US6858925B2 - Semiconductor device and a method of manufacturing the same - Google Patents

Semiconductor device and a method of manufacturing the same Download PDF

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Publication number
US6858925B2
US6858925B2 US10/240,187 US24018702A US6858925B2 US 6858925 B2 US6858925 B2 US 6858925B2 US 24018702 A US24018702 A US 24018702A US 6858925 B2 US6858925 B2 US 6858925B2
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United States
Prior art keywords
memory card
base substrate
cap
adapter
view
Prior art date
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Expired - Lifetime, expires
Application number
US10/240,187
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English (en)
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US20030049887A1 (en
Inventor
Tamaki Wada
Hirotaka Nishizawa
Masachika Masuda
Kenji Osawa
Junichiro Osako
Satoshi Hatakeyama
Haruji Ishihara
Kazuo Yoshizaki
Kazunori Furusawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Renesas Electronics Corp
Original Assignee
Renesas Technology Corp
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp, Hitachi ULSI Systems Co Ltd filed Critical Renesas Technology Corp
Priority to US10/364,345 priority Critical patent/US20030117785A1/en
Publication of US20030049887A1 publication Critical patent/US20030049887A1/en
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FURUSAWA, KAZUNORI, HATAKEYAMA, SATOSHI, ISHIHARA, HARUJI, NISHIZAWA, HIROTAKA, OSAKO, JUNICHIRO, OSAWA, KENJI, YOSHIZAKI, KAZUO, MASUDA, MASACHIKA, WADA, TAMAKI
Assigned to RENESAS TECHNOLOGY CORPORATION reassignment RENESAS TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI, LTD.
Assigned to HITACHI ULSI SYSTEMS CO., LTD., HITACHI, LTD. reassignment HITACHI ULSI SYSTEMS CO., LTD. CORRECTIVE COVERSHEET TO ADD SECOND ASSIGNEE THAT WAS PREVIOUSLY RECORDED ON REEL 014075, FRAME 0116. Assignors: FURUSAWA, KAZUNORI, HATEKEYAMA, SATOSHI, ISHIHARA, HARUJI, NISHIZAWA, HIROTAKA, OSAKA, JUNICHIRO, OSAWA, KENJI, YOSHIZAKI, KAZUO, MASUDA, MASACHIKA, WADA, TAMAKI
Application granted granted Critical
Publication of US6858925B2 publication Critical patent/US6858925B2/en
Priority to US11/204,047 priority patent/US7239011B2/en
Priority to US11/203,969 priority patent/US7233058B2/en
Priority to US11/431,072 priority patent/US7294918B2/en
Priority to US11/431,074 priority patent/US7271475B2/en
Assigned to RENESAS TECHNOLOGY CORP. reassignment RENESAS TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI ULSI SYSTEMS CO., LTD.
Priority to US12/508,089 priority patent/US20090283885A1/en
Assigned to RENESAS ELECTRONICS CORPORATION reassignment RENESAS ELECTRONICS CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: NEC ELECTRONICS CORPORATION
Assigned to NEC ELECTRONICS CORPORATION reassignment NEC ELECTRONICS CORPORATION MERGER (SEE DOCUMENT FOR DETAILS). Assignors: RENESAS TECHNOLOGY CORP.
Assigned to RENESAS ELECTRONICS CORPORATION reassignment RENESAS ELECTRONICS CORPORATION CHANGE OF ADDRESS Assignors: RENESAS ELECTRONICS CORPORATION
Adjusted expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G—PHYSICS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
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    • H01L2924/181—Encapsulation
US10/240,187 2001-04-02 2001-12-28 Semiconductor device and a method of manufacturing the same Expired - Lifetime US6858925B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/364,345 US20030117785A1 (en) 2001-04-02 2003-02-12 Semiconductor device and a method of manufacturing the same
US11/203,969 US7233058B2 (en) 2001-04-02 2005-08-16 Memory card with an adaptor
US11/204,047 US7239011B2 (en) 2001-04-02 2005-08-16 Memory card with a cap having indented portions
US11/431,074 US7271475B2 (en) 2001-04-02 2006-05-10 Memory card with connecting portions for connection to an adapter
US11/431,072 US7294918B2 (en) 2001-04-02 2006-05-10 Memory card with connecting portions for connection to an adapter
US12/508,089 US20090283885A1 (en) 2001-04-02 2009-07-23 Semiconductor Device and a Method of Manufacturing the Same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001103535 2001-04-02
JP2000-103535 2001-04-02
PCT/JP2001/011640 WO2002082364A1 (fr) 2001-04-02 2001-12-28 Dispositif semi-conducteur et son procédé de production

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/011640 A-371-Of-International WO2002082364A1 (fr) 2001-04-02 2001-12-28 Dispositif semi-conducteur et son procédé de production

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/267,784 Division US7053471B2 (en) 2001-04-02 2002-10-10 Memory card

Publications (2)

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US20030049887A1 US20030049887A1 (en) 2003-03-13
US6858925B2 true US6858925B2 (en) 2005-02-22

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Family Applications (8)

Application Number Title Priority Date Filing Date
US10/240,187 Expired - Lifetime US6858925B2 (en) 2001-04-02 2001-12-28 Semiconductor device and a method of manufacturing the same
US10/267,784 Expired - Fee Related US7053471B2 (en) 2001-04-02 2002-10-10 Memory card
US10/364,345 Abandoned US20030117785A1 (en) 2001-04-02 2003-02-12 Semiconductor device and a method of manufacturing the same
US11/203,969 Expired - Fee Related US7233058B2 (en) 2001-04-02 2005-08-16 Memory card with an adaptor
US11/204,047 Expired - Fee Related US7239011B2 (en) 2001-04-02 2005-08-16 Memory card with a cap having indented portions
US11/431,074 Expired - Fee Related US7271475B2 (en) 2001-04-02 2006-05-10 Memory card with connecting portions for connection to an adapter
US11/431,072 Expired - Fee Related US7294918B2 (en) 2001-04-02 2006-05-10 Memory card with connecting portions for connection to an adapter
US12/508,089 Abandoned US20090283885A1 (en) 2001-04-02 2009-07-23 Semiconductor Device and a Method of Manufacturing the Same

Family Applications After (7)

Application Number Title Priority Date Filing Date
US10/267,784 Expired - Fee Related US7053471B2 (en) 2001-04-02 2002-10-10 Memory card
US10/364,345 Abandoned US20030117785A1 (en) 2001-04-02 2003-02-12 Semiconductor device and a method of manufacturing the same
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CN101004944A (zh) 2007-07-25
JPWO2002082364A1 (ja) 2004-07-29
US7053471B2 (en) 2006-05-30
EP1376452B1 (en) 2007-04-25
CN1866277A (zh) 2006-11-22
ATE360859T1 (de) 2007-05-15
US7294918B2 (en) 2007-11-13
CN1855132A (zh) 2006-11-01
WO2002082364A1 (fr) 2002-10-17
KR100551658B1 (ko) 2006-02-13
EP1376452A1 (en) 2004-01-02
US20030034552A1 (en) 2003-02-20
US20060220203A1 (en) 2006-10-05
US7239011B2 (en) 2007-07-03
EP1788512A1 (en) 2007-05-23
CN1439144A (zh) 2003-08-27
US20030117785A1 (en) 2003-06-26
CN1855133A (zh) 2006-11-01
CN100501767C (zh) 2009-06-17
KR20030090486A (ko) 2003-11-28
CN100435170C (zh) 2008-11-19
US20090283885A1 (en) 2009-11-19
DE60128151D1 (de) 2007-06-06
JP3943502B2 (ja) 2007-07-11
US20060220204A1 (en) 2006-10-05
US20060033191A1 (en) 2006-02-16
CN1267996C (zh) 2006-08-02
JP2009151815A (ja) 2009-07-09
TWI234273B (en) 2005-06-11
US20030049887A1 (en) 2003-03-13
EP1376452A4 (en) 2005-04-13
US7233058B2 (en) 2007-06-19
DE60128151T2 (de) 2008-01-03
US7271475B2 (en) 2007-09-18
US20050280131A1 (en) 2005-12-22

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