WO2003095579A1 - Composition et procede pour la fixation termporaire de solides - Google Patents

Composition et procede pour la fixation termporaire de solides Download PDF

Info

Publication number
WO2003095579A1
WO2003095579A1 PCT/JP2003/005899 JP0305899W WO03095579A1 WO 2003095579 A1 WO2003095579 A1 WO 2003095579A1 JP 0305899 W JP0305899 W JP 0305899W WO 03095579 A1 WO03095579 A1 WO 03095579A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixing
composition
temporarily fixing
temporarily
solid
Prior art date
Application number
PCT/JP2003/005899
Other languages
English (en)
French (fr)
Inventor
Yasuaki Yokoyama
Nobuo Bessho
Masaaki Hanamura
Original Assignee
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002136995A external-priority patent/JP2003332278A/ja
Priority claimed from JP2002157060A external-priority patent/JP2003347254A/ja
Priority claimed from JP2002157059A external-priority patent/JP2003347253A/ja
Priority claimed from JP2002235607A external-priority patent/JP2004079663A/ja
Priority claimed from JP2002282307A external-priority patent/JP2004115682A/ja
Priority claimed from JP2003059542A external-priority patent/JP2004273597A/ja
Priority claimed from JP2003061792A external-priority patent/JP2004273722A/ja
Priority claimed from JP2003061793A external-priority patent/JP2004273723A/ja
Priority to KR10-2004-7000283A priority Critical patent/KR20050006120A/ko
Priority to AU2003234794A priority patent/AU2003234794A1/en
Application filed by Jsr Corporation filed Critical Jsr Corporation
Priority to US10/483,178 priority patent/US7186448B2/en
Priority to EP03728056A priority patent/EP1522567A4/en
Publication of WO2003095579A1 publication Critical patent/WO2003095579A1/ja
Priority to US11/501,713 priority patent/US20060275939A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
PCT/JP2003/005899 2002-05-13 2003-05-12 Composition et procede pour la fixation termporaire de solides WO2003095579A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP03728056A EP1522567A4 (en) 2002-05-13 2003-05-12 COMPOSITION AND METHOD FOR THE TEMPORARY MOUNTING OF A SOLID BODY
US10/483,178 US7186448B2 (en) 2002-05-13 2003-05-12 Composition and method for temporarily fixing solid
KR10-2004-7000283A KR20050006120A (ko) 2002-05-13 2003-05-12 고체의 일시적 고정을 위한 조성물 및 방법
AU2003234794A AU2003234794A1 (en) 2002-05-13 2003-05-12 Composition and method for temporarily fixing solid
US11/501,713 US20060275939A1 (en) 2002-05-13 2006-08-10 Composition and method for temporarily fixing solids

Applications Claiming Priority (16)

Application Number Priority Date Filing Date Title
JP2002136995A JP2003332278A (ja) 2002-05-13 2002-05-13 ウェハの加工法およびそのためのウェハ固定化剤
JP2002-136995 2002-05-13
JP2002157060A JP2003347254A (ja) 2002-05-30 2002-05-30 ウェハ固定化用組成物およびこれを用いたウェハの加工法
JP2002-157060 2002-05-30
JP2002-157059 2002-05-30
JP2002157059A JP2003347253A (ja) 2002-05-30 2002-05-30 ウェハ固定化用ペレットおよびこれを用いたウェハの加工方法
JP2002-235607 2002-08-13
JP2002235607A JP2004079663A (ja) 2002-08-13 2002-08-13 Ｃｍｐ用パッド固定化剤、ｃｍｐ用パッドの固定化方法および分離方法、ならびにウェハの加工方法
JP2002-282307 2002-09-27
JP2002282307A JP2004115682A (ja) 2002-09-27 2002-09-27 固体の固定化剤ならびに固体の固定化方法および分離方法
JP2003059542A JP2004273597A (ja) 2003-03-06 2003-03-06 ウェハ加工方法
JP2003-59542 2003-03-06
JP2003-61792 2003-03-07
JP2003061793A JP2004273723A (ja) 2003-03-07 2003-03-07 ウェハ搬送方法
JP2003061792A JP2004273722A (ja) 2003-03-07 2003-03-07 ウェハ加工方法
JP2003-61793 2003-03-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/501,713 Division US20060275939A1 (en) 2002-05-13 2006-08-10 Composition and method for temporarily fixing solids

Publications (1)

Publication Number Publication Date
WO2003095579A1 true WO2003095579A1 (fr) 2003-11-20

Family

ID=29424952

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/005899 WO2003095579A1 (fr) 2002-05-13 2003-05-12 Composition et procede pour la fixation termporaire de solides

Country Status (6)

Country Link
US (2) US7186448B2 (ja)
EP (1) EP1522567A4 (ja)
KR (1) KR20050006120A (ja)
AU (1) AU2003234794A1 (ja)
TW (1) TWI277148B (ja)
WO (1) WO2003095579A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007092689A3 (en) * 2006-02-06 2010-03-04 Brewer Science Inc. Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

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KR100652788B1 (ko) * 2004-10-26 2006-12-01 다이닛뽕스크린 세이조오 가부시키가이샤 웨이퍼 처리장치 및 웨이퍼 처리방법
US20060267774A1 (en) * 2005-03-24 2006-11-30 Feinberg Stewart C Transponder overmolded with ethylene copolymers
US20070114366A1 (en) * 2005-11-21 2007-05-24 General Electric Company Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same
US20080200011A1 (en) * 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US7713835B2 (en) * 2006-10-06 2010-05-11 Brewer Science Inc. Thermally decomposable spin-on bonding compositions for temporary wafer bonding
JP5788173B2 (ja) 2007-06-25 2015-09-30 ブルーワー サイエンス アイ エヌシー． 高温スピンオン仮接合用組成物
JP5408848B2 (ja) * 2007-07-11 2014-02-05 株式会社ジャパンディスプレイ 半導体装置の製造方法
JP2009056742A (ja) * 2007-08-31 2009-03-19 Seiko Epson Corp 印刷装置及びその制御方法
DE202009018064U1 (de) * 2008-01-24 2010-12-02 Brewer Science, Inc. Gegenstände beim reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat
KR101023838B1 (ko) * 2008-02-04 2011-03-22 주식회사 엘지화학 아크릴계 점착제 조성물, 이를 포함하는 편광판 및 액정표시장치
TWI488933B (zh) 2008-02-01 2015-06-21 Lg Chemical Ltd 含有光學各向異性化合物之丙烯酸系壓感性黏著劑組合物、偏光板、及含彼之液晶顯示裝置
US8741008B2 (en) * 2008-02-18 2014-06-03 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
KR101133064B1 (ko) * 2008-04-25 2012-04-04 주식회사 엘지화학 아크릴계 점착제 조성물, 이를 포함하는 편광판 및액정표시장치
US8488428B2 (en) 2008-05-14 2013-07-16 Nbcuniversal Media, Llc Enhanced security of optical article
WO2010002195A2 (ko) * 2008-07-01 2010-01-07 (주)Lg화학 점착제 조성물, 편광판 및 액정표시장치
US8092628B2 (en) 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
US8771927B2 (en) * 2009-04-15 2014-07-08 Brewer Science Inc. Acid-etch resistant, protective coatings
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
TW201205098A (en) * 2010-07-16 2012-02-01 Chroma Ate Inc Inspection fixture for semiconductor die test maintaining flatness of carrier portion
US9263314B2 (en) 2010-08-06 2016-02-16 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
JP5681502B2 (ja) 2010-09-30 2015-03-11 東京応化工業株式会社 接着剤組成物
JP5661669B2 (ja) 2011-09-30 2015-01-28 東京応化工業株式会社 接着剤組成物、接着フィルムおよび基板の処理方法
KR102108067B1 (ko) * 2013-09-24 2020-05-08 엘지전자 주식회사 이동 단말기 및 광가이드부 제조방법
JP6429388B2 (ja) * 2015-03-19 2018-11-28 株式会社ディスコ 積層デバイスの製造方法
JP6959960B2 (ja) * 2019-06-21 2021-11-05 国立研究開発法人産業技術総合研究所 高分子化合物用剥離剤、接着材料及び接着材料の使用方法
CN113637421B (zh) * 2021-08-05 2022-12-09 杭州电子科技大学 一种可降解胶带及其制备方法

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JPH0232184A (ja) * 1988-07-20 1990-02-01 Polyplastics Co 接着物
JPH07305036A (ja) * 1994-05-13 1995-11-21 Hoechst Gosei Kk 再剥離性感圧接着スティックのり
JPH0820762A (ja) * 1994-07-07 1996-01-23 Sekisui Chem Co Ltd 水溶性粘着剤組成物
JPH0853156A (ja) * 1994-08-08 1996-02-27 Hitachi Chem Co Ltd 電子部品等搬送用粘着フィルム、これを用いた部品搬送方法及び部品剥離方法
JPH0881668A (ja) * 1994-09-13 1996-03-26 Sekisui Chem Co Ltd アクリル系粘着剤組成物
JPH09188868A (ja) * 1996-01-10 1997-07-22 Sekisui Chem Co Ltd 水分散系離型剤組成物及び離型シート
JPH09302070A (ja) * 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JPH10284444A (ja) * 1997-04-03 1998-10-23 Hitachi Chem Co Ltd 半導体ウエハ保護用フィルム及びこれを用いた半導体ウエハ裏面の化学エッチング方法
JPH1171568A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JPH1171567A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JP2001089420A (ja) * 1999-09-16 2001-04-03 Idemitsu Kosan Co Ltd アクリレート化合物とそれを用いた接着剤及び液晶素子
JP2001303019A (ja) * 2000-04-21 2001-10-31 Daicel Chem Ind Ltd 水系感熱性粘着剤組成物及び感熱性粘着シート

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Publication number Priority date Publication date Assignee Title
JPH0232184A (ja) * 1988-07-20 1990-02-01 Polyplastics Co 接着物
JPH07305036A (ja) * 1994-05-13 1995-11-21 Hoechst Gosei Kk 再剥離性感圧接着スティックのり
JPH0820762A (ja) * 1994-07-07 1996-01-23 Sekisui Chem Co Ltd 水溶性粘着剤組成物
JPH0853156A (ja) * 1994-08-08 1996-02-27 Hitachi Chem Co Ltd 電子部品等搬送用粘着フィルム、これを用いた部品搬送方法及び部品剥離方法
JPH0881668A (ja) * 1994-09-13 1996-03-26 Sekisui Chem Co Ltd アクリル系粘着剤組成物
JPH09188868A (ja) * 1996-01-10 1997-07-22 Sekisui Chem Co Ltd 水分散系離型剤組成物及び離型シート
JPH09302070A (ja) * 1996-05-20 1997-11-25 Sumitomo Metal Ind Ltd 熱硬化性エポキシ樹脂組成物とその用途および硬化剤
JPH10284444A (ja) * 1997-04-03 1998-10-23 Hitachi Chem Co Ltd 半導体ウエハ保護用フィルム及びこれを用いた半導体ウエハ裏面の化学エッチング方法
JPH1171568A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JPH1171567A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JP2001089420A (ja) * 1999-09-16 2001-04-03 Idemitsu Kosan Co Ltd アクリレート化合物とそれを用いた接着剤及び液晶素子
JP2001303019A (ja) * 2000-04-21 2001-10-31 Daicel Chem Ind Ltd 水系感熱性粘着剤組成物及び感熱性粘着シート

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Title
See also references of EP1522567A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007092689A3 (en) * 2006-02-06 2010-03-04 Brewer Science Inc. Thermal-and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

Also Published As

Publication number Publication date
US20060275939A1 (en) 2006-12-07
TWI277148B (en) 2007-03-21
EP1522567A4 (en) 2005-11-16
EP1522567A1 (en) 2005-04-13
AU2003234794A1 (en) 2003-11-11
US7186448B2 (en) 2007-03-06
KR20050006120A (ko) 2005-01-15
TW200409227A (en) 2004-06-01
US20040185187A1 (en) 2004-09-23

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