TWI729625B - 樹脂鑄模裝置 - Google Patents
樹脂鑄模裝置 Download PDFInfo
- Publication number
- TWI729625B TWI729625B TW108146043A TW108146043A TWI729625B TW I729625 B TWI729625 B TW I729625B TW 108146043 A TW108146043 A TW 108146043A TW 108146043 A TW108146043 A TW 108146043A TW I729625 B TWI729625 B TW I729625B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- workpiece
- mold
- molding
- hand
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
- B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/38—Moulds for making articles of definite length, i.e. discrete articles with means to avoid flashes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/366—Moulds for making articles of definite length, i.e. discrete articles plates pressurized by an actuator, e.g. ram drive, screw, vulcanizing presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
- B29C2043/5061—Removing moulded articles using means movable from outside the mould between mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018244435A JP7203414B2 (ja) | 2018-12-27 | 2018-12-27 | 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置 |
JP2018-244435 | 2018-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202045334A TW202045334A (zh) | 2020-12-16 |
TWI729625B true TWI729625B (zh) | 2021-06-01 |
Family
ID=71125839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108146043A TWI729625B (zh) | 2018-12-27 | 2019-12-16 | 樹脂鑄模裝置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7203414B2 (ja) |
KR (1) | KR102340509B1 (ja) |
CN (1) | CN111867800B (ja) |
TW (1) | TWI729625B (ja) |
WO (1) | WO2020137386A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7445974B2 (ja) * | 2020-10-20 | 2024-03-08 | アピックヤマダ株式会社 | 樹脂封止装置 |
WO2023100439A1 (ja) * | 2021-12-03 | 2023-06-08 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
CN116461034B (zh) * | 2023-03-05 | 2023-11-21 | 广州市迅兴精密工业有限公司 | 一种汽车配件加工用高精度冲压模具 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003229444A (ja) * | 2001-11-30 | 2003-08-15 | Apic Yamada Corp | 成形品収納装置及び樹脂封止装置 |
CN102543773A (zh) * | 2010-11-25 | 2012-07-04 | 山田尖端科技株式会社 | 树脂模制装置 |
JP2018192712A (ja) * | 2017-05-18 | 2018-12-06 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0682698B2 (ja) * | 1984-10-03 | 1994-10-19 | 道男 長田 | 半導体素子の自動連続化トランスファ樹脂モールド成形方法 |
JPH0657414B2 (ja) * | 1988-06-27 | 1994-08-03 | トーワ株式会社 | 電子部品の樹脂封止成形方法及び金型装置 |
JP3439386B2 (ja) * | 1999-07-27 | 2003-08-25 | Necエレクトロニクス株式会社 | 樹脂封入方法とその装置 |
JP4058357B2 (ja) * | 2003-01-30 | 2008-03-05 | アピックヤマダ株式会社 | ヒートスプレッダー搬送装置及び樹脂封止装置 |
JP3609824B1 (ja) * | 2003-10-30 | 2005-01-12 | 第一精工株式会社 | 樹脂封止成形装置 |
CN100528527C (zh) * | 2006-01-09 | 2009-08-19 | 李岳桥 | 一种具有节能降耗浇注系统的塑胶注射模具 |
JP5128430B2 (ja) * | 2008-09-30 | 2013-01-23 | Towa株式会社 | 下型キャビティ面への離型フイルム装着方法及び装置 |
JP5312897B2 (ja) * | 2008-10-20 | 2013-10-09 | Towa株式会社 | 圧縮成形装置 |
JP5693931B2 (ja) | 2010-11-25 | 2015-04-01 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP5793806B2 (ja) * | 2011-08-17 | 2015-10-14 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP6137679B2 (ja) | 2013-05-13 | 2017-05-31 | アピックヤマダ株式会社 | 樹脂モールド装置および樹脂モールド方法 |
WO2014192456A1 (ja) * | 2013-05-29 | 2014-12-04 | アピックヤマダ株式会社 | 樹脂モールド装置および樹脂モールド方法 |
JP6180206B2 (ja) * | 2013-07-03 | 2017-08-16 | アピックヤマダ株式会社 | 樹脂封止方法および圧縮成形装置 |
JP6281461B2 (ja) * | 2014-09-30 | 2018-02-21 | 日立金属株式会社 | 樹脂モールド付きケーブルの製造方法 |
JP6625838B2 (ja) * | 2015-07-08 | 2019-12-25 | Towa株式会社 | 加圧装置およびそれを備えた個片化装置、樹脂成形装置、デバイス製造装置、ならびに加圧方法およびそれを含む樹脂成形方法、デバイス製造方法 |
JP6184632B1 (ja) * | 2017-03-23 | 2017-08-23 | エムテックスマツムラ株式会社 | ゲートブレーク装置及び樹脂成形システム |
-
2018
- 2018-12-27 JP JP2018244435A patent/JP7203414B2/ja active Active
-
2019
- 2019-12-04 CN CN201980019816.XA patent/CN111867800B/zh active Active
- 2019-12-04 WO PCT/JP2019/047313 patent/WO2020137386A1/ja active Application Filing
- 2019-12-04 KR KR1020207023026A patent/KR102340509B1/ko active IP Right Grant
- 2019-12-16 TW TW108146043A patent/TWI729625B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003229444A (ja) * | 2001-11-30 | 2003-08-15 | Apic Yamada Corp | 成形品収納装置及び樹脂封止装置 |
CN102543773A (zh) * | 2010-11-25 | 2012-07-04 | 山田尖端科技株式会社 | 树脂模制装置 |
TW201727846A (zh) * | 2010-11-25 | 2017-08-01 | 山田尖端科技股份有限公司 | 樹脂模塑裝置與樹脂模塑方法 |
JP2018192712A (ja) * | 2017-05-18 | 2018-12-06 | アピックヤマダ株式会社 | モールド金型及び樹脂モールド方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202045334A (zh) | 2020-12-16 |
JP7203414B2 (ja) | 2023-01-13 |
JP2020107700A (ja) | 2020-07-09 |
KR20200105720A (ko) | 2020-09-08 |
KR102340509B1 (ko) | 2021-12-20 |
CN111867800A (zh) | 2020-10-30 |
CN111867800B (zh) | 2022-07-15 |
WO2020137386A1 (ja) | 2020-07-02 |
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