FI20021218A0 - Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti - Google Patents

Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti

Info

Publication number
FI20021218A0
FI20021218A0 FI20021218A FI20021218A FI20021218A0 FI 20021218 A0 FI20021218 A0 FI 20021218A0 FI 20021218 A FI20021218 A FI 20021218A FI 20021218 A FI20021218 A FI 20021218A FI 20021218 A0 FI20021218 A0 FI 20021218A0
Authority
FI
Finland
Prior art keywords
radio system
production
electronics
electronics unit
component
Prior art date
Application number
FI20021218A
Other languages
English (en)
Swedish (sv)
Inventor
Pasi Lehtonen
Kimmo Huhtala
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Priority to FI20021218A priority Critical patent/FI20021218A0/fi
Publication of FI20021218A0 publication Critical patent/FI20021218A0/fi
Priority to EP03101723A priority patent/EP1377142A3/en
Priority to US10/463,865 priority patent/US7362562B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FI20021218A 2002-06-20 2002-06-20 Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti FI20021218A0 (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20021218A FI20021218A0 (fi) 2002-06-20 2002-06-20 Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti
EP03101723A EP1377142A3 (en) 2002-06-20 2003-06-12 Method of producing electronic unit of radio system automatically, electronic unit of radio system and electronic component used for its production
US10/463,865 US7362562B2 (en) 2002-06-20 2003-06-18 Electronic unit of radio system and method of producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20021218A FI20021218A0 (fi) 2002-06-20 2002-06-20 Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti

Publications (1)

Publication Number Publication Date
FI20021218A0 true FI20021218A0 (fi) 2002-06-20

Family

ID=8564209

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20021218A FI20021218A0 (fi) 2002-06-20 2002-06-20 Menetelmä radiojärjestelmän elektroniikkayksikön koneelliseksi valmistamiseksi, radiojärjestelmän elektroniikkayksikkö ja sen valmistamiseen käytettävä elektroniikkakomponentti

Country Status (3)

Country Link
US (1) US7362562B2 (fi)
EP (1) EP1377142A3 (fi)
FI (1) FI20021218A0 (fi)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202004002332U1 (de) * 2004-02-11 2004-04-22 Siemens Ag Leiterplatte
DE102006001188A1 (de) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Anordnung zur Kühlung von Leistungsbauelementen auf Leiterplatten und Verfahren zur Herstellung derselben
EP2205051A3 (en) * 2008-12-31 2011-11-02 Samsung SDI Co., Ltd. Semiconductor package assembly and plasma display device having the same
KR101030990B1 (ko) 2008-12-31 2011-04-22 삼성에스디아이 주식회사 반도체 패키지 및 이를 구비하는 플라즈마 디스플레이 장치
KR101030991B1 (ko) * 2008-12-31 2011-04-22 삼성에스디아이 주식회사 반도체 패키지의 장착구조 및 이를 적용한 플라즈마 디스플레이 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724514A (en) * 1986-07-18 1988-02-09 Kaufman Lance R Low cost compressively clamped circuit and heat sink assembly
US4967201A (en) * 1987-10-22 1990-10-30 Westinghouse Electric Corp. Multi-layer single substrate microwave transmit/receive module
US5291063A (en) * 1991-12-23 1994-03-01 Eni Div. Of Astec America, Inc. High-power RF device with heat spreader bushing
KR100306988B1 (ko) * 1992-10-26 2001-12-15 윌리엄 비. 켐플러 장치패키지
DE59603341D1 (de) * 1995-08-28 1999-11-18 Siemens Ag Elektrisches Bauelement, insbesondere relais, und Verfahren zu dessen Einbau in eine Leiterplatte
US6011449A (en) * 1997-02-18 2000-01-04 The Whitaker Corporation Surface mount technology contact for ferrite isolator/circulator applications
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
US6235991B1 (en) 1998-06-30 2001-05-22 Lucent Technologies Inc. Recessed mechanical fasteners for circuit boards
US6327146B2 (en) * 1999-05-21 2001-12-04 Nokia Telecommunications, Oy Pick and place assembly and reflow soldering for high power active devices with a flange
US6276593B1 (en) * 1999-07-12 2001-08-21 Agere Systems Guardian Corp. Apparatus and method for solder attachment of high powered transistors to base heatsink
SE517455C2 (sv) * 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande för framställning därav
US6504445B1 (en) * 2001-12-07 2003-01-07 Renaissance Electronics Corporation Surface mountable low IMD circulator/isolator with a locking cover and assembly method
FI20021232A0 (fi) * 2002-06-24 2002-06-24 Nokia Corp Menetelmä radiojärjestelmän elektroniikkayksikön valmistamiseksi ja elektroniikkayksikkö

Also Published As

Publication number Publication date
EP1377142A3 (en) 2005-01-26
US20040034995A1 (en) 2004-02-26
EP1377142A2 (en) 2004-01-02
US7362562B2 (en) 2008-04-22

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