WO2013133256A1 - ガスバリアフィルム積層体、粘着フィルム、および電子部材 - Google Patents
ガスバリアフィルム積層体、粘着フィルム、および電子部材 Download PDFInfo
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- WO2013133256A1 WO2013133256A1 PCT/JP2013/055934 JP2013055934W WO2013133256A1 WO 2013133256 A1 WO2013133256 A1 WO 2013133256A1 JP 2013055934 W JP2013055934 W JP 2013055934W WO 2013133256 A1 WO2013133256 A1 WO 2013133256A1
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- gas barrier
- barrier film
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- adhesive layer
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Definitions
- the present invention relates to a gas barrier film laminate in which at least two gas barrier films having an excellent gas barrier property are laminated via an adhesive layer, an adhesive film useful in producing the gas barrier film laminate, and the gas barrier
- the present invention relates to an electronic member provided with a film laminate.
- a transparent plastic is used in place of a glass plate in order to realize a thin, lightweight, flexible and impact resistance.
- the use of films is being considered.
- the plastic film has a problem that it easily permeates water vapor, oxygen, and the like as compared with the glass plate, and easily causes deterioration of elements inside the electronic member.
- Patent Document 1 discloses a flexible display substrate in which a transparent gas barrier layer made of a metal oxide is laminated on a transparent plastic film.
- Patent Document 2 discloses a gas barrier laminate in which a plastic film and a resin layer containing polyorganosilsesquioxane as a main component are laminated on at least one surface of the plastic film.
- Patent Document 3 a transparent gas barrier layer is formed on a first transparent plastic film substrate, and a second transparent plastic film substrate is formed on the transparent gas barrier layer via a transparent adhesive layer. Disposed transparent films are disclosed.
- gas barrier film As described above, several gas barrier films have been proposed so far.
- the applicant of the present application has also proposed a molded body (gas barrier film) having a gas barrier layer formed from a material containing oxygen atoms, carbon atoms, and silicon atoms (WO2010 / 021326, WO2010 / 107018). Gazette).
- the gas barrier films described in these documents have excellent gas barrier properties.
- the present inventors have further studied to further improve the gas barrier property, and have devised a laminate in which at least two gas barrier films are laminated via an adhesive layer.
- the laminate in which the gas barrier films are bonded to each other through the pressure-sensitive adhesive layer as described above may cause poor appearance due to bubbles or the like when placed under high temperature and high humidity for a long time. .
- the present invention has been made in view of such circumstances, and has a high gas barrier property and appearance defects such as bubbles are generated even when it is placed under high temperature and high humidity for a long time. It is an object of the present invention to provide a gas barrier film laminate that is difficult to form, an adhesive film that is useful in producing the gas barrier film laminate, and an electronic member that includes the gas barrier film laminate.
- the moisture of the gas barrier film may penetrate into the gas barrier film laminate, (Ii) Moisture that has entered the gas barrier film laminate is difficult to escape to the outside due to the presence of the gas barrier film; (Iii)
- a gas barrier film laminate in which the hardness of the pressure-sensitive adhesive layer is greatly reduced under high temperature conditions that is, a gas barrier film laminate having a pressure-sensitive adhesive layer in which ⁇ described below exceeds 70% It was found that a small amount of moisture entering from the outside easily accumulates in the pressure-sensitive adhesive layer when it is left for a long time, and as a result, bubbles are likely to be generated.
- the gas barrier film laminate having the pressure-sensitive adhesive layer having an ⁇ of 70% or less which will be described later, is excellent in gas barrier properties, and even when placed under a high temperature and high humidity for a long time.
- the present inventors have found that appearance defects such as bubbles are unlikely to occur and have completed the present invention.
- gas barrier film laminates (1) to (10), an adhesive film (11), and an electronic member (12) are provided.
- a gas barrier film laminate comprising at least two gas barrier films, wherein two adjacent gas barrier films are laminated via an adhesive layer, and the adhesive layer has the following formula (I)
- the gas barrier film laminate wherein the reduction rate ⁇ (%) of the shear load represented by is 70% or less.
- X is a test piece having a three-layer structure of polyethylene terephthalate film / adhesive layer / non-alkali glass and having an adhesion area of 225 mm 2 (15 mm ⁇ 15 mm), 23 ° C., 50% RH, shear
- the shear load (N) when the displacement in the shear direction was 0.1 mm was represented, and Y was 80 ° C. using the same test piece.
- the shear load (N) when the displacement in the shear direction is 0.1 mm when the shear test is performed at a shear rate of 0.1 mm / min.
- the acrylic pressure-sensitive adhesive mainly comprises an acrylic copolymer having both a repeating unit derived from an acrylic monomer having a carboxyl group and a repeating unit derived from an acrylic monomer having no functional group.
- An adhesive film for producing a gas barrier film laminate comprising at least two gas barrier films, wherein two adjacent gas barrier films are laminated via an adhesive layer, wherein at least the gas barrier film and Adhesive layer is laminated adjacently,
- the pressure-sensitive adhesive film, wherein the adhesive layer has a shear load reduction rate ⁇ (%) represented by the formula (I) of 70% or less.
- An electronic member comprising the gas barrier film laminate according to any one of (1) to (5).
- the gas barrier film laminate of the present invention has high gas barrier properties and is less likely to cause appearance defects such as bubbles even when it is placed at a high temperature and high humidity for a long time.
- the pressure-sensitive adhesive film of the present invention is suitably used when producing the gas barrier film laminate.
- the gas barrier film laminate of the present invention is suitable for electronic members such as solar cells, liquid crystal displays, and electroluminescence (EL) displays.
- Gas barrier film laminate of the present invention is a gas barrier film laminate comprising at least two gas barrier films, and two adjacent gas barrier films are laminated via an adhesive layer.
- the pressure-sensitive adhesive layer has a shear load reduction rate ⁇ (%) represented by the formula (I) of 70% or less.
- the gas barrier film used in the present invention is a film having a property of suppressing permeation of oxygen and water vapor (hereinafter referred to as “gas barrier property”).
- the water vapor permeability of the gas barrier film used is preferably 1.0 g / m 2 / day or less, more preferably 0.00001 to 1.0 g / m 2 / day, in an atmosphere of 40 ° C. and 90% relative humidity. It is preferably 0.00001 to 0.5 g / m 2 / day, and more preferably 0.00001 to 0.1 g / m 2 / day.
- a gas barrier film laminate having excellent gas barrier properties By using a gas barrier film having a water vapor transmission rate of 1.0 g / m 2 / day or less, a gas barrier film laminate having excellent gas barrier properties can be obtained.
- the lower limit of the water vapor transmission rate is not particularly limited from the viewpoint of obtaining a gas barrier film laminate that hardly causes poor appearance, and is preferably as small as possible.
- the water vapor transmission rate can be measured using a known gas transmission rate measuring device.
- the gas barrier film used for this invention should just have gas barrier property as mentioned above,
- the material etc. are not specifically limited. Since the gas barrier film used in the present invention is excellent in gas barrier properties, a base material made of a synthetic resin film (hereinafter sometimes abbreviated as “base film” or “base material”), and on the base material. It is preferable to have at least one gas barrier layer provided on the substrate.
- the base material made of a synthetic resin film includes: polyolefin resins such as polyethylene and polypropylene; styrene resins such as polystyrene; acrylic resins such as polymethyl methacrylate; polyamide (nylon 6, nylon 66, etc.), poly m Amide resins such as phenylene isophthalamide and poly p-phenylene terephthalamide; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyarylate; norbornene polymers, monocyclic olefin polymers, Cycloolefin polymers such as cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof; polyimides; polyamideimides; polyphenylene ethers; polyether ketones; Polyetheretherketone; polycarbonates; polysulfones; polyether sulfone; polyphenylene sulfide;
- the base material made of a synthetic resin film may be a cured product of an energy ray curable compound.
- energy ray curable compounds include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, neo Pentyl glycol adipate di (meth) acrylate, dicyclopentanyl di (meth) acrylate, isocyanurate di (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) ) Multifunctional acrylate-based energy ray polymerizable monomers such as acrylate, tris (acryloxyethyl) isocyanurate, dipentaerythritol
- polyester resin polysulfone, polyether sulfone, polyphenylene sulfide, amide resin, and cycloolefin polymer are preferable because of excellent transparency and versatility.
- Polyester resin, polysulfone, polysulfone, Ether sulfone, polyphenylene sulfide, and cycloolefin polymers are more preferable.
- the thickness of the substrate used is usually in the range of 100 nm to 1000 ⁇ m, preferably 5 to 200 ⁇ m.
- the gas barrier layer of the gas barrier film used in the present invention is a layer having gas barrier properties.
- the gas barrier layer may be formed on one side of a base material made of a synthetic resin film, or may be formed on both sides of the base material. Further, the gas barrier layer may be a single layer or a plurality of layers may be laminated.
- the material of the gas barrier layer is not particularly limited as long as it prevents the permeation of oxygen and water vapor, but a material that can form a gas barrier layer having excellent transparency in addition to excellent gas barrier properties is preferable.
- Examples of the material for the gas barrier layer include metals such as aluminum, magnesium, zinc, and tin; Inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide and tin oxide; Inorganic nitrides such as silicon nitride; Inorganic carbides; inorganic sulfides; inorganic oxynitrides that are composites thereof; inorganic oxide carbides; inorganic nitride carbides; inorganic oxynitride carbides; polymer compounds;
- the method for forming the gas barrier layer is not particularly limited.
- the above-described material is formed on a substrate by a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, or the like.
- a method of forming by plasma treatment is not particularly limited.
- the above-described material is formed on a substrate by a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, or the like.
- the thickness of the gas barrier layer is not particularly limited, but is usually 20 nm to 50 ⁇ m, preferably 30 nm to 1 ⁇ m, more preferably 40 nm to 500 nm.
- the target gas barrier layer can be easily formed as the gas barrier layer
- a layer formed by subjecting the polymer layer composed of the polymer compound to plasma treatment is preferable.
- the method for the plasma treatment is not particularly limited, and a known method can be used. Among them, a method of implanting ions on the surface of the polymer layer is preferable because a gas barrier layer having excellent gas barrier properties can be easily and efficiently formed.
- the “gas barrier layer” does not mean only a portion modified by ion implantation, but means “a polymer layer having a portion modified by ion implantation”.
- the polymer compound constituting the polymer layer includes a polymer silicon compound; a polyolefin resin such as polyethylene and polypropylene; a styrene resin such as polystyrene; an acrylic resin such as polymethyl methacrylate; a polyamide (nylon 6, nylon 66) Amide resins such as poly m-phenylene isophthalamide and poly p-phenylene terephthalamide; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate and polyarylate; norbornene polymers, monocyclic cyclic Cycloolefin polymers such as olefin polymers, cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof; polyimides; polyamideimides; polyphenylene ethers; Teruketon; polyetheretherketone; polycarbonates; polysulfones; polyether sulfone; polyphenylene
- a polymer silicon compound, a polyester resin, or an acrylic resin is preferable, and a polymer silicon compound is more preferable because a gas barrier layer having excellent gas barrier properties can be easily formed.
- the polymer silicon compound may be an organic compound or an inorganic compound as long as it is a polymer containing silicon.
- examples include polyorganosiloxane compounds, polycarbosilane compounds, polysilane compounds, polysilazane compounds, and the like.
- a polyorganosiloxane compound is a compound obtained by polycondensation of a silane compound having a hydrolyzable functional group.
- a polyorganosiloxane type compound Any of linear shape, ladder shape, and bowl shape may be sufficient.
- the linear main chain structure is a structure represented by the following formula (a)
- the ladder main chain structure is a structure represented by the following formula (b): a cage main chain structure
- Examples of the structure include the structure represented by the following formula (c).
- each of Rx, Ry, and Rz independently represents a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted aryl group, etc. Represents a hydrolyzable group.
- the plurality of Rx in the formula (a), the plurality of Ry in the formula (b), and the plurality of Rz in the formula (c) may be the same or different. However, both Rx in the formula (a) are not hydrogen atoms.
- alkyl group of the unsubstituted or substituted alkyl group examples include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, t-butyl group, n
- alkyl groups having 1 to 10 carbon atoms such as -pentyl group, isopentyl group, neopentyl group, n-hexyl group, n-heptyl group and n-octyl group.
- alkenyl group examples include alkenyl groups having 2 to 10 carbon atoms such as vinyl group, 1-propenyl group, 2-propenyl group, 1-butenyl group, 2-butenyl group and 3-butenyl group.
- substituent for the alkyl group and alkenyl group examples include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group; And unsubstituted or substituted aryl groups such as 4-methylphenyl group and 4-chlorophenyl group.
- aryl group of the unsubstituted or substituted aryl group examples include aryl groups having 6 to 10 carbon atoms such as a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.
- substituent of the aryl group examples include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; alkyl groups having 1 to 6 carbon atoms such as methyl group and ethyl group; carbon numbers such as methoxy group and ethoxy group 1-6 alkoxy groups; nitro groups; cyano groups; hydroxyl groups; thiol groups; epoxy groups; glycidoxy groups; (meth) acryloyloxy groups; unsubstituted phenyl groups, 4-methylphenyl groups, 4-chlorophenyl groups, etc.
- Rx, Ry, and Rz a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and an alkyl group having 1 to 6 carbon atoms is particularly preferable.
- polysiloxane-based compound As the polyorganosiloxane-based compound, a linear compound represented by the above formula (a) is preferable. From the viewpoint of easy availability and formation of a layer having excellent gas barrier properties, 2 in the above formula (a). Polydimethylsiloxane in which two Rx are both methyl group compounds is more preferable.
- the polyorganosiloxane compound can be obtained, for example, by a known production method in which a silane compound having a hydrolyzable functional group is polycondensed. What is necessary is just to select the silane compound to be used suitably according to the structure of the target polyorganosiloxane type compound.
- the polycarbosilane compound is a polymer compound having a (—Si—C—) bond in the main chain in the molecule.
- a polycarbosilane type compound used for this invention what contains the repeating unit represented by following formula (d) is preferable.
- Rw and Rv each independently represent a hydrogen atom, a hydroxyl group, an alkyl group, an aryl group, an alkenyl group, or a monovalent heterocyclic group.
- a plurality of Rw and Rv may be the same or different.
- Examples of the alkyl group, aryl group, and alkenyl group for Rw and Rv include the same groups as those exemplified as Rx and the like.
- the heterocyclic ring of the monovalent heterocyclic group is not particularly limited as long as it is a 3- to 10-membered cyclic compound containing at least one hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom in addition to a carbon atom.
- R represents an alkylene group, an arylene group or a divalent heterocyclic group.
- alkylene group of R include alkylene groups having 1 to 10 carbon atoms such as a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, and an octamethylene group.
- arylene group examples include arylene groups having 6 to 20 carbon atoms such as a phenylene group, a 1,4-naphthylene group, and a 2,5-naphthylene group.
- divalent heterocyclic group a divalent group derived from a 3- to 10-membered heterocyclic compound containing at least one hetero atom such as an oxygen atom, a nitrogen atom, or a sulfur atom in addition to a carbon atom is particularly preferable.
- the alkylene group, arylene group, and divalent heterocyclic group represented by R may have a substituent such as an alkyl group, an aryl group, an alkoxy group, or a halogen atom at an arbitrary position.
- Rw and Rv are each independently a hydrogen atom, an alkyl group or an aryl group, and more preferably include a repeating unit in which R is an alkylene group or an arylene group, Rw, More preferably, each Rv independently represents a hydrogen atom or an alkyl group, and R includes an alkylene group.
- the weight average molecular weight of the polycarbosilane compound having a repeating unit represented by the formula (d) is usually from 400 to 12,000.
- the method for producing the polycarbosilane compound is not particularly limited, and a conventionally known method can be adopted.
- the polysilane compound is a polymer compound having a (—Si—Si—) bond in the molecule.
- Examples of such polysilane compounds include compounds having at least one repeating unit selected from structural units represented by the following formula (e).
- Rq and Rr are the same or different and are a hydrogen atom, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, a hydroxyl group, an alkoxy group, a cycloalkyloxy group, an aryloxy group, an aralkyloxy group.
- a group, an amino group optionally having a substituent, a silyl group, or a halogen atom is represented.
- Examples of the alkyl group, alkenyl group, and aryl group of Rq and Rr include the same as those exemplified for Rx and the like.
- Examples of the cycloalkyl group include cycloalkenyl groups having 3 to 10 carbon atoms such as a cyclopentyl group, a cyclohexyl group, and a methylcyclohexyl group.
- Examples of the cycloalkenyl group include cycloalkenyl groups having 4 to 10 carbon atoms such as a cyclopentenyl group and a cyclohexenyl group.
- alkoxy group examples include alkoxy groups having 1 to 10 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a t-butoxy group, and a pentyloxy group.
- cycloalkyloxy group examples include cycloalkyloxy groups having 3 to 10 carbon atoms such as a cyclopentyloxy group and a cyclohexyloxy group.
- aryloxy group examples include aryloxy groups having 6 to 20 carbon atoms such as a phenoxy group and a naphthyloxy group.
- aralkyloxy group examples include aralkyloxy groups having 7 to 20 carbon atoms such as benzyloxy group, phenethyloxy group, and phenylpropyloxy group.
- the amino group which may have a substituent is an amino group; an N-mono or N, N-disubstituted amino group substituted with an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an acyl group, or the like. Is mentioned.
- silyl group examples include Si1-10 silanyl groups (preferably Si1-6 silanyl group) such as silyl group, disiranyl group, and trisilanyl group, substituted silyl groups (eg, alkyl group, cycloalkyl group, aryl group, aralkyl group, alkoxy group) A substituted silyl group substituted with a group, etc.).
- substituted silyl groups eg, alkyl group, cycloalkyl group, aryl group, aralkyl group, alkoxy group
- halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the cycloalkyl group, cycloalkenyl group, alkoxy group, cycloalkyloxy group, aryloxy group, aralkyloxy group, silyl group may have a substituent such as a halogen atom, an alkyl group, an aryl group, or an alkoxy group. Good.
- a compound containing a repeating unit represented by the formula (e) is preferable.
- Rq and Rr are each independently A compound containing a repeating unit which is a hydrogen atom, a hydroxyl group, an alkyl group, an aryl group, an alkoxy group, an amino group or a silyl group is more preferable.
- Rq and Rr are each independently a hydrogen atom, More preferred are compounds containing a repeating unit which is an alkyl group or an aryl group.
- the form of the polysilane compound is not particularly limited, and may be a random copolymer, a block even if it is a homopolymer such as acyclic polysilane (linear polysilane, branched polysilane, network polysilane, etc.) or cyclic polysilane. Copolymers such as copolymers, alternating copolymers, and comb copolymers may also be used.
- the terminal group (terminal substituent) of the polysilane compound is a hydrogen atom, a halogen atom (chlorine atom, etc.), an alkyl group, a hydroxyl group, an alkoxy group, silyl It may be a group or the like.
- polysilane compound examples include polydialkylsilanes such as polydimethylsilane, poly (methylpropylsilane), poly (methylbutylsilane), poly (methylpentylsilane), poly (dibutylsilane), and poly (dihexylsilane).
- Homopolymers such as polydiarylsilanes such as poly (diphenylsilane), poly (alkylarylsilanes) such as poly (methylphenylsilane); dialkylsilanes such as dimethylsilane-methylhexylsilane copolymers and other dialkylsilanes Copolymer, arylsilane-alkylarylsilane copolymer such as phenylsilane-methylphenylsilane copolymer, dimethylsilane-methylphenylsilane copolymer, dimethylsilane-phenylhexylsilane copolymer, dimethylsilane-methylnaphtho And the like; Rushiran copolymer, methyl propyl silane - copolymers of alkyl aryl silane copolymer - dialkyl silane and methyl phenyl silane copolymer.
- the average degree of polymerization (for example, the number average degree of polymerization) of the polysilane compound is usually about 5 to 400, preferably about 10 to 350, and more preferably about 20 to 300.
- the weight average molecular weight of the polysilane compound is about 300 to 100,000, preferably 400 to 50,000, and more preferably about 500 to 30,000.
- Many of the polysilane compounds are known substances and can be produced using known methods.
- the polysilazane compound is a polymer compound having a (—Si—N—) bond in the molecule.
- Such polysilazane compounds include those represented by the formula (f)
- the compound which has a repeating unit represented by these is preferable.
- the number average molecular weight of the polysilazane compound to be used is not particularly limited, but is preferably 100 to 50,000.
- n represents an arbitrary natural number.
- Rm, Rp, and Rt each independently represent a non-hydrolyzable group such as a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, or an alkylsilyl group.
- alkyl group examples include trimethylsilyl group, triethylsilyl group, triisopropylsilyl group, tri-t-butylsilyl group, methyldiethylsilyl group, dimethylsilyl group, diethylsilyl group, methylsilyl group, and ethylsilyl group.
- Rm, Rp, and Rt a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and a hydrogen atom is particularly preferable.
- Examples of the polysilazane compound having a repeating unit represented by the formula (f) include inorganic polysilazanes in which Rm, Rp, and Rt are all hydrogen atoms, and organic polysilazanes in which at least one of Rm, Rp, and Rt is not a hydrogen atom. It may be.
- inorganic polysilazane the following formula
- perhydropolysilazane having a linear structure, a branched structure and a cyclic structure in the molecule.
- organic polysilazane (I) — (Rm′SiHNH) — (Rm ′ represents the same alkyl group, cycloalkyl group, alkenyl group, aryl group or alkylsilyl group as Rm. The same applies to the following Rm ′).
- the organic polysilazane can be produced by a conventionally known method. For example, the following formula
- m represents 2 or 3
- X represents a halogen atom
- R 1 represents any of the substituents of Rm, Rp, Rt, Rm ′, Rp ′, and Rt ′ described above.
- the secondary amine, ammonia, and primary amine to be used may be appropriately selected according to the structure of the target polysilazane compound.
- examples of the polysilazane compound include, for example, JP-A-62-195024, JP-A-2-84437, JP-A-63-81122, JP-A-1-138108, JP-A-1-138108. JP-A-2-175726, JP-A-5-238827, JP-A-5-238827, JP-A-6-122852, JP-A-6-306329, JP-A-6-299118, etc.
- Polysilazane modified products described in JP-A-9-31333, JP-A-5-345826, JP-A-4-63833 and the like can also be used.
- inorganic polysilazane in which Rm, Rp, and Rt are all hydrogen atoms, and organic polysilazane in which at least one of Rm, Rp, and Rt is not a hydrogen atom are preferable and easily available. From the viewpoint of forming an injection layer having excellent gas barrier properties, inorganic polysilazane is more preferable.
- the polysilazane type compound can also use the commercial item marketed as a glass coating material etc. as it is.
- the polymer layer may contain other components in addition to the above-described polymer compound as long as the object of the present invention is not impaired.
- other components include curing agents, other polymers, anti-aging agents, light stabilizers, and flame retardants.
- the content of the polymer compound in the polymer layer is preferably 50% by mass or more and more preferably 70% by mass or more from the viewpoint of forming a gas barrier layer having excellent gas barrier properties.
- the method for forming the polymer layer is not particularly limited.
- a layer forming solution containing at least one kind of polymer compound, and optionally other components, a solvent, and the like may be formed on the substrate or desired by a known coating method.
- coating on the primer layer formed on the base material by and drying the obtained coating film moderately is mentioned.
- the coating apparatus known apparatuses such as a spin coater, a knife coater, and a gravure coater can be used.
- the coating film it is preferable to heat the coating film in order to dry the obtained coating film and improve the gas barrier property of the film.
- heating and drying methods conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be employed.
- the heating temperature is usually 80 to 150 ° C.
- the heating time is usually several tens of seconds to several tens of minutes.
- the thickness of the formed polymer layer is not particularly limited, but is usually 20 nm to 1000 nm, preferably 30 to 500 nm, more preferably 40 to 200 nm. In the present invention, even if the thickness of the polymer layer is nano-order, a film having sufficient gas barrier performance can be obtained by implanting ions as will be described later.
- the amount of ions implanted into the polymer layer may be appropriately determined according to the purpose of use of the film to be formed (necessary gas barrier properties, transparency, etc.).
- ions to be implanted ions of rare gases such as argon, helium, neon, krypton, and xenon; ions such as fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur; Ions of alkane gases such as methane, ethane, propane, butane, pentane and hexane; ions of alkene gases such as ethylene, propylene, butene and pentene; ions of alkadiene gases such as pentadiene and butadiene; acetylene, Ions of alkyne gases such as methylacetylene; ions of aromatic hydrocarbon gases such as benzene, toluene, xylene, indene, naphthalene and phenanthrene; ions of cycloalkane gases such as cyclopropane and cyclohexane; cyclopentene, Ions of cycloalkene gases
- organosilicon compound examples include tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, and tetra t-butoxysilane;
- An alkylalkoxysilane having an unsubstituted or substituted group such as dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, (3,3,3-trifluoropropyl) trimethoxysilane;
- Arylalkoxysilanes such as diphenyldimethoxysilane and phenyltriethoxysilane;
- Disiloxanes such as hexamethyldisiloxane (H
- One kind of ion is preferred.
- the method of implanting ions is not particularly limited, and examples thereof include a method of irradiating ions accelerated by an electric field (ion beam), a method of implanting ions in plasma, and the like. Among them, in the present invention, the latter method of implanting plasma ions is preferable because a gas barrier film can be easily obtained.
- a method As the plasma ion implantation method, (A) a method in which ions existing in plasma generated using an external electric field are implanted into the surface portion of the polymer layer, or (B) the layer without using an external electric field.
- a method is preferred in which ions existing in plasma generated only by an electric field generated by a negative high voltage pulse applied to are implanted into the surface portion of the polymer layer.
- the pressure during ion implantation is preferably 0.01 to 1 Pa.
- the pressure during plasma ion implantation is in such a range, ions can be implanted easily and efficiently uniformly, and the target gas barrier layer can be efficiently formed.
- the processing operation is simple, and the processing time can be greatly shortened. Further, the entire layer can be processed uniformly, and ions in the plasma can be continuously injected into the surface portion of the layer with high energy when a negative high voltage pulse is applied. Furthermore, without applying special other means such as radio frequency (hereinafter abbreviated as “RF”) or a high frequency power source such as a microwave, just applying a negative high voltage pulse to the layer, A high-quality ion-implanted layer can be uniformly formed on the surface of the layer.
- RF radio frequency
- a high frequency power source such as a microwave
- the pulse width when applying a negative high voltage pulse is preferably 1 to 15 ⁇ sec.
- the pulse width is in such a range, ions can be implanted more easily and efficiently and uniformly.
- the applied voltage when generating plasma is preferably -1 to -50 kV, more preferably -1 to -30 kV, and particularly preferably -5 to -20 kV. If ion implantation is performed at an applied voltage greater than ⁇ 1 kV, the ion implantation amount (dose amount) becomes insufficient, and desired performance cannot be obtained. On the other hand, if ion implantation is performed at a value smaller than ⁇ 50 kV, the film is charged at the time of ion implantation, and problems such as coloring of the film occur, which is not preferable.
- Examples of the ion species to be plasma ion implanted include those exemplified as the ions to be implanted.
- a plasma ion implantation apparatus When ions in plasma are implanted into the surface portion of the layer, a plasma ion implantation apparatus is used. Specifically, as a plasma ion implantation apparatus, ( ⁇ ) a high-frequency power is superimposed on a feedthrough that applies a negative high-voltage pulse to a polymer layer (hereinafter also referred to as “ion-implanted layer”). A device that uniformly surrounds the periphery of the ion-implanted layer with plasma and attracts, implants, collides and deposits ions in the plasma (Japanese Patent Laid-Open No.
- a plasma ion implantation apparatus that generates plasma using an external electric field such as a high-frequency power source such as a microwave and applies high voltage pulses to attract and inject ions in the plasma
- a plasma ion implantation apparatus that implants ions in plasma generated only by an electric field generated by applying a high voltage pulse without using an external electric field.
- the plasma ion implantation apparatus ( ⁇ ) or ( ⁇ ) because the processing operation is simple, the processing time can be greatly shortened, and it is suitable for continuous use.
- Examples of the method using the plasma ion implantation apparatus ( ⁇ ) and ( ⁇ ) include those described in International Publication WO2010 / 021326.
- the plasma generating means for generating plasma is also used by the high voltage pulse power source, other special means such as a high frequency power source such as RF and microwave are used.
- a high frequency power source such as RF and microwave.
- a portion that has been modified by ion implantation in the surface portion by generating a plasma simply by applying a negative high-voltage pulse without the need to inject ions in the plasma continuously into the surface portion of the polymer layer. It is possible to mass produce a gas barrier film having a polymer layer having a gas barrier layer, that is, a gas barrier layer.
- the thickness of the portion into which ions are implanted can be controlled by implantation conditions such as ion type, applied voltage, and processing time, and may be determined according to the thickness of the polymer layer, the purpose of use of the gas barrier film, etc. Usually, it is 10 to 1000 nm.
- the ion implantation can be confirmed by performing an elemental analysis measurement in the vicinity of 10 nm from the surface of the polymer layer using X-ray photoelectron spectroscopy (XPS).
- XPS X-ray photoelectron spectroscopy
- the gas barrier film laminate of the present invention is a gas barrier film laminate comprising at least two gas barrier films, wherein two adjacent gas barrier films are laminated via an adhesive layer,
- the reduction rate ⁇ (%) of the shear load represented by the following formula (I) is 70% or less.
- X is 23 ° C. and 50% RH using a test piece having a three-layer structure of polyethylene terephthalate film / adhesive layer / non-alkali glass and having an adhesion area of 225 mm 2 (15 mm ⁇ 15 mm).
- the shear load (N) when the displacement in the shear direction is 0.1 mm when the shear test is performed under the condition of the shear rate of 0.1 mm / min.
- Y is the shear load (N) when the displacement in the shear direction is 0.1 mm when the same test piece is used and the shear test is performed at 80 ° C. and the shear rate of 0.1 mm / min. Represents.
- ⁇ is a numerical value of the rate of change between the degree of hardness of the pressure-sensitive adhesive layer under the condition of 23 ° C. and 50% RH and the degree of hardness of the pressure-sensitive adhesive layer when placed under the condition of 80 ° C. Is.
- ⁇ is 0%.
- ⁇ is 70% or less, preferably 1 to 60%, more preferably 5 to 50%.
- the gas barrier film laminate of the present invention is placed under a high temperature and high humidity for a long time because the adhesive layer has a shear load reduction rate ⁇ (%) represented by the formula (I) of 70% or less. Even in such a case, appearance defects such as bubbles are difficult to occur.
- the gas barrier film laminate having an adhesive layer with ⁇ exceeding 70% shows bubbles when it is placed under high temperature and high humidity for a long time, resulting in poor appearance. It has occurred. And this cause is as having described as knowledge (iii) previously. Therefore, in order to obtain a gas barrier film laminate that is less likely to cause poor appearance due to bubbles when placed under high temperature and high humidity for a long time, the hardness of the pressure-sensitive adhesive layer is difficult to decrease even under high temperature conditions.
- the form and composition of the pressure-sensitive adhesive used as long as the pressure-sensitive adhesive layer having this property can be formed.
- X is preferably 5.0 to 50N, more preferably 7.0 to 50N. Since the pressure-sensitive adhesive layer in which X is 5.0 N or more has sufficient adhesive strength, a gas barrier film laminate in which two adjacent gas barrier films are difficult to peel off is obtained by using such a pressure-sensitive adhesive layer.
- Y is preferably 2.0 to 30N, more preferably 5.0 to 30N, and still more preferably 6.0 to 30N. A pressure-sensitive adhesive layer having Y of 2.0 N or more has sufficient adhesive strength even when placed under a high temperature and high humidity for a long time. Even if it is placed, a gas barrier film laminate in which two adjacent gas barrier films are difficult to peel off can be obtained.
- the thickness of the pressure-sensitive adhesive layer is not particularly limited and is appropriately selected, but is preferably 0.5 to 100 ⁇ m, more preferably 1 to 60 ⁇ m, and further preferably 3 to 40 ⁇ m. If it is 0.5 ⁇ m or more, good adhesive force can be obtained, and if it is 100 ⁇ m or less, it is advantageous in terms of productivity.
- the form and material of the pressure-sensitive adhesive to be used are not particularly limited. Therefore, the form of the pressure-sensitive adhesive to be used may be any form such as a solvent-type pressure-sensitive adhesive, an emulsion-type pressure-sensitive adhesive, and a hot-melt type pressure-sensitive adhesive.
- the pressure-sensitive adhesive to be used may be any of an acrylic pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, etc., but from the viewpoint of adhesive strength and handleability, an acrylic pressure-sensitive adhesive, Urethane adhesives are preferred. Among these, a pressure-sensitive adhesive that can form a cross-link as described later is preferable because it is easy to reduce the reduction rate ⁇ of the shear load.
- the acrylic pressure-sensitive adhesive is a pressure-sensitive adhesive mainly composed of an acrylic copolymer.
- An acrylic copolymer is a copolymer having a repeating unit derived from (meth) acrylic acid or (meth) acrylic acid ester.
- “(Meth) acrylic acid” means acrylic acid or methacrylic acid
- “(meth) acrylic acid ester” means acrylic acid ester or methacrylic acid ester.
- the acrylic copolymer may have a repeating unit other than the above as long as the effects of the present invention are not impaired.
- the acrylic copolymer is a repeating unit derived from an acrylic monomer having a functional group capable of forming a crosslinked structure (hereinafter sometimes abbreviated as “functional group”), and an acrylic type having no functional group. It is preferable to have both of the monomer-derived repeating units.
- the repeating unit derived from an acrylic monomer having a functional group contributes to the formation of a crosslinked structure in the pressure-sensitive adhesive layer, while the repeating unit derived from an acrylic monomer having no functional group is included in the pressure-sensitive adhesive layer. It can contribute to the improvement of adhesiveness.
- the functional group of the repeating unit derived from the acrylic monomer having a functional group usually includes a carboxyl group, a hydroxyl group, an amino group, and an amide group, although it depends on the type of the crosslinking agent used. Among these, a carboxyl group is preferable because an adhesive layer having a low reduction rate of shear load can be formed.
- a repeating unit derived from an acrylic monomer having no functional group can form a pressure-sensitive adhesive layer having excellent adhesiveness, and therefore an alkyl (meth) acrylate having a hydrocarbon group having 4 to 10 carbon atoms. Those derived from esters are preferred.
- the weight average molecular weight of the acrylic copolymer is usually 100,000 to 1,000,000, preferably 300,000 to 900,000. When the weight average molecular weight is within this range, an adhesive layer having a low shear load reduction rate ⁇ can be easily formed.
- the weight average molecular weight can be adjusted by adding an amount of a polymerization initiator or a chain transfer agent.
- the said weight average molecular weight is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.
- GPC gel permeation chromatography
- the acrylic copolymer can be used alone or in combination of two or more.
- the method for producing the acrylic copolymer is not particularly limited, and a conventionally known method such as a solution polymerization method, an emulsion polymerization method, a suspension polymerization method, or a bulk polymerization method can be used. Among these, solution polymerization is desirable because polymerization is easy.
- the monomers used for the production of the acrylic copolymer include acrylic monomers having a functional group, acrylic monomers having no functional group, and other monomers copolymerizable with these monomers. A monomer is mentioned.
- acrylic monomer having a functional group examples include acrylic monomers having a carboxyl group such as (meth) acrylic acid and 2-carboxyethyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, ( Such as 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc. And acrylic monomers having a hydroxyl group.
- acrylic monomers having a carboxyl group such as (meth) acrylic acid and 2-carboxyethyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, ( Such as 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (me
- an acrylic monomer having a carboxyl group such as (meth) acrylic acid, 2-carboxyethyl (meth) acrylate, etc.
- an adhesive layer having a low shear load reduction rate ⁇ is preferred, and (meth) acrylic acid is more preferred.
- These monomers can be used alone or in combination of two or more.
- the ratio of the repeating unit derived from the acrylic monomer having a functional group in the acrylic copolymer is 1 to 40% by mass, preferably 3 to 15% by mass, based on all repeating units.
- acrylic monomer having no functional group examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, (meth ) Hexyl acrylate, octyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate, stearyl (meth) acrylate, (meth) And acrylic monomers having an alkyl group such as 2-ethylhexyl acrylate and isooctyl (meth) acrylate; acrylic monomers having a cycloalkyl group such as cyclohexyl (meth) acrylate; and the like.
- the acrylic monomer having no functional group is an alkyl (meth) acrylate having a hydrocarbon group having 4 to 10 carbon atoms. Esters are preferred, and butyl (meth) acrylate is more preferred. These monomers can be used alone or in combination of two or more.
- monomers having a carboxyl group such as crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid; (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meta )
- a monomer having an amide group such as acrylamide examples thereof include acrylonitrile; styrene; vinyl acetate; vinyl pyrrolidone.
- the initiator used for the polymerization reaction is not particularly limited, and peroxide initiators such as benzoyl peroxide, lauroyl peroxide, methyl ethyl ketone peroxide, azobisisobutyronitrile, azobiscyanovaleric acid, azobiscyanopentane, etc. And azo initiators.
- the solvent used for the polymerization reaction is not particularly limited, and examples thereof include toluene, hexane, heptane, ethyl acetate, acetone, methyl ethyl ketone, and methanol.
- Known conditions can be adopted as the reaction conditions such as the temperature of the polymerization reaction and the reaction time.
- a crosslinking agent can be added to the acrylic adhesive.
- the cross-linking agent is a compound that reacts with the functional group to form a cross-link.
- a crosslinking agent there is no restriction
- an isocyanate-based crosslinking agent is preferable because an adhesive layer having a low shear load reduction rate ⁇ can be easily formed.
- the isocyanate-based crosslinking agent is not particularly limited, and a compound having two or more isocyanate groups in the molecule is used.
- isocyanate-based crosslinking agents include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; aliphatic polyisocyanates such as hexamethylene diisocyanate; isophorone diisocyanate.
- Cycloaliphatic polyisocyanates such as hydrogenated diphenylmethane diisocyanate; and their biuret, isocyanurate, and low molecular activities such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, etc.
- epoxy-based crosslinking agent a compound having two or more epoxy groups in the molecule is used.
- sorbitol tetraglycidyl ether trimethylolpropane glycidyl ether, tetraglycidyl-1,3-bisaminomethylcyclohexane, tetraglycidyl -M-xylenediamine, triglycidyl-p-aminophenol and the like.
- a crosslinking agent can be used individually by 1 type or in combination of 2 or more types.
- the amount of the crosslinking agent used is usually 0.01 to 10 parts by mass, preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer, although it depends on the type of the crosslinking agent.
- the acrylic pressure-sensitive adhesive may contain various additives as long as the adhesiveness is not impaired. Additives include light stabilizers, antioxidants, tackifiers, plasticizers, UV absorbers, colorants, resin stabilizers, fillers, pigments, extenders, antistatic agents, silane coupling agents, etc. Can be mentioned. These additives can be used alone or in combination of two or more.
- the acrylic pressure-sensitive adhesive is preferably used as a solvent-type pressure-sensitive adhesive.
- the solvent to be used is not particularly limited, and a known solvent can be used.
- the urethane-based pressure-sensitive adhesive is a pressure-sensitive adhesive containing a urethane-based resin as a main component (including a case where the whole is composed only of the component).
- the urethane adhesive includes a urethane adhesive.
- the urethane-based pressure-sensitive adhesive to be used is not particularly limited as long as a pressure-sensitive adhesive layer having desired properties can be formed, and conventionally known pressure-sensitive adhesives can be used.
- urethane resin examples include polyether polyurethane and polyester polyurethane. These urethane resins are usually produced by a polyaddition reaction of a polyol such as polyether polyol or polyester polyol and a diisocyanate.
- the diisocyanate is not particularly limited, and 2,4-tolylene diisocyanate, 2,6-toluene diisocyanate, diphenylmethane-4,4′-diisocyanate (MDI), naphthalene-1,5-diisocyanate (NDI), xylylene diene
- Aromatic diisocyanates such as isocyanate (XDI); 1,6-hexamethylene diisocyanate (HDI), dicyclohexylmethane-4,4′-diisocyanate (HMDI), 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate (IPDI) ), Aliphatic isocyanates such as 2,6-diisocyanate ethyl dicaproate (LDI); and the like. These can be used individually by 1 type or in combination of 2 or more types.
- the urethane resin may have a three-dimensional crosslinked structure obtained by reacting a urethane prepolymer having an isocyanate group at a terminal with a crosslinking agent such as triol or diamine.
- the urethane-based pressure-sensitive adhesive may contain various additives as long as the adhesiveness is not hindered. Additives include light stabilizers, antioxidants, tackifiers, plasticizers, UV absorbers, colorants, resin stabilizers, fillers, pigments, extenders, antistatic agents, silane coupling agents, etc. Can be mentioned. These additives can be used alone or in combination of two or more.
- the urethane-based pressure-sensitive adhesive may be in any form such as a solventless pressure-sensitive adhesive, a solvent-based pressure-sensitive adhesive, or a hot-melt pressure-sensitive adhesive.
- the adhesive layer adhesiveness and shear load reduction rate ⁇ can be controlled.
- the reduction rate ⁇ of the shear load can be reduced while maintaining the adhesiveness by appropriately forming a crosslinked structure.
- the content of the repeating unit having a functional group is preferably 1 to 20% by mass, and more preferably 2 to 15% by mass in all the repeating units. If the content rate of the repeating unit which has a functional group exists in said range, since a gas barrier property can be hold
- decrease rate (alpha) of a shear load, etc. are controllable by adjusting the molecular weight and crosslinked structure of urethane type resin.
- the reduction rate ⁇ of the shear load can be reduced while maintaining the adhesiveness.
- a known method can be adopted depending on the form of the pressure-sensitive adhesive to be used.
- the pressure-sensitive adhesive used is a solvent-type pressure-sensitive adhesive or an emulsion-type pressure-sensitive adhesive
- a pressure-sensitive adhesive layer-forming composition is prepared by dissolving the pressure-sensitive adhesive in an organic solvent such as toluene, ethyl acetate, or methyl ethyl ketone. After coating this composition by a known coating method such as spin coating method, spray coating method, bar coating method, knife coating method, roll coating method, blade coating method, die coating method, gravure coating method, etc.
- the pressure-sensitive adhesive layer can be formed by drying and removing the solvent from the resulting coating film and heating as desired. Moreover, when the form of the pressure-sensitive adhesive to be used is a hot-melt pressure-sensitive adhesive, it is applied by a hot-melt method utilizing the property that it easily melts and becomes fluid under heating.
- the adhesive layer can be formed by applying the molten hot-melt type adhesive by a known application method such as T-die, fountain die, gear-in die, slot die, and cooling.
- the gas barrier film laminate of the present invention is a gas barrier film laminate comprising at least two gas barrier films, wherein two adjacent gas barrier films are laminated via the pressure-sensitive adhesive layer. .
- the laminated body in which the gas barrier films are bonded to each other through the pressure-sensitive adhesive layer may have a poor appearance due to bubbles or the like when left for a long time under high temperature and high humidity.
- This problem is considered to be peculiar to a laminate in which gas barrier films are bonded together. That is, a laminated body (glass plate / adhesive of comparative example) using a glass plate instead of the gas barrier film, and further using a pressure-sensitive adhesive layer of a comparative example (experimental example in which appearance failure occurred in the gas barrier film laminated body) described later.
- appearance defects did not occur after being placed for a long time under high temperature and high humidity.
- PET film polyethylene terephthalate film
- gas barrier film PET film / laminate having a layer structure of an adhesive layer / PET film of a comparative example
- the reason for the former is that when the glass plate is used, the water vapor permeability of the glass plate is about 0.000001 g / m 2 / day, which is an extremely small value, so that it is considered that almost no moisture has entered the laminated body. It is done.
- the reason for the latter is that when a PET film is used, the water vapor permeability of the PET film is about 10 g / m 2 / day, and the PET film allows water vapor to pass more than the gas barrier film. Even if it enters the inside, it can easily escape to the outside, and it is considered that moisture does not accumulate inside the laminate.
- the above-mentioned problem of poor appearance is caused for the first time by devising a laminate in which at least two gas barrier films are laminated via an adhesive layer. And this invention solves this problem of an external appearance defect by using in combination the at least 2 gas barrier film and the adhesive layer which has the said characteristic.
- the number of gas barrier films to be laminated is not particularly limited as long as it is 2 or more.
- the number of laminated gas barrier films is usually 2-5.
- the gas barrier film laminate of the present invention may be laminated with other layers such as a protective layer, a conductor layer, and a primer layer as desired.
- the position where other layers are stacked is not particularly limited.
- the other layer may be one type, or two or more layers of the same type or different types.
- the protective layer plays a role of protecting the gas barrier film laminate when an impact is applied from the outside.
- the protective layer those having good transparency and scratch resistance are preferable.
- stacked is not specifically limited, It is preferable to laminate
- the material constituting the protective layer is not particularly limited, and known materials can be used.
- a silicon-containing compound a polymerizable composition comprising a photopolymerizable compound comprising a photopolymerizable monomer and / or a photopolymerizable prepolymer, and a polymerization initiator that generates radicals at least in the visible light region; a polyester resin , Polyurethane resins (particularly polyacrylic polyols, polyester polyols, polyether polyols and isocyanate compounds) and acrylic resins, polycarbonate resins, vinyl chloride / vinyl acetate copolymers, polyvinyl butyral resins And resins such as nitrocellulose-based resins; alkyl titanates; ethyleneimine; These materials can be used alone or in combination of two or more.
- the protective layer is formed by applying a solution for forming a protective layer obtained by dissolving or dispersing the material constituting the protective layer in an appropriate solvent onto the layer to be laminated by a known method, and drying the obtained coating film. It can be formed by heating if desired.
- a normal wet coating method can be used as a method for applying the protective layer forming solution. Examples include dipping method, roll coating, gravure coating, knife coating, air knife coating, roll knife coating, die coating, screen printing method, spray coating, gravure offset method and the like.
- the coating film of the solution for forming the protective layer As a method for drying the coating film of the solution for forming the protective layer, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be employed.
- the thickness of the protective layer can be appropriately selected according to the purpose of the gas barrier film laminate, but is preferably 0.05 to 50 ⁇ m, more preferably 0.1 to 10 ⁇ m, and further preferably 0.2 to 5 ⁇ m.
- the scratch resistance is not sufficient, which is not preferable.
- the thickness is larger than 50 ⁇ m, curling due to distortion at the time of curing tends to occur, which is not preferable.
- the conductor layer is a conductive layer.
- the material constituting the conductor layer include metals, alloys, metal oxides, electrically conductive compounds, and mixtures thereof.
- tin oxide (ATO) doped with antimony tin oxide (FTO) doped with fluorine
- conductive such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide (IZO) Metal oxides; metals such as gold, silver, chromium and nickel; mixtures of these metals and conductive metal oxides
- inorganic conductive materials such as copper iodide and copper sulfide
- organic conductive materials such as polyaniline, polythiophene and polypyrrole Material, etc.
- the conductor layer may be formed by laminating a plurality of layers made of these materials.
- the method for forming the conductor layer include a vapor deposition method, a sputtering method, an ion plating method, a thermal CVD method, a plasma CVD method, and the like.
- the sputtering method is preferable because the conductor layer can be easily formed.
- the sputtering method introduces a discharge gas (such as argon) into a vacuum chamber, applies a high-frequency voltage or a direct current voltage between the target and the substrate to turn the discharge gas into plasma, and collides the plasma with the target material.
- a discharge gas such as argon
- This is a method of obtaining a thin film by skipping and attaching to a substrate.
- a target made of a material for forming the conductor layer is used as the target.
- the thickness of a conductor layer suitably according to the use. Usually, it is 10 nm to 50 ⁇ m, preferably 20 nm to 20 ⁇ m.
- the surface resistivity of the obtained conductor layer is usually 1000 ⁇ / ⁇ or less.
- the formed conductor layer may be patterned as necessary.
- the patterning method include chemical etching by photolithography and the like, physical etching using a laser and the like, vacuum deposition method using a mask, sputtering method, lift-off method, printing method, and the like.
- a primer layer is a layer which plays the role which improves the interlayer adhesiveness of a base material layer, a gas barrier layer, or another layer. By providing the primer layer, interlayer adhesion and surface smoothness can be improved. It does not specifically limit as a material which comprises a primer layer, A well-known thing can be used.
- a silicon-containing compound for example, a silicon-containing compound; a polymerizable composition comprising a photopolymerizable compound comprising a photopolymerizable monomer and / or a photopolymerizable prepolymer, and a polymerization initiator that generates radicals at least in the visible light region; a polyester resin , Polyurethane resins (particularly polyacrylic polyols, polyester polyols, polyether polyols and isocyanate compounds) and acrylic resins, polycarbonate resins, vinyl chloride / vinyl acetate copolymers, polyvinyl butyral resins And resins such as nitrocellulose-based resins; alkyl titanates; ethyleneimine; These materials can be used alone or in combination of two or more.
- a polyester resin Polyurethane resins (particularly polyacrylic polyols, polyester polyols, polyether polyols and isocyanate compounds) and acrylic resins, polycarbonate resins, vinyl chloride /
- a primer layer forming solution obtained by dissolving or dispersing the material constituting the primer layer in an appropriate solvent is applied to one side or both sides of the base material layer or other layers, and the resulting coating film is obtained.
- a normal wet coating method can be used as a method for applying the primer layer forming solution to the base material or other layers. Examples include dipping method, roll coating, gravure coating, knife coating, air knife coating, roll knife coating, die coating, screen printing method, spray coating, gravure offset method and the like.
- the coating film of the primer layer forming solution As a method for drying the coating film of the primer layer forming solution, a conventionally known drying method such as hot air drying, hot roll drying, infrared irradiation or the like can be employed.
- the thickness of the primer layer is usually 10 to 5000 nm, preferably 20 to 4000 nm.
- the gas barrier film laminate of the present invention is a gas barrier film laminate including at least two gas barrier films, and two adjacent gas barrier films are laminated via the pressure-sensitive adhesive layer.
- the laminated structure is not particularly limited.
- the gas barrier film laminate 100A shown in FIG. 1A two adjacent gas barrier films are arranged such that the gas barrier layer 2a and the gas barrier layer 2b are opposed to each other with the pressure-sensitive adhesive layer 4 interposed therebetween.
- Layer 1a / gas barrier layer 2a / adhesive layer 4 / gas barrier layer 2b / substrate 1b two adjacent gas barrier films are arranged such that the gas barrier layer 2a and the substrate 1b face each other with the adhesive layer 4 interposed therebetween via the adhesive layer 4.
- a gas barrier film laminate 100D shown in FIG. 2 (a) is a gas barrier film laminate including three gas barrier films, and two adjacent gas barrier films are connected to the gas barrier layer 2a via the adhesive layer 4a.
- the gas barrier layer 2b is laminated so as to face each other with the pressure-sensitive adhesive layer 4a interposed therebetween, and another gas barrier film is formed by the base material 1b and the gas barrier layer 2c being interposed through the pressure-sensitive adhesive layer 4b.
- Layer structure base material 1a / gas barrier layer 2a / adhesive layer 4a / gas barrier layer 2b / base material 1b / adhesive layer 4b / gas barrier layer 2c / base material 1c laminated so as to face each other.
- FIG. 2 (b) is a gas barrier film laminate including three gas barrier films, and two adjacent gas barrier films are bonded to the gas barrier layer 2a via the adhesive layer 4a.
- the gas barrier layer 2 (c) is a gas barrier film laminate including three gas barrier films, and two adjacent gas barrier films are connected to the gas barrier layer 2a via the adhesive layer 4a.
- the gas barrier layer 2b is laminated so as to face each other with the pressure-sensitive adhesive layer 4a sandwiched therebetween, and another gas barrier film is formed by interposing the pressure-sensitive adhesive layer 4b with the base material 1b and the base material 1c.
- Layer structure base material 1a / gas barrier layer 2a / adhesive layer 4a / gas barrier layer 2b / base material 1b / adhesive layer 4b / base material 1c / gas barrier layer 2c).
- two adjacent gas barrier films have a gas barrier layer and a gas barrier layer.
- Lamination so as to face each other with the pressure-sensitive adhesive layer interposed therebetween is preferable because scratches and pinholes are unlikely to occur in the gas barrier layer and gas barrier properties are unlikely to deteriorate, and FIG. 1 (a) and FIG. 2 (a) As shown in FIG. 2, it is more preferable that none of the outermost layers of the gas barrier film laminate is a gas barrier layer.
- the method for laminating the two adjacent gas barrier films via the pressure-sensitive adhesive layer is not particularly limited, and a known method may be mentioned.
- the gas barrier film laminate 100A having the layer configuration (base 1a / gas barrier layer 2a / adhesive layer 4 / gas barrier layer 2b / base 1b) shown in FIG. 1 (a) is manufactured as follows. Can do.
- FIG. 3A two sheets of a gas barrier film 10 having a base material 1 made of a synthetic resin film and a gas barrier layer 2 provided on the base material 1 are prepared (hereinafter 10a respectively). 10b)).
- the adhesive layer 4 is formed on the peeling film 3, and the peeling film 20 with an adhesive layer is obtained.
- the peeling film 20 with an adhesive layer may have another peeling film on the adhesive layer 4.
- FIG.3 (c) by bonding together the gas barrier layer 2a of the gas barrier film 10a, and the adhesive layer 4 of the peeling film 20 with an adhesive layer, heating as needed, an adhesive film Get 30.
- the method of bonding is not particularly limited, and examples thereof include a method using a known laminator.
- the release film 3 of the adhesive film 30 is peeled off, and the gas barrier layer 2b of the gas barrier film 10b is bonded to the exposed pressure-sensitive adhesive layer 4 surface while heating as desired.
- the gas barrier film laminate 100A shown in FIG. 3 (e) can be obtained.
- the method for producing the gas barrier laminate of the present invention is not limited to the above method.
- the pressure-sensitive adhesive layer is formed directly on the gas barrier layer 2 of the gas barrier film 10 shown in FIG.
- a gas barrier film laminate can be obtained by stacking and pressure-bonding another gas barrier film while heating if desired.
- the shape of the gas barrier film laminate of the present invention is not particularly limited as long as it can be applied to an electronic member as described later.
- a sheet shape, a rectangular parallelepiped shape, a polygonal column shape, a cylindrical shape and the like can be mentioned.
- the gas barrier film laminate of the present invention has a high gas barrier property, and even when placed under a high temperature and a high humidity for a long time, it is difficult for appearance defects such as bubbles to occur. It is suitable for display members such as organic EL display members, inorganic EL display members, and electronic paper members.
- Adhesive film The adhesive film of the present invention comprises at least two gas barrier films, and an adhesive film for producing a gas barrier film laminate comprising two adjacent gas barrier films laminated via an adhesive layer.
- the gas barrier film and the pressure-sensitive adhesive layer are laminated adjacent to each other, and the pressure-sensitive adhesive layer has a shear load reduction rate ⁇ (%) represented by the formula (I) of 70% or less. It is characterized by being.
- Examples of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film of the present invention include those similar to the pressure-sensitive adhesive layer described above in the gas barrier film laminate.
- stacked adjacently is mentioned.
- the adhesive film of this invention has a peeling film on the adhesive layer 4, it does not have a peeling film (namely, it has a layer structure formed by removing the peeling film 3 from the adhesive film 30). Thing).
- the pressure-sensitive adhesive film of the present invention may be laminated with other layers such as a protective layer, a conductor layer, and a primer layer as desired. Examples of these layers include those described above in the gas barrier film laminate.
- the position where other layers are stacked is not particularly limited.
- the other layer may be one kind or two or more kinds of the same kind or different kinds.
- the pressure-sensitive adhesive film of the present invention is useful when producing the gas barrier film laminate of the present invention.
- the electronic member of the present invention includes the gas barrier film laminate of the present invention.
- the electronic member include flexible substrates such as a liquid crystal display member, an organic EL display member, an inorganic EL display member, an electronic paper member, a solar cell, and a thermoelectric conversion member. Since the electronic member of the present invention is provided with the gas barrier film laminate of the present invention described above, it is difficult to cause deterioration of the device due to water vapor and the like, and when it is placed under high temperature and high humidity for a long time. However, appearance defects such as bubbles are less likely to occur.
- BA butyl acrylate
- AA acrylic acid
- adhesive composition E 100 parts by mass of polyisobutylene resin (manufactured by BASF, Opanol B50, weight average molecular weight 340,000), 30 parts by mass of polybutene resin (manufactured by Nippon Oil Co., Ltd., Nippon Polybutene Grade HV-1900, weight average molecular weight 1900), cyclic olefin 50 parts by mass of a polymer (Elastotac H-100L Resin, manufactured by Eastman Chemical Co., Ltd.) was dissolved in toluene to obtain an adhesive composition E having a nonvolatile content concentration of about 18% by mass.
- polyisobutylene resin manufactured by BASF, Opanol B50, weight average molecular weight 340,000
- polybutene resin manufactured by Nippon Oil Co., Ltd., Nippon Polybutene Grade HV-1900, weight average molecular weight 1900
- cyclic olefin 50 parts by mass of a polymer (Elastot
- a polyethylene terephthalate film Mitsubishi Plastics, PET38 T-100, thickness 38 ⁇ m, hereinafter referred to as “PET film”
- PET film a polyethylene terephthalate film
- a polysilazane compound a coating material containing perhydropolysilazane as a main component (Clariant Japan) Manufactured by Aquamica NL110-20
- argon (Ar) was ion-implanted into the surface of the polysilazane layer using a plasma ion implantation apparatus under the following conditions to form a gas barrier layer, thereby producing a gas barrier film.
- the resulting gas barrier film had a water vapor transmission rate of 0.02 g / m 2 / day under the conditions of 40 ° C. and relative humidity of 90%.
- the water vapor permeability of the gas barrier film was measured using “PERMATRAN” manufactured by MOCON, USA.
- the plasma ion implantation apparatus and ion implantation conditions used for forming the gas barrier layer are as follows.
- RF power source JEOL Ltd., model number “RF” 56000
- High voltage pulse power supply “PV-3-HSHV-0835” manufactured by Kurita Manufacturing Co., Ltd.
- Plasma generation gas Ar Gas flow rate: 100sccm Duty ratio: 0.5%
- Applied voltage -6kV
- RF power supply frequency 13.56 MHz
- applied power 1000 W
- Chamber internal pressure 0.2 Pa
- Pulse width 5 ⁇ sec Processing time (ion implantation time): 200 seconds
- Example 1 The adhesive composition A was applied by a comma direct coating method to the release layer surface of a release film (SP-PET 381031 manufactured by Lintec Corporation) having a silicone release layer on one side of a 38 ⁇ m thick polyethylene terephthalate film, The obtained coating film was dried at 100 ° C. for 1 minute to form a pressure-sensitive adhesive layer having a thickness of about 10 ⁇ m to obtain a release film a with a pressure-sensitive adhesive layer.
- SP-PET 381031 manufactured by Lintec Corporation
- a release film (SP-PFS50AL-5, manufactured by Lintec Co., Ltd., a release film in which a release layer is provided on one side of a 38 ⁇ m thick polyethylene terephthalate film) is prepared separately, and the release layer and the adhesive layer of the release film The pressure-sensitive adhesive layer surface of the peelable release film a was bonded to obtain a pressure-sensitive adhesive layer-attached release film A in which release films were laminated on both sides of the pressure-sensitive adhesive layer.
- two gas barrier films prepared by the above method were prepared, and the gas barrier layer surface of one gas barrier film was bonded to the adhesive layer surface exposed by peeling off one release film of the release film A with the adhesive layer. . Further, the pressure-sensitive adhesive layer surface exposed by peeling off the release film on the other surface side and the gas barrier layer surface of the other gas barrier film were bonded together to produce a gas barrier film laminate A.
- Example 2 In Example 1, the pressure-sensitive adhesive composition A was replaced with the pressure-sensitive adhesive composition B, and a release film B with a pressure-sensitive adhesive layer was prepared, and the gas barrier film lamination was performed in the same manner as in Example 1 except that this was used. Body B was prepared.
- Example 1 (Comparative Example 1) In Example 1, the pressure-sensitive adhesive composition A was replaced with the pressure-sensitive adhesive composition C to prepare a release film C with a pressure-sensitive adhesive layer, and the gas barrier film lamination was performed in the same manner as in Example 1 except that this was used. Body C was prepared.
- Example 2 In Example 1, the pressure-sensitive adhesive composition A was replaced with the pressure-sensitive adhesive composition D to prepare a release film D with a pressure-sensitive adhesive layer, and the gas barrier film lamination was performed in the same manner as in Example 1 except that this was used. Body D was prepared.
- Example 3 (Comparative Example 3)
- the pressure-sensitive adhesive composition A was replaced with the pressure-sensitive adhesive composition E to prepare a release film E with a pressure-sensitive adhesive layer, and the gas barrier film lamination was performed in the same manner as in Example 1 except that this was used. Body E was produced.
- Example 3 A sheet with a pressure-sensitive adhesive layer having a urethane-based pressure-sensitive adhesive layer (manufactured by Kurashiki Boseki Co., Ltd., G-6, thickness 25 ⁇ m) is prepared on the release film, and this pressure-sensitive adhesive layer surface and the gas barrier layer surface of the gas barrier film produced by the above method And a heat laminator (lamination temperature 120 ° C., speed 0.24 m / min), and then the release film was peeled off. The exposed urethane pressure-sensitive adhesive layer and the gas barrier layer surface of another gas barrier film were bonded together using the heat laminator to prepare a gas barrier film laminate F.
- a urethane-based pressure-sensitive adhesive layer manufactured by Kurashiki Boseki Co., Ltd., G-6, thickness 25 ⁇ m
- Example 4 (Comparative Example 4) In Example 3, instead of the sheet with the pressure-sensitive adhesive layer having the urethane-based pressure-sensitive adhesive layer, the pressure-sensitive adhesive sheet with the agent layer having the olefin-based pressure-sensitive adhesive on the release film (manufactured by Kurashiki Boseki Co., Ltd., Z-2, thickness 25 ⁇ m) A gas barrier film laminate G was produced in the same manner as in Example 3 except that it was used.
- test pieces were prepared by the following method.
- a polyethylene terephthalate film manufactured by Toyobo Co., Ltd., Cosmo Shine PET188A4300, thickness 188 ⁇ m
- a test adhesive film (adhesive layer thickness 30 ⁇ m) was obtained. After peeling the release film of the test adhesive film to expose the adhesive layer, the test adhesive film and non-alkali glass (Corning Corp.
- FIG. 4A is a front view of the test piece
- FIG. 4B is a cross-sectional view along the XY plane in FIG. 4A.
- test piece was prepared by the following method.
- a polyethylene terephthalate film manufactured by Toyobo Co., Ltd., Cosmo Shine PET188A4300, thickness 188 ⁇ m
- the adhesive layer surface of each adhesive layer-attached sheet are attached with a heat laminator (lamination temperature 120 ° C., speed 0.24 m / min). After combining, it was cut into a size of 15 mm wide and 100 mm long to obtain a test adhesive film. After peeling the release film of the test adhesive film to expose the adhesive layer, the test adhesive film and non-alkali glass (Corning Corp. Eagle XG) were attached as shown in FIG.
- the test pieces were obtained by superimposing such that the area was 225 mm 2 (15 mm ⁇ 15 mm) and bonding them using a heat laminator under the same conditions as described above.
- test pieces obtained by the above method were each left for 24 hours in an environment of 23 ° C. and a relative humidity of 50%. After that, in the same environment, a test piece was attached to a tensile tester (Instron, model 5581) (in the non-alkali glass and the test adhesive film, the end on the non-adhered side was used as the tensile tester, respectively.
- the test piece was pulled in the horizontal direction (shear direction) at a shear rate of 0.1 mm / min, and the load was measured.
- the shear load when the displacement in the shear direction was 0.1 mm was defined as X (N).
- Each of the gas barrier film laminates A to G obtained in Examples 1 to 3 and Comparative Examples 1 to 4 was cut into a size of 120 mm ⁇ 120 mm and subjected to high-temperature and humid-heat conditions (condition 1: 60 ° C., 90%). RH, condition 2: 85 ° C., 85% RH) for 1000 hours each. Then, temperature control and humidity control were performed for one day in an environment of 23 ° C. and 50% RH, and the gas barrier film laminate was visually evaluated.
- Table 1 shows the following.
- the pressure-sensitive adhesive layer has a shear load reduction rate of 70% or less, and even when it is placed under high-temperature and high-humidity conditions, Is not seen.
- the pressure-sensitive adhesive layer has a shear load reduction rate exceeding 70%, and bubbles are observed when placed under high temperature and high humidity conditions. It was.
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Abstract
Description
しかし、プラスチックフィルムは、ガラス板に比べて水蒸気や酸素等を透過しやすく、電子部材内部の素子の劣化を起こしやすいという問題があった。
特許文献2には、プラスチックフィルムと、該プラスチックフィルムの少なくとも一方の面に、ポリオルガノシルセスキオキサンを主成分とする樹脂層を積層してなるガスバリア性積層体が開示されている。
また、特許文献3には、第1の透明プラスチックフィルム基材の上に透明ガスバリア層が形成され、前記透明ガスバリア層の上に透明粘着剤層を介して、第2の透明プラスチックフィルム基材が配置されている透明フィルムが開示されている。
本願出願人も、先に、酸素原子、炭素原子及びケイ素原子を含む材料から形成されてなるガスバリア層を有する成形体(ガスバリアフィルム)を提案している(WO2010/021326号公報、WO2010/107018号公報など)。これらの文献に記載されたガスバリアフィルムは優れたガスバリア性を有するものである。
本発明者らは、ガスバリア性をより向上させるべくさらに検討し、少なくとも2枚のガスバリア性フィルムを粘着剤層を介して積層した積層体を案出した。
しかしながら、上記のように粘着剤層を介してガスバリアフィルム同士を貼り合せた積層体は、高温及び高湿度下に長時間置いた場合に、気泡などが原因で外観不良が発生することがあった。
その結果、
(i)WO2010/021326号公報、WO2010/107018号公報などに記載されたガスバリアフィルムは優れたガスバリア性を有するものであるが、それでも、高温および高湿度下に長時間置かれた場合に、微量の水分がガスバリアフィルムを通過し、ガスバリアフィルム積層体内部に浸入する場合があること、
(ii)このようなガスバリアフィルム積層体内部に侵入した水分は、ガスバリアフィルムが存在することで、逆に外部に逃げ難くなっていること、
(iii)また、高温条件下で粘着剤層の硬さが大きく低下するガスバリアフィルム積層体、すなわち、後述するαが70%を超える粘着剤層を有するガスバリアフィルム積層体は、高温および高湿度下に長時間置かれた場合に、外部から浸入した微量の水分を粘着剤層にためやすく、その結果、気泡が発生しやすい、という知見を得た。
そして、これらの知見から、後述するαが70%以下である粘着剤層を有するガスバリアフィルム積層体は、ガスバリア性に優れ、かつ、高温および高湿度下に長時間置かれた場合であっても、気泡などの外観不良が発生しにくいものであることを見出し、本発明を完成するに至った。
(1)少なくとも2枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなり、前記粘着剤層の、下記式(I)で示されるせん断荷重の減少率α(%)が70%以下であることを特徴とするガスバリアフィルム積層体。
(2)前記ガスバリアフィルムが、基材フィルムと、該基材フィルム上に設けられた少なくとも1層のガスバリア層とを有するものである、(1)に記載のガスバリアフィルム積層体。
(3)隣接する2枚のガスバリアフィルムが、該ガスバリアフィルムのガスバリア層同士が対向するように積層されたものである、(2)に記載のガスバリアフィルム積層体。
(5)前記粘着剤層が、アクリル系粘着剤またはウレタン系粘着剤からなるものである、(1)または(2)に記載のガスバリアフィルム積層体。
(6)前記アクリル系粘着剤が、カルボキシル基を有するアクリル系単量体由来の繰り返し単位と、官能基を有しないアクリル系単量体由来の繰り返し単位の両方を有するアクリル系共重合体を主成分とするものである、(5)に記載のガスバリアフィルム積層体。
(8)前記アクリル系粘着剤が、架橋剤を含む、(5)に記載のガスバリアフィルム積層体。
(9)前記粘着剤層の厚みが、0.5~100μmである(1)に記載のガスバリアフィルム積層体。
(10)前記ガスバリアフィルムの水蒸気透過率が、40℃、相対湿度90%の雰囲気下で、0.00001~1.0g/m2/dayである(1)に記載のガスバリアフィルム積層体。
前記粘着剤層の、前記式(I)で示されるせん断荷重の減少率α(%)が70%以下であることを特徴とする粘着フィルム。
(12)前記(1)~(5)のいずれかに記載のガスバリアフィルム積層体を備える電子部材。
本発明の粘着フィルムは、前記ガスバリアフィルム積層体を製造する際に好適に用いられる。
本発明のガスバリアフィルム積層体は、太陽電池や、液晶ディスプレイ、エレクトロルミネッセンス(EL)ディスプレイ等の電子部材用に好適である。
本発明のガスバリアフィルム積層体は、少なくとも2枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなり、前記粘着剤層が、前記式(I)で示されるせん断荷重の減少率α(%)が70%以下のものであることを特徴とする。
本発明に用いるガスバリアフィルムは、酸素や水蒸気の透過を抑制する特性(以下、「ガスバリア性」という)を有するフィルムである。
用いるガスバリアフィルムの水蒸気透過率は、40℃、相対湿度90%の雰囲気下で、好ましくは1.0g/m2/day以下、より好ましくは0.00001~1.0g/m2/day、より好ましくは0.00001~0.5g/m2/day、さらに好ましくは0.00001~0.1g/m2/dayである。
なお、水蒸気透過率は、公知のガス透過率測定装置を使用して測定することができる。
本発明に用いるガスバリアフィルムとしては、ガスバリア性に優れることから、合成樹脂フィルムからなる基材(以下、「基材フィルム」や「基材」と略記することがある。)と、該基材上に設けられた少なくとも1層のガスバリア層を有するものが好ましい。
合成樹脂フィルムからなる基材の材料としては、ポリエチレン、ポリプロピレンなどのポリオレフィン系樹脂;ポリスチレン等のスチレン系樹脂;ポリメタクリル酸メチルなどのアクリル系樹脂;ポリアミド(ナイロン6、ナイロン66など)、ポリm-フェニレンイソフタルアミド、ポリp-フェニレンテレフタルアミドなどのアミド系樹脂;ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリアリレートなどのポリエステル系樹脂;ノルボルネン系重合体、単環の環状オレフィン系重合体、環状共役ジエン系重合体、ビニル脂環式炭化水素重合体、及びこれらの水素化物などのシクロオレフィン系ポリマー;ポリイミド;ポリアミドイミド;ポリフェニレンエーテル;ポリエーテルケトン;ポリエーテルエーテルケトン;ポリカーボネート;ポリスルフォン;ポリエーテルスルフォン;ポリフェニレンスルフィド;及びこれらの高分子の二種以上の組合せ;等が挙げられる。
用いる基材の厚みは、通常100nm~1000μm、好ましくは5~200μmの範囲である。
本発明に用いるガスバリアフィルムのガスバリア層は、ガスバリア性を有する層である。
ガスバリア層は合成樹脂フィルムからなる基材の片面に形成されていても、基材の両面に形成されていてもよい。また、ガスバリア層は単層であってもよく、複数層積層されていてもよい。
酸化珪素、酸化アルミニウム、酸化マグネシウム、酸化亜鉛、酸化インジウム、酸化スズ等の無機酸化物;
窒化珪素等の無機窒化物;
無機炭化物;無機硫化物;これらの複合体である無機酸化窒化物;無機酸化炭化物;無機窒化炭化物;無機酸化窒化炭化物;高分子化合物;等が挙げられる。
なお、この場合、「ガスバリア層」とは、イオン注入により改質された部分のみを意味するのではなく、「イオン注入により改質された部分を有する高分子層」を意味する。
なお、高分子化合物から形成されるガスバリア層は、前述の合成樹脂フィルムからなる基材には含まれない。
ポリオルガノシロキサン系化合物の主鎖構造に制限はなく、直鎖状、ラダー状、籠状のいずれであってもよい。
例えば、前記直鎖状の主鎖構造としては下記式(a)で表される構造が、ラダー状の主鎖構造としては下記式(b)で表される構造が、籠状の主鎖構造としては、例えば下記式(c)で表される構造が、それぞれ挙げられる。
アルケニル基としては、例えば、ビニル基、1-プロペニル基、2-プロペニル基、1-ブテニル基、2-ブテニル基、3-ブテニル基等の炭素数2~10のアルケニル基が挙げられる。
前記アリール基の置換基としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン原子;メチル基、エチル基等の炭素数1~6のアルキル基;メトキシ基、エトキシ基等の炭素数1~6のアルコキシ基;ニトロ基;シアノ基;ヒドロキシル基;チオール基;エポキシ基;グリシドキシ基;(メタ)アクリロイルオキシ基;フェニル基、4-メチルフェニル基、4-クロロフェニル基等の無置換若しくは置換基を有するアリール基;等が挙げられる。
用いるシラン化合物は、目的とするポリオルガノシロキサン系化合物の構造に応じて適宜選択すればよい。
Rw、Rvのアルキル基、アリール基、アルケニル基としては、前記Rx等として例示したものと同様のものが挙げられる。
Rのアルキレン基としては、メチレン基、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基、オクタメチレン基等の炭素数1~10のアルキレン基が挙げられる。
2価の複素環基としては、炭素原子の他に酸素原子、窒素原子、硫黄原子等のヘテロ原子を少なくとも1つ含む3~10員の複素環化合物から導かれる2価の基であれば特に制約はない。
なお、Rのアルキレン基、アリーレン基、2価の複素環基は、任意の位置に、アルキル基、アリール基、アルコキシ基、ハロゲン原子等の置換基を有していてもよい。
シクロアルキル基としては、シクロペンチル基、シクロヘキシル基、メチルシクロヘキシル基等の炭素数3~10のシクロアルケニル基が挙げられる。
シクロアルケニル基としては、シクロペンテニル基、シクロヘキセニル基等の炭素数4~10のシクロアルケニル基が挙げられる。
アルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基、t-ブトキシ基、ペンチルオキシ基等の炭素数1~10のアルコキシ基が挙げられる。
シクロアルキルオキシ基としては、シクロペンチルオキシ基、シクロヘキシルオキシ基等の炭素数3~10のシクロアルキルオキシ基が挙げられる。
アリールオキシ基としては、フェノキシ基、ナフチルオキシ基等の炭素数6~20のアリールオキシ基が挙げられる。
アラルキルオキシ基としては、ベンジルオキシ基、フェネチルオキシ基、フェニルプロピルオキシ基等の炭素数7~20のアラルキルオキシ基が挙げられる。
置換基を有していてもよいアミノ基としては、アミノ基;アルキル基、シクロアルキル基、アリール基、アラルキル基、アシル基等で置換されたN-モノ又はN,N-ジ置換アミノ基等が挙げられる。
シリル基としては、シリル基、ジシラニル基、トリシラニル基等のSi1-10シラニル基(好ましくはSi1-6シラニル基)、置換シリル基(例えば、アルキル基、シクロアルキル基、アリール基、アラルキル基、アルコキシ基等で置換された置換シリル基)等が挙げられる。
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられる。
ポリシラン系化合物が非環状ポリシランである場合は、ポリシラン系化合物の末端基(末端置換基)は、水素原子であっても、ハロゲン原子(塩素原子等)、アルキル基、ヒドロキシル基、アルコキシ基、シリル基等であってもよい。
また、ポリシラン系化合物の重量平均分子量は、300~100,000、好ましくは400~50,000、さらに好ましくは500~30,000程度である。
ポリシラン系化合物の多くは公知物質であり、公知の方法を用いて製造することができる。
Rm、Rp、Rtは、それぞれ独立して、水素原子、アルキル基、シクロアルキル基、アルケニル基、アリール基又はアルキルシリル基等の非加水分解性基を表す。
シクロアルキル基としては、前記Rq等で例示したのと同様のものが挙げられる。
アルキルシリル基としては、トリメチルシリル基、トリエチルシリル基、トリイソプロピルシリル基、トリt-ブチルシリル基、メチルジエチルシリル基、ジメチルシリル基、ジエチルシリル基、メチルシリル基、エチルシリル基等が挙げられる。
無機ポリシラザンとしては、下記式
(i)-(Rm’SiHNH)-(Rm’は、Rmと同様のアルキル基、シクロアルキル基、アルケニル基、アリール基又はアルキルシリル基を表す。以下のRm’も同様である。)を繰り返し単位として、主として重合度が3~5の環状構造を有するもの、
(ii)-(Rm’SiHNRt’)-(Rt’は、Rtと同様のアルキル基、シクロアルキル基、アルケニル基、アリール基又はアルキルシリル基を表す。)を繰り返し単位として、主として重合度が3~5の環状構造を有するもの、
(iii)-(Rm’Rp’SiNH)-(Rp’は、Rpと同様のアルキル基、シクロアルキル基、アルケニル基、アリール基アルキルシリル基を表す。)を繰り返し単位として、主として重合度が3~5の環状構造を有するもの、
(iv)下記式で表される構造を分子内に有するポリオルガノ(ヒドロ)シラザン、
で表される繰り返し構造を有するポリシラザン等が挙げられる。
用いる2級アミン、アンモニア及び1級アミンは、目的とするポリシラザン系化合物の構造に応じて、適宜選択すればよい。
なお、ポリシラザン系化合物は、ガラスコーティング材等として市販されている市販品をそのまま使用することもできる。
本発明においては、高分子層の厚みがナノオーダーであっても、後述するようにイオンを注入することで、充分なガスバリア性能を有するフィルムを得ることができる。
メタン、エタン、プロパン、ブタン、ペンタン、ヘキサン等のアルカン系ガス類のイオン;エチレン、プロピレン、ブテン、ペンテン等のアルケン系ガス類のイオン;ペンタジエン、ブタジエン等のアルカジエン系ガス類のイオン;アセチレン、メチルアセチレン等のアルキン系ガス類のイオン;ベンゼン、トルエン、キシレン、インデン、ナフタレン、フェナントレン等の芳香族炭化水素系ガス類のイオン;シクロプロパン、シクロヘキサン等のシクロアルカン系ガス類のイオン;シクロペンテン、シクロヘキセン等のシクロアルケン系ガス類のイオン;
金、銀、銅、白金、ニッケル、パラジウム、クロム、チタン、モリブデン、ニオブ、タンタル、タングステン、アルミニウム等の導電性の金属のイオン;
シラン(SiH4)又は有機ケイ素化合物のイオン;等が挙げられる。
ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジエチルジメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、(3,3,3-トリフルオロプロピル)トリメトキシシラン等の無置換若しくは置換基を有するアルキルアルコキシシラン;
ジフェニルジメトキシシラン、フェニルトリエトキシシラン等のアリールアルコキシシラン;
ヘキサメチルジシロキサン(HMDSO)等のジシロキサン;
ビス(ジメチルアミノ)ジメチルシラン、ビス(ジメチルアミノ)メチルビニルシラン、ビス(エチルアミノ)ジメチルシラン、ジエチルアミノトリメチルシラン、ジメチルアミノジメチルシラン、テトラキスジメチルアミノシラン、トリス(ジメチルアミノ)シラン等のアミノシラン;
ヘキサメチルジシラザン、ヘキサメチルシクロトリシラザン、ヘプタメチルジシラザン、ノナメチルトリシラザン、オクタメチルシクロテトラシラザン、テトラメチルジシラザン等のシラザン;
テトライソシアナートシラン等のシアナートシラン;
トリエトキシフルオロシラン等のハロゲノシラン;
ジアリルジメチルシラン、アリルトリメチルシラン等のアルケニルシラン;
ジ-t-ブチルシラン、1,3-ジシラブタン、ビス(トリメチルシリル)メタン、テトラメチルシラン、トリス(トリメチルシリル)メタン、トリス(トリメチルシリル)シラン、ベンジルトリメチルシラン等の無置換若しくは置換基を有するアルキルシラン;
ビス(トリメチルシリル)アセチレン、トリメチルシリルアセチレン、1-(トリメチルシリル)-1-プロピン等のシリルアルキン;
1,4-ビストリメチルシリル-1,3-ブタジイン、シクロペンタジエニルトリメチルシラン等のシリルアルケン;
フェニルジメチルシラン、フェニルトリメチルシラン等のアリールアルキルシラン;
プロパルギルトリメチルシラン等のアルキニルアルキルシラン;
ビニルトリメチルシラン等のアルケニルアルキルシラン;
ヘキサメチルジシラン等のジシラン;
オクタメチルシクロテトラシロキサン、テトラメチルシクロテトラシロキサン、ヘキサメチルシクロテトラシロキサン等のシロキサン;
N,O-ビス(トリメチルシリル)アセトアミド;
ビス(トリメチルシリル)カルボジイミド;
等が挙げられる。
これらのイオンは、一種単独で、あるいは二種以上を組み合わせて用いてもよい。
プラズマイオン注入装置としては、具体的には、(α)高分子層(以下、「イオン注入する層」ということがある。)に負の高電圧パルスを印加するフィードスルーに高周波電力を重畳してイオン注入する層の周囲を均等にプラズマで囲み、プラズマ中のイオンを誘引、注入、衝突、堆積させる装置(特開2001-26887号公報)、(β)チャンバー内にアンテナを設け、高周波電力を与えてプラズマを発生させてイオン注入する層周囲にプラズマが到達後、イオン注入する層に正と負のパルスを交互に印加することで、正のパルスでプラズマ中の電子を誘引衝突させてイオン注入する層を加熱し、パルス定数を制御して温度制御を行いつつ、負のパルスを印加してプラズマ中のイオンを誘引、注入させる装置(特開2001-156013号公報)、(γ)マイクロ波等の高周波電力源等の外部電界を用いてプラズマを発生させ、高電圧パルスを印加してプラズマ中のイオンを誘引、注入させるプラズマイオン注入装置、(δ)外部電界を用いることなく高電圧パルスの印加により発生する電界のみで発生するプラズマ中のイオンを注入するプラズマイオン注入装置等が挙げられる。
前記(γ)及び(δ)のプラズマイオン注入装置を用いる方法については、国際公開WO2010/021326号公報に記載のものが挙げられる。
本発明のガスバリアフィルム積層体は、少なくとも2枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなり、前記粘着剤層の、下記式(I)で示されるせん断荷重の減少率α(%)が70%以下であることを特徴とする。
また、Yは、同様の試験片を用いて、80℃、せん断速度0.1mm/分の条件でせん断試験を行った場合において、せん断方向の変位が0.1mmのときのせん断荷重(N)を表す。
本発明においては、αは、70%以下、好ましくは、1~60%、より好ましくは、5~50%である。
したがって、高温および高湿度下に長時間置かれた場合に、気泡による外観不良が発生しにくいガスバリアフィルム積層体を得るためには、高温条件下でも粘着剤層の硬さが低下しにくいものであればよく(すなわち、αが70%以下のものであればよく)、この特性を有する粘着剤層を形成し得る限り、用いる粘着剤の形態や組成は特に制限されない。
また、Yは、好ましくは2.0~30N、より好ましくは5.0~30N、さらに好ましくは6.0~30Nである。Yが2.0N以上の粘着剤層は、高温および高湿度下に長時間置かれた場合にも十分な粘着力を有するものであるため、かかる粘着剤層を用いることで、上記条件下に置かれた場合であっても、隣接する2枚のガスバリアフィルムが剥がれにくいガスバリアフィルム積層体が得られる。
アクリル系共重合体とは、(メタ)アクリル酸又は(メタ)アクリル酸エステル由来の繰り返し単位を有する共重合体である。
「(メタ)アクリル酸」とは、アクリル酸又はメタクリル酸を意味し、「(メタ)アクリル酸エステル」とは、アクリル酸エステル又はメタクリル酸エステルを意味する。
また、アクリル系共重合体は、本発明の効果を阻害しない限り、上記以外の繰り返し単位を有するものであってもよい。
重量平均分子量は、重合開始剤の量や連鎖移動剤を添加することによって調節することができる。
なお、上記重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により測定したポリスチレン換算の値である。
アクリル系粘着剤を調製する際に、アクリル系共重合体は一種単独で、あるいは二種以上を組み合わせて用いることができる。
これらの単量体は、一種単独で、あるいは二種以上を組み合わせて用いることができる。
これらのなかでも、粘着性に優れる粘着剤層を形成することができることから、官能基を有しないアクリル系単量体としては、炭素数4~10の炭化水素基を有する(メタ)アクリル酸アルキルエステルが好ましく、(メタ)アクリル酸ブチルがより好ましい。
これらの単量体は、一種単独で、あるいは二種以上を組み合わせて用いることができる。
アクリロニトリル;スチレン;酢酸ビニル;ビニルピロリドン等が挙げられる。
重合反応に用いる溶媒は特に制限されず、トルエン、ヘキサン、ヘプタン、酢酸エチル、アセトン、メチルエチルケトン、メタノール等が挙げられる。
重合反応の温度や反応時間等の反応条件は、公知の条件を採用することができる。
架橋剤は、一種単独で、あるいは二種以上を組み合わせて用いることができる。
アクリル系粘着剤は、溶剤型粘着剤として好ましく用いられる。用いる溶剤は特に制限されず、公知のものを使用することができる。
用いるウレタン系粘着剤は、目的の特性を有する粘着剤層を形成できる限り特に限定されず、従来公知のものを用いることができる。
これらのウレタン系樹脂は、通常、ポリエーテルポリオール又はポリエステルポリオールなどのポリオールとジイソシアネートとの重付加反応により製造される。
これらは一種単独で、あるいは二種以上を組み合わせて用いることができる。
ウレタン系粘着剤は、無溶剤型粘着剤、溶剤型粘着剤、ホットメルト型粘着剤等のいずれの形態のものであってもよい。
例えば、アクリル系共重合体を用いる場合、適度に架橋構造を形成させることで、粘着性を維持したまま、せん断荷重の減少率αを低下させることができる。官能基を有する繰り返し単位の含有割合は、全繰り返し単位中、1~20質量%が好ましく、2~15質量%がより好ましい。官能基を有する繰り返し単位の含有割合が上記の範囲内であれば、ガスバリア層を侵食することがなく、ガスバリア性を保持できるため好ましい。
また、ウレタン系樹脂を用いる場合、ウレタン系樹脂の分子量や架橋構造を調節することで、粘着剤層の粘着性やせん断荷重の減少率α等を制御することができる。特に、適度に3次元架橋構造を形成させることで、粘着性を維持したまま、せん断荷重の減少率αを低下させることができる。
また、用いる粘着剤の形態が、ホットメルト型粘着剤である場合は、加熱下に容易に溶融して流動性を有するようになる性質を利用して、ホットメルト法によって塗工される。溶融状態のホットメルト型粘着剤をTダイ、ファウンテンダイ、ギヤインダイ、スロットダイ等の公知の塗工方法により塗工し、冷却することにより、粘着剤層を形成することができる。
本発明のガスバリアフィルム積層体は、少なくとも2枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、前記粘着剤層を介して積層されていることを特徴とする。
すなわち、ガスバリアフィルムの代わりにガラス板を使用し、さらに、後述する比較例(ガスバリアフィルム積層体に外観不良が発生した実験例)の粘着剤層を使用した積層体(ガラス板/比較例の粘着剤層/ガラス板の層構成を有する積層体)においては、高温および高湿度下に長時間置かれた後に外観不良が発生しなかった。
また、同様に、ガスバリアフィルムに代えてポリエチレンテレフタレートフィルム(以下、「PETフィルム」ということがある。)を使用した積層体(PETフィルム/比較例の粘着剤層/PETフィルムの層構成を有する積層体)においても、高温および高湿度下に長時間置かれた後に外観不良が発生しなかった。
後者の理由としては、PETフィルムを使用する場合、PETフィルムの水蒸気透過率は、約10g/m2/dayであり、ガスバリアフィルムに比べてPETフィルムは水蒸気をよく通すことから、水分が積層体内部に浸入しても容易に外に逃げることができ、積層体内部に水分がたまりにくいと考えられる。
そして、本発明は、少なくとも2枚のガスバリアフィルムと上記特性を有する粘着剤層を組み合わせて用いることで、この外観不良の問題を解決するものである。
保護層が積層される位置は、特に限定されないが、ガスバリアフィルム積層体の最外層に積層されることが好ましい。
導電体層の形成方法としては、例えば、蒸着法、スパッタリング法、イオンプレーティング法、熱CVD法、プラズマCVD法等が挙げられる。これらの中でも、簡便に導電体層が形成できることから、スパッタリング法が好ましい。
プライマー層を構成する材料としては、特に限定されず、公知のものが使用できる。例えば、ケイ素含有化合物;光重合性モノマー及び/又は光重合性プレポリマーからなる光重合性化合物、及び少なくとも可視光域の光でラジカルを発生する重合開始剤を含む重合性組成物;ポリエステル系樹脂、ポリウレタン系樹脂(特にポリアクリルポリオール、ポリエステルポリオール、ポリエーテルポリオール等とイソシアネート化合物との2液硬化型樹脂)、アクリル系樹脂、ポリカーボネート系樹脂、塩化ビニル/酢酸ビニル共重合体、ポリビニルブチラール系樹脂、ニトロセルロース系樹脂等の樹脂類;アルキルチタネート;エチレンイミン;等が挙げられる。これらの材料は単独で、あるいは2種以上を組み合わせて用いることができる。
図1(a)に示すガスバリアフィルム積層体100Aは、隣接する2枚のガスバリアフィルムが、粘着剤層4を介して、ガスバリア層2aとガスバリア層2bとが粘着剤層4を挟んで対向するように積層された層構成(基材1a/ガスバリア層2a/粘着剤層4/ガスバリア層2b/基材1b)を有する。
図1(b)に示すガスバリアフィルム積層体100Bは、隣接する2枚のガスバリアフィルムが、粘着剤層4を介して、ガスバリア層2aと基材1bとが粘着剤層4を挟んで対向するように積層された層構成(基材1a/ガスバリア層2a/粘着剤層4/基材1b/ガスバリア層2b)を有する。
図1(c)に示すガスバリアフィルム積層体100Cは、隣接する2枚のガスバリアフィルムが、粘着剤層4を介して、基材1aと基材1bとが粘着剤層4を挟んで対向するように積層された層構成(ガスバリア層2a/基材1a/粘着剤層4/基材1b/ガスバリア層2b)を有する。
図2(b)に示すガスバリアフィルム積層体100Eは、3枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層4aを介してガスバリア層2aと基材1bとが、粘着剤層4bを介してガスバリア層2bと基材1cとが、それぞれ、粘着剤層を挟んで対向するように積層された層構成(基材1a/ガスバリア層2a/粘着剤層4a/基材1b/ガスバリア層1b/粘着剤層4b/基材1c/ガスバリア層2c)を有する。
図2(c)に示すガスバリアフィルム積層体100Fは、3枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層4aを介して、ガスバリア層2aとガスバリア層2bとが粘着剤層4aを挟んで対向するように積層され、さらに、もう1枚のガスバリアフィルムが、粘着剤層4bを介して、基材1bと基材1cとが粘着剤層4bを挟んで対向するように積層された層構成(基材1a/ガスバリア層2a/粘着剤層4a/ガスバリア層2b/基材1b/粘着剤層4b/基材1c/ガスバリア層2c)を有する。
次いで、図3(b)に示すように、剥離フィルム3上に粘着剤層4を形成して、粘着剤層付剥離フィルム20を得る。なお、粘着剤層付剥離フィルム20は、粘着剤層4上にさらに別の剥離フィルムを有するものであってもよい。
次に、図3(c)に示すように、ガスバリアフィルム10aのガスバリア層2aと、粘着剤層付剥離フィルム20の粘着剤層4とを、所望により加熱しながら、貼り合わせることで、粘着フィルム30を得る。貼り合わせの方法は特に限定されず、例えば、公知のラミネーターを使用する方法が挙げられる。
本発明の粘着フィルムは、少なくとも2枚のガスバリアフィルムを含み、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなるガスバリアフィルム積層体を製造するための粘着フィルムであって、少なくともガスバリアフィルムと粘着剤層とが隣接して積層されてなり、前記粘着剤層が、前記式(I)で示されるせん断荷重の減少率α(%)が70%以下のものであることを特徴とする。
また、本発明の粘着フィルムは、粘着剤層4上に剥離フィルムを有するものであっても、剥離フィルムを有しないもの(すなわち、粘着フィルム30から剥離フィルム3を除去してなる層構造を有するもの)であってもよい。
本発明の粘着フィルムは、上記の本発明のガスバリアフィルム積層体を製造する際に有用である。
本発明の電子部材は、上記の本発明のガスバリアフィルム積層体を備えることを特徴とする。電子部材としては、例えば、液晶ディスプレイ部材、有機ELディスプレイ部材、無機ELディスプレイ部材、電子ペーパー部材、太陽電池、熱電変換部材等のフレキシブル基板等が挙げられる。
本発明の電子部材は、上記の本発明のガスバリアフィルム積層体を備えるものであるため、水蒸気等による素子の劣化が起こりにくく、かつ、高温および高湿度下に長時間置かれた場合であっても、気泡などの外観不良が発生しにくいものである。
(粘着剤組成物Aの調製)
ブチルアクリレート(BA)及びアクリル酸(AA)を用いて得られたアクリル系共重合体(質量比(BA:AA)=90:10、重量平均分子量550,000)100質量部とイソシアナート系架橋剤(東洋インキ社製、BHS-8515、濃度37.5質量%)0.22質量部を混合し、メチルエチルケトンで希釈して、不揮発分濃度30質量%の粘着剤組成物Aを得た。
ブチルアクリレート(BA)、メチルアクリレート(MA)及びアクリル酸(AA)を用いて得られたアクリル系共重合体(質量比(BA:MA:AA)=76:20:4、重量平均分子量800,000)100質量部とイソシアナート系架橋剤(東洋インキ社製、BHS-8515、濃度37.5質量%)2質量部、エポキシ系架橋剤(大成化薬社製、TC-5、濃度5質量%)0.5質量部を混合し、酢酸エチルで希釈して、不揮発分濃度22質量%の粘着剤組成物Bを得た。
2-エチルヘキシルアクリレート(2EHA)、シクロヘキシルアクリレート(CHA)及び2-ヒドロキシエチルアクリレート(HEA)を用いて得られたアクリル系共重合体(質量比(2EHA:CHA:HEA)=59.7:40:0.3、重量平均分子量800,000)100質量部とイソシアナート系架橋剤(東洋インキ社製、BHS-8515、濃度37.5質量%)0.5質量部を混合し、メチルエチルケトンで希釈して、不揮発分濃度30質量%の粘着剤組成物Cを得た。
ブチルアクリレート(BA)及びアクリル酸(AAc)を用いて得られたアクリル系共重合体(質量比(BA:AAc)=90:10、重量平均分子量400,000)100質量部とエポキシ系架橋剤(大成化薬社製、TC-5、濃度5質量%)0.5質量部を混合し、メチルエチルケトンで希釈して、不揮発分濃度35質量%の粘着剤組成物Dを得た。
ポリイソブチレン樹脂(BASF社製、オパノールB50、重量平均分子量340,000)100質量部、ポリブテン樹脂(新日本石油社製、日石ポリブテン グレードHV-1900、重量平均分子量1900)30質量部、環状オレフィン系重合体(イーストマンケミカル社製、Elastotac H-100L Resin)50質量部をトルエンに溶解して、不揮発分濃度約18質量%の粘着剤組成物Eを得た。
基材として、ポリエチレンテレフタレートフィルム(三菱樹脂社製、PET38 T-100、厚さ38μm、以下、「PETフィルム」という。)に、ポリシラザン化合物(ペルヒドロポリシラザンを主成分とするコーティング材(クラリアントジャパン社製、アクアミカNL110-20)をスピンコート法により塗布し、120℃で1分間加熱して、厚さ150nmの、ペルヒドロポリシラザンを含むポリシラザン層を形成した。
次に、プラズマイオン注入装置を用いてポリシラザン層の表面に、下記の条件にて、アルゴン(Ar)をプラズマイオン注入して、ガスバリア層を形成して、ガスバリアフィルムを作製した。得られたガスバリアフィルムの40℃、相対湿度90%の条件での水蒸気透過率は、0.02g/m2/dayであった。なお、ガスバリアフィルムの水蒸気透過率は、米国MOCON社製、「PERMATRAN」を用いて測定した。
RF電源:日本電子社製、型番号「RF」56000
高電圧パルス電源:栗田製作所社製、「PV-3-HSHV-0835」
(プラズマイオン注入条件)
プラズマ生成ガス:Ar
ガス流量:100sccm
Duty比:0.5%
印加電圧:-6kV
RF電源:周波数 13.56MHz、印加電力 1000W
チャンバー内圧:0.2Pa
パルス幅:5μsec
処理時間(イオン注入時間):200秒
厚さ38μmのポリエチレンテレフタレートフィルムの片面に、シリコーン剥離層を設けてなる剥離フィルム(リンテック社製、SP-PET381031)の剥離層表面に、粘着剤組成物Aをコンマダイレクトコート法にて塗布し、得られた塗膜を100℃で1分間乾燥させて、厚さ約10μmの粘着剤層を形成して、粘着剤層付剥離フィルムaを得た。次に、剥離フィルム(リンテック社製、SP-PFS50AL-5、厚さ38μmのポリエチレンテレフタレートフィルムの片面に剥離層を設けてなる剥離フィルム)を別途準備し、該剥離フィルムの剥離層と粘着剤層付剥離フィルムaの粘着剤層面とを貼り合わせて、粘着剤層の両面に剥離フィルムが積層された粘着剤層付剥離フィルムAを得た。
次いで、上記方法で作製したガスバリアフィルムを2枚用意し、1枚のガスバリアフィルムのガスバリア層面と、粘着剤層付剥離フィルムAの一方の剥離フィルムを剥がして露出した粘着剤層面とを貼り合わせた。
さらに、もう一方の面側の剥離フィルムを剥離して露出した粘着剤層面と、もう1枚のガスバリアフィルムのガスバリア層面とを貼り合わせて、ガスバリアフィルム積層体Aを作製した。
実施例1において、粘着剤組成物Aを粘着剤組成物Bに代えて、粘着剤層付剥離フィルムBを作製し、このものを使用したこと以外は、実施例1と同様にしてガスバリアフィルム積層体Bを作製した。
実施例1において、粘着剤組成物Aを粘着剤組成物Cに代えて、粘着剤層付剥離フィルムCを作製し、このものを使用したこと以外は、実施例1と同様にしてガスバリアフィルム積層体Cを作製した。
実施例1において、粘着剤組成物Aを粘着剤組成物Dに代えて、粘着剤層付剥離フィルムDを作製し、このものを使用したこと以外は、実施例1と同様にしてガスバリアフィルム積層体Dを作製した。
実施例1において、粘着剤組成物Aを粘着剤組成物Eに代えて、粘着剤層付剥離フィルムEを作製し、このものを使用したこと以外は、実施例1と同様にしてガスバリアフィルム積層体Eを作製した。
剥離フィルム上に、ウレタン系粘着剤層を有する粘着剤層付シート(倉敷紡績社製、G-6、厚み25μm)を準備し、この粘着剤層面と、上記方法で作製したガスバリアフィルムのガスバリア層面とを、ヒートラミネーター(ラミネート温度120℃、速度0.24m/分)にて貼り合わせた後、剥離フィルムを剥離した。露出したウレタン粘着剤層と、別のガスバリアフィルムのガスバリア層面とを前記ヒートラミネーターを使用して貼り合わせて、ガスバリアフィルム積層体Fを作製した。
実施例3において、ウレタン系粘着剤層を有する粘着剤層付シートに代えて、剥離フィルム上にオレフィン系粘着剤を有する剤層付粘着シート(倉敷紡績社製、Z-2、厚み25μm)を使用したこと以外は、実施例3と同様にしてガスバリアフィルム積層体Gを作製した。
実施例1、2、比較例1~3のガスバリアフィルム積層体の粘着剤層についてせん断試験を行うために、以下の方法で試験片を作製した。
ポリエチレンテレフタレートフィルム(東洋紡株式会社製、コスモシャイン PET188A4300、厚さ188μm)と上記の粘着剤層付剥離フィルムA~Eとをそれぞれ貼り合わせた後、幅15mm長さ100mmの大きさに裁断して、試験用粘着フィルム(粘着剤層の厚さ30μm)を得た。試験用粘着フィルムの剥離フィルムを剥離して粘着剤層を露出させた後、図4に示すように、この試験用粘着フィルムと、無アルカリガラス(コーニング社製、イーグルXG)とを、貼着面積が225mm2(15mm×15mm)となるように貼り合わせ、2kgのロールで5回往復させて、試験片を得た。なお、図4(a)は、試験片の正面図、図4(b)は、図4(a)中のX-Y面における断面図である。
ポリエチレンテレフタレートフィルム(東洋紡株式会社製、コスモシャイン PET188A4300、厚さ188μm)とそれぞれの粘着剤層付シートの粘着剤層面とを、ヒートラミネーター(ラミネート温度120℃、速度0.24m/分)にて貼り合わせた後、幅15mm長さ100mmの大きさに裁断して試験用粘着フィルムを得た。試験用粘着フィルムの剥離フィルムを剥離して粘着剤層を露出させた後、図4に示すように、この試験用粘着フィルムと、無アルカリガラス(コーニング社製、イーグルXG)とを、貼着面積が225mm2(15mm×15mm)となるように重ね合わせ、前記同様の条件でヒートラミネーターを使用して貼り合わせて、試験片を得た。
また、80℃の条件下で同様の試験を行い、この試験における、せん断方向の変位が0.1mmのときのせん断荷重をY(N)とした。
得られたX及びYから、下記式(I)によりせん断荷重の減少率αを求めた。
実施例1~3、及び比較例1~4で得られたガスバリアフィルム積層体A~Gのそれぞれを、120mm×120mmの大きさに裁断し、高温湿熱条件下(条件1:60℃、90%RH、条件2:85℃、85%RH)に、それぞれ1000時間載置した。その後、23℃、50%RH環境下で1日調温・調湿を行い、ガスバリアフィルム積層体を目視にて評価した。
○:ガスバリアフィルム積層体に気泡が見られなかったもの。
×:ガスバリアフィルム積層体に気泡が見られたもの。
評価結果を第1表に示す。
実施例1~3で得られるガスバリアフィルム積層体は、その粘着剤層は、せん断荷重の減少率が70%以下のものであり、高温高湿条件下に置かれた場合であっても、気泡が見られない。
一方、比較例1~4で得られるガスバリアフィルム積層体は、その粘着剤層は、せん断荷重の減少率が70%を超えるものであり、高温高湿条件下に置かれた場合、気泡が見られた。
2,2a,2b,2c・・・ガスバリア層
3・・・剥離フィルム
4,4a,4b・・・粘着剤層
5・・・無アルカリガラス
6・・・ポリエチレンテレフタレートフィルム
7・・・粘着剤層
10,10a,10b・・・ガスバリアフィルム
20・・・粘着剤層付剥離フィルム
30・・・粘着フィルム
100A,100B,100C,100D,100E,100F・・・ガスバリアフィルム積層体
Claims (12)
- 少なくとも2枚のガスバリアフィルムを含むガスバリアフィルム積層体であって、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなり、
前記粘着剤層の、下記式(I)で示されるせん断荷重の減少率α(%)が70%以下であることを特徴とするガスバリアフィルム積層体。
- 前記ガスバリアフィルムが、基材フィルムと、該基材フィルム上に設けられた少なくとも1層のガスバリア層とを有するものである、請求項1に記載のガスバリアフィルム積層体。
- 隣接する2枚のガスバリアフィルムが、該ガスバリアフィルムのガスバリア層同士が対向するように積層されたものである、請求項2に記載のガスバリアフィルム積層体。
- 前記ガスバリア層が、高分子ケイ素化合物からなる層にイオンが注入されて形成された層である、請求項2または3に記載のガスバリアフィルム積層体。
- 前記粘着剤層が、アクリル系粘着剤またはウレタン系粘着剤からなるものである、請求項1または2に記載のガスバリアフィルム積層体。
- 前記アクリル系粘着剤が、カルボキシル基を有するアクリル系単量体由来の繰り返し単位と、官能基を有しないアクリル系単量体由来の繰り返し単位の両方を有するアクリル系共重合体を主成分とするものである、請求項5に記載のガスバリアフィルム積層体。
- 前記アクリル系共重合体の重量平均分子量が、100,000~1,000,000である請求項6に記載のガスバリアフィルム積層体。
- 前記アクリル系粘着剤が、架橋剤を含む、請求項5に記載のガスバリアフィルム積層体。
- 前記粘着剤層の厚みは、0.5~100μmである請求項1に記載のガスバリアフィルム積層体。
- 前記ガスバリアフィルムの水蒸気透過率は、40℃、相対湿度90%の雰囲気下で、0.00001~1.0g/m2/dayである請求項1に記載のガスバリアフィルム積層体。
- 少なくとも2枚のガスバリアフィルムを含み、隣接する2枚のガスバリアフィルムが、粘着剤層を介して積層されてなるガスバリアフィルム積層体を製造するための粘着フィルムであって、少なくともガスバリアフィルムと粘着剤層とが隣接して積層されてなり、
前記粘着剤層の、下記式(I)で示されるせん断荷重の減少率α(%)が70%以下であることを特徴とする粘着フィルム。
- 請求項1~5のいずれかに記載のガスバリアフィルム積層体を備える電子部材。
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Also Published As
Publication number | Publication date |
---|---|
EP2823961A1 (en) | 2015-01-14 |
CN104125884B (zh) | 2018-04-27 |
KR20140138690A (ko) | 2014-12-04 |
EP2823961B1 (en) | 2019-05-01 |
EP2823961A4 (en) | 2015-10-21 |
TWI626163B (zh) | 2018-06-11 |
TW201350340A (zh) | 2013-12-16 |
JPWO2013133256A1 (ja) | 2015-07-30 |
KR102059319B1 (ko) | 2019-12-26 |
JP6087340B2 (ja) | 2017-03-01 |
CN104125884A (zh) | 2014-10-29 |
US20150030829A1 (en) | 2015-01-29 |
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