DE69105020T2 - Verfahren zur Montage von elektrischen Komponenten. - Google Patents
Verfahren zur Montage von elektrischen Komponenten.Info
- Publication number
- DE69105020T2 DE69105020T2 DE69105020T DE69105020T DE69105020T2 DE 69105020 T2 DE69105020 T2 DE 69105020T2 DE 69105020 T DE69105020 T DE 69105020T DE 69105020 T DE69105020 T DE 69105020T DE 69105020 T2 DE69105020 T2 DE 69105020T2
- Authority
- DE
- Germany
- Prior art keywords
- electrical components
- assembling electrical
- assembling
- components
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2079503A JP2536657B2 (ja) | 1990-03-28 | 1990-03-28 | 電気装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69105020D1 DE69105020D1 (de) | 1994-12-15 |
DE69105020T2 true DE69105020T2 (de) | 1995-06-22 |
Family
ID=13691739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69105020T Expired - Fee Related DE69105020T2 (de) | 1990-03-28 | 1991-03-28 | Verfahren zur Montage von elektrischen Komponenten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5373418A (de) |
EP (1) | EP0449640B1 (de) |
JP (1) | JP2536657B2 (de) |
DE (1) | DE69105020T2 (de) |
HK (1) | HK1003819A1 (de) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005034546A1 (de) * | 2005-07-23 | 2007-01-25 | Conti Temic Microelectronic Gmbh | Baugruppe mit Kühlvorrichtung |
DE102005036299A1 (de) * | 2005-08-02 | 2007-02-15 | Siemens Ag | Kühlsystem für Elektronikgehäuse |
DE10100620B4 (de) * | 2000-05-25 | 2009-04-23 | Mitsubishi Denki K.K. | Leistungsmodul |
DE10138711B4 (de) * | 2000-10-02 | 2009-12-31 | Siemens Ag | Kühlanordnung für in einem Gehäuse angeordnete Verlustwärme erzeugende elektrische Bauteile und elektrisches Gerät mit einer derartigen Kühlanordnung |
DE102010028927A1 (de) * | 2010-05-12 | 2011-11-17 | Zf Friedrichshafen Ag | Leistungselektronikanordnung |
DE102014211206B3 (de) * | 2014-06-12 | 2015-09-10 | Continental Automotive Gmbh | Vorrichtung mit einer Leiterplatte und einer darauf angeordneten elektronischen Schaltung, die einen Elektrolytkondensator aufweist, dessen Betriebstemperatur mittels der elektronischen Schaltung regelbar ist |
DE102020117310A1 (de) | 2020-07-01 | 2022-01-05 | Seg Automotive Germany Gmbh | Stromrichter für elektrische Maschine und elektrische Maschine |
DE112012004605B4 (de) | 2011-11-03 | 2024-02-15 | Ledvance Gmbh | Treiberbaugruppe und Verfahren zu ihrer Herstellung |
Families Citing this family (100)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4237632A1 (de) * | 1992-11-07 | 1994-05-11 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
EP0612100B1 (de) * | 1993-02-16 | 1996-08-21 | Koninklijke Philips Electronics N.V. | Elektrodenlose Hochdruckentladungslampe |
EP0655881A1 (de) * | 1993-11-26 | 1995-05-31 | Siemens Aktiengesellschaft | Gehäuse |
FR2724283B1 (fr) * | 1994-09-02 | 1996-10-18 | Schneider Electric Sa | Variateur electronique de vitesse |
US5757620A (en) * | 1994-12-05 | 1998-05-26 | International Business Machines Corporation | Apparatus for cooling of chips using blind holes with customized depth |
JP3159071B2 (ja) * | 1996-08-01 | 2001-04-23 | 株式会社日立製作所 | 放熱フィンを有する電気装置 |
US5798916A (en) * | 1997-03-20 | 1998-08-25 | Electric Power Research Institute, Inc. | High power inverter pole employing series connected devices configured for reduced stray loop inductance |
FR2766967A1 (fr) * | 1997-07-31 | 1999-02-05 | Scps | Dispositif de dissipation thermique et/ou protection electromagnetique pour cartes et composants electroniques |
JPH1154971A (ja) * | 1997-08-06 | 1999-02-26 | Kobe Nippon Denki Software Kk | 電子装置の冷却構造 |
JPH11121666A (ja) | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | マルチチップモジュールの冷却装置 |
FR2771594B1 (fr) * | 1997-11-21 | 1999-12-31 | Schneider Electric Sa | Variateur electronique de vitesse |
US6147869A (en) * | 1997-11-24 | 2000-11-14 | International Rectifier Corp. | Adaptable planar module |
US5894402A (en) * | 1997-11-25 | 1999-04-13 | Pacesetter, Inc. | Electrolytic capacitor and heat sink assembly |
DE19846156C1 (de) * | 1998-10-07 | 2000-07-27 | Bosch Gmbh Robert | Anordnung eines mehrphasigen Umrichters |
DE19850153B4 (de) * | 1998-10-30 | 2005-07-21 | Siemens Ag | Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung |
DE19919098A1 (de) * | 1998-12-15 | 2000-07-06 | Mannesmann Vdo Ag | Elektronische Einrichtung |
US6195257B1 (en) * | 1999-02-13 | 2001-02-27 | Lucent Technologies Inc. | Apparatus and method of adapting a rectifier module to enhance cooling |
DE19914497A1 (de) * | 1999-03-30 | 2000-10-19 | Siemens Ag | Wärmeableitender Sockel für Bauelementträger |
JP2001054286A (ja) * | 1999-08-06 | 2001-02-23 | Mitsubishi Electric Corp | 電子制御基板 |
DE10009398C2 (de) | 2000-02-28 | 2002-03-14 | Epcos Ag | Kühlkörpermodul und Anordnung von Kühlkörpermodulen |
US6631071B2 (en) * | 2002-01-16 | 2003-10-07 | Matsushita Electric Industrial Co., Ltd. | Capacitor module |
JP3611548B2 (ja) * | 2002-02-20 | 2005-01-19 | Tdk株式会社 | スイッチング電源とその製造方法 |
FI20021232A0 (fi) * | 2002-06-24 | 2002-06-24 | Nokia Corp | Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö |
US7057896B2 (en) | 2002-08-21 | 2006-06-06 | Matsushita Electric Industrial Co., Ltd. | Power module and production method thereof |
GB0221123D0 (en) * | 2002-09-12 | 2002-10-23 | Bae Systems Plc | Improvements in or relating to cooling of electronic components |
US6781834B2 (en) * | 2003-01-24 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | Cooling device with air shower |
US7027300B2 (en) * | 2003-09-16 | 2006-04-11 | Mobility Electronics, Inc. | Compact electronics plenum |
US7547233B2 (en) * | 2003-09-18 | 2009-06-16 | Panasonic Corporation | Capacitor unit |
US20050257913A1 (en) * | 2004-05-21 | 2005-11-24 | Acroman Co., Ltd. | Heat sink with fins fitted and bonded thereto by applying conductive glue |
DE102004047182A1 (de) * | 2004-09-29 | 2006-03-30 | Robert Bosch Gmbh | Elektronisches Gerät mit einem mehrschichtigen Keramiksubstrat |
GB2419463A (en) * | 2004-10-25 | 2006-04-26 | Elan House Ltd | Heat sink |
US7365273B2 (en) * | 2004-12-03 | 2008-04-29 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices |
FR2881018B1 (fr) * | 2005-01-19 | 2007-04-06 | Intelligent Electronic Systems | Procede de refroidissement d'un dispositif de conversion statique d'electronique de puissance et dispositif correspondant |
US7310233B2 (en) * | 2005-01-28 | 2007-12-18 | Tyco Electronics Power Systems | Apparatus and method for transferring heat from an electrical module |
JP4372193B2 (ja) | 2005-03-11 | 2009-11-25 | 富士通株式会社 | 吸熱部材、冷却装置及び電子機器 |
JP2007012941A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 電子機器、およびこの電子機器に組み込まれたヒートシンク |
AU2006335521B2 (en) * | 2006-01-16 | 2009-11-12 | Mitsubishi Electric Corporation | Drive circuit of motor and outdoor unit of air conditioner |
US7450387B2 (en) * | 2006-03-02 | 2008-11-11 | Tdk Innoveta Technologies, Inc. | System for cooling electronic components |
DE102006061215A1 (de) * | 2006-08-12 | 2008-02-21 | Diehl Ako Stiftung & Co. Kg | Leistungselektronik mit Kühlkörper |
EP1996004B1 (de) * | 2007-05-25 | 2014-07-09 | SMA Solar Technology AG | Wechselrichtergehäuse |
TWM331763U (en) * | 2007-11-14 | 2008-05-01 | Simplo Technology Co Ltd | A PCB with advanced soldering holes and the same implemented on a battery set |
US7791887B2 (en) * | 2008-02-12 | 2010-09-07 | Honeywell International Inc. | Contour surface cooling of electronics devices |
US8017451B2 (en) | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
US8273603B2 (en) * | 2008-04-04 | 2012-09-25 | The Charles Stark Draper Laboratory, Inc. | Interposers, electronic modules, and methods for forming the same |
DE102008023714B4 (de) * | 2008-05-15 | 2011-01-20 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen |
DE102009044368B4 (de) * | 2009-10-30 | 2014-07-03 | Lear Corporation Gmbh | Kühlanordnung |
DE102010043445B3 (de) * | 2010-11-05 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Kondensatoranordnung, leistungselektronisches Gerät damit undVerfahren zur Herstellung der Kondensatoranordnung |
ITUD20110040A1 (it) * | 2011-03-15 | 2012-09-16 | Eurotech S P A | Dispositivo di raffreddamento a liquido di schede elettroniche |
US9317079B2 (en) * | 2011-03-29 | 2016-04-19 | Echostar Uk Holdings Limited | Media content device with customized panel |
DE102011006632A1 (de) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Elektronikmodul |
DE102011076325B4 (de) * | 2011-05-24 | 2016-05-04 | Semikron Elektronik Gmbh & Co. Kg | Kühlanordnung für eine leistungselektronische Komponente mit Subsystemen und einer Kühleinrichtung |
DE102011081283A1 (de) * | 2011-08-19 | 2013-02-21 | Robert Bosch Gmbh | Kondensator mit einem Kühlkörper |
JP5693419B2 (ja) * | 2011-08-31 | 2015-04-01 | 三菱電機株式会社 | 電気機器の筐体 |
EP2637489B1 (de) | 2012-03-06 | 2018-01-24 | ABB Schweiz AG | Stromschaltungsanordnung |
US9474189B2 (en) * | 2012-05-23 | 2016-10-18 | Mitsubishi Electric Corporation | Inverter device |
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JP5992235B2 (ja) * | 2012-07-11 | 2016-09-14 | 東芝機械株式会社 | 制御装置 |
JP6145717B2 (ja) * | 2012-11-21 | 2017-06-14 | パナソニックIpマネジメント株式会社 | 電力変換装置 |
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JP6166081B2 (ja) * | 2013-03-28 | 2017-07-19 | 株式会社ケーヒン | 車両用電子制御装置 |
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JP6209737B2 (ja) * | 2013-08-30 | 2017-10-11 | パナソニックIpマネジメント株式会社 | インバータ装置 |
EP3057216B1 (de) * | 2013-10-07 | 2019-05-08 | Hitachi Automotive Systems, Ltd. | Gleichspannungswandler |
JP2015082951A (ja) * | 2013-10-24 | 2015-04-27 | トヨタ自動車株式会社 | 電力変換装置 |
JP2015088556A (ja) * | 2013-10-29 | 2015-05-07 | 富士電機株式会社 | 電子モジュール |
CN104682722B (zh) * | 2013-11-26 | 2018-01-26 | 台达电子企业管理(上海)有限公司 | 电源转换装置及其组装方法 |
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JP6269094B2 (ja) * | 2014-01-20 | 2018-01-31 | Tdk株式会社 | 電源装置 |
JP6326618B2 (ja) * | 2014-01-31 | 2018-05-23 | パナソニックIpマネジメント株式会社 | 電力変換装置 |
JP2015198168A (ja) * | 2014-04-01 | 2015-11-09 | 富士電機株式会社 | 電子装置、電力変換装置及び回転電機 |
US11191186B2 (en) * | 2014-06-24 | 2021-11-30 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
WO2015198411A1 (ja) * | 2014-06-25 | 2015-12-30 | 株式会社日立製作所 | パワーモジュール装置、電力変換装置およびパワーモジュール装置の製造方法 |
JP2016071269A (ja) * | 2014-09-30 | 2016-05-09 | 株式会社東芝 | 電子機器、及びシステム |
US10199804B2 (en) * | 2014-12-01 | 2019-02-05 | Tesla, Inc. | Busbar locating component |
JP2016178141A (ja) * | 2015-03-19 | 2016-10-06 | パナソニックIpマネジメント株式会社 | ヒートシンク |
JP6693706B2 (ja) * | 2015-04-06 | 2020-05-13 | 株式会社デンソー | 電子制御装置 |
JP6701637B2 (ja) * | 2015-07-21 | 2020-05-27 | ダイキン工業株式会社 | インバータ装置 |
JP6528620B2 (ja) * | 2015-09-15 | 2019-06-12 | 株式会社オートネットワーク技術研究所 | 回路構成体および電気接続箱 |
JP6453195B2 (ja) * | 2015-09-29 | 2019-01-16 | 日立オートモティブシステムズ株式会社 | 車載制御装置 |
DE102015226149A1 (de) * | 2015-12-21 | 2017-06-22 | Robert Bosch Gmbh | Antriebselektronik für einen Antrieb |
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- 1991-03-28 DE DE69105020T patent/DE69105020T2/de not_active Expired - Fee Related
- 1991-03-28 EP EP91302781A patent/EP0449640B1/de not_active Expired - Lifetime
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Cited By (10)
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DE10100620B4 (de) * | 2000-05-25 | 2009-04-23 | Mitsubishi Denki K.K. | Leistungsmodul |
DE10138711B4 (de) * | 2000-10-02 | 2009-12-31 | Siemens Ag | Kühlanordnung für in einem Gehäuse angeordnete Verlustwärme erzeugende elektrische Bauteile und elektrisches Gerät mit einer derartigen Kühlanordnung |
DE102005034546A1 (de) * | 2005-07-23 | 2007-01-25 | Conti Temic Microelectronic Gmbh | Baugruppe mit Kühlvorrichtung |
DE102005036299A1 (de) * | 2005-08-02 | 2007-02-15 | Siemens Ag | Kühlsystem für Elektronikgehäuse |
DE102005036299B4 (de) * | 2005-08-02 | 2008-01-24 | Siemens Ag | Kühlanordnung |
US7684195B2 (en) | 2005-08-02 | 2010-03-23 | Siemens Vdo Automotive Ag | Cooling system for electronics housing |
DE102010028927A1 (de) * | 2010-05-12 | 2011-11-17 | Zf Friedrichshafen Ag | Leistungselektronikanordnung |
DE112012004605B4 (de) | 2011-11-03 | 2024-02-15 | Ledvance Gmbh | Treiberbaugruppe und Verfahren zu ihrer Herstellung |
DE102014211206B3 (de) * | 2014-06-12 | 2015-09-10 | Continental Automotive Gmbh | Vorrichtung mit einer Leiterplatte und einer darauf angeordneten elektronischen Schaltung, die einen Elektrolytkondensator aufweist, dessen Betriebstemperatur mittels der elektronischen Schaltung regelbar ist |
DE102020117310A1 (de) | 2020-07-01 | 2022-01-05 | Seg Automotive Germany Gmbh | Stromrichter für elektrische Maschine und elektrische Maschine |
Also Published As
Publication number | Publication date |
---|---|
HK1003819A1 (en) | 1998-11-06 |
JPH03278596A (ja) | 1991-12-10 |
JP2536657B2 (ja) | 1996-09-18 |
DE69105020D1 (de) | 1994-12-15 |
US5373418A (en) | 1994-12-13 |
EP0449640A1 (de) | 1991-10-02 |
EP0449640B1 (de) | 1994-11-09 |
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