FI20021232A0 - Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö - Google Patents

Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö

Info

Publication number
FI20021232A0
FI20021232A0 FI20021232A FI20021232A FI20021232A0 FI 20021232 A0 FI20021232 A0 FI 20021232A0 FI 20021232 A FI20021232 A FI 20021232A FI 20021232 A FI20021232 A FI 20021232A FI 20021232 A0 FI20021232 A0 FI 20021232A0
Authority
FI
Finland
Prior art keywords
electronic unit
manufacturing
radio system
electronic
unit
Prior art date
Application number
FI20021232A
Other languages
English (en)
Swedish (sv)
Inventor
Pasi Lehtonen
Kimmo Huhtala
Marko Kuusikko
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI20021232A priority Critical patent/FI20021232A0/fi
Publication of FI20021232A0 publication Critical patent/FI20021232A0/fi
Priority to EP03396064A priority patent/EP1377143A3/en
Priority to US10/601,767 priority patent/US6865074B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5168—Multiple-tool holder
    • Y10T29/5171—Axial tool and transversely movable slide rest
FI20021232A 2002-06-24 2002-06-24 Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö FI20021232A0 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20021232A FI20021232A0 (fi) 2002-06-24 2002-06-24 Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö
EP03396064A EP1377143A3 (en) 2002-06-24 2003-06-24 Method of producing electronic unit of radio system and electronic unit
US10/601,767 US6865074B2 (en) 2002-06-24 2003-06-24 Method of producing electronic unit of radio system and electronic unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20021232A FI20021232A0 (fi) 2002-06-24 2002-06-24 Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö

Publications (1)

Publication Number Publication Date
FI20021232A0 true FI20021232A0 (fi) 2002-06-24

Family

ID=8564219

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20021232A FI20021232A0 (fi) 2002-06-24 2002-06-24 Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö

Country Status (3)

Country Link
US (1) US6865074B2 (fi)
EP (1) EP1377143A3 (fi)
FI (1) FI20021232A0 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20021218A0 (fi) * 2002-06-20 2002-06-20 Nokia Corp Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti
JP5813382B2 (ja) * 2011-06-09 2015-11-17 富士通株式会社 電子装置
DE102012020838A1 (de) * 2012-10-24 2014-04-24 Schoeller-Electronics Gmbh Leiterplatte
CN104249249A (zh) * 2013-06-28 2014-12-31 鸿富锦精密工业（深圳）有限公司 风扇组装设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982271A (en) * 1975-02-07 1976-09-21 Rca Corporation Heat spreader and low parasitic transistor mounting
DE2929612C2 (de) * 1979-07-21 1981-11-05 Rohde & Schwarz GmbH & Co KG, 8000 München Schaltungsanordnung in Microstrip-Bauweise für mit Leistungstransistoren bestückte Schaltungen der Höchstfrequenztechnik
JPS6083401A (ja) * 1983-10-13 1985-05-11 Matsushita Electric Ind Co Ltd マイクロ波回路
US4724514A (en) 1986-07-18 1988-02-09 Kaufman Lance R Low cost compressively clamped circuit and heat sink assembly
JP2536657B2 (ja) * 1990-03-28 1996-09-18 三菱電機株式会社 電気装置及びその製造方法
US5889649A (en) * 1994-03-01 1999-03-30 Canon Kabushiki Kaisha Information processing apparatus and a card-shaped adapter for smaller and larger storage medium
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
US6235991B1 (en) 1998-06-30 2001-05-22 Lucent Technologies Inc. Recessed mechanical fasteners for circuit boards
US6487080B2 (en) * 2000-09-22 2002-11-26 Linux Networx, Inc. Sub rack based vertical housing for computer systems
SG103832A1 (en) * 2001-05-08 2004-05-26 Micron Technology Inc Interposer, packages including the interposer, and methods
US6573592B2 (en) * 2001-08-21 2003-06-03 Micron Technology, Inc. Semiconductor die packages with standard ball grid array footprint and method for assembling the same

Also Published As

Publication number Publication date
US20040052035A1 (en) 2004-03-18
US6865074B2 (en) 2005-03-08
EP1377143A3 (en) 2005-08-10
EP1377143A2 (en) 2004-01-02

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