた成分の総質量をいう。
本明細書において「工程」との語は、独立した工程だけではなく、他の工程と明確に区別できない場合であってもその工程の所期の作用が達成されれば、本用語に含まれる。
本発明の組成物は、波長650~1000nmの範囲に極大吸収波長を有し、23℃の水に対する溶解度が0.1質量%以下である近赤外線吸収化合物を2種類以上含み、
2種類以上の近赤外線吸収化合物は、
波長650~1000nmの範囲に極大吸収波長を有する第1の近赤外線吸収化合物と、
第1の近赤外線吸収化合物の極大吸収波長よりも短波長側であって、波長650~1000nmの範囲に極大吸収波長を有する第2の近赤外線吸収化合物とを含み、
第1の近赤外線吸収化合物の極大吸収波長と、第2の近赤外線吸収化合物の極大吸収波長との差が1~150nmである。
すなわち、第1の近赤外線吸収化合物と第2の近赤外線吸収化合物は、波長650~1000nmの範囲において、異なる波長範囲に極大吸収波長を有し、かつ、両者の極大吸収波長の差が1~150nmであるので、波長650~1000nmの範囲における膜の吸収スペクトルの波形が、1種類の赤外線吸収化合物を使用した場合に比べて広がり、幅広い波長範囲の赤外線を遮蔽することができる。
また、近赤外線吸収化合物を2種類以上含む膜は、分光変動が生じやすいことが分かった。分光変動の発生は、検討したところ、膜中に含まれる近赤外線吸収化合物が、膜表面にブリードアウトしたり、近赤外線吸収化合物の会合状態が変化したりすることが原因であると推測される。
本発明では、近赤外線吸収化合物として、23℃の水に対する溶解度が0.1質量%以下の化合物を用いるので、得られる膜の耐湿性が向上する。本発明の組成物を用いて得られた膜を高温高湿の環境下に置いても、近赤外線吸収化合物のブリードアウトや会合状態の変化などを抑制でき、分光変動を抑制することができる。
また、第1の近赤外線吸収化合物として、耐光性に優れる化合物(例えばピロロピロール化合物)を用いた場合、第2の近赤外線吸収化合物として、耐光性の劣る化合物を用いても、耐光性に優れた膜を製造することができる。このような効果が得られるメカニズムは、第1の近赤外線吸収化合物よりも短波長側に極大吸収波長を有する第2の近赤外線吸収化合物が吸収したエネルギーを、耐光性に優れる第1の近赤外線吸収化合物側に移動して、第2の近赤外線吸収化合物の分解などを抑制できたためであると推測する。
以下、組成物の各成分について説明する。
本発明の組成物は、波長650~1000nmの範囲に極大吸収波長を有し、23℃の水に対する溶解度が0.1質量%以下である近赤外線吸収化合物(以下、近赤外線吸収化合物Aともいう)を2種類以上含む。
近赤外線吸収化合物Aの23℃の水に対する溶解度は、0.1質量%以下であり、0.05質量%以下がより好ましく、0.01質量%以下がさらに好ましい。この態様によれば、より分光変動が抑制された膜を製造できる。特に、高温高湿の環境に曝されても分光変動をより効果的に抑制できる。
近赤外線吸収化合物Aは、波長500nmにおける吸光度A1と、極大吸収波長における吸光度A2との比率A1/A2が、0.08以下であることが好ましく、0.04以下であることがさらに好ましい。この態様によれば、可視透明性と赤外線遮蔽性に優れた膜を製造できる。
なお、波長500nmにおける吸光度A1、および、極大吸収波長における吸光度A2は、近赤外線吸収化合物の溶液での吸収スペクトルから求めた値である。
第1の近赤外線吸収化合物と第2の近赤外線吸収化合物の好ましい組み合わせの一態様としては、第1の近赤外線吸収化合物の極大吸収波長と、第2の近赤外線吸収化合物の極大吸収波長との差が5~100nmであることが好ましく、30~90nmであることがより好ましい。この態様によれば、幅広い波長範囲の赤外線を遮蔽できる膜などの製造に適している。
第1の近赤外線吸収化合物と第2の近赤外線吸収化合物の好ましい組み合わせの他の態様としては、第1の近赤外線吸収化合物の極大吸収波長と、第2の近赤外線吸収化合物の極大吸収波長との差が5~100nmであることが好ましく、20~60nmであることがより好ましい。この態様によれば、特定の波長範囲の赤外線を選択的に遮蔽可能な膜などの製造に適している。
なお、上述の波長範囲に極大吸収波長を有する近赤外線吸収化合物を3種類以上含んでいてもよい。この場合、波長650~1000nmの範囲において、最も長波長側に極大吸収波長を有する近赤外線吸収化合物を第1の近赤外線吸収化合物とし、第1の近赤外線吸収化合物よりも短波長側に極大吸収波長を有する近赤外線吸収化合物のすべてを第2の近赤外線吸収化合物とする。また、最も長波長側に極大吸収波長を有する近赤外線吸収化合物が2種類以上存在する場合は、それらを第1の近赤外線吸収化合物とみなす。
第1の近赤外線吸収化合物と第2の近赤外線吸収化合物との割合は、特に限定はない。第1の近赤外線吸収化合物の100質量部に対して、第2の近赤外線吸収化合物を5~500質量部含有することが好ましく、10~300質量部がより好ましく、30~200質量部がさらに好ましい。
第1の近赤外線吸収化合物は、1種類のみであってもよく、2種類以上含んでいてもよい。第1の近赤外線吸収化合物および/または第2の近赤外線吸収化合物を2種類以上含む場合は、これらの合計が上記範囲であることが好ましい。
また、第2の近赤外線吸収化合物は、1種類のみであってもよく、2種類以上含んでいてもよい。分光の観点から、第2の近赤外線吸収化合物を2種類以上含むことが好ましい。第2の近赤外線吸収化合物を2種類以上のn個含む場合、n個の第2の近赤外線吸収化合物のうち、極大吸収波長をa番目に長波長側に有する化合物Aaの極大吸収波長と、極大吸収波長を(a+1)番目に長波長側に有する化合物Aa+1の極大吸収波長の差が1~90nmであることが好ましく、5~60nmであることがより好ましい。ここで、aは1~n-1の整数を表し、nは2以上の整数を表す。
また、例えば、第2の近赤外線吸収化合物を3種類含む場合、極大吸収波長が1番目に長波長側に有する化合物A1(極大吸収波長を最も長波長側に有する化合物)の極大吸収波長と、極大吸収波長を2番目に長波長側に有する化合物A2(化合物A1よりも短波長側に極大吸収波長を有する化合物)の極大吸収波長の差が1~90nmであることが好ましく、5~60nmであることがより好ましい。また、極大吸収波長を2番目に長波長側に有する化合物A2の極大吸収波長と、極大吸収波長を3番目に長波長側に有する化合物A3(化合物A2よりも短波長側に極大吸収波長を有する化合物)の極大吸収波長の差が1~90nmであることが好ましく、5~60nmであることがより好ましい。
近赤外線吸収化合物Aとして用いるピロロピロール化合物は、式(I)で表される化合物が好ましい。
式(I)中、A1およびA2はそれぞれ独立にヘテロアリール基を表し、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。
ヘテロアリール基は、単環、または、縮合環が好ましく、単環、または、縮合数が2~8の縮合環がより好ましく、単環、または、縮合数が2~4の縮合環が更に好ましい。ヘテロアリール基を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましく、3~10が特に好ましい。ヘテロアリール基は、5員環または6員環が好ましい。
R3、R4およびRX1~RX3が表す置換基は、アルキル基、アルケニル基、アリール基、ヘテロアリール基、アルコキシ基、アリールオキシ基、ヘテロアリールオキシ基、アシル基、アルコキシカルボニル基、アリールオキシカルボニル基、ヘテロアリールオキシカルボニル基、アシルオキシ基、アミノ基、アシルアミノ基、アルコキシカルボニルアミノ基、アリールオキシカルボニルアミノ基、ヘテロアリールオキシカルボニルアミノ基、スルホニルアミノ基、スルファモイル基、カルバモイル基、アルキルチオ基、アリールチオ基、ヘテロアリールチオ基、アルキルスルホニル基、アリールスルホニル基、ヘテロアリールスルホニル基、アルキルスルフィニル基、アリールスルフィニル基、ヘテロアリールスルフィニル基、ウレイド基、リン酸アミド基、メルカプト基、スルホ基、カルボキシル基、ニトロ基、ヒドロキサム酸基、スルフィノ基、ヒドラジノ基、イミノ基、シリル基、ヒドロキシル基、ハロゲン原子、シアノ基などが挙げられ、アルキル基、アリール基およびハロゲン原子が好ましい。
アルキル基の炭素数は、1~20が好ましく、1~15がより好ましく、1~8が更に好ましい。アルキル基は、直鎖、分岐、環状のいずれでもよく、直鎖または分岐が好ましい。アルキル基は、置換基を有してもよく、無置換であってもよい。置換基としては、上述した基が挙げられ、例えば、ハロゲン原子、アリール基等が挙げられる。
アリール基の炭素数は、6~30が好ましく、6~20がより好ましく、6~12が更に好ましい。アリール基は、置換基を有してもよく、無置換であってもよい。置換基としては、上述した基が挙げられ、例えば、ハロゲン原子、アルキル基等が挙げられる。
ハロゲン原子は、フッ素原子、塩素原子、臭素原子、ヨウ素原子などが挙げられる。
式中、X1はそれぞれ独立にO、S、NRX1またはCRX2RX3を表し、RX1~RX3はそれぞれ独立に水素原子または置換基を表し、R101~R109はそれぞれ独立に水素原子または置換基を表す。*は式(I)における結合位置を表す。
RY1が表す置換基は、上述した置換基が挙げられ、アルキル基、アリール基およびハロゲン原子が好ましい。アルキル基の炭素数は、1~20が好ましく、1~15がより好ましく、1~8が更に好ましい。アルキル基は、直鎖、分岐、環状のいずれでもよく、直鎖または分岐が好ましい。アルキル基は、置換基を有してもよく、無置換であってもよい。置換基としては、上述した置換基が挙げられ、例えば、ハロゲン原子、アリール基等が挙げられる。
アリール基の炭素数は、6~30が好ましく、6~20がより好ましく、6~12が更に好ましい。アリール基は、置換基を有してもよく、無置換であってもよい。置換基としては、上述した置換基が挙げられ、例えば、ハロゲン原子、アルキル基等が挙げられる。
ハロゲン原子は、フッ素原子、塩素原子、臭素原子、ヨウ素原子などが挙げられる。
式中、R201~R227はそれぞれ独立に水素原子または置換基を表し、*は式(I)における結合位置を表す。
アルキル基の炭素数は、1~40が好ましい。下限は、例えば、3以上がより好ましい。上限は、例えば、30以下がより好ましく、25以下が更に好ましい。アルキル基は、直鎖、分岐、環状のいずれでもよいが、直鎖または分岐が好ましい。
アルケニル基の炭素数は、2~40が好ましい。下限は、例えば、3以上がより好ましく、5以上が更に好ましく、8以上が一層好ましく、10以上が特に好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。アルケニル基は直鎖、分岐、環状のいずれでもよい。
アルコキシ基の炭素数は、1~40が好ましい。下限は、例えば、3以上がより好ましい。上限は、例えば、30以下がより好ましく、25以下が更に好ましい。アルコキシ基は、直鎖、分岐、環状のいずれでもよい。
アリール基の炭素数は、6~20が好ましく、6~12がより好ましい。アリール基は、置換基を有していてもよく、無置換であってもよい。置換基としては、アルキル基、アルコキシ基、ハロゲン原子などが挙げられる。これらの詳細については、前述したものが挙げられる。
ヘテロアリール基は、単環であっても多環であってもよい。ヘテロアリール基を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましく、3~5が特に好ましい。ヘテロアリール基は、5員環または6員環が好ましい。ヘテロアリール基は、置換基を有していてもよく、無置換であってもよい。置換基としては、アルキル基、アルコキシ基、ハロゲン原子などが挙げられる。これらの詳細については、前述したものが挙げられる。
アルキル基の炭素数は、1~40が好ましく、1~30がより好ましく、1~25が特に好ましい。アルキル基は直鎖、分岐、環状のいずれでもよいが、直鎖または分岐が好ましく、分岐が特に好ましい。
アリール基は、炭素数6~20のアリール基が好ましく、炭素数6~12のアリール基がより好ましい。フェニル基またはナフチル基が特に好ましい。
ヘテロアリール基は、単環であっても多環であってもよい。ヘテロアリール基を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましい。
置換基としては、酸素原子を含んでもよい炭化水素基、アミノ基、アシルアミノ基、アルコキシカルボニルアミノ基、アリールオキシカルボニルアミノ基、ヘテロアリールオキシカルボニルアミノ基、スルホニルアミノ基、スルファモイル基、カルバモイル基、アルキルチオ基、アリールチオ基、ヘテロアリールチオ基、アルキルスルホニル基、アリールスルホニル基、ヘテロアリールスルホニル基、アルキルスルフィニル基、アリールスルフィニル基、ヘテロアリールスルフィニル基、ウレイド基、リン酸アミド基、メルカプト基、スルホ基、カルボキシル基、ニトロ基、ヒドロキサム酸基、スルフィノ基、ヒドラジノ基、イミノ基、シリル基、ヒドロキシル基、ハロゲン原子、シアノ基等が挙げられる。
炭化水素基としては、アルキル基、アルケニル基、アリール基などが挙げられる。
アルキル基の炭素数は、1~40が好ましい。下限は、3以上がより好ましく、5以上が更に好ましく、8以上が一層好ましく、10以上が特に好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。アルキル基は直鎖、分岐、環状のいずれでもよいが、直鎖または分岐が好ましく、分岐が特に好ましい。分岐のアルキル基の炭素数は、3~40が好ましい。下限は、例えば、5以上がより好ましく、8以上が更に好ましく、10以上が一層好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。分岐のアルキル基の分岐数は、例えば、2~10が好ましく、2~8がより好ましい。
アルケニル基の炭素数は、2~40が好ましい。下限は、例えば、3以上がより好ましく、5以上が更に好ましく、8以上が一層好ましく、10以上が特に好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。アルケニル基は直鎖、分岐、環状のいずれでもよいが、直鎖または分岐が好ましく、分岐が特に好ましい。分岐のアルケニル基の炭素数は、3~40が好ましい。下限は、例えば、5以上がより好ましく、8以上が更に好ましく、10以上が一層好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。分岐のアルケニル基の分岐数は、2~10が好ましく、2~8がより好ましい。
アリール基の炭素数は、6~30が好ましく、6~20がより好ましく、6~12が更に好ましい。
酸素原子を含む炭化水素基としては、-L-Rx1で表される基が挙げられる。
Lは、-O-、-CO-、-COO-、-OCO-、-(ORx2)m-または-(Rx2O)m-を表す。Rx1は、アルキル基、アルケニル基またはアリール基を表す。Rx2は、アルキレン基またはアリーレン基を表す。mは2以上の整数を表し、m個のRx2は、同一であってもよく、異なっていてもよい。
Lは、-O-、-(ORx2)m-または-(Rx2O)m-が好ましく、-O-がより好ましい。
Rx1が表すアルキル基、アルケニル基、アリール基は上述したものと同義であり、好ましい範囲も同様である。Rx1は、アルキル基またはアルケニル基が好ましく、アルキル基がより好ましい。
Rx2が表すアルキレン基の炭素数は、1~20が好ましく、1~10がより好ましく、1~5が更に好ましい。アルキレン基は直鎖、分岐、環状のいずれでもよいが、直鎖または分岐が好ましい。Rx2が表すアリーレン基の炭素数は、6~20が好ましく、6~12がより好ましい。Rx2はアルキレン基が好ましい。
mは2以上の整数を表し、2~20が好ましく、2~10がより好ましい。
置換基としては、例えば、アルキル基、アルケニル基、アリール基、ヘテロアリール基、アルコキシ基、アリールオキシ基、ヘテロアリールオキシ基、アシル基、アルコキシカルボニル基、アリールオキシカルボニル基、ヘテロアリールオキシカルボニル基、アシルオキシ基、アミノ基、アシルアミノ基、アルコキシカルボニルアミノ基、アリールオキシカルボニルアミノ基、ヘテロアリールオキシカルボニルアミノ基、スルホニルアミノ基、スルファモイル基、カルバモイル基、アルキルチオ基、アリールチオ基、ヘテロアリールチオ基、アルキルスルホニル基、アリールスルホニル基、ヘテロアリールスルホニル基、アルキルスルフィニル基、アリールスルフィニル基、ヘテロアリールスルフィニル基、ウレイド基、リン酸アミド基、メルカプト基、スルホ基、カルボキシル基、ニトロ基、ヒドロキサム酸基、スルフィノ基、ヒドラジノ基、イミノ基、シリル基、ヒドロキシル基、ハロゲン原子、シアノ基などが挙げられる。D1およびD2は、電子求引性基が好ましい。
R3~R6はそれぞれ独立に水素原子または置換基を表し、
R3とR4、またはR5とR6は互いに結合して環を形成してよく、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。
近赤外線吸収化合物Aとして用いるスクアリリウム化合物は、式(SQ)で表される化合物が好ましい。
式中、A1およびA2はそれぞれ独立にアリール基、ヘテロアリール基または下記式(2)で表される基を表す;
式(2)中、Z1は含窒素複素環を形成する非金属原子団を表し、R2はアルキル基、アルケニル基またはアラルキル基を表し、dは0または1を表し、波線は式(SQ)における4員環との連結手を表す。
A1およびA2が表すアリール基の炭素数は、6~48が好ましく、6~24がより好ましく、6~12が特に好ましい。具体例としては、フェニル基、ナフチル基等が挙げられる。なお、アリール基が置換基を有する場合における上記アリール基の炭素数は、置換基の炭素数を除いた数を意味する。
A1およびA2が表すヘテロアリール基としては、5員環または6員環が好ましい。また、ヘテロアリール基は、単環または縮合環が好ましく、単環または縮合数が2~8の縮合環がより好ましく、単環または縮合数が2~4の縮合環が更に好ましく、単環または縮合数が2または3の縮合環が特に好ましい。ヘテロアリール基に含まれるヘテロ原子としては、窒素原子、酸素原子、硫黄原子が例示され、窒素原子、硫黄原子が好ましい。ヘテロ原子の数は、1~3が好ましく、1~2がより好ましい。具体的には、窒素原子、酸素原子および硫黄原子の少なくとも一つを含有する5員環または6員環等の単環、多環芳香族環から誘導されるヘテロアリール基などが挙げられる。
アルケニル基の炭素数は、2~20が好ましく、2~12がより好ましく、2~8が特に好ましい。アルケニル基は直鎖、分岐、環状のいずれでもよく、直鎖または分岐が好ましい。
アルキニル基の炭素数は、2~40が好ましく、2~30がより好ましく、2~25が特に好ましい。アルキニル基は直鎖、分岐、環状のいずれでもよく、直鎖または分岐が好ましい。
アリール基の炭素数は、6~30が好ましく、6~20がより好ましく、6~12が更に好ましい。
アラルキル基のアルキル部分は、上記アルキル基と同様である。アラルキル基のアリール部分は、上記アリール基と同様である。アラルキル基の炭素数は、7~40が好ましく、7~30がより好ましく、7~25が更に好ましい。
ヘテロアリール基は、単環または縮合環が好ましく、単環または縮合数が2~8の縮合環がより好ましく、単環または縮合数が2~4の縮合環が更に好ましい。ヘテロアリール基の環を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基の環を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基は、5員環または6員環が好ましい。ヘテロアリール基の環を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましい。
アルキル基、アルケニル基、アルキニル基、アラルキル基、アリール基およびヘテロアリール基は、置換基を有していてもよく、無置換であってもよい。置換基としては、上述した置換基が挙げられる。
アルキル基の炭素数は、1~30が好ましく、1~20がより好ましく、1~12が更に好ましく、2~8が特に好ましい。
アルケニル基の炭素数は、2~30が好ましく、2~20がより好ましく、2~12が更に好ましい。
アルキル基およびアルケニル基は、直鎖、分岐、環状のいずれでもよく、直鎖または分岐が好ましい。
アラルキル基の炭素数は7~30が好ましく、7~20がより好ましい。
式(3)および式(4)中、R11はアルキル基、アルケニル基またはアラルキル基を表し、R12は置換基を表す。mは0~4の整数を表し、mが2以上の場合、R12同士は連結して環を形成してもよい。Xは、窒素原子、または、CR13R14を表し、R13およびR14はそれぞれ独立に水素原子または置換基を表す。波線は式(SQ)における4員環との連結手を表す。
式(3)および式(4)におけるR12は、置換基を表す。置換基としては、上述した式(SQ)で説明した置換基が挙げられる。例えば、ハロゲン原子、アルキル基、ヒドロキシル基、アミノ基、アシルアミノ基が好ましく、ハロゲン原子、アルキル基がより好ましい。ハロゲン原子は塩素原子が好ましい。アルキル基の炭素数は、1~30が好ましく、1~20がより好ましく、1~12が更に好ましい。アルキル基は、直鎖または分岐が好ましい。
mが2以上の場合、R12同士は連結して環を形成してもよい。環としては、脂環(非芳香性の炭化水素環)、芳香環、複素環などが挙げられる。環は単環であってもよく、多環であってもよい。置換基同士が連結して環を形成する場合の連結基としては、-CO-、-O-、-NH-、2価の脂肪族基、2価の芳香族基およびそれらの組み合わせからなる群より選ばれる2価の連結基で連結することができる。例えば、R12同士が連結してベンゼン環を形成していることが好ましい。
式(3)におけるXは、窒素原子、または、CR13R14を表し、R13およびR14はそれぞれ独立に水素原子または置換基を表す。置換基としては、上述した式(SQ)で説明した置換基が挙げられる。例えば、アルキル基などが挙げられる。アルキル基の炭素数は、1~20が好ましく、1~10がより好ましく、1~5が更に好ましく、1~3が特に好ましく、1が最も好ましい。アルキル基は、直鎖または分岐が好ましく、直鎖が特に好ましい。
mは、0~4の整数を表し、0~2が好ましい。
式(SQ-1)
式(SQ-1)中、環Aおよび環Bはそれぞれ独立に芳香族環を表し、
XAおよびXBはそれぞれ独立に置換基を表し、
GAおよびGBはそれぞれ独立に置換基を表し、
kAは0~nAの整数を表し、kBは0~nBの整数を表し、
nAは環Aに置換可能な最大の整数を表し、nBは環Bに置換可能な最大の整数を表し、
XAとGA、XBとGBは互いに結合して環を形成しても良く、GAおよびGBがそれぞれ複数存在する場合は、互いに結合して環を形成していても良い。
置換基としては、ハロゲン原子、シアノ基、ニトロ基、アルキル基、アルケニル基、アルキニル基、アラルキル基、アリール基、ヘテロアリール基、-ORc1、-CORc2、-COORc3、-OCORc4、-NRc5Rc6、-NHCORc7、-CONRc8Rc9、-NHCONRc10Rc11、-NHCOORc12、-SRc13、-SO2Rc14、-SO2ORc15、-NHSO2Rc16または-SO2NRc17Rc18が挙げられる。Rc1~Rc18は、それぞれ独立に、水素原子、アルキル基、アルケニル基、アルキニル基、アリール基またはヘテロアリール基を表す。なお、-COORc3のRc3が水素原子の場合(すなわち、カルボキシル基)は、水素原子が解離してもよく(すなわち、カルボネート基)、塩の状態であってもよい。また、-SO2ORc15のRc15が水素原子の場合(すなわち、スルホ基)は、水素原子が解離してもよく(すなわち、スルホネート基)、塩の状態であってもよい。
アルキル基の炭素数は、1~20が好ましく、1~12がさらに好ましく、1~8が特に好ましい。アルキル基は、直鎖、分岐、環状のいずれでもよい。アルキル基は無置換であってもよく、置換基を有していてもよい。
アルケニル基の炭素数は、2~20が好ましく、2~12がさらに好ましく、2~8が特に好ましい。アルケニル基は、直鎖、分岐、環状のいずれでもよい。
アルキニル基の炭素数は、2~20が好ましく、2~12がさらに好ましく、2~8が特に好ましい。アルキニル基は、直鎖、分岐、環状のいずれでもよい。
アリール基の炭素数は、6~25が好ましく、6~15がさらに好ましく、6~10が最も好ましい。
アラルキル基のアルキル部分は、上記アルキル基と同様である。アラルキル基のアリール部分は、上記アリール基と同様である。アラルキル基の炭素数は、7~40が好ましく、7~30がより好ましく、7~25が更に好ましい。
ヘテロアリール基は、単環または縮合環が好ましく、単環または縮合数が2~8の縮合環がより好ましく、単環または縮合数が2~4の縮合環が更に好ましい。ヘテロアリール基の環を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基の環を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基は、5員環または6員環が好ましい。ヘテロアリール基の環を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましい。
アルキル基、アルケニル基、アルキニル基、アラルキル基、アリール基およびヘテロアリール基は、置換基を有していてもよく、無置換であってもよい。置換基としては、上述したGAおよびGBで挙げた置換基が挙げられ、例えば、ハロゲン原子、ヒドロキシル基、カルボキシル基、スルホ基、アルコキシ基、アミノ基等が挙げられる。
芳香族環は、無置換であってもよく、置換基を有していてもよい。置換基としては、GAおよびGBで説明した置換基が挙げられる。
式(SQ-A)
式中、R1およびR2はそれぞれ独立にアルキル基、アルケニル基、アリール基またはヘテロアリール基を表し、
R3およびR4はそれぞれ独立に水素原子、またはアルキル基を表し、
X1およびX2はそれぞれ独立に酸素原子、または-N(R5)-を表し、
R5は、水素原子、アルキル基、アリール基またはヘテロアリール基を表し、
Y1~Y4はそれぞれ独立に置換基を表し、Y1とY2、およびY3とY4は、互いに結合して環を形成していてもよく、
Y1~Y4は、それぞれ複数存在する場合、互いに結合して環を形成していてもよく、
pおよびsはそれぞれ独立に0~3の整数を表し、
qおよびrはそれぞれ独立に0~2の整数を表す。
R1およびR2が表すアルケニル基の炭素数は、2~40が好ましい。下限は、例えば、3以上がより好ましく、5以上が更に好ましく、8以上が一層好ましく、10以上が特に好ましい。上限は、35以下がより好ましく、30以下が更に好ましい。アルケニル基は直鎖または分岐が好ましく、分岐が特に好ましい。分岐のアルケニル基の分岐数は、2~10が好ましく、2~8がより好ましい。
R1およびR2が表すアリール基の炭素数は、6~30が好ましく、6~20がより好ましく、6~12が更に好ましい。
R1およびR2が表すヘテロアリール基は、単環であっても多環であってもよい。ヘテロアリール基の環を構成するヘテロ原子の数は1~3が好ましい。ヘテロアリール基の環を構成するヘテロ原子は、窒素原子、酸素原子または硫黄原子が好ましい。ヘテロアリール基の環を構成する炭素原子の数は3~30が好ましく、3~18がより好ましく、3~12が更に好ましい。
R1およびR2が表す、アルキル基、アルケニル基、アリール基およびヘテロアリール基は、無置換であってもよく、置換基を有していてもよい。置換基としては、上述したGAおよびGBで説明した置換基が挙げられる。アルコキシ基が好ましい。
R5は、水素原子、アルキル基、アリール基またはヘテロアリール基を表し、水素原子、アルキル基またはアリール基が好ましい。R5が表すアルキル基、アリール基およびヘテロアリール基の詳細は、R3およびR4で説明した範囲と同様である。R5が表すアルキル基、アリール基およびヘテロアリール基は、無置換であってもよく、置換基を有していてもよい。置換基としては、上述したGAおよびGBで説明した置換基が挙げられる。
Y1~Y4は、それぞれ複数存在する場合、互いに結合して環構造を形成していてもよい。例えば、Y1が複数存在する場合、Y1同士が互いに結合し、Y1およびY2に直結しているナフタレン環と併せて、例えば、アントラセン環、フェナントレン環等の3環等となっていてもよい。なお、Y1同士が互いに結合して環構造を形成する場合、Y1以外の置換基であるY2~Y4は必ずしも複数存在する必要はない。また、Y2~Y4は存在しなくてもよい。Y2同士、Y3同士およびY4同士が結合して環構造を形成する場合も同様である。
pおよびsはそれぞれ独立に0~3の整数を表し、好ましくはそれぞれ0~1であり、特に好ましくは0である。
qおよびrはそれぞれ独立に0~2の整数を表し、好ましくはそれぞれ0~1であり、特に好ましくは0である。
近赤外線吸収化合物Aとして用いるシアニン化合物は、式(C)で表される化合物が好ましい。
式(C)
式(C)中、Z1およびZ2はそれぞれ独立に縮環してもよい5員または6員の含窒素複素環を形成する非金属原子団であり、
R101およびR102はそれぞれ独立にアルキル基、アルケニル基、アルキニル基、アラルキル基またはアリール基を表し、
L1は、奇数個のメチン基を有するメチン鎖を表し、
aおよびbはそれぞれ独立に0または1であり、
aが0の場合、炭素原子と窒素原子とが二重結合で結合し、bが0の場合、炭素原子と窒素原子とが単結合で結合し、
式中のCyで表される部位がカチオン部である場合、X1はアニオンを表し、cは電荷のバランスを取るために必要な数を表し、式中のCyで表される部位がアニオン部である場合、X1はカチオンを表し、cは電荷のバランスを取るために必要な数を表し、式中のCyで表される部位の電荷が分子内で中和されている場合、cは0である。
アルキル基の炭素数は、1~20が好ましく、1~12がさらに好ましく、1~8が特に好ましい。アルキル基は、直鎖、分岐、環状のいずれでもよい。
アルケニル基の炭素数は、2~20が好ましく、2~12がさらに好ましく、2~8が特に好ましい。アルケニル基は、直鎖、分岐、環状のいずれでもよい。
アルキニル基の炭素数は、2~20が好ましく、2~12がさらに好ましく、2~8が特に好ましい。アルキニル基は、直鎖、分岐、環状のいずれでもよい。
アリール基の炭素数は、6~25が好ましく、6~15がさらに好ましく、6~10が最も好ましい。アリール基は無置換であってもよく、置換基を有していてもよい。
アラルキル基のアルキル部分は、上記アルキル基と同様である。アラルキル基のアリール部分は、上記アリール基と同様である。アラルキル基の炭素数は、7~40が好ましく、7~30がより好ましく、7~25が更に好ましい。
アルキル基、アルケニル基、アルキニル基、アラルキル基およびアリール基は、置換基を有していてもよく、無置換であってもよい。置換基としては、ハロゲン原子、ヒドロキシル基、カルボキシル基、スルホ基、アルコキシ基、アミノ基等が挙げられ、カルボキシル基およびスルホ基が好ましく、スルホ基が特に好ましい。カルボキシル基およびスルホ基は、水素原子が解離していてもよく、塩の状態であってもよい。
メチン基は置換基を有していてもよい。置換基を有するメチン基は、中央の(メソ位の)メチン基であることが好ましい。置換基の具体例としては、Z1およびZ2の含窒素複素環が有してもよい置換基、および、式(a)で表される基などが挙げられる。また、メチン鎖の二つの置換基が結合して5または6員環を形成しても良い。
式(a)中、*はメチン鎖との連結部を表し、A1は酸素原子または硫黄原子を表す。
式(C)において、式中のCyで表される部位がアニオン部である場合、X1はカチオンを表し、cは電荷のバランスを取るために必要な数を表す。カチオンとしては、アルカリ金属イオン(Li+、Na+、K+など)、アルカリ土類金属イオン(Mg2+、Ca2+、Ba2+、Sr2+など)、遷移金属イオン(Ag+、Fe2+、Co2+、Ni2+、Cu2+、Zn2+など)、その他の金属イオン(Al3+など)、アンモニウムイオン、トリエチルアンモニウムイオン、トリブチルアンモニウムイオン、ピリジニウムイオン、テトラブチルアンモニウムイオン、グアニジニウムイオン、テトラメチルグアニジニウムイオン、ジアザビシクロウンデセニウムなどが挙げられる。カチオンとしては、Na+、K+、Mg2+、Ca2+、Zn2+、ジアザビシクロウンデセニウムが好ましい。
式(C)において、式中のCyで表される部位の電荷が分子内で中和されている場合、X1は存在しない。すなわち、cは0である。
式中、R1A、R2A、R1BおよびR2Bはそれぞれ独立にアルキル基、アルケニル基、アルキニル基、アラルキル基またはアリール基を表し、
L1AおよびL1Bはそれぞれ独立に奇数個のメチン基を有するメチン鎖を表し、
Y1およびY2はそれぞれ独立に-S-、-O-、-NRX1-または-CRX2RX3-を表し、
RX1、RX2およびRX3はそれぞれ独立に水素原子またはアルキル基を表し、
V1A、V2A、V1BおよびV2Bはそれぞれ独立に置換基を表し、
m1およびm2はそれぞれ独立に0~4を表し、
式中のCyで表される部位がカチオン部である場合、X1はアニオンを表し、cは電荷のバランスを取るために必要な数を表し、
式中のCyで表される部位がアニオン部である場合、X1はカチオンを表し、cは電荷のバランスを取るために必要な数を表し、
式中のCyで表される部位の電荷が分子内で中和されている場合、X1は存在しない。
V1A、V2A、V1BおよびV2Bが表す置換基は、式(SQ)で説明した置換基が挙げられ、好ましい範囲も同様である。
m1およびm2はそれぞれ独立に0~4を表し、0~2が好ましい。
X1が表すアニオンおよびカチオンは、式(C)のX1で説明した範囲と同義であり、好ましい範囲も同様である。
組成物は、上述した近赤外線吸収化合物A以外の近赤外線吸収化合物(他の近赤外線吸収化合物ともいう)をさらに含んでもよい。
他の近赤外線吸収化合物としては、例えば、銅化合物、シアニン化合物、スクアリリウム化合物、フタロシアニン化合物、ナフタロシアニン化合物、リレン化合物、メロシアニン化合物、クロコニウム化合物、オキソノール化合物、ジインモニウム化合物、ジチオール化合物、トリアリールメタン化合物、ピロメテン化合物、アゾメチン化合物、アントラキノン化合物及びジベンゾフラノン化合物などが挙げられる。
Cu(L)n1・(X)n2 式(Cu-1)
上記式中、Lは銅に配位する配位子を表し、Xは対イオンを表す。n1は1~4の整数を表す。n2は0~4の整数を表す。
対イオンが負の対イオン(対アニオン)の場合、例えば、無機陰イオンでも有機陰イオンでもよい。具体例としては、水酸化物イオン、ハロゲン陰イオン(例えば、フッ化物イオン、塩化物イオン、臭化物イオン、ヨウ化物イオン等)、置換または無置換のアルキルカルボン酸イオン(酢酸イオン、トリフルオロ酢酸イオン等)、置換または無置換のアリールカルボン酸イオン(安息香酸イオン等)、置換もしくは無置換のアルキルスルホン酸イオン(メタンスルホン酸イオン、トリフルオロメタンスルホン酸イオン等)、置換もしくは無置換のアリールスルホン酸イオン(例えばp-トルエンスルホン酸イオン、p-クロロベンゼンスルホン酸イオン等)、アリールジスルホン酸イオン(例えば1,3-ベンゼンジスルホン酸イオン、1,5-ナフタレンジスルホン酸イオン、2,6-ナフタレンジスルホン酸イオン等)、アルキル硫酸イオン(例えばメチル硫酸イオン等)、硫酸イオン、チオシアン酸イオン、硝酸イオン、過塩素酸イオン、テトラフルオロホウ酸イオン、テトラアリールホウ酸イオン、テトラキス(ペンタフルオロフェニル)ホウ酸イオン(B-(C6F5)4)、ヘキサフルオロホスフェートイオン、ピクリン酸イオン、アミドイオン(アシル基やスルホニル基で置換されたアミドを含む)、メチドイオン(アシル基やスルホニル基で置換されたメチドを含む)が挙げられ、ハロゲン陰イオン、置換もしくは無置換のアルキルカルボン酸イオン、硫酸イオン、硝酸イオン、テトラフルオロホウ酸イオン、テトラアリールホウ酸イオン、ヘキサフルオロホスフェートイオン、アミドイオン(アシル基やスルホニル基で置換されたアミドを含む)、メチドイオン(アシル基やスルホニル基で置換されたメチドイオンを含む)が好ましい。
対アニオンは、低求核アニオンが好ましい。低求核アニオンとは、一般的に超酸(super acid)と呼ばれるpKaの低い酸がプロトンを解離してなるアニオンである。超酸の定義は、文献によっても異なるがメタンスルホン酸よりpKaが低い酸の総称であり、J.Org.Chem.2011,76,391-395 Equilibrium Acidities of Super acidsに記載される構造が知られている。低求核アニオンのpKaは、例えば、-11以下が好ましく、-11~-18がより好ましい。pKaは、例えば、J.Org.Chem.2011,76,391-395に記載の方法により測定することができる。本明細書におけるpKa値は、特に断りがない場合、1,2-ジクロロエタン中でのpKaである。
低求核アニオンは、テトラフルオロホウ酸イオン、テトラアリールホウ酸イオン(アルキル基として、ハロゲン原子やフルオロアルキル基で置換されたアリール基を有するテトラアリールホウ酸イオンを含む)、ヘキサフルオロホスフェートイオン、イミドイオン(アシル基やスルホニル基で置換されたイミドを含む)、メチドイオン(アシル基やスルホニル基で置換されたメチドイオンを含む)がより好ましく、テトラアリールホウ酸イオン、イミドイオン、メチドイオンが特に好ましい。
対イオンが正の対イオン(対カチオン)の場合、例えば、無機もしくは有機のアンモニウムイオン(例えば、テトラブチルアンモニウムイオンなどのテトラアルキルアンモニウムイオン、トリエチルベンジルアンモニウムイオン、ピリジニウムイオン等)、ホスホニウムイオン(例えば、テトラブチルホスホニウムイオンなどのテトラアルキルホスホニウムイオン、アルキルトリフェニルホスホニウムイオン、トリエチルフェニルホスホニウムイオン等)、アルカリ金属イオンまたはプロトンが挙げられる。
また、対イオンは金属錯体イオンであってもよく、特に対イオンが銅錯体、すなわち、カチオン性銅錯体とアニオン性銅錯体の塩であっても良い。
(1)2つの配位部位を有する化合物の1つまたは2つを配位子として有する銅錯体
(2)3つの配位部位を有する化合物を配位子として有する銅錯体
(3)3つの配位部位を有する化合物と2つの配位部位を有する化合物とを配位子として有する銅錯体
(4)4つの配位部位を有する化合物を配位子として有する銅錯体
(5)5つの配位部位を有する化合物を配位子として有する銅錯体
MxWyOz・・・(W-1)
Mは金属、Wはタングステン、Oは酸素を表す。
0.001≦x/y≦1.1
2.2≦z/y≦3.0
Mが表す金属としては、アルカリ金属、アルカリ土類金属、Mg、Zr、Cr、Mn、Fe、Ru、Co、Rh、Ir、Ni、Pd、Pt、Cu、Ag、Au、Zn、Cd、Al、Ga、In、Tl、Sn、Pb、Ti、Nb、V、Mo、Ta、Re、Be、Hf、Os、Biが挙げられ、アルカリ金属が好ましく、RbまたはCsがより好ましく、Csが特に好ましい。Mの金属は1種でも2種以上でも良い。
x/yが0.001以上であることにより、赤外線を十分に遮蔽することができ、1.1以下であることにより、酸化タングステン系化合物中に不純物相が生成されることをより確実に回避することができる。
z/yが2.2以上であることにより、材料としての化学的安定性をより向上させることができ、3.0以下であることにより赤外線を十分に遮蔽することができる。
酸化タングステン系化合物は、例えば、住友金属鉱山株式会社製のYMF-02などのタングステン微粒子の分散物として入手可能である。
組成物は、有彩色着色剤を含有することができる。本発明において、有彩色着色剤とは、白色着色剤および黒色着色剤以外の着色剤を意味する。有彩色着色剤は、波長400nm以上650nm未満の範囲に吸収極大を有する着色剤が好ましい。
カラーインデックス(C.I.)Pigment Yellow 1,2,3,4,5,6,10,11,12,13,14,15,16,17,18,20,24,31,32,34,35,35:1,36,36:1,37,37:1,40,42,43,53,55,60,61,62,63,65,73,74,77,81,83,86,93,94,95,97,98,100,101,104,106,108,109,110,113,114,115,116,117,118,119,120,123,125,126,127,128,129,137,138,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173,174,175,176,177,179,180,181,182,185,187,188,193,194,199,213,214等(以上、黄色顔料)
C.I.Pigment Orange 2,5,13,16,17:1,31,34,36,38,43,46,48,49,51,52,55,59,60,61,62,64,71,73等(以上、オレンジ色顔料)
C.I.Pigment Red 1,2,3,4,5,6,7,9,10,14,17,22,23,31,38,41,48:1,48:2,48:3,48:4,49,49:1,49:2,52:1,52:2,53:1,57:1,60:1,63:1,66,67,81:1,81:2,81:3,83,88,90,105,112,119,122,123,144,146,149,150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,270,272,279等(以上、赤色顔料)
C.I.Pigment Green 7,10,36,37,58,59等(以上、緑色顔料)
C.I.Pigment Violet 1,19,23,27,32,37,42等(以上、紫色顔料)
C.I.Pigment Blue 1,2,15,15:1,15:2,15:3,15:4,15:6,16,22,60,64,66,79,80等(以上、青色顔料)
これら有機顔料は、単独若しくは種々組合せて用いることができる。
有彩色着色剤の含有量は、近赤外線吸収化合物A100質量部に対し、10~1000質量部が好ましく、50~800質量部がより好ましい。
また、有彩色着色剤と近赤外線吸収化合物Aとの合計量は、組成物の全固形分中1~80質量%とすることが好ましい。下限は、5質量%以上が好ましく、10質量%以上がより好ましい。上限は、70質量%以下が好ましく、60質量%以下がより好ましい。
組成物が、有彩色着色剤を2種以上含む場合、その合計量が上記範囲内であることが好ましい。
組成物は、可視光を遮光する色材を含有することもできる。可視光を遮光する色材は、顔料の含有量が、可視光を遮光する色材の全質量に対して、90質量%以上が好ましく、95質量%以上がより好ましく、99質量%以上が更に好ましい。可視光を遮光する色材は、複数の色材の組み合わせにより、黒色、灰色、またはそれらに近い色を呈することが好ましい。また、可視光を遮光する色材は、紫色から赤色の波長域の光を吸収する材料であることが好ましい。また、可視光を遮光する色材は、波長450~650nmの波長域の光を遮光する色材であることが好ましい。
(1):2種類以上の有彩色着色剤を含む態様
(2):有機系黒色着色剤を含む態様
なお、本発明において、可視光を遮光する色材としての有機系黒色着色剤は、可視領域の光を吸収するが、赤外領域の光の少なくとも一部を透過する材料を意味する。したがって、本発明において、可視光を遮光する色材としての有機系黒色着色剤は、赤外領域の光および可視領域の光の両方を吸収する黒色着色剤である、カーボンブラックやチタンブラックは含まない。
上記の特性は、1種類の素材で満たしていてもよく、複数の素材の組み合わせで満たしていてもよい。例えば、上記(1)の態様の場合、複数の有彩色着色剤を組み合わせて上記分光特性を満たしていることが好ましい。
(1)黄色着色剤、青色着色剤、紫色着色剤および赤色着色剤を含有する態様
(2)黄色着色剤、青色着色剤および赤色着色剤を含有する態様
(3)黄色着色剤、紫色着色剤および赤色着色剤を含有する態様
(4)黄色着色剤および紫色着色剤を含有する態様
(5)緑色着色剤、青色着色剤、紫色着色剤および赤色着色剤を含有する態様
(6)紫色着色剤およびオレンジ色着色剤を含有する態様
(7)緑色着色剤、紫色着色剤および赤色着色剤を含有する態様
(8)緑色着色剤および赤色着色剤を含有する態様
また、組成物は、可視光を遮光する色材を実質的に含有しない態様とすることもできる。可視光を遮光する色材を実質的に含有しないとは、可視光を遮光する色材の含有量が、組成物の全固形分中、0.005質量%以下が好ましく、0.001質量%以下が更に好ましく、可視光を遮光する色材を含有しないことが一層好ましい。
組成物は、顔料を含む場合は、更に顔料誘導体を含有することができる。顔料誘導体としては、顔料の一部が、酸性基、塩基性基又はフタルイミドメチル基で置換した構造を有する化合物が好ましく、式(B1)で表される顔料誘導体が更に好ましい。
式(B1)中、Pは色素構造を表し、Lは単結合または連結基を表し、Xは酸性基、塩基性基、塩構造を有する基またはフタルイミド基を表す。mは1以上の整数を表し、nは1以上の整数を表す。mが2以上の場合は複数のLおよびXは互いに異なっていてもよく、nが2以上の場合は複数のXは互いに異なってもよい。
組成物は、硬化性化合物を含有することが好ましい。硬化性化合物としては、ラジカル、酸、熱により硬化可能な公知の化合物を用いることができる。例えば、エチレン性不飽和結合を有する基を有する化合物、エポキシ基を有する化合物、メチロール基を有する化合物、アルコキシシリル基を有する化合物等が挙げられる。エチレン性不飽和結合を有する基としては、ビニル基、(メタ)アリル基、(メタ)アクリロイル基、(メタ)アクリロイルオキシ基などが挙げられる。アルコキシシリル基としては、モノアルコキシシリル基、ジアルコキシシリル基、トリアルコキシシリル基が挙げられる。エチレン性不飽和結合を有する基は、(メタ)アクリロイル基、(メタ)アクリロイルオキシ基が好ましい。アルコキシシリル基は、ジアルコキシシリル基、トリアルコキシシリル基が好ましい。また、アルコキシシリル基におけるアルコキシ基の炭素数は、1~5が好ましく、1~3がより好ましく、1または2が特に好ましい。
硬化性化合物として、エチレン性不飽和結合を有する基を有する化合物を用いることができる。エチレン性不飽和結合を有する基を有する化合物は、モノマーであることが好ましい。エチレン性不飽和結合を有する基を有する化合物の分子量は、100~3000が好ましい。上限は、2000以下が好ましく、1500以下が更に好ましい。下限は、150以上が好ましく、250以上が更に好ましい。エチレン性不飽和結合を有する基を有する化合物は、3~15官能の(メタ)アクリレート化合物であることが好ましく、3~6官能の(メタ)アクリレート化合物であることがより好ましい。
上記化合物の例としては、特開2013-253224号公報の段落番号0033~0034の記載を参酌することができ、この内容は本明細書に組み込まれる。上記化合物としては、エチレンオキシ変性ペンタエリスリトールテトラアクリレート(市販品としては、NKエステルATM-35E;新中村化学工業社製)、ジペンタエリスリトールトリアクリレート(市販品としては、KAYARAD D-330;日本化薬株式会社製)、ジペンタエリスリトールテトラアクリレート(市販品としては、KAYARAD D-320;日本化薬株式会社製)、ジペンタエリスリトールペンタ(メタ)アクリレート(市販品としては KAYARAD D-310;日本化薬株式会社製)、ジペンタエリスリトールヘキサ(メタ)アクリレート(市販品としては、KAYARAD DPHA;日本化薬株式会社製、A-DPH-12E;新中村化学工業社製)、およびこれらの(メタ)アクリロイル基がエチレングリコール、プロピレングリコール残基を介して結合している構造が好ましい。またこれらのオリゴマータイプも使用できる。また、特開2013-253224号公報の段落番号0034~0038の重合性化合物の記載を参酌することができ、この内容は本明細書に組み込まれる。また、特開2012-208494号公報の段落番号0477(対応する米国特許出願公開第2012/0235099号明細書の段落番号0585)に記載の重合性モノマー等が挙げられ、これらの内容は本明細書に組み込まれる。
また、ジグリセリンEO(エチレンオキシド)変性(メタ)アクリレート(市販品としては M-460;東亞合成製)が好ましい。ペンタエリスリトールテトラアクリレート(新中村化学工業社製、A-TMMT)、1,6-ヘキサンジオールジアクリレート(日本化薬社製、KAYARAD HDDA)も好ましい。これらのオリゴマータイプも使用できる。例えば、RP-1040(日本化薬株式会社製)などが挙げられる。
市販品としては、ウレタンオリゴマーUAS-10、UAB-140(山陽国策パルプ社製)、UA-7200(新中村化学工業社製)、DPHA-40H(日本化薬社製)、UA-306H、UA-306T、UA-306I、AH-600、T-600、AI-600(共栄社化学(株)製)などが挙げられる。
硬化性化合物として、エポキシ基を有する化合物を用いることもできる。エポキシ基を有する化合物としては、単官能または多官能グリシジルエーテル化合物や、多官能脂肪族グリシジルエーテル化合物などが挙げられる。また、グリシジル(メタ)アクリレートやアリルグリシジルエーテル等のグリシジル基を有する化合物や、脂環式エポキシ基を有する化合物を用いることもできる。
硬化性化合物として、アルコキシシリル基を有する化合物を用いることもできる。アルコキシシリル基におけるアルコキシ基の炭素数は、1~5が好ましく、1~3がより好ましく、1または2が特に好ましい。アルコキシシリル基は、一分子中に2個以上有することが好ましく、2~3個有することがさらに好ましい。アルコキシシリル基を有する化合物の具体例としては、メチルトリメトキシシラン、ジメチルジメトキシシラン、フェニルトリメトキシシラン、メチルトリエトキシシラン、ジメチルジエトキシシラン、フェニルトリエトキシシラン、n-プロピルトリメトキシシラン、n-プロピルトリエトキシシラン、ヘキシルトリメトキシシラン、ヘキシルトリエトキシシラン、オクチルトリエトキシシラン、デシルトリメトキシシラン、1,6-ビス(トリメトキシシリル)ヘキサン、トリフルオロプロピルトリメトキシシラン、ヘキサメチルジシラザン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-グリシドキシプロピルトリエトキシシラン、p-スチリルトリメトキシシラン、3-メタクリロキシプロピルメチルジメトキシシラン、3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-アクリロキシプロピルトリメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン、N-2-(アミノエチル)-3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミン、N-フェニル-3-アミノプロピルトリメトキシシラン、N-(ビニルベンジル)-2-アミノエチル-3-アミノプロピルトリメトキシシランの塩酸塩、トリス-(トリメトキシシリルプロピル)イソシアヌレート、3-ウレイドプロピルトリエトキシシラン、3-メルカプトプロピルメチルジメトキシシラン、3-メルカプトプロピルトリメトキシシラン、ビス(トリエトキシシリルプロピル)テトラスルフィド、3-イソシアネートプロピルトリエトキシシランなどが挙げられる。また、上記以外にアルコキシオリゴマーを用いることができる。また、下記化合物を用いることもできる。
また、アルコキシシリル基を有する化合物は、アルコキシシリル基を側鎖に有するポリマーを用いることもできる。
硬化性化合物として、メチロール基を有する化合物を用いることもできる。メチロール基を有する化合物としては、メチロール基が、窒素原子または芳香族環を形成する炭素原子に結合している化合物が挙げられる。
(式(8-1)~(8-4)中、X2は2価の有機基を表し、R7~R11はそれぞれ独立に水素原子または一価の有機基を表す。)
(式(4)中、Xは単結合または1~4価の有機基を表し、R11、R12はそれぞれ独立に水素原子または一価の有機基を表し、nは1~4の整数であり、pおよびqはそれぞれ独立に0~4の整数である。ただし、nが1である場合、pは1~4の整数である。nが2~4の整数である場合、pは0~4の整数であるが、式(4)中に1つ以上の-CH2OR11を含む。)
(式(5)中、2つのYはそれぞれ独立に水素原子または炭素原子数1~10のアルキル基を表し、酸素原子、フッ素原子を含んでいてもよい。R13~R16はそれぞれ独立に水素原子または一価の有機基を表す。mおよびnはそれぞれ独立に1~3の整数であり、pおよびqはそれぞれ独立に0~4の整数である。)
組成物は、樹脂を含有することができる。樹脂は、例えば、顔料などを組成物中で分散させる用途、バインダーの用途で配合される。なお、主に顔料などを分散させるために用いられる樹脂を分散剤ともいう。ただし、このような用途は一例であって、このような用途以外を目的として樹脂を使用することもできる。
スチレン樹脂としては、ポリヒドロキシスチレンなどが挙げられる。
式(ED2)中、Rは水素原子または炭素数1~30の有機基を表す。式(ED2)の具体例としては、特開2010-168539号公報の記載を参酌できる。
式(X)において、R1は水素原子またはメチル基を表し、R2は炭素数2~10のアルキレン基を表し、R3は水素原子またはベンゼン環を含んでもよい炭素数1~20のアルキル基を表す。nは1~15の整数を表す。
式中、R5は水素原子またはアルキル基を表し、L4~L7はそれぞれ独立に単結合または2価の連結基を表し、R10~R13はそれぞれ独立にアルキル基またはアリール基を表す。R14およびR15はそれぞれ独立に水素原子または置換基を表す。
L4~L7は、式(A2-1)~(A2-4)のL51と同義であり、好ましい範囲も同様である。
ル基が好ましい。
また、樹脂は、マープルーフG-0150M、G-0105SA、G-0130SP、G-0250SP、G-1005S、G-1005SA、G-1010S、G-2050M、G-01100、G-01758(日油(株)製、エポキシ基含有ポリマー)を使用することも好ましい。
分散剤として働く樹脂は、酸性型の樹脂および/または塩基性型の樹脂が好ましい。
ここで、酸性型の樹脂とは、酸基の量が塩基性基の量よりも多い樹脂を表す。酸性型の樹脂は、樹脂中の酸基の量と塩基性基の量の合計量を100モル%としたときに、酸基の量が70モル%以上を占めるものが好ましく、実質的に酸基のみからなるものがより好ましい。酸性型の樹脂が有する酸基は、カルボキシル基が好ましい。酸性型の樹脂の酸価は、40~105mgKOH/gが好ましく、50~105mgKOH/gがより好ましく、60~105mgKOH/gがさらに好ましい。
また、塩基型の樹脂とは、塩基性基の量が酸基の量よりも多い樹脂を表す。塩基型の樹脂は、樹脂中の酸基の量と塩基性基の量の合計量を100モル%としたときに、塩基性基の量が50モル%以上を占めるものが好ましい。塩基性型の樹脂が有する塩基性基は、アミンが好ましい。
末端変性型高分子としては、例えば、特開平3-112992号公報、特表2003-533455号公報等に記載の末端にリン酸基を有する高分子、特開2002-273191号公報等に記載の末端にスルホン酸基を有する高分子、特開平9-77994号公報等に記載の有機色素の部分骨格や複素環を有する高分子などが挙げられる。また、特開2007-277514号公報に記載の高分子末端に2個以上の顔料表面へのアンカー部位(酸基、塩基性基、有機色素の部分骨格やヘテロ環等)を導入した高分子も分散安定性に優れ好ましい。
グラフト型高分子としては、例えば、特開昭54-37082号公報、特表平8-507960号公報、特開2009-258668公報等に記載のポリ(低級アルキレンイミン)とポリエステルの反応生成物、特開平9-169821号公報等に記載のポリアリルアミンとポリエステルの反応生成物、特開平10-339949号公報、特開2004-37986号公報等に記載のマクロモノマーと、窒素原子を含有するモノマーとの共重合体、特開2003-238837号公報、特開2008-9426号公報、特開2008-81732号公報等に記載の有機色素の部分骨格や複素環を有するグラフト型高分子、特開2010-106268号公報等に記載のマクロモノマーと酸基含有モノマーの共重合体などが挙げられる。マクロモノマーとしては、例えば、東亞合成(株)製のマクロモノマーAA-6(末端基がメタクリロイル基であるポリメタクリル酸メチル)、AS-6(末端基がメタクリロイル基であるポリスチレン)、AN-6S(末端基がメタクリロイル基であるスチレンとアクリロニトリルの共重合体)、AB-6(末端基がメタクリロイル基であるポリアクリル酸ブチル)、(株)ダイセル製のプラクセルFM5(メタクリル酸2-ヒドロキシエチルのε-カプロラクトン5モル当量付加品)、FA10L(アクリル酸2-ヒドロキシエチルのε-カプロラクトン10モル当量付加品)、及び特開平2-272009号公報に記載のポリエステル系マクロモノマー等が挙げられる。
ブロック型高分子としては、特開2003-49110号公報、特開2009-52010号公報等に記載のブロック型高分子が好ましい。
上記グラフト共重合体については、特開2012-255128号公報の段落番号0025~0069の記載を参酌でき、本明細書には上記内容が組み込まれる。
上記グラフト共重合体の具体例としては、例えば、以下が挙げられる。また、特開2012-255128号公報の段落番号0072~0094に記載の樹脂を用いることができる。
オリゴイミン系樹脂は、例えば、下記式(I-1)で表される構造単位と、式(I-2)で表される構造単位、および/または、式(I-2a)で表される構造単位を含む樹脂などが挙げられる。
R1およびR2はそれぞれ独立に、水素原子、ハロゲン原子又はアルキル基(炭素数1~6が好ましい)を表す。aはそれぞれ独立に1~5の整数を表す。*は構造単位間の連結部を表す。
R8およびR9はR1と同義の基である。
Lは単結合、アルキレン基(炭素数1~6が好ましい)、アルケニレン基(炭素数2~6が好ましい)、アリーレン基(炭素数6~24が好ましい)、ヘテロアリーレン基(炭素数1~6が好ましい)、イミノ基(炭素数0~6が好ましい)、エーテル基、チオエーテル基、カルボニル基、またはこれらの組合せに係る連結基である。なかでも、単結合もしくは-CR5R6-NR7-(イミノ基がXもしくはYの方になる)であることが好ましい。ここで、R5およびR6はそれぞれ独立に、水素原子、ハロゲン原子、アルキル基(炭素数1~6が好ましい)を表す。R7は水素原子または炭素数1~6のアルキル基である。
LaはCR8CR9とNとともに環構造を形成する構造部位であり、CR8CR9の炭素原子と合わせて炭素数3~7の非芳香族複素環を形成する構造部位であることが好ましい。さらに好ましくは、CR8CR9の炭素原子およびN(窒素原子)を合わせて5~7員の非芳香族複素環を形成する構造部位であり、より好ましくは5員の非芳香族複素環を形成する構造部位であり、ピロリジンを形成する構造部位であることが特に好ましい。この構造部位はさらにアルキル基等の置換基を有していてもよい。
XはpKa14以下の官能基を有する基を表す。
Yは原子数40~10,000の側鎖を表す。
上記樹脂(オリゴイミン系樹脂)は、さらに式(I-3)、式(I-4)、および式(I-5)で表される構造単位から選ばれる1種以上を共重合成分として含有していてもよい。上記樹脂が、このような構造単位を含むことで、顔料の分散性能を更に向上させることができる。
Yaはアニオン基を有する原子数40~10,000の側鎖を表す。式(I-3)で表される構造単位は、主鎖部に一級又は二級アミノ基を有する樹脂に、アミンと反応して塩を形成する基を有するオリゴマー又はポリマーを添加して反応させることで形成することが可能である。
Xは単結合、メチレン基、-O-、-C(=O)-であることが好ましく、-C(=O)-であることが特に好ましい。
組成物は、光重合開始剤を含有することができる。特に、組成物が、エチレン性不飽和結合を有する基を有する樹脂や硬化性化合物など、ラジカル重合性成分を含む場合、光重合開始剤を含有することが好ましい。光重合開始剤としては、特に制限はなく、公知の光重合開始剤の中から適宜選択することができる。例えば、紫外線領域から可視領域の光線に対して感光性を有するものが好ましい。光重合開始剤は、光ラジカル重合開始剤が好ましい。また、光重合開始剤は、約300nm~800nm(330nm~500nmがより好ましい。)の範囲内に少なくとも約50のモル吸光係数を有する化合物を、少なくとも1種含有していることが好ましい。
アシルホスフィン化合物としては、市販品であるIRGACURE-819やDAROCUR-TPO(商品名、いずれもBASF社製)を用いることができる。
好ましくは、例えば、特開2013-29760号公報の段落番号0274~0275を参酌することができ、この内容は本明細書に組み込まれる。
具体的には、オキシム化合物としては、下記式(OX-1)で表される化合物が好ましい。オキシム化合物は、オキシムのN-O結合が(E)体のオキシム化合物であってもよく、オキシムのN-O結合が(Z)体のオキシム化合物であってもよく、(E)体と(Z)体との混合物であってもよい。
式(OX-1)中、Rで表される一価の置換基としては、一価の非金属原子団であることが好ましい。
一価の非金属原子団としては、アルキル基、アリール基、アシル基、アルコキシカルボニル基、アリールオキシカルボニル基、複素環基、アルキルチオカルボニル基、アリールチオカルボニル基等が挙げられる。また、これらの基は、1以上の置換基を有していてもよい。また、前述した置換基は、さらに他の置換基で置換されていてもよい。
置換基としてはハロゲン原子、アリールオキシ基、アルコキシカルボニル基またはアリールオキシカルボニル基、アシルオキシ基、アシル基、アルキル基、アリール基等が挙げられる。
式(OX-1)中、Bで表される一価の置換基としては、アリール基、複素環基、アリールカルボニル基、又は、複素環カルボニル基が好ましい。これらの基は1以上の置換基を有していてもよい。置換基としては、前述した置換基が例示できる。
式(OX-1)中、Aで表される二価の有機基としては、炭素数1~12のアルキレン基、シクロアルキレン基、アルキニレン基が好ましい。これらの基は1以上の置換基を有していてもよい。置換基としては、前述した置換基が例示できる。
組成物は、酸発生剤を含有することができる。特に、硬化性化合物として、エポキシ基を有する化合物やメチロール基を有する化合物を用いた場合、酸発生剤を含有することが好ましい。酸発生剤は、光照射により酸を発生する化合物(光酸発生剤)が好ましい。酸発生剤は、光照射により分解して酸を発生する、ジアゾニウム塩、ホスホニウム塩、スルホニウム塩、ヨードニウム塩などのオニウム塩化合物、イミドスルホネート、オキシムスルホネート、ジアゾジスルホン、ジスルホン、o-ニトロベンジルスルホネート等のスルホネート化合物などを挙げることができる。
酸発生剤の種類、具体的化合物、および好ましい例としては、特開2008-13646号公報の段落番号0066~0122に記載の化合物などを挙げることができ、これらを本発明にも適用することができる。例えば、トリエチルアンモニウムノナフレート等が挙げられる。
組成物は、触媒をさらに含有することができる。特に、硬化性化合物として、アルコキシシリル基を有する化合物を用いた場合、触媒を含有することで、ゾルゲル反応が促進して、強固な硬化膜が得られる。触媒としては、酸触媒、塩基触媒などが挙げられる。酸触媒としては、塩酸、硝酸、硫酸、亜硫酸、硫化水素、過塩素酸、過酸化水素、炭酸、蟻酸や酢酸等のカルボン酸、RCOOHで示される構造式のRを他元素または置換基によって置換した置換カルボン酸、ベンゼンスルホン酸などのスルホン酸、リン酸などが挙げられる。さらに、塩化アルミニウム、アルミニウムアセチルアセトナート、塩化亜鉛、塩化スズ、三フッ化ホウ素ジエチルエーテル錯体、ヨードトリメチルシランなどのルイス酸を用いてもよい。また塩基触媒としては、アンモニア水などのアンモニア性塩基化合物、エチルアミンやアニリンなどの有機アミンなどが挙げられる。また、触媒は、特開2013-201007号公報の段落番号0070~0076に記載の触媒を用いることもできる。
触媒の含有量は、硬化性化合物の100質量部(好ましくはアルコキシシリル基を有する化合物の100質量部)に対し0.1~100質量部が好ましく、より好ましくは0.1~50質量部であり、さらに好ましくは0.1~20質量部である。組成物は、触媒を1種類のみを含んでいてもよいし、2種類以上含んでいてもよい。2種類以上含む場合は、その合計量が上記範囲となることが好ましい。
組成物は、溶剤を含有することができる。溶剤としては、有機溶剤が挙げられる。溶剤は、各成分の溶解性や組成物の塗布性を満足すれば基本的には特に制限はないが、組成物の塗布性、安全性を考慮して選ばれることが好ましい。
エステル類として、例えば、酢酸エチル、酢酸-n-ブチル、酢酸イソブチル、酢酸シクロヘキシル、ギ酸アミル、酢酸イソアミル、プロピオン酸ブチル、酪酸イソプロピル、酪酸エチル、酪酸ブチル、乳酸メチル、乳酸エチル、アルキルオキシ酢酸アルキル(例えば、アルキルオキシ酢酸メチル、アルキルオキシ酢酸エチル、アルキルオキシ酢酸ブチル(例えば、メトキシ酢酸メチル、メトキシ酢酸エチル、メトキシ酢酸ブチル、エトキシ酢酸メチル、エトキシ酢酸エチル等))、3-アルキルオキシプロピオン酸アルキルエステル類(例えば、3-アルキルオキシプロピオン酸メチル、3-アルキルオキシプロピオン酸エチル等(例えば、3-メトキシプロピオン酸メチル、3-メトキシプロピオン酸エチル、3-エトキシプロピオン酸メチル、3-エトキシプロピオン酸エチル等))、2-アルキルオキシプロピオン酸アルキルエステル類(例えば、2-アルキルオキシプロピオン酸メチル、2-アルキルオキシプロピオン酸エチル、2-アルキルオキシプロピオン酸プロピル等(例えば、2-メトキシプロピオン酸メチル、2-メトキシプロピオン酸エチル、2-メトキシプロピオン酸プロピル、2-エトキシプロピオン酸メチル、2-エトキシプロピオン酸エチル))、2-アルキルオキシ-2-メチルプロピオン酸メチル及び2-アルキルオキシ-2-メチルプロピオン酸エチル(例えば、2-メトキシ-2-メチルプロピオン酸メチル、2-エトキシ-2-メチルプロピオン酸エチル等)、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル、アセト酢酸メチル、アセト酢酸エチル、2-オキソブタン酸メチル、2-オキソブタン酸エチル等、並びに、エーテル類として、例えば、ジエチレングリコールジメチルエーテル、テトラヒドロフラン、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、メチルセロソルブアセテート、エチルセロソルブアセテート、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノブチルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート等、並びに、ケトン類として、例えば、メチルエチルケトン、シクロヘキサノン、シクロペンタノン、2-ヘプタノン、3-ヘプタノン等、並びに、芳香族炭化水素類として、例えば、トルエン、キシレン等が好適に挙げられる。
組成物は、組成物の製造中又は保存中において、硬化性化合物の不要な熱重合を阻止するために、重合禁止剤を含有してもよい。
重合禁止剤としては、ハイドロキノン、p-メトキシフェノール、ジ-tert-ブチル-p-クレゾール、ピロガロール、tert-ブチルカテコール、ベンゾキノン、4,4’-チオビス(3-メチル-6-tert-ブチルフェノール)、2,2’-メチレンビス(4-メチル-6-t-ブチルフェノール)、N-ニトロソフェニルヒドロキシアミン塩(アンモニウム塩、第一セリウム塩等)が挙げられる。中でも、p-メトキシフェノールが好ましい。
重合禁止剤の含有量は、組成物の全固形分に対して、0.01~5質量%が好ましい。
組成物は、塗布性をより向上させる観点から、各種の界面活性剤を含有してもよい。界面活性剤としては、フッ素系界面活性剤、ノニオン系界面活性剤、カチオン系界面活性剤、アニオン系界面活性剤、シリコーン系界面活性剤などの各種界面活性剤を使用できる。
上記の化合物の重量平均分子量は、好ましくは3,000~50,000であり、例えば、14,000である。
界面活性剤の含有量は、組成物の全固形分に対して、0.001~2.0質量%が好ましく、0.005~1.0質量%がより好ましい。
R3及びR4は、電子求引性基を表す。電子求引性基は、ハメットの置換基定数σp値(以下、単に「σp値」という。)が、0.20以上1.0以下の基であることが好ましく、σp値が0.30以上0.8以下の基であることがより好ましい。R3、R4としては、アシル基、カルバモイル基、アルキルオキシカルボニル基、アリールオキシカルボニル基、シアノ基、ニトロ基、アルキルスルホニル基、アリールスルホニル基、スルホニルオキシ基、スルファモイル基が好ましく、特にアシル基、カルバモイル基、アルキルオキシカルボニル基、アリールオキシカルボニル基、シアノ基、アルキルスルホニル基、アリールスルホニル基、スルホニルオキシ基、スルファモイル基が好ましい。上記式(1)については、特開2010-049029号公報の段落番号0148~0158の記載を参酌でき、この内容は本明細書に組み込まれる。
紫外線吸収剤の市販品としては、例えば、UV503(大東化学株式会社)などが挙げられる。
紫外線吸収剤の含有量は、組成物の全固形分に対して、0.01~10質量%が好ましく、0.01~5質量%がより好ましい。
組成物は、必要に応じて、分散剤、増感剤、硬化促進剤、フィラー、熱硬化促進剤、熱重合禁止剤、可塑剤、密着促進剤及びその他の助剤類(例えば、導電性粒子、充填剤、消泡剤、難燃剤、レベリング剤、剥離促進剤、酸化防止剤、香料、表面張力調整剤、連鎖移動剤など)を含有してもよい。これらの成分を適宜含有させることにより、目的とする近赤外線カットフィルタなどの光学フィルタの安定性、膜物性などの性質を調整することができる。これらの成分は、例えば、特開2012-003225号公報の段落番号0183(対応する米国特許出願公開第2013/0034812号明細書の段落番号0237)の記載、特開2008-250074号公報の段落番号0101~0104、0107~0109等の記載を参酌でき、これらの内容は本明細書に組み込まれる。また、酸化防止剤としては、フェノール化合物、亜リン酸エステル化合物、チオエーテル化合物などが挙げられる。分子量500以上のフェノール化合物、分子量500以上の亜リン酸エステル化合物又は分子量500以上のチオエーテル化合物がより好ましい。これらは2種以上を混合して使用してもよい。フェノール化合物としては、フェノール系酸化防止剤として知られる任意のフェノール化合物を使用することができる。好ましいフェノール化合物としては、ヒンダードフェノール化合物が挙げられる。特に、フェノール性水酸基に隣接する部位(オルト位)に置換基を有する化合物が好ましい。前述の置換基としては炭素数1~22の置換又は無置換のアルキル基が好ましく、メチル基、エチル基、プロピオニル基、イソプロピオニル基、ブチル基、イソブチル基、t-ブチル基、ペンチル基、イソペンチル基、t-ペンチル基、ヘキシル基、オクチル基、イソオクチル基、2-エチルへキシル基がより好ましい。また、同一分子内にフェノール基と亜リン酸エステル基を有する化合物(酸化防止剤)も好ましい。また、酸化防止剤は、リン系酸化防止剤も好適に使用することができる。リン系酸化防止剤としてはトリス[2-[[2,4,8,10-テトラキス(1,1-ジメチルエチル)ジベンゾ[d,f][1,3,2]ジオキサホスフェピン-6-イル]オキシ]エチル]アミン、トリス[2-[(4,6,9,11-テトラ-tert-ブチルジベンゾ[d,f][1,3,2]ジオキサホスフェピン-2-イル)オキシ]エチル]アミン、および亜リン酸エチルビス(2,4-ジ-tert-ブチル-6-メチルフェニル)からなる群から選ばれる少なくとも1種の化合物が挙げられる。これらは、市販品として容易に入手可能であり、アデカスタブ AO-20、アデカスタブ AO-30、アデカスタブ AO-40、アデカスタブ AO-50、アデカスタブ AO-50F、アデカスタブ AO-60、アデカスタブ AO-60G、アデカスタブ AO-80、アデカスタブ AO-330((株)ADEKA)などが挙げられる。酸化防止剤の含有量は、組成物の全固形分に対して、0.01~20質量%であることが好ましく、0.3~15質量%であることがより好ましい。酸化防止剤は、1種類のみでもよく、2種類以上でもよい。2種類以上の場合は、合計量が上記範囲となることが好ましい。
組成物は、前述の成分を混合して調製できる。
組成物の調製に際しては、各成分を一括配合してもよいし、各成分を溶剤に溶解および/または分散した後に逐次配合してもよい。また、配合する際の投入順序や作業条件は特に制約を受けない。例えば、組成物は、全成分を同時に溶剤に溶解および/または分散して調製してもよいし、必要に応じて、各成分を適宜2つ以上の溶液または分散液とし、使用時(塗布時)にこれらを混合して調製してもよい。
フィルタの孔径は、0.01~7.0μm程度が適しており、好ましくは0.01~3.0μm程度、さらに好ましくは0.05~0.5μm程度である。この範囲とすることにより、後工程において均一な組成物の調製や、平滑な膜の形成などを阻害しうる微細な異物を確実に除去することが可能となる。また、ファイバ状のろ材を用いることも好ましく、ろ材としては例えばポリプロピレンファイバ、ナイロンファイバ、グラスファイバ等が挙げられ、具体的にはロキテクノ社製のSBPタイプシリーズ(SBP008など)、TPRタイプシリーズ(TPR002、TPR005など)、SHPXタイプシリーズ(SHPX003など)のフィルタカートリッジを用いることができる。
また、上述した範囲内で異なる孔径の第1のフィルタを組み合わせてもよい。ここでの孔径は、フィルタメーカーの公称値を参照することができる。市販のフィルタとしては、例えば、日本ポール株式会社(DFA4201NXEYなど)、アドバンテック東洋株式会社、日本インテグリス株式会社(旧日本マイクロリス株式会社)又は株式会社キッツマイクロフィルタ等が提供する各種フィルタの中から選択することができる。
第2のフィルタは、上述した第1のフィルタと同様の材料等で形成されたものを使用することができる。
例えば、第1のフィルタでのフィルタリングは、分散液のみで行い、他の成分を混合した後で、第2のフィルタリングを行ってもよい。
本発明の組成物は、固体撮像素子の受光側における近赤外線カットフィルタ(例えば、ウエハーレベルレンズに対する近赤外線カットフィルタなど)、固体撮像素子の裏面側(受光側とは反対側)における近赤外線カットフィルタなどに用いることもできる。また、組成物を、イメージセンサ上に直接塗布し塗膜形成して用いてもよい。
組成物は、塗布可能な状態で供給できることから、固体撮像素子の所望の部材や位置に近赤外線カットフィルタを容易に形成できる。
また、本発明の組成物を、ガラス基材や、銅を含有する層に適用してもよい。
また、組成物が有彩色着色剤を含む場合、カラーフィルタの画素形成に用いることもできる。
また、組成物を用いた画素と、赤、緑、青、マゼンタ、黄、シアン、黒および無色から選ばれる画素とを組み合わせてカラーフィルタとしてもよい。
次に、本発明の膜について説明する。本発明の膜は、上述した組成物を用いて形成されるものである。本発明の膜は、赤外線遮蔽性および可視透明性に優れ、分光変動が生じにくい(特に、高温高湿の環境に曝されても分光変動が生じにくい)ので、近赤外線カットフィルタ、赤外線透過フィルタとして好ましく用いることができる。また、熱線遮蔽フィルタとして用いることもできる。膜は、パターンを有していてもよく、パターンを有さない膜(平坦膜)であってもよい。また、膜は、支持体上に積層した状態で用いてもよく、膜を支持体から剥離してもよい。なお、本発明の膜を赤外線透過フィルタとして用いる場合、赤外線透過フィルタは、例えば、可視光を遮光し、波長900nm以上の波長の光を透過するフィルタが挙げられる。なお、膜を赤外線透過フィルタとして用いる場合、上述の近赤外線吸収化合物Aと、可視光を遮光する色材(好ましくは、2種以上の有彩色着色剤を含有する色材、または、有機系黒色着色剤を少なくとも含有する色材)とを含む組成物を用いたフィルタであるか、近赤外線吸収化合物Aを含む層の他に、可視光を遮光する色材の層が別途存在するフィルタであることが好ましい。膜を赤外線透過フィルタとして用いる場合、近赤外線吸収化合物Aは、透過する光(近赤外線)をより長波長側に限定する役割を有している。
また、本発明の近赤外線カットフィルタは、上述した組成物を用いて形成されるものである。
近赤外線カットフィルタが、更に、銅を含有する層および/または誘電体多層膜を有することで、視野角が広く、赤外線遮蔽性に優れた近赤外線カットフィルタを得ることができる。また、近赤外線カットフィルタが、更に、紫外線吸収層を有することで、紫外線遮蔽性に優れた近赤外線カットフィルタとすることができる。紫外線吸収層としては、例えば、国際公開WO2015/099060号公報の段落番号0040~0070、0119~0145に記載の吸収層を参酌でき、この内容は本明細書に組み込まれる。誘電体多層膜としては、特開2014-41318号公報の段落番号0255~0259の記載を参酌でき、この内容は本明細書に組み込まれる。銅を含有する層としては、銅を含有するガラスで構成されたガラス基材(銅含有ガラス基材)や、銅錯体を含む層(銅錯体含有層)を用いることもできる。銅含有ガラス基材としては、銅を含有する燐酸塩ガラス、銅を含有する弗燐酸塩ガラスなどが挙げられる。銅含有ガラスの市販品としては、NF-50(AGCテクノグラス(株)製 商品名)、BG-60、BG-61(以上、ショット社製 商品名)、CD5000(HOYA(株)製 商品名)等が挙げられる。銅錯体含有層としては、銅錯体を含む組成物を用いて形成される層が挙げられる。銅錯体は、700~1200nmの波長領域に極大吸収波長を有する化合物が好ましい。銅錯体の極大吸収波長は、720~1200nmの波長領域に有することがより好ましく、800~1100nmの波長領域に有することがさらに好ましい。銅錯体は、上述した他の近赤外線吸収化合物で説明した材料などが挙げられる。
また、近赤外線カットフィルタの可視透明性の好ましい範囲は、波長400~550nmの平均透過率が70%以上であることが好ましく、80%以上がより好ましく、85%以上がさらに好ましく、90%以上が特に好ましい。また、波長400~550nmの全ての範囲での透過率が70%以上であることが好ましく、80%以上であることがより好ましく、90%以上であることが更に好ましい。
また、近赤外線カットフィルタの赤外線遮蔽性の好ましい範囲は用途によって異なるが、波長700~1000nmの範囲の少なくとも1点での透過率が20%以下であることが好ましく、15%以下がより好ましく、10%以下がさらに好ましい。
本発明のパターン形成方法は、本発明の組成物を用いて支持体上に組成物層を形成する工程と、フォトリソグラフィ法またはドライエッチング法により、組成物層に対してパターンを形成する工程と、を含む。
フォトリソグラフィによるパターン形成方法であると、ドライエッチング工程が不要なため工程数を削減できるという効果が得られる。
ドライエッチングによるパターン形成方法であると、本発明の組成物は、フォトリソ機能が不要なため、近赤外線吸収剤などの濃度を上げることができるという効果が得られる。
また、ドライエッチング法によるパターン形成は、各組成物を用いて支持体上に組成物層を形成し、硬化して硬化物層を形成する工程と、硬化物層上にフォトレジスト層を形成する工程と、露光および現像することによりフォトレジスト層をパターニングしてレジストパターンを得る工程と、レジストパターンをエッチングマスクとして硬化物層をドライエッチングしてパターンを形成する工程とを含むことが好ましい。以下、各工程について説明する。
組成物層を形成する工程では、各組成物を用いて、支持体上に組成物層を形成する。
パターンは、固体撮像素子用基板の固体撮像素子形成面側(おもて面)に形成してもよいし、固体撮像素子非形成面側(裏面)に形成してもよい。
支持体上には、必要により、上部の層との密着改良、物質の拡散防止或いは基板表面の平坦化のために下塗り層を設けてもよい。
プリベークを行う場合、プリベーク温度は、150℃以下が好ましく、120℃以下がより好ましく、110℃以下が更に好ましい。下限は、例えば、50℃以上とすることができ、80℃以上とすることもできる。プリベーク温度を150℃以下で行うことにより、例えば、イメージセンサの光電変換膜を有機素材で構成した場合において、これらの特性をより効果的に維持することができる。
プリベーク時間は、10秒~300秒が好ましく、40~250秒がより好ましく、80~220秒がさらに好ましい。乾燥は、ホットプレート、オーブン等で行うことができる。
<<露光工程>>
次に、組成物層を、パターン状に露光する(露光工程)。例えば、組成物層に対し、ステッパー等の露光装置を用いて、所定のマスクパターンを有するマスクを介して露光することで、パターン露光することができる。これにより、露光部分を硬化することができる。
露光に際して用いることができる放射線(光線)としては、g線、i線等の紫外線が好ましく(特に好ましくはi線)用いられる。照射量(露光量)は、例えば、0.03~2.5J/cm2が好ましく、0.05~1.0J/cm2がより好ましく、0.08~0.5J/cm2が最も好ましい。
露光時における酸素濃度については適宜選択することができ、大気下で行う他に、例えば酸素濃度が19体積%以下の低酸素雰囲気下(例えば、15体積%、5体積%、実質的に無酸素)で露光してもよく、酸素濃度が21体積%を超える高酸素雰囲気下(例えば、22体積%、30体積%、50体積%)で露光してもよい。また、露光照度は適宜設定することが可能であり、通常1000W/m2~100000W/m2(例えば、5000W/m2、15000W/m2、35000W/m2)の範囲から選択することができる。酸素濃度と露光照度は適宜条件を組み合わせてよく、例えば、酸素濃度10体積%で照度10000W/m2、酸素濃度35体積%で照度20000W/m2などとすることができる。
次に、未露光部を現像除去してパターンを形成する。未露光部の現像除去は、現像液を用いて行うことができる。これにより、露光工程における未露光部の組成物層が現像液に溶出し、光硬化した部分だけが残る。
現像液としては、下地の固体撮像素子や回路などにダメージを起さない、有機アルカリ現像液が望ましい。
現像液の温度は、例えば、20~30℃が好ましい。現像時間は、20~180秒が好ましい。また、残渣除去性を向上するため、現像液を60秒ごとに振り切り、さらに新たに現像液を供給する工程を数回繰り返してもよい。
ドライエッチング法でのパターン形成は、支持体上に形成した組成物層を硬化して硬化物層を形成し、次いで、得られた硬化物層に対してパターニングされたフォトレジスト層を形成し、このフォトレジスト層をマスクとして硬化物層に対してエッチングガスを用いてエッチングして行うことができる。フォトレジスト層の形成方法としては、硬化物層上にポジ型またはネガ型の感放射線性組成物を塗布し、これを乾燥させて形成することが好ましい。フォトレジスト層の形成においては、さらにプリベーク処理を施すことが好ましい。特に、フォトレジストの形成プロセスとしては、露光後の加熱処理、現像後の加熱処理(ポストベーク処理)を実施する形態が望ましい。ドライエッチング法でのパターン形成については、特開2013-064993号公報の段落番号0010~0067の記載を参酌でき、この内容は本明細書に組み込まれる。
本発明の固体撮像素子は、上述した本発明の膜を有する。固体撮像素子の構成としては、本発明の膜(近赤外線カットフィルタ)を有する構成であり、固体撮像素子として機能する構成であれば特に限定はないが、例えば、以下のような構成が挙げられる。
さらに、デバイス保護膜上であって、本発明の近赤外線カットフィルタの下(支持体に近い側)に集光手段(例えば、マイクロレンズ等。以下同じ)を有する構成や、本発明の膜(近赤外線カットフィルタ)上に集光手段を有する構成等であってもよい。
また、カラーフィルタは、隔壁により例えば格子状に仕切られた空間に、各色画素を形成する硬化膜が埋め込まれた構造を有していてもよい。この場合の隔壁は各色画素に対して低屈折率であることが好ましい。このような構造を有する撮像装置の例としては、特開2012-227478号公報、特開2014-179577号公報に記載の装置が挙げられる。
本発明の膜は、液晶表示装置や有機エレクトロルミネッセンス(有機EL)表示装置などの画像表示装置に用いることもできる。例えば、各着色画素(例えば赤色、緑色、青色)とともに用いることにより、表示装置のバックライト(例えば白色発光ダイオード(白色LED))に含まれる赤外光を遮断し、周辺機器の誤作動を防止する目的や、各着色表示画素に加えて赤外の画素を形成する目的で用いることが可能である。
本発明の赤外線センサは、上述した本発明の膜を有する。赤外線センサの構成としては、本発明の膜を有し、赤外線センサとして機能する構成であれば特に限定はない。
図1において、符号110は、固体撮像素子である。固体撮像素子110上に設けられている撮像領域は、近赤外線カットフィルタ111と、赤外線透過フィルタ114とを有する。また、近赤外線カットフィルタ111上には、カラーフィルタ112が積層している。カラーフィルタ112および赤外線透過フィルタ114の入射光hν側には、マイクロレンズ115が配置されている。マイクロレンズ115を覆うように平坦化層116が形成されている。
例えば、赤外LEDの発光波長が850nmである場合、近赤外線カットフィルタ111は、可視光(例えば、波長400~700nmの光)を透過し、かつ、波長850nmを超える波長の光を遮光するフィルタであることが好ましい。
また、赤外LEDの発光波長が940nmである場合、近赤外線カットフィルタ111は、可視光(例えば、波長400~700nmの光)を透過し、かつ、波長940nmを超える波長の光を遮光するフィルタであることが好ましい。
例えば、赤外LEDの発光波長が850nmである場合、赤外線透過フィルタ114は、波長400~650nmの範囲における膜の厚み方向における光透過率の最大値が30%以下であることが好ましく、20%以下であることがより好ましく、10%以下であることがさらに好ましく、0.1%以下であることが特に好ましい。この透過率は、波長400~650nmの範囲の全域で上記の条件を満たすことが好ましい。波長400~650nmの範囲における光透過率の最大値は、通常、0.1%以上である。
赤外線透過フィルタ114の分光特性、膜厚等の測定方法を以下に示す。
膜厚は、膜を有する乾燥後の基板を、触針式表面形状測定器(ULVAC社製 DEKTAK150)を用いて測定した。
膜の分光特性は、紫外可視近赤外分光光度計(日立ハイテクノロジーズ社製 U-4100)を用いて、波長300~1300nmの範囲において透過率を測定した値である。
また、近赤外線カットフィルタ111として、近赤外線吸収化合物の他に、更に、有彩色着色剤を含むものを用い、近赤外線カットフィルタ111がカラーフィルタとしての機能を有する場合においては、図8に示すように、カラーフィルタ112を省略することもできる。図8において、符号111aは、有彩色着色剤を含む近赤外線カットフィルタであり、カラーフィルタの機能を兼ね備えた近赤外線カットフィルタである。
(合成例1) 化合物II-186の合成
Chem.Eur.J.2009,15,4857を参考にして化合物II-186を合成した。
60質量%の水素化ナトリウム18.2質量部と、テトラヒドロフラン200質量部とをフラスコに入れ、氷浴下でシアノ酢酸tert-ブチル60質量部を滴下した。室温で1時間攪拌した後に、2-クロロ-6-メチル-ベンゾオキサゾール25質量部を添加し、12時間攪拌した。反応液を1000質量部の水に注ぎ、酢酸100質量部を加え、析出物を濾取し、ヘキサンで洗浄した。この結晶を50℃で送風乾燥することで、中間体Aを39質量部得た。
中間体Aの39質量部と、トリフルオロ酢酸50質量部と、クロロホルム300質量部をフラスコに入れ、60℃で1時間攪拌した。反応後、炭酸ナトリウム水溶液を加え、分液操作により有機相を取り出した。有機相を飽和塩化ナトリウム水溶液で洗浄した後、溶媒を減圧留去して淡黄色固体を得た。得られた淡黄色固体をシリカカラムクロマトグラフィ(ヘキサン/クロロホルム溶媒)で精製し、中間体a-1を13質量部得た。
イソオクタデカノール(ファインオキソコール180、日産化学工業(株)製)21.6質量部、トリエチルアミンをトルエン80質量部中で攪拌し、-10℃下で、メタンスルホニルクロリド10質量部を滴下した。滴下終了後、30℃で2時間反応させた。分液操作により有機相を取り出し、溶媒を減圧留去した。溶媒を留去したのち、3-シアノフェノール10.5質量部、炭酸カリウム13.9質量部、ジメチルアセトアミド16質量部中を加えて、100℃で24時間反応させた。分液操作により有機相を取り出し、有機相を水酸化ナトリウム水溶液で洗浄した後、溶媒を減圧留去することで、淡黄色液体である化合物Aを28質量部得た。
化合物Aの30質量部、コハク酸ジイソプロピル9質量部、tert-アミルアルコール40質量部、カリウムtert-ブトキシド16.5質量部をフラスコに入れ、120℃で3時間攪拌した。反応後、メタノール100質量部、水100質量部を加え、析出物を濾取した。この結晶を50℃で送風乾燥することで、化合物Bを20質量部得た。
化合物Bの20質量部と、中間体a-1の9.4質量部とを、トルエン400質量部中で攪拌し、次いで、オキシ塩化リン20.9質量部を加えて4.5時間加熱還流した。反応後、室温まで冷却して、メタノール800質量部を加え、室温で30分間攪拌した。析出した結晶をろ別し、メタノール400質量部で洗浄した。得られた結晶を40℃で12時間送風乾燥させることで、化合物Cを13質量部得た。
ジフェニルボリン酸2-アミノエチル7.5質量部を含有するトルエン90質量部中に、塩化チタン10.5質量部を添加し、35℃で30分間撹拌した。次に、化合物Cの9質量部を添加し、さらに2時間加熱還流条件で攪拌した。室温まで冷却して、メタノール100質量部を加え、さらに30分攪拌した。析出した結晶を濾取し、シリカカラムクロマトグラフィ(クロロホルム溶媒)で精製し、化合物II-186を8.8質量部得た。
1H-NMR(CDCl3):δ0.75-1.88(m,70H),2.13(s,6H),3.75(m,4H),6.20(s,2H),6.42(d,4H),6.64(d,4H),6.93(d,2H)7.12-7.22(m,22H)
化合物II-9、II-10、II-27、II-43、II-44、II-167、II-168、II-184、II-185、II-201、II-202、II-325、II-507、II-508、II-524、II-525、II-541、II-673、II-697、II-715、III-9、III-28、III-29、III-167、III-328、III-349、III-358およびIII-365を、化合物II-186と同様の方法で合成した。
中間体a-1と同様の方法で合成した中間体a-2を用いて化合物Dを合成した。
2-クロロ-1,3,2-ベンゾジオキサボロールを10質量部含有するトルエン200質量部中に、化合物Dの20質量部を添加後、ジイソプロピルエチルアミン11質量部を添加し、100℃で1時間攪拌した。室温まで冷却したのち、メタノール400質量部を加え、さらに30分攪拌した。析出した結晶を濾取し、シリカカラムクロマトグラフィ(クロロホルム溶媒)で精製し、化合物II-408を13質量部得た。
1H-NMR(CDCl3):δ0.85-2.02(m,70H),3.70(m,4H),6.44(m,4H),6.63(m,8H),6.95(m,6H),7.29(m,2H)7.41(dd,2H)
化合物II-91、II-269、II-274、II-275、II-589およびII-590を化合物II-408と同様の方法で合成した。
化合物Bの20質量部にオキシ塩化リン35質量部を加えて2時間加熱還流した。反応後、過剰のオキシ塩化リンを減圧留去した後、トルエン200質量部、2-(2-ベンゾチアゾリル)アセトニトリル4.7質量部を加えて1時間加熱還流した。室温まで冷却して、クロロホルム200質量部、水200質量部を加え、分液操作により有機相を取り出した。有機相を飽和塩化ナトリウム水溶液で洗浄した後、溶媒を減圧留去することで、化合物Eを11質量部得た。化合物Eの8質量部と、中間体a-1の2.2質量部とを、トルエン80質量部中で攪拌し、次いで、オキシ塩化リン4質量部を加えて2時間加熱還流した。反応後、室温まで冷却して、メタノール150質量部を加え、室温で30分間攪拌した。析出した結晶をろ別し、メタノール100質量部で洗浄した。得られた結晶を40℃で12時間送風乾燥させることで、化合物Fを6質量部得た。
2-クロロ-1,3,2-ベンゾジオキサボロールを2.5質量部含有するトルエン50質量部中に、化合物Fの4.5質量部を添加した。次いで、ジイソプロピルエチルアミン2.5質量部を添加し、100℃で1時間攪拌した。室温まで冷却したのち、メタノール90質量部を加え、さらに30分攪拌した。析出した結晶を濾取し、シリカカラムクロマトグラフィ(クロロホルム溶媒)で精製し、化合物IV-92を3質量部得た。
1H-NMR(CDCl3):δ0.85-2.02(m,70H),2.14(s,3H),3.60-3,87(m,4H),6.40(m,4H),6.45(s,1H),6.60(m,6H),6.86(m,1H),6.89-7.00(m,5H),7.10(d,2H),7.19(t,1H),7.30(t,1H),7.34(d,1H)
化合物IV-7およびIV-91を、化合物III-92と同様の方法で合成した。
イソオクタデカノール(ファインオキソコール180、日産化学工業(株)製)21.6質量部、トリエチルアミン9.7質量部、トルエン80質量部を加え攪拌し、これに液温10℃以下で、メタンスルホニルクロリド10質量部を滴下した。滴下終了後、30℃で2時間反応させた。分液操作により有機相を取り出し、溶媒を減圧留去した。溶媒を留去したのち、4-シアノフェノール10.5質量部、炭酸カリウム13.3質量部、ジメチルアセトアミド24質量部中を加えて、110℃で24時間反応させた。分液操作により有機相を取り出し、有機相を水酸化ナトリウム水溶液で洗浄した後、溶媒を減圧留去することで、淡黄色液体である化合物Gを28質量部得た。
次に、化合物Gの13質量部、コハク酸ジイソプロピル4.2質量部、t-アミルアルコール18質量部、カリウムt-ブトキシド7.7質量部をフラスコに入れ、120℃で6時間攪拌した。反応後、メタノール36質量部、水36質量部を加え、析出物を濾取して結晶を得た。この結晶を50℃で送風乾燥することで、化合物Hを5.1質量部得た。
次に、化合物Hの5質量部と、国際公開WO2015/166873号公報に記載の方法で合成した中間体a-3の3.5質量部とを、トルエン100質量部中で加熱攪拌し、次いで、オキシ塩化リン3.8質量部を加えて4時間加熱還流した。反応後、反応液を室温まで冷却し、次いで、メタノール200質量部を加え、室温で30分間攪拌した。析出した結晶をろ別し、メタノール400質量部で洗浄した。得られた結晶を50℃で12時間送風乾燥させることで、化合物Iを3.1質量部得た。
次に、ジフェニルボリン酸2-アミノエチル2.2質量部を含有するトルエン20質量部中に、塩化チタン3.1質量部を添加し、35℃で30分間撹拌した。次に、化合物Iの1.7質量部を添加し、さらに3時間加熱還流条件で攪拌した。室温まで冷却して、メタノール40質量部を加え、さらに30分攪拌した。析出した結晶を濾取し、シリカカラムクロマトグラフィ(クロロホルム溶媒)で精製し、化合物III-168を1.8質量部の量で得た。
1H-NMR(CDCl3):δ8.99(s、2H)、8.16(s、2H)、7.78(s、2H)、7.26(s、10H)、7.19(s、10H)、6.58(d、4H)、6.18(d、4H)、3.95~3.82(m、4H)、1.98~1.67(m、4H)、1.45~1.08(m、18H)、1.03~0.95(m、48H)、であった。
各化合物を、下記表に記載の測定溶媒に溶かし(濃度2.5×10-6mol/L)、吸収スペクトルを測定した(光路長10mm)。
各化合物の吸収スペクトルの極大吸収波長(λmax)を下記表に示す。
また波長500nmの吸光度を、極大吸収波長の吸光度で割った値である吸光度比(500nm/λmax)を以下の基準で評価した。
A:吸光度比(500nm/λmax)が0.04以下
B:吸光度比(500nm/λmax)が0.04を超え、0.08以下
C:吸光度比(500nm/λmax)が0.08を超える
各化合物を、大気圧下で、23℃の水に添加し、1時間攪拌したのち、各化合物の水に対する溶解度を求めた。以下の基準で、化合物の溶解性を評価した。
A:23℃の水に対する溶解度が0.1質量%以下
B:23℃の水に対する溶解度が0.1質量%を超え、1質量%以下
C:23℃の水に対する溶解度が1質量%を超える
(銅を含有する層の作製)
下記銅錯体1を6.55質量部と、下記銅錯体2を19.65質量部と、以下に示す樹脂1を61.9質量部と、IRGACURE-OXE02(BASF社製)を5質量部と、トリス(2,4-ペンタンジオナト)アルミニウム(III)(東京化成工業(株)製)を0.025質量部と、KBM-3066(信越化学工業(株)製)を6.875質量部と、シクロペンタノンを24.344質量部と、酢酸ブチルを75.656質量部と、水0.1質量部とを混合し、撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して銅錯体含有組成物1を調製した。
銅錯体1
銅錯体2
樹脂1(Mw=1.5万、主鎖に付記した数値は、各構造単位のモル比である)
下記の組成を混合および撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して組成物を調製した。
第1の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
第2の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
樹脂1、樹脂2または樹脂3(下記表に示す樹脂)・・・・・7.51部
樹脂1:下記構造の樹脂(Mw=40,000)
樹脂2:ARTON F4520(JSR(株)製)
樹脂3:下記構造の樹脂(構造単位における比はモル比である)、Mw=11500
特開2012-198408号公報の段落番号0247~0249に記載の方法で合成した。
硬化性化合物1(ジペンタエリスリトールヘキサアクリレート(日本化薬社製、製品名 KAYARAD DPHA))・・・・・1.28部
光重合開始剤(IRGACURE-OXE02、BASF社製)・・・・1.40部
界面活性剤1(メガファックRS-72-K(DIC製、30%プロピレングリコールモノメチルエーテルアセテート溶液))・・・・・1.59部
シクロヘキサノン・・・・・86.3部
第1の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
第2の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
樹脂4(メタクリル酸グリシジル骨格ランダムポリマー、日油(株)製、マープルーフG-0150M、Mw=10,000)・・・・・12.9部
硬化性化合物2(OXT-221、東亞合成(株)製)・・・・・12.9部
酸発生剤1(CPI-100P、サンアプロ(株)製)・・・・・2.5部
界面活性剤2(下記混合物、Mw=14000)・・・・・0.04部
シクロヘキサノン・・・・・49.6部
プロピレングリコールモノメチルエーテルアセテート・・・・・19.3部
第1の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
第2の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
樹脂5(下記構造の樹脂(構造単位における比はモル比である)、Mw=18,000)・・・・12.9部
酸触媒(リン酸)・・・・・2.5部
界面活性剤2・・・・・0.04部
シクロヘキサノン・・・・・58.9部
プロピレングリコールモノメチルエーテルアセテート・・・・・22.9部
第1の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
第2の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
樹脂6:ポリヒドロキシスチレン(シグマアルドリッチ製、Mw=10,000)・・・・・12.9部
硬化性化合物3:1,3,4,6-テトラメトキシメチルグリコールウリル(東京化成製)・・・・・12.9部
酸発生剤2(トリエチルアンモニウムノナフレート)・・・・・2.5部
界面活性剤3(FC-4430、住友スリーエム(株)製)・・・・・0.04部
シクロヘキサノン・・・・・49.6部
プロピレングリコールモノメチルエーテルアセテート・・・・・19.3部
第1の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
第2の近赤外線吸収化合物(下記表に示す化合物)・・・・・0.96部
樹脂1・・・・・7.51部
硬化性化合物1(ジペンタエリスリトールヘキサアクリレート(日本化薬社製、製品名 KAYARAD DPHA))・・・・・1.28部
界面活性剤1(メガファックRS-72-K(DIC製、30%プロピレングリコールモノメチルエーテルアセテート溶液))・・・・・1.59部
シクロヘキサノン・・・・・86.3部
また、実施例1-11は、第2の近赤外線吸収化合物として、II-589とIV-91とII-274とを、それぞれ0.32部ずつ使用した(質量比で、II-589:IV-91:II-274=1:1:1の割合で使用した)。
また、実施例1-30は、第2の近赤外線吸収化合物として、II-408とII-91を0.48部ずつ使用した(質量比で、II-408:II-91=1:1の割合で使用した)。
また、実施例1-31は、第2の近赤外線吸収化合物として、II-29とII-408とII-91とを、それぞれ0.32部ずつ使用した(質量比で、II-29:II-408:II-91=1:1:1の割合で使用した)。
また、比較例1-1は、第1の近赤外線吸収化合物の含有量を1.92部とした。
また、比較例1-2は、第1の近赤外線吸収化合物の含有量を3.84部とした。
(実施例1-1~1-18、1-20~1-31、比較例1-1~1-6)
各組成物を、上述の銅を含有する層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。
次いで、i線ステッパーを用い、1000mJ/cm2で全面露光を行った。次いで、200℃、300秒間の後加熱(ポストベーク)を行い、近赤外線カットフィルタを製造した。
実施例1-19の組成物を、上述の銅を含有する層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行い、近赤外線カットフィルタを製造した。
近赤外線カットフィルタの波長700nm~800nmの透過率を分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定した。赤外線遮蔽性を以下の基準で評価した。結果を以下の表に示す。
A:波長700~800nmで最も透過率の低い値≦1%
B:1%<波長700~800nmで最も透過率の低い値≦5%
C:5%<波長700~800nmで最も透過率の低い値≦10%
D:10%<波長700~800nmで最も透過率の低い値≦20%
E:20%<波長700~800nmで最も透過率の低い値
上記のようにして得た近赤外線カットフィルタにおける波長400~550nmの平均透過率を分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定した。可視透明性を以下の基準で評価した。結果を以下の表に示す。
A:90%≦波長400~550nmの平均透過率
B:85%≦波長400~550nmの平均透過率<90%
C:波長400~550nmの平均透過率<85%
近赤外線カットフィルタを、85℃、相対湿度85%の高温高湿の環境下で1時間放置した。耐湿性試験前と耐湿性試験後とのそれぞれにおいて、近赤外線カットフィルタの波長700~1400nmにおける最大吸光度(Absλmax)と、波長400~700nmにおける最小吸光度(Absλmin)とを、分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定し、「Absλmax/Absλmin」で表される吸光度比を求めた。|(試験前における吸光度比-試験後における吸光度比)/試験前における吸光度比×100|(%)で表される吸光度比変化率を、以下の基準で評価した。結果を以下の表に示す。
A:吸光度比変化率≦2%
B:2%<吸光度比変化率≦4%
C:4%<吸光度比変化率≦7%
D:7%<吸光度比変化率
近赤外線カットフィルタに対し、キセノンランプを5万luxで20時間照射(100万lux・h相当)した後、耐光テスト前後の色差のΔEab値を測定した。ΔEab値が小さいほど耐光性が良好であることを示す。結果を以下の表に示す。なお、ΔEab値は、CIE1976(L*,a*,b*)空間表色系による以下の色差公式から求められる値である(日本色彩学会編 新編色彩科学ハンドブック(昭和60年)p.266)。
ΔEab={(ΔL*)2+(Δa*)2+(Δb*)2}1/2
A:ΔEab値<5
B:5≦ΔEab値<10
C:10≦ΔEab値<20
D:20≦ΔEab値
一方、比較例は、分光変動性および赤外線遮蔽の少なくとも一つが、実施例に比べて劣るものであった。
また、実施例において、銅含有層の代わりに、銅を含有する燐酸塩ガラス、又は銅を含有する弗燐酸塩ガラス上に、実施例の組成物を用いて膜を形成しても、実施例と同様の効果が得られる。
また、実施例の組成物に、銅を含有する層の形成に用いた銅錯体をさらに配合した組成物を用い、ガラス基材上に前述の組成物を用いて膜を形成しても、実施例と同様の効果が得られる。
(銅錯体含有組成物2)
テトラエトキシシランの28.9質量部と、フェニルトリエトキシシランの28.9質量部と、10質量%塩酸の30.6質量部とを室温にて4時間混合しゾルを得た。シクロペンタノン85.5質量部に、銅錯体1の26.0質量部を室温にて20分かけて溶解させた溶液を、前述のゾルに添加し、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して銅錯体含有組成物2を調製した。
銅を含有する層上に実施例の組成物を積層した膜の上に、以下のセシウム酸化タングステン含有組成物をスピンコート法で塗布し、その後ホットプレートを用いて100℃で2分間加熱して塗布層を得た。得られた塗布層を、i線ステッパーあるいはアライナーを用い、500mJ/cm2の露光量にて露光した。次いで、露光後の塗布層に対し、さらにホットプレートを用いて220℃で5分間硬化処理を行い、厚さ3.0μmの膜を形成した。
YMS-01A-2(住友金属鉱山株式会社製:セシウム酸化タングステン粒子分散液)の49.84質量部と、下記樹脂(固形分40%PGMEA溶液)の39.5質量部と、KAYARAD DPHA(日本化薬製)6.80質量部と、IRGACURE 369(BASF製)の2.18質量部と、PGMEA1.68質量部を混合および撹拌してセシウム酸化タングステン含有組成物を調製した。
樹脂:下記構造の樹脂(酸価:70mgKOH/g、Mw=11000、構造単位における比はモル比である)
以下の方法で、2層の膜から構成された近赤外線カットフィルタを形成しても実施例1-30と同様の効果が得られた。
組成6の組成物を、上述の銅を含有する層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。次いで、i線ステッパーを用い、1000mJ/cm2で全面露光を行った。次いで、200℃、300秒間の後加熱(ポストベーク)を行い、第1の近赤外線カットフィルタ層を製造した。
次に、組成7の組成物を、上述の第1の近赤外線カットフィルタ層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。次いで、i線ステッパーを用い、1000mJ/cm2で全面露光を行った。次いで、200℃、300秒間の後加熱(ポストベーク)を行い、2層からなる近赤外線カットフィルタを製造した。
第1の近赤外線吸収化合物(II-186)・・・・・0.96部
第2の近赤外線吸収化合物(II-408)・・・・・0.48部
樹脂1・・・・・7.51部
硬化性化合物1・・・・・1.28部
光重合開始剤(IRGACURE-OXE02、BASF社製)・・・・1.40部
界面活性剤1・・・・・1.59部
シクロヘキサノン・・・・・86.3部
近赤外線吸収化合物(II-91)・・・・・0.48部
樹脂1・・・・・7.51部
硬化性化合物1・・・・・1.28部
光重合開始剤(IRGACURE-OXE02、BASF社製)・・・・1.40部
界面活性剤1・・・・・1.59部
シクロヘキサノン・・・・・86.3部
以下の方法で、2層の膜から構成された近赤外線カットフィルタを形成しても実施例1-31と同様の効果が得られた。
組成8の組成物を、上述の銅を含有する層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。次いで、i線ステッパーを用い、1000mJ/cm2で全面露光を行った。次いで、200℃、300秒間の後加熱(ポストベーク)を行い、第1の近赤外線カットフィルタ層を製造した。
次に、組成9の組成物を、上述の第1の近赤外線カットフィルタ層上に、乾燥後の膜厚が0.8μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。次いで、i線ステッパーを用い、1000mJ/cm2で全面露光を行った。次いで、200℃、300秒間の後加熱(ポストベーク)を行い、2層からなる近赤外線カットフィルタを製造した。
第1の近赤外線吸収化合物(II-186)・・・・・0.96部
第2の近赤外線吸収化合物(II-408)・・・・・0.32部
樹脂1・・・・・7.51部
硬化性化合物1・・・・・1.28部
光重合開始剤(IRGACURE-OXE02、BASF社製)・・・・1.40部
界面活性剤1・・・・・1.59部
シクロヘキサノン・・・・・86.3部
第1の近赤外線吸収化合物(II-29)・・・・・0.32部
第2の近赤外線吸収化合物(II-91)・・・・・0.32部
樹脂1・・・・・7.51部
硬化性化合物1・・・・・1.28部
光重合開始剤(IRGACURE-OXE02、BASF社製)・・・・1.40部
界面活性剤1・・・・・1.59部
シクロヘキサノン・・・・・86.3部
(組成物の調製)
下記の組成を混合および撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して組成物を調製した。
[組成]
第1の近赤外線吸収化合物(表に示す化合物)・・・・・2.38部
第2の近赤外線吸収化合物(表に示す化合物)・・・・・0.98部
表に示す樹脂1、樹脂2または樹脂3(下記表に示す樹脂)・・・・・・6.86部
樹脂1:下記構造の樹脂(Mw=40,000、構造単位における比はモル比である)
樹脂2:ARTON F4520(JSR(株)製)
樹脂3:下記構造の樹脂(構造単位における比はモル比である)、Mw=11500
特開2012-198408号公報の段落番号0247~0249に記載の方法で合成した。
硬化性化合物(ジペンタエリスリトールヘキサアクリレート(日本化薬社製、製品名 KAYARAD DPHA))・・・・・1.41部
光重合開始剤(下記化合物)・・・・1.55部
界面活性剤(メガファックRS-72-K(DIC製、30%プロピレングリコールモノメチルエーテルアセテート溶液))・・・・・2.71部
重合禁止剤(p-メトキシフェノール)・・・・・0.001部
シクロペンタノン・・・・・84.11部
また、色素3種使用した実施例2-21は、第1の近赤外線吸収化合物としてII-507を1.12部使用し、第2の近赤外線吸収化合物として、II-43とII-589を、質量比で、1.12部ずつ使用した。(質量比で、II-507:II-43:II-589=1:1:1の割合で使用した。)
また、色素3種使用した実施例2-22は、第1の近赤外線吸収化合物としてIII-9を1.12部使用し、第2の近赤外線吸収化合物として、II-673とII-9を1.12部ずつ使用した。(質量比で、III-9:II-673:II-9=1:1:1の割合で使用した。)
また、色素3種使用した実施例2-23は、第1の近赤外線吸収化合物としてII-673を1.12部使用し、第2の近赤外線吸収化合物として、II-507とII-43を1.12部ずつ使用した。(質量比で、II-673:II-507:II-43=1:1:1の割合で使用した。)
また、色素4種使用した実施例2-24は、第1の近赤外線吸収化合物としてIII-9を0.84部使用し、第2の近赤外線吸収化合物として、III-673とII-167とIV-92を0.84部ずつ使用した。(質量比で、III-9:III-673:II-167:IV-92=1:1:1:1の割合で使用した。)
また、実施例2-34は、光重合開始剤を含有させなかった。
また、比較例2-1は、第1の近赤外線吸収化合物の含有量を2.38部とした。
また、比較例2-2は、第1の近赤外線吸収化合物の含有量を4.0部とした。
また、実施例2-39は、第1の近赤外線吸収化合物として以下のように調製した顔料分散液を17.6部使用した。
・顔料分散液の調製。
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で、ピロロピロール化合物の平均粒径(二次粒子)が75nm以下となるまで混合、分散して、顔料分散液を調製した。顔料分散液中の顔料の平均粒径は、日機装(株)製のMICROTRACUPA 150を用いて、体積基準で測定した。
・ピロロピロール化合物(II-524) ・・・13.5質量部
・樹脂(Disperbyk-111(BYKChemie社製)) ・・・4質量部
・プロピレングリコールモノメチルエーテルアセテート(PGMEA) ・・・82.5質量部
(実施例2-1~2-33、2-35~2-39、比較例2-1~2-6)
各組成物を、ガラス基板(コーニング社製1737)上に、乾燥後の膜厚が1.0μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行った。
次いで、i線ステッパー露光装置FPA-3000i5+(Canon(株)製)を使用して、500mJ/cm2で露光した。さらに、200℃のホットプレートを用いて300秒間加熱処理(ポストベーク)を行い、近赤外線カットフィルタを製造した。
実施例2-34の組成物を、ガラス基板(コーニング社製1737)上に、乾燥後の膜厚が1.0μmになるようにスピンコーターを用いて塗布し、100℃のホットプレートを用いて120秒間加熱処理(プリベーク)を行い、近赤外線カットフィルタを製造した。
近赤外線カットフィルタの透過率を分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定した。赤外線遮蔽性を以下の基準で評価した。結果を以下の表に示す。
A:極大吸収波長λmax±25nmの範囲の平均透過率≦10%
B:10%<極大吸収波長λmax±25nmの範囲の平均透過率≦15%
C:15%<極大吸収波長λmax±25nmの範囲の平均透過率≦20%
D:20%<極大吸収波長λmax±25nmの範囲の平均透過率
近赤外線カットフィルタの波長400~550nmの平均透過率を分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定した。可視透明性を以下の基準で評価した。結果を以下の表に示す。
A:90%≦波長400~550nmの平均透過率
B:85%≦波長400~550nmの平均透過率<90%
C:波長400~550nmの平均透過率<85%
近赤外線カットフィルタを、85℃、相対湿度85%の高温高湿の環境下で1時間放置した。耐湿性試験前と耐湿性試験後とのそれぞれにおいて、近赤外線カットフィルタの波長700~1400nmにおける最大吸光度(Absλmax)と、波長400~700nmにおける最小吸光度(Absλmin)とを、分光光度計U-4100(日立ハイテクノロジーズ社製)を用いて測定し、「Absλmax/Absλmin」で表される吸光度比を求めた。|(試験前における吸光度比-試験後における吸光度比)/試験前における吸光度比×100|(%)で表される吸光度比変化率を以下の基準で評価した。結果を以下の表に示す。
A:吸光度比変化率≦2%
B:2%<吸光度比変化率≦4%
C:4%<吸光度比変化率≦7%
D:7%<吸光度比変化率
近赤外線カットフィルタに対し、キセノンランプを5万luxで20時間照射(100万lux・h相当)した後、耐光テスト前後の色差のΔEab値を測定した。ΔEab値の小さい方が耐光性が良好であることを示す。結果を以下の表に示す。なお、ΔEab値は、CIE1976(L*,a*,b*)空間表色系による以下の色差公式から求められる値である(日本色彩学会編 新編色彩科学ハンドブック(昭和60年)p.266)。
ΔEab={(ΔL*)2+(Δa*)2+(Δb*)2}1/2
A:ΔEab値<5
B:5≦ΔEab値<10
C:10≦ΔEab値<20
D:20≦ΔEab値
一方、比較例は、分光変動性および赤外線遮蔽の少なくとも一つが、実施例に比べて劣るものであった。
また、誘電体多層膜と実施例2-1~2-39の組成物から得られる膜とを合わせた積層膜も好適な効果が得られる。
下記の組成を混合および撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して組成物を調製した。
[組成]
第1の近赤外線吸収化合物(表に示す化合物)・・・・・2.38部
第2の近赤外線吸収化合物(表に示す化合物)・・・・・0.98部
樹脂1、樹脂2または樹脂3・・・・・・7.52部
硬化性化合物(ジペンタエリスリトールヘキサアクリレート(日本化薬社製、製品名 KAYARAD DPHA))・・・・・1.41部
光重合開始剤(下記化合物)・・・・1.55部
界面活性剤(メガファックRS-72-K(DIC製、30%プロピレングリコールモノメチルエーテルアセテート溶液))・・・・・0.467部
重合禁止剤(p-メトキシフェノール)・・・・・0.001部
シクロペンタノン・・・・・85.68部
実施例2-5または実施例2-26の組成物を、製膜後の膜厚が1.0μmになるように、シリコンウェハ上にスピンコート法で塗布した。その後ホットプレートを用いて、100℃で2分間加熱した。次いで、ホットプレートを用いて、200℃で5分間加熱した。次いでドライエッチング法により2μmのBayerパターン(近赤外線カットフィルタ)を形成した。
次に、近赤外線カットフィルタのBayerパターン上に、Red組成物を製膜後の膜厚が1.0μmになるようにスピンコート法で塗布した。次いで、ホットプレートを用いて、100℃で2分間加熱した。次いで、i線ステッパー露光装置FPA-3000i5+(Canon(株)製)を用い、1000mJ/cm2で2μmのドットパターンをマスクを介して露光した。次いで、水酸化テトラメチルアンモニウム(TMAH)0.3質量%水溶液を用い、23℃で60秒間パドル現像を行った。その後、スピンシャワーにてリンスを行い、さらに純水にて水洗した。次いで、ホットプレートを用いて、200℃で5分間加熱することで、近赤外線カットフィルタのBayerパターン上に、Red組成物をパターニングした。同様にGreen組成物、Blue組成物を順次パターニングし、赤、青および緑の着色パターンを形成した。
次に、上記パターン形成した膜上に、赤外線透過フィルタ形成用組成物(組成100または組成101)を、製膜後の膜厚が2.0μmになるようにスピンコート法で塗布した。次いで、ホットプレートを用いて、100℃で2分間加熱した。次いで、i線ステッパー露光装置FPA-3000i5+(Canon(株)製)を用い、1000mJ/cm2で2μmのBayerパターンをマスクを介して露光した。次いで、水酸化テトラメチルアンモニウム(TMAH)0.3質量%水溶液を用い、23℃で60秒間パドル現像を行った。その後、スピンシャワーにてリンスを行い、さらに純水にて水洗した。次いで、ホットプレートを用いて、200℃で5分間加熱することで、近赤外線カットフィルタのBayerパターンの抜け部分に、赤外線透過フィルタのパターニングを行った。これを公知の方法に従い固体撮像素子に組み込んだ。得られた固体撮像素子は、入射角依存性が良好であった。更には、認識評価も良好であった。
なお、実施例2-5の組成物を用いて近赤外線カットフィルタを製造した場合は、組成100の赤外線透過フィルタ形成用組成物を用いた。実施例2-26の組成物を用いて近赤外線カットフィルタを製造した場合は、組成101の赤外線透過フィルタ形成用組成物を用いた。
下記成分を混合し、撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して、Red組成物を調製した。
Red顔料分散液 ・・51.7質量部
樹脂4(40%PGMEA溶液) ・・・0.6質量部
硬化性化合物4 ・・・0.6質量部
光重合開始剤1 ・・・0.3質量部
界面活性剤1 ・・・4.2質量部
PGMEA ・・・42.6質量部
下記成分を混合し、撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して、Green組成物を調製した。
Green顔料分散液 ・・・73.7質量部
樹脂4(40%PGMEA溶液) ・・・0.3質量部
硬化性化合物1 ・・・1.2質量部
光重合開始剤1 ・・・0.6質量部
界面活性剤1 ・・・4.2質量部
紫外線吸収剤1 ・・・0.5質量部
PGMEA ・・・19.5質量部
下記成分を混合し、撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して、Blue組成物を調製した。
Blue顔料分散液 44.9質量部
樹脂4(40%PGMEA溶液) ・・・2.1質量部
硬化性化合物1 ・・・1.5質量部
硬化性化合物4 ・・・0.7質量部
光重合開始剤1 ・・・0.8質量部
界面活性剤1 ・・・4.2質量部
PGMEA ・・・45.8質量部
下記組成における成分を混合し、撹拌した後、孔径0.45μmのナイロン製フィルタ(日本ポール(株)製)でろ過して、赤外線透過フィルタ形成用組成物を調製した。
(組成100)
顔料分散液1-1 ・・・46.5質量部
顔料分散液1-2 ・・・37.1質量部
硬化性化合物5 ・・・1.8質量部
樹脂4 ・・・1.1質量部
光重合開始剤2 ・・・0.9質量部
界面活性剤1 ・・・4.2質量部
重合禁止剤1 ・・・0.001質量部
基板密着剤 ・・・0.6質量部
PGMEA ・・・7.8質量部
(組成101)
顔料分散液2-1 ・・・22.67質量部
顔料分散液3-1 ・・・11.33質量部
顔料分散液3-2 ・・・22.67質量部
顔料分散液3-3 ・・・10.34質量部
顔料分散液3-4 ・・・6.89質量部
硬化性化合物6 ・・・1.37質量部
樹脂5 ・・・3.52質量部
光重合開始剤1 ・・・0.86質量部
界面活性剤1 ・・・0.42質量部
重合禁止剤1 ・・・0.001質量部
PGMEA ・・・19.93質量部
C.I.Pigment Red 254を9.6質量部、C.I.Pigment Yellow 139を4.3質量部、分散剤(Disperbyk-161、BYKChemie社製)を6.8質量部、PGMEAを79.3質量部とからなる混合液を、ビーズミル(ジルコニアビーズ0.3mm径)により3時間混合および分散して、顔料分散液を調製した。その後さらに、減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製)を用いて、2000kg/cm3の圧力下で流量500g/minとして分散処理を行なった。この分散処理を10回繰り返し、Red顔料分散液を得た。
C.I.Pigment Green 36を6.4質量部、C.I.Pigment Yellow 150を5.3質量部、分散剤(Disperbyk-161、BYKChemie社製)を5.2質量部、PGMEAを83.1質量部からなる混合液を、ビーズミル(ジルコニアビーズ0.3mm径)により3時間混合および分散して、顔料分散液を調製した。その後さらに、減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製)を用いて、2000kg/cm3の圧力下で流量500g/minとして分散処理を行なった。この分散処理を10回繰り返し、Green顔料分散液を得た。
C.I.Pigment Blue 15:6を9.7質量部、C.I.Pigment Violet 23を2.4質量部、分散剤(Disperbyk-161、BYKChemie社製)を5.5部、PGMEAを82.4部からなる混合液を、ビーズミル(ジルコニアビーズ0.3mm径)により3時間混合および分散して、顔料分散液を調製した。その後さらに、減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製)を用いて、2000kg/cm3の圧力下で流量500g/minとして分散処理を行なった。この分散処理を10回繰り返し、Blue顔料分散液を得た。
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で、3時間、混合、分散して、顔料分散液1-1を調製した。
・赤色顔料(C.I.Pigment Red 254)及び黄色顔料(C.I.Pigment Yellow 139)からなる混合顔料 ・・・11.8質量部
・樹脂(Disperbyk-111、BYKChemie社製) ・・・9.1質量部
・PGMEA ・・・79.1質量部
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で、3時間、混合、分散して、顔料分散液1-2を調製した。
・青色顔料(C.I.Pigment Blue 15:6)及び紫色顔料(C.I.Pigment Violet 23)からなる混合顔料 ・・・12.6質量部
・樹脂(Disperbyk-111、BYKChemie社製) ・・・2.0質量部
・樹脂10 ・・・3.3質量部
・シクロヘキサノン ・・・31.2質量部
・PGMEA ・・・50.9部
樹脂10:下記構造の樹脂(Mw=14,000、構造単位における比はモル比である)
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で、ピロロピロール顔料の平均粒径(二次粒子)が75nm以下となるまで混合、分散して、顔料分散液を調製した。顔料分散液中の顔料の平均粒径は、日機装(株)製のMICROTRACUPA 150を用いて、体積基準で測定した。
・ピロロピロール顔料 ・・・13.5質量部
・樹脂(Disperbyk-111、BYKChemie社製) ・・・4質量部
・PGMEA ・・・82.5質量部
・ピロロピロール顔料:下記構造の化合物
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で混合、分散して、顔料分散液を調製した。
・C.I.Pigment Red 254 ・・・13.5質量部
・樹脂11 ・・・2質量部
・樹脂12 ・・・2質量部
・PGMEA ・・・82.5質量部
・樹脂11:下記構造の樹脂(Mw:7950、主鎖に付記した数値はモル比であり、側鎖に付記した数値は繰り返し単位の数である)
・樹脂12:下記構造の樹脂(Mw:12000、構造単位における比はモル比である)
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で混合、分散して、顔料分散液を調製した。
・C.I.Pigment Blue 15:6 ・・・13.5質量部
・樹脂13 ・・・4質量部
・PGMEA ・・・82.5質量部
・樹脂13:下記構造の樹脂(Mw:30000、主鎖に付記した数値はモル比であり、側鎖に付記した数値は繰り返し単位の数である)
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で混合、分散して、顔料分散液を調製した。
・C.I.Pigment Yellow 139 ・・・14.8質量部
・樹脂(Disperbyk-111、BYKChemie社製) ・・・3質量部
・樹脂12 ・・・2.2質量部
・PGMEA ・・・80質量部
下記組成の混合液を、0.3mm径のジルコニアビーズを使用して、ビーズミル(減圧機構付き高圧分散機NANO-3000-10(日本ビーイーイー(株)製))で混合、分散して、顔料分散液を調製した。
・C.I.Pigment Violet 23 ・・・14.8質量部
・樹脂(Disperbyk-111、BYKChemie社製) ・・・3質量部
・樹脂12 ・・・2.2質量部
・PGMEA ・・・80質量部
・硬化性化合物4:下記構造の化合物
・硬化性化合物5:下記構造の化合物(左側化合物と右側化合物とのモル比が7:3の混合物)
・硬化性化合物6:M-305(トリアクリレートが55~63質量%、東亞合成(株)製)
Claims (21)
- 波長650~1000nmの範囲に極大吸収波長を有し、23℃の水に対する溶解度が0.1質量%以下である近赤外線吸収化合物を2種類以上含み、
前記2種類以上の近赤外線吸収化合物は、
波長650~1000nmの範囲に極大吸収波長を有する第1の近赤外線吸収化合物と、
前記第1の近赤外線吸収化合物の極大吸収波長よりも短波長側であって、波長650~1000nmの範囲に極大吸収波長を有する第2の近赤外線吸収化合物とを含み、
前記第1の近赤外線吸収化合物の極大吸収波長と、前記第2の近赤外線吸収化合物の極大吸収波長との差が1~150nmである、組成物。 - 前記第1の近赤外線吸収化合物および前記第2の近赤外線吸収化合物は、波長550nmにおける吸光度A1と極大吸収波長における吸光度A2との比率A1/A2が、それぞれ0.04以下である、請求項1に記載の組成物。
- 前記第1の近赤外線吸収化合物および前記第2の近赤外線吸収化合物の少なくとも一方が、ピロロピロール化合物、シアニン化合物、スクアリリウム化合物、フタロシアニン化合物、ナフタロシアニン化合物、およびリレン化合物から選ばれる少なくとも一種を含む、請求項1または2に記載の組成物。
- 前記第1の近赤外線吸収化合物が、ピロロピロール化合物である、請求項1~3のいずれか1項に記載の組成物。
- 前記第1の近赤外線吸収化合物および前記第2の近赤外線吸収化合物の少なくとも一方が、下記式(II)で表される化合物、および、下記式(III)で表される化合物から選ばれる少なくとも1種を含む、請求項1~4のいずれか1項に記載の組成物;
式(II)中、X1およびX2はそれぞれ独立にO、S、NRX1またはCRX2RX3を表し、RX1~RX3はそれぞれ独立に水素原子または置換基を表し、
R3~R6はそれぞれ独立に水素原子または置換基を表し、
R3とR4、またはR5とR6は互いに結合して環を形成してよく、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す;
式(III)中、Y1~Y8はそれぞれ独立にNまたはCRY1を表し、Y1~Y4の少なくとも2つはCRY1であり、Y5~Y8の少なくとも2つはCRY1であり、RY1は水素原子または置換基を表し、隣接するRY1同士は互いに結合して環を形成してよく、
B1およびB2はそれぞれ独立に-BR1R2基を表し、R1およびR2はそれぞれ独立に置換基を表し、R1とR2は互いに結合して環を形成してよく、
C1およびC2はそれぞれ独立にアルキル基、アリール基、またはヘテロアリール基を表し、
D1およびD2はそれぞれ独立に置換基を表す。 - 前記第1の近赤外線吸収化合物と前記第2の近赤外線吸収化合物が、共通の色素骨格を有する化合物である、請求項1~6のいずれか1項に記載の組成物。
- 前記第1の近赤外線吸収化合物と前記第2の近赤外線吸収化合物とがいずれもピロロピロール化合物であるか、または、いずれもシアニン化合物である、請求項1~3のいずれか1項に記載の組成物。
- 前記第1の近赤外線吸収化合物の極大吸収波長と前記第2の近赤外線吸収化合物の極大吸収波長との差が、1~90nmである請求項1~8のいずれか1項に記載の組成物。
- 更に、硬化性化合物を含む、請求項1~9のいずれか1項に記載の組成物。
- 更に、樹脂および溶剤を含む請求項1~10のいずれか1項に記載の組成物。
- 更に、有彩色着色剤を含む、請求項1~11のいずれか1項に記載の組成物。
- 請求項1~12のいずれか1項に記載の組成物を含む膜。
- 請求項1~12のいずれか1項に記載の組成物を含む近赤外線カットフィルタ。
- 更に、銅を含む層を有する、請求項14に記載の近赤外線カットフィルタ。
- 請求項14または15に記載の近赤外線カットフィルタと、有彩色着色剤を含むカラーフィルタと、を有する積層体。
- 請求項1~12のいずれか1項に記載の組成物を含む組成物層を支持体上に形成する工程と、フォトリソグラフィ法またはドライエッチング法により、前記組成物層にパターンを形成する工程と、を含む、パターン形成方法。
- 請求項13に記載の膜を有する固体撮像素子。
- 請求項13に記載の膜を有する画像表示装置。
- 請求項13に記載の膜を有する赤外線センサ。
- 請求項1~12のいずれか1項に記載の組成物を含む画素と、赤、緑、青、マゼンタ、黄、シアン、黒および無色から選ばれる画素とを有するカラーフィルタ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187018809A KR102247282B1 (ko) | 2016-01-29 | 2017-01-19 | 조성물, 막, 근적외선 차단 필터, 적층체, 패턴 형성 방법, 고체 촬상 소자, 화상 표시 장치, 적외선 센서 및 컬러 필터 |
JP2017564197A JP6833728B2 (ja) | 2016-01-29 | 2017-01-19 | 組成物、膜、近赤外線カットフィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置、赤外線センサおよびカラーフィルタ |
EP17744055.9A EP3410162A4 (en) | 2016-01-29 | 2017-01-19 | COMPOSITION, FILM, NEAR INFRARED CUT FILTER, LAMINATE, PATTERN FORMING METHOD, SEMICONDUCTOR IMAGE SENSOR, IMAGE DISPLAY DEVICE, INFRARED SENSOR, AND COLOR FILTER |
CN201780006291.7A CN108474884B (zh) | 2016-01-29 | 2017-01-19 | 组合物、膜、近红外线截止滤波器、层叠体 |
US16/019,178 US10947389B2 (en) | 2016-01-29 | 2018-06-26 | Composition, film, near infrared cut filter, laminate, pattern forming method, solid image pickup element, image display device, infrared sensor, and color filter |
US17/157,195 US11518833B2 (en) | 2016-01-29 | 2021-01-25 | Composition, film, near infrared cut filter, laminate, pattern forming method, solid image pickup element, image display device, infrared sensor, and color filter |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016015782 | 2016-01-29 | ||
JP2016-015782 | 2016-01-29 | ||
JP2016142116 | 2016-07-20 | ||
JP2016-142116 | 2016-07-20 | ||
JP2016-228784 | 2016-11-25 | ||
JP2016228784 | 2016-11-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/019,178 Continuation US10947389B2 (en) | 2016-01-29 | 2018-06-26 | Composition, film, near infrared cut filter, laminate, pattern forming method, solid image pickup element, image display device, infrared sensor, and color filter |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017130825A1 true WO2017130825A1 (ja) | 2017-08-03 |
Family
ID=59398875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/001678 WO2017130825A1 (ja) | 2016-01-29 | 2017-01-19 | 組成物、膜、近赤外線カットフィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置、赤外線センサおよびカラーフィルタ |
Country Status (7)
Country | Link |
---|---|
US (2) | US10947389B2 (ja) |
EP (1) | EP3410162A4 (ja) |
JP (1) | JP6833728B2 (ja) |
KR (1) | KR102247282B1 (ja) |
CN (2) | CN113721316A (ja) |
TW (1) | TWI709641B (ja) |
WO (1) | WO2017130825A1 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018139534A1 (ja) * | 2017-01-30 | 2018-08-02 | 富士フイルム株式会社 | 組成物、膜、赤外線透過フィルタ、固体撮像素子、画像表示装置および赤外線センサ |
JP2019031637A (ja) * | 2017-08-09 | 2019-02-28 | 株式会社日本触媒 | スクアリリウム化合物 |
CN109752783A (zh) * | 2017-11-01 | 2019-05-14 | 三星电子株式会社 | 滤光器、以及包括其的相机模块和电子设备 |
WO2019159985A1 (ja) * | 2018-02-15 | 2019-08-22 | Jsr株式会社 | 赤外線透過膜用組成物、およびカバー部材の製造方法 |
EP3546990A1 (en) * | 2018-03-27 | 2019-10-02 | Samsung Electronics Co., Ltd. | Near-infrared absorbing film, optical filter compring the same and electronic device |
WO2019240397A1 (ko) * | 2018-06-14 | 2019-12-19 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
WO2019240398A1 (ko) * | 2018-06-14 | 2019-12-19 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
WO2020017337A1 (ja) * | 2018-07-18 | 2020-01-23 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距モジュール |
CN111032701A (zh) * | 2017-08-24 | 2020-04-17 | 富士胶片株式会社 | 固化性组合物、膜、近红外线截止滤光片、固体摄像元件、图像显示装置及红外线传感器 |
KR20200041908A (ko) * | 2017-09-15 | 2020-04-22 | 후지필름 가부시키가이샤 | 조성물, 막, 적층체, 적외선 투과 필터, 고체 촬상 소자 및 적외선 센서 |
JP2020172614A (ja) * | 2019-04-12 | 2020-10-22 | 三菱ケミカル株式会社 | 色素組成物、膜、光学フィルタ、固体撮像素子、画像表示装置及び赤外線センサ |
WO2022044286A1 (ja) * | 2020-08-28 | 2022-03-03 | Hoya株式会社 | 近赤外線カットフィルタ及びそれを備える撮像装置 |
WO2022075037A1 (ja) * | 2020-10-09 | 2022-04-14 | コニカミノルタ株式会社 | 近赤外線吸収組成物、近赤外線吸収膜、近赤外線吸収フィルター及び固体撮像素子用イメージセンサー |
TWI775465B (zh) * | 2020-06-03 | 2022-08-21 | 日商昭和電工股份有限公司 | 正型感光性樹脂組成物,及有機el元件隔膜 |
WO2022181724A1 (ja) * | 2021-02-26 | 2022-09-01 | 富士フイルム株式会社 | 機上現像型平版印刷版原版、平版印刷版の作製方法、平版印刷方法、及び、呈色剤 |
WO2023053925A1 (ja) | 2021-09-30 | 2023-04-06 | 富士フイルム株式会社 | インクジェット記録用インク及びインクジェット記録方法 |
WO2023162790A1 (ja) * | 2022-02-22 | 2023-08-31 | 富士フイルム株式会社 | 着色組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置および化合物 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113721316A (zh) * | 2016-01-29 | 2021-11-30 | 富士胶片株式会社 | 组合物、膜、近红外线截止滤波器、层叠体、图案形成方法 |
CN110267992B (zh) * | 2017-02-22 | 2022-04-05 | 富士胶片株式会社 | 固化性组合物、固化膜、近红外线截止滤光片、固体摄像元件、图像显示装置及红外线传感器 |
TWI832864B (zh) * | 2018-08-07 | 2024-02-21 | 日商索尼半導體解決方案公司 | 攝像裝置及攝像系統 |
EP3715920B1 (en) * | 2019-03-25 | 2023-03-15 | Essilor International | Ophthalmic lens comprising mix of two or more nir dyes for broader nir cut and better aesthetic |
JP7203225B2 (ja) * | 2019-07-25 | 2023-01-12 | 富士フイルム株式会社 | 波長選択吸収フィルタ及び有機エレクトロルミネッセンス表示装置 |
CN110650301B (zh) * | 2019-10-14 | 2022-03-01 | Oppo广东移动通信有限公司 | 图像传感器及成像方法、设备 |
JP2022151614A (ja) * | 2021-03-23 | 2022-10-07 | 信越化学工業株式会社 | ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008070827A (ja) * | 2006-09-15 | 2008-03-27 | Agc Techno Glass Co Ltd | 赤外線遮蔽フィルタ |
WO2008038679A1 (fr) * | 2006-09-27 | 2008-04-03 | Nippon Shokubai Co., Ltd. | Composé phtalocyanine et son procédé de production |
JP2011068731A (ja) * | 2009-09-24 | 2011-04-07 | Fujifilm Corp | 近赤外吸収性色素を含有する硬化性組成物、インク用組成物および近赤外線吸収フィルタの製造方法 |
WO2013054864A1 (ja) * | 2011-10-14 | 2013-04-18 | Jsr株式会社 | 光学フィルターならびに該光学フィルターを用いた固体撮像装置およびカメラモジュール |
JP2014067019A (ja) * | 2012-09-04 | 2014-04-17 | Nippon Shokubai Co Ltd | 光選択透過フィルター形成用樹脂組成物及びその用途 |
JP2014080487A (ja) * | 2012-10-16 | 2014-05-08 | Nippon Kayaku Co Ltd | 樹脂組成物及び近赤外線カットフィルタ |
JP2015034252A (ja) * | 2013-08-09 | 2015-02-19 | 日本化薬株式会社 | 熱硬化性樹脂組成物及びその近赤外線カットフィルタ |
JP2015200878A (ja) * | 2014-03-31 | 2015-11-12 | 富士フイルム株式会社 | 赤外線センサ、近赤外線吸収組成物、硬化膜、近赤外線吸収フィルタ、イメージセンサ、カメラモジュールおよび化合物 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61228418A (ja) | 1985-04-02 | 1986-10-11 | Sony Corp | 液晶表示装置 |
JP4958461B2 (ja) * | 2006-03-30 | 2012-06-20 | 富士フイルム株式会社 | 近赤外吸収色素含有硬化性組成物 |
JP5243056B2 (ja) | 2008-02-05 | 2013-07-24 | 富士フイルム株式会社 | 少なくとも2種のシアニン化合物を含む近赤外吸収組成物 |
JP5380019B2 (ja) | 2008-03-30 | 2014-01-08 | 富士フイルム株式会社 | 赤外線吸収性化合物および該化合物からなる微粒子 |
JP2009283814A (ja) | 2008-05-26 | 2009-12-03 | Toshiba Lighting & Technology Corp | ワイヤーボンディング用キャピラリーおよび電子部品組立装置 |
JP2010111750A (ja) * | 2008-11-05 | 2010-05-20 | Fujifilm Corp | 光吸収性組成物 |
JP5526765B2 (ja) * | 2009-12-24 | 2014-06-18 | 富士ゼロックス株式会社 | 画像形成材料及び色素含有組成物、並びにそれらの製造方法 |
JP6036689B2 (ja) * | 2011-06-06 | 2016-11-30 | 旭硝子株式会社 | 光学フィルタ、固体撮像素子、撮像装置用レンズおよび撮像装置 |
CN202165187U (zh) | 2011-07-14 | 2012-03-14 | 中国电子科技集团公司第十三研究所 | 柴油汽车用集水杯总成 |
CN102267299A (zh) * | 2011-08-05 | 2011-12-07 | 深圳力合防伪技术有限公司 | 近红外吸收油墨与近红外非吸收油墨组合防伪方法 |
JP5988630B2 (ja) * | 2012-03-16 | 2016-09-07 | 富士フイルム株式会社 | 赤外線吸収性組成物および赤外線カットフィルタ |
CN103323897B (zh) * | 2012-03-22 | 2018-09-21 | 株式会社日本触媒 | 光选择透射滤光器、树脂片材和固态图像传感器 |
JP5981243B2 (ja) * | 2012-06-28 | 2016-08-31 | 株式会社Adeka | 近赤外線吸収剤および近赤外線吸収性組成物 |
JP6183041B2 (ja) * | 2012-08-23 | 2017-08-23 | 旭硝子株式会社 | 近赤外線カットフィルタ |
JP6161007B2 (ja) * | 2012-09-14 | 2017-07-12 | パナソニックIpマネジメント株式会社 | 固体撮像装置及びカメラモジュール |
KR20150080451A (ko) * | 2012-11-01 | 2015-07-09 | 가부시키가이샤 아데카 | 도료 및 근적외선 흡수 필터 |
KR20150072428A (ko) | 2012-11-30 | 2015-06-29 | 후지필름 가부시키가이샤 | 경화성 수지 조성물, 이것을 사용한 이미지 센서칩의 제조 방법 및 이미지 센서칩 |
JP6248945B2 (ja) * | 2012-12-06 | 2017-12-20 | 旭硝子株式会社 | 近赤外線カットフィルタ |
CN105102560A (zh) * | 2012-12-28 | 2015-11-25 | 富士胶片株式会社 | 红外线反射膜形成用的硬化性树脂组合物、红外线反射膜及其制造方法、以及红外线截止滤波器及使用其的固体摄影元件 |
KR20150112002A (ko) | 2013-03-14 | 2015-10-06 | 후지필름 가부시키가이샤 | 고체 촬상 소자 및 그 제조 방법, 적외광 커트필터 형성용 경화성 조성물, 카메라 모듈 |
JP2017078871A (ja) | 2014-01-31 | 2017-04-27 | クラリオン株式会社 | 車両用情報システム、サーバ装置 |
JP6122454B2 (ja) * | 2014-01-31 | 2017-04-26 | 富士フイルム株式会社 | カラーフィルタ用赤色着色組成物、着色膜、カラーフィルタ、固体撮像素子 |
JP6329626B2 (ja) | 2014-05-01 | 2018-05-23 | 富士フイルム株式会社 | 赤外線センサ、近赤外線吸収組成物、感光性樹脂組成物、化合物、近赤外線吸収フィルタおよび撮像装置 |
WO2016088645A1 (ja) * | 2014-12-04 | 2016-06-09 | Jsr株式会社 | 固体撮像装置 |
WO2017051867A1 (ja) * | 2015-09-25 | 2017-03-30 | 旭硝子株式会社 | 光学フィルタおよび撮像装置 |
CN113721316A (zh) * | 2016-01-29 | 2021-11-30 | 富士胶片株式会社 | 组合物、膜、近红外线截止滤波器、层叠体、图案形成方法 |
CN108885287A (zh) * | 2016-03-22 | 2018-11-23 | Jsr株式会社 | 光学滤波器和使用光学滤波器的装置 |
-
2017
- 2017-01-19 CN CN202111049607.5A patent/CN113721316A/zh active Pending
- 2017-01-19 CN CN201780006291.7A patent/CN108474884B/zh active Active
- 2017-01-19 KR KR1020187018809A patent/KR102247282B1/ko active IP Right Grant
- 2017-01-19 EP EP17744055.9A patent/EP3410162A4/en active Pending
- 2017-01-19 WO PCT/JP2017/001678 patent/WO2017130825A1/ja active Application Filing
- 2017-01-19 JP JP2017564197A patent/JP6833728B2/ja active Active
- 2017-01-25 TW TW106102756A patent/TWI709641B/zh active
-
2018
- 2018-06-26 US US16/019,178 patent/US10947389B2/en active Active
-
2021
- 2021-01-25 US US17/157,195 patent/US11518833B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008070827A (ja) * | 2006-09-15 | 2008-03-27 | Agc Techno Glass Co Ltd | 赤外線遮蔽フィルタ |
WO2008038679A1 (fr) * | 2006-09-27 | 2008-04-03 | Nippon Shokubai Co., Ltd. | Composé phtalocyanine et son procédé de production |
JP2011068731A (ja) * | 2009-09-24 | 2011-04-07 | Fujifilm Corp | 近赤外吸収性色素を含有する硬化性組成物、インク用組成物および近赤外線吸収フィルタの製造方法 |
WO2013054864A1 (ja) * | 2011-10-14 | 2013-04-18 | Jsr株式会社 | 光学フィルターならびに該光学フィルターを用いた固体撮像装置およびカメラモジュール |
JP2014067019A (ja) * | 2012-09-04 | 2014-04-17 | Nippon Shokubai Co Ltd | 光選択透過フィルター形成用樹脂組成物及びその用途 |
JP2014080487A (ja) * | 2012-10-16 | 2014-05-08 | Nippon Kayaku Co Ltd | 樹脂組成物及び近赤外線カットフィルタ |
JP2015034252A (ja) * | 2013-08-09 | 2015-02-19 | 日本化薬株式会社 | 熱硬化性樹脂組成物及びその近赤外線カットフィルタ |
JP2015200878A (ja) * | 2014-03-31 | 2015-11-12 | 富士フイルム株式会社 | 赤外線センサ、近赤外線吸収組成物、硬化膜、近赤外線吸収フィルタ、イメージセンサ、カメラモジュールおよび化合物 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3410162A4 * |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11466113B2 (en) | 2017-01-30 | 2022-10-11 | Fujifilm Corporation | Composition, film, infrared transmitting filter, solid image pickup element, image display device, and infrared sensor |
JPWO2018139534A1 (ja) * | 2017-01-30 | 2019-11-14 | 富士フイルム株式会社 | 組成物、膜、赤外線透過フィルタ、固体撮像素子、画像表示装置および赤外線センサ |
WO2018139534A1 (ja) * | 2017-01-30 | 2018-08-02 | 富士フイルム株式会社 | 組成物、膜、赤外線透過フィルタ、固体撮像素子、画像表示装置および赤外線センサ |
JP2019031637A (ja) * | 2017-08-09 | 2019-02-28 | 株式会社日本触媒 | スクアリリウム化合物 |
JPWO2019039159A1 (ja) * | 2017-08-24 | 2020-08-06 | 富士フイルム株式会社 | 硬化性組成物、膜、近赤外線カットフィルタ、固体撮像素子、画像表示装置および赤外線センサ |
JP7041159B2 (ja) | 2017-08-24 | 2022-03-23 | 富士フイルム株式会社 | 硬化性組成物、膜、近赤外線カットフィルタ、固体撮像素子、画像表示装置および赤外線センサ |
TWI783014B (zh) * | 2017-08-24 | 2022-11-11 | 日商富士軟片股份有限公司 | 硬化性組成物、膜、近紅外線截止濾光片、固體攝像元件、圖像顯示裝置及紅外線感測器 |
CN111032701A (zh) * | 2017-08-24 | 2020-04-17 | 富士胶片株式会社 | 固化性组合物、膜、近红外线截止滤光片、固体摄像元件、图像显示装置及红外线传感器 |
KR102483100B1 (ko) | 2017-09-15 | 2022-12-30 | 후지필름 가부시키가이샤 | 조성물, 막, 적층체, 적외선 투과 필터, 고체 촬상 소자 및 적외선 센서 |
KR20200041908A (ko) * | 2017-09-15 | 2020-04-22 | 후지필름 가부시키가이샤 | 조성물, 막, 적층체, 적외선 투과 필터, 고체 촬상 소자 및 적외선 센서 |
US11181673B2 (en) | 2017-11-01 | 2021-11-23 | Samsung Electronics Co., Ltd. | Optical filter, and camera module and electronic device comprising the same |
US11719867B2 (en) | 2017-11-01 | 2023-08-08 | Samsung Electronics Co., Ltd. | Optical filter, and camera module and electronic device comprising the same |
CN109752783A (zh) * | 2017-11-01 | 2019-05-14 | 三星电子株式会社 | 滤光器、以及包括其的相机模块和电子设备 |
JPWO2019159985A1 (ja) * | 2018-02-15 | 2021-02-04 | Jsr株式会社 | 赤外線透過膜用組成物、およびカバー部材の製造方法 |
WO2019159985A1 (ja) * | 2018-02-15 | 2019-08-22 | Jsr株式会社 | 赤外線透過膜用組成物、およびカバー部材の製造方法 |
JP2019174798A (ja) * | 2018-03-27 | 2019-10-10 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 近赤外線吸収フィルム及び光学フィルタ並びに電子装置 |
CN110305352A (zh) * | 2018-03-27 | 2019-10-08 | 三星电子株式会社 | 近红外吸收膜、包括其的滤光器和电子设备 |
US11073643B2 (en) | 2018-03-27 | 2021-07-27 | Samsung Electronics Co., Ltd. | Near-infrared absorbing film, optical filter comprising the same and electronic device |
EP3546990A1 (en) * | 2018-03-27 | 2019-10-02 | Samsung Electronics Co., Ltd. | Near-infrared absorbing film, optical filter compring the same and electronic device |
CN110305352B (zh) * | 2018-03-27 | 2022-06-10 | 三星电子株式会社 | 近红外吸收膜、包括其的滤光器和电子设备 |
WO2019240397A1 (ko) * | 2018-06-14 | 2019-12-19 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
US11473035B2 (en) | 2018-06-14 | 2022-10-18 | Young Chang Chemical Co., Ltd. | Process solution composition for extreme ultraviolet lithography, and method for forming pattern by using same |
WO2019240398A1 (ko) * | 2018-06-14 | 2019-12-19 | 영창케미칼 주식회사 | 극자외선 리소그래피용 공정액 조성물 및 이를 이용하는 패턴 형성 방법 |
US11624984B2 (en) | 2018-06-14 | 2023-04-11 | Young Chang Chemical Co., Ltd | Process liquid composition for extreme ultraviolet lithography and pattern forming method using same |
US11652175B2 (en) | 2018-07-18 | 2023-05-16 | Sony Semiconductor Solutions Corporation | Light reception device and distance measurement module |
JPWO2020017337A1 (ja) * | 2018-07-18 | 2021-08-26 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距モジュール |
WO2020017337A1 (ja) * | 2018-07-18 | 2020-01-23 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距モジュール |
JP7225195B2 (ja) | 2018-07-18 | 2023-02-20 | ソニーセミコンダクタソリューションズ株式会社 | 受光素子および測距モジュール |
JP2020172614A (ja) * | 2019-04-12 | 2020-10-22 | 三菱ケミカル株式会社 | 色素組成物、膜、光学フィルタ、固体撮像素子、画像表示装置及び赤外線センサ |
TWI775465B (zh) * | 2020-06-03 | 2022-08-21 | 日商昭和電工股份有限公司 | 正型感光性樹脂組成物,及有機el元件隔膜 |
WO2022044286A1 (ja) * | 2020-08-28 | 2022-03-03 | Hoya株式会社 | 近赤外線カットフィルタ及びそれを備える撮像装置 |
WO2022075037A1 (ja) * | 2020-10-09 | 2022-04-14 | コニカミノルタ株式会社 | 近赤外線吸収組成物、近赤外線吸収膜、近赤外線吸収フィルター及び固体撮像素子用イメージセンサー |
WO2022181724A1 (ja) * | 2021-02-26 | 2022-09-01 | 富士フイルム株式会社 | 機上現像型平版印刷版原版、平版印刷版の作製方法、平版印刷方法、及び、呈色剤 |
WO2023053925A1 (ja) | 2021-09-30 | 2023-04-06 | 富士フイルム株式会社 | インクジェット記録用インク及びインクジェット記録方法 |
WO2023162790A1 (ja) * | 2022-02-22 | 2023-08-31 | 富士フイルム株式会社 | 着色組成物、膜、カラーフィルタ、固体撮像素子、画像表示装置および化合物 |
Also Published As
Publication number | Publication date |
---|---|
EP3410162A1 (en) | 2018-12-05 |
US10947389B2 (en) | 2021-03-16 |
JP6833728B2 (ja) | 2021-02-24 |
TWI709641B (zh) | 2020-11-11 |
KR20180088897A (ko) | 2018-08-07 |
CN113721316A (zh) | 2021-11-30 |
KR102247282B1 (ko) | 2021-05-03 |
US20180305552A1 (en) | 2018-10-25 |
TW201803962A (zh) | 2018-02-01 |
EP3410162A4 (en) | 2019-02-20 |
US20210139708A1 (en) | 2021-05-13 |
CN108474884B (zh) | 2021-09-17 |
JPWO2017130825A1 (ja) | 2019-01-17 |
US11518833B2 (en) | 2022-12-06 |
CN108474884A (zh) | 2018-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6833728B2 (ja) | 組成物、膜、近赤外線カットフィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置、赤外線センサおよびカラーフィルタ | |
JP7041625B2 (ja) | 組成物、膜、近赤外線カットフィルタ、パターン形成方法、積層体、固体撮像素子、画像表示装置、カメラモジュールおよび赤外線センサ | |
JP6453456B2 (ja) | 着色組成物、膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子および赤外線センサ | |
JP6721578B2 (ja) | 赤外線吸収組成物、赤外線カットフィルタ、積層体、パターン形成方法、および固体撮像素子 | |
US11209732B2 (en) | Near infrared absorbing composition, film, infrared cut filter, solid image pickup element, infrared absorber, and compound | |
JP6689864B2 (ja) | 近赤外線吸収性硬化性組成物、硬化膜、固体撮像素子、赤外線吸収剤および化合物 | |
JP6734377B2 (ja) | 組成物、膜、光学フィルタ、積層体、固体撮像素子、画像表示装置、赤外線センサおよび化合物 | |
CN110352221B (zh) | 组合物、膜、红外线截止滤光片、固体摄像元件、红外线传感器、相机模块及新型化合物 | |
JP6849314B2 (ja) | 組成物、膜、光学フィルタ、積層体、固体撮像素子、画像表示装置および赤外線センサ | |
WO2017146092A1 (ja) | 組成物、硬化性組成物、硬化膜、近赤外線カットフィルタ、赤外線透過フィルタ、固体撮像素子、赤外線センサおよびカメラモジュール | |
US11236215B2 (en) | Curable composition, cured film, optical filter, laminate, solid image pickup element, image display device, and infrared sensor | |
WO2017146091A1 (ja) | 感放射線性組成物、光学フィルタ、積層体、パターン形成方法、固体撮像素子、画像表示装置および赤外線センサ | |
JP6574849B2 (ja) | 着色組成物、カラーフィルタ、パターン形成方法、固体撮像素子、および、画像表示装置 | |
JP2018045011A (ja) | 赤外線吸収剤、組成物、膜、光学フィルタ、積層体、固体撮像素子、画像表示装置および赤外線センサ | |
WO2020059484A1 (ja) | 組成物、膜、光学フィルタ、固体撮像素子、赤外線センサ、光学フィルタの製造方法、カメラモジュール、化合物、及び、分散組成物 | |
JP6705891B2 (ja) | 組成物、膜、光学フィルタ、積層体、固体撮像素子、画像表示装置および赤外線センサ | |
WO2019077913A1 (ja) | 着色組成物、膜、カラーフィルタ、固体撮像素子および画像表示装置 | |
WO2019077912A1 (ja) | 着色組成物、膜の製造方法、カラーフィルタの製造方法、固体撮像素子の製造方法および画像表示装置の製造方法 | |
TWI841599B (zh) | 組成物、膜、濾光器、固體攝像元件、紅外線感測器、濾光器的製造方法、相機模組、化合物及分散組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17744055 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20187018809 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020187018809 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2017564197 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2017744055 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2017744055 Country of ref document: EP Effective date: 20180829 |