WO2004076534A1 - カチオン硬化性含ケイ素化合物の製造方法 - Google Patents
カチオン硬化性含ケイ素化合物の製造方法 Download PDFInfo
- Publication number
- WO2004076534A1 WO2004076534A1 PCT/JP2004/002285 JP2004002285W WO2004076534A1 WO 2004076534 A1 WO2004076534 A1 WO 2004076534A1 JP 2004002285 W JP2004002285 W JP 2004002285W WO 2004076534 A1 WO2004076534 A1 WO 2004076534A1
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- WIPO (PCT)
- Prior art keywords
- group
- compound
- represented
- siloxane bond
- following formula
- Prior art date
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- 150000003377 silicon compounds Chemical class 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 22
- 125000003566 oxetanyl group Chemical group 0.000 claims abstract description 30
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 17
- 125000000524 functional group Chemical group 0.000 claims abstract description 14
- 125000003118 aryl group Chemical group 0.000 claims abstract description 13
- 125000000753 cycloalkyl group Chemical group 0.000 claims abstract description 11
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 11
- 238000009835 boiling Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 239000002210 silicon-based material Substances 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 18
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 230000002378 acidificating effect Effects 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 238000009833 condensation Methods 0.000 abstract description 14
- 239000003377 acid catalyst Substances 0.000 abstract description 9
- 230000005494 condensation Effects 0.000 abstract description 6
- 125000004356 hydroxy functional group Chemical group O* 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 35
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 34
- 150000001875 compounds Chemical class 0.000 description 32
- 238000006460 hydrolysis reaction Methods 0.000 description 28
- 239000000047 product Substances 0.000 description 28
- 230000007062 hydrolysis Effects 0.000 description 27
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 19
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 15
- 239000002994 raw material Substances 0.000 description 14
- 238000006482 condensation reaction Methods 0.000 description 10
- 150000002894 organic compounds Chemical class 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 125000003545 alkoxy group Chemical group 0.000 description 7
- -1 siloxane, siloxane skeleton Chemical group 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 125000002091 cationic group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 5
- 125000004104 aryloxy group Chemical group 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 125000000000 cycloalkoxy group Chemical group 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- MLIREBYILWEBDM-UHFFFAOYSA-N cyanoacetic acid Chemical compound OC(=O)CC#N MLIREBYILWEBDM-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- MDLRQEHNDJOFQN-UHFFFAOYSA-N methoxy(dimethyl)silicon Chemical compound CO[Si](C)C MDLRQEHNDJOFQN-UHFFFAOYSA-N 0.000 description 2
- RSRCJPGCPWEIHN-UHFFFAOYSA-N methoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[SiH](OC)C1=CC=CC=C1 RSRCJPGCPWEIHN-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- YQJPWWLJDNCSCN-UHFFFAOYSA-N 1,3-diphenyltetramethyldisiloxane Chemical compound C=1C=CC=CC=1[Si](C)(C)O[Si](C)(C)C1=CC=CC=C1 YQJPWWLJDNCSCN-UHFFFAOYSA-N 0.000 description 1
- GVJSGABMOHZNSD-UHFFFAOYSA-N 1-triphenylsilylethanone Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C(=O)C)C1=CC=CC=C1 GVJSGABMOHZNSD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- OMBADDZNTSOLPP-UHFFFAOYSA-N benzhydryloxy(methyl)silane Chemical compound C=1C=CC=CC=1C(O[SiH2]C)C1=CC=CC=C1 OMBADDZNTSOLPP-UHFFFAOYSA-N 0.000 description 1
- SEGBQNJGOCXIGC-FHERZECASA-N benzyl n-[(2s)-1-[(4-hydroxyoxolan-3-yl)amino]-4-methyl-1-oxopentan-2-yl]carbamate Chemical compound N([C@@H](CC(C)C)C(=O)NC1C(COC1)O)C(=O)OCC1=CC=CC=C1 SEGBQNJGOCXIGC-FHERZECASA-N 0.000 description 1
- RFXODRCAZTVEOH-UHFFFAOYSA-N benzyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)CC1=CC=CC=C1 RFXODRCAZTVEOH-UHFFFAOYSA-N 0.000 description 1
- WCHNCRPGOCEXPK-UHFFFAOYSA-N butyl(trimethoxy)silane;triethoxy(propyl)silane Chemical compound CCCC[Si](OC)(OC)OC.CCC[Si](OCC)(OCC)OCC WCHNCRPGOCEXPK-UHFFFAOYSA-N 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- ATGKAFZFOALBOF-UHFFFAOYSA-N cyclohexyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C1CCCCC1 ATGKAFZFOALBOF-UHFFFAOYSA-N 0.000 description 1
- MEWFSXFFGFDHGV-UHFFFAOYSA-N cyclohexyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C1CCCCC1 MEWFSXFFGFDHGV-UHFFFAOYSA-N 0.000 description 1
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- DRUOQOFQRYFQGB-UHFFFAOYSA-N ethoxy(dimethyl)silicon Chemical compound CCO[Si](C)C DRUOQOFQRYFQGB-UHFFFAOYSA-N 0.000 description 1
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical compound CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 description 1
- ZVJXKUWNRVOUTI-UHFFFAOYSA-N ethoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OCC)C1=CC=CC=C1 ZVJXKUWNRVOUTI-UHFFFAOYSA-N 0.000 description 1
- PQVKZMRAPBTIQM-UHFFFAOYSA-N ethoxy-methoxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](OC)(OCC)C1=CC=CC=C1 PQVKZMRAPBTIQM-UHFFFAOYSA-N 0.000 description 1
- ADLWTVQIBZEAGJ-UHFFFAOYSA-N ethoxy-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(OCC)C1=CC=CC=C1 ADLWTVQIBZEAGJ-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229940071870 hydroiodic acid Drugs 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- FUMSHFZKHQOOIX-UHFFFAOYSA-N methoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OC FUMSHFZKHQOOIX-UHFFFAOYSA-N 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- RFGGTTPASBFBTB-UHFFFAOYSA-N methyl-[methyl(diphenyl)silyl]oxy-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C)O[Si](C)(C=1C=CC=CC=1)C1=CC=CC=C1 RFGGTTPASBFBTB-UHFFFAOYSA-N 0.000 description 1
- HLXDKGBELJJMHR-UHFFFAOYSA-N methyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](C)(OC(C)C)OC(C)C HLXDKGBELJJMHR-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- REOJLIXKJWXUGB-UHFFFAOYSA-N mofebutazone Chemical group O=C1C(CCCC)C(=O)NN1C1=CC=CC=C1 REOJLIXKJWXUGB-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- HUZZQXYTKNNCOU-UHFFFAOYSA-N triethyl(methoxy)silane Chemical compound CC[Si](CC)(CC)OC HUZZQXYTKNNCOU-UHFFFAOYSA-N 0.000 description 1
- WILBTFWIBAOWLN-UHFFFAOYSA-N triethyl(triethylsilyloxy)silane Chemical compound CC[Si](CC)(CC)O[Si](CC)(CC)CC WILBTFWIBAOWLN-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 1
- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 1
- VFFKJOXNCSJSAQ-UHFFFAOYSA-N trimethylsilyl benzoate Chemical compound C[Si](C)(C)OC(=O)C1=CC=CC=C1 VFFKJOXNCSJSAQ-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
Definitions
- the present invention relates to a method for producing a cationically curable silicon-containing compound having an oxetanyl group using a hydrolysis condensation reaction.
- the cationically curable silicon-containing compound obtained by the present invention has excellent curability and ability to form a high-hardness film, and is therefore useful as a hard coat agent or a raw material for a protective film of various base materials. Since the ratio of inorganic components can be increased, it is also useful as a resist raw material. High storage stability! /, Handling, easy, without the need to store in the refrigerator. Background art
- radical polymerization is inhibited by oxygen in the air, it is necessary to carry out polymerization under an inert atmosphere in order to rapidly and completely polymerize radically polymerizable monomers.
- the cationically polymerizable monomer is not subject to polymerization inhibition by oxygen, it can be completely polymerized even in air.
- cationic polymerizable monomer compounds having an epoxy group, a vinyl ether group, and an oxetanyl group are known.
- Epoxy group-containing cationically polymerizable monomers can provide cured materials with good heat resistance, excellent adhesive strength, and good chemical resistance. It is a material that is difficult to use in an environment where productivity is called for.
- the cationically polymerizable monomer having a vinyl ether group has a relatively high cationic curability and a performance that is + minute in terms of productivity.
- the cured product is soft and hard coat agent as the object of the present invention. Or as a protective film for various substrates.
- the other is a method using a hydrolysis condensation reaction, which is considered to be an industrially advantageous method because inexpensive raw materials can be used and the catalyst can be easily removed.
- JP-A-11-129640 discloses a method for producing a cationically curable composition comprising a sinoresesquioxane compound having an oxetanyl group, which is represented by the following structural formula (5).
- a method for producing a cationically curable composition in which the compound to be hydrolyzed in an atmosphere having a pH of 7 or more is disclosed.
- R is an organic functional group having an epoxy group or an oxetanyl group
- X is a hydrolyzable group.
- JP-A No. 11-29640 and JP-A No. 11-199673 disclose a method for producing a cationically curable resin composition in which a hydrolytic condensation reaction is performed in the presence of an alkaline catalyst such as ammonia. In addition, in the step after the hydrolysis condensation reaction, very complicated operation was required to remove the alkaline catalyst.
- JP-A-10-59984 discloses a oligomer mixture of condensed alkylalkoxysilanes.
- the process for producing this mixture is based on the fact that the silane used is an alkyltrialkoxysilane having an alkyl group having 3 to 18 carbon atoms and a methoxy and / or ethoxy group as an alkoxy group, and the use of water exceeding 1 mole per mole of Sil.
- JP-A-8-113648 vinyl trialkoxysilane or an organotrialkoxysilane having a vinyl group as a substituent and another organotrialkoxysilane are mixed and mixed with water in the presence of an acid catalyst. After the reaction and hydrolysis / polycondensation of the trialkoxysilane, the obtained polymer is reacted with a silylating agent without isolation to obtain a polymer.
- a process for producing a terminal silylated polysilsesquioxane which is characterized in that the terminal group of the coalesced is silylated.
- the reason for using the acid catalyst in this publication is that the polysilsesquioxane production step and the silylation step can be performed in a series of one-pot steps.
- the method for producing a terminal silylated polysilsesquioxane disclosed in the publication there is no compound having a highly cationically polymerizable functional group such as an oxetanyl group in the starting alkoxysilane to be brought into contact with an acid catalyst, and the acid catalyst is used as an oxetanyl group.
- a force-thione-curable silicon-containing compound having the following formula:
- JP-A-2001-31767 discloses an epoxy-functional organopolysiloxane resin.
- One of the objects of the publication is to provide an epoxy-functional organopolysiloxane resin capable of hydrolyzing and condensation-polymerizing an epoxy group-containing trialkoxysilane and specific silanes to obtain an amine-curable epoxy-functional organopolysiloxane resin.
- the gazette discloses that an acid catalyst is also acceptable in the hydrolysis / condensation step.There is no description about the oxetane compound. There is no disclosure or suggestion that it is applicable to manufacturing. Disclosure of the invention
- An object of the present invention is to provide a method for producing a highly curable, cationically curable silicon-containing compound.
- the present inventors have avoided the study under alkaline conditions that require a purification step by a neutralization treatment step to solve the above problems, and studied a production method under neutral or acidic conditions.
- the present inventors have found that a cationically curable silicon-containing compound having excellent storage stability and curability can be obtained without a neutralization treatment step, thereby completing the present invention.
- the present invention provides an organosilicon compound (A) represented by the following formula (1) and an organosilicon compound (B) represented by the following formula (2) when the pKa at 25 ° C is 5 or less. And the boiling point under atmospheric pressure Cation characterized by hydrolysis co-condensation in the presence of an acidic catalyst at 150 ° C or lower
- R is an organic functional group having an oxetanyl group
- X is a siloxane bond-forming group
- Xs may be the same or different from each other, and may be different.
- R 2 is an alkyl group, a cycloalkyl group or an aryl group, and ⁇ is an integer of 0 to 2.
- the present invention provides an organosilicon compound ( ⁇ ) represented by the following formula (1) and an organosilicon compound having a siloxane bond-forming group represented by the following formula (2) and having no oxetanyl group:
- a method for producing a cationically curable silicon-containing compound, comprising hydrolyzing and condensing a compound ( ⁇ ) and an organic silicon compound (C) represented by the following formula (3) in the presence of an acidic catalyst. is there.
- R is an organic functional group having an oxetanyl group
- X is a siloxane bond-forming group
- Xs may be the same or different from each other.
- X is a siloxane bond-forming group, is an alkyl group, a cycloanoalkyl group or an aryl group, and n is an integer of 0 to 2.
- the raw materials in the present invention are the following organic silicon compounds.
- the organosilicon compound (A) in the present invention is a compound represented by the following formula (1).
- R is an organic functional group having an oxetanyl group
- X is a siloxane bond-forming group
- Xs may be the same or different.
- the siloxane bond forming group X in the above formula (1) is not particularly limited as long as it is a group having hydrolyzability.
- Preferred X is a halogen atom, an alkoxy group, a cycloalkoxy group or an aryloxy group, and more preferred X is an alkoxy group, a cycloalkoxy group or an aryloxy group. This is because, in the case of an X-carbogen atom, hydrogen halide is generated by hydrolysis, so that the reaction system becomes a strongly acidic atmosphere and the oxetanyl group may be opened soon due to this.
- alkoxy group examples include a methoxy group, an ethoxy group, an n- and i-propoxy group, an n-, an i-thio-t-butoxy group and the like.
- cycloanoreoxy group Represents a cyclohexyloxy group and the like
- aryloxy group include a phenyloxy group.
- X is preferably an alkoxy group having 1 to 3 carbon atoms because the alkoxy group has good hydrolyzability. Also, the availability of raw materials is easy and the hydrolysis reaction is easy to control! X is, therefore, particularly preferred, X is an ethoxy group.
- R in the above formula (1) is an organic functional group having an oxetanyl group.
- R in the present invention Is one having 20 or less carbon atoms, and is particularly preferable R.
- R s is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 7 is an alkylene group having 2 to 6 carbon atoms.
- R s is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and is preferably an ethyl group.
- R7 is an alkylene group having 2 to 6 carbon atoms, preferably a propylene group. This is because it is easy to obtain or synthesize such an oxetane compound which forms an organic functional group. Further, if the number of carbon atoms of R s or R 7 in the formula (3) is 7 or more, the surface hardness of the cured product tends to be insufficient, which is not preferable.
- the organic silicon compound (B) in the present invention is an organic silicon compound having a siloxane bond forming group and no oxetanyl group, and a preferred example is a compound represented by the following formula (2).
- R 2 is an alkyl group, a cycloalkyl group or an aryl group, and n is an integer of 0 to 2.
- X “siloxane bond forming group” means a group capable of forming a siloxane bond between a silicon atom of the compound represented by the structural formula shown in the above formula (1) by hydrolysis.
- examples thereof include a hydrogen atom, a hydroxyl group, an alkoxy group, a cycloalkoxy group, an aryloxy group, a halogen atom and the like. Preferred are those other than these ⁇ and halogen atoms. This is because, when X ′ is a halogen atom, a halogenated hydrogen is generated by hydrolysis, so that the reaction system becomes a strongly acidic atmosphere, which may cause ring opening of the oxetanyl group and the like.
- R 2 in the above formula (2) is an alkyl group, a cycloalkyl group or an aryl group.
- the alkyl group preferably has 1 to 6 carbon atoms, and more preferably has 1 to 4 carbon atoms.
- Preferred examples of the alkyl group include a methyl group, an ethyl group, an n- and i-propyl group, an n-, i- and t-butyl group, and the like.
- Examples of the “cycloalkynole group” include a cyclohexyl group and the like, and examples of the “aryl group” include a phenyl group and the like.
- specific examples include tetramethoxysilane and tetraethoxysilane. That is, when n is 1, specifically, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane, methyltriisopropoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltriethoxysilane Butyltrimethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, phenyltrimethoxysilane and phenyltriethoxysilane.
- n 2
- the compound represented by the above formula (2) reduces the concentration of oxetanyl groups in the cationically curable silicon-containing compound, thereby lowering the viscosity or lowering the cross-linking density without lowering the molecular weight of the cinoresesquioxane compound.
- particularly preferred examples include methyltrimethoxysilane and methyltriethoxysilane.
- the organosilicon compound (C) in the present invention is represented by the following formula (3), and is bonded to a terminal silanol group generated in the hydrolysis-condensation process in the present invention to form a cationic curable composition obtained by the present invention. It is a component having the effect of improving storage stability.
- Y is a hydroxyl group or a siloxane bond forming group
- R 2 is an alkyl group, a cycloalkyl group or an aryl group.
- R 2 in the above formula (3) is an alkyl group, a cycloalkyl group or an aryl group.
- Preferred alkyl groups have 1 to 6 carbon atoms, and more preferably 1 to 4 carbon atoms.
- Preferred examples of the alkynole group include, for example, a methyl group, an ethyl group, n- and i-propynole groups, n-, i- and 1: monobutyl groups.
- Examples of the “cycloalkyl group” include a cyclohexyl group and the like, and examples of the “aryl group” include a phenyl group and the like.
- the organic silicon compound represented by the above formula (3) is exemplified below.
- the production method of the present invention uses the above raw materials at 25 ° C! ) Ka is 5 or less, and the hydrolysis co-condensation is carried out in the presence of an acidic catalyst having a boiling point at atmospheric pressure S150 ° C or less. Thereafter, a step of removing the organic solvent used in the hydrolysis condensation reaction step is performed.
- organic silicon compounds (A) and organic silicon compounds Compound (B) and organosilicon compound (C) are charged at once (hereinafter referred to as the batch charging method), and after hydrolytic cocondensation of organosilicon compound (A) and organosilicon compound (B)
- a split charging method there is a method of adding an organic silicon compound (C) to the reaction system.
- the charging ratio of the organic compounds A to C which are the raw material compounds, except that at least the organic compound A and the organic compound B are used in combination.
- the preferable charging ratio of the organic compound B is 0.01 to 99 mol, more preferably 1 to 90 mol, per 1 mol of the raw material compound A.
- the ratio of the organic compound (C) is preferably less than the total amount of the siloxane bond forming groups (X) in the organic compound (A) and the organic compound (B).
- the amount of the organic compound (C) is preferably less than [3a + (4-n) b] mole.
- the amount of water used in the hydrolysis co-condensation step is 0.1%, assuming that the amount of water required to completely hydrolyze the siloxane bond-forming groups in the organosilicon compounds (A) and (B) is one equivalent. 5 to: It is preferred to use 10 equivalents, especially 1.5 to 5 equivalents.
- the system when co-hydrolyzing the compound represented by the above formula (1), the system is preferably set to an acidic atmosphere having a pH of 0.5 to 4.5.
- the pH is less than 0.5, most of the oxetanyl groups are opened, and the photocurability is significantly reduced.
- the rate of hydrolysis and condensation reaction decreases, and the production takes a long time.
- the hydrolysis of the organosilicon compound (A) does not completely proceed, so that a desired cationically curable silicon-containing compound cannot be obtained.
- the cocondensation of the organic silicon compound (A) and the organic silicon compound (B), or the cocondensation of these with the organic silicon compound (C) may cause gelling under an alkaline atmosphere of pH 7 or more depending on the combination. It happens and cannot be manufactured at all.
- the acidic catalyst When the atmosphere during hydrolysis is pHO.5 to 4.5 as described above, the acidic catalyst has a pKa at 25 ° C of 5 or less and a boiling point at atmospheric pressure of 150 ° C or less.
- Preferred acidic catalysts include hydrofluoric acid, hydroiodic acid, hydrobromic acid, hydrochloric acid, sulfurous acid, cyanoacetic acid, formic acid, acrylic acid, p-toluenesulfonic acid, acetic acid, lactic acid, and the like. Among them, preferred is Shii-Danilo Hydrogen Acid, which is easily available.
- the organic solvent used in the hydrolysis is not particularly limited, and examples thereof include alcohols such as methyl alcohol, ethyl alcohol, and isopropyl alcohol; ketones such as acetone and methyl ethyl ketone; tetrahydrofuran, toluene, Kisane, rig mouth in and the like can be used. It is preferable that the reaction system is made a uniform solution by using one or more of these mixed solvents.
- the preferred reaction temperature at the time of hydrolysis is 10 to 120 ° C, more preferably 20 to 80 ° C, regardless of the type of the starting compound, and is common to the batch charging method and the split charging method.
- a suitable reaction time for the hydrolysis is 2 to 30 hours, more preferably 4 to 24 hours.
- the cationically curable silicon-containing compound (hereinafter abbreviated as a co-condensate) formed by the hydrolytic co-condensation of the organic silicon compounds (A) and (B) is a compound having a hydrolyzable group in the above formulas (1) and (2).
- X includes a silsesquioxane compound having a three-dimensional (Si—O—Si) bond formed by hydrolysis and having an oxetanyl group.
- Cationic curable silicon-containing compounds formed by hydrolysis and co-condensation of organic silicon compounds (A) to (C) are commonly used in the batch charging method and the split charging method.
- the siloxane bond forming group X in the above formulas (1) and (2) consists of a one-dimensional to three-dimensional (Si-O-Si) bond formed by hydrolysis, and the terminal of the formula (3)
- the compound has a condensed structure.
- the co-condensate may contain a linear silicone compound. Further, the co-condensate may contain a silsesquioxane compound having a nose-like, cage-like or random-like structure.
- the co-condensate may contain only one kind of silsesquioxane conjugate, or may contain two or more kinds of silsesquioxane conjugates having different structures or different molecular weights.
- the co-condensate is The force S varies greatly depending on the types and composition ratios of the mechanical silicon compounds (A) to (C). When manufactured by the batch charging method, it contains a linear silicone compound. In some cases, including a three-dimensional silsesquioxane compound! /, Often.
- substantially all of the hydrolyzable groups preferably 90% or more of the hydrolyzable groups in the organic silicon compounds (A) and (B) are preferably condensed. It is more preferable that If the ratio of the remaining hydrolyzable groups exceeds 10%, the silsesquioxane structure is not sufficiently formed, and thus the hardness of the film may be reduced or the storage stability of the composition may be reduced.
- substantially all of the hydrolyzable groups are condensed means, for example, that no peak based on the hydrolyzable group is observed in the NMR chart of the obtained silsesquioxane compound. You can check.
- the co-condensate comprises a silsesquioxane compound having a reduced oxetanyl group equivalent. This compound is useful as a material having a low viscosity and having a reduced cure shrinkage immediately after handling.
- the co-condensate can be reduced in viscosity and easy to handle because the molecular weight of the co-condensate itself can be reduced in the batch charging method.
- the resulting co-condensate has a high molecular weight, but the silanol groups in the product are end-cabbed by the organic silicon compound (C). No hydrogen bonding between them, lower viscosity, easy handling.
- the silanol group in the product is end-caved, the product can be obtained with extremely little change over time, high storage stability, and a product.
- the number average molecular weight of the co-condensate obtained according to the present invention is preferably from 600 to 5,000, more preferably from 1,000 to 3,000. If the number average molecular weight is less than 600, a film formed with the composition may not have sufficient hardness. Further, since the viscosity of the composition becomes low, when this composition is used as a node cord composition, squeezing tends to occur on the coated surface. On the other hand, if the number average molecular weight exceeds 5,000, the viscosity of the composition becomes too high, which makes the composition difficult to handle and reduces the coatability when this composition is used as a node code composition.
- this composition when used as a node coat agent composition, 50% by weight or more of the entire cocondensate is composed of a silsesquioxane disulfide compound having a number average molecular weight of 1,000 to 3,000.
- a silsesquioxane disulfide compound having a number average molecular weight of 1,000 to 3,000.
- the number average molecular weight in the present specification It is the molecular weight in terms of polystyrene measured by gel permeation 'chromatography (GPC).
- the above product was stored in a dark place at 25 ° C for 3 months, and the solubility in THF and the viscosity were measured.
- the solubility in THF was good, and the viscosity was 52000 mPa's (viscosity increase rate 163%).
- the solubility in THF was good, and the viscosity was 52000 mPa's (viscosity increase rate 163%).
- a reactor equipped with a stirrer and a thermometer was charged with 167 g of isopropyl alcohol, 15 g (0.3 mol) of Oxe-TRIE S95, and 72 llg (0.3 mol) of phenyltriethoxysilane, and then 1% hydrochloric acid. 7g (H 2 0;. l 8mol, HC1; 9mmol) was added slowly, and ⁇ at 25 ° C. The progress of the reaction was monitored by gel permeation chromatography, and Oxe-TRIES almost disappeared. The reaction was completed when it was lost (20 hours after the start of the addition of the mixture).
- a reactor equipped with a stirrer and a thermometer was charged with 50 g of isopropyl alcohol, 32.05 g (0.lmol) of Oxe-TRIES and 10.42 g (0.05 mol) of tetraethoxysilane, and 7.28 g of 1% hydrochloric acid ( H 2 O; 0.40 mol, HCl; 2 mmol) were gradually added, and the mixture was stirred at 25 ° C. The progress of the reaction was monitored by gel permeation chromatography, and the reaction was completed when Oxe-TRIES almost disappeared (20 hours after the start of the addition of the mixture).
- a colorless and transparent product having a viscosity of 33,000 mPa ⁇ s was obtained in the same manner as in Example 1 except that 200 g of methyl ethyl ketone was used.
- the above product was stored in a dark place at 25 ° C for 3 months, and the solubility in THF and the viscosity were measured.
- the solubility in THF was good, and the viscosity was 53000 mPa's (viscosity increase rate 161%).
- the solubility in THF was good, and the viscosity was 53000 mPa's (viscosity increase rate 161%).
- a reactor equipped with a stirrer and a thermometer was charged with 2 OO g of isopropynole alcohol, 13 g (0.25 mol) of Oxe-TRIE S80 and 126.59 g (0.71 mol) of methyltriethoxysilane, and then purified water 51 . 71g (H 2 0; 2. 87iriol) was added slowly, and stirred at 65 ° C. The progress of the reaction was monitored by gel permeation chromatography. 20 hours after the start of the addition of the mixture, the Oxe-TRIES peak did not disappear, and the product could not be obtained.
- a reactor equipped with a stirrer and a thermometer was charged with 60 g of isopropyl alcohol, 115.38 g (360 mmol) of Oxe-TRIES, 32.09 g (180 mmol) of methyltriethoxysilane, and 14.62 g (90 mmol) of hexamethyldisiloxane. 29.2 g of 1% hydrochloric acid was gradually added thereto, followed by stirring at 25 ° C. The progress of the reaction was monitored by gel permeation chromatography, and the reaction was completed when Oxe-TRIE S had almost disappeared (the starting power of the mixture in the mixture was also 20 hours later). Subsequently, the solvent was distilled off under reduced pressure, a colorless and transparent, to obtain a product of viscosity 6600iriP a 'S.
- the above product was stored in a dark place at 25 ° C for 3 months, and the solubility in THF and the viscosity were measured.
- the solubility in THF was good, and the viscosity was 6700 mPa's (viscosity increase rate 102%). Met.
- a reactor equipped with a stirrer and a thermometer was charged with 50 g of isopropyl alcohol, 32.05 g (100 mmol) of Oxe-TRIES and 17.83 g (100 mmol) of methyltriethoxysilane, and 1 g of 1% hydrochloric acid was gradually added. And stirred at 25 ° C. The progress of the reaction was monitored by gel permeation chromatography, and when Oxe-TRIES almost disappeared (20 hours after the start of the addition of the mixture), 0.65 g (4 mmol) of hexamethyldisiloxane was added dropwise. The mixture was heated and stirred at 50 ° C for 1 hour.
- the composition was applied on a glass substrate to a thickness of about 20 ⁇ using a bar coater, irradiated with ultraviolet rays under the following conditions, and the number of times of irradiation until the surface became tack-free was measured.
- Lamp 80W / cm high pressure mercury lamp
- Pencil hardness Each composition was applied to a thickness of about 20 ⁇ m on a steel plate and a glass substrate using a bar coater, and irradiated with ultraviolet light under the above irradiation conditions to obtain a cured film.
- the pencil hardness of the surface was measured according to JIS K5400, and the results are shown in Table 2 below.
- the product obtained by the production method of the present invention has an oxetaninole group, so that it exhibits excellent cation curability, and the resulting cured film is composed of a cinoresesquioxane compound. Very hard due to being a film.
- Table 2
- the method for producing the cationically curable resin composition of the present invention does not require a neutralization step after the hydrolysis-condensation reaction, and can be easily purified by simply removing the organic solvent by a normal distillation operation. It is useful as a production method with a high productivity of a cationically curable resin composition in which the number of steps after hydrolytic condensation is small as compared with the production method.
- the production method of the present invention requires only a small amount of waste, so that the burden on the environment is small.
- composition obtained by the production method of the present invention has high storage stability, it does not need to be stored in a refrigerator and is easy to handle.
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Description
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EP04714889A EP1598389A4 (en) | 2003-02-27 | 2004-02-26 | METHOD FOR PRODUCING A CATIONICALLY HARDENABLE SILICONE COMPOUND |
JP2005502929A JPWO2004076534A1 (ja) | 2003-02-27 | 2004-02-26 | カチオン硬化性含ケイ素化合物の製造方法 |
US10/547,429 US20070055034A1 (en) | 2003-02-27 | 2004-02-26 | Process for producing cation-curable silicon compound |
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- 2004-02-26 WO PCT/JP2004/002285 patent/WO2004076534A1/ja not_active Application Discontinuation
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WO2009131038A1 (ja) | 2008-04-22 | 2009-10-29 | 東亞合成株式会社 | 硬化性組成物及び有機ケイ素化合物の製造方法 |
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Also Published As
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KR20050106458A (ko) | 2005-11-09 |
EP1598389A4 (en) | 2006-06-21 |
US20070055034A1 (en) | 2007-03-08 |
JPWO2004076534A1 (ja) | 2006-06-01 |
EP1598389A1 (en) | 2005-11-23 |
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