WO2018181426A1 - 封止用シート - Google Patents
封止用シート Download PDFInfo
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- WO2018181426A1 WO2018181426A1 PCT/JP2018/012646 JP2018012646W WO2018181426A1 WO 2018181426 A1 WO2018181426 A1 WO 2018181426A1 JP 2018012646 W JP2018012646 W JP 2018012646W WO 2018181426 A1 WO2018181426 A1 WO 2018181426A1
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims 1
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- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- YZWMMWCMMGKFDB-UHFFFAOYSA-N NCCC[Si](OC)(OC)OC.SCCCCCCCCCCC[Si](OC)(OC)OC Chemical compound NCCC[Si](OC)(OC)OC.SCCCCCCCCCCC[Si](OC)(OC)OC YZWMMWCMMGKFDB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 102000003978 Tissue Plasminogen Activator Human genes 0.000 description 1
- 108090000373 Tissue Plasminogen Activator Proteins 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 1
- MWGMEGAYPPQWFG-UHFFFAOYSA-N [SiH4].OC(=O)C=C Chemical compound [SiH4].OC(=O)C=C MWGMEGAYPPQWFG-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005443 coulometric titration Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- DEJRLAVWNDPXGZ-UHFFFAOYSA-N dimethyl(3-trimethoxysilylpropyl)azanium;chloride Chemical compound Cl.CO[Si](OC)(OC)CCCN(C)C DEJRLAVWNDPXGZ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- DFQPZDGUFQJANM-UHFFFAOYSA-M tetrabutylphosphanium;hydroxide Chemical compound [OH-].CCCC[P+](CCCC)(CCCC)CCCC DFQPZDGUFQJANM-UHFFFAOYSA-M 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2581/00—Seals; Sealing equipment; Gaskets
Definitions
- the present invention relates to a sealing sheet suitable for sealing an organic EL element.
- An organic EL (Electroluminescence) element is a light emitting element using an organic substance as a light emitting material, and has recently attracted attention.
- the organic EL element is extremely weak against moisture, and there is a problem that the luminance is lowered by moisture.
- the organic EL element is sealed using a sealing sheet having a resin composition layer.
- the sealing sheet is usually composed of a support, a resin composition layer, and a cover film for protecting the resin composition layer (for example, Patent Document 1).
- the sealing sheet having the resin composition layer containing the semi-fired hydrotalcite can achieve high moisture barrier properties by the semi-fired hydrotalcite, but the semi-fired hydrotalcite is reversible. It has the property of absorbing and releasing moisture. Therefore, in a sealing sheet having a resin composition layer containing semi-fired hydrotalcite, for example, the semi-fired hydrotalcite absorbs moisture during storage of the sealing sheet, and then the absorbed moisture is resin composition. Release into the material layer. If the organic EL element is sealed with the resin composition layer containing the moisture thus released, the life of the organic EL device may be shortened.
- the present invention has been made paying attention to the above circumstances, and its purpose is to absorb water of the resin composition layer during storage (in particular, water absorption of the resin composition layer containing semi-calcined hydrotalcite). It is in providing the sheet
- water vapor transmission rate (hereinafter referred to as “WVTR”) measured by the method described in Examples described later is obtained.
- 1 g / m 2 / 24hr
- moisture-proof film film
- a sealing sheet having a first film, a resin composition layer, and a second film, wherein the resin composition layer exists between the first film and the second film, and the first film and the second film
- transmittance of a film is 1 (g / m ⁇ 2 > / 24hr) or less, respectively.
- a water vapor permeability of the first film and second film, respectively is 0.01 (g / m 2 / 24hr ) or 1 (g / m 2 / 24hr ) or less, according to [1] Sealing sheet.
- a water vapor transmission rate of the first film and second film, respectively is 0.01 (g / m 2 / 24hr ) or 0.5 (g / m 2 / 24hr ) or less, the [1] The sheet
- a water vapor transmission rate of the first film and second film, respectively is 0.01 (g / m 2 / 24hr ) or 0.2 (g / m 2 / 24hr ) or less, the [1] The sheet
- a water vapor permeability of the first film and second film, respectively is 0.05 (g / m 2 / 24hr ) or 0.2 (g / m 2 / 24hr ) or less, the [1] The sheet
- the water vapor transmission rate of the first film is less than 0.01 (g / m 2 / 24hr ), the water vapor transmission rate of the second film is 0.01 (g / m 2 / 24hr ) or 1 (g / m is 2/24 hr or) below, encapsulating sheet according to [1].
- a water vapor permeability of the first film is 0.005 (g / m 2 / 24hr ) or less, the sealing sheet according to [6].
- a water vapor permeability of the first film is 0.001 (g / m 2 / 24hr ) or less, the sealing sheet according to [6].
- a water vapor permeability of the first film is 0.0005 (g / m 2 / 24hr ) or less, the sealing sheet according to [6].
- a water vapor transmission rate of the second film is 0.01 (g / m 2 / 24hr ) or 0.5 (g / m 2 / 24hr ) or less, the [6] any one of to [9]
- a water vapor transmission rate of the second film is 0.01 (g / m 2 / 24hr ) or 0.2 (g / m 2 / 24hr ) or less, the [6] any one of to [9] The sheet
- a water vapor transmission rate of the second film is not more than 0.05 (g / m 2 / 24hr ) or 0.2 (g / m 2 / 24hr ), the [6] any one of to [9]
- a water vapor permeability of the first film is at 0.0005 (g / m 2 / 24hr ) or less
- the water vapor transmission rate of the second film is 0.0005 (g / m 2 / 24hr ) Ultra 0.01 ( g is / m 2 / 24hr) below, encapsulating sheet according to [1].
- water absorption of the resin composition layer of the sealing sheet (particularly, water absorption of the resin composition layer containing semi-baked hydrotalcite) can be suppressed.
- the sealing sheet of the present invention has a first film, a resin composition layer, and a second film, and both the first film and the second film are moisture-proof films.
- the moisture-proof film may be a laminated film.
- the first film and the second film may be the same or different.
- the value of WVTR of a 1st film and a 2nd film may be the same, and may differ. In JIS, etc., those having a thickness of less than 0.25 mm are classified as films, and those having a thickness of more than 0.25 mm are classified as sheets. However, the present invention is not limited to such classification.
- WVTR of moisture-proof film is preferably 0.01 (g / m 2 / 24hr ) or more, 1 (g / m 2 / 24hr) or less, preferably 0.5 (g / m 2 / 24hr ) or less, and more preferably 0.2 (g / m 2 / 24hr ) or less.
- This WVTR is a value measured by the method described in the examples described later.
- the WVTR of the moisture-proof film used as the first film and the second film can be appropriately set in a preferable mode depending on the structure of the organic EL device to which the sealing sheet of the present invention is applied.
- the first film of the present invention (support), WVTR is 0.01 (g / m 2 / 24hr ) less than the moisture-proof film (hereinafter , which may be abbreviated as “high moisture-proof film”).
- WVTR high moisture resistance film is more preferably 0.005 (g / m 2 / 24hr ) or less, more preferably 0.001 (g / m 2 / 24hr ) or less, particularly preferably 0.0005 (g / m it is 2 / 24hr) or less.
- the lower limit of WVTR of high moisture resistance film is not particularly limited, a lower value is preferable, 0 (g / m 2 / 24hr) are most preferred.
- the second film (cover film) is peeled off and discarded at the time of sealing. Therefore the second film, from the viewpoint of achieving suppression and cost containment of the water-absorbent resin composition layer during storage at the same time, WVTR is 0.01 (g / m 2 / 24hr ) or 1 (g / m 2 / 24hr ) It is preferable to use the following moisture-proof film (hereinafter sometimes abbreviated as “medium moisture-proof film”).
- WVTR of medium moisture-proof film the balance of moisture resistance and cost, the more preferably 0.05 (g / m 2 / 24hr ) or more, more preferably 0.5 (g / m 2 / 24hr ) or less, more preferably 0.2 (g / m 2 / 24hr ) or less.
- WVTR is 0.0005 (g / m 2 / 24hr ) or less very high moisture resistance
- WVTR is 0.0005 (g / m 2 / 24hr ) Ultra 0 You may use the moisture-proof film below 0.01 (g / m ⁇ 2 > / 24hr).
- WVTR is 0.0005 (g / m 2 / 24hr ) or less of moisture-proof film, as a barrier layer, generally produced by forming a plurality of layers of the inorganic layer by vacuum evaporation or the like on a plastic film, a high cost.
- WVTR is 0.0005 (g / m 2 / 24hr )
- an opaque moisture-proof film such as a film with metal foil is used as both the first film and the second film, it becomes difficult to inspect the quality of the resin composition layer, so one of the first film and the second film.
- a transparent moisture-proof film is desirable to use as the other.
- the transparency of the transparent moisture-proof film is preferably such that the total light transmittance with D65 light is 85% or more regardless of its thickness.
- “Opaque moisture-proof film” is defined as “a moisture-proof film having a total light transmittance of 50% or less with D65 light”. The total light transmittance can be measured with D65 light using a haze meter HZ-V3 (halogen lamp) manufactured by Suga Test Instruments Co., Ltd. with air as a reference.
- the above medium moisture-proof film is used as both the first film and the second film.
- the moisture-proof film is preferably a film having a base material and a barrier layer.
- the substrate means a portion other than the barrier layer in the film.
- the substrate may be a single layer film or a laminated film.
- the base material include polyolefins such as polyethylene and polypropylene (PP), polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), cycloolefin polymer (COP), Examples thereof include plastic films such as polyvinyl chloride. Only one type of plastic film may be used, or two or more types may be used.
- the substrate is preferably a polyethylene terephthalate film, a cycloolefin polymer film, a polyethylene naphthalate film or a polycarbonate film, more preferably a polyethylene terephthalate film or a cycloolefin polymer film.
- the thickness of the substrate (when the substrate is a laminated film, the total thickness) is preferably 10 to 100 ⁇ m, more preferably 12.5 to 75 ⁇ m, and even more preferably 12.5 to 50 ⁇ m.
- the barrier layer examples include inorganic films such as metal foil (eg, aluminum foil), silica vapor deposition film, silicon nitride film, and silicon oxide film.
- the barrier layer may be composed of a plurality of layers of a plurality of inorganic films (for example, a metal foil and a silica deposited film).
- the barrier layer may be composed of an organic material and an inorganic material, or may be a composite multilayer of an organic layer and an inorganic film.
- the thickness of the barrier layer is preferably 0.01 to 100 ⁇ m, more preferably 0.05 to 50 ⁇ m, still more preferably 0.05 to 30 ⁇ m.
- WVTR is less than 0.01 (g / m 2 / 24hr ) moisture-proof film (high moisture resistance film), especially WVTR is 0.0005 (g / m 2 / 24hr ) or less of moisture-proof film, for example, substrate
- An inorganic film such as silicon oxide (silica), aluminum oxide, magnesium oxide, silicon nitride, silicon nitride oxide, SiCN, amorphous silicon is formed on the surface by chemical vapor deposition (for example, heat, plasma, ultraviolet light, vacuum heat, vacuum plasma). Or chemical vapor deposition using vacuum ultraviolet radiation) or physical vapor deposition (eg, vacuum deposition, sputtering, ion plating, laser deposition, molecular beam epitaxy), etc.
- the moisture-proof film manufactured by such a method is a film having transparency.
- the WVTR is at 0.01 (g / m 2 / 24hr ) less than the moisture-proof film (high moisture resistance film), WVTR is 0.0005 (g / m 2 / 24hr ) Ultra 0.01 (g / m 2 / As a highly moisture-proof film of less than 24 hr), in addition to the moisture-proof film produced by the above method, for example, a metal foil such as SUS foil or aluminum foil, or a substrate and a metal foil are bonded together with an adhesive.
- the moisture-proof film manufactured by methods, such as these, is mentioned.
- a moisture-proof film made of a metal foil or a substrate and a metal foil is usually opaque.
- the WVTR is 0.01 (g / m 2 / 24hr ) or 1 (g / m 2 / 24hr ) or less of moisture-proof film (medium moisture-proof film), for example, as a barrier layer, a silicon oxide on the surface of the substrate ( Silica), aluminum oxide, magnesium oxide, silicon nitride, silicon nitride oxide, SiCN, amorphous silicon or other inorganic film containing an inorganic film, or a coating liquid comprising a metal oxide and an organic resin having a barrier property on a substrate Can be produced by a method of applying and drying (see, for example, Japanese Patent Application Laid-Open No. 2013-108103 and Japanese Patent No. 4028353).
- the moisture-proof film manufactured by such a method is a film having transparency.
- a commercially available product may be used as the moisture-proof film.
- Commercially available medium moisture resistant films include, for example, “Clarista CI” manufactured by Kuraray Co., Ltd., “Tech Barrier HX”, “Tech Barrier LX” and “Tech Barrier L” manufactured by Mitsubishi Plastics, and “IB-” manufactured by Dai Nippon Printing Co., Ltd.
- Examples of commercially available high-moisture resistant films include “PET-PXB”, “GL, GX series” manufactured by Toppan Printing Co., Ltd., and “X-BARRIER” manufactured by Toyo Aluminum Co., Ltd. Or the like.
- the moisture-proof film may have a layer other than the base material and the barrier layer.
- the inorganic film in order to prevent cracks in the inorganic film, it is preferable to alternately laminate the inorganic film and the transparent planarization layer (for example, a transparent plastic layer).
- you may have the laminated structure which bonded the plastic film to the barrier layer and / or the base-material surface using the adhesive agent.
- the adhesive is not particularly limited, and a commercially available adhesive can be used.
- plastic examples include polyolefins such as polyethylene and polypropylene (PP), polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), and cycloolefin polymer (COP). And polyvinyl chloride. Only one type of plastic film may be used, or two or more types may be used.
- PP polypropylene
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PC polycarbonate
- PI polyimide
- COP cycloolefin polymer
- polyvinyl chloride Only one type of plastic film may be used, or two or more types may be used.
- the resin composition layer is present between the first film and the second film.
- Another layer may be included between the first film and the resin composition layer and / or between the second film and the resin composition layer as long as the effects of the present invention are not impaired.
- the second film to be the cover film is peeled off to expose the resin composition layer before laminating the sealing film on the organic EL element.
- the first film to be the support is used as it is without being peeled off when incorporated into a device as a moisture-proof layer, and is peeled off at any step after lamination when not incorporated. Since the 2nd film used as a cover film makes peeling easy, it may have a mold release layer in the surface which contacts a resin composition layer.
- the 1st film used as a support body may also have a mold release layer in the surface which contacts a resin composition layer, for example, when it peels at the process after lamination
- the first film When the first film is incorporated into the device and is not peeled off, the first film typically does not have a release layer.
- the moisture-proof layer is provided in the organic EL device, the first film may be used as it is as the moisture-proof layer, or a moisture-proof layer may be provided separately after the first film is peeled off.
- a circularly polarizing plate is generally composed of a polarizing plate and a quarter-wave plate, and the quarter-wave plate of the circularly polarizing plate is disposed in the resin composition layer.
- the release layer can be formed, for example, by applying a release agent to a moisture-proof film or a laminated film including the moisture-proof film and drying it.
- a plastic film having a release layer is formed by applying a release agent to the plastic film and drying, and then bonding the plastic film having the release layer and the moisture-proof film using an adhesive. May be.
- the drying temperature after application of the release agent is, for example, 100 to 150 ° C., and the drying time is, for example, 5 to 120 minutes.
- the release agent examples include silicone release agents, alkyd release agents, fluorine release agents, olefin release agents, and the like.
- the release layer is preferably formed of a silicone release agent or an alkyd release agent.
- the thickness of the release layer is preferably 0.05 to 1 ⁇ m, more preferably 0.05 to 0.5 ⁇ m, and still more preferably 0.05 to 0.1 ⁇ m.
- the thickness of the first film (when the first film is a laminated film, the total thickness) is preferably 12.5 to 100 ⁇ m, more preferably 12.5 to 62.5 ⁇ m, and even more preferably 12. 5 to 55 ⁇ m.
- the thickness of the second film (when the second film is a laminated film, the total thickness) is preferably 12.5 to 100 ⁇ m, more preferably 12.5 to 62.5 ⁇ m, and even more preferably 12. 5 to 55 ⁇ m.
- the resin composition layer is not particularly limited, and the resin composition layer can be formed using a known resin composition.
- the resin composition layer preferably contains an olefin resin and / or an epoxy resin.
- the olefin resin is not particularly limited as long as it has a skeleton derived from an olefin monomer.
- ethylene resin, propylene resin, butene resin, and isobutylene resin are preferable.
- These olefinic resins may be homopolymers or copolymers such as random copolymers and block copolymers. Examples of the copolymer include copolymers of two or more olefins, and copolymers of olefins with monomers other than olefins such as non-conjugated dienes and styrene.
- Examples of preferred copolymers include ethylene-nonconjugated diene copolymers, ethylene-propylene copolymers, ethylene-propylene-nonconjugated diene copolymers, ethylene-butene copolymers, propylene-butene copolymers, propylene.
- the polyolefin resin for example, isobutylene-modified resin, styrene-isobutylene-modified resin, modified propylene-butene resin and the like are preferably used.
- the olefin resin preferably contains an olefin resin having an acid anhydride group (that is, a carbonyloxycarbonyl group (—CO—O—CO—)) and an epoxy group from the viewpoint of imparting excellent physical properties such as adhesion. It contains at least one selected from the group consisting of olefin-based resins, more preferably olefin-based resins having acid anhydride groups and olefin-based resins having epoxy groups.
- the acid anhydride group examples include a group derived from succinic anhydride, a group derived from maleic anhydride, a group derived from glutaric anhydride, and the like.
- the acid anhydride group may be one type or two or more types.
- the olefin resin having an acid anhydride group can be obtained by, for example, an unsaturated compound having an acid anhydride group and graft-modifying the olefin resin under radical reaction conditions. Moreover, you may make it carry out radical copolymerization of the unsaturated compound which has an acid anhydride group with an olefin.
- an olefin resin having an epoxy group is an unsaturated compound having an epoxy group such as glycidyl (meth) acrylate, 4-hydroxybutyl acrylate glycidyl ether, allyl glycidyl ether, etc. It can be obtained by graft modification with Moreover, you may make it carry out radical copolymerization of the unsaturated compound which has an epoxy group with an olefin.
- the concentration of the acid anhydride group in the olefin resin having an acid anhydride group is preferably 0.05 to 10 mmol / g, more preferably 0.1 to 5 mmol / g.
- the concentration of the acid anhydride group is obtained from the value of the acid value defined as the number of mg of potassium hydroxide necessary to neutralize the acid present in 1 g of resin according to the description of JIS K 2501.
- the amount of the olefin resin having an acid anhydride group in the olefin resin is preferably 0 to 70% by mass, more preferably 10 to 50% by mass.
- the concentration of the epoxy group in the olefin resin having an epoxy group is preferably 0.05 to 10 mmol / g, more preferably 0.1 to 5 mmol / g.
- the epoxy group concentration is determined from the epoxy equivalent obtained based on JIS K 7236-1995.
- the amount of the olefin resin having an epoxy group in the olefin resin is preferably 0 to 70% by mass, more preferably 10 to 50% by mass.
- the olefin resin preferably contains both an olefin resin having an acid anhydride group and an olefin resin having an epoxy group from the viewpoint of imparting excellent physical properties such as moisture resistance.
- Such an olefin-based resin can react with an acid anhydride group and an epoxy group by heating to form a crosslinked structure, thereby forming a sealing layer (resin composition layer) having excellent moisture resistance and the like.
- Crosslinking structure formation can also be performed after sealing. For example, when a sealing target is weak to heat, such as an organic EL element, sealing is performed using a sealing film, and the sealing film is manufactured. It is desirable to form a crosslinked structure.
- the ratio of the olefin resin having an acid anhydride group and the olefin resin having an epoxy group is not particularly limited as long as an appropriate crosslinked structure can be formed, but the molar ratio of the epoxy group to the acid anhydride group (epoxy group: acid anhydride).
- the group) is preferably 100: 10 to 100: 200, more preferably 100: 50 to 100: 150, particularly preferably 100: 90 to 100: 110.
- the number average molecular weight of the olefin-based resin is not particularly limited, but is 1,000,000 from the viewpoint of providing good coatability of the resin composition varnish and good compatibility with other components in the resin composition.
- the following is preferable, 750,000 or less is more preferable, 500,000 or less is more preferable, 400,000 or less is more preferable, 300,000 or less is still more preferable, 200,000 or less is particularly preferable, and 150,000 or less. Is most preferred.
- the number average molecular weight is 1,000 or more.
- the number average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion).
- GPC gel permeation chromatography
- the number average molecular weight by the GPC method is specifically determined by moving LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device and Shodex® K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column. Using toluene or the like as a phase, the measurement can be made at a column temperature of 40 ° C. and calculated using a standard polystyrene calibration curve.
- the olefin-based resin is preferably amorphous from the viewpoint of suppressing a decrease in fluidity due to thickening of the varnish.
- amorphous means that the olefin resin does not have a clear melting point.
- DSC differential scanning calorimetry
- the amount of the olefin resin there is no particular limitation on the amount of the olefin resin. From the viewpoint of good coatability and the like, when an olefin-based resin is used, the amount thereof is preferably 80% by mass or less, based on the entire resin composition layer (ie, the entire nonvolatile content of the resin composition), and 75 % By mass or less is more preferable, 70% by mass or less is more preferable, 60% by mass or less is further preferable, 55% by mass or less is further more preferable, and 50% by mass or less is particularly preferable. On the other hand, from the viewpoint of improving moisture resistance and transparency, the amount of the olefin resin is preferably 1% by mass or more per total resin composition layer (that is, the entire nonvolatile content of the resin composition).
- 3 mass% or more is more preferable, 5 mass% or more is more preferable, 7 mass% or more is further preferable, 10 mass% or more is further more preferable, 35 mass% or more is particularly preferable, and 40 mass% or more is most preferable. .
- olefin resin examples include “OPanol B100” (viscosity average molecular weight: 11,110,000) manufactured by BASF, and “B50SF” (viscosity average molecular weight: 400,000) manufactured by BASF.
- butene-based resin examples include “HV-1900” (polybutene, number average molecular weight: 2,900) manufactured by JX Energy, and “HV-300M” (maleic anhydride-modified liquid polybutene (“HV”) manufactured by Toho Chemical Industries, Ltd. -300 "(modified product of number average molecular weight: 1,400)), number average molecular weight: 2,100, number of carboxy groups constituting acid anhydride group: 3.2 / 1 molecule, acid value: 43. 4 mg KOH / g, acid anhydride group concentration: 0.77 mmol / g).
- HV-1900 polybutene, number average molecular weight: 2,900
- HV-300M maleic anhydride-modified liquid polybutene (“HV”) manufactured by Toho Chemical Industries, Ltd. -300 "(modified product of number average molecular weight: 1,400)
- number average molecular weight: 2,100 number of carboxy groups constituting acid anhydride group: 3.2
- styrene-isobutylene copolymer examples include “SIBSTAR T102” manufactured by Kaneka (styrene-isobutylene-styrene block copolymer, number average molecular weight: 100,000, styrene content: 30% by mass), manufactured by Starlight PMC.
- T-YP757B maleic anhydride-modified styrene-isobutylene-styrene block copolymer, acid anhydride group concentration: 0.464 mmol / g, number average molecular weight: 100,000
- T-YP766 manufactured by Seiko PMC (Glycidyl methacrylate-modified styrene-isobutylene-styrene block copolymer, epoxy group concentration: 0.638 mmol / g, number average molecular weight: 100,000
- T-YP8920 maleic anhydride modified styrene-isobutylene, manufactured by Seiko PMC) -Styrene copolymer, acid anhydride base concentration : 0.464 mmol / g, number average molecular weight: 35,800
- T-YP8930 glycidyl methacrylate modified styrene-isobutylene-st
- ethylene-based resin or propylene-based resin examples include “EPT X-3012P” (ethylene-propylene-5-ethylidene-2-norbornene copolymer manufactured by Mitsui Chemicals, “EPT1070” manufactured by Mitsui Chemicals (ethylene-propylene). -Dicyclopentadiene copolymer) and “Tuffmer A4085” (ethylene-butene copolymer) manufactured by Mitsui Chemicals.
- ethylene-methyl methacrylate copolymer examples include “T-YP429” (maleic anhydride-modified ethylene-methyl methacrylate copolymer (methyl methacrylate per 100% by mass in total of ethylene units and methyl methacrylate units) manufactured by Seiko PMC.
- propylene-butene copolymer examples include “T-YP341” (glycidyl methacrylate-modified propylene-butene random copolymer (amount of butene units per 100 mass% in total of propylene units and butene units: 29 mass%, epoxy group concentration: 0.638 mmol / g, 20 mass% swazole solution with number average molecular weight: 155,000), “T-YP279” (maleic anhydride modified propylene-butene random co-polymer) manufactured by Seiko PMC Unit, amount of butene unit per 100% by mass of propylene unit and butene unit: 36% by mass, acid anhydride group concentration: 0.464 mmol / g, number average molecular weight: 35,000), “T” manufactured by Seiko PMC -YP276 "(glycidyl methacrylate modified propylene-butene random copolymer, propylene The amount of butene units per
- the olefin resin includes an olefin resin having an epoxy group
- an olefin resin having a functional group other than an acid anhydride group that can react with the epoxy group may be used.
- the functional group include a hydroxyl group, a phenolic hydroxyl group, an amino group, a carboxy group, and an acid anhydride group.
- the olefin resin includes an olefin resin having an acid anhydride group
- an olefin resin having a functional group other than an epoxy group that can react with the acid anhydride group may be used.
- the functional group include a hydroxyl group, a primary or secondary amino group, a thiol group, an epoxy group, and an oxetane group.
- the epoxy resin can be used without limitation as long as it has an average of two or more epoxy groups per molecule.
- the epoxy resin include bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, bisphenol F type epoxy resin, and phosphorus containing Epoxy resin, bisphenol S type epoxy resin, aromatic glycidylamine type epoxy resin (eg, tetraglycidyldiaminodiphenylmethane, triglycidyl-p-aminophenol, diglycidyltoluidine, diglycidylaniline, etc.), alicyclic epoxy resin, aliphatic Chain epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A novolac epoxy resin, epoxy resin having butadiene structure Diglycidyl etherified products of bisphenol, diglycidyl etherified products of
- the epoxy equivalent of the epoxy resin is preferably 50 to 5,000, more preferably 50 to 3,000, more preferably 80 to 2,000, more preferably 100 to 1,000 from the viewpoint of reactivity and the like. Preferably it is 120 to 1,000, more preferably 140 to 300.
- the “epoxy equivalent” is the number of grams (g / eq) of a resin containing 1 gram equivalent of an epoxy group, and is measured according to the method defined in JIS K 7236.
- the weight average molecular weight of the epoxy resin is preferably 5,000 or less.
- the epoxy resin may be liquid or solid, and both liquid epoxy resin and solid epoxy resin may be used.
- liquid and solid are states of the epoxy resin at normal temperature (25 ° C.) and normal pressure (1 atm).
- the amount of epoxy resin is not particularly limited. When an epoxy resin is used, the amount thereof is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, more preferably 50 to 50% by mass based on the entire resin composition layer (that is, per total nonvolatile content of the resin composition). 65 mass% is more preferable.
- the resin composition layer preferably contains semi-fired hydrotalcite. Only one type of semi-calcined hydrotalcite may be used, or two or more types may be used.
- Hydrotalcite can be classified into unfired hydrotalcite, semi-fired hydrotalcite, and fired hydrotalcite.
- Uncalcined hydrotalcite is a metal hydroxide having a layered crystal structure typified by natural hydrotalcite (Mg 6 Al 2 (OH) 16 CO 3 .4H 2 O), for example, It consists of a layer [Mg 1-X Al X (OH) 2 ] X + and a middle layer [(CO 3 ) X / 2 ⁇ mH 2 O] X— which are the basic skeleton.
- the uncalcined hydrotalcite in the present invention is a concept including a hydrotalcite-like compound such as synthetic hydrotalcite. Examples of the hydrotalcite-like compound include those represented by the following formula (I) and the following formula (II).
- M 2+ is Mg 2+, a divalent metal ion such as Zn 2+, M 3+ represents a trivalent metal ion such as Al 3+, Fe 3+, A n- is CO 3 2-, Cl Represents an n-valent anion such as ⁇ and NO 3 — , 0 ⁇ x ⁇ 1, 0 ⁇ m ⁇ 1, and n is a positive number.
- M 2+ is preferably Mg 2+
- M 3+ is preferably Al 3+
- a n- is preferably CO 3 2-.
- M 2+ represents a divalent metal ion such as Mg 2+ or Zn 2+
- a n ⁇ represents an n-valent anion such as CO 3 2 ⁇ , Cl ⁇ , NO 3 ⁇
- x is 2 or more.
- Z is a positive number of 2 or less
- m is a positive number
- n is a positive number.
- M 2+ is preferably Mg 2+, A n-is preferably CO 3 2-.
- Semi-fired hydrotalcite refers to a metal hydroxide having a layered crystal structure in which the amount of interlayer water is reduced or eliminated, obtained by firing unfired hydrotalcite.
- the “interlayer water” refers to “H 2 O” described in the composition formula of the unfired natural hydrotalcite and hydrotalcite-like compound described above using a composition formula.
- calcined hydrotalcite refers to a metal oxide having an amorphous structure obtained by calcining uncalcined hydrotalcite or semi-calcined hydrotalcite, and not only interlayer water but also hydroxyl groups disappeared by condensation dehydration.
- Unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by saturated water absorption.
- the saturated water absorption of the semi-calcined hydrotalcite is 1% by mass or more and less than 20% by mass.
- the saturated water absorption rate of the unfired hydrotalcite is less than 1% by mass, and the saturated water absorption rate of the fired hydrotalcite is 20% by mass or more.
- the saturated water absorption rate of the semi-fired hydrotalcite is preferably 3% by mass or more and less than 20% by mass, more preferably 5% by mass or more and less than 20% by mass.
- unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by the thermogravimetric reduction rate measured by thermogravimetric analysis.
- the thermal weight loss rate at 280 ° C. of the semi-calcined hydrotalcite is less than 15% by mass, and the thermal weight reduction rate at 380 ° C. is 12% by mass or more.
- the thermal weight reduction rate at 280 ° C. of the unfired hydrotalcite is 15% by mass or more, and the thermal weight reduction rate at 380 ° C. of the sintered hydrotalcite is less than 12% by mass.
- Thermogravimetric analysis was performed using Hitachi High-Tech Science TG / DTA EXSTAR6300, weighing 5 mg of hydrotalcite into an aluminum sample pan, and without opening the lid, in an atmosphere with a nitrogen flow rate of 200 mL / min.
- the temperature can be increased from 30 ° C. to 550 ° C. at a temperature increase rate of 10 ° C./min.
- unfired hydrotalcite, semi-fired hydrotalcite and fired hydrotalcite can be distinguished by the peak and relative intensity ratio measured by powder X-ray diffraction.
- Semi-calcined hydrotalcite shows a peak that is split into two around 8 to 18 ° by powder X-ray diffraction, or a peak having a shoulder due to the synthesis of two peaks.
- the uncalcined hydrotalcite has only one peak at around 8 to 18 °, or the relative intensity ratio of the diffraction intensity of the peak or shoulder appearing on the low angle side and the peak or shoulder appearing on the high angle side is in the above range. Get out.
- the calcined hydrotalcite does not have a characteristic peak in the region of 8 ° to 18 °, but has a characteristic peak at 43 °.
- Powder X-ray diffraction measurement was performed using a powder X-ray diffractometer (Empyrean, manufactured by PANalytical), counter-cathode CuK ⁇ (1.5405 mm), voltage: 45 V, current: 40 mA, sampling width: 0.0260 °, scanning speed: 0 0.0657 ° / s, diffraction angle range (2 ⁇ ): 5.0131 to 79.9711 °.
- the peak search uses the peak search function of the software attached to the diffractometer. “Minimum significance: 0.50, minimum peak tip: 0.01 °, maximum peak tip: 1.00 °, peak base width: 2 0.000, method: minimum value of second derivative ”.
- BET specific surface area of the semi-sintered hydrotalcite is preferably 1 ⁇ 250m 2 / g, more preferably 5 ⁇ 200m 2 / g.
- the BET specific surface area of semi-calcined hydrotalcite should be calculated using the BET multipoint method by adsorbing nitrogen gas to the sample surface using a specific surface area measuring device (Macsorb HM Model 1210 Mountec) according to the BET method. Can do.
- the average particle size of the semi-fired hydrotalcite is preferably 1 to 1,000 nm, and more preferably 10 to 800 nm.
- the average particle size of the semi-calcined hydrotalcite is the median size of the particle size distribution when the particle size distribution is prepared on a volume basis by laser diffraction scattering type particle size distribution measurement (JIS Z 8825).
- Semi-baked hydrotalcite can be surface-treated with a surface treatment agent.
- a surface treatment agent used for the surface treatment for example, higher fatty acids, alkylsilanes, silane coupling agents and the like can be used, and among these, higher fatty acids and alkylsilanes are preferable.
- One or more surface treatment agents can be used.
- higher fatty acid examples include higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid, and palmitic acid, among which stearic acid is preferable. These can use 1 type (s) or 2 or more types.
- alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, and n-octadecyl. Examples thereof include dimethyl (3- (trimethoxysilyl) propyl) ammonium chloride. These 1 type (s) or 2 or more types can be used.
- silane coupling agent examples include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
- Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropylto Amino silanes such as methoxysilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Coupling agents; Ureido silane coupling agents such as 3-
- the surface treatment of the semi-fired hydrotalcite is performed, for example, by adding and spraying the surface treatment agent and stirring for 5 to 60 minutes while stirring and dispersing the untreated semi-fired hydrotalcite at room temperature with a mixer.
- a mixer a well-known mixer can be used, for example, blenders, such as V blender, a ribbon blender, and a bubble cone blender, mixers, such as a Henschel mixer and a concrete mixer, a ball mill, a cutter mill, etc. are mentioned.
- the semi-fired hydrotalcite is pulverized with a ball mill or the like, the above-mentioned higher fatty acid, alkylsilanes or silane coupling agent can be added to carry out surface treatment.
- the amount of the surface treatment agent used varies depending on the type of the semi-fired hydrotalcite or the type of the surface treatment agent, but is preferably 1 to 10 parts by mass with respect to 100 parts by mass of the semi-fired hydrotalcite that has not been surface-treated. .
- the surface-treated semi-fired hydrotalcite is also included in the “semi-fired hydrotalcite”.
- the amount of semi-fired hydrotalcite is not particularly limited. In the case of using semi-fired hydrotalcite from the viewpoint of moisture barrier properties of the sealing sheet, the amount thereof is 3 to 50 mass per whole resin composition layer (that is, per whole nonvolatile content of the resin composition). %, More preferably 5 to 45% by mass, still more preferably 10 to 40% by mass.
- Examples of the semi-calcined hydrotalcite include “DHT-4C” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), “DHT-4A-2” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm), and the like. Can be mentioned.
- examples of the calcined hydrotalcite include “KW-2200” (manufactured by Kyowa Chemical Industry Co., Ltd., average particle size: 400 nm).
- Examples of the uncalcined hydrotalcite include “DHT-4A” (Kyowa Chemical). Manufactured by Kogyo Co., Ltd., average particle size: 400 nm).
- the resin composition layer may contain other components different from the above-mentioned olefin resin, epoxy resin and semi-calcined hydrotalcite.
- olefin resin epoxy resin
- semi-calcined hydrotalcite A well-known thing can be used as a component of the resin composition for sealing.
- other components include curing agents, curing accelerators, other resins different from olefin resins and epoxy resins, other inorganic fillers different from semi-fired hydrotalcite, silane coupling agents, and the like. . Any of these other components may be used alone or in combination of two or more.
- a curing agent When using an olefin resin and / or epoxy resin having an epoxy group, it is preferable to use a curing agent or to use a curing agent and a curing accelerator in combination for curing.
- the resin composition layer may contain another resin different from the olefin resin and the epoxy resin.
- the other resin include a tackifier resin and a thermoplastic resin (for example, a phenoxy resin) different from the olefin resin.
- the phenoxy resin can have an epoxy group similarly to the epoxy resin.
- the epoxy equivalent of the phenoxy resin is preferably more than 5,000 and not more than 16,000, more preferably not less than 10,000 and not more than 16,000.
- the resin composition layer may contain another inorganic filler different from the semi-fired hydrotalcite.
- inorganic fillers include, for example, uncalcined hydrotalcite, calcined hydrotalcite, talc, silica, alumina, barium sulfate, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride , Aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate and the like.
- the amount of the other inorganic filler is preferably 0 to 12% by mass, more preferably 0 to 10% by mass, and still more preferably 0 per total resin composition layer (that is, per total nonvolatile content of the resin composition). ⁇ 8% by mass.
- the thickness of the resin composition layer is preferably 5 to 75 ⁇ m, more preferably 10 to 50 ⁇ m, and still more preferably 15 to 50 ⁇ m.
- the sealing sheet of the present invention can be manufactured.
- the resin composition varnish is prepared by mixing the components of the resin composition and the organic solvent using a kneading roller or a rotary mixer.
- the non-volatile content of the resin composition varnish is preferably 20 to 80% by mass, more preferably 30 to 70% by mass.
- organic solvent examples include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; cellosolve, butyl carbitol, and the like Carbitols of the above; aromatic hydrocarbons such as toluene and xylene; dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like; aromatic mixed solvents such as solvent naphtha.
- ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone
- acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate
- aromatic mixed solvent products examples include “Swazole” (manufactured by Maruzen Petroleum Co., Ltd.) and “Ipsol” (manufactured by Idemitsu Kosan Co., Ltd.). Only one organic solvent may be used, or two or more organic solvents may be used.
- the drying conditions for forming the resin composition layer are not particularly limited, but the drying temperature is 80 to 130 ° C., for example, and the drying time is 3 to 60 minutes, for example.
- the drying temperature is preferably 80 to 100 ° C., and the drying time is preferably 5 to 90 minutes.
- the drying temperature is preferably 80 to 130 ° C., and the drying time is preferably 15 to 60 minutes.
- the sealing film After forming the resin composition layer on the first film, the sealing film can be produced by laminating the second film on the obtained resin composition layer. Moreover, after forming a resin composition layer on a 2nd film, the sheet
- a known device such as a roll laminator, a press machine, a vacuum pressure laminator or the like can be used.
- both the first film (support) and the second film (cover film) were formed before and after the formation of the organic EL device sealing layer (resin composition layer or cured product layer thereof).
- a sealing film premised on being peeled off was produced.
- both the first film and the second film use the following moisture-proof film with a release layer in which a release layer is formed on the opposite side of the barrier layer of the moisture-proof film in Table 1 above. did.
- “Film A with Silicone Release Layer” A moisture-proof film in which a silicone release layer is provided on the surface of the film A opposite to the barrier layer.
- PET + film A with alkyd release layer Moisture-proof film (film with an adhesive bonded to the opposite side of the release layer of PET with alkyd release layer and the opposite side of the barrier layer of film A) Overall thickness 55 ⁇ m).
- PET + film A with silicone release layer a moisture-proof film (film) in which the opposite surface of the release layer of PET with silicone release layer and the opposite surface of the barrier layer of film A are bonded together with an adhesive Overall thickness 55 ⁇ m).
- PET + film B with silicone release layer a moisture-proof film (film) in which the opposite side of the release layer of PET with the silicone release layer and the opposite side of the barrier layer of film B are bonded together with an adhesive Overall thickness 55 ⁇ m).
- PET + film C with silicone release layer a moisture-proof film (film with an adhesive bonding the opposite surface of the release layer of PET with silicone release layer and the opposite surface of the barrier layer of film C) Overall thickness 55 ⁇ m).
- Film D with Silicone Release Layer A moisture-proof film (thickness of the entire film is 55 ⁇ m) provided with a silicone release layer on the opposite side of the barrier layer (aluminum foil) of film D.
- the “PET with silicone release layer” used in Comparative Examples and Examples is a film in which a silicone release layer is provided on one side of a polyethylene terephthalate film.
- PET with alkyd release layer used in Comparative Examples and Examples is a film in which an alkyd release layer is provided on one side of a polyethylene terephthalate film.
- the ionic liquid curing agent (N-acetylglycine tetrabutylphosphonium salt) was synthesized by the following procedure. To 20.0 g of a 41.4 mass% tetrabutylphosphonium hydroxide aqueous solution (Hokuko Chemical Co., Ltd.), 3.54 g of N-acetylglycine (Tokyo Chemical Industry Co., Ltd.) was added at 0 ° C. and stirred for 10 minutes. did. The pressure was reduced to 40-50 mmHg using an evaporator, and the mixture was concentrated at 60-80 ° C. for 2 hours and at 90 ° C. for 5 hours.
- Example 1 PET + film A with silicone release layer was used as the first film, and film A with silicone release layer was used as the second film.
- the olefin-based resin composition varnish obtained in Production Example 1 is uniformly applied to the release layer surface of the first film by a die coater and heated at 130 ° C. for 60 minutes, whereby a resin composition having a thickness of 20 ⁇ m.
- a sealing sheet having a layer was obtained (residual solvent amount in the resin composition layer: about 1% by mass).
- the sealing sheet was wound up in a roll while bonding them so that the resin composition layer of the obtained sealing sheet and the release layer surface of the second film were in contact with each other.
- the roll-shaped sealing sheet was slit to a width of 507 mm to obtain a sealing sheet having a size of 507 ⁇ 336 mm.
- the structure of the obtained sealing sheet is shown in Table 2 below.
- Examples 2 to 10 and Comparative Examples 1 to 3 The films shown in Tables 2 and 3 below are used as the first film or the second film, and the resin composition layer is formed using the olefin resin composition varnish or the epoxy resin composition varnish obtained in Production Example 1 or 2.
- the sealing sheets of Examples 2 to 10 and Comparative Examples 1 to 3 were produced basically in the same manner as in Example 1 except that it was formed (resin composition layer thickness 20 ⁇ m).
- the structures of the obtained sealing sheet are shown in Tables 2 and 3 below.
- Example 10 and Comparative Example 3 using the epoxy resin composition varnish after applying the epoxy resin composition varnish, the epoxy resin composition layer was dried at 80 to 100 ° C. (average 90 ° C.) for 5 minutes. Formed (residual solvent amount in the resin composition layer: about 2% by mass).
- the apparatus is composed of a glass container in which a heatable sample is placed and a titration apparatus that contains a reaction liquid that titrates water vaporized when the sample is heated.
- the vaporized water moves from the glass container to the reaction liquid side of the titration apparatus by flowing nitrogen at a flow rate of 250 ⁇ 25 ml / min.
- the measurement is carried out by placing a sample in a glass container substituted under a nitrogen atmosphere (water vapor ⁇ 0.1 ppm (mass basis)), titrating the amount of water vaporized at 130 ° C.
- the water content of was calculated.
- the unit of moisture content “ppm” described below is based on mass.
- the sealing sheet cut into a 7 cm square was left for 7 days in an atmosphere at a temperature of 25 ° C. and a humidity of 50% RH, and then the first and second films were peeled in the same manner as described above.
- the layer was used as a sample after standing, and its water content was measured in the same manner. The moisture content after standing is shown in Table 2 below.
- the ratio of the water content after standing measured as described above to the water content before standing (that is, the water content after standing / water content before standing, hereinafter referred to as “the ratio of water content”). ) was calculated. This ratio is also shown in Table 2 below.
- the sealing sheet was evaluated according to the following criteria from the water content after standing and the ratio of the water content after standing and the water content before leaving. The results are also shown in the table below.
- the second film was peeled off, and the sealing film on which PET lacquer AL1N30 was bonded was used to peel off the first film, as will be described later. Then, the organic EL element was sealed.
- a sealing sheet from which the second film was peeled that is, a laminate of the resin composition layer and the first film was used, which will be described later. Thus, the organic EL element was sealed.
- an inorganic film (SiN) (thickness: 500 nm) was deposited on the organic EL device element using capacitively coupled plasma (CCP) to obtain an organic EL device element with an inorganic film.
- CCP capacitively coupled plasma
- the resin composition layer of the sealing sheet described above and the organic EL device element with an inorganic film are in contact with each other, and these are bonded with a thermal laminator (Lamipacker DAiSY A4 (LPD2325) manufactured by Fuji Plastics).
- the sample was heated at 100 ° C. for 60 minutes after bonding, and the epoxy resin The composition layer was cured.
- the emission area of samples for evaluation other than dark spots was calculated using a Keyence microscope, and this value was used as the initial value.
- the evaluation sample was stored in a small environmental tester (SH-222 manufactured by Espec Corp.) set to a temperature of 85 ° C. and a humidity of 85% RH for a certain period of time, and the light emission area of the evaluation sample was measured every certain period of time. .
- the time during which the light emission area of the evaluation sample stored in the small environmental tester was less than 95 area% compared to the initial value was calculated as the light emission area reduction start time, and evaluated according to the following criteria.
- Tables 2 and 3 below. In Examples and Comparative Examples in which the emission area decrease start time was not measured, “ ⁇ ” was described in Tables 2 and 3 below. (Standard of emission area decrease start time) ⁇ (Good): Light emission area decrease start time is 1000 hours or more. ⁇ (Yes): Light emission area decrease start time is 800 hours or more and less than 1000 hours. X (Bad): Light emission area decrease start time is less than 800 hours.
- WVTR is 1 (g / m 2 / 24hr ) encapsulating sheet having a a first and second films is less, RH atmosphere temperature 25 ° C. and 50% humidity Even if left for 7 days, water absorption (that is, increase in water content) of the resin composition layer can be suppressed. If such a sealing sheet is used, the lifetime of the organic EL device (light emission area starts to decrease). Time).
- the sealing sheet of the present invention is useful for sealing electronic components such as organic EL elements.
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Abstract
Description
[3] 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.01(g/m2/24hr)以上0.5(g/m2/24hr)以下である、前記[1]に記載の封止用シート。
[4] 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.01(g/m2/24hr)以上0.2(g/m2/24hr)以下である、前記[1]に記載の封止用シート。
[5] 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.05(g/m2/24hr)以上0.2(g/m2/24hr)以下である、前記[1]に記載の封止用シート。
[8] 第1フィルムの水蒸気透過度が0.001(g/m2/24hr)以下である、前記[6]に記載の封止用シート。
[9] 第1フィルムの水蒸気透過度が0.0005(g/m2/24hr)以下である、前記[6]に記載の封止用シート。
[11] 第2フィルムの水蒸気透過度が0.01(g/m2/24hr)以上0.2(g/m2/24hr)以下である、前記[6]~[9]のいずれか一つに記載の封止用シート。
[12] 第2フィルムの水蒸気透過度が0.05(g/m2/24hr)以上0.2(g/m2/24hr)以下である、前記[6]~[9]のいずれか一つに記載の封止用シート。
[15] 基材が、プラスチックフィルムである、前記[14]に記載の封止用シート。
[16] バリア層が無機膜を含む、前記[14]または[15]に記載の封止用シート。
[18] 樹脂組成物層が、半焼成ハイドロタルサイトを含む前記[1]~[17]のいずれか一つに記載の封止用シート。
[20] 第1フィルムおよび第2フィルムが離型層を有するフィルムである、前記[1]~[19]のいずれか一つに記載の封止用シート。
(式中、M2+はMg2+、Zn2+などの2価の金属イオンを表し、M3+はAl3+、Fe3+などの3価の金属イオンを表し、An-はCO3 2-、Cl-、NO3 -などのn価のアニオンを表し、0<x<1であり、0≦m<1であり、nは正の数である。)
式(I)中、M2+は、好ましくはMg2+であり、M3+は、好ましくはAl3+であり、An-は、好ましくはCO3 2-である。
(式中、M2+はMg2+、Zn2+などの2価の金属イオンを表し、An-はCO3 2-、Cl-、NO3-などのn価のアニオンを表し、xは2以上の正の数であり、zは2以下の正の数であり、mは正の数であり、nは正の数である。)
式(II)中、M2+は、好ましくはMg2+であり、An-は、好ましくはCO3 2-である。
飽和吸水率(質量%)
=100×(吸湿後の質量-初期質量)/初期質量 (i)
で求めることができる。
熱重量減少率(質量%)
=100×(加熱前の質量-所定温度に達した時の質量)/加熱前の質量 (ii)
で求めることができる。
以下の実施例、比較例で使用した防湿性フィルム、離型層付きPETフィルム、後述する方法で測定したWVTR等を下記表1に記載する。
「シリコーン離型層付きフィルムA」:フィルムAのバリア層の反対側の面に、シリコーン離型層が設けられた防湿性フィルム。
「アルキッド離型層付きPET+フィルムA」:アルキッド離型層付きPETの離型層の反対側の面とフィルムAのバリア層の反対側の面とを接着剤で貼り合せた防湿性フィルム(フィルム全体の厚さ55μm)。
「シリコーン離型層付きPET+フィルムA」:シリコーン離型層付きPETの離型層の反対側の面とフィルムAのバリア層の反対側の面とを接着剤で貼り合せた防湿性フィルム(フィルム全体の厚さ55μm)。
「シリコーン離型層付きPET+フィルムB」:シリコーン離型層付きPETの離型層の反対側の面とフィルムBのバリア層の反対側の面とを接着剤で貼り合せた防湿性フィルム(フィルム全体の厚さ55μm)。
「シリコーン離型層付きPET+フィルムC」:シリコーン離型層付きPETの離型層の反対側の面とフィルムCのバリア層の反対側の面とを接着剤で貼り合せた防湿性フィルム(フィルム全体の厚さ55μm)。
「シリコーン離型層付きフィルムD」:フィルムDのバリア層(アルミニウム箔)の反対側の面に、シリコーン離型層が設けられた防湿性フィルム(フィルム全体の厚さ55μm)。
なお、比較例および実施例で使用した「シリコーン離型層付きPET」はポリエチレンテレフタレートフィルムの片面にシリコーン離型層が設けられたフィルムである。
なお、比較例および実施例で使用した「アルキッド離型層付きPET」はポリエチレンテレフタレートフィルムの片面にアルキッド離型層が設けられたフィルムである。
製造例1:オレフィン系樹脂組成物ワニスの製造
シクロヘキサン環含有飽和炭化水素樹脂(荒川化学社製「アルコンP125」)の60質量%スワゾール溶液130質量部に、無水マレイン酸変性液状ポリイソブチレン(東邦化学工業社製「HV-300M」)35質量部、ポリブテン(JXエネルギー社製「HV-1900」)60質量部、および半焼成ハイドロタルサイト(協和化学工業社製「DHT-4C」)100質量部を3本ロールで分散させて、混合物を得た。得られた混合物に、グリシジルメタクリレート変性ポリプロピレン-ポリブテン共重合体の20質量%スワゾール溶液(星光PMC社製「T-YP341」)200質量部、アニオン重合型硬化剤(2,4,6-トリス(ジアミノメチル)フェノール)0.5質量部およびトルエン16質量部を配合し、得られた混合物を高速回転ミキサーで均一に分散して、オレフィン系樹脂組成物ワニスを得た。
液状ビスフェノールA型エポキシ樹脂(三菱化学社製「jER828EL」、エポキシ当量:約185)56質量部、シランカップリング剤(信越化学工業社製「KBM403)1.2質量部、タルク粉末(日本タルク社製「FG15」)2質量部、および半焼成ハイドロタルサイト(協和化学工業社製「DHT-4A-2」)15質量部を混練後、3本ロールミルにて分散を行い、混合物を得た。硬化促進剤(サンアプロ社製「U-3512T」)1.5質量部をフェノキシ樹脂(三菱化学社製「YL7213」)の35質量%メチルエチルケトン(MEK)溶液81質量部に溶解させた混合物に、先に調製した3本ロールミルにより分散した混合物と、固形ビスフェノールA型エポキシ樹脂の溶液(三菱化学社製「jER1001」)の80質量%MEK溶液30質量部と、有機溶剤分散型コロイダルシリカ(アモルファスシリカ粒径10~15nm、不揮発分:30質量%、溶剤:MEK、日産化学工業社製「MEK-EC-2130Y」)20質量部と、イオン液体硬化剤(N-アセチルグリシンテトラブチルホスホニウム塩)3質量部を配合し、高速回転ミキサーで均一に分散して、エポキシ樹脂組成物ワニスを得た。
実施例1
シリコーン離型層付きPET+フィルムAを第1フィルムとして使用し、シリコーン離型層付きフィルムAを第2フィルムとして使用した。製造例1で得られたオレフィン系樹脂組成物ワニスを、第1フィルムの離型層面に、ダイコーターにて均一に塗布し、130℃で60分間加熱することにより、厚さ20μmの樹脂組成物層を有する封止用シートを得た(樹脂組成物層中の残留溶媒量:約1質量%)。次いで、得られた封止用シートの樹脂組成物層と第2フィルムの離型層面とが接触するように、これらを貼り合わせながら、封止用シートをロール状に巻き取った。ロール状の封止用シートを幅507mmにスリットし、サイズ507×336mmの封止用シートを得た。得られた封止用シートの構成を、以下の表2に示す。
下記表2および3に示すフィルムを第1フィルムまたは第2フィルムとして使用し、製造例1または2で得られたオレフィン系樹脂組成物ワニスまたはエポキシ樹脂組成物ワニスを使用して樹脂組成物層を形成したこと以外は基本的に実施例1と同様にして、実施例2~10および比較例1~3の封止用シートを製造した(樹脂組成物層の厚さ20μm)。得られた封止用シートの構成を、以下の表2および3に示す。
(1)水蒸気透過度(WVTR)の測定
表1に記載するフィルムA~フィルムX、シリコーン剥離処理PETおよびアルキッド剥離処理PETの水蒸気透過度を、以下のようにして測定した。まず、フィルムから60mmφに打ち抜いた試験片を作製した。JIS Z 0208:1976に従い、透過面積2.826×10-3m2(60mmφ)であるアルミニウム製の透湿カップに塩化カルシウム7.5gを量り取り、この透湿カップに試験片に取り付けた。塩化カルシウムを入れ、試験片を取り付けた透湿カップの初期質量を精密天秤にて測定した。次いで、温度40℃および湿度90%RHの恒温試験室に前記透湿カップを24時間静置した後、塩化カルシウムを入れ、試験片を取り付けた透湿カップの透湿後の質量を精密天秤にて測定した。質量増加量(=透湿後の質量-初期質量)を水蒸気の透過量とし、水蒸気の透過量、透過面積および静置時間から、水蒸気透過度(g/m2/24hr)を算出した。
実施例1~5および比較例1で製造した封止用シートの放置前後の樹脂組成物層の含水量を以下のようにして測定した。
(含水量の基準)
〇(良好):放置後の含水量が9000ppm未満、且つ含水量の比が1.5未満
△(可):放置後の含水量が9000ppm未満、且つ含水量の比が1.5以上、または放置後の含水量が9000ppm以上、且つ含水量の比が1.5未満
×(不良):放置後の含水量が9000ppm以上、且つ含水量の比が1.5以上
7cm角にカットし、第2フィルムを剥離して得られた実施例6~10並びに比較例2および3の封止用シート(即ち、7cm角にカットした樹脂組成物層および第1フィルムの積層体)を含水量測定用のサンプルとして用いたこと以外は含水量の測定1と同様にして、これらの放置前後の含水量を測定し、含水量の比を算出して、上記基準で評価した。これらの結果を下記表3に示す。
後述するようにして、実施例1、2、4、7および8、並びに比較例1~3の放置前後の封止用シートを用いて有機EL素子を封止し、その発光面積減少開始時間を測定し、評価した。なお、放置前の封止用シートとして、製造してから24時間以内の封止用シートを用いた。また、放置後の封止用シートとして、温度25℃および湿度50%RH)の雰囲気下で7日間放置した封止用シートを使用した。
(発光面積減少開始時間の基準)
〇(良好):発光面積減少開始時間が1000時間以上
△(可):発光面積減少開始時間が800時間以上、1000時間未満
×(不良):発光面積減少開始時間が800時間未満
Claims (21)
- 第1フィルム、樹脂組成物層および第2フィルムを有する封止用シートであって、樹脂組成物層が、第1フィルムおよび第2フィルムの間に存在し、第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、1(g/m2/24hr)以下である封止用シート。
- 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.01(g/m2/24hr)以上1(g/m2/24hr)以下である、請求項1に記載の封止用シート。
- 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.01(g/m2/24hr)以上0.5(g/m2/24hr)以下である、請求項1に記載の封止用シート。
- 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.01(g/m2/24hr)以上0.2(g/m2/24hr)以下である、請求項1に記載の封止用シート。
- 第1フィルムおよび第2フィルムの水蒸気透過度が、それぞれ、0.05(g/m2/24hr)以上0.2(g/m2/24hr)以下である、請求項1に記載の封止用シート。
- 第1フィルムの水蒸気透過度が0.01(g/m2/24hr)未満であり、第2フィルムの水蒸気透過度が0.01(g/m2/24hr)以上1(g/m2/24hr)以下である、請求項1に記載の封止用シート。
- 第1フィルムの水蒸気透過度が0.005(g/m2/24hr)以下である、請求項6に記載の封止用シート。
- 第1フィルムの水蒸気透過度が0.001(g/m2/24hr)以下である、請求項6に記載の封止用シート。
- 第1フィルムの水蒸気透過度が0.0005(g/m2/24hr)以下である、請求項6に記載の封止用シート。
- 第2フィルムの水蒸気透過度が0.01(g/m2/24hr)以上0.5(g/m2/24hr)以下である、請求項6~9のいずれか一項に記載の封止用シート。
- 第2フィルムの水蒸気透過度が0.01(g/m2/24hr)以上0.2(g/m2/24hr)以下である、請求項6~9のいずれか一項に記載の封止用シート。
- 第2フィルムの水蒸気透過度が0.05(g/m2/24hr)以上0.2(g/m2/24hr)以下である、請求項6~9のいずれか一項に記載の封止用シート。
- 第1フィルムの水蒸気透過度が0.0005(g/m2/24hr)以下であり、第2フィルムの水蒸気透過度が0.0005(g/m2/24hr)超0.01(g/m2/24hr)未満である、請求項1に記載の封止用シート。
- 第1フィルムおよび第2フィルムが、基材およびバリア層を有するフィルムである、請求項1~13のいずれか一項に記載の封止用シート。
- 基材が、プラスチックフィルムである、請求項14に記載の封止用シート。
- バリア層が無機膜を含む、請求項14または15に記載の封止用シート。
- 樹脂組成物層が、オレフィン系樹脂および/またはエポキシ樹脂を含む請求項1~16のいずれか一項に記載の封止用シート。
- 樹脂組成物層が、半焼成ハイドロタルサイトを含む請求項1~17のいずれか一項に記載の封止用シート。
- 第1フィルムが離型層を有するフィルムである、請求項1~18のいずれか一項に記載の封止用シート。
- 第1フィルムおよび第2フィルムが離型層を有するフィルムである、請求項1~19のいずれか一項に記載の封止用シート。
- 有機EL素子の封止用である請求項1~20のいずれか一項に記載の封止用シート。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020262110A1 (ja) * | 2019-06-25 | 2020-12-30 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
WO2021065972A1 (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用シートの製造方法 |
WO2021095830A1 (ja) * | 2019-11-13 | 2021-05-20 | 味の素株式会社 | 封止用シート |
JP2021075009A (ja) * | 2019-11-12 | 2021-05-20 | 味の素株式会社 | 封止用シートの製造方法 |
KR20220012199A (ko) | 2020-07-22 | 2022-02-03 | 아지노모토 가부시키가이샤 | 밀봉용 시트 및 폴리머 조성물 층 |
WO2023182493A1 (ja) * | 2022-03-25 | 2023-09-28 | 味の素株式会社 | 樹脂シートおよびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011151969A1 (ja) * | 2010-06-03 | 2011-12-08 | 株式会社カネカ | 太陽電池用バックシートおよび太陽電池モジュール |
JP2012057065A (ja) * | 2010-09-09 | 2012-03-22 | Lintec Corp | 封止用粘着シート、電子デバイス、及び有機デバイス |
WO2013133256A1 (ja) * | 2012-03-06 | 2013-09-12 | リンテック株式会社 | ガスバリアフィルム積層体、粘着フィルム、および電子部材 |
WO2015178469A1 (ja) * | 2014-05-23 | 2015-11-26 | 味の素株式会社 | 封止体の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008044579A1 (en) * | 2006-10-06 | 2008-04-17 | Sumitomo Bakelite Company Limited | Epoxy resin composition for sealing of semiconductor and semiconductor device |
JP6081123B2 (ja) * | 2011-10-08 | 2017-02-15 | 三菱樹脂株式会社 | 基材レス両面粘着シート |
JP6269503B6 (ja) * | 2012-11-30 | 2018-06-27 | 三菱ケミカル株式会社 | 防湿フィルム及びそれを用いた有機電子デバイス |
TWI536633B (zh) * | 2014-12-22 | 2016-06-01 | 財團法人工業技術研究院 | 一種用於電子元件之基板結構及其製法 |
JP6428432B2 (ja) | 2015-03-27 | 2018-11-28 | 味の素株式会社 | 封止用シート、その製造方法および評価方法 |
WO2017135112A1 (ja) | 2016-02-01 | 2017-08-10 | 味の素株式会社 | 封止用の熱硬化性樹脂組成物および封止用シート |
-
2018
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011151969A1 (ja) * | 2010-06-03 | 2011-12-08 | 株式会社カネカ | 太陽電池用バックシートおよび太陽電池モジュール |
JP2012057065A (ja) * | 2010-09-09 | 2012-03-22 | Lintec Corp | 封止用粘着シート、電子デバイス、及び有機デバイス |
WO2013133256A1 (ja) * | 2012-03-06 | 2013-09-12 | リンテック株式会社 | ガスバリアフィルム積層体、粘着フィルム、および電子部材 |
WO2015178469A1 (ja) * | 2014-05-23 | 2015-11-26 | 味の素株式会社 | 封止体の製造方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020262110A1 (ja) * | 2019-06-25 | 2020-12-30 | 住友化学株式会社 | 有機電子デバイスの製造方法 |
WO2021065972A1 (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用シートの製造方法 |
KR20220077918A (ko) | 2019-09-30 | 2022-06-09 | 아지노모토 가부시키가이샤 | 밀봉용 시트의 제조방법 |
JP2021075009A (ja) * | 2019-11-12 | 2021-05-20 | 味の素株式会社 | 封止用シートの製造方法 |
WO2021095792A1 (ja) * | 2019-11-12 | 2021-05-20 | 味の素株式会社 | 封止用シートの製造方法 |
WO2021095830A1 (ja) * | 2019-11-13 | 2021-05-20 | 味の素株式会社 | 封止用シート |
KR20220100902A (ko) | 2019-11-13 | 2022-07-18 | 아지노모토 가부시키가이샤 | 밀봉용 시트 |
DE112020005543T5 (de) | 2019-11-13 | 2022-09-01 | Ajinomoto Co., Inc. | Siegelfolie |
KR20220012199A (ko) | 2020-07-22 | 2022-02-03 | 아지노모토 가부시키가이샤 | 밀봉용 시트 및 폴리머 조성물 층 |
WO2023182493A1 (ja) * | 2022-03-25 | 2023-09-28 | 味の素株式会社 | 樹脂シートおよびその製造方法 |
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