US5373418A - Electrical device for mounting electrical components with enhanced thermal radiating properties - Google Patents

Electrical device for mounting electrical components with enhanced thermal radiating properties Download PDF

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Publication number
US5373418A
US5373418A US07/675,202 US67520291A US5373418A US 5373418 A US5373418 A US 5373418A US 67520291 A US67520291 A US 67520291A US 5373418 A US5373418 A US 5373418A
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US
United States
Prior art keywords
electrical components
recesses
metal base
electrical
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/675,202
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English (en)
Inventor
Satoru Hayasi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
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Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: HAYASI, SATORU
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Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H10W40/22—
    • H10W40/611—
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H10W40/231—
    • H10W74/00—

Definitions

  • This invention relates to electrical devices for mounting electrical components and methods of producing the same, and more particularly to such devices and methods by which a variety of electrical components can be assembled compactly with enhanced assembling efficiency.
  • FIG. 2 is a circuit diagram of an electrical device disclosed, for example, in Japanese laid-open utility model application No. 60-151186.
  • FIG. 3 is a top view of the electrical device for mounting electrical components of the circuit of FIG. 2, and
  • FIGS. 4 and 5 show the sections along the lines A--A and B--B of FIG. 3, respectively. As shown in FIG.
  • the circuit is an inverter circuit for converting the frequency, etc., of a three-phase power, and thus includes: an electromagnetic contactor 1 for turning on and off the power; reactors 2; control transformer 3 for converting the input voltage to a predetermined voltage level; diode bridge rectifier circuit 4 for rectifying the AC current; smoothing capacitor 5 for smoothing the DC current rectified via the diode bridge rectifier circuit 4; discharge transistor 6 for discharging the current charging the capacitors such as smoothing capacitor 5; and transistor inverter circuit 7 for converting the DC current, smoothed via the smoothing capacitor 5, into an AC current of desired frequency.
  • Mold resin box 9 accommodates the electromagnetic contactor 1, the reactors 2, the control transformer 3, and the smoothing capacitor 5.
  • An electrically insulating substrate 10 is provided with short bars for making large-current-carrying electrical connections among the terminals 14 of the electromagnetic contactor 1, the smoothing capacitor 5, the transistor invertor circuit 7, etc.
  • a printed circuit board 11 includes electronic elements for generating control signals.
  • the mold resin box 9 is provided with a cover 12 (removed in FIGS. 3 and 5).
  • the electrical components are fixed via screws on finned aluminum base 8 or within mold resin box 9, in such a manner that the terminals 14 of the electrical components are leveled in their height.
  • the electrically insulating substrate 10 is disposed above the electrical components, such that the short bars on the electrically insulating substrate 10 are in contact with the terminals 14 of the electrical components.
  • the printed circuit board 11 is positioned above the electrically insulating substrate 10 with a predetermined gap formed therebetween. Screws 13 extending through the printed circuit board 11 and the short bars and the electrically insulating substrate 10 secure the electrically insulating substrate 10 and the printed circuit board 11 such that secure electrical connections among the electrical components are ensured. It is noted that the finned aluminum base 8 carries the electrical components which generate a large amount of heat.
  • the above electrical device for mounting electrical components has the following disadvantages.
  • a electrical device for mounting electrical components which includes: a metal base having a plurality of recesses formed on one side thereof for receiving electrical components having terminals projecting therefrom, wherein said recesses have dimensions corresponding to exterior dimensions of the electrical components accommodated therein, such that said terminals of the respective electrical components accommodated in the recesses project to a predetermined height above the metal base; and a circuit board carrying a predetermined pattern of electrical conductors thereon, said circuit board being positioned above said one side of the metal base such that said terminals of the electrical components are in electrical contact with said pattern of electrical conductors carried on said circuit board.
  • the terminals of the electrical components accommodated in the recesses of the metal base extend substantially to an equal height above said metal base.
  • the metal base has fins formed integrally on a side thereof opposite to the side on which said recesses are formed, said fins radiating heat generated via electrical components accommodated in the recesses of the metal base.
  • the electrical components generating a large amount of heat are accommodated in the recesses of the metal base via a high heat conductivity resin and the electrical components generating a small or negligible amount of heat are accommodated in the recesses of the metal base via a heat insulating resin.
  • the above object is also accomplished by a method of producing the above electrical device for mounting electrical components, which includes the steps of:
  • a metal base having on one side thereof the recesses for receiving the electrical components, said recesses having dimensions corresponding to exterior dimensions of the respective electrical components received therein;
  • said circuit board above said side of the metal base having the recesses formed thereon and inserting the board-mounted electrical components carried on said circuit board into respective recesses of the metal base, terminals of electrical components accommodated in the recesses of the metal base coming into electrical contact with electrical conductors on the circuit board.
  • FIG. 1 is a sectional side view of a electrical device for mounting electrical components including a thick substantially plate-shaped metal base according to this invention
  • FIG. 2 is a circuit diagram showing the circuit of a typical converter the electrical components of which are mounted on an electrical device for mounting electrical components;
  • FIG. 3 is a top view of a conventional electrical device for mounting electrical components for mounting the electrical components of the circuit of FIG. 2;
  • FIGS. 4 and 5 show sections along the lines A--A and B--B of FIG. 3.
  • FIG. 1 of the drawings an embodiment of this invention is described.
  • An aluminum metal base 20, made via aluminum die casting process, is provided, at the upper side thereof, with a plurality of recesses 20a for receiving and fittingly accommodating the electrical components, and, at the bottom side thereof, with radiating fins 20b for radiating the heat generated by the electrical components.
  • the recesses 20a, formed at predetermined positions on the metal base 20, have dimensions corresponding to the respective heights and the shapes of the electrical components accommodated therein, such that the terminals of the electrical components are leveled, i.e., extend above the upper surface of the metal base 20 to substantially the same height.
  • the recesses 20a and the radiating fins 20b are formed simultaneously when the metal base 20 is cast by aluminum die casting process.
  • a printed circuit board 21 having a predetermined pattern of electrical conductors 21a is disposed above the metal base 20 to make electrical connections among the electrical components accommodated in the respective recesses 20a of the metal base 20 (such as a resistor 22, a cement resistor 23, a electrolytic capacitor 26, and a power module 27 such as a power transistor module) and the electrical components disposed on the printed circuit board 21 (such as a capacitor 24).
  • the cement resistor 23 generating a particularly large amount of heat is enclosed in a copper covering 28.
  • the copper covering 28 has the same form as the exterior of the cement resistor 23 and is disposed in the recess 20a such that the bottom thereof is in direct contact with the metal base 20.
  • the cover 28 may be made of a good heat conductive material other than copper, such as aluminum, iron, or zinc alloys.
  • a high heat conductivity resin 29 is filled into the recesses 20a accommodating the resistor 22, cement resistor 23, and the power module 27, which generate a large amount of heat. It is noted that the high heat conductivity resin 29 fills the gap between the cement resistor 23, the copper covering 28, and the recess 20a.
  • a resin having fluidity at the normal or elevated temperature such as an epoxy resin, a silicone resin, a urethane resin or a polyester resin, or a mixture thereof, may be utilized as the high heat conductivity resin 29, which preferably includes, as a good heat conducting filler material, a powder made of one or a plurality of the materials selected from: copper, aluminum, silver, gold, iron, stainless steel, brass, alumina, magnesia, crystalline silica, aluminum nitride, silicon oxide, beryllia, silicon, boron nitride, zirconium silicate, silicon carbide, and diamond.
  • the high heat conductivity resin 29 is made as follows. An amine type setting agent is added to an epoxy resin. Further, to 100 parts by weight of the epoxy resin are mixed as a filler material 900 parts by weight of alumina powder, thereby obtaining a resin having a heat conductivity at about 51 ⁇ 10 -4 cal/cm.sec.°C.
  • a heat insulating resin 30 is filled in the recess 20a accommodating the electrolytic capacitor 26 generating a small amount of heat.
  • a resin having fluidity at the normal or elevated temperature such as an epoxy resin, a silicone resin, a urethane resin, or a polyester resin, or a mixture thereof, may be utilized as the heat insulating resin 30, which preferably includes a filler made of minute hollow spheres (referred to as balloon filler) that are made of one or a plurality of the materials selected from: phenol resin (phenol aldehyde resin), epoxy resin, silicone resin, urea resin (urea-formaldehyde resin), alumina, quartz sand, silica, zirconia, and glass.
  • the heat insulating resin 30 is made as follows. An amine type setting agent is added to an epoxy resin. Further, to 100 parts by weight of the epoxy resin are mixed as balloon filler 50 parts by weight of minute hollow silica spheres, thereby obtaining a resin having a heat conductivity at about 2 ⁇ 10 -4 cal/cm. sec.°C.
  • the electrical components accommodated in the recesses 20a of the metal base 20 are electrically connected to the printed circuit board 21 via terminals 31 thereof.
  • the terminals 31 of the resistor 22 and cement resistor 23 are electrically connected to the electrical conductors 21a of the printed circuit board 21 via the solder 25.
  • the terminals 31 of the electrolytic capacitor 26 are electrically connected to the electrical conductors 21a of the printed circuit board 21 via nuts 32.
  • the terminals 31 of the power module 27 are electrically connected to the electrical conductors 21a of the printed circuit board 21 via fixing screws 33.
  • the printed circuit board 21 is supported on the metal base 20 via side supports 34 secured on the metal base 20.
  • the electrical device for mounting electrical components of this embodiment is assembled as follows. First, the board-mounted electrical components, the capacitor 24, the resistor 22, and the cement resistor 23, are soldered to and fixed on the printed circuit board 21 via the solder 25. Thereafter, a predetermined amount of the high heat conductivity resin 29 is poured into the copper covering 28 for the cement resistor 23, and then the cement resistor 23 is encapsulated via the copper covering 28. Further, predetermined amounts of the high heat conductivity resin 29 are poured into the recesses 20a for accommodating the power module 27, the resistor 22, and the cement resistor 23, while a predetermined amount of the heat insulating resin 30 is poured into the recess 20a for accommodating the electrolytic capacitor 26.
  • the power module 27 and the electrolytic capacitor 26 are fitted into the respective recesses 20a of the metal base 20, and the printed circuit board 21 having mounted thereon the resistor 22 and the cement resistor 23, etc., is fixed via screws (not shown) on the side supports 34 secured on the metal base 20. Furthermore, before the high heat conductivity resin 29 and the heat insulating resin 30 are set, the fixing screws 33 and the nuts 32 are fastened on the terminals 31 of the power module 27 and the electrolytic capacitor 26, respectively. The high heat conductivity resin 29 and the heat insulating resin 30 are set by leaving them at the normal temperature or by heating them. The assembling of the electrical device for mounting electrical components is thus completed.
  • the electrical device for mounting electrical components has the following advantages. Since the recesses 20a are formed on the metal base 20 in accordance with the height and the exterior forms of the power module 27 and the electrolytic capacitor 26, the horizontal and the vertical positioning of these electrical components on the metal base 20 can be accomplished accurately simply by fitting them into the respective recesses 20a. Further, there may be variations in the dimensions of the electrical components or of the gap between the metal base 20 and the printed circuit board 21, such that the bottom ends of the electrical components, such as the resistor 22 and the cement resistor 23, screwed or soldered to the printed circuit board 21, are not necessarily in contact with the metal base 20.
  • the resins are interposed between the recesses 20a of the metal base 20 and the electrical components such as resistor 22 and the cement resistor 23, the variations of dimensions are thereby absorbed and buffered, and the electrical components are securely fixed to the metal base 20 when the resins are set. Furthermore, since the high heat conductivity resin 29 is filled in the recesses 20a for the heat generating electrical components such as the power module 27 and the heat insulating resin 30 is filled in the recesses 20a for the non-heat generating electrical components such as electrolytic capacitor 26, the heat generating electrical components are cooled efficiently while the intrusion of heat into the non-heat generating electrical components is effectively prevented.
  • the electrical components generating a particularly large amount of heat such as the cement resistor 23, are encapsulated in the copper covering 28.
  • the heat generated in such electrical components are quickly transmitted to the copper covering 28, and from the copper covering 28 to the metal base 20, to be effectively radiated from the radiating fins 20b of the metal base 20.
  • the metal base 20 may be made of any one of good heat conductor metals other than the diecast aluminum, such as copper, zinc alloys, or iron. Even then, substantially the same meritorious effect can be obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
US07/675,202 1990-03-28 1991-03-26 Electrical device for mounting electrical components with enhanced thermal radiating properties Expired - Lifetime US5373418A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-79503 1990-03-28
JP2079503A JP2536657B2 (ja) 1990-03-28 1990-03-28 電気装置及びその製造方法

Publications (1)

Publication Number Publication Date
US5373418A true US5373418A (en) 1994-12-13

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US07/675,202 Expired - Lifetime US5373418A (en) 1990-03-28 1991-03-26 Electrical device for mounting electrical components with enhanced thermal radiating properties

Country Status (4)

Country Link
US (1) US5373418A (de)
EP (1) EP0449640B1 (de)
JP (1) JP2536657B2 (de)
DE (1) DE69105020T2 (de)

Cited By (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757620A (en) * 1994-12-05 1998-05-26 International Business Machines Corporation Apparatus for cooling of chips using blind holes with customized depth
US5798916A (en) * 1997-03-20 1998-08-25 Electric Power Research Institute, Inc. High power inverter pole employing series connected devices configured for reduced stray loop inductance
US5894402A (en) * 1997-11-25 1999-04-13 Pacesetter, Inc. Electrolytic capacitor and heat sink assembly
US5940272A (en) * 1996-08-01 1999-08-17 Hitachi, Ltd. Electric apparatus having heat radiating fin
DE19919098A1 (de) * 1998-12-15 2000-07-06 Mannesmann Vdo Ag Elektronische Einrichtung
DE19914497A1 (de) * 1999-03-30 2000-10-19 Siemens Ag Wärmeableitender Sockel für Bauelementträger
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
US6195257B1 (en) * 1999-02-13 2001-02-27 Lucent Technologies Inc. Apparatus and method of adapting a rectifier module to enhance cooling
US6219236B1 (en) 1997-10-20 2001-04-17 Fujitsu, Ltd. Cooling system for multichip module
DE10009398A1 (de) * 2000-02-28 2001-09-06 Epcos Ag Kühlkörpermodul und Anordnung von Kühlkörpermodulen
US6501653B1 (en) * 1998-10-07 2002-12-31 Robert Bosch Gmbh Arrangement of a multiphase converter
US6775141B2 (en) * 2002-02-20 2004-08-10 Tdk Corporation Heat dissipation structure for use in combination with electronic circuit board
US20050057899A1 (en) * 2003-09-16 2005-03-17 Charles Lord Compact electronics plenum
US20050257913A1 (en) * 2004-05-21 2005-11-24 Acroman Co., Ltd. Heat sink with fins fitted and bonded thereto by applying conductive glue
US20060050468A1 (en) * 2003-09-18 2006-03-09 Tatehiko Inoue Capacitor unit
US20060171121A1 (en) * 2005-01-28 2006-08-03 Bell Michael R Apparatus and method for transferring heat from an electrical module
US20070017686A1 (en) * 2005-06-30 2007-01-25 Takehiko Numata Electronic apparatus, and heat sink incorporated in the electronic apparatus
US20070206361A1 (en) * 2006-03-02 2007-09-06 Cheng Sun-Wen C System for cooling electronic components
US20080037223A1 (en) * 2006-08-12 2008-02-14 Diehl Ako Stiftung & Co. Kg Power Electronics with a Heat Sink
US20080212281A1 (en) * 2005-08-02 2008-09-04 Siemens Vdo Automotive Ag Cooling System for Electronics Housing
US20080266811A1 (en) * 2006-01-16 2008-10-30 Mitsubishi Electric Corporation Motor Drive Circuit And Outdoor Unit For Air Conditioner
US20080291632A1 (en) * 2007-05-25 2008-11-27 Sma Technologie Ag Inverter casing
US20090124099A1 (en) * 2007-11-14 2009-05-14 Simplo Technology Co., Ltd. PCB with improved soldering holes and a battery set with the same
US20090201648A1 (en) * 2008-02-12 2009-08-13 Evgeni Ganev Contour surface cooling of electronics devices
US20090250249A1 (en) * 2008-04-04 2009-10-08 Racz Livia M Interposers, electronic modules, and methods for forming the same
US20090284936A1 (en) * 2008-05-15 2009-11-19 Semikron Elektronik Gmbh & Co. Kg Combination of a Main Carrier and a Printed Circuit Board with Components
US20100039771A1 (en) * 2005-01-19 2010-02-18 Intelligent Electronic Systems (Ies) Method for cooling a static electronic power converter device and corresponding device
DE102010043445B3 (de) * 2010-11-05 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Kondensatoranordnung, leistungselektronisches Gerät damit undVerfahren zur Herstellung der Kondensatoranordnung
US20120250260A1 (en) * 2011-03-29 2012-10-04 Eldon Technology Limited Media content device with customized panel
DE102011081283A1 (de) * 2011-08-19 2013-02-21 Robert Bosch Gmbh Kondensator mit einem Kühlkörper
US20130050952A1 (en) * 2011-08-31 2013-02-28 Mitsubishi Electric Corporation Electrical equipment casing
US8535984B2 (en) 2008-04-04 2013-09-17 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
DE10301268B4 (de) * 2002-01-16 2014-02-13 Panasonic Corporation Kondensatormodul
US20140240927A1 (en) * 2011-04-01 2014-08-28 Robert Bosch Gmbh Electronic module
US20150029668A1 (en) * 2013-07-24 2015-01-29 Aura Systems, Inc. Clamping Structure for Power Electronic Components
CN104335471A (zh) * 2012-05-23 2015-02-04 三菱电机株式会社 逆变器装置
US20150146377A1 (en) * 2013-11-26 2015-05-28 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
US20150208546A1 (en) * 2014-01-20 2015-07-23 Tdk Corporation Power supply device
US20150373878A1 (en) * 2012-12-18 2015-12-24 Accelink Technologies Co., Ltd. Heat control device for power equipment
US20160093550A1 (en) * 2014-09-30 2016-03-31 Kabushiki Kaisha Toshiba Electronic device having a heat radiating unit
US20160156278A1 (en) * 2014-12-01 2016-06-02 Tesla Motors, Inc. Busbar locating component
US20160248333A1 (en) * 2013-10-07 2016-08-25 Hitachi Automotive Systems, Ltd. DC-DC Converter Apparatus
US20160369649A1 (en) * 2012-06-05 2016-12-22 General Electric Company High temperature flame sensor
US20170325360A1 (en) * 2014-06-25 2017-11-09 Hitachi, Ltd. Power-Module Device, Power Conversion Device, and Method for Manufacturing Power-Module Device
US9826665B2 (en) 2012-03-06 2017-11-21 Abb Schweiz Ag Electrical power circuit assembly
CN107852103A (zh) * 2015-07-21 2018-03-27 大金工业株式会社 逆变器装置
US10334734B2 (en) * 2015-09-15 2019-06-25 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
CN109964291A (zh) * 2016-11-11 2019-07-02 日本精工株式会社 电子控制装置和转向装置
US10396010B2 (en) 2015-09-29 2019-08-27 Hitachi Automotive Systems, Ltd. Onboard control device
US20200146174A1 (en) * 2018-11-01 2020-05-07 Franklin Electric Co., Inc. Discrete power component assembly
CN112119579A (zh) * 2018-05-14 2020-12-22 三菱电机株式会社 功率转换装置
US20210168965A1 (en) * 2019-12-03 2021-06-03 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US11051430B2 (en) 2015-04-06 2021-06-29 Denso Corporation Electronic control unit
US11057985B2 (en) * 2019-02-28 2021-07-06 Denso Ten Limited Printed wiring board
US11120947B2 (en) * 2017-05-11 2021-09-14 Autonetworks Technologies, Ltd. Connection structure of power storage elements and power storage module
US11191186B2 (en) * 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US11439043B2 (en) * 2019-05-20 2022-09-06 International Business Machines Corporation Multi-device cooling structure having assembly alignment features
US20220399817A1 (en) * 2021-06-09 2022-12-15 Mitsubishi Electric Corporation Power conversion device

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
EP0612100B1 (de) * 1993-02-16 1996-08-21 Koninklijke Philips Electronics N.V. Elektrodenlose Hochdruckentladungslampe
EP0655881A1 (de) * 1993-11-26 1995-05-31 Siemens Aktiengesellschaft Gehäuse
FR2724283B1 (fr) * 1994-09-02 1996-10-18 Schneider Electric Sa Variateur electronique de vitesse
FR2766967A1 (fr) * 1997-07-31 1999-02-05 Scps Dispositif de dissipation thermique et/ou protection electromagnetique pour cartes et composants electroniques
JPH1154971A (ja) * 1997-08-06 1999-02-26 Kobe Nippon Denki Software Kk 電子装置の冷却構造
FR2771594B1 (fr) * 1997-11-21 1999-12-31 Schneider Electric Sa Variateur electronique de vitesse
DE19850153B4 (de) * 1998-10-30 2005-07-21 Siemens Ag Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung
JP2001054286A (ja) * 1999-08-06 2001-02-23 Mitsubishi Electric Corp 電子制御基板
JP4009056B2 (ja) * 2000-05-25 2007-11-14 三菱電機株式会社 パワーモジュール
DE10138711B4 (de) * 2000-10-02 2009-12-31 Siemens Ag Kühlanordnung für in einem Gehäuse angeordnete Verlustwärme erzeugende elektrische Bauteile und elektrisches Gerät mit einer derartigen Kühlanordnung
FI20021232A0 (fi) * 2002-06-24 2002-06-24 Nokia Corp Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö
US7057896B2 (en) 2002-08-21 2006-06-06 Matsushita Electric Industrial Co., Ltd. Power module and production method thereof
GB0221123D0 (en) * 2002-09-12 2002-10-23 Bae Systems Plc Improvements in or relating to cooling of electronic components
US6781834B2 (en) * 2003-01-24 2004-08-24 Hewlett-Packard Development Company, L.P. Cooling device with air shower
DE102004047182A1 (de) * 2004-09-29 2006-03-30 Robert Bosch Gmbh Elektronisches Gerät mit einem mehrschichtigen Keramiksubstrat
GB2419463A (en) * 2004-10-25 2006-04-26 Elan House Ltd Heat sink
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
WO2006095436A1 (ja) 2005-03-11 2006-09-14 Fujitsu Limited 吸熱部材、冷却装置及び電子機器
DE102005034546A1 (de) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Baugruppe mit Kühlvorrichtung
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
DE102010028927A1 (de) * 2010-05-12 2011-11-17 Zf Friedrichshafen Ag Leistungselektronikanordnung
ITUD20110040A1 (it) * 2011-03-15 2012-09-16 Eurotech S P A Dispositivo di raffreddamento a liquido di schede elettroniche
DE102011076325B4 (de) * 2011-05-24 2016-05-04 Semikron Elektronik Gmbh & Co. Kg Kühlanordnung für eine leistungselektronische Komponente mit Subsystemen und einer Kühleinrichtung
CN103090338B (zh) * 2011-11-03 2018-10-09 欧司朗股份有限公司 驱动器组件及其制造方法
JP5992235B2 (ja) * 2012-07-11 2016-09-14 東芝機械株式会社 制御装置
WO2014080462A1 (ja) * 2012-11-21 2014-05-30 三洋電機株式会社 電力変換装置
JP6166081B2 (ja) * 2013-03-28 2017-07-19 株式会社ケーヒン 車両用電子制御装置
CN109166711A (zh) * 2013-06-10 2019-01-08 施耐德电气太阳能逆变器美国股份有限公司 电子系统及其形成方法
JP6209737B2 (ja) * 2013-08-30 2017-10-11 パナソニックＩｐマネジメント株式会社 インバータ装置
JP2015082951A (ja) * 2013-10-24 2015-04-27 トヨタ自動車株式会社 電力変換装置
JP2015088556A (ja) * 2013-10-29 2015-05-07 富士電機株式会社 電子モジュール
JP2015126590A (ja) * 2013-12-26 2015-07-06 パナソニックＩｐマネジメント株式会社 電力変換装置
JP6335515B2 (ja) * 2014-01-15 2018-05-30 三菱電機株式会社 半導体素子の保護構造および空気調和機の室外機
JP6326618B2 (ja) * 2014-01-31 2018-05-23 パナソニックＩｐマネジメント株式会社 電力変換装置
JP2015198168A (ja) * 2014-04-01 2015-11-09 富士電機株式会社 電子装置、電力変換装置及び回転電機
DE102014211206B3 (de) * 2014-06-12 2015-09-10 Continental Automotive Gmbh Vorrichtung mit einer Leiterplatte und einer darauf angeordneten elektronischen Schaltung, die einen Elektrolytkondensator aufweist, dessen Betriebstemperatur mittels der elektronischen Schaltung regelbar ist
JP2016178141A (ja) * 2015-03-19 2016-10-06 パナソニックＩｐマネジメント株式会社 ヒートシンク
DE102015226149A1 (de) * 2015-12-21 2017-06-22 Robert Bosch Gmbh Antriebselektronik für einen Antrieb
JP2017192285A (ja) * 2016-04-11 2017-10-19 三菱電機株式会社 回転機および回転機を備えた車両
CN106206330B (zh) * 2016-08-26 2019-02-26 王文杰 一种应用于电动汽车电控产品的针脚式功率单管集成结构
CN108630636B (zh) * 2017-03-24 2022-01-14 德昌电机(深圳)有限公司 Mos器件安装结构、控制器及电动助力转向系统
JP2018186143A (ja) * 2017-04-25 2018-11-22 オムロンオートモーティブエレクトロニクス株式会社 回路基板モジュール、電子装置
CN109951055A (zh) * 2017-12-19 2019-06-28 法雷奥动力总成(上海)有限公司 电压转换器及其组装方法
JP7314478B2 (ja) * 2018-05-18 2023-07-26 住友電気工業株式会社 電気配線板を備えた装置
JP2020198347A (ja) * 2019-05-31 2020-12-10 株式会社豊田自動織機 電力変換装置
JP6854936B1 (ja) * 2020-01-20 2021-04-07 三菱電機株式会社 回転電機
JP7069238B2 (ja) * 2020-03-17 2022-05-17 株式会社クボタ 電子制御装置
DE102020117310A1 (de) 2020-07-01 2022-01-05 Seg Automotive Germany Gmbh Stromrichter für elektrische Maschine und elektrische Maschine
JP7208550B2 (ja) * 2021-03-30 2023-01-19 ダイキン工業株式会社 電装品および冷凍装置
US20240203820A1 (en) * 2022-12-20 2024-06-20 Qualcomm Incorporated Package comprising a lid structure with a compartment
WO2025190574A1 (de) 2024-03-11 2025-09-18 Sew-Eurodrive Gmbh & Co Kg Elektrogerät

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
GB1441692A (en) * 1973-11-27 1976-07-07 Siemens Ag Module accomodating a disc-shaped rectifier element
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
JPS59146981A (ja) * 1983-02-09 1984-08-23 日本碍子株式会社 窒化珪素焼結体およびその製造法
DE3307654A1 (de) * 1983-03-04 1984-09-06 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet im motorraum eines kraftfahrzeugs
JPS60151186A (ja) * 1984-01-17 1985-08-09 Iseki & Co Ltd トラクタの安全フレ−ム取付装置
JPS6230353A (ja) * 1985-07-31 1987-02-09 Oki Electric Ind Co Ltd 樹脂封止用回路基板
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4918571A (en) * 1987-03-31 1990-04-17 Amp Incorporated Chip carrier with energy storage means
DE4009445A1 (de) * 1989-04-20 1990-10-25 Siemens Ag Kuehlvorrichtung fuer elektronische baugruppen einer bestueckten leiterplatte

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680911B2 (ja) * 1986-05-08 1994-10-12 富士通株式会社 電子部品を搭載したプリント配線板の放熱構造
JPS6422093U (de) * 1987-07-29 1989-02-03

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
GB1441692A (en) * 1973-11-27 1976-07-07 Siemens Ag Module accomodating a disc-shaped rectifier element
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
JPS59146981A (ja) * 1983-02-09 1984-08-23 日本碍子株式会社 窒化珪素焼結体およびその製造法
DE3307654A1 (de) * 1983-03-04 1984-09-06 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet im motorraum eines kraftfahrzeugs
JPS60151186A (ja) * 1984-01-17 1985-08-09 Iseki & Co Ltd トラクタの安全フレ−ム取付装置
JPS6230353A (ja) * 1985-07-31 1987-02-09 Oki Electric Ind Co Ltd 樹脂封止用回路基板
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4918571A (en) * 1987-03-31 1990-04-17 Amp Incorporated Chip carrier with energy storage means
DE4009445A1 (de) * 1989-04-20 1990-10-25 Siemens Ag Kuehlvorrichtung fuer elektronische baugruppen einer bestueckten leiterplatte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Cunavelis et al., External Module Heat Sink Fastened to Board, IBM Technical Disclosure Bulletin, vol. 14, No. 1, Jun. 1971, p. 182. *

Cited By (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757620A (en) * 1994-12-05 1998-05-26 International Business Machines Corporation Apparatus for cooling of chips using blind holes with customized depth
US5940272A (en) * 1996-08-01 1999-08-17 Hitachi, Ltd. Electric apparatus having heat radiating fin
US5798916A (en) * 1997-03-20 1998-08-25 Electric Power Research Institute, Inc. High power inverter pole employing series connected devices configured for reduced stray loop inductance
WO1998042066A1 (en) * 1997-03-20 1998-09-24 Electric Power Research Institute, Inc. High power inverter pole employing series connected devices configured for reduced stray loop inductance
US6219236B1 (en) 1997-10-20 2001-04-17 Fujitsu, Ltd. Cooling system for multichip module
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
US6272015B1 (en) * 1997-11-24 2001-08-07 International Rectifier Corp. Power semiconductor module with insulation shell support for plural separate substrates
US5894402A (en) * 1997-11-25 1999-04-13 Pacesetter, Inc. Electrolytic capacitor and heat sink assembly
US6117194A (en) * 1997-11-25 2000-09-12 Pacesetter, Inc. Method for assembling electrolytic capacitor and heat sink
US6501653B1 (en) * 1998-10-07 2002-12-31 Robert Bosch Gmbh Arrangement of a multiphase converter
DE19919098A1 (de) * 1998-12-15 2000-07-06 Mannesmann Vdo Ag Elektronische Einrichtung
US6195257B1 (en) * 1999-02-13 2001-02-27 Lucent Technologies Inc. Apparatus and method of adapting a rectifier module to enhance cooling
DE19914497A1 (de) * 1999-03-30 2000-10-19 Siemens Ag Wärmeableitender Sockel für Bauelementträger
DE10009398A1 (de) * 2000-02-28 2001-09-06 Epcos Ag Kühlkörpermodul und Anordnung von Kühlkörpermodulen
US6708757B2 (en) 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
DE10009398C2 (de) * 2000-02-28 2002-03-14 Epcos Ag Kühlkörpermodul und Anordnung von Kühlkörpermodulen
DE10301268B4 (de) * 2002-01-16 2014-02-13 Panasonic Corporation Kondensatormodul
US6775141B2 (en) * 2002-02-20 2004-08-10 Tdk Corporation Heat dissipation structure for use in combination with electronic circuit board
US7027300B2 (en) * 2003-09-16 2006-04-11 Mobility Electronics, Inc. Compact electronics plenum
US20050057899A1 (en) * 2003-09-16 2005-03-17 Charles Lord Compact electronics plenum
US20060050468A1 (en) * 2003-09-18 2006-03-09 Tatehiko Inoue Capacitor unit
US7547233B2 (en) * 2003-09-18 2009-06-16 Panasonic Corporation Capacitor unit
US20050257913A1 (en) * 2004-05-21 2005-11-24 Acroman Co., Ltd. Heat sink with fins fitted and bonded thereto by applying conductive glue
US7813128B2 (en) * 2005-01-19 2010-10-12 Intelligent Electronic Systems (Ies) Method for cooling a static electronic power converter device and corresponding device
US20100039771A1 (en) * 2005-01-19 2010-02-18 Intelligent Electronic Systems (Ies) Method for cooling a static electronic power converter device and corresponding device
US20060171121A1 (en) * 2005-01-28 2006-08-03 Bell Michael R Apparatus and method for transferring heat from an electrical module
US7310233B2 (en) * 2005-01-28 2007-12-18 Tyco Electronics Power Systems Apparatus and method for transferring heat from an electrical module
US20070017686A1 (en) * 2005-06-30 2007-01-25 Takehiko Numata Electronic apparatus, and heat sink incorporated in the electronic apparatus
US7684195B2 (en) 2005-08-02 2010-03-23 Siemens Vdo Automotive Ag Cooling system for electronics housing
US20080212281A1 (en) * 2005-08-02 2008-09-04 Siemens Vdo Automotive Ag Cooling System for Electronics Housing
US20080266811A1 (en) * 2006-01-16 2008-10-30 Mitsubishi Electric Corporation Motor Drive Circuit And Outdoor Unit For Air Conditioner
US7643296B2 (en) * 2006-01-16 2010-01-05 Mitsubishi Electric Corporation Motor drive circuit and outdoor unit for air conditioner
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
US20070206361A1 (en) * 2006-03-02 2007-09-06 Cheng Sun-Wen C System for cooling electronic components
US20080037223A1 (en) * 2006-08-12 2008-02-14 Diehl Ako Stiftung & Co. Kg Power Electronics with a Heat Sink
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
US7715195B2 (en) * 2007-05-25 2010-05-11 Sma Solar Technology Ag. Inverter casing
US20080291632A1 (en) * 2007-05-25 2008-11-27 Sma Technologie Ag Inverter casing
US20090124099A1 (en) * 2007-11-14 2009-05-14 Simplo Technology Co., Ltd. PCB with improved soldering holes and a battery set with the same
US7632150B2 (en) * 2007-11-14 2009-12-15 Simplo Technology Co., Ltd. PCB with improved soldering holes and a battery set with the same
US20090201648A1 (en) * 2008-02-12 2009-08-13 Evgeni Ganev Contour surface cooling of electronics devices
US7791887B2 (en) * 2008-02-12 2010-09-07 Honeywell International Inc. Contour surface cooling of electronics devices
US20090250249A1 (en) * 2008-04-04 2009-10-08 Racz Livia M Interposers, electronic modules, and methods for forming the same
US9425069B2 (en) 2008-04-04 2016-08-23 Charles Stark Draper Laboratory, Inc. Electronic modules
US8535984B2 (en) 2008-04-04 2013-09-17 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) * 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same
US20090284936A1 (en) * 2008-05-15 2009-11-19 Semikron Elektronik Gmbh & Co. Kg Combination of a Main Carrier and a Printed Circuit Board with Components
US8344270B2 (en) * 2008-05-15 2013-01-01 Semikron Elektronik Gmbh & Co., Kg Combination of a main carrier and a printed circuit board with components
CN102543423A (zh) * 2010-11-05 2012-07-04 赛米控电子股份有限公司 电容器系统和用于制造电容器系统的方法
DE102010043445B3 (de) * 2010-11-05 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Kondensatoranordnung, leistungselektronisches Gerät damit undVerfahren zur Herstellung der Kondensatoranordnung
CN102543423B (zh) * 2010-11-05 2016-01-20 赛米控电子股份有限公司 电容器系统和用于制造电容器系统的方法
US9058932B2 (en) 2010-11-05 2015-06-16 Frank Ebersberger Capacitor system and method for producing a capacitor system
US20120250260A1 (en) * 2011-03-29 2012-10-04 Eldon Technology Limited Media content device with customized panel
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
US20140240927A1 (en) * 2011-04-01 2014-08-28 Robert Bosch Gmbh Electronic module
US9271418B2 (en) * 2011-04-01 2016-02-23 Robert Bosch Gmbh Electronic module
DE102011081283A1 (de) * 2011-08-19 2013-02-21 Robert Bosch Gmbh Kondensator mit einem Kühlkörper
US8767402B2 (en) * 2011-08-31 2014-07-01 Mitsubishi Electric Corporation Electrical equipment casing
US20130050952A1 (en) * 2011-08-31 2013-02-28 Mitsubishi Electric Corporation Electrical equipment casing
US9826665B2 (en) 2012-03-06 2017-11-21 Abb Schweiz Ag Electrical power circuit assembly
US9474189B2 (en) * 2012-05-23 2016-10-18 Mitsubishi Electric Corporation Inverter device
US20150131233A1 (en) * 2012-05-23 2015-05-14 Mitsubishi Electric Corporation Inverter device
CN104335471A (zh) * 2012-05-23 2015-02-04 三菱电机株式会社 逆变器装置
US10392959B2 (en) * 2012-06-05 2019-08-27 General Electric Company High temperature flame sensor
US20160369649A1 (en) * 2012-06-05 2016-12-22 General Electric Company High temperature flame sensor
US20150373878A1 (en) * 2012-12-18 2015-12-24 Accelink Technologies Co., Ltd. Heat control device for power equipment
US10149410B2 (en) * 2012-12-18 2018-12-04 Accelink Technologies Co., Ltd. Heat control device for power equipment
US20150029668A1 (en) * 2013-07-24 2015-01-29 Aura Systems, Inc. Clamping Structure for Power Electronic Components
US9935558B2 (en) * 2013-10-07 2018-04-03 Hitachi Automotive Systems, Ltd. DC-DC converter apparatus including single drive circuit board arranged at predetermined interval from metal base
US20160248333A1 (en) * 2013-10-07 2016-08-25 Hitachi Automotive Systems, Ltd. DC-DC Converter Apparatus
US20150146377A1 (en) * 2013-11-26 2015-05-28 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
CN104682722A (zh) * 2013-11-26 2015-06-03 台达电子企业管理（上海）有限公司 电源转换装置及其组装方法
US9668384B2 (en) * 2013-11-26 2017-05-30 Delta Electronics (Shanghai) Co., Ltd. Power conversion device and method for assembling the same
EP2876984B1 (de) * 2013-11-26 2019-07-31 Delta Electronics (Shanghai) Co., Ltd. Leistungsumwandlungsvorrichtung und Verfahren zur Montage davon
CN104682722B (zh) * 2013-11-26 2018-01-26 台达电子企业管理（上海）有限公司 电源转换装置及其组装方法
US9820413B2 (en) * 2014-01-20 2017-11-14 Tdk Corporation Power supply device
US20150208546A1 (en) * 2014-01-20 2015-07-23 Tdk Corporation Power supply device
US11191186B2 (en) * 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US20170325360A1 (en) * 2014-06-25 2017-11-09 Hitachi, Ltd. Power-Module Device, Power Conversion Device, and Method for Manufacturing Power-Module Device
US10064310B2 (en) * 2014-06-25 2018-08-28 Hitachi, Ltd. Power-module device, power conversion device, and method for manufacturing power-module device
US20160093550A1 (en) * 2014-09-30 2016-03-31 Kabushiki Kaisha Toshiba Electronic device having a heat radiating unit
US20160156278A1 (en) * 2014-12-01 2016-06-02 Tesla Motors, Inc. Busbar locating component
US10199804B2 (en) * 2014-12-01 2019-02-05 Tesla, Inc. Busbar locating component
CN105655946A (zh) * 2014-12-01 2016-06-08 特斯拉汽车公司 母线定位部件
CN105655946B (zh) * 2014-12-01 2019-10-15 特斯拉公司 母线定位部件
US11051430B2 (en) 2015-04-06 2021-06-29 Denso Corporation Electronic control unit
US20180187905A1 (en) * 2015-07-21 2018-07-05 Daikin Industries, Ltd. Inverter apparatus
CN107852103A (zh) * 2015-07-21 2018-03-27 大金工业株式会社 逆变器装置
US10495327B2 (en) * 2015-07-21 2019-12-03 Daikin Industries, Ltd. Inverter apparatus
US10334734B2 (en) * 2015-09-15 2019-06-25 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
US10396010B2 (en) 2015-09-29 2019-08-27 Hitachi Automotive Systems, Ltd. Onboard control device
CN109964291A (zh) * 2016-11-11 2019-07-02 日本精工株式会社 电子控制装置和转向装置
EP3525221A4 (de) * 2016-11-11 2019-11-27 NSK Ltd. Elektronische steuerungsvorrichtung und lenkvorrichtung
US11148708B2 (en) 2016-11-11 2021-10-19 Nsk Ltd. Electronic control device and steering device
US11120947B2 (en) * 2017-05-11 2021-09-14 Autonetworks Technologies, Ltd. Connection structure of power storage elements and power storage module
US11343942B2 (en) * 2018-05-14 2022-05-24 Mitsubishi Electric Corporation Power conversion device including cooling components
CN112119579A (zh) * 2018-05-14 2020-12-22 三菱电机株式会社 功率转换装置
CN112119579B (zh) * 2018-05-14 2024-04-02 三菱电机株式会社 功率转换装置
US10667439B1 (en) * 2018-11-01 2020-05-26 Franklin Electric Company, Inc. Discrete power component assembly
US20200146174A1 (en) * 2018-11-01 2020-05-07 Franklin Electric Co., Inc. Discrete power component assembly
US11057985B2 (en) * 2019-02-28 2021-07-06 Denso Ten Limited Printed wiring board
US11439043B2 (en) * 2019-05-20 2022-09-06 International Business Machines Corporation Multi-device cooling structure having assembly alignment features
US20210168965A1 (en) * 2019-12-03 2021-06-03 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US20220399817A1 (en) * 2021-06-09 2022-12-15 Mitsubishi Electric Corporation Power conversion device
US11736021B2 (en) * 2021-06-09 2023-08-22 Mitsubishi Electric Corporation Power conversion device with noise reduction

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EP0449640A1 (de) 1991-10-02
HK1003819A1 (en) 1998-11-06
DE69105020T2 (de) 1995-06-22
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DE69105020D1 (de) 1994-12-15
JP2536657B2 (ja) 1996-09-18
JPH03278596A (ja) 1991-12-10

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