WO2001054187A1 - Appareil de commande de transfert de tranches et procede de transfert de tranches - Google Patents
Appareil de commande de transfert de tranches et procede de transfert de tranches Download PDFInfo
- Publication number
- WO2001054187A1 WO2001054187A1 PCT/JP2000/009404 JP0009404W WO0154187A1 WO 2001054187 A1 WO2001054187 A1 WO 2001054187A1 JP 0009404 W JP0009404 W JP 0009404W WO 0154187 A1 WO0154187 A1 WO 0154187A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- time
- processing
- unit
- execution time
- Prior art date
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 221
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000012545 processing Methods 0.000 claims abstract description 383
- 238000004364 calculation method Methods 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims description 479
- 238000012937 correction Methods 0.000 claims description 41
- 230000008859 change Effects 0.000 claims description 29
- 238000001514 detection method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 45
- 239000004065 semiconductor Substances 0.000 abstract description 43
- 230000008569 process Effects 0.000 abstract description 16
- 235000012431 wafers Nutrition 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 24
- 230000032258 transport Effects 0.000 description 24
- 238000003860 storage Methods 0.000 description 18
- 238000007747 plating Methods 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 8
- 238000004590 computer program Methods 0.000 description 7
- 239000013598 vector Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007781 pre-processing Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000003111 delayed effect Effects 0.000 description 3
- 238000009795 derivation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/907—Continuous processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/907—Continuous processing
- Y10S438/908—Utilizing cluster apparatus
Definitions
- the present invention relates to a substrate transfer control device and a substrate transfer method, and more particularly, to a substrate transfer control device that sequentially transfers a plurality of substrates in a substrate processing apparatus such as a semiconductor manufacturing apparatus to a plurality of processing apparatuses using a transfer device, and a processing method. It relates to the substrate transfer method. Further, the present invention relates to a substrate processing apparatus in which the transfer of a substrate is controlled by the substrate transfer control device.
- a plurality of semiconductor substrates are sequentially loaded from a cassette and transported between a plurality of processing devices by a plurality of transporters.
- substrates that are processed in parallel and that have been completely processed are collected in cassettes.
- a plurality of cassettes can be mounted or exchanged.
- the semiconductor manufacturing apparatus is continuously operated by appropriately replacing the cassette with an unprocessed substrate. be able to.
- the control of these semiconductor manufacturing apparatuses in particular, the control of the operation of the transfer device is performed by the substrate transfer control device.
- the status of the transfer device is constantly input from the transfer device being controlled. And based on the status of this transporter, Detects the transporter that is not operating at (not operating). If a non-operating transporter is detected, for each non-operating transporter, the presence or absence of a processed substrate in the processing equipment at the source, an empty arm for the transporter to receive the substrate, and a destination Inspects available processing equipment and finds the next possible operation. Next, for each non-operating transporter having a possible operation, one operation to be performed next is determined, and a command to execute this operation is transmitted to the corresponding transporter. The non-operating transporter that has received the command starts the next operation given.
- the non-operating transfer device moves from the current position to the position of the processing equipment to transfer or receive the substrate only after the operable condition is satisfied. . That is, even if the transporter is not operating, it cannot operate before the operable condition is satisfied, so that the throughput of the semiconductor manufacturing apparatus may deteriorate.
- the next operation is determined sequentially.
- the time at which the final substrate finishes processing and is collected in the cassette is the earliest value that is logically possible (earliest time). than There was a big delay.
- a substrate processed by a certain processing equipment is promptly transferred to the next processing equipment and processed (immediateness) in terms of process processing.
- the substrate after plating is left untreated, its quality will deteriorate due to oxidation, etc., so it should be immediately transported to the next processing equipment for post-treatment such as cleaning. Is required. That is, there may be a case where a certain constraint condition regarding the operation time of the transfer device (in the above-described example, the condition that the waiting time of the transfer device with respect to the processed substrate becomes 0) is required.
- the present invention has been made in view of such problems of the related art.
- Another object of the present invention is to provide a substrate processing apparatus incorporating such a substrate transfer control device.
- one embodiment of the present invention provides a substrate transfer device that transfers a substrate by a transfer device between a plurality of processing devices installed in the substrate processing device.
- a substrate to be processed is set based on a predetermined conditional expression including, as parameters, a time required for each operation of the transporter and a time required for processing the substrate in each processing device.
- Calculate the execution time of each operation of the transporter such that the time at which the last sheet of the transporter finishes all processing and is collected from the substrate processing apparatus is the earliest, and becomes the calculated execution time of each operation of the transporter.
- a substrate transfer method in which the operation is instructed to a corresponding transfer device when the transfer is performed.
- a preferred aspect of the present invention is a substrate transfer method, wherein an execution time of each operation of the transfer device is calculated based on a linear programming method. Further, according to a preferred aspect of the present invention, it is determined whether or not the solution of the execution time of each operation of the transfer device is obtained based on the conditional expression, and when it is determined that the solution of the execution time is not obtained.
- the present invention provides a substrate transport method, wherein the conditional expression is corrected so as to reduce the average number of substrates simultaneously existing in the substrate processing apparatus, and the calculation of the execution time is retried.
- a board transfer method is characterized in that a new execution time is calculated for a board up to the final board determined above while holding a scheduling result before the assumed time.
- the throughput can be approximately maximized while satisfying the process processing constraints.
- the number of additional substrates to be scheduled can be estimated in consideration of the number of sheets that can be calculated, so scheduling should be performed even in a conference where the processing capacity is relatively low. I can do it.
- a time at which the carrier starts to perform each operation is acquired, and a contradiction or a predetermined time is determined between the acquired time and the execution time in the scheduling result obtained in the past. Judgment is made as to whether there is a difference greater than or equal to the prescribed range. If it is determined that there is a contradiction or a difference greater than the predetermined range, it is determined that there is a contradiction or a difference greater than the predetermined range. Is This is a substrate transfer method characterized by correcting the execution time of each operation of a transfer device that has not been performed at a given time.
- One preferred aspect of the present invention is to detect a change in conditions relating to a substrate scheduled to be put into the substrate processing apparatus after the operation of the substrate processing apparatus is started, and to detect a change in conditions relating to the substrate.
- a method of transporting a substrate comprising correcting the execution time of each operation of the transporter with respect to the substrate after the substrate whose condition has been changed.
- the present invention when the processing of one or more substrates in one or more processing equipment in the substrate processing apparatus is omitted, the one or more substrates are transported by skipping the one or more processing equipments.
- the present invention provides a method of transporting a substrate, which calculates an execution time of each operation of the transporter.
- the substrate can be transferred while skipping unnecessary processing equipment types, so that a plurality of processing equipment types can be properly used according to purposes. Therefore, the throughput can be greatly improved, and a flexible operation corresponding to high-mix low-volume production becomes possible.
- Another aspect of the present invention is directed to a substrate transfer control device that controls transfer of a substrate by a transfer device between a plurality of processing apparatuses installed in a substrate processing apparatus.
- An input device for inputting a time required for each operation of the transfer device and a time required for processing a substrate in each processing device, and the time input by the input device as a parameter.
- Based on a predetermined conditional expression calculate the execution time of each operation of the transporter such that the time at which the last substrate of the target substrate is completely processed and collected from the substrate processing apparatus is the earliest.
- a substrate transport comprising: a schedule calculation unit; and an operation command unit that instructs the corresponding transport device to perform the operation when the execution time of each operation of the transport device calculated by the schedule calculation unit comes. It is a control device.
- a preferred aspect of the present invention is the substrate transfer control device, wherein the schedule calculation unit calculates an execution time of each operation of the transfer device based on a linear planning method.
- a preferred aspect of the present invention is a solution determining unit that determines whether or not the solution of the execution time of each operation of the transporter is obtained by the schedule calculation unit, and a solution determination unit that determines the solution of the execution time by the solution determining unit. If it is determined that the time has not been obtained, the conditional expression is modified so as to reduce the average number of substrates simultaneously existing in the substrate processing apparatus, and the calculation of the execution time by the schedule calculation unit is retried. And a retry unit for performing the operation.
- a schedule determination unit that determines whether or not it is necessary to newly calculate the execution time of each operation of the transfer machine by the schedule calculation unit after the operation of the substrate processing apparatus is started.
- the schedule determination unit determines whether the calculated execution time is a new one and the final substrate of the target substrate in the calculation of the execution time by the schedule calculation unit.
- Calculation condition determining unit for determining Wherein the schedule calculation unit is determined by the calculation condition determination unit while holding a scheduling result obtained in the past and before the assumed time determined by the calculation condition determination unit.
- This is a substrate transfer control device characterized in that a new execution time is calculated for substrates up to the final substrate.
- a result time acquisition unit for acquiring a time at which the transport device starts to perform each operation; a time acquired by the result time acquisition unit; and an execution time in a scheduling result obtained in the past.
- Re-scheduling to determine whether there is an inconsistency or a difference exceeding a predetermined range between the re-scheduling judgment unit and the re-scheduling judgment unit.
- a correction unit that corrects the execution time of each operation of the transporter that has not been performed when it is determined that there is a contradiction or a difference that exceeds a predetermined range. This is a substrate transfer control device.
- a condition change detection unit that detects a change in a condition relating to a substrate scheduled to be put into the substrate processing apparatus after the start of the operation of the substrate processing apparatus;
- a correction unit configured to correct, when the detection unit detects a change in the condition relating to the substrate, the execution time of each operation of the transfer device with respect to the substrate after the substrate for which the condition has been changed. This is a substrate transfer control device.
- a substrate transfer control device is characterized in that the execution time of each operation of the transfer device is calculated so as to be transferred while skipping the above processing equipment.
- a substrate processing apparatus including a plurality of processing apparatuses for processing a substrate, wherein the substrate is processed by transporting the substrate by a transporter between the processing apparatuses.
- a substrate processing apparatus provided with a control device.
- FIG. 1 is a schematic diagram showing a configuration of a semiconductor manufacturing apparatus according to one embodiment of the present invention
- FIG. 2 is a diagram showing an example of a hardware configuration according to the first embodiment of the present invention
- FIG. 3 is a block diagram showing a configuration of substrate transfer control according to the first embodiment of the present invention.
- FIG. 4 is a flowchart illustrating a procedure of substrate transfer control according to the first embodiment of the present invention
- FIG. 5 is a block diagram showing a configuration of substrate transfer control according to the second embodiment of the present invention.
- FIG. 6 is a flowchart showing a procedure of substrate transfer control according to the second embodiment of the present invention.
- FIG. 7 is a diagram showing an image of a time domain to be scheduled in the second embodiment of the present invention.
- FIG. 8 is a block diagram illustrating a configuration of substrate transfer control according to the third embodiment of the present invention.
- FIG. 9 is a flowchart showing a procedure of a process performed in a schedule correction unit according to the third embodiment of the present invention.
- FIG. 10 shows a configuration of substrate transfer control according to the fourth embodiment of the present invention. Block diagram
- FIG. 11 is a flowchart showing a procedure of processing performed in a schedule correction unit according to the fourth embodiment of the present invention.
- FIG. 12 is a diagram showing an example of a configuration of a substrate processing apparatus
- FIG. 13 is a diagram showing an example of the flow of a substrate between the types of processing equipment in FIG. 12;
- Figures 14A and 14B show the order of the substrates to be scheduled in Figure 13;
- FIG. 15 is a diagram showing an example of the flow of a substrate between the types of processing equipment in FIG. 12;
- Figures 16A and 16B show the order of the substrates to be scheduled in Figure 15;
- FIG. 17 is a diagram showing an example of the configuration of a substrate processing apparatus
- Figure 18 is a diagram showing an example of the flow of the substrate between the processing equipment types of Figure 17;
- FIGS. 19A to 19C are diagrams showing the order of substrates to be scheduled in FIG. 18;
- FIG. 20 is a block diagram showing the overall configuration of a substrate processing apparatus in which the substrate transfer apparatus according to the present invention is incorporated;
- FIG. 21 is a diagram showing a scheduling result immediately after the start of operation when the execution time of the transfer device is scheduled using the substrate transfer control device according to the second embodiment of the present invention.
- FIG. 22 is a diagram showing a scheduling result after a lapse of a fixed time from the start of operation when the execution time of the transfer device is scheduled using the substrate transfer control device according to the second embodiment of the present invention. It is. BEST MODE FOR CARRYING OUT THE INVENTION
- a substrate transfer control device controls transfer of a substrate between a plurality of processing apparatuses installed in a substrate processing apparatus.
- the substrate processing apparatus in which the substrate transfer is controlled by the substrate transfer control apparatus according to the present invention is a semiconductor manufacturing apparatus that performs processing on a semiconductor substrate (a wafer).
- the present invention is not limited to this, and can be applied to, for example, a substrate processing apparatus that performs processing for manufacturing an LCD on a glass substrate.
- FIG. 1 is a schematic diagram illustrating a configuration of a semiconductor manufacturing apparatus according to the present embodiment.
- a semiconductor manufacturing apparatus controlled by a substrate transfer control device includes transfer devices 1a to 1c for transferring substrates, cassettes 2a and 2b on which substrates are loaded, and substrates. 3a, 3b, reversing machine 4, washing / drying machine 5a, 5b, chemical washing machine 6a, 6b, coarse washing machine 7, pretreatment tank 8a, 8b, plating Tanks 9a to 9d are provided.
- the semiconductor manufacturing apparatus can be configured as various apparatuses such as a CVD apparatus for performing a film forming process and a polishing apparatus for performing a polishing process. can do.
- the substrate loaded in cassette 2a or 2b is loaded into the device by transporter 1a, transported to temporary storage 3a, and then transported to temporary storage 3b by transporter 1b. .
- the substrate is transferred to the pretreatment tank 8a or 8b by the transfer device 1c, processed, and inverted. After that, it is tightened by transporter 1c It is transported to the tanks 9 a to 9 d for processing, and further transported to the rough washing machine 7.
- the substrate after the rough cleaning is transported by the transport device 1b to the chemical cleaning device 6a or 6b, processed, and further transported to the reversing device 4 to be reversed.
- the substrate is finally conveyed to the washing / drying machine 5a or 5b by the transfer machine 1a, processed, and collected in the cassette 2a or 2b that has been loaded first.
- the substrate is not limited to a single substrate, and may be a set of a plurality of substrates integrated by being connected by a jig or the like.
- each operation of the transporters 1 a to 1 c is defined in advance.
- the operations of the transporter 1c include an operation C of moving to the temporary placing table 3b to receive the substrate, an operation D of transporting the substrates to the preprocessing tanks 8a and 8b and delivering the substrate D, and an operation of the preprocessing tank 8 a, 8b to receive the pre-processed substrate E, transfer to plating tanks 9a to 9d and deliver the substrate F, move to plating tanks 9a to 9d for plating
- the operation G which receives the subsequent substrate and moves it to the rough cleaning machine to deliver the substrate, is defined.
- FIG. 2 is a diagram illustrating an example of a hardware configuration of the substrate transfer control device according to the present embodiment
- FIG. 3 is a block diagram illustrating a configuration of the substrate transfer control device according to the present embodiment.
- the board transfer controller 10 is a central processing unit (CPU) 11, a communication device for reading pointing devices such as a keyboard and a mouse, and other devices stored in the console. It comprises an input device 12 such as a device, and a ROM 13, a memory 14, and a hard disk 15 as storage devices.
- the substrate transfer control device 10 is connected to the transfer devices 1 a to lc of the semiconductor manufacturing apparatus via an input / output interface 16, and receives signals from the CPU 11.
- 1 evening field 1 6 Are transferred to the transporters 1 a to lc of the semiconductor manufacturing apparatus via the control unit, thereby controlling the transporters 1 a to lc.
- the R ⁇ M 13 and the hardware and disk 15 store computer program codes for giving instructions to the CPU 11 etc. in cooperation with the OS (Operating System) and controlling board transfer. I have.
- This computer program is executed by being loaded into the memory 14, and performs the substrate transfer control described below in cooperation with the CPU 11.
- the schedule calculation unit 21, solution determination unit 22, time table creation unit 23, operation command unit 24, A retry section 25 is configured.
- the hard disk 15 (or the memory 14) stores a time table 17 created (updated) by a time table creation unit 23 described later.
- FIG. 4 is a flowchart showing a procedure of substrate transfer control in the substrate transfer control device 10 according to the present embodiment.
- the time required for each of the operations 1 a to lc (hereinafter referred to as the scheduled operation time), for example, the estimated time required for the transfer machines 1 a to 1 c to receive the substrate from the processing equipment and the transfer device 1 Enter the expected time required for a to lc to move from one processing equipment position to another processing equipment position (step 1).
- the input of the scheduled operation time is performed via the input device 12 described above.
- the scheduled processing time for example, the time scheduled for cleaning the substrate in the rough cleaning machine 7. Enter (Step 2). This The input of the scheduled processing time is also performed via the input device 12.
- the input device for inputting the scheduled operation time and the scheduled processing time is not limited to the keyboard / pointing device.
- the input scheduled operation time and the scheduled processing time are stored in the storage device 1 in advance. 4 or 15 may be stored as a file, and by reading this file, the scheduled operation time and the scheduled processing time may be input. Alternatively, such a file may be stored in another computer. The scheduled operation time and the scheduled processing time may be input by reading this via the communication device.
- the scheduled operation time is stored in a file, for example, the time required for each operation of the transfer machine is actually measured by a computer connected to each transfer machine, and the measured time is used as the estimated operation time. It may be stored in a file.
- the schedule calculation unit 21 uses the transfer devices 1a to 1c to set the time at which the last substrate (final substrate) to be collected from the semiconductor manufacturing apparatus is completed as soon as possible.
- the operation time of each operation (hereinafter referred to as the execution time) is derived (step 3).
- the derivation of the execution time is performed by calculating a solution that satisfies a predetermined conditional expression. The details will be described later.
- Step 4 determines whether or not a solution that satisfies the above conditional expression is obtained after the operation by the above schedule operation unit 21.
- the time table creator 23 sets the time table 17 based on the execution time, that is, when the obtained execution time and the execution time are reached.
- a table is created (updated) in correspondence with the operation of the transfer machine to be performed, and the table 1 is stored in the hard disk 15 (step 5).
- the operation command unit 24 controls the transporters 1 a to 1 c with reference to the time table 17 stored in the hard disk 15. That is, when the execution time described in the time table 17 is reached, the operation of the corresponding transporter is instructed to the transporter via the input / output interface 16. As a result, the time at which the last substrate to be processed is collected from the semiconductor manufacturing apparatus after completing the entire processing is earlier.
- the operation command section 24 instructs the transfer devices 1a to lc to operate, the transfer device is not operating and the processing of the substrate in the transfer source processing device has been completed. After confirming that the preceding board does not exist in the processing equipment of the transfer destination and that the reset has been completed, the command is transmitted. If these conditions are not satisfied, the operation command section 24 waits until the above conditions are satisfied before transmitting the command.
- the retry unit 25 sets the average number of substrates that exist simultaneously on the transporter in the apparatus and on the processing equipment.
- the condition of the substrate is adjusted so as to reduce the above, that is, the above-mentioned conditional expression is corrected, and the processing after the above step 3 is retried (step 6).
- This conditional expression is modified by inserting virtual substrates (hereinafter referred to as empty substrates) between the substrates at appropriate intervals with the scheduled operation time of the transporter and the scheduled processing time of the processing equipment set to 0. Will be At this time, if the number of substrates simultaneously present in the apparatus is reduced, the operation of the transporter is frequently performed.
- the degree becomes smaller and the carrier has a margin the probability of obtaining a solution increases. If the solution cannot be obtained even after retrying by the retry unit 25, the above conditional expression is modified so as to further reduce the average number of boards that exist simultaneously in the above-mentioned equipment. After the processing of the preceding substrate has been completed and collected in cassette 2a or 2b, the next substrate is loaded into the apparatus.
- the numbers (operation numbers) k of the operations of the transporters 1 a to 1 c are assigned in the order of 1, 2, 3, 3,..., K along the path from the input of the substrate to the semiconductor manufacturing apparatus to the collection. Is defined. Assuming that sufficient time has passed since the start of operation of the semiconductor manufacturing equipment and there are enough substrates in the semiconductor manufacturing equipment and the semiconductor manufacturing equipment is operating steadily, the operation k is executed next to the corresponding transporter. The number of the action performed is denoted by kp (k). Furthermore, it is assumed that an appropriate number of the above-mentioned empty substrates exist before the first substrate at the start of the operation of the semiconductor manufacturing apparatus and after the last substrate at the end of the operation.
- the board number n is determined in the order of loading from the cassette 2a or 2b into the semiconductor manufacturing equipment, and the board number of the board to be operated when moving from operation k to the next operation kp (k) is determined.
- the semiconductor manufacturing apparatus shown in FIG. 1 is defined as follows.
- Operation to convey the received substrate to preprocessing tank 8a or 8b and deliver it D to k 4
- the operation sequence of the transfer machine is determined. deep.
- the operation order of the transporter 1c is periodically defined such that the operation number is 3546 ⁇ 73 7 '. In this case,
- the increment np of the board number when moving from the operation k to the next operation kp (k) is defined as follows. This np is determined in consideration of the number of processing devices 3a to 9d for each type.
- each substrate is a processing device of the same type (for example, 8a to 8b, Assuming that they are assigned in order of 9a to 9d) in order of application ⁇ Periodic, the scheduled operation time shown below is uniquely determined.
- These scheduled operation times are input by the input device 12 described above, or are calculated based on the input values in consideration of the position and route of the transporter.
- T g (k, n) T g (k, n). That is,
- T g (k, n) M 1 (k, n) + G 1 (k, n)
- X f (k, n) idle time of the processing equipment immediately before transferring the substrate to the processing equipment by operation k on the substrate n ⁇ xw (k, n) is the operation including the reception of the substrate from the processing equipment Defined only when Xf (k, n) is the drawing of the substrate to the processing equipment. Only the operation including transfer is defined, but practically, the operation may be limited to the operation of transferring a substrate to a relay-type processing device used for transfer of the substrate between transfer devices.
- Equation 3 P (k, n) in (Equation 2) is the scheduled processing time of the board number n after the operation represented by the operation number k, and This is calculated based on the input value or the input value.In addition to the scheduled processing time such as plating and cleaning, which is usually specified for each substrate, it is necessary to perform processing on processing equipment. This includes the time required for the pre-operation such as closing the shirt and filling the liquid that is performed in advance, and the time required for the post-operation such as draining and shutting down the liquid after the processing is completed.
- U (k) in (Equation 3) represents the number of devices in the type for the processing device that delivers the substrate in operation k.
- Equation 1 is the operation performed by the same transporter after the operation k for the substrate n.
- Equation 2 is the start time of the next operation k + 1 after processing of substrate n by the processing equipment
- Equation 3) is the transfer machine receiving the processed substrate from the processing equipment.
- the start time of the operation of transferring the next substrate n is defined by the above (Equation 1) to (Equation 3), where T, Xr, Xw, and Xf are t (k, ⁇ ), ⁇ r (k , ⁇ ), ⁇ w (k, ⁇ ), ⁇ f (k, ⁇ ), Rm, Wm, Fm as an appropriate matrix, and Rv, Wv, Fv as an appropriate column
- T, Xr, Xw, and Xf are t (k, ⁇ ), ⁇ r (k , ⁇ ), ⁇ w (k, ⁇ ), ⁇ f (k, ⁇ ), Rm, Wm, Fm as an appropriate matrix, and Rv, Wv, Fv as an appropriate column
- the vector T on the left side has an element corresponding to t ( ⁇ , N) representing the start time of the collection operation for the final substrate N (excluding the empty substrate).
- condition for making the collection time earliest can be expressed as follows, where c is an appropriate vector.
- the corresponding element on the right side of (Equation 3b) indicates this time.
- the transporter 1a after the transporter 1a receives the substrate after the inversion, the transporter 1b can deliver the next substrate only after the inversion mechanism is reset. In such a case, the reset required time is added to the corresponding element on the right side.
- the time from receiving the substrate from the immediately preceding processing device in operation k0 to transferring it to the next processing device in operation k0 + 1 is also set.
- a similar form of inequality can be derived.
- a lower-limit constraint condition can be set between the start times of any two operations, whereby it is possible to perform a schedule with some allowance for the transfer device.
- the waiting time before the processing from when the substrate n is delivered to the processing equipment by the operation k until the processing is actually started is defined as xww (k, n), and the waiting time is defined as the variable vector Xr. It is also possible to formulate it. In this case, the upper bound constraint on xw (k + 1, n) The probability that the condition is satisfied can be increased.
- Equations lb) to (Equation 3b) and (Equation 5) can be expressed by the following equations, where A is an appropriate matrix and b is an appropriate column vector.
- FIG. 5 is a block diagram illustrating the configuration of the substrate transfer control device 10 according to the present embodiment
- FIG. 6 is a flowchart illustrating the procedure of the substrate transfer control in the substrate transfer control device 10 according to the present embodiment
- FIG. FIG. 4 is a diagram showing an image of a time domain to be scheduled according to the embodiment.
- the substrate transfer control device of the present embodiment can cope with such a case.
- the substrate transfer control device 10 in the present embodiment repeats the sequential scheduling while moving the scheduling target time region shown in FIG. 7 backward during the operation of the semiconductor manufacturing apparatus, and contradicts the result of each scheduling.
- the control is carried out without adding.
- the board transfer control device 10 according to the present embodiment has a hard disk 15 in which a calculation time table 18 is stored, and a computer program stored in storage devices 13 to 15.
- schedule decision unit 31 computation condition decision unit 32, schedule computation unit 33, solution decision unit 34, time table creation unit 35, operation command unit 36, retry
- the part 37 is composed.
- the expected operation time is input by the input device 12 (step 21), and the expected processing time is input by the input device 12 (step 22).
- the data input by the input device is temporarily stored in the storage device 14 or 15, and by reading the data, the scheduled operation time and the scheduled processing time are input.
- the schedule determination unit 31 determines whether a new scheduling is necessary (step 23). In other words, it checks whether there is a substrate for which the scheduled processing time has been input but the scheduling has not yet been performed.
- the schedule determination unit 31 determines that there is no board that has not been scheduled, that is, if it is determined that new scheduling is not required, the process returns to step 22 again, and the scheduled processing time is input. Wait for
- the calculation condition determining unit 32 sets the scheduled time after the present time and the target of the scheduling calculation.
- the final substrate (excluding the empty substrate) is determined (step 24).
- the final board is It is assumed that this is the last substrate to be newly added as a target of the scheduling operation in addition to the already scheduled substrates, and is not an empty substrate.
- the estimated time and the final substrate are calculated based on the previously derived scheduling results, and the first non-empty substrate (meaning that is not an empty substrate) is entered into the semiconductor manufacturing equipment and the first empty substrate
- the number of additional substrates is estimated within the range of the number of substrates for which the scheduled processing time has been input but the scheduled processing time has not yet been entered. If a positive number of additional substrates cannot be obtained, the estimated time is obtained by shifting the estimated time to the time of collection of the next scheduled substrate. In this way, as shown in FIG. 7, a period from the above-mentioned assumed time to the time when the last substrate is collected is a rough time zone for scheduling.
- the average value of the time required for the scheduling calculation with respect to the number of added boards is stored in the hard disk 15 as a calculation time table 18.
- An appropriate number of additional boards is estimated in consideration of the time required for the calculation stored in the time table 18.
- the time for collecting the final substrate by this new scheduling is usually later than the true earliest value (earliest time) realized when the scheduled processing time for all substrates is given in advance, If the number of substrates to be added in each scheduling is increased to some extent, it can be approximated to the true earliest value approximately.
- the calculation condition determination unit 32 sets the estimated time and the target of the scheduling After the final board is determined, the schedule calculation unit 33 next performs each operation of the transporting machine within the above-mentioned scheduling target time domain based on the conditional expression after adding the above-described additional board.
- the lower limit of the board number of interest for each operation k Ask for may be determined by obtaining an operation that can occur after the estimated time depending on the expected processing time or the expected operation time from the operation order of the transporter. In this way, in the past scheduling results, the execution time of many operations before the assumed time is retained, but there may be an operation where the execution time is not retained near the estimated time.
- an operation that can occur before the start time of the operation of collecting the last substrate to be processed into the cassette for the above scheduling operation is determined, and the upper limit of the substrate number is determined.
- the upper limit of the substrate number is determined.
- the unknown column vectors T, Xr, and the like described above are configured based on the lower and upper limits of the board numbers thus determined, and the scheduling operation is performed. Then, in each scheduling operation, the average value of the required time of the operation stored in the operation time table 18 is updated based on the time actually required for the operation.
- the minimum value of k l, 2, ... ⁇ ⁇ Calculate the operation time in the order of, K.
- the collection time of the substrate becomes the most. Be faster.
- the substrates are processed by the processing equipment 3a to 9d and immediately transferred to the next processing equipment by the transporters 1a to 1c. Conveyed. Therefore, an optimal solution that satisfies the given constraints is obtained.
- step 26 it is determined whether or not the solution of the execution time is obtained by the solution determination unit 34 (step 26), and the solution of the execution time is determined.
- a time table is created (updated) by the time table creating section 35 (step 27). After the time table is created (updated), the process returns to step 22 and repeats the subsequent steps.
- the operation command unit 36 controls the transporters 1 a to 1 c by referring to the time table 17 stored in the hard disk 15, as in the first embodiment.
- step 28 when the solution determination unit 34 determines that the solution at the execution time was not obtained, an empty board is inserted between the boards by the retry unit 37 as in the first embodiment ( In step 28), in such a case, the calculation condition determining unit 32 considers the empty board to be inserted and sets the estimated time and scheduling so that a non-empty additional board exists. Determine the final board to be calculated.
- the safety factor is set to a large value in the above estimation of the number of additional substrates. Therefore, it is necessary to complete the scheduling calculation earlier than the expected time so that the operation instruction unit 36 can issue an operation instruction to the transfer device.
- FIG. 8 is a block diagram illustrating a configuration of the substrate transfer control device 10 according to the present embodiment.
- the board transfer control device 10 includes a scheduling unit 40, a schedule correction unit 50, and an operation command unit 60. Is stored.
- the operation command section 60 corresponds to the operation command section 36 in the above-described second embodiment.
- the scheduling unit 40 includes the schedule determination unit, the calculation condition determination unit, the schedule calculation unit, the solution determination unit, the time table creation unit, and the retry unit in the second embodiment.
- the schedule correction unit 50 includes an actual time acquisition unit 51, a rescheduling determination unit 52, an invalidation unit 53, an elapsed data acquisition unit 54, a correction unit 55, and an activation unit 56. . Both the scheduling unit 40 and the schedule correcting unit 50 are realized by cooperation between the computer program stored in the storage devices 13 to 15 and the CPU 11.
- FIG. 9 is a flowchart showing a procedure of processing performed by the schedule correction unit 50 in the present embodiment.
- the basic processing flow in the scheduling unit 40 is the same as the processing described in the second embodiment described above.
- the condition data such as the scheduled operation time and the scheduled processing time and the above-described t ( k, n), xr (k, n), and the result of the scheduling result such as the last board number that has been scheduled, etc., as an elapsed data file 19, which is inconsistent with the schedule correction unit 50. It differs from the second embodiment in that it is shared and updated.
- the scheduled processing time is also stored in the memory 14 as an elapsed time file 19. Or, it is stored in the hard disk 15.
- the elapsed time file 19 is read, and based on this, the time table generation unit Steps up to the creation (update) of 17 are executed, and the results are stored in the progress file 19.
- the data stored in the progress data file 19 is sequentially deleted from old and unnecessary ones, for example, by referring to the numbers of the boards collected in the cassette after actually completing all the processes at each point in time.
- the schedule determination unit determines the necessity of a new scheduling operation and the calculation condition determination unit determines the final board, taking into account the storage capacity of the transit data file 19 and the frequency of time correction. Then, the range of the substrate to be subjected to the scheduling operation may be restricted.
- the following processing is performed in the schedule correction section 50.
- the actual time acquisition section 51 is connected to the input / output
- the time at which the transporters 1a to 1c actually started each operation via the face 16 (hereinafter, referred to as the actual time) is obtained (step 41).
- the re-scheduling determination unit 52, the actual time acquired by the actual time acquisition unit 51, and the past scheduled by the schedule operation unit of the scheduling unit 40, and the time table 17 Find the difference from the execution time described in It is determined whether or not this difference exceeds a predetermined allowable range (step 42).
- the rescheduling determination unit 52 may determine whether or not inconsistency has occurred in the operation based on the relationship between the actual time and the execution time described in the time table 17. For example, if the operation of one of the transporters is delayed and the other transporter is scheduled to receive the substrate from the processing equipment before actually delivering the substrate to the relay-type processing equipment, Since there is a contradiction, the execution time may be corrected in this case.
- the execution time can be corrected more finely.
- the invalidating section 53 invalidates or stops the processing in the scheduling section 40 (step 43), and the elapsed time and overnight acquisition section 54 outputs the elapsed time.
- the elapsed time is obtained by referring to the file 19 (step 44).
- the correction unit 55 calculates the substrates existing on the transfer machine and the processing equipment in the semiconductor manufacturing apparatus, and Leading single substrate before entering semiconductor manufacturing equipment Regarding the operations that have not been performed at this point in time (including any empty substrates), a new value that satisfies the above (Equation 1) to (Equation 3) and does not fall below the previously scheduled time is set as the new ( The (corrected) execution time is calculated (step 45).
- the scheduled final substrate is the first substrate before being put into the above-mentioned semiconductor manufacturing apparatus, and an appropriate number of blank plates are inserted after that for convenience of calculation.
- the correction unit 55 updates the time table 17 and the elapsed data file 19 based on the corrected execution time (step, repeat 46).
- the time scheduled in the past may be uniformly moved backward according to the delay of the latest actual time. Also, the comparison with the past scheduling results may be made for the time when the transfer device finishes receiving the substrate from the transfer source processing device or the time when the transfer device finishes transferring the substrate to the transfer destination processing device.
- the validating unit 56 re-enables or restarts the processing in the scheduling unit 40 that has been invalidated or stopped by the invalidating unit 53.
- Step 47 After this activation or restart, the scheduling unit 40 performs processing based on the contents of the updated progress data file 19 described above.
- FIG. 10 is a block diagram showing the configuration of the substrate transport control device 10 in the present embodiment.
- the board transfer control device 10 includes a scheduling unit 40, a schedule correction unit 70, and an operation command unit 60. Is stored.
- the scheduling unit 40 and the schedule correction unit 70 are both realized by cooperation between the computer program stored in the storage devices 13 to 15 and the CPU 11.
- the schedule correction unit 70 includes a condition change detection unit 71, an invalidation unit 72, an elapsed data acquisition unit 73, a scheduled processing time update unit 74, a correction unit 75, and an activation unit 7. It consists of six parts.
- FIG. 11 is a flowchart showing a procedure of processing performed in the schedule correction unit 70 in the present embodiment.
- the condition change detection unit 71 changes the condition of a board to be put into the apparatus (hereinafter, referred to as an unloaded board) after the start of the operation, for example, canceling the scheduled time of the apparatus input, and setting the processing time.
- the presence or absence of a change or a change in the device input order is detected via the input device 12 (step 51). conditions If the change detection unit 71 detects a change in the condition relating to an unloaded substrate, the execution time described in the time table 17 needs to be corrected, so the following process is performed.
- the invalidating unit 72 invalidates or stops the processing in the scheduling unit 40 (step 52), and the elapsed time / night acquisition unit 73 refers to the elapsed time data file 19 to execute the above process.
- the scheduled processing time updating unit 74 refers to the above-mentioned change in the condition regarding the unloaded substrate (cancellation of the scheduled loading of the device, change of the scheduled processing time, change of the order of loading the devices, and the like), and obtains the above-mentioned progress data.
- the data on the scheduled processing time accumulated in the past is updated (step 54).
- a new loading order is set for the unloaded substrates after the condition is changed, and the scheduled processing time is updated based on the loading order.
- the constraint on transport is specified for each substrate, the constraint is similarly updated.
- the correction unit 75 determines the current board based on the past scheduling result in the elapsed data. Cancel the scheduling result after the board and insert an appropriate number of empty boards. Then, a new (corrected) execution time is calculated as a minimum value that satisfies the above (Equation 1) to (Equation 3) and does not fall below the previously scheduled time (step 55). At this time, the scheduled last board is the last board whose scheduled processing time has not been changed in step 54. Then, the correction unit 75 updates the time table 17 and the elapsed data file 19 based on the corrected execution time (step 56). Note that in step 55, the transfer device is A comparison with past scheduling results may be made for the time when the substrate is completely received from the server or the time when the substrate is finished being delivered to the processing equipment of the transfer destination.
- the validating unit 76 re-validates or restarts the processing in the scheduling unit 40 that has been invalidated or stopped by the invalidating unit 72 (step 57).
- the scheduling section 40 performs processing based on the updated contents of the progress file 19.
- the operation execution time can be recalculated based on the changed scheduled processing time for the substrates subsequent to the first substrate whose scheduled processing time has been changed in step 54 above. In this way, even if there is a change in the condition regarding the substrate that has not been loaded, such as cancellation of processing, a change in the scheduled processing time, or a change in the order of loading the equipment, the substrate processing apparatus is operated flexibly in response to this change. It becomes possible.
- schedule correction unit 70 of the present embodiment and the schedule correction unit 50 of the third embodiment described above may be configured to function simultaneously.
- the schedule calculation unit in each of the above embodiments executes the execution time of each operation of the transporter such that the time at which the last substrate of the target substrate has been processed and collected from the semiconductor manufacturing apparatus is the earliest. Is derived.
- each operation of the transfer machine is performed such that the tomb plate is transported over the specified processing equipment even when the processing of a certain processing equipment for a specific substrate is designated to be omitted. It is possible to calculate the execution time. Omission of such processing can be designated, for example, by setting the scheduled processing time for a specific substrate in a certain processing apparatus to zero. When a substrate is transported by jumping over processing equipment in this way, an appropriate number of empty substrates are inserted immediately before the processing equipment that jumps and immediately before the target substrate.
- the execution time is calculated by the calculation based on the linear programming described above.
- processing equipment types S 1 to S 3 are installed in a substrate processing apparatus. Operations including delivery of substrates to processing equipment types S1 to S3 k ⁇ 1, k, and k + 1 are performed by the same transporter, and substrates A, B, C, and D are processed in this order. It shall be thrown into the equipment and transported and processed.
- FIG. 13 and FIG. 15 which will be described later show examples of the flow of the substrate between the processing device types in FIG. 12, and the time axis is taken downward.
- this operation [k + 1, 2] does not inhibit the operation [k-1, 5] including the transfer of the substrate C (5) to the processing device type S1.
- the operation [k, 4] is treated as an operation on an empty substrate, that is, an operation having no operation time of zero.
- the processing equipment type of the transfer source is replaced from S2 to S1, and the operation including the transfer of the board D (6) to the processing equipment type S1
- This operation [k + 1, 3] is performed before the operation [k, 5] including the reception of the substrate C (5) from the processing equipment type S 1 so as not to disturb [k ⁇ 1, 6].
- the substrate C is transferred from the processing device type S1 to the processing device type S3.
- the action [k, 5] is also treated as an insubstantial action.
- the empty substrate before the substrates B and C is moved to the rear of the substrates B and C after the operation [k + 1, 3] as shown in FIG. 14B. It will move.
- a number obtained by subtracting 1 from the number of devices 2 of the processing device type S2, that is, one empty substrate ⁇ ⁇ is inserted immediately before the substrate B.
- the operation including the reception of the substrate B (3) from the processing device type S 1 [k: [3] is treated as an operation on an empty substrate, and the next operation, that is, an operation [k + 1, 2] on an empty substrate ⁇ ⁇ ⁇ ⁇ ⁇ , is performed by replacing the processing equipment type of the transfer source from S2 to S1.
- the substrate B is transferred from the processing device type S1 to the processing device type S3.
- the transporter can transfer these substrates C and D to the processing device type S1 without any problem.
- the empty substrate in front of the substrates B and C moves to the rear of the substrates B and C as shown in FIG. 16B.
- the transfer of the substrate to another transfer device via the relay type processing device type is performed instead of the operation k-1.
- the jump can be performed by determining the number of empty substrates to be inserted so as not to affect the operation order of the other transfer device.
- FIG. 17 a case will be described as an example where processing equipment types S1 to S4 are installed in the substrate processing apparatus.
- the operations k—1, k, k + 1, and k + 2, including the transfer of the board to the processing equipment types S1 to S4, are performed by the same transporter, and the boards A, B, C, D, E, and F are In this order, they are loaded into the substrate processing apparatus, transported and processed.
- the operation sequence of the conveyor during the steady operation is k + 2, k + 1 3 k, a k-1, is assumed to operate conveyor is in the order shown in FIG. 18. In FIG. 18 as well, the time axis is set downward.
- the processing equipment type of the transport source in the above operation [k + 1, 5] is replaced with S1 from S2, and the operation [k, 1] including the reception of the substrate E (7) from the processing equipment type S1
- the above operation [k + 1, 5] is performed prior to 7].
- the substrate E is transported over the processing equipment S2.
- one of the empty substrates moves to the rear of the substrate D.
- the processing equipment type of the transport source in the operation [k + 2, 4] is replaced with S2 from S3, and the operation [k + 1, 4] including the reception of the substrate D from the processing equipment type S2 is performed.
- the above operation [k + 2, 4] is performed prior to 6].
- the substrate D is transported while skipping the processing equipment S3.
- the processing equipment type of the transport source in the above operation [k + 1, 6] is replaced with S1 from S2, and the operation [k, 1] including the reception of the board F (8) from the processing equipment type S1
- the above operation [k + 1, 6] is performed prior to [8].
- the substrate F is transported over the processing equipment S2.
- the two empty substrates move behind the substrate F as shown in FIG. 19C.
- the present invention during continuous operation of the substrate processing apparatus, for each substrate, an unnecessary processing device type is skipped and the substrate is transported, or a plurality of processing device types are selectively used according to purposes.
- the throughput can be greatly improved compared to a case where the continuous operation is stopped once and a substrate that performs different processing is handled, and when a substrate processing apparatus is separately prepared for each purpose. Compared with this, the cost can be significantly reduced.
- the correction unit (reference numeral in FIG. 8) is used. In the case of 55 and 75 in Fig. 10, jumping is also considered.
- FIG. 20 shows a substrate processing apparatus according to the present embodiment.
- FIG. 2 is a block diagram showing an overall configuration of a (semiconductor manufacturing apparatus).
- This substrate processing apparatus includes, as a main body, transfer apparatuses 1a to 1c, cassettes 2a and 2b, and processing apparatuses 3a to 9d shown in FIG.
- the substrate processing apparatus includes an apparatus control unit 100 including a computer, a scheduler 102 including an independent computer, a display apparatus 104 for displaying the state of the apparatus, and the like.
- the above-mentioned input device 12 for inputting operating conditions and control conditions of the device is provided.
- the storage devices inside the device control unit 100 and the scheduler 102 store the above-mentioned computer program for board control and the computer program for device control.
- the device control unit 100 and the scheduler 102 may be configured by cooperating a plurality of computers, or they may be configured by a single computer. Good.
- the apparatus control unit 100 includes controllers 1a to 1c connected to the transporters 1a to 1c, cassettes 2a and 2b, and the processing devices 3a to 9d in the apparatus body. 1 and a main controller 120 connected to these controllers 110 to 112.
- the controllers 110 to 112 receive a command from the main controller 120 and transmit the command to each of the devices 1a to 9d. Further, the controllers 110 to 112 monitor the devices 1 a to 9 d and transmit the states of the devices 1 a to 9 d to the main controller 120.
- the main controller 120 has a function of transmitting a processing start command, processing conditions, and the like to the processing devices 3 a to 9 d, and an operation command section (reference numeral 24 in FIG. 3; Reference numerals 36 in FIG.
- FIG. 8 and reference numeral 60 in FIG. 10 an actual time acquisition unit (reference numeral 51 in FIG. 8), a rescheduling judgment unit (reference numeral 52 in FIG. 8), and conditions.
- Change detection unit (signs in Fig. 10 7 1) is included.
- a display device 104 and an input device 12 are connected to the main controller 120.
- the scheduler 102 includes a schedule calculation unit (reference numeral 21 in FIG. 3 and reference numeral 33 in FIG. 5) for controlling the above-described transport device, a solution determination unit (reference numeral 22 in FIG. 3, reference numeral 34 in FIG. 5). ), Retry section (reference number 25 in FIG. 3, reference number 37 in FIG. 5), remote table creation section (reference number 23 in FIG. 3, reference number 35 in FIG. 5), schedule determination section (see FIG. 5).
- Reference numeral 31 an operation condition determination unit (reference numeral 32 in FIG. 5), an invalidation unit (reference numeral 53 in FIG. 8, reference numeral 72 in FIG. 10), and a progress data acquisition unit (refer to FIG. 8)
- the configuration of the main controller 120 and the scheduler 102 is just an example, and it goes without saying that the main controller 120 and the scheduler 102 may have a different configuration.
- the power supply of the device main body is linked to the power supply of the device control unit 100, the display device 104, the input device 12, and the scheduler 102.
- the device control unit 1 0 0, display device 104, input device 12 and scheduler 102 are also automatically turned on, and the device control unit 100, display device 104, input device 12 and scheduler 1-2 are started. I do.
- the scheduler 102 is in a standby state for a signal from the main controller 120.
- the input device 12 allows the use of each of the processing devices 3 a to 9 d of the apparatus main body, and each processing unit 1 a to lc performs each processing.
- a transfer route indicating the order in which substrates are transferred between the types of the physical devices 3a to 9d, the order of basic operations of the transfer devices 1a to 1c during normal operation, and the like are input.
- an operation command is transmitted from the main controller 120 to each of the transporters 1a to 1c to operate the transporters 1a to 1c in the apparatus main body, and the respective transporters 1a to 1c are operated. The time required for the operation may be obtained.
- the main controller 120 performs start processing such as returning to the home position of the transporters 1 a to lc and initializing the processing devices 3 a to 9 d.
- start processing such as returning to the home position of the transporters 1 a to lc and initializing the processing devices 3 a to 9 d.
- the scheduler 102 transmits to the scheduler 102 an operation start command and data such as the above-described transport path, basic operation sequence, and scheduled operation time.
- the scheduler 102 reads these data and performs initialization processing such as setting of the internal memory.
- the input device 12 inputs the scheduled processing time for these unprocessed substrates and constraints on transport.
- the data is transmitted to the scheduler 102 via the main controller 120.
- the scheduler 102 reads the data on the scheduled processing time and the constraint conditions, calculates the execution time of each operation for the first substrate by the above-described substrate transfer control, creates a time table, This time table is transmitted to the main controller 120.
- the main controller 120 starts the operation of the transporter and the processing in each processing device corresponding thereto based on the time table, and starts measuring the execution time of each operation.
- the main controller 120 commands the conveyors 1a to 1c to operate.
- the main controller 120 transmits the execution time of each operation to the scheduler 102, and transmits the position of each board, the progress of the processing, and the like to the output device 104. .
- the transmission of the status of the main body of the device will be performed continuously at appropriately determined intervals.
- the scheduler 102 sets an appropriate number of additional boards as described above with respect to the second and subsequent boards for which the scheduled processing time is first obtained, and sequentially schedules them by the linear programming method. Send the updated timetape to the main controller 120.
- the scheduler 102 issues a command to stop the time of the main controller 120 before transmission, prohibits the start of a new operation, and disables the time table during transmission. Only the portion corresponding to the unexecuted operation may be transmitted, and after this transmission, the time of the main controller 120 may be restarted.
- the time table is stored and accumulated in the storage device in the scheduler 102, and a fixed amount of schedule is created starting from the unexecuted operations.
- the data may be transmitted to the main controller 120 sequentially at regular intervals regardless of the scheduling operation.
- the scheduled processing time of each substrate and constraints on transport are entered in the same manner as described above.
- the input and input data is transmitted from the main controller 120 to the scheduler 102.
- the scheduler 102 reads these data and accumulates them in the progress data file, and continues the sequential scheduling by the linear programming described above.o
- the scheduler 102 waits until the scheduled processing time of the next board that has not been loaded is input. I do.
- the main controller 120 measures the execution time of each operation during the operation of the apparatus main body, and monitors the difference between the measured time and the time specified on the time table. As described above, if there is a delay in the operation time of each transporter 1a to 1c, the processing time in each processing equipment 3a to 9d, and the reset time, the execution time of the resulting operation will be delayed. Sometimes. In such a case, the main controller 120 sends a time correction command to the scheduler 102 by the rescheduling determination unit described above, and in response, the scheduler 102 receives the execution time of the unexecuted operation. Update the time table with the correction, and send it to the main controller 120. At this time, the main controller 120 stops the time before transmitting the correction command and restarts after receiving the time table, so that there is no inconsistency between the corrected time table and the actual operation. To
- the input device 12 cancels the input of the unprocessed substrate or changes the processing time.
- the information is transferred from the main controller 120 to the scheduler 102 together with the correction instruction for the board not yet input.
- the scheduler 102 updates a part of the timetable and updates To the main controller 120. Note that, as in the case of the above-described time correction command, the main controller 120 stops the time before transmitting the correction command for the not-input board to the scheduler 102, and after receiving the time table, restart.
- the main controller 120 stops checking the transmission from the scheduler 102 and clears the memory. End processing such as release is performed, and the state returns to the state after the above-described activation. Similarly, the scheduler 102 and the input device 12 also return to the state after the start. In this case, the next operation can be performed by resetting the transfer route, the order of the basic operation, the scheduled operation time, and the like from the input device 12. Alternatively, the processing can be restarted by inputting the operation start command again with the settings as they are, installing the cassette of the unprocessed substrate, and restarting the processing.
- FIG. 21 and FIG. 22 show an example of a result of scheduling the execution time of the transfer device using the substrate transfer control device according to the second embodiment described above.
- the numbers represent the board numbers
- the solid lines sandwiched by X corresponding to the transporters 1 a to lc indicate that each transporter is operating.
- the solid line between * corresponding to devices 3a to 9d indicates that processing is being performed in each processing device.
- FIG. 21 shows the scheduling result immediately after the start of the operation of the substrate transfer control device. It can be seen that the margin of the transfer devices 1a to 1c at this time is large.
- FIG. 22 shows a steady state in which a certain time has elapsed from the start of operation of the substrate transfer control device. In Fig. 22, each transporter has a short downtime and is almost always in operation, but nevertheless, the plating tanks 9a to 9 with the constraint that the transporter wait time after substrate processing is set to 0 In d, Figure 22 As shown above, it can be seen that the transporter started to move to the plating tank before the processing was completed, immediately received the processed substrate, and was transported to the rough cleaning machine 7.
- the present invention is to schedule the execution time of each operation of the transporter such that the time at which the last substrate of the target substrate has been completely processed and collected from the substrate processing apparatus is the earliest. Therefore, the throughput of the substrate processing apparatus can be maximized.
- the final conditions of the target board are all processed while satisfying the constraints set for the operation time of the transporter.
- the time at which the substrate is collected from the substrate processing apparatus can be made earliest, and the requirements for the processing can be satisfied, and the throughput of the substrate processing apparatus can be maximized.
- the throughput can be approximately maximized while satisfying the constraints on the process processing.
- the number of additional substrates to be scheduled can be estimated in consideration of the number of sheets that can be calculated, so scheduling is performed even in a computer with relatively low processing capacity. be able to.
- the substrate processing equipment can be transferred while skipping unnecessary processing equipment types, so that a plurality of processing equipment types can be properly used according to purposes. Therefore, the throughput can be greatly improved, and the flexible operation corresponding to high-mix low-volume production becomes possible.
- the present invention is directed to a substrate transfer control device that sequentially transfers a plurality of substrates in a substrate processing apparatus such as a semiconductor manufacturing apparatus to a plurality of processing devices by using a transfer device, and processes the substrates. It is suitably used for a substrate processing apparatus to be used.
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Strategic Management (AREA)
- Economics (AREA)
- Human Resources & Organizations (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Marketing (AREA)
- Tourism & Hospitality (AREA)
- General Business, Economics & Management (AREA)
- Entrepreneurship & Innovation (AREA)
- Manufacturing & Machinery (AREA)
- Development Economics (AREA)
- Quality & Reliability (AREA)
- Operations Research (AREA)
- Game Theory and Decision Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Primary Health Care (AREA)
- Automation & Control Theory (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Educational Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Control Of Conveyors (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/181,293 US6772029B2 (en) | 2000-01-17 | 2000-12-28 | Wafer transfer control apparatus and method for transferring wafer |
JP2001553578A JP3995478B2 (ja) | 2000-01-17 | 2000-12-28 | 基板搬送制御装置及び基板搬送方法 |
EP00987798A EP1255294A4 (en) | 2000-01-17 | 2000-12-28 | SEMI-SLIDE TRANSPORT CONTROL APPARATUS AND METHOD OF TRANSPORTING SEMICONDUCTED DISCS |
US10/869,848 US7072730B2 (en) | 2000-01-17 | 2004-06-18 | Substrate transfer controlling apparatus and substrate transferring method |
US11/385,760 US7313452B2 (en) | 2000-01-17 | 2006-03-22 | Substrate transfer controlling apparatus and substrate transferring method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-8038 | 2000-01-17 | ||
JP2000008038 | 2000-01-17 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/181,293 A-371-Of-International US6772029B2 (en) | 2000-01-17 | 2000-12-28 | Wafer transfer control apparatus and method for transferring wafer |
US10181293 A-371-Of-International | 2000-12-28 | ||
US10/869,848 Division US7072730B2 (en) | 2000-01-17 | 2004-06-18 | Substrate transfer controlling apparatus and substrate transferring method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001054187A1 true WO2001054187A1 (fr) | 2001-07-26 |
Family
ID=18536375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2000/009404 WO2001054187A1 (fr) | 2000-01-17 | 2000-12-28 | Appareil de commande de transfert de tranches et procede de transfert de tranches |
Country Status (6)
Country | Link |
---|---|
US (3) | US6772029B2 (ja) |
EP (1) | EP1255294A4 (ja) |
JP (1) | JP3995478B2 (ja) |
KR (1) | KR100823237B1 (ja) |
TW (1) | TW473813B (ja) |
WO (1) | WO2001054187A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006260294A (ja) * | 2005-03-17 | 2006-09-28 | Sumitomo Metal Ind Ltd | 製鋼プロセスの操業スケジュール作成システム、製鋼プロセスの操業スケジュール作成方法、及びコンピュータプログラム |
US7392812B2 (en) * | 2002-12-02 | 2008-07-01 | Kaijo Corporation | Substrate processing apparatus and substrate transporting device mounted thereto |
WO2008133286A1 (ja) | 2007-04-20 | 2008-11-06 | Ebara Corporation | 研磨装置及びそのプログラム |
JP2009021589A (ja) * | 2007-07-05 | 2009-01-29 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
JP2013118415A (ja) * | 2013-03-15 | 2013-06-13 | Hitachi High-Technologies Corp | 半導体処理システム及びプログラム |
JP2015216326A (ja) * | 2014-05-13 | 2015-12-03 | キヤノン株式会社 | 露光装置及びその制御方法、並びにデバイスの製造方法 |
US9385016B2 (en) | 2009-12-14 | 2016-07-05 | Hitachi High-Technologies Corporation | Semiconductor processing system and program |
US9673067B2 (en) | 2013-04-23 | 2017-06-06 | Ebara Corporation | Substrate processing apparatus and processed substrate manufacturing method |
JP2023032391A (ja) * | 2021-08-27 | 2023-03-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4915033B2 (ja) * | 2000-06-15 | 2012-04-11 | 株式会社ニコン | 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法 |
US7280883B2 (en) * | 2001-09-06 | 2007-10-09 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing system managing apparatus information of substrate processing apparatus |
US7218983B2 (en) * | 2003-11-06 | 2007-05-15 | Applied Materials, Inc. | Method and apparatus for integrating large and small lot electronic device fabrication facilities |
US7720557B2 (en) * | 2003-11-06 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
TWI316044B (en) | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
KR101018525B1 (ko) * | 2004-03-31 | 2011-03-03 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
US8078311B2 (en) * | 2004-12-06 | 2011-12-13 | Tokyo Electron Limited | Substrate processing apparatus and substrate transfer method adopted in substrate processing apparatus |
US7346413B2 (en) * | 2005-05-09 | 2008-03-18 | International Business Machines Corporation | Productivity for tool having plurality of processing modules |
JP4492875B2 (ja) * | 2005-06-21 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
US9235413B1 (en) * | 2005-08-03 | 2016-01-12 | National Semiconductor Corporation | Automated control of semiconductor wafer manufacturing based on electrical test results |
JP2007058499A (ja) * | 2005-08-24 | 2007-03-08 | Matsushita Electric Ind Co Ltd | 情報処理装置およびデータ書き込み方法 |
JP4884801B2 (ja) * | 2005-10-06 | 2012-02-29 | 東京エレクトロン株式会社 | 処理システム |
US7840452B2 (en) * | 2006-08-30 | 2010-11-23 | International Business Machines Corporation | Application, method and process for managing part exchangeability across functional boundaries |
JP5154102B2 (ja) * | 2007-03-07 | 2013-02-27 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
US20090069919A1 (en) * | 2007-09-07 | 2009-03-12 | International Business Machines Corporation | Intelligent mass production planning and routing system |
JP4828503B2 (ja) * | 2007-10-16 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) * | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5294681B2 (ja) * | 2008-04-28 | 2013-09-18 | 東京エレクトロン株式会社 | 基板処理装置及びその基板搬送方法 |
KR20090117580A (ko) * | 2008-05-08 | 2009-11-12 | 엘지전자 주식회사 | 부호어의 생성 방법 |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
US8110511B2 (en) * | 2009-01-03 | 2012-02-07 | Archers Inc. | Methods and systems of transferring a substrate to minimize heat loss |
US7897525B2 (en) * | 2008-12-31 | 2011-03-01 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US8367565B2 (en) * | 2008-12-31 | 2013-02-05 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
JP5410794B2 (ja) * | 2009-03-17 | 2014-02-05 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5463066B2 (ja) * | 2009-04-30 | 2014-04-09 | 東京エレクトロン株式会社 | ロット処理開始判定方法及び制御装置 |
US8655472B2 (en) | 2010-01-12 | 2014-02-18 | Ebara Corporation | Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus |
KR101868304B1 (ko) * | 2010-04-09 | 2018-06-15 | 가부시키가이샤 니콘 | 기판 처리 장치 |
US20130079913A1 (en) * | 2011-09-28 | 2013-03-28 | Globalfoundries Inc. | Methods and systems for semiconductor fabrication with local processing management |
NL2010166A (en) * | 2012-02-22 | 2013-08-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
US8881297B2 (en) * | 2012-09-06 | 2014-11-04 | Brooks Automation, Inc. | Access arbitration module and system for semiconductor fabrication equipment and methods for using and operating the same |
US9146551B2 (en) | 2012-11-29 | 2015-09-29 | Asm Ip Holding B.V. | Scheduler for processing system |
JP5867473B2 (ja) * | 2013-09-19 | 2016-02-24 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像装置の運転方法及び記憶媒体 |
JP6370084B2 (ja) * | 2014-04-10 | 2018-08-08 | 株式会社荏原製作所 | 基板処理装置 |
JP2017518626A (ja) * | 2015-02-17 | 2017-07-06 | ソーラーシティ コーポレーション | 太陽電池の製造歩留まりを向上させる方法及びシステム |
TWI617818B (zh) * | 2015-05-28 | 2018-03-11 | Seiko Epson Corp | Electronic component transport system, electronic component inspection system, electronic component transport device, and electronic component inspection device |
US20160359080A1 (en) | 2015-06-07 | 2016-12-08 | Solarcity Corporation | System, method and apparatus for chemical vapor deposition |
US10295979B2 (en) * | 2015-09-15 | 2019-05-21 | Applied Materials, Inc. | Scheduling in manufacturing environments |
US9748434B1 (en) | 2016-05-24 | 2017-08-29 | Tesla, Inc. | Systems, method and apparatus for curing conductive paste |
US9954136B2 (en) | 2016-08-03 | 2018-04-24 | Tesla, Inc. | Cassette optimized for an inline annealing system |
US10115856B2 (en) | 2016-10-31 | 2018-10-30 | Tesla, Inc. | System and method for curing conductive paste using induction heating |
JP6517845B2 (ja) * | 2017-01-17 | 2019-05-22 | 株式会社荏原製作所 | スケジューラ、基板処理装置、及び基板搬送方法 |
TWI758578B (zh) * | 2018-03-01 | 2022-03-21 | 日商荏原製作所股份有限公司 | 排程器、基板處理裝置、及基板搬送方法 |
JP6981918B2 (ja) * | 2018-05-11 | 2021-12-17 | 株式会社Screenホールディングス | 基板処理方法、基板処理装置、およびコンピュータプログラム |
CN111489986B (zh) * | 2019-01-28 | 2024-03-22 | 东京毅力科创株式会社 | 基片处理装置和基片处理方法 |
JP2022052165A (ja) * | 2020-09-23 | 2022-04-04 | 東京エレクトロン株式会社 | 半導体製造装置、基板搬送方法及びプログラム |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201950A (ja) * | 1993-12-28 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH10256342A (ja) * | 1997-03-06 | 1998-09-25 | Kokusai Electric Co Ltd | 搬送制御方法 |
JPH11102953A (ja) * | 1997-08-01 | 1999-04-13 | Kokusai Electric Co Ltd | 基板搬送制御方法 |
JP2000332083A (ja) * | 1999-03-17 | 2000-11-30 | Hitachi Ltd | 真空処理装置及びその運転方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2982038B2 (ja) | 1994-04-01 | 1999-11-22 | 東京エレクトロン株式会社 | 被処理体の処理のスケジューリング方法及びその装置 |
JP2994553B2 (ja) * | 1994-04-08 | 1999-12-27 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US5975740A (en) * | 1996-05-28 | 1999-11-02 | Applied Materials, Inc. | Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
JPH10207525A (ja) | 1997-01-21 | 1998-08-07 | Kokusai Electric Co Ltd | 処理制御装置 |
US6201999B1 (en) * | 1997-06-09 | 2001-03-13 | Applied Materials, Inc. | Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool |
JP3442669B2 (ja) * | 1998-10-20 | 2003-09-02 | 東京エレクトロン株式会社 | 基板処理装置 |
US6418350B1 (en) * | 2000-06-09 | 2002-07-09 | Brooks Automation Inc. | Periodic scheduler for dual-arm robots in cluster tools with process-module residency constraints |
US6535784B2 (en) | 2001-04-26 | 2003-03-18 | Tokyo Electron, Ltd. | System and method for scheduling the movement of wafers in a wafer-processing tool |
-
2000
- 2000-12-28 US US10/181,293 patent/US6772029B2/en not_active Expired - Lifetime
- 2000-12-28 EP EP00987798A patent/EP1255294A4/en not_active Withdrawn
- 2000-12-28 WO PCT/JP2000/009404 patent/WO2001054187A1/ja active Application Filing
- 2000-12-28 JP JP2001553578A patent/JP3995478B2/ja not_active Expired - Fee Related
- 2000-12-28 KR KR1020027008868A patent/KR100823237B1/ko not_active IP Right Cessation
- 2000-12-30 TW TW089128444A patent/TW473813B/zh not_active IP Right Cessation
-
2004
- 2004-06-18 US US10/869,848 patent/US7072730B2/en not_active Expired - Lifetime
-
2006
- 2006-03-22 US US11/385,760 patent/US7313452B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07201950A (ja) * | 1993-12-28 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH10256342A (ja) * | 1997-03-06 | 1998-09-25 | Kokusai Electric Co Ltd | 搬送制御方法 |
JPH11102953A (ja) * | 1997-08-01 | 1999-04-13 | Kokusai Electric Co Ltd | 基板搬送制御方法 |
JP2000332083A (ja) * | 1999-03-17 | 2000-11-30 | Hitachi Ltd | 真空処理装置及びその運転方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1255294A4 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7392812B2 (en) * | 2002-12-02 | 2008-07-01 | Kaijo Corporation | Substrate processing apparatus and substrate transporting device mounted thereto |
JP4501740B2 (ja) * | 2005-03-17 | 2010-07-14 | 住友金属工業株式会社 | 製鋼プロセスの操業スケジュール作成システム、製鋼プロセスの操業スケジュール作成方法、及びコンピュータプログラム |
JP2006260294A (ja) * | 2005-03-17 | 2006-09-28 | Sumitomo Metal Ind Ltd | 製鋼プロセスの操業スケジュール作成システム、製鋼プロセスの操業スケジュール作成方法、及びコンピュータプログラム |
WO2008133286A1 (ja) | 2007-04-20 | 2008-11-06 | Ebara Corporation | 研磨装置及びそのプログラム |
US8206197B2 (en) | 2007-04-20 | 2012-06-26 | Ebara Corporation | Polishing apparatus and program thereof |
JP2009021589A (ja) * | 2007-07-05 | 2009-01-29 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
US9385016B2 (en) | 2009-12-14 | 2016-07-05 | Hitachi High-Technologies Corporation | Semiconductor processing system and program |
JP2013118415A (ja) * | 2013-03-15 | 2013-06-13 | Hitachi High-Technologies Corp | 半導体処理システム及びプログラム |
US9673067B2 (en) | 2013-04-23 | 2017-06-06 | Ebara Corporation | Substrate processing apparatus and processed substrate manufacturing method |
JP2015216326A (ja) * | 2014-05-13 | 2015-12-03 | キヤノン株式会社 | 露光装置及びその制御方法、並びにデバイスの製造方法 |
JP2023032391A (ja) * | 2021-08-27 | 2023-03-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP7289881B2 (ja) | 2021-08-27 | 2023-06-12 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
TWI828196B (zh) * | 2021-08-27 | 2024-01-01 | 日商斯庫林集團股份有限公司 | 基板處理裝置及基板處理方法 |
Also Published As
Publication number | Publication date |
---|---|
US7313452B2 (en) | 2007-12-25 |
JP3995478B2 (ja) | 2007-10-24 |
KR20020070336A (ko) | 2002-09-05 |
EP1255294A1 (en) | 2002-11-06 |
KR100823237B1 (ko) | 2008-04-18 |
US6772029B2 (en) | 2004-08-03 |
US20040249494A1 (en) | 2004-12-09 |
US20060161286A1 (en) | 2006-07-20 |
US7072730B2 (en) | 2006-07-04 |
US20020192055A1 (en) | 2002-12-19 |
EP1255294A4 (en) | 2009-01-21 |
TW473813B (en) | 2002-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2001054187A1 (fr) | Appareil de commande de transfert de tranches et procede de transfert de tranches | |
JP4921726B2 (ja) | オブジェクトを製造するためのコンピュータ制御されたマルチ・ステップの製造システム内で例外取扱いを実行するための方法、システム、及び、コンピュータによって利用可能な記録媒体 | |
TWI521628B (zh) | 排程器、基板處理裝置,及基板處理裝置之基板傳送方法 | |
KR101079487B1 (ko) | 기판 캐리어 핸들러의 향상된 동작을 위한 방법 및 장치 | |
JP4845553B2 (ja) | 基板処理装置のスケジュール実行方法及びそのプログラム | |
JP5415356B2 (ja) | 基板処理装置の基板搬送方法、スケジューラ、及び基板処理装置の運転制御装置 | |
JP5277838B2 (ja) | 搬送制御装置及び搬送システム | |
US6996449B2 (en) | Semiconductor manufacturing apparatus control system | |
JP2000277401A (ja) | 基板処理装置、基板処理装置のシミュレート装置、及び基板処理装置のシミュレートプログラムを記録したコンピュータ読み取り可能な記録媒体 | |
JP2000158254A (ja) | ロット搬送制御システム及びその搬送制御方法ならびに搬送制御プログラムを格納した記憶媒体 | |
JP2003031454A (ja) | 基板処理装置のスケジュール作成方法及びそのプログラム | |
CN1689941A (zh) | 增强载体处理器操作的方法和装置 | |
JP2008210956A (ja) | 基板処理装置のスケジュール作成方法及びそのプログラム | |
JP5077284B2 (ja) | 電子部品実装装置およびデータダウンロード方法 | |
JP2003068823A (ja) | 基板キャリア管理システム、基板キャリア管理方法、プログラム、記録媒体及び半導体装置の製造方法 | |
US7224442B2 (en) | Supply control system and method, program, and information storage medium | |
JP2012104683A (ja) | 半導体装置の製造ライン、及び、半導体装置の製造方法 | |
JP3528286B2 (ja) | 作業ラインシステム | |
JP2013122969A (ja) | 搬送装置、搬送システム、及び、搬送方法 | |
JP4449774B2 (ja) | 物流システム | |
TW487835B (en) | Automation system and its control method | |
JP4530247B2 (ja) | 半導体装置の製造方法 | |
KR20220017831A (ko) | 기판 처리 장치 및 반송 스케줄 제작 방법 | |
JP6357806B2 (ja) | コントローラ冗長化システム、そのコントローラ | |
Seo et al. | Developing a Practical Machine Scheduler for Worker-Involved Systems |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2001 553578 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020027008868 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10181293 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2000987798 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020027008868 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2000987798 Country of ref document: EP |