JPWO2013021554A1 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JPWO2013021554A1 JPWO2013021554A1 JP2013527854A JP2013527854A JPWO2013021554A1 JP WO2013021554 A1 JPWO2013021554 A1 JP WO2013021554A1 JP 2013527854 A JP2013527854 A JP 2013527854A JP 2013527854 A JP2013527854 A JP 2013527854A JP WO2013021554 A1 JPWO2013021554 A1 JP WO2013021554A1
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- 238000003384 imaging method Methods 0.000 title claims abstract description 108
- 238000009826 distribution Methods 0.000 claims abstract description 50
- 230000005540 biological transmission Effects 0.000 claims abstract description 43
- 238000010586 diagram Methods 0.000 description 20
- 238000013139 quantization Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 14
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1876—Diffractive Fresnel lenses; Zone plates; Kinoforms
- G02B5/188—Plurality of such optical elements formed in or on a supporting substrate
- G02B5/1885—Arranged as a periodic array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/702—SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0076—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a detector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
B=−k0n0 (式2−3)
k0=2π/λ (式2−4)
2、502 カラーフィルタ
3、503 配線層
6、506 受光素子
7、507 Si基板
10 画素部
10A 単位セル
11 単位画素
14 垂直走査回路
18 水平信号線
19 垂直信号線
25 AD変換回路
27 参照信号生成部
27a DAC
28 出力I/F
30 通信・タイミング制御部
33A 下段光透過膜
33B 上段光透過膜
42 カラムアンプ
100、500、510 固体撮像装置
110 レンズ
110A、110B 撮像レンズ
120 DSP
121 画像処理回路
122 カメラシステム制御部
130 画像表示デバイス
140 画像メモリ
252 電圧比較部
254 カウンタ部
256 データ記憶部
258 スイッチ
262 信号保持容量
263 信号保持スイッチ
501 マイクロレンズ
502A、502B 入射光
Claims (5)
- 入射光を集光する集光素子を備える単位画素が配置された固体撮像装置であって、
前記集光素子は、前記入射光の波長より短い線幅ごとに分割された、同心構造の円環形状を有する複数のゾーン領域で構成され、当該複数のゾーン領域の組み合わせにより制御された実効屈折率分布を有しており、
前記複数のゾーン領域のうち少なくとも一つのゾーン領域では、前記ゾーン領域を構成する光透過膜が、前記同心構造の円周方向において、前記入射光の波長より短い間隔ごとに分割されている
固体撮像装置。 - 前記ゾーン領域を構成する光透過膜は、前記入射光の波長より短い間隔ごとに分割された複数の円弧状の光透過膜で構成されている
請求項1に記載の固体撮像装置。 - 前記複数の円弧状の光透過膜は、当該円弧状の光透過膜の内周部もしくは外周部に配置された円環状の光透過膜と連続している
請求項1または2に記載の固体撮像装置。 - 前記複数の円弧状の光透過膜の各々は、前記単位画素の中心を同心点とした同一円周上に配置されている
請求項2または3に記載の固体撮像装置。 - 請求項1〜4のうちいずれか1項に記載の固体撮像装置と、
前記集光素子よりも光の入射側に、当該光を入射させるための撮像レンズとを備え、
前記撮像レンズは、前記光を前記集光素子に広角に入射させる第1撮像レンズと、前記光を前記集光素子にテレセントリックに入射させる第2撮像レンズとを有する交換レンズである
撮像装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011172636 | 2011-08-08 | ||
JP2011172636 | 2011-08-08 | ||
PCT/JP2012/004638 WO2013021554A1 (ja) | 2011-08-08 | 2012-07-20 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013021554A1 true JPWO2013021554A1 (ja) | 2015-03-05 |
JP5983954B2 JP5983954B2 (ja) | 2016-09-06 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013527854A Active JP5983954B2 (ja) | 2011-08-08 | 2012-07-20 | 固体撮像装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9160951B2 (ja) |
JP (1) | JP5983954B2 (ja) |
WO (1) | WO2013021554A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005101067A1 (ja) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Industrial Co., Ltd. | 集光素子および固体撮像装置 |
JP2009135236A (ja) * | 2007-11-29 | 2009-06-18 | Panasonic Corp | 固体撮像素子 |
JP2010027875A (ja) * | 2008-07-18 | 2010-02-04 | Panasonic Corp | 固体撮像素子 |
JP2010171861A (ja) * | 2009-01-26 | 2010-08-05 | Ricoh Co Ltd | 撮像素子及び該撮像素子を備えた画像撮像装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4515971B2 (ja) * | 2005-06-17 | 2010-08-04 | パナソニック株式会社 | 集光素子の製造方法および位相シフトマスク |
JP4456040B2 (ja) | 2005-06-17 | 2010-04-28 | パナソニック株式会社 | 固体撮像素子 |
JP4699917B2 (ja) * | 2006-02-28 | 2011-06-15 | パナソニック株式会社 | 固体撮像素子 |
JP2008010773A (ja) * | 2006-06-30 | 2008-01-17 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
JP2008083189A (ja) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Ind Co Ltd | 位相シフトマスクおよび集光素子の製造方法 |
JP2008192771A (ja) * | 2007-02-02 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
US8755117B2 (en) * | 2009-01-06 | 2014-06-17 | Menicon Co., Ltd. | Method of manufacturing a diffraction lens other than an aphakic intraocular lens |
JP2010251489A (ja) * | 2009-04-15 | 2010-11-04 | Sony Corp | 固体撮像装置および電子機器 |
JP5277063B2 (ja) * | 2009-04-20 | 2013-08-28 | パナソニック株式会社 | 集光素子、集光素子群および固体撮像装置 |
JP5390357B2 (ja) * | 2009-12-04 | 2014-01-15 | パナソニック株式会社 | 光学レンズ用プレス成形金型、ガラス製光学レンズ、及びガラス製光学レンズの製造方法 |
WO2011142101A1 (ja) * | 2010-05-10 | 2011-11-17 | パナソニック株式会社 | 回折レンズ |
-
2012
- 2012-07-20 JP JP2013527854A patent/JP5983954B2/ja active Active
- 2012-07-20 WO PCT/JP2012/004638 patent/WO2013021554A1/ja active Application Filing
-
2014
- 2014-02-04 US US14/171,953 patent/US9160951B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005101067A1 (ja) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Industrial Co., Ltd. | 集光素子および固体撮像装置 |
JP2009135236A (ja) * | 2007-11-29 | 2009-06-18 | Panasonic Corp | 固体撮像素子 |
JP2010027875A (ja) * | 2008-07-18 | 2010-02-04 | Panasonic Corp | 固体撮像素子 |
JP2010171861A (ja) * | 2009-01-26 | 2010-08-05 | Ricoh Co Ltd | 撮像素子及び該撮像素子を備えた画像撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5983954B2 (ja) | 2016-09-06 |
WO2013021554A1 (ja) | 2013-02-14 |
US20140152880A1 (en) | 2014-06-05 |
US9160951B2 (en) | 2015-10-13 |
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