WO2005101067A1 - 集光素子および固体撮像装置 - Google Patents
集光素子および固体撮像装置 Download PDFInfo
- Publication number
- WO2005101067A1 WO2005101067A1 PCT/JP2004/018746 JP2004018746W WO2005101067A1 WO 2005101067 A1 WO2005101067 A1 WO 2005101067A1 JP 2004018746 W JP2004018746 W JP 2004018746W WO 2005101067 A1 WO2005101067 A1 WO 2005101067A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- incident
- refractive index
- lens
- state imaging
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 58
- 239000007787 solid Substances 0.000 title abstract 2
- 238000009826 distribution Methods 0.000 claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
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- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 49
- 239000000463 material Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 230000007423 decrease Effects 0.000 description 9
- 230000035945 sensitivity Effects 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
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- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001444 catalytic combustion detection Methods 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
- G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
- G02B5/1885—Arranged as a periodic array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006519307A JP4733030B2 (ja) | 2004-04-13 | 2004-12-15 | 固体撮像装置 |
EP04807105A EP1736803A1 (en) | 2004-04-13 | 2004-12-15 | Condensing element and solid state imaging device |
US10/576,023 US8018508B2 (en) | 2004-04-13 | 2004-12-15 | Light-collecting device and solid-state imaging apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004117689 | 2004-04-13 | ||
JP2004-117689 | 2004-04-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005101067A1 true WO2005101067A1 (ja) | 2005-10-27 |
Family
ID=35150134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/018746 WO2005101067A1 (ja) | 2004-04-13 | 2004-12-15 | 集光素子および固体撮像装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8018508B2 (ja) |
EP (1) | EP1736803A1 (ja) |
JP (1) | JP4733030B2 (ja) |
CN (1) | CN100492064C (ja) |
WO (1) | WO2005101067A1 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007235452A (ja) * | 2006-02-28 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 固体撮像素子 |
JP2007304324A (ja) * | 2006-05-11 | 2007-11-22 | Konica Minolta Holdings Inc | ディスプレイパネル |
JP2008010773A (ja) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
JP2008024252A (ja) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | ヘッドライトモジュール |
JP2008147259A (ja) * | 2006-12-06 | 2008-06-26 | Canon Inc | 撮像素子及び撮像装置 |
JP2009015315A (ja) * | 2007-06-04 | 2009-01-22 | Sony Corp | 光学部材、固体撮像装置、製造方法 |
WO2010007792A1 (ja) * | 2008-07-16 | 2010-01-21 | パナソニック株式会社 | 固体撮像素子 |
JP2010171861A (ja) * | 2009-01-26 | 2010-08-05 | Ricoh Co Ltd | 撮像素子及び該撮像素子を備えた画像撮像装置 |
WO2010122758A1 (ja) * | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | 集光素子、集光素子群および固体撮像装置 |
US7846620B2 (en) | 2006-09-26 | 2010-12-07 | Panasonic Corporation | Phase shift mask and method for manufacturing light-collecting device |
JP2011154370A (ja) * | 2010-01-25 | 2011-08-11 | Toyota Motor Engineering & Manufacturing North America Inc | 回折格子を利用した光学装置 |
US8004595B2 (en) | 2007-11-29 | 2011-08-23 | Panasonic Corporation | Solid-state imaging device with a two-dimensional array of unit pixels |
WO2012001834A1 (ja) * | 2010-07-01 | 2012-01-05 | パナソニック株式会社 | 固体撮像装置 |
WO2012001930A1 (ja) * | 2010-07-02 | 2012-01-05 | パナソニック株式会社 | 固体撮像装置 |
WO2013021554A1 (ja) * | 2011-08-08 | 2013-02-14 | パナソニック株式会社 | 固体撮像装置 |
WO2013042281A1 (ja) * | 2011-09-20 | 2013-03-28 | パナソニック株式会社 | 固体撮像装置 |
JP2021092750A (ja) * | 2019-12-11 | 2021-06-17 | 采▲ぎょく▼科技股▲ふん▼有限公司VisEra Technologies Company Limited | 光学装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4456040B2 (ja) * | 2005-06-17 | 2010-04-28 | パナソニック株式会社 | 固体撮像素子 |
US7612319B2 (en) * | 2006-06-09 | 2009-11-03 | Aptina Imaging Corporation | Method and apparatus providing a microlens for an image sensor |
JP2008192771A (ja) * | 2007-02-02 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
JP4410274B2 (ja) * | 2007-06-26 | 2010-02-03 | 株式会社東芝 | 受光素子および光配線lsi |
JP5272433B2 (ja) * | 2008-02-15 | 2013-08-28 | 富士通セミコンダクター株式会社 | 画像撮像素子のずらし量算出方法及び装置、画像撮像素子、画像撮像素子内蔵装置 |
JP5338280B2 (ja) * | 2008-11-27 | 2013-11-13 | ソニー株式会社 | 2次元固体撮像装置 |
JP2010135442A (ja) * | 2008-12-02 | 2010-06-17 | Panasonic Corp | 固体撮像装置及びその製造方法 |
US8102460B2 (en) * | 2009-11-20 | 2012-01-24 | Fujifilm Corporation | Solid-state imaging device |
JP5312393B2 (ja) * | 2010-04-16 | 2013-10-09 | キヤノン株式会社 | 撮像装置 |
FR2972814B1 (fr) * | 2011-03-16 | 2014-04-18 | Essilor Int | Element optique transparent a plusieurs couches constituees de pavages cellulaires |
WO2013008395A1 (ja) * | 2011-07-08 | 2013-01-17 | パナソニック株式会社 | 固体撮像素子および撮像装置 |
TWI567953B (zh) | 2011-12-20 | 2017-01-21 | 新加坡恒立私人有限公司 | 光電模組及包含該模組之裝置 |
JP6271900B2 (ja) * | 2013-07-31 | 2018-01-31 | キヤノン株式会社 | 固体撮像素子およびそれを用いた撮像装置 |
KR102159166B1 (ko) * | 2014-05-09 | 2020-09-23 | 삼성전자주식회사 | 색분리 소자 및 상기 색분리 소자를 포함하는 이미지 센서 |
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JP2022554314A (ja) * | 2019-11-01 | 2022-12-28 | ウエイブタッチ デンマーク エー/エス | ナノインプリントリソグラフィを用いて生体撮像装置を製造するための方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04343471A (ja) * | 1991-05-21 | 1992-11-30 | Nec Corp | 固体撮像素子 |
JPH07113907A (ja) * | 1993-10-18 | 1995-05-02 | Matsushita Electric Ind Co Ltd | 回折光学素子 |
JP2001108812A (ja) * | 1999-10-13 | 2001-04-20 | Nippon Telegr & Teleph Corp <Ntt> | 光学素子 |
JP2001318217A (ja) * | 2000-05-08 | 2001-11-16 | Japan Science & Technology Corp | 有効屈折率法を用いたブレーズド位相型回折光学素子及びその製造方法 |
JP2002135796A (ja) * | 2000-10-25 | 2002-05-10 | Canon Inc | 撮像装置 |
JP2003229553A (ja) * | 2002-02-05 | 2003-08-15 | Sharp Corp | 半導体装置及びその製造方法 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4403827A (en) * | 1980-09-12 | 1983-09-13 | Mcdonnell Douglas Corporation | Process for producing a diffraction grating |
US4994664A (en) | 1989-03-27 | 1991-02-19 | Massachusetts Institute Of Technology | Optically coupled focal plane arrays using lenslets and multiplexers |
US5227915A (en) * | 1990-02-13 | 1993-07-13 | Holo-Or Ltd. | Diffractive optical element |
JPH05251673A (ja) | 1992-03-05 | 1993-09-28 | Nippon Telegr & Teleph Corp <Ntt> | 光検出装置 |
US5477383A (en) * | 1993-02-05 | 1995-12-19 | Apa Optics, Inc. | Optical array method and apparatus |
JPH06317764A (ja) * | 1993-04-27 | 1994-11-15 | Olympus Optical Co Ltd | 光学的ローパスフィルター |
JP3214964B2 (ja) | 1993-10-18 | 2001-10-02 | 松下電器産業株式会社 | 回折光学素子 |
US5561558A (en) | 1993-10-18 | 1996-10-01 | Matsushita Electric Industrial Co., Ltd. | Diffractive optical device |
KR0132018B1 (ko) * | 1994-01-27 | 1998-04-14 | 김만제 | 세원형 그레이팅 표면 방출형 레이저 다이오드 |
US5696371A (en) * | 1996-05-23 | 1997-12-09 | Eastman Kodak Company | Diffractive/refractive lenslet array |
US5995285A (en) * | 1996-07-09 | 1999-11-30 | Canon Kabushiki Kaisha | Multilevel optical diffraction device with antireflection film and exposure apparatus |
JP3507632B2 (ja) * | 1996-09-17 | 2004-03-15 | 株式会社東芝 | 回折格子レンズ |
CA2197706A1 (en) * | 1997-02-14 | 1998-08-14 | Peter Ehbets | Method of fabricating apodized phase mask |
JP2000039503A (ja) | 1998-07-22 | 2000-02-08 | Matsushita Electric Ind Co Ltd | レンズアレイ |
JP2001196568A (ja) | 2000-01-14 | 2001-07-19 | Sony Corp | 固体撮像素子及びその製造方法、並びにカメラ |
JP2001290074A (ja) * | 2000-04-04 | 2001-10-19 | Canon Inc | 回折光学素子を有する光学系 |
TW475334B (en) * | 2000-07-14 | 2002-02-01 | Light Opto Electronics Co Ltd | High light-sensing efficiency image sensor apparatus and method of making the same |
US6524772B1 (en) * | 2001-08-30 | 2003-02-25 | United Microelectronics Corp. | Method of manufacturing phase grating image sensor |
JP4343471B2 (ja) | 2001-12-14 | 2009-10-14 | 山陽特殊製鋼株式会社 | 磁歪部材およびその製造方法 |
US20030227684A1 (en) * | 2002-01-09 | 2003-12-11 | Akihiro Goto | Diffractive optical element, refractive optical element, illuminating optical apparatus, exposure apparatus and exposure method |
DE10200648A1 (de) * | 2002-01-10 | 2003-07-24 | Inst Neue Mat Gemein Gmbh | Verfahren zur Herstellung Optischer Elemente mit Gradientenstruktur |
JP4027115B2 (ja) | 2002-02-21 | 2007-12-26 | キヤノン株式会社 | 撮像素子及び撮像装置 |
US7250973B2 (en) | 2002-02-21 | 2007-07-31 | Canon Kabushiki Kaisha | Image pickup apparatus for reflecting light at an area between successive refractive areas |
US6888613B2 (en) * | 2002-03-01 | 2005-05-03 | Hewlett-Packard Development Company, L.P. | Diffractive focusing using multiple selectively light opaque elements |
DE60330521D1 (de) * | 2002-04-04 | 2010-01-28 | Canon Kk | Diffraktives optisches Element mit einer Vielzahl von Beugungsgittern und optisches System |
JP4310080B2 (ja) * | 2002-06-17 | 2009-08-05 | キヤノン株式会社 | 回折光学素子およびこれを備えた光学系、光学装置 |
JP2004096358A (ja) * | 2002-08-30 | 2004-03-25 | Olympus Corp | 撮像素子 |
EP1394969B1 (en) * | 2002-08-30 | 2004-05-12 | Alcatel | Electronic equaliser for optical transmitter |
JP2005202356A (ja) * | 2003-12-19 | 2005-07-28 | Sumitomo Electric Ind Ltd | 平板型マイクロレンズとその製造方法 |
TWM249381U (en) * | 2003-12-19 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Image sensor |
JP4451268B2 (ja) * | 2004-03-04 | 2010-04-14 | 株式会社リコー | 光学素子及びその製造方法と、これを用いた光学製品、光ピックアップ及び光情報処理装置 |
US20060102827A1 (en) | 2004-11-17 | 2006-05-18 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device |
US7420610B2 (en) * | 2004-12-15 | 2008-09-02 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging element, solid-state imaging device, and method for fabricating the same |
-
2004
- 2004-12-15 JP JP2006519307A patent/JP4733030B2/ja active Active
- 2004-12-15 EP EP04807105A patent/EP1736803A1/en not_active Withdrawn
- 2004-12-15 US US10/576,023 patent/US8018508B2/en active Active
- 2004-12-15 WO PCT/JP2004/018746 patent/WO2005101067A1/ja not_active Application Discontinuation
- 2004-12-15 CN CN200480042730.2A patent/CN100492064C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04343471A (ja) * | 1991-05-21 | 1992-11-30 | Nec Corp | 固体撮像素子 |
JPH07113907A (ja) * | 1993-10-18 | 1995-05-02 | Matsushita Electric Ind Co Ltd | 回折光学素子 |
JP2001108812A (ja) * | 1999-10-13 | 2001-04-20 | Nippon Telegr & Teleph Corp <Ntt> | 光学素子 |
JP2001318217A (ja) * | 2000-05-08 | 2001-11-16 | Japan Science & Technology Corp | 有効屈折率法を用いたブレーズド位相型回折光学素子及びその製造方法 |
JP2002135796A (ja) * | 2000-10-25 | 2002-05-10 | Canon Inc | 撮像装置 |
JP2003229553A (ja) * | 2002-02-05 | 2003-08-15 | Sharp Corp | 半導体装置及びその製造方法 |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007235452A (ja) * | 2006-02-28 | 2007-09-13 | Matsushita Electric Ind Co Ltd | 固体撮像素子 |
JP4699917B2 (ja) * | 2006-02-28 | 2011-06-15 | パナソニック株式会社 | 固体撮像素子 |
US7728901B2 (en) * | 2006-02-28 | 2010-06-01 | Panasonic Corporation | Solid-state imaging device using light-transmitting film as a micro lens |
JP2007304324A (ja) * | 2006-05-11 | 2007-11-22 | Konica Minolta Holdings Inc | ディスプレイパネル |
JP2008010773A (ja) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
JP2008024252A (ja) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | ヘッドライトモジュール |
JP4620640B2 (ja) * | 2006-07-25 | 2011-01-26 | パナソニック株式会社 | ヘッドライトモジュール |
US7846620B2 (en) | 2006-09-26 | 2010-12-07 | Panasonic Corporation | Phase shift mask and method for manufacturing light-collecting device |
JP2008147259A (ja) * | 2006-12-06 | 2008-06-26 | Canon Inc | 撮像素子及び撮像装置 |
US8586909B2 (en) | 2007-06-04 | 2013-11-19 | Sony Corporation | Method of manufacturing an optical member having stacked high and low refractive index layers |
JP2014078015A (ja) * | 2007-06-04 | 2014-05-01 | Sony Corp | 光学部材、固体撮像装置、製造方法 |
JP2009015315A (ja) * | 2007-06-04 | 2009-01-22 | Sony Corp | 光学部材、固体撮像装置、製造方法 |
US8004595B2 (en) | 2007-11-29 | 2011-08-23 | Panasonic Corporation | Solid-state imaging device with a two-dimensional array of unit pixels |
JP2010027746A (ja) * | 2008-07-16 | 2010-02-04 | Panasonic Corp | 固体撮像素子 |
WO2010007792A1 (ja) * | 2008-07-16 | 2010-01-21 | パナソニック株式会社 | 固体撮像素子 |
US8610228B2 (en) | 2008-07-16 | 2013-12-17 | Panasonic Corporation | Solid-state image sensor |
JP2010171861A (ja) * | 2009-01-26 | 2010-08-05 | Ricoh Co Ltd | 撮像素子及び該撮像素子を備えた画像撮像装置 |
US8502910B2 (en) | 2009-04-20 | 2013-08-06 | Panasonic Corporation | Light-collecting device, light-collecting device group, and solid-state imaging apparatus |
JP2010251673A (ja) * | 2009-04-20 | 2010-11-04 | Panasonic Corp | 集光素子、集光素子群および固体撮像装置 |
WO2010122758A1 (ja) * | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | 集光素子、集光素子群および固体撮像装置 |
JP2011154370A (ja) * | 2010-01-25 | 2011-08-11 | Toyota Motor Engineering & Manufacturing North America Inc | 回折格子を利用した光学装置 |
US8872091B2 (en) | 2010-07-01 | 2014-10-28 | Panasonic Corporation | Solid-state imaging device |
WO2012001834A1 (ja) * | 2010-07-01 | 2012-01-05 | パナソニック株式会社 | 固体撮像装置 |
JP2012015380A (ja) * | 2010-07-01 | 2012-01-19 | Panasonic Corp | 固体撮像装置 |
JP2012015424A (ja) * | 2010-07-02 | 2012-01-19 | Panasonic Corp | 固体撮像装置 |
WO2012001930A1 (ja) * | 2010-07-02 | 2012-01-05 | パナソニック株式会社 | 固体撮像装置 |
US8759931B2 (en) | 2010-07-02 | 2014-06-24 | Panasonic Corporation | Solid-state imaging device |
WO2013021554A1 (ja) * | 2011-08-08 | 2013-02-14 | パナソニック株式会社 | 固体撮像装置 |
JPWO2013021554A1 (ja) * | 2011-08-08 | 2015-03-05 | パナソニック株式会社 | 固体撮像装置 |
US9160951B2 (en) | 2011-08-08 | 2015-10-13 | Panasonic intellectual property Management co., Ltd | Solid-state imaging apparatus having a light collecting element with an effective refractive index distribution |
WO2013042281A1 (ja) * | 2011-09-20 | 2013-03-28 | パナソニック株式会社 | 固体撮像装置 |
JPWO2013042281A1 (ja) * | 2011-09-20 | 2015-03-26 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
US9466626B2 (en) | 2011-09-20 | 2016-10-11 | Panasonic Intellectual Property Management Co., Ltd. | Solid-state imaging apparatus |
JP2021092750A (ja) * | 2019-12-11 | 2021-06-17 | 采▲ぎょく▼科技股▲ふん▼有限公司VisEra Technologies Company Limited | 光学装置 |
US11156826B2 (en) | 2019-12-11 | 2021-10-26 | Visera Technologies Company Limited | Optical devices |
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EP1736803A1 (en) | 2006-12-27 |
US8018508B2 (en) | 2011-09-13 |
US20070146531A1 (en) | 2007-06-28 |
JPWO2005101067A1 (ja) | 2008-03-06 |
CN1938615A (zh) | 2007-03-28 |
JP4733030B2 (ja) | 2011-07-27 |
CN100492064C (zh) | 2009-05-27 |
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