WO2010073933A1 - オキセタニル基を有するケイ素化合物の製造方法 - Google Patents
オキセタニル基を有するケイ素化合物の製造方法 Download PDFInfo
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- WO2010073933A1 WO2010073933A1 PCT/JP2009/070845 JP2009070845W WO2010073933A1 WO 2010073933 A1 WO2010073933 A1 WO 2010073933A1 JP 2009070845 W JP2009070845 W JP 2009070845W WO 2010073933 A1 WO2010073933 A1 WO 2010073933A1
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- silicon compound
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- 150000003377 silicon compounds Chemical class 0.000 title claims abstract description 192
- 125000003566 oxetanyl group Chemical group 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000008569 process Effects 0.000 title claims abstract description 16
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims abstract description 87
- 238000006243 chemical reaction Methods 0.000 claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 claims abstract description 30
- 125000003158 alcohol group Chemical group 0.000 claims abstract description 17
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims description 47
- 125000003545 alkoxy group Chemical group 0.000 claims description 33
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 125000000962 organic group Chemical group 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 125000004104 aryloxy group Chemical group 0.000 claims description 6
- 125000000000 cycloalkoxy group Chemical group 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 claims 1
- 238000001879 gelation Methods 0.000 abstract description 26
- 230000002378 acidificating effect Effects 0.000 abstract description 9
- 238000006482 condensation reaction Methods 0.000 abstract description 7
- 238000007142 ring opening reaction Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 54
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 42
- 235000019441 ethanol Nutrition 0.000 description 30
- 239000000047 product Substances 0.000 description 30
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 26
- 239000003960 organic solvent Substances 0.000 description 25
- 239000000243 solution Substances 0.000 description 24
- 150000001875 compounds Chemical class 0.000 description 21
- 238000006460 hydrolysis reaction Methods 0.000 description 21
- 150000003961 organosilicon compounds Chemical class 0.000 description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 19
- 239000000203 mixture Substances 0.000 description 19
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 19
- 238000005406 washing Methods 0.000 description 18
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- 230000007062 hydrolysis Effects 0.000 description 16
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- -1 1-propoxy compound Chemical class 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 14
- 239000000499 gel Substances 0.000 description 13
- 239000002994 raw material Substances 0.000 description 13
- 238000005481 NMR spectroscopy Methods 0.000 description 12
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- 238000006386 neutralization reaction Methods 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 229910017604 nitric acid Inorganic materials 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000014759 maintenance of location Effects 0.000 description 7
- OUCALNIJQUBGSL-UHFFFAOYSA-M methanol;tetramethylazanium;hydroxide Chemical compound [OH-].OC.C[N+](C)(C)C OUCALNIJQUBGSL-UHFFFAOYSA-M 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 239000007810 chemical reaction solvent Substances 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000002102 aryl alkyloxo group Chemical group 0.000 description 4
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- NSGDYZCDUPSTQT-UHFFFAOYSA-N N-[5-bromo-1-[(4-fluorophenyl)methyl]-4-methyl-2-oxopyridin-3-yl]cycloheptanecarboxamide Chemical compound Cc1c(Br)cn(Cc2ccc(F)cc2)c(=O)c1NC(=O)C1CCCCCC1 NSGDYZCDUPSTQT-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- 125000005975 2-phenylethyloxy group Chemical group 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000003868 ammonium compounds Chemical class 0.000 description 2
- 125000000051 benzyloxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])O* 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 2
- 229960001231 choline Drugs 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 2
- 125000001887 cyclopentyloxy group Chemical group C1(CCCC1)O* 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000006606 n-butoxy group Chemical group 0.000 description 2
- 125000005186 naphthyloxy group Chemical group C1(=CC=CC2=CC=CC=C12)O* 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FSRHFTKAMSLMBK-UHFFFAOYSA-N 3-[(3-ethyloxetan-3-yl)methoxy]propyl-trimethoxysilane Chemical compound CO[Si](OC)(OC)CCCOCC1(CC)COC1 FSRHFTKAMSLMBK-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000006136 alcoholysis reaction Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
- C07F7/0872—Preparation and treatment thereof
- C07F7/0874—Reactions involving a bond of the Si-O-Si linkage
Definitions
- the present invention relates to a method for producing a silicon compound having an oxetanyl group. More specifically, the conventional manufacturing method relates to a manufacturing method capable of manufacturing a silicon compound having a composition that gels during the reaction at a high concentration without causing gelation.
- Non-Patent Document 1 tetraethoxysilane, which is a SiX 4 type silicon compound, is hydrolyzed by both an acid and an alkaline catalyst, whereas monomethyltriethoxysilane, which is an RSiX 3 type, reacts with an acid catalyst but is alkaline. It is described that the catalyst hardly reacts.
- Patent Document 1 describes that an acid catalyst causes ring opening of an oxetanyl group, and hydrolytic polycondensates a silicon compound having an oxetanyl group and three hydrolyzable groups under alkaline conditions. Thus, a method for producing a condensed silicon compound having an oxetanyl group is disclosed.
- Patent Document 2 a silicon compound having an oxetanyl group and having three hydrolyzable groups is hydrolyzed and co-condensed under alkaline conditions together with a reactive silicone having one or more siloxane bond-forming groups in one molecule. It is disclosed that a cured product of the obtained condensate is excellent in stain resistance due to the effect of the silicone chain.
- Patent Document 3 discloses a method for producing a condensed silicon compound having an oxetanyl group, in which a silicon compound having an oxetanyl group and having three hydrolyzable groups is hydrolytically polycondensed in the presence of an acidic catalyst. It is disclosed.
- the film obtained by curing the condensed silicon compound obtained by this method has a remarkably superior result of the pencil hardness test as compared with the cured film containing silicone disclosed in the example of Patent Document 2, and the surface hardness is obtained. Suitable for the intended use.
- Patent Document 3 illustrates in Example 8 a specific example in which a silicon compound having four siloxane bond-forming groups and a silicon compound having three hydrolyzable groups are co-condensed with an acidic catalyst.
- the evaluation of the cured product of the silicon compound obtained by hydrolysis copolycondensation was not different from the case of using the silicon compound having three siloxane bond-forming groups.
- co-condensation of a silicon compound having an oxetanyl group and having three hydrolyzable groups and a silicon compound having four siloxane bond-forming groups under alkaline conditions suggests the possibility of gelation. It can be said that the literature and prior literature suggesting that no special effects are expected.
- An object of the present invention is to provide a method capable of producing a silicon compound having an oxetanyl group and capable of giving a cured product having a high surface hardness at a high concentration without causing a gelation problem during the reaction. To do.
- a first step of subjecting a silicon compound (A) having four siloxane bond-forming groups and a silicon compound (B) having an oxetanyl group to an alcohol exchange reaction with 1-propanol, and a silicon compound (AP ), (BP) can be obtained by a production method including hydrolysis and copolycondensation at a specific ratio under alkaline conditions without causing gelation without causing a silicon compound (C) having an oxetanyl group.
- the present invention was completed.
- the silicon compound (C) can be produced from an inexpensive raw material without causing gelation.
- the obtained silicon compound (C) is soluble in a solvent and can be easily applied to various uses.
- the silicon compound (C) obtained by the production method of the present invention does not cause thickening or gelation during storage, and has excellent stability.
- the method has an effect that it is difficult to cause a gelation problem during the reaction even at a high concentration.
- the reason why the silicon compound (C) is excellent in storage stability is mainly due to the second step of the present invention using an alkaline catalyst.
- the hydrolysis reaction under acidic conditions often results in insufficient reaction, and the content of unreacted alkoxy groups may increase compared to the hydrolysis reaction under alkaline conditions.
- silicon compounds produced by hydrolysis and copolycondensation under acidic conditions contain siloxane bond-forming groups such as unreacted alkoxy groups, and the unreacted groups gradually crosslink during storage, resulting in increased viscosity. And may cause problems such as gelation.
- an alkaline catalyst is essential, and unreacted siloxane bond-forming groups are unlikely to remain. Therefore, the resulting silicon compound (C) has excellent storage stability and can be stored for a long time. However, there is an effect that high viscosity and gelation hardly occur.
- the hydrolysis reaction under alkaline conditions tends to proceed, but there is a problem that gel is likely to occur during the condensation reaction.
- a curable silicon-containing compound produced using a silicon compound having four siloxane bond-forming groups (referred to as Q monomer) has excellent curability, and the resulting cured product has high surface hardness.
- Q monomer a curable silicon-containing compound produced using a silicon compound having four siloxane bond-forming groups
- a silicon compound (A) having four siloxane bond-forming groups and a silicon compound (B) having an oxetanyl group are subjected to an alcohol exchange reaction in 1-propanol.
- the production method using alcohol exchange of the present invention is more effective than the case where the siloxane bond-forming group of the silicon compound (A) and the hydrolyzable group of (B) are all 1-propoxy groups.
- the results are superior in the results, but in the first place also in the production of the silicon compounds (A) and (B), 1-propanol is low in reactivity, so that the 1-propoxy compound is industrially Since it is expensive and difficult to obtain, the present invention is also economically superior in this sense.
- the silicon compound (A) represented by the general formula (1) and the silicon compound (B) represented by the general formula (2) are mixed in 1-propanol. And a second step of hydrolyzing and copolycondensing the composition obtained by the above reaction under alkaline conditions.
- the silicon compound (C) obtained by the present invention comprises a silicon compound (A), a silicon compound (referred to as AP) generated from the silicon compound (A) in the first step, a silicon compound (B), and a silicon compound ( It is produced by hydrolysis copolycondensation with a silicon compound (referred to as BP) derived from B).
- the silicon compound (C) Can be said to be a polysiloxane composed of a three-dimensional siloxane bond (Si—O—Si) formed by hydrolysis of a siloxane bond-forming group, a hydrolyzable group and an n-propoxy group.
- the silicon compound (C) has an organic part containing a carbon atom and an inorganic part containing no carbon atom.
- R 0 and R in formula (2) representing the silicon compound (B) form an organic moiety.
- a part of hydrolyzable group (alkoxy group etc.) derived from a silicon compound (A), a silicon compound (AP), a silicon compound (B), and a silicon compound (BP) remains, this is also an organic part.
- the portion other than the organic portion is an inorganic portion that does not contain a carbon atom.
- the silicon compound (C) since the silicon compound (C) has an oxetanyl group, it has cationic curability. By cationically curing the silicon compound (C), a cured product film having a large surface hardness and excellent abrasion resistance can be provided.
- the silicon compound (B) When the compound (T monomer having three hydrolyzable groups) in which n is 0 in the general formula (2) is used as the silicon compound (B), the silicon compound (AP), the silicon compound (A) ( As a result of the hydrolysis / condensation reaction with the Q monomer having four siloxane bond-forming groups, the resulting silicon compound (C) has T monomer units and Q monomer units as constituent units. In the above case, the silicon compound (C) can partially have a ladder-like, cage-like or random-like structure.
- the silicon compound (C) includes a hydrolyzable group of the silicon compound (AP) and / or the silicon compound (A) (in the present invention, a siloxane bond-forming group including silanol is referred to as a hydrolyzable group), silicon. It is preferable that 92 mol% or more of the compound (BP) and / or the hydrolyzable group of the silicon compound (B) is condensed, and more preferably 95 mol% or more is condensed. More preferably, 98% or more of the mole is condensed. Particularly preferably, substantially all of the hydrolyzable group is condensed.
- the ratio of the remaining hydrolyzable groups exceeds 8 mol% of the hydrolyzable groups contained in the raw materials used, the ratio of the inorganic portion becomes smaller than the designed structure (the polysiloxane structure is sufficiently Therefore, there is a possibility that the hardness of the obtained coating film is lowered. Moreover, there exists a possibility that the storage stability of a silicon compound (C) may fall.
- the type of the remaining alkoxy group it is preferable that at least 50 mol% or more of an alkoxy group having 3 or more carbon atoms such as a propoxy group is included in the remaining alkoxy, more preferably 70 mol% or more, Preferably 90 mol% or more is contained. This is because a methoxy group or an ethoxy group having 2 or less carbon atoms has high reactivity and may cause a crosslinking reaction during storage, resulting in a decrease in storage stability.
- the residual ratio of siloxane bond-forming groups can be calculated from a 1 H-NMR (nuclear magnetic resonance spectrum) chart. Further, “substantially all of the hydrolyzable groups are condensed” means that, for example, a peak based on hydrolyzable groups in the 1 H-NMR chart of the obtained silicon compound (C) (polysiloxane compound) Can be confirmed by almost no observation.
- the silicon compound (A) in the present invention is a compound represented by the following general formula (1).
- SiX 4 (1) [In General Formula (1), X is a siloxane bond-forming group, and X may be the same or different. ]
- the silicon compound (A) has four siloxane bond-forming groups X (also referred to as Q monomer), and this siloxane bond-forming group reacts with the hydrolyzable group of the silicon compound (B), A siloxane bond is formed.
- the resulting silicon compound (C) has a larger mass composition of inorganic components such as Si and O than the case where a silicon compound having one or more organic groups is condensed, resulting in heat resistance and hardness.
- the Q monomer is a raw material component that enlarges the inorganic portion of the resulting condensate.
- the siloxane bond-forming group X in the general formula (1) means a hydroxyl group (also called a silanol group) or a hydrolyzable group.
- the silicon compound (A) is not particularly limited as long as silicon has four siloxane bond-forming groups.
- a plurality of Xs may be the same or different from each other.
- As a hydrolysable group what is necessary is just a group which has hydrolyzability, and a hydrogen atom, an alkoxy group, a cycloalkoxy group, an aryloxy group, an arylalkoxy group etc. are mentioned specifically ,.
- alkoxy group examples include methoxy group, ethoxy group, n-propoxy group, iso-propoxy group, n-butoxy group, iso-butoxy group, sec-butoxy group, t-butoxy group, n-pentyl group and n- A hexyl group etc. are mentioned.
- cycloalkoxy group examples include a cyclopentyloxy group and a cyclohexyloxy group.
- aralkyloxy group examples include benzyloxy group and 2-phenylethyloxy group.
- aryloxy group examples include a phenyloxy group, an o-toluyloxy group, an m-toluyloxy group, a p-toluyloxy group, and a naphthyloxy group.
- alkoxy groups are preferable because of their good hydrolyzability, alkoxy groups having 1 to 3 carbon atoms are more preferable, raw materials are easily available and inexpensive, and the hydrolysis reaction is easy to control. Therefore, a methoxy group is more preferable. These may be used alone or in combination of two or more.
- Preferred compounds as the silicon compound (A) are tetramethoxysilane, tetraethoxysilane and tetra n-propoxysilane. Furthermore, tetramethoxysilane is more preferable because it is easily available. Incidentally, at least a part of the siloxane bond-forming group is exchanged with an n-propoxy group by an alcohol exchange reaction described later.
- the silicon compound (B) in the present invention has an organic group having an oxetanyl group, and is a component for imparting cationic curability to the silicon compound (C) obtained by the production method of the present invention. It is a compound represented by Formula (2).
- R 0 is an organic group having an oxetanyl group, R 0 may be the same or different, and R is an alkyl group having 1 to 6 carbon atoms and an aralkyl having 7 to 10 carbon atoms.
- An organic group having a group, an aryl group having 6 to 10 carbon atoms, or an oxetanyl group, R may be the same or different, Y is a hydrolyzable group, and Y is the same or different. N may be 0 or 1.
- R 0 is an organic group having an oxetanyl group, and the organic group preferably has 20 or less carbon atoms.
- the carbon number of R 0 is 20 or less, good and stable cationic curability can be imparted to the silicon compound (C) obtained by the production method of the present invention.
- an organic group having a structure represented by the following general formula (3) is preferable as R 0 .
- R 3 has a smaller number of carbon atoms because the resulting silicon compound (C) tends to have a higher proportion of inorganic portion and the surface hardness of the resulting cured product tends to increase.
- R 3 is preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, more preferably an ethyl group.
- R 4 in the general formula (3) is preferably smaller in carbon number because the obtained silicon compound (C) tends to have a larger proportion of the inorganic portion and the surface hardness of the obtained cured product tends to be larger.
- R 4 is preferably an alkylene group having 2 to 6 carbon atoms, and more preferably a propylene group (trimethylene group). The reason is that it is easy to industrially obtain or synthesize a compound that forms such an organic functional group.
- a compound in which n is 0 has three hydrolyzable groups and is also called a T monomer. Moreover, the compound whose n is 1 has two hydrolyzable groups, and is also called D monomer.
- n is preferably 0.
- n is preferably 1.
- Y in the general formula (2) is a hydrolyzable group and may be any group having hydrolyzability. Specifically, a hydrogen atom, an alkoxy group, a cycloalkoxy group, an aryloxy group, an arylalkoxy group, and the like Is mentioned.
- alkoxy groups include methoxy, ethoxy, n-propoxy, iso-propoxy, n-butoxy, iso-butoxy, sec-butoxy, t-butoxy, n-pentyl and n-hexyl. Groups and the like.
- the cycloalkoxy group include a cyclopentyloxy group and a cyclohexyloxy group.
- Examples of the aralkyloxy group include benzyloxy group and 2-phenylethyloxy group.
- Examples of the aryloxy group include a phenyloxy group, an o-toluyloxy group, an m-toluyloxy group, a p-toluyloxy group, and a naphthyloxy group.
- alkoxy groups are preferable because of their good hydrolyzability, alkoxy groups having 1 to 3 carbon atoms are more preferable, raw materials are easily available and inexpensive, and the hydrolysis reaction is easy to control. Therefore, a methoxy group is more preferable. These may be used alone or in combination of two or more.
- Y is preferably an alkoxy group, a cycloalkoxy group and an aryloxy group, more preferably an alkoxy group, specifically a methoxy group, an ethoxy group and an n-propoxy group.
- a methoxy group is preferred because it is easily available and synthesized industrially.
- At least a part of Y is exchanged for an n-propoxy group by an alcohol exchange reaction described later.
- a silicon monomer having only one siloxane bond-forming group is also called an M monomer.
- the M monomer has three organic groups, and reduces the inorganic part of the condensate obtained compared to the Q, T, and D monomers.
- a method for preventing gelation during the reaction a method for avoiding gelation by using an M monomer such as trimethylalkoxysilane or hexamethyldisiloxane as an end-capping agent is also known.
- an M monomer such as trimethylalkoxysilane or hexamethyldisiloxane as an end-capping agent.
- the M monomer it is possible to add the M monomer at such a low rate that the inorganic properties are not lowered.
- the Q monomer, the T monomer and / or the D monomer are added.
- M monomer of 1/10 mol or less can be added and reacted with respect to the total number of moles, and the resulting composition also falls under the category of the present invention.
- the silicon compound (A) represented by the general formula (1) and the silicon compound (B) represented by the general formula (2) are subjected to an alcohol exchange reaction in 1-propanol. It is a reaction process.
- the organic silicon compound (A) used in the first step may be only one type or two or more types.
- the silicon compound (B) may be only one type or two or more types.
- the 1-propanol-derived n-propoxy group is contained by an alcohol exchange reaction between the siloxane bond-forming group of the silicon compound (A) and 1-propanol.
- the alcohol exchange reaction between the hydrolyzable group of the silicon compound (B) and 1-propanol results in the silicon compound (B) containing an n-propoxy group derived from the 1-propanol.
- a reaction product of an organosilicon compound (A) having an n-propoxy group hereinafter referred to as “silicon compound (AP)”
- AP an organosilicon compound
- BP reaction product of an organosilicon compound (B) having an n-propoxy group
- the silicon compound (AP) is one in which at least one of the four siloxane bond-forming groups of the silicon compound (A) is exchanged with an n-propoxy group.
- the silicon compound (BP) is one in which at least one of the two or three hydrolyzable groups of the silicon compound (B) is replaced with an n-propoxy group.
- the alcohol used in the first step is 1-propanol.
- the siloxane bond-forming group of the silicon compound (A) is exchanged with an n-propoxy group
- at least a part of the hydrolyzable group of the silicon compound (B) is exchanged with an n-propoxy group.
- both monomers can be copolycondensed in a balanced manner in the second step described later.
- the siloxane bond-forming group of the silicon compound (A) is a highly reactive methoxy group or ethoxy group, since the Q monomer originally tends to be highly reactive, only the Q monomer advances the condensation crosslinking reaction. There is a risk of forming a network and gelling, but the condensation reaction can proceed smoothly and more effectively by exchanging with an n-propoxy group having a reasonably low reactivity.
- the resulting reaction product has a low reactivity i-propoxy group or n-butoxy group. There is a possibility that the condensation of the obtained compound (AP) and (BP) does not proceed smoothly.
- the reaction product obtained has a methoxy group or ethoxy group that is relatively more reactive than the reaction product obtained when 1-propanol is used.
- the hydrolysis copolycondensation reaction of the obtained compounds (AP) and (BP) does not proceed uniformly, and a gel may be formed or a product with low stability may be obtained.
- the reaction temperature in the first step is preferably 0 to 100 ° C., more preferably 10 to 90 ° C., and still more preferably 20 to 80 ° C.
- the reaction time is preferably 5 minutes to 30 hours, more preferably 10 minutes to 24 hours, and more preferably 15 minutes to 24 hours.
- the pH condition in the first step may be any of alkaline, neutral and acidic.
- the pH condition may be performed under alkaline conditions. preferable.
- the pH of the reaction solution is a value exceeding 7. In that case, the pH of the reaction solution is preferably 8 or more and 13 or less. More preferably, the pH is 9 or more.
- an alkaline agent is added.
- the alkaline agent also acts as a reaction catalyst for smoothly proceeding the alcohol exchange reaction between the organosilicon compound (A) and the alkoxy group of the silicon compound (B) and 1-propanol.
- the alkali agent include ammonia, organic amines, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, choline, sodium hydroxide, potassium hydroxide and calcium hydroxide.
- ammonium compound having a quaternary nitrogen atom having good catalytic activity is preferable, and tetramethylammonium hydroxide, which is easily available, is more preferable. These may be used alone or in combination of two or more.
- the amount of the alkali agent used is preferably 1 to 20 mol, more preferably 3 to 15 mol, when the total number of moles of the silicon compound (A) and the silicon compound (B) is 100 mol.
- the amount of the alkali agent used is 5 to 10 mol, the alcohol exchange reaction proceeds favorably and economically.
- the second step is a step in which water is added to the composition obtained in the first step under alkaline conditions to cause hydrolytic copolycondensation.
- the composition obtained in the first step can use the reaction solution after the reaction in the first step as it is, and the composition contains a silicon compound having an n-propoxy group obtained by an alcohol exchange reaction ( AP) and silicon compounds (BP) are contained.
- AP alcohol exchange reaction
- BP silicon compounds
- the compounding ratio of the silicon compound (AP) and the silicon compound (BP) is 0.3 to 2.8 mol of the silicon compound (AP) with respect to 1 mol of the silicon compound (BP), preferably The amount is 0.8 to 2.5 mol, more preferably 1 to 2.3 mol.
- the hydrolysis copolycondensation reaction proceeds favorably without causing gelation.
- Compound (C) can be produced satisfactorily.
- the said silicon compound (AP) and the said silicon compound (BP) may contain a silicon compound (A) and a silicon compound (B), respectively, a mixture ratio is (A) and ( You may calculate from the preparation ratio of B). Therefore, even if (A) is expressed as 0.3 to 2.8 mol with respect to 1 mol of (B) before the first step, it means substantially the same thing.
- an alkaline agent is added to bring the system under alkaline conditions.
- the alkali agent hydrolyzes an alkoxy group which is a hydrolyzable group of the silicon compound (AP) obtained in the first step and the organosilicon compound (BP), and the organosilicon compound (AP) and the organic It acts as a reaction catalyst for smoothly proceeding the hydrolysis copolycondensation reaction with the silicon compound (BP).
- alkali agent examples include ammonia, organic amines, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, choline, sodium hydroxide, potassium hydroxide and calcium hydroxide.
- Etc an ammonium compound having a quaternary nitrogen atom having good catalytic activity is preferable, and tetramethylammonium hydroxide, which is easily available, is more preferable. These may be used alone or in combination of two or more.
- the amount of the alkali agent used in the second step is preferably 1 to 20 mol, more preferably 3 to 15 when the total number of moles of the silicon compound (AP) and the organosilicon compound (BP) is 100 mol.
- the molar amount is more preferably 5 to 10 mol, and the alcohol exchange reaction proceeds favorably and economically.
- the second step is a reaction under alkaline conditions, and the pH of the reaction solution is more than 7.
- the pH of the reaction solution is preferably 8 or more and 13 or less. More preferably, the pH is 9 or more and 13 or less, and the hydrolysis copolycondensation reaction proceeds well.
- Silicon compounds obtained by hydrolytic copolycondensation under acidic conditions are poor in storage stability and may gel during storage depending on reaction conditions and the like. Further, under neutral conditions (around pH 7), the hydrolysis copolycondensation reaction hardly proceeds. That is, a silicon compound having high storage stability can be obtained by proceeding hydrolysis copolycondensation between the organosilicon compound (AP) and the organosilicon compound (BP) under alkaline conditions (more than pH 7).
- an organic solvent can be used as a reaction solvent.
- the organic solvent include alcohols such as methyl alcohol, ethyl alcohol, 1-propanol and 2-propanol; ketones such as acetone and methyl ethyl ketone; tetrahydrofuran, toluene, 1,4-dioxane, hexane, ligroin and the like. It is done. Among these, highly polar solvents such as alcohols are preferable because the solubility of the silicon compound (C) is high. Since 1-propanol is used in the first step and the composition obtained in the first step can be used in the second step, 1-propanol is more preferable as the reaction solvent to be used. In addition, these may use only 1 type and may mix and use 2 or more types.
- water is added during hydrolysis.
- the amount of water added is preferably 0.5 to 10 equivalents, more preferably 1 to 5 equivalents, relative to 1 equivalent of the alkoxy group. If the amount of water used is less than 0.5 equivalents, the reaction may be insufficient. If the amount of water used is more than 10 equivalents, the process of removing water after the reaction will be long and not economical. There is a risk of gel formation.
- the appropriate organic solvent include alcohols such as methyl alcohol, ethyl alcohol and isopropyl alcohol, ketones such as acetone and methyl ethyl ketone, ethers such as tetrahydrofuran and 1,4-dioxane, and the like. Two or more organic solvents may be used in combination. Alcohols are preferable organic solvents because of good solubility of raw materials and products. Further, dilution with a solvent used as a reaction solvent is preferable, and 1-propanol is most preferable.
- a preferred concentration is 1% or more and 60% or less, more preferably 5% or more and 40% or less, and more preferably 10% or more and 30% or less in terms of the mass concentration of the silicon compound (C) to be produced.
- the higher the reaction temperature in the second step the faster the reaction proceeds, but a lower one is preferable because side reactions can be suppressed.
- the temperature is preferably 0 to 120 ° C, more preferably 10 to 100 ° C, more preferably 40 to 100 ° C, and particularly preferably 40 to 80 ° C.
- the reaction time in the second step is preferably 30 minutes to 30 hours, more preferably 30 minutes to 10 hours, and more preferably 1 to 8 hours.
- the neutralization step is a step of adding an acid to the composition obtained in the second step to neutralize the alkaline agent used in the first step and the second step.
- acids include inorganic acids such as phosphoric acid, nitric acid, sulfuric acid and hydrochloric acid; carboxylic acids such as acetic acid, formic acid, lactic acid, acrylic acid and oxalic acid; and sulfonic acids such as p-toluenesulfonic acid and methanesulfonic acid. Can be mentioned.
- the amount of the acid used is preferably 1 to 1.1 equivalents, more preferably 1 to 1.05 equivalents per equivalent of the alkali agent.
- the volatile component removal step (1) is a step of removing volatile components from the intermediate treatment product obtained in the neutralization step (referred to as “treatment composition obtained in each step”). .
- This volatile component removal step (1) is based on distillation under normal pressure (atmospheric pressure) or reduced pressure conditions.
- an organic solvent used as a reaction solvent in the neutralization step is a main target.
- an organic solvent miscible with water, such as methanol is used as the reaction solvent, this step is preferably carried out because it may hinder the washing with water described later.
- the organic solvent used as the reaction solvent is immiscible with water and is an organic solvent suitable for washing the intermediate treatment product with water, or even if it is a solvent miscible with water such as alcohol, the intermediate treatment If the washing step can be performed by adding a large amount of an organic solvent suitable for washing with water, the volatile component removal step (1) and the dissolution step described later can be omitted. Nevertheless, it is economically preferable to perform the volatile component removal step (1).
- the dissolution step is a step of dissolving the intermediate treatment product obtained in the volatile component removal step (1) in a cleaning organic solvent, and is a preferable step in the present invention.
- a solvent in which the silicon compound (C) as a reaction product is dissolved and is not miscible with water and can be separated after washing with water in a washing step described later is used.
- the phrase “not miscible with water” means that the mixture is sufficiently mixed with water and then separated into an aqueous layer and an organic layer upon standing.
- a preferable organic solvent for cleaning is described in the description of the cleaning step described later.
- the washing step is a step of washing the intermediate treatment product obtained in the dissolution step (an intermediate treatment product obtained in the neutralization step when the volatile component removal step and the dissolution step are omitted) with water, and the present invention. Is a preferable step.
- the alkaline agent used in the second step, the acid used in the neutralization step, and salts thereof can be substantially removed from the organic layer by water washing in this washing step.
- Organic solvents for cleaning include ketones such as methyl isobutyl ketone, ethers such as diisopropyl ether, aromatic hydrocarbons such as toluene, carbonization such as hexane
- ketones such as methyl isobutyl ketone
- ethers such as diisopropyl ether
- aromatic hydrocarbons such as toluene
- carbonization such as hexane
- esters such as hydrogen, ethyl acetate and propylene glycol monomethyl ether acetate (hereinafter referred to as “PGMEA”).
- the washing step includes a step of mixing water and the intermediate treatment product, bringing the water and the intermediate treatment product into contact with each other, and a step of separating the water layer from the organic layer (intermediate treatment product). Silicon obtained when mixing of water and intermediate treatment, and contact between water and intermediate treatment are insufficient, and when separation between the water layer and the organic layer (intermediate treatment) is insufficient
- the compound (C) may contain a large amount of impurities and may become a silicon compound (C) having poor stability.
- the temperature in the step of mixing the water and the intermediate treatment product in the washing step, bringing the water and the intermediate treatment product into contact with each other, and separating the water layer and the organic layer (intermediate treatment product) is not particularly limited. 0 to 70 ° C. is preferable, 10 to 60 ° C. is more preferable, and 40 to 60 ° C. in which the separation time is shortened is still more preferable.
- the said volatile component removal process (2) is a process of removing a volatile component from the intermediate processed material obtained by the said washing
- This volatile component removal step (2) is performed by distillation under normal pressure (atmospheric pressure) or reduced pressure conditions.
- the main component removed in the volatile component removal step (2) is an organic solvent, but if other volatile components are contained, they are removed simultaneously.
- the cleaning organic solvent is used as it is as the solvent for the silicon compound (C) without isolating the silicon compound (C)
- the volatile component removal step (2) can be omitted.
- Mn means number average molecular weight
- Mw means weight average molecular weight
- GPC gel permeation chromatography
- Compound C1 was analyzed by 1 H NMR analysis and IR (infrared absorption) to confirm the presence of an oxetanyl group.
- 1 H NMR analysis 1 g of silicon compound C1 and 100 mg of hexamethyldisiloxane (hereinafter referred to as “HMDSO”), which is an internal standard substance, were weighed and mixed together, and the signal intensity of the proton of HMDSO was used as a reference. Quantitative calculation was performed.
- HMDSO hexamethyldisiloxane
- the content of the silicon compound (AP), that is, the content of the structural unit (T monomer unit) derived from TMSOX and the content of the alkoxy group of the compound C1 are obtained, and based on these, the silicon compound (BP ), That is, the content of structural units (Q monomer units) derived from TMOS was calculated.
- the obtained organosilicon compound C1 was a copolycondensate obtained by a stoichiometric reaction between the silicon compound (AP) and the silicon compound (BP).
- the content of the alkoxy group (methoxy group bonded to the silicon atom) calculated from the 1 H NMR chart of the silicon compound C1 is an amount corresponding to 0.8% with respect to the entire alkoxy group contained in the raw material. there were. Further, Mn of the obtained silicon compound was 3,200, and Mw was 350,000, and no peak was observed in the polymer region having a retention time of 6 minutes to 10 minutes. Mw / Mn was calculated as 108, and in the silicon compound C1, the proportion of the inorganic portion was 50%. Compound C1 obtained in Example 1 was dissolved in an equal amount of PGMEA and immersed in an oil bath at 60 ° C., and the appearance was observed over time. .
- Example 2 Production of silicon compound C2
- TMSOX represented by the formula (4)
- 28.19 g (0.185 mol) of TMOS and 111.5 g of 1-propanol.
- 7.29 g of a 25% tetramethylammonium hydroxide methanol solution (methanol 0.17 mol, tetramethylammonium hydroxide 20 mmol) was gradually added.
- a mixture of 18.72 g (1.04 mmol) of water and 20.0 g of 1-propanol was added dropwise over 0.5 hours. After reacting at 60 ° C.
- the silicon compound C2 was analyzed by 1 H NMR analysis and IR (infrared absorption spectrum) method, and it was confirmed that an oxetanyl group was present.
- This organosilicon compound C2 was also confirmed to be a copolycondensate obtained by a stoichiometric reaction of TMSOX and TMOS by 1 H NMR analysis as in Example 1. .
- the content of the alkoxy group (methoxy group bonded to the silicon atom) calculated from the 1 H NMR chart of the silicon compound C2 is an amount corresponding to 0.9% with respect to the entire alkoxy group contained in the raw material. there were.
- the proportion of the inorganic portion was 50%.
- the obtained silicon compound had Mn of 3,500 and Mw of 400,000, and no peak was observed in the polymer region having a retention time of 6 minutes to 10 minutes. MW / Mn was calculated to be 114.
- Compound C2 obtained in Example 2 was dissolved in an equal amount of PGMEA and immersed in an oil bath at 60 ° C., and the appearance was observed over time. After 5 days, it did not gel and remained a homogeneous solution. .
- Example 3 Production of silicon compound C3
- TMSOX represented by the formula (4)
- 28.19 g (0.185 mol) of TMOS and 111.5 g of 1-propanol.
- 7.29 g of a 25% tetramethylammonium hydroxide methanol solution (methanol 0.17 mol, tetramethylammonium hydroxide 20 mmol) was gradually added.
- a mixture of 18.72 g (1.04 mmol) of water and 20.0 g of 1-propanol was added dropwise over 0.5 hours. After reacting at 20 ° C.
- Compound C3 was analyzed by 1H NMR analysis and IR (infrared absorption spectrum) method, and it was confirmed that an oxetanyl group was present.
- This organosilicon compound C2 was also confirmed to be a copolycondensate obtained by a stoichiometric reaction of TMSOX and TMOS by 1 H NMR analysis as in Example 1. .
- the content of the alkoxy group (methoxy group bonded to the silicon atom) calculated from the 1 H NMR chart of the silicon compound C3 is an amount corresponding to 2.0% with respect to the entire alkoxy group contained in the charged raw material. there were.
- the proportion of the inorganic portion was 50%.
- Mw was 500,000, and no peak was observed in the polymer region having a retention time of 6 minutes to 10 minutes.
- the MW / Mn was calculated to be 132.
- Compound C3 obtained in Example 3 was dissolved in an equal amount of PGMEA and immersed in an oil bath at 60 ° C., and the appearance was observed over time. After 5 days, the viscosity increased slightly but did not gel. It remained a homogeneous solution.
- the content of the alkoxy group (methoxy group bonded to the silicon atom) calculated from the 1 H NMR chart of the silicon compound C4 is an amount corresponding to 2.6% with respect to the entire alkoxy group contained in the charged raw material. there were. Further, the Mn of the obtained silicon compound was calculated to be 4,300, and Mw was calculated to be 3,000,000. However, a large peak was observed in the polymer region with a retention time of 6 minutes to 10 minutes, and the Mw was 400,000. Since this is a region that exceeds the limit and has a low quantitative property, it is expressed in Table 1 as Mw> 1 million (> 1 million), and Mw / Mn is also expressed as greater than 200 (> 200).
- Example 1 The results of Examples and Comparative Examples are shown in Table 1.
- Table 1 the symbol “-” indicates that the measurement is not performed or not measured.
- “Solvent” in the first step indicates a solvent used for alcohol exchange in the first step, and Comparative Example 5 does not have an independent first step, and is therefore “ ⁇ ”.
- the “C concentration” in the second step is calculated from the amount of the raw material monomers (A) and (B), and is a calculated value of the generated mass of the silicon compound (C) when completely hydrolyzed and condensed in the second step. Is expressed in% when divided by the total charge mass in the second step.
- the silicon compound (Q monomer) having four siloxane bond-forming groups by hydrolytic condensation is different from SiO 2 having silicon having three hydrolyzable groups. This means that SiO 1.5 was obtained from the compound (T monomer) and SiO 1 from the silicon compound (D monomer) having two hydrolyzable groups.
- Mw / Mn is usually a number called polydispersity of a polymer, and is understood as an index that becomes 1 when all the molecules are the same and increases as the molecular weight distribution increases. In Examples 1 to 3, this value was smaller than 200, but in Comparative Examples 2 to 4, which did not gel during the reaction, the value was larger than 200. In Examples 1 to 3, it is considered that the molecular weight of the compound C was also uniformed because the monomer reactivity was uniformized in a well-balanced manner through the first step.
- Mw / Mn of Example 1 was the smallest, 108, was that the second step was a charge concentration at which the C concentration was 25%, and the reaction temperature was 60 ° C., and the reaction was performed under a high temperature and high concentration condition. It is considered that alcohol exchange reaction and alcoholysis decomposition reaction (alcolysis reaction) occur actively at the same time as the condensation reaction, resulting in a more uniform molecular weight distribution.
- the silicon compound obtained by the production method of the present invention is soluble in a solvent and can be used as a coating material having good storage stability.
- it since it has cationic curability, it can be easily applied to various substrates, the surface of articles, etc., and the cured product has a high surface hardness, so that it can be used as a hard coat, protective film for various substrates, or a resist film. Useful.
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Abstract
Description
本発明は、オキセタニル基を有し、表面硬度の高い硬化物を与えることのできるケイ素化合物を、反応途中でゲル化の問題を生じることなく、高濃度で製造できる方法を提供することを課題とする。
一方、高い濃度で反応を行うことは、効率が上がり経済的であるものの、反応性シラン同士の接触確率が上がり、分子間反応が進んでゲルが生じやすくなる恐れがある。
本発明のケイ素化合物(C)の製造方法は、上記一般式(1)で表されるケイ素化合物(A)と上記一般式(2)で表されるケイ素化合物(B)を、1-プロパノール中でアルコール交換反応させる第一工程と、上記反応させて得られた組成物をアルカリ性条件下で加水分解共重縮合させる第二工程とを備えることを特徴とする。
本発明で得られるケイ素化合物(C)は、ケイ素化合物(A)、第1工程によりケイ素化合物(A)から生じるケイ素化合物(APと呼ぶ)、ケイ素化合物(B)及び第1工程によりケイ素化合物(B)から生じるケイ素化合物(BPと呼ぶ)との加水分解共重縮合によって生成するものである。以下に説明する第二工程により、A,B,AP,BPに含まれるシロキサン結合生成基、加水分解性基及びn-プロポキシ基の大部分はシロキサン結合に転化されるので、ケイ素化合物(C)は、シロキサン結合生成基、加水分解性基及びn-プロポキシ基が加水分解して形成された三次元のシロキサン結合(Si-O-Si)からなるポリシロキサンであるということができる。
上記の場合、ケイ素化合物(C)は、部分的にラダー(はしご)状、かご状又はランダム状の構造をとることができる。
さらに、残存するアルコキシ基の種類としては、残存アルコキシの中で少なくともプロポキシ基などの炭素数3以上のアルコキシ基が50モル%以上含まれることが好ましく、より好ましくは70モル%以上であり、さらに好ましくは90モル%以上含まれることが好ましい。炭素数2以下のメトキシ基やエトキシ基は反応性が高く、保存中に架橋反応を起こして保存安定性が低下する恐れがあるからである。
本発明におけるケイ素化合物(A)は、下記一般式(1)で表される化合物である。
SiX4 (1)
〔一般式(1)において、Xはシロキサン結合生成基であり、Xは同一であっても異なっても良い。〕
ケイ素化合物(A)はシロキサン結合生成基であるXを4個有するもの(Qモノマーとも呼ばれる。)であり、このシロキサン結合生成基は、ケイ素化合物(B)の加水分解性基との反応により、シロキサン結合を生成する。その結果得られるケイ素化合物(C)は、1つ以上の有機基を有するケイ素化合物を縮合させた場合にくらべて、SiやOといった無機成分の質量組成が大きくなり、結果的に耐熱性や硬度といった無機的な特徴をより強く示すようになるため、Qモノマーは得られる縮合物の無機部分を大きくする原料成分であるということができる。
上記シクロアルコキシ基としては、例えばシクロペンチルオキシ基及びシクロヘキシルオキシ基等が挙げられる。アラルキルオキシ基の例としては、ベンジルオキシ基、2-フェニルエチルオキシ基等が挙げられる。アリールオキシ基としては、例えばフェニルオキシ基、o-トルイルオキシ基、m-トルイルオキシ基、p-トルイルオキシ基及びナフチルオキシ基等が挙げられる。これらのうち、加水分解性が良好であることからアルコキシ基が好ましく、炭素数1~3のアルコキシ基がより好ましく、原料入手が容易であり安価であること、並びに加水分解反応が制御しやすいことから、メトキシ基が更に好ましい。これらは1種のみ用いてもよく、2種以上を混合して用いてもよい。上記ケイ素化合物(A)として好ましい化合物は、テトラメトキシシラン、テトラエトキシシランおよびテトラn-プロポキシシランである。更に、入手が容易であることから、より好ましくはテトラメトキシシランである。
尚、シロキサン結合生成基の少なくとも一部は、後述のアルコール交換反応により、n-プロポキシ基に交換される。
本発明におけるケイ素化合物(B)は、オキセタニル基を有する有機基を有するものであり、本発明の製造方法により得られるケイ素化合物(C)にカチオン硬化性を付与するための成分であり、下記一般式(2)で表される化合物である。
〔式(2)において、R0はオキセタニル基を有する有機基であり、R0は同一であっても異なっても良く、Rは炭素数1~6のアルキル基、炭素数7~10のアラルキル基、炭素数6~10のアリール基、またはオキセタニル基を有する有機基であり、Rは同一であっても異なっても良く、Yは加水分解性基であり、Yは同一であっても異なってもよく、nは0または1である。〕
更に、無機部分の割合量と溶剤への溶解性とのバランスから、nが0のケイ素化合物とnが1のケイ素化合物とを併用することができる。併用する場合、nが0のケイ素化合物とnが1のケイ素化合物との配合割合は、得られるケイ素化合物(C)を用いる用途により適宜選択される。本発明において好ましいのは、平均値でn=0~0.5、さらに好ましくはn=0~0.3の範囲となるものである。
本発明の第一工程は、上記一般式(1)で表されるケイ素化合物(A)と上記一般式(2)で表されるケイ素化合物(B)を、1-プロパノール中でアルコール交換反応させる反応工程である。第一工程において用いる有機ケイ素化合物(A)は1種のみでもよく、2種以上であってもよい。同様に、ケイ素化合物(B)は1種のみでもよく、2種以上であってもよい。
また、上記ケイ素化合物(B)が有する加水分解性基と1-プロパノールとのアルコール交換反応により、ケイ素化合物(B)は、上記1-プロパノール由来のn-プロポキシ基を含むものとなる。
この第一工程によりn-プロポキシ基を有する有機ケイ素化合物(A)の反応物(以下、「ケイ素化合物(AP)」という)と、n-プロポキシ基を有する有機ケイ素化合物(B)の反応物(以下、「ケイ素化合物(BP)」という)が製造される。
上記ケイ素化合物(AP)は、上記ケイ素化合物(A)が有する4個のシロキサン結合生成基のうち、少なくとも1個がn-プロポキシ基に交換されているものである。
また、上記ケイ素化合物(BP)は、上記ケイ素化合物(B)が有する2個または3個の加水分解性基のうち、少なくとも1個がn-プロポキシ基に交換されているものである。
また、第一工程のアルコールとしてメタノールやエタノールを用いた場合、得られる反応物は、1-プロパノールを用いた場合に得られる反応物よりも反応性が比較的高いメトキシ基やエトキシ基を有することとなり、得られた化合物(AP)と(BP)との加水分解共重縮合反応が均一に進行せずゲルが生じたり、安定性の低いものが得られるたりする恐れがある。
また、反応時間は5分~30時間が好ましく、さらに好ましくは10分~24時間、より好ましくは15分~24時間である。
上記第一工程がアルカリ性条件下である場合、反応液のpHは7を超える値である。その場合、反応液のpHは、好ましくは8以上であり13以下である。さらに好ましくはpHが9以上である。
上記アルカリ剤としては、例えば、アンモニア、有機アミン類、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、水酸化テトラプロピルアンモニウム、水酸化テトラブチルアンモニウム、コリン、水酸化ナトリウム、水酸化カリウム及び水酸化カルシウム等が挙げられる。これらのうち、触媒活性の良好な第4級窒素原子を有するアンモニウム化合物が好ましく、更に入手が容易な水酸化テトラメチルアンモニウムがより好ましい。これらは1種のみ用いてもよく、2種以上を混合して用いてもよい。
上記第二工程は、上記第一工程により得られた組成物に、アルカリ性条件下で水を加え、加水分解共重縮合させる工程である。
上記第一工程により得られた組成物は、第一工程における反応後の反応溶液をそのまま用いることができ、上記組成物には、アルコール交換反応により得られたn-プロポキシ基を有するケイ素化合物(AP)及びケイ素化合物(BP)が含有される。
上記アルカリ剤としては、例えば、アンモニア、有機アミン類、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、水酸化テトラプロピルアンモニウム、水酸化テトラブチルアンモニウム、コリン、水酸化ナトリウム、水酸化カリウム及び水酸化カルシウム等が挙げられる。これらのうち、触媒活性の良好な第4級窒素原子を有するアンモニウム化合物が好ましく、更に入手が容易な水酸化テトラメチルアンモニウムがより好ましい。これらは1種のみ用いてもよく、2種以上を混合して用いてもよい。
また、中性条件下(pH7付近)では、加水分解共重縮合反応が進行し難い。
すなわち、アルカリ性条件下(pH7超)で有機ケイ素化合物(AP)と有機ケイ素化合物(BP)との加水分解共重縮合を進行させることによって保存安定性の高いケイ素化合物を得ることができる。
上記の適当な有機溶媒としては、メチルアルコール、エチルアルコール、イソプロピルアルコール等のアルコール類、アセトン、メチルエチルケトン等のケトン類、テトラヒドロフラン、1,4-ジオキサン等のエーテル類等が挙げられる。有機溶剤は2種類以上が併用されてもよい。アルコール類は、原料および生成物の溶解性が良好であり好ましい有機溶媒である。さらに、反応溶媒として使用している溶媒を用いて希釈することが好ましく、1-プロパノールが最も好ましい。
また、第二工程における反応温度は高いほど反応が速く進むが、低い方が副反応を抑えることができるので好ましい。0~120℃が好ましく、さらに好ましくは10~100℃であり、より好ましくは40~100℃、特に好ましくは40~80℃である。第二工程の反応時間としては30分~30時間が好ましく、さらに好ましくは30分~10時間、より好ましくは1~8時間である。
また、本発明のケイ素化合物の製造方法において、上記第二工程の後、更に、中和工程、揮発成分除去工程(1)、溶解工程、洗浄工程及び揮発成分除去工程(2)を備えるのが好ましい。
反応溶媒として使用された有機溶剤が水と混和しないものであり、中間処理物の水による洗浄に適した有機溶剤である場合、またはアルコール等の水と混和する溶媒であったとしても、中間処理物の水による洗浄に適した有機溶剤を多量に追加することで洗浄工程を行うことが可能な場合には、この揮発成分除去工程(1)及び後述の溶解工程は省略することができるが、それでも揮発成分除去工程(1)を行うことは経済的に好ましい。
洗浄工程における、水と中間処理物とを混合し、水と中間処理物とを接触させる工程、及び水層と有機層(中間処理物)とを分離させる工程での温度は特に限定されないが、0~70℃が好ましく、10~60℃がより好ましく、分離時間が短縮される40~60℃が更に好ましい。
ケイ素化合物(C)を単離することなく、洗浄用有機溶剤がそのままケイ素化合物(C)の溶剤として使用される場合には、揮発成分除去工程(2)は省略することができる。
(実施例1:ケイ素化合物C1の製造)
攪拌機および温度計を備えた反応器に、下記式(4)で表される3-エチル-3-((3-(トリメトキシシリル)プロポキシ)メチル)オキセタン(生成するケイ素化合物(C)において、T構造単位を与えるモノマーの一種であり、以下、「TMSOX」という)1.1kg(4.01mol)、テトラメトキシシラン(Q構造単位を与えるモノマーの一種であり、以下、「TMOS」という)1.1kg(7.24mol)と1-プロパノール1.1kgを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液0.29kg(メタノール6.8mol、水酸化テトラメチルアンモニウム0.8mol)を徐々に加えた。60℃で1時間反応させた後、反応液を攪拌しながら水750g(41mol)と1-プロパノール750gの混合液を0.5時間かけて滴下した。滴下時間も含めて60℃で6時間反応させたあと、反応液に硝酸を加えて中和した。減圧下で有機溶剤と水を留去して、得られた残さをPGMEAに溶解させ、水洗を行うことで塩類や過剰の酸を除去した。得られたPGMEA溶液から減圧下で溶剤を留去し、無色の固体(化合物C1)を得た。収量1.2kg。仕込み原料の量から算出される質量収率は91%であった。
1H NMR分析は、ケイ素化合物C1の1gおよび内部標準物質であるヘキサメチルジシロキサン(以下、「HMDSO」という)の100mgを、それぞれ精秤して混合し、HMDSOのプロトンのシグナル強度を基準として定量計算を行った。この1H NMR分析により、ケイ素化合物(AP)、即ち、TMSOXに由来する構造単位(Tモノマー単位)の含有量および化合物C1のアルコキシ基の含有量を求め、これらを基にしてケイ素化合物(BP)、即ち、TMOSに由来する構造単位(Qモノマー単位)の含有量を計算した。その結果、得られた有機ケイ素化合物C1は、ケイ素化合物(AP)およびケイ素化合物(BP)が化学量論的に反応して得られた共重縮合物であることが確認された。
また、得られたケイ素化合物のMnは3,200、Mwは350,000であり、保持時間6分から10分付近の高分子領域にピークは見られなかった。Mw/Mnは108と算出され、上記ケイ素化合物C1において、無機部分の割合は50%であった。
実施例1で得られた化合物C1を等量のPGMEAに溶解させ60℃のオイルバスに浸し、経時的に外観を観察したところ5日経過してもゲル化せず均一溶液のままであった。
攪拌機および温度計を備えた反応器に、式(4)で表されるTMSOXを27.82g(0.1mol)、TMOSを28.19g(0.185mol)と1-プロパノール111.5gを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液7.29g(メタノール0.17mol、水酸化テトラメチルアンモニウム20mmol)を徐々に加えた。60℃で1時間反応させた後、水18.72g(1.04mmol)と1-プロパノール20.0gの混合液を0.5時間かけて滴下した。滴下時間も含めて60℃で6時間反応させたあと、硝酸を加えて中和した。減圧下で有機溶剤と水を留去して、得られた残さをPGMEAに溶解させ、水洗を行うことで塩類や過剰の酸を除去した。得られたPGMEA溶液から減圧下で溶剤を留去し、無色の固体(化合物C2)を得た。収量28.8g。質量収率90%。
また、この有機ケイ素化合物C2についても、実施例1と同様にした1H NMR分析により、TMSOXとTMOSとが化学量論的に反応して得られた共重縮合物であることが確認された。
ケイ素化合物C2の1H NMRチャートから算出したアルコキシ基(ケイ素原子に結合したメトキシ基)の含有量は、仕込み原料に含まれていたアルコキシ基の全体に対して0.9%に相当する量であった。
得られたケイ素化合物のMnは3,500、Mwは400,000であり、保持時間6分から10分付近の高分子領域にピークは見られなかった。MW/Mnは114と算出された。
実施例2で得られた化合物C2を等量のPGMEAに溶解させ60℃のオイルバスに浸し、経時的に外観を観察したところ5日経過後には、ゲル化せず均一溶液のままであった。
攪拌機および温度計を備えた反応器に、式(4)で表されるTMSOXを27.82g(0.1mol)、TMOSを28.19g(0.185mol)と1-プロパノール111.5gを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液7.29g(メタノール0.17mol、水酸化テトラメチルアンモニウム20mmol)を徐々に加えた。20℃で1時間反応させた後、水18.72g(1.04mmol)と1-プロパノール20.0gの混合液を0.5時間かけて滴下した。滴下時間も含めて20℃で6時間反応させたあと、硝酸を加えて中和した。減圧下で有機溶剤と水を留去して、得られた残さをPGMEAに溶解させ、水洗を行うことで塩類や過剰の酸を除去した。得られたPGMEA溶液から減圧下で溶剤を留去し、無色の固体(化合物C2)を得た。収量27.2g。質量収率85%。
また、この有機ケイ素化合物C2についても、実施例1と同様にした1H NMR分析により、TMSOXとTMOSとが化学量論的に反応して得られた共重縮合物であることが確認された。
ケイ素化合物C3の1H NMRチャートから算出したアルコキシ基(ケイ素原子に結合したメトキシ基)の含有量は、仕込み原料に含まれていたアルコキシ基の全体に対して2.0%に相当する量であった。
得られたケイ素化合物のGPC分析では、3,800、Mwは500,000で、保持時間6分から10分付近の高分子領域にピークは見られなかった。MW/Mnは132と算出された。
実施例3で得られた化合物C3を等量のPGMEAに溶解させ60℃のオイルバスに浸し、経時的に外観を観察したところ5日経過後には、わずかに粘度上昇があったがゲル化せず均一溶液のままであった。
攪拌機および温度計を備えた反応器に、TMSOX39.2g(0.14mol)、TMOS39.6g(0.26mol)とメタノール39.3gを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液10.4g(メタノール0.24mol、水酸化テトラメチルアンモニウム28mmol)を徐々に加えた。21℃で1時間反応させた後、水26.3g(1.46mol)と1-プロパノール26.6gの混合液を滴下したところ、滴下中にゲル化してしまった。
攪拌機および温度計を備えた反応器に、TMSOX27.73g(0.1mol)、TMOS 28.12g(0.18mol)とメタノール 27.57gを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液7.41g(メタノール0.18mol、水酸化テトラメチルアンモニウム 20mmol)を徐々に加えた。60℃で1時間反応させた後、水 18.9g(1mol)とメタノール 18.91gを滴下し、60℃で6時間反応させた。硝酸を加えて中和した。減圧下で有機溶剤と水を留去した。得られた残さをPGMEAに溶解させ、水洗を行うことで塩類や過剰の酸を除去しようとした。
水洗途中の有機層のGPCを測定したところ、保持時間6分から10分付近の高分子領域に大きなピークが見られ、分子量40万を超える高分子量成分が多量に存在することがわかり、安定性の悪いことが推測された。表1にはこの測定結果を載せた。また、水洗中水層と有機層の分離が非常に悪く、明確に分離することはできなかったために目的物を単離することができなかった。
攪拌機および温度計を備えた反応器に、TMSOX 27.70g(0.1mol)、TMOS 28.5g(0.185mol)とエタノール27.54を仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液7.3g(メタノール0.18mol、水酸化テトラメチルアンモニウム20mmol)を徐々に加えた。60℃で1時間反応させた後、水 18.74g(1mol)とエタノール 18.7gを滴下し、60℃で6時間反応させた。硝酸を加えて中和した。減圧下で有機溶剤と水を留去して、得られた残渣をPGMEAに溶解させ、水洗を行うことで塩類や過剰の酸を除去した。PGMEA溶液から溶剤を減圧下で留去し、淡黄色の固体を得た。収量29.08g。収率91%。
生成物を1H NMR分析およびIR(赤外吸収スペクトル)分析し、オキセタニル基が存在することを確認した。
また、この有機ケイ素化合物C4についても、実施例1と同様にした1H NMR分析により、ケイ素化合物(A)およびケイ素化合物(B)が化学量論的に反応して得られた共重縮合物であることが確認された。
ケイ素化合物C4の1H NMRチャートから算出したアルコキシ基(ケイ素原子に結合したメトキシ基)の含有量は、仕込み原料に含まれていたアルコキシ基の全体に対して2.6%に相当する量であった。
また、得られたケイ素化合物のMnは4,300、Mwは3,000,000と算出されたが、保持時間6分から10分付近の高分子領域に大きなピークが見られ、Mwは40万を超えており定量性の乏しい領域なので、表1にはMw>100万より大(>100万)と表記し、Mw/Mnも200より大(>200)と表記した。
比較例3で得られた化合物を等量のPGMEAに溶解させ60℃のオイルバスに浸し、経時的に外観を観察したところ翌日にはゲル化していた。残存アルコキシ基がエトキシ基のみのものは安定性が低いことがわかった。
攪拌機および温度計を備えた反応器に、TMSOX 27.74g(0.1mol)、TMOS 28.20g(0.185mol)と2-プロパノール27.54gを仕込んだ後、25%水酸化テトラメチルアンモニウムメタノール溶液7.3g(メタノール0.18mol、水酸化テトラメチルアンモニウム20mmol)を徐々に加えた。60℃で1時間反応させた後、水 18.87g(1mol)と2-プロパノール 18.88gを滴下し、60℃で6時間反応させた。硝酸を加えて中和した。減圧下で有機溶剤と水を留去して、得られた残渣をPGMEAに溶解させようとしたが、水洗を行うことで塩類や過剰の酸を除去した。PGMEA溶液から溶剤を減圧下で留去し、淡黄色の固体を得た。収量は28.73gで収率90%。
反応を終え、硝酸で中和した直後の反応液のガスクロ分析を行ったところ、シランモノマー由来のピークが残存していることがわかった。一方、反応終了後の溶液のGPC分析を行ったところ、また、得られたケイ素化合物のMnは3,300、Mwは11,000,000と算出されたが、保持時間6分から10分付近の高分子領域に大きなピークが見られ、Mwは40万を超えており定量性の乏しい領域なので、表1にはMw>100万より大(>100万)と表記し、Mw/Mnも200より大(>200)と表記した。モノマーが残る一方で、ポリマーの高分子量化が進んでいることから原料モノマーの加水分解・共重縮合反応が均一に進行していないことがわかった。
比較例4で得られたケイ素化合物を等量のPGMEAに溶解させ60℃のオイルバスに浸し、経時的に外観を観察したところ4日目にはゲル化していた。
攪拌機および温度計を備えた反応器に、TMSOX27.89g(0.1mol)、TMOS28.84g(0.185mol)と1-プロパノール27.69gを仕込んだ後、反応溶液を60℃へ昇温した。25%水酸化テトラメチルアンモニウム水溶液7.3g(水酸化テトラメチルアンモニウムとして20mmol)と水18.53g(1mol)と1-プロパノール 17.75gの混合液を滴下した。滴下を始めてすぐにゲル化した。すなわち、本発明の第一工程と第二工程を分離しない製造方法ではゲル化を抑えることはできなかった。
第一工程における「溶媒」とは、第一工程においてアルコール交換に用いた溶媒を示し、比較例5では独立した第一工程を有しないので「-」とした。第2工程における「C濃度」とは、原料モノマー(A),(B)の量から算出される、第二工程において完全に加水分解縮合したときのケイ素化合物(C)の生成質量の計算値を、第二工程における全仕込み質量で割ったときの%で表される。尚、モノマーが完全に加水分解縮合したときとは、加水分解縮合により4つのシロキサン結合生成基を持ったケイ素化合物(Qモノマー)からは、SiO2が、3つの加水分解性基を持ったケイ素化合物(Tモノマー)からはSiO1.5、2つの加水分解性基を持ったケイ素化合物(Dモノマー)からはSiO1が得られたことをいう。
上記ケイ素化合物の製造において、ゲル化することなく製造できたケイ素化合物(C)に関して、そのケイ素化合物の収率(%)及び残留アルコキシ基の含有量(%)を下記要領で測定及び算出した。
収率(%)は、(化合物Cの単離収量)/(QモノマーのアルコキシシランがすべてSiO2に変わり、TモノマーのアルコキシシランがすべてSiO1.5に、DモノマーのアルコキシシランがすべてSiO1に変わったと仮定したときの理論収量)×100によって算出した。残留アルコキシ基の含有量(%)は、1H-NMR(核磁気共鳴スペクトル)チャートから算出した。実施例1~3の中でも、第二工程の反応温度が高かった実施例1および2では残留アルコキシ基の含有量が1%を下回っており、特に優れていた。
上記ケイ素化合物の安定性評価を行った。実施例で得られた化合物Cと比較例3、4で得られた化合物Cとをそれぞれを等重量のPGMEAに溶解させ、この溶液を5ml容量のガラス製サンプル管に2ml入れて密封し、60℃の空気恒温槽内で保管して経時的に外観を観察した。サンプル管をさかさまにしても液体が流れない状態をゲル化したと判断した。比較例3で得られた生成物は1日後、比較例4は4日後にはゲル化していたのに対し、実施例で得られた生成物は5日経ってもゲル化はしていなかった。
Mw/Mnは通常、ポリマーの多分散度と呼ばれる数字であり、全ての分子が同一である時に1になり、分子量分布が広がるほど大きくなる指標として理解されている。実施例1~3ではこの値が200より小さかったが、比較例の内、反応中にゲル化しなかった比較例2~4では200より大きい値になった。実施例1~3では、第一工程を経ることにより、モノマーの反応性がバランスよく均一化したために、化合物Cの分子量も均一化したからであると考えられる。また実施例1のMw/Mnが108と、最も小さかった理由は第二工程がC濃度が25%となる仕込み濃度で、反応温度が60℃と、高温かつ高濃度の条件で反応させたために、縮合反応と同時にアルコール交換反応や加アルコール分解反応(アルコリシス反応)が活発に起き、結果的に分子量分布がより均一化された結果であると考えられる。
Claims (7)
- 下記一般式(1)で表されるケイ素化合物(A)および下記一般式(2)で表されるケイ素化合物(B)を、1-プロパノール中でアルコール交換反応させる第一工程と、ケイ素化合物(B)1モルに対して、ケイ素化合物(A)が0.3~2.8モルの割合で、アルカリ性条件下で加水分解共重縮合させる第二工程とを含む、ケイ素化合物(C)の製造方法。
SiX4 (1)
(式(1)において、Xはシロキサン結合生成基であり、Xは同一であっても異なっていても良い。)
(式(2)において、R0はオキセタニル基を有する有機基であり、R0は同一であっても異なっても良く、Rは炭素数1~6のアルキル基、炭素数7~10のアラルキル基、炭素数6~10のアリール基、またはオキセタニル基を有する有機基であり、Rは同一であっても異なっても良く、Yは加水分解性基であり、Yは同一であっても異なってもよく、nは0または1である。)
- 式(2)におけるYがアルコキシ基、シクロアルコキシ基またはアリールオキシ基である、請求項1または2に記載のケイ素化合物(C)の製造方法。
- アルカリ性条件とするためのアルカリ剤として水酸化テトラアルキルアンモニウムが使用される、請求項1~3のいずれかに記載のケイ素化合物(C)の製造方法。
- ケイ素化合物(A)およびケイ素化合物(B)の合計モル数を100モルとした場合に、第二工程をアルカリ性条件とするためのアルカリ剤の使用量が1~20モルである、請求項1~4のいずれかに記載のケイ素化合物(C)の製造方法。
- 第二工程における反応温度が40~100℃である、請求項1~5のいずれかに記載のケイ素化合物(C)の製造方法。
- 第二工程におけるケイ素モノマーの仕込み濃度が、生成するケイ素化合物(C)の質量濃度に換算して、10%~40質量%である、請求項1~6のいずれかに記載のケイ素化合物(C)の製造方法。
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