Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
  • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
  • C07D209/56—Ring systems containing three or more rings
  • C07D209/80—[b, c]- or [b, d]-condensed
  • C07D209/82—Carbazoles; Hydrogenated carbazoles
  • C07D209/88—Carbazoles; Hydrogenated carbazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to carbon atoms of the ring system
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
  • G03F7/031—Organic compounds not covered by group G03F7/029
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor

Definitions

• This invention relates to a novel oxime ester compound useful as a photopolymerization initiator in a photosensitive composition, a photopolymerization initiator containing the compound as an active ingredient, and a photosensitive composition containing a polymerizable compound having an ethylenically unsaturated bond and the photopolymerization initiator.
• a photosensitive composition contains a polymerizable compound having an ethylenically unsaturated bond and a photopolymerization initiator.
• a photosensitive composition polymerizes to cure on being irradiated with light of 405 nm or 365 nm and is used in photo-curing inks, photosensitive printing plate precursors, and various photoresists.
• Patent documents 1 to 8 listed below propose using an O-acyl oxime compound having a carbazolyl structure as a photopolymerization initiator of a photosensitive composition.
• the known O-acyl oxime compounds are not sufficiently satisfactory particularly in sensitivity.
• Patent document 1 JP2001-302871A
• Patent document 2 JP 2004-534797A
• Patent document 4 JP 2005-128483A
• Patent document 6 JP 2005-242280A
• Patent document 7 JP 2006-16545A
• Patent document 8 Japanese Patent 3754065
• an object of the invention is to provide a highly sensitive photopolymerization initiator that efficiently absorbs light of long wavelength, e.g., 405 nm or 365 nm, to be activated.
• R 1 , R 2 , and R 3 each independently represent R 11 , OR 11 , COR 11 , SR 11 , CONR 12 R 13 , or CN;
• R 11 , R 12 , and R 13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms, in which the alkyl group, aryl group, arylalkyl group, and heterocyclic group may have their hydrogen atom substituted with OR 21 , COR 21 , SR 21 , NR 22 R 23 , CONR 22 R 23 , —NR 22 —O 23 , —NCOR 22 —OCOR 23 , —C( ⁇ N_OR 21 )—R 22 , —C(—NOCOR 21 )—R 22 , CN, a halogen atom,
• the invention also provides a photosensitive composition containing the photopolymerization initiator and a polymerizable compound having an ethylenically unsaturated bond.
• the invention also provides an alkali-developable photosensitive resin composition containing the photopolymerization initiator and an alkali-developable compound having an ethylenically unsaturated bond.
• the invention also provides a colored alkali-developable photosensitive resin composition comprising the alkali-developable photosensitive resin composition and a colorant.
• the oxime ester compound of the invention and a photopolymerization initiator containing the compound as an active ingredient will be described in detail.
• the oxime ester compound according to the invention embraces geometric isomers based on the double bond of oxime. Either of the isomers is useful.
• the general formula (I) and the formulae of specific examples of the compounds given later each represent either one of the isomers or a mixture of the isomers, not being limited to the isomeric structure shown.
• examples of the alkyl group as represented by R 11 , R 12 , R 13 , R 21 , R 12 , and R 23 include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, t-butyl, amyl, isoamyl, t-amyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, vinyl, allyl, butenyl, ethynyl, prop
• Examples of the arylalkyl group as represented by R 11 , R 12 , R 13 , R 21 , R 22 , and R 23 include benzyl, chlorobenzoyl, ⁇ -methylbenzyl, ⁇ , ⁇ -dimethylbenzyl, phenylethyl, and phenylethenyl.
• the heterocyclic group as represented by R 11 , R 12 , R 13 , R 21 , R 22 , and R 23 is preferably a 5- to 7-membered heterocyclic group, including pyridyl, pyrimidyl, furyl, thienyl, tetrahydrofuryl, dioxolanyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidyl, imidazolidyl, pyrazolidyl, thiazolidyl, isothiazolidyl, oxazolidyl, isooxazolidyl, piperidyl, piperazyl, and morpholinyl.
• Examples of the ring formed by connecting R 12 and R 13 , the ring formed by connecting R 22 and R 23 , and the ring formed by connecting R 3 and a neighboring benzene ring include 5- to 7-membered rings, such as cyclopentane, cyclohexane, cyclopentene, benzene, piperidine, morpholine, lactone, and lactam rings.
• Examples of the halogen atom as a substituent of R 11 , R 12 , R 13 , R 21 , R 22 , and R 23 and the halogen atom represented by R 4 and R 5 include fluorine, chlorine, bromine, and iodine.
• the methylene units of the alkylene moiety of the above described substituents may be interrupted by an unsaturated linkage, an ether linkage, a thioether linkage, an ester linkage, a thioester linkage, an amido linkage, or a urethane linkage at 1 to 5 sites.
• the interrupting linking groups may be the same or different. Two or more interrupting linking groups may be continued to each other, if possible.
• the alkyl moiety of the above described substituents may be branched or cyclic, and the alkyl terminal of the substituents may have an unsaturated bond.
• Preferred of the oxime ester compounds of general formula (I) according to the invention are those in which R 1 is an alkyl group having 11 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, OR 11 , COR 11 , SR 11 , CONR 12 R 13 , or CN and those in which 3 is an alkyl group having 1 to 12 carbon atoms and interrupted by an ether linkage or an ester linkage at 1 to 5 sites, an alkyl group having 13 to 20 carbon atoms, OR 11 , COR 11 , SR 11 , CONR 12 R 13 , or CN.
• R 1 is an alkyl group having 11 to 20 carbon atoms or an aryl group having 6 to 30 carbon atoms, or R 3 is a branched alkyl group having 8 or more carbon atoms the methylene units of which may be interrupted by an ether linkage or an ester linkage at 1 to 5 sites; those in which R 3 is an alkyl group having 13 or more carbon atoms the methylene units of which may be interrupted by an ether linkage or an ester linkage at 1 to 5 sites; those in which R 1 is an alkyl group interrupted by an ether linkage at 1 to 5 sites; and those in which R 3 is an alkyl group interrupted by an ester linkage at 1 to 5 sites.
• These preferred compounds are easy to synthesize and show high sensitivity.
• they dissolve in propylene glycol-1-monomethyl ether-2-acetate or cyclohexanone as a solvent to a concentration of 1% by mass or higher to satisfy the requirement as a photopolymerization initiator.
• the solubility measurement is preferably made at 20 to 30° C.
• the oxime ester compound of the invention may be dimerized at R 1 or R 2 to provide a compound represented by formulae shown below:
• Examples of the preferred oxime ester compounds of general formula (I) include, but are not limited to, compound Nos. 1 through 71 below.
• the oxime ester compound of general formula (I) is prepared by, for example, the following process in accordance with reaction scheme:
• a nitrocarbazole compound 1 and an acid chloride 2 are allowed to react in the presence of zinc chloride to give an acylated compound 3.
• the acylated compound 3 is allowed to react with hydroxylamine hydrochloride in the presence of DMF to give an oxime compound 4,
• the oxime compound 4 is allowed to react with an acid anhydride 5 or an acid chloride 5′ to yield an oxime ester compound of general formula (I).
• the oxime ester compound of the invention is useful as an initiator for photopolymerization of a polymerizable compound having an ethylenically unsaturated bond.
• the photosensitive composition according to the invention contains a photopolymerization initiator having the oxime ester compound as an active ingredient, an ethylenically unsaturated polymerizable compound, and, if desired, an inorganic compound and/or a colorant, and other optional components such as a solvent.
• Any ethylenically unsaturated polymerizable compound that has been used in a photosensitive composition can be used in the invention.
• examples include unsaturated aliphatic hydrocarbons, such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; a polymer having a carboxyl group and a hydroxyl group at both terminals, such as (meth)acrylic acid, ⁇ -chloroacrylic acid; itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinylacetic acid, allylacetic acid, cinnamic acid, sorbic acid, mesaconic acid, trimellitic acid, pyromellitic acid, 2,2′,3,3′-benzophenonetetracarboxylic acid, 3,3,4,4′-benzophenonet
• a (mono)methacrylate of a polymer having a carboxyl group and a hydroxyl group at both terminals a polyfunctional (meth)acrylate having one carboxyl group and two or more (meth)acryloyl groups, and an ester between an unsaturated monobasic acid and a polyhydric alcohol or polyhydric phenol are suited to be polymerized by using the photopolymerization initiator containing the oxime ester compound of the invention as an active ingredient.
• the polymerizable compounds may be used either individually or as a mixture of two or more thereof.
• the two or more polymerizable compounds to be used in combination may be in the form of a copolymer previously prepared therefrom.
• the photosensitive composition of the invention serves as an alkali-developable photosensitive resin composition.
• the ethylenically unsaturated, alkali-developable compound include acrylic ester copolymers, phenol and/or cresol novolak epoxy resins, polyphenylmethane epoxy resins having two or more epoxy groups, and resins obtained by causing an epoxy compound, such as a compound represented by general formula (II) below, and an unsaturated monobasic acid to react with each other and causing the resulting reaction product to react with a polybasic acid anhydride.
• Preferred of them are resins obtained by causing an epoxy compound, such as a compound represented by general formula (II) below, and an unsaturated monobasic acid to react with each other and causing the resulting product to react with a polybasic acid anhydride.
• the ethylenically unsaturated, alkali-developable compound preferably contains 0.2 to 1.0 equivalents of an unsaturated group.
• R 41 , R 42 , R 43 , and R 44 each independently represent a hydrogen atom, a halogen-substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, a halogen-substituted or unsubstituted alkoxy group having 1 to 8 carbon atoms, a halogen-substituted or unsubstituted alkenyl group having 2 to 5 carbon atoms, or a halogen atom; and m represents an integer of 0 to 10.
• Examples of the unsaturated monobasic acid which is caused to react on the epoxy compound include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid, hydroxyethyl methacrylate malate, hydroxyethyl acrylate malate, hydroxypropyl methacrylate malate, hydroxypropyl acrylate malate, and dicyclopentadiene malate.
• polybasic acid anhydride that is caused to react after the reaction of the unsaturated monobasic acid
• examples of the polybasic acid anhydride that is caused to react after the reaction of the unsaturated monobasic acid include hiphenyltetracarboxylic acid dianhydride, tetrahydrophthalic anhydride, succinic anhydride, biphthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, 2,2′,3,3′-benzophenonetetracarboxylic acid anhydride, ethylene glycol bisanhydrotrimellitate, glycerol trisanhydrotrimellitate, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, nadic anhydride, methylnadic anhydride, trialkyltetrahydrophthalic anhydrides, hexahydrophthalic anhydride, 5-(2,5-dioxotetrahydr
• the epoxy compound and the unsaturated monobasic acid are preferably used in such a molar ratio that results in the formation of an epoxy adduct having 0.1 to 1.0 carboxyl group of the unsaturated monobasic acid added per epoxy group of the epoxy compound.
• the polybasic acid anhydride is preferably used in such a molar ratio as to provide 0.1 to 1.0 acid anhydride structure per hydroxyl group of the resulting epoxy adduct.
• the acid value of the ethylenically unsaturated alkali-developable compound may be adjusted by using a mono- or polyfunctional epoxy compound in combination with the ethylenically unsaturated, alkali-developable compound. It is preferred that the solid content of the ethylenically unsaturated, alkali-developable compound to have an acid value of 5 to 120 mg-KOH/g.
• the amount of the mono- or polyfunctional epoxy compound to be used is preferably chosen so as to satisfy the above recited range of acid value.
• Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadec
• the polyfunctional epoxy compound is preferably at least one compound selected from the group consisting of bisphenol epoxy compounds and glycidyl ethers Using at least one of them is effective in providing a (colored) alkali developable photosensitive resin composition having further improved characteristics.
• the bisphenol epoxy compounds include the epoxy compounds represented by general formula (II) and others including hydrogenated bisphenol epoxy compounds.
• glycidyl ethers examples include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri(glycidyloxymethyl)propane, 1,1,1-tri(glycidyloxymethyl)ethane, 1,1,1-tri(glycid
• polyfunctional epoxy compounds include novolak epoxy compounds, such as phenol novolak epoxy compounds, biphenyl novolak epoxy compounds, cresol novolak epoxy compounds, bisphenol A novolak epoxy compounds, and dicyclopentadiene novolak epoxy compounds; alicyclic epoxy compounds, such as 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methyleyelohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 1-epoxyethyl-3,4-epoxycyclohexane; glycidyl esters, such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, and glycidyl dimerate; glycidylamines, such as tetraglycidyl diaminodiphenylmethane, triglycidyl p-aminophenol
• the amount of the photopolymerization initiator to be used in the photosensitive composition of the invention is preferably, but not limited to, 1 to 70 parts, more preferably 1 to 50 parts, even more preferably 5 to 30 parts, by mass per 100 parts by mass of the ethylenically unsaturated polymerizable compound.
• the photosensitive composition is contemplated to be a (colored) alkali developable photosensitive resin composition
• the content of the ethylenically unsaturated, alkali developable compound in the composition is preferably 1 to 20%, more preferably 3 to 12%, by mass.
• the photosensitive composition of the invention may optionally contain a solvent.
• solvents capable of dissolving or dispersing the above described components such as the oxime ester compound of the invention and the ethylenically unsaturated polymerizable compound are used where necessary.
• Such solvents include ketones, e.g., methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, and cyclohexanone; ethers, such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, and dipropylene glycol dimethyl ether; esters, such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, and n-butyl acetate; cellosolve solvents, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and propylene glycol-1-monoethyl ether-2-acetate; alcohols, such as methanol, ethanol, isopropyl
• ketones and cellosolve solvents particularly propylene glycol-1-monomethyl ether-2-acetate, cyclohexanone, and so on in view of providing good compatibility between a resist and a photopolymerization initiator in a photosensitive composition.
• the photosensitive composition may further contain an inorganic compound.
• the inorganic compound include metal oxides, such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silica, and alumina; layered clay minerals, Milori blue, calcium carbonate, magnesium carbonate, cobalt compounds, manganese compounds, glass powder, mica, talc, kaolin, ferrocyanides, various metal sulfates, sulfides, selenides, aluminum silicate, calcium silicate, aluminum hydroxide, platinum, gold, silver, and copper. Preferred of them are titanium oxide, silica, layered clay minerals, and silver.
• the inorganic compounds are used as, for example, a filler, an antireflection agent, an electrically conductive agent, a stabilizer, a flame retardant, a mechanical strength improving agent, a specific wavelength absorbing agent, an ink repellent agent, and the like.
• the photosensitive composition of the invention especially the alkali developable photosensitive resin composition may further contain a colorant to be formulated into a colored photosensitive composition.
• a colorant to be formulated into a colored photosensitive composition.
• Pigments, dyes, and naturally occurring dyes are used as a colorant.
• the colorants may be used either individually or as a mixture of two or more thereof.
• the pigments may be either organic or inorganic, including nitroso compounds, nitro compounds, azo compounds, diazo compounds, xanthene compounds, quinoline compounds, anthraquinone compounds, coumarin compounds, phthalocyanine compounds, isoindolinone compounds, isoindoline compounds, quinacridone compounds, anthanthrone compounds, perynone compounds, perylene compounds, diketopyrrolopyrrole compounds, thioindigo compounds, dioxazine compounds, triphenylmethane compounds, quinophthalone compounds, and naphthalenetetracarboxylic acids; metal complex compounds, such as azo dyes, and cyanine dyes; lake pigments; carbon black species, such as furnace black, channel black, thermal black, acetylene black, Ketjen black, and lamp black; the carbon blacks recited which have been surface treated with an acid or an alkali; graphite, graphitized carbon black, activated carbon, carbon fiber, carbon
• pigments may be used, including pigment red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, 97, 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, and 254; pigment orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 65, and 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 95, 97, 98, 100, 109, 110, 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151,
• the dyes include azo dyes, anthraquinone dyes, indigoid dyes, triarylmethane dyes, xanthene dyes, alizarine dyes, acridine dyes, stilbene dyes, thiazole dyes, naphthol dyes, quinoline dyes, nitro dyes, indamine dyes, oxazine dyes, phthalocyanine dyes, and cyanine dyes.
• The may be used as a mixture thereof.
• the amount of the colorant to be added to the photosensitive composition is preferably 50 to 350 parts, more preferably 100 to 250 parts, by mass per 100 parts by mass of the ethylenically unsaturated polymerizable compound.
• the photosensitive composition may further contain other organic polymer in addition to the ethylenically unsaturated polymerizable compound to provide a cured product with improved characteristics.
• organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymers, poly(meth)acrylic acid, styrene-(meth)acrylic acid copolymers, (meth)acrylic acid-methyl methacrylate copolymers, ethylene-vinyl chloride copolymers, ethylene-vinyl copolymers, polyvinyl chloride resins, ABS resins, nylon 6, nylon 66, nylon 12, urethane resins, polycarbonate, polyvinyl butyral, cellulose esters, polyacrylamide, saturated polyesters, phenol resins, phenoxy resins, polyamide-imide resins, polyamic acid resins, and epoxy resins.
• the photosensitive composition may furthermore contain a monomer having an unsaturated bond, a chain transfer agent, a surfactant, and so on.
• the surfactant examples include fluorine-containing surfactants, such as perfluoroalkylphosphoric esters, perfluoroalkylcarboxylic acid salts; anionic surfactants, such as higher fatty acid alkali salts, alkylsulfonic acid salts, and alkylsulfuric acid salts; cationic surfactants, such as higher amine halogenic acid salts and quaternary ammonium salts; nonionic surfactants, such as polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters, and fatty acid monoglycerides; amphoteric surfactants, and silicone surfactants. These surfactants may be used in combination thereof.
• fluorine-containing surfactants such as perfluoroalkylphosphoric esters, perfluoroalkylcarboxylic acid salts
• anionic surfactants such as higher fatty acid alkali salts, alkylsulfonic acid
• the photosensitive composition may contain other photopolymerization initiator or sensitizer in addition to the oxime ester compound of the invention.
• a combined use of other photopolymerization initiator can produce marked synergistic effects.
• any known photopolymerization initiators can be used in combination with the oxime ester compound.
• examples of such initiators include benzophenone, phenyl biphenyl ketone, 1-hydroxy-1-benzoyleyclophexane, benzoin, benzyl dimethyl ketal, 1-benzyl-1-dimethylamino-1-(4′-morpholinobenzoyl)propane, 2-morpholyl-2-(4′-methylmercapto)benzoylpropane, thioxanthone, 1-chloro-4-propoxythioxanthone, isopropylthioxanthone, diethylthioxanthone, ethylanthraquinone, 4-benzoyl-4′-methyldiphenyl sulfide, benzoin butyl ether, 2-hydroxy-2-benzoylpropane, 2-hydroxy-2-(4′-isopropyl)benzoylpropane, 4-buty
• photopolymerization initiators can be used either individually or in a combination of two or more thereof.
• the amount of the known photopolymerization initiator(s), if used, is preferably equal to or less than the mass of the oxime ester compound of the invention.
• R 1 and R 2 are as defined for general formula (I); R 6 , Y 2 and n are as defined for general formula (III); R ′1 , R ′2 , and R ′6 have the same meaning as R 1 ; Y ′2 has the same meaning as Y 2 ; R 7 represents a diol residue or a dithiol residue; and Z 2 represents an oxygen atom or a sulfur atom.
• the photosensitive composition of the present invention may contain commonly used additives, including thermal polymerization inhibitors (e.g., p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, and phenothiazine), plasticizers, adhesion accelerators, fillers, defoaming agents, leveling agents surface modifiers, antioxidants, ultraviolet absorbers, dispersing acids, anti-coagulants, catalysts, effect accelerators, sensitizers, crosslinking agents, and thickeners.
• thermal polymerization inhibitors e.g., p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, and phenothiazine
• plasticizers e.g., p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, and phenothiazine
• adhesion accelerators e.g., p-anisole, hydroquinone, pyrocatechol, t
• the photosensitive composition of the invention is applied to a substrate, such as soda glass, quartz glass, semiconductor substrates, metals, paper, or plastics.
• a substrate such as soda glass, quartz glass, semiconductor substrates, metals, paper, or plastics.
• the method of application is not limited. Any known coating methods may be used, such as spin coating, roll coating, bar coating, die coating, curtain coating, printing, and dipping.
• the photosensitive composition may be once applied to a carrier substrate, such as a film, and then transferred to another substrate.
• the photosensitive composition containing the oxime ester compound of the invention can be cured with active light from light sources emitting light of wavelengths of from 300 to 450 nm.
• light sources include an ultrahigh pressure mercury lamps, mercury vapor arcs, carbon arcs, and xenon arcs.
• Step 2 Preparation of compound Nos. 1 to 3, 7, 10, 12, 20, 33, 45 to 51, and 53 to 58
• step (1) In a reactor were charged 20 mmol of the acylated compound obtained in step (1), 2.1 g (30 mmol) of hydroxylamine hydrochloride, and 16.9 g of dimethylformamide and stirred at 80° C. for 1 hour in a nitrogen stream. The reaction system was cooled to room temperature, followed by oil-water separation. The solvent was removed by evaporation. To the residue were added 25.4 g of butyl acetate and then 2.45 g (24 mmol) of acetic anhydride. The mixture was stirred at 90° C. for 1 hour, followed by cooling to room temperature.
• the acrylic copolymer used above was obtained by dissolving 20 parts by mass of methacrylic acid, 15 parts by mass of hydroxyethyl methacrylate, 10 parts by mass of methyl methacrylate, and 55 parts by mass of butyl methacrylate in 300 parts by mass of ethyl cellosolve, adding thereto 0.75 parts by mass of azobisisobutyronitrile, followed by heating at 70° C. for 5 hours in a nitrogen atmosphere.
• Photosensitive composition No. 3 was obtained in the same manner as in Example 2, except for replacing compound No. 1 prepared in Example 1-1 with 2.70 g of compound No. 3 prepared in Example 1-3.
• Photosensitive composition No. 4 was obtained in the same manner as in Example 2, except for replacing compound No. 1 prepared in Example 1-1 with 2.70 g of compound No. 7 prepared in Example 1-4.
• Photosensitive composition No. 5 was obtained in the same manner as in Example 2, except for replacing compound No. 1 prepared in Example 1-1 with 2.70 g of compound No. 10 prepared in Example 1-5.
• Photosensitive composition No. 6 was obtained in the same manner as in Example 2, except for replacing compound No. 1 prepared in Example 1-1 with 2.70 g of compound No. 12 prepared in Example 1-6.
• the reaction system was cooled room temperature, and 7.18 g of propylene glycol-1-monomethyl ether-2-acetate, 4.82 g of succinic anhydride, and 0.25 g of tetrabutylammonium acetate, were added thereto, followed by stirring at 1001° C. for 5 hours. To the mixture were further added 5.08 g of 1,1-bis(4′-epoxypropyloxyphenyl)-1-(1′′-biphenyl)-1-cyclohexylmethane and 2.18 g of propylene glycol-1-monomethyl ether-2-acetate, and the mixture was stirred at 12° C. for 12 hours, 80° C. for 2 hours, and 40° C. for 2 hours.
• Alkali developable resin composition No. 8 obtained in step 1 above (2.68 g), 0.73 g of trimethylolpropane triacrylate, 7.91 g of propylene glycol-1-monomethyl ether-2-acetate, and 5.18 g of cyclohexanone were mixed.
• Compound No. 1 obtained in Example 1 (1.58 g) was added thereto, followed by stirring well to give photosensitive composition No. 8 as an alkali developable photosensitive resin composition.
• Alkali developable resin composition No. 9 obtained in step 1 above (2.68 g), 0.73 g of trimethylolpropane triacrylate, 7.91 g of propylene glycol-1-monomethyl ether-2-acetate, and 5.18 g of cyclohexanone were mixed.
• Compound No. 1 obtained in Example 1 (1.58 g) was added thereto to give photosensitive composition No. 9 as an alkali developable photosensitive resin composition.
• Photosensitive composition No. 10 which was a colored alkali-developable photosensitive resin composition, was prepared in the same manner as in Example 9, except for further adding 2.00 g of pigment blue 15.
• Photosensitive composition No. 11 which was a colored alkali-developable photosensitive resin composition, was prepared in the same manner as in Example 10, except for further adding 3.00 g of carbon black.
• Photosensitive composition No. 12 was prepared in the same manner as in Example 2, except for further adding 4.52 g of titanium oxide.
• Photosensitive resin composition No. 13 for comparison was prepared in the same manner as in Example 2, except for replacing compound No. 1 obtained in Example 1-1 with 2.70 g of comparative compound 1 shown below.
• Photosensitive resin composition No. 14 as a comparative alkali developable photosensitive resin composition was prepared in the same manner as in Example 9, except for replacing 1.58 g of compound No. 1 obtained in Example 1-1 with 1.58 g of comparative compound 1.
• Photosensitive composition No. 8 which was an alkali developable photosensitive resin composition
• photosensitive resin composition No. 14 which was an alkali developable photosensitive resin composition for comparison, were evaluated for sensitivity as follows. The results are shown in Table 5.
• the photosensitive composition was applied to a 50 ⁇ m thick polyethylene terephthalate film with a #3 bar coater and irradiated with light of a high pressure mercury lamp (80 W/cm) using a light irradiator equipped with a belt conveyor.
• the distance between the lamp and the belt conveyor was 10 cm.
• the linear speed of the belt conveyor was 8 cm/min.
• the alkali developable photosensitive resin composition was applied to an aluminum plate with a #3 bar coater to a thickness of about 1 ⁇ m, prebaked at 60° C. for 15 minutes, and exposed to light of an ultra-high pressure mercury lamp using a spectrophotometer CT-25CP form JASCO Corp.
• the exposed coating layer was dipped in a 2.5 mass % solution of sodium carbonate at 25° C., followed by thoroughly washing with water.
• the spectral sensitivity at 365 nm and 405 nm was evaluated in terms of the minimum energy of light at 365 nm and 405 nm necessary for the coating layer to sufficiently cure to remain on the aluminum plate.
• Photosensitive composition No. 1 of Example 2 gained high hardness on curing, whereas photosensitive composition No. 13 of Comparative Example 1 failed to provide sufficient hardness.
• Alkali developable photosensitive resin composition No. 8 of Example 9 exhibited high sensitivity to light of long wavelengths, i.e., 365 nm and 405 nm, whereas alkali developable photosensitive resin composition No. 14 of Comparative Example 2 required an increased amount of energy for exposure at 365 nm and 405 nm on account of low sensitivity to these wavelengths of light.
• Photosensitive composition No. 16 as a comparative colored alkali-developable photosensitive resin composition was prepared in the same manner as in Example 14, except for replacing compound No. 54 obtained in Example 1-17 with 1.0 g of comparative compound 1.
• Photosensitive composition No. 15 and comparative photosensitive composition No. 16 were evaluated as follows. The results obtained are shown in Table 6.
• a photosensitive composition that succeeded in patterning with an exposure energy of 60 mJ/cm 2 was graded A.
• a photosensitive composition that failed to form a pattern until the exposure energy was raised to 100 mJ/cm 2 or 150 mJ/cm 2 was graded B or C, respectively.
• a photosensitive composition that succeeded in forming a satisfactory pattern of a line width of 8 ⁇ m or less was graded A.
• a photosensitive composition that succeeded in forming a good pattern with a line width of from 10 to 30 ⁇ m was graded B.
• a photosensitive composition that succeeded to form a good pattern with a line width of 30 ⁇ m or more was graded C.
• the pattern formed by the development was inspected for peeling. A pattern suffering from no peeling was rated “good”, while a pattern suffering from peeling in part was rated “poor”.
• photosensitive composition 16 of Comparative Example 3 which was a colored, alkali-developable photosensitive resin composition, had low sensitivity, low resolution, and poor adhesion to the substrate.
• the oxime ester compound of the invention exhibits high photosensitivity, particularly to long wavelengths of light at 365 nm (i-rays) and 405 nm (h-rays), and is therefore useful as a photopolymerization initiator.

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