TWI705982B - 硬化性樹脂及其製造方法 - Google Patents

硬化性樹脂及其製造方法 Download PDF

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Publication number
TWI705982B
TWI705982B TW105101655A TW105101655A TWI705982B TW I705982 B TWI705982 B TW I705982B TW 105101655 A TW105101655 A TW 105101655A TW 105101655 A TW105101655 A TW 105101655A TW I705982 B TWI705982 B TW I705982B
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TW
Taiwan
Prior art keywords
curable resin
epoxy resin
mol
epoxy
phenol compound
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TW105101655A
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English (en)
Chinese (zh)
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TW201629115A (zh
Inventor
吉田雅年
大槻信章
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日商日本觸媒股份有限公司
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Publication of TW201629115A publication Critical patent/TW201629115A/zh
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Publication of TWI705982B publication Critical patent/TWI705982B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1494Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1444Monoalcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
TW105101655A 2015-02-02 2016-01-20 硬化性樹脂及其製造方法 TWI705982B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-018461 2015-02-02
JP2015018461 2015-02-02

Publications (2)

Publication Number Publication Date
TW201629115A TW201629115A (zh) 2016-08-16
TWI705982B true TWI705982B (zh) 2020-10-01

Family

ID=56552846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105101655A TWI705982B (zh) 2015-02-02 2016-01-20 硬化性樹脂及其製造方法

Country Status (5)

Country Link
US (1) US10508169B2 (enExample)
JP (2) JP6557155B2 (enExample)
KR (1) KR101952927B1 (enExample)
CN (1) CN105837795B (enExample)
TW (1) TWI705982B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108164686B (zh) * 2018-02-01 2020-01-21 江南大学 一种改性环氧丙烯酸酯、含该改性环氧丙烯酸酯的阻焊剂
KR102177966B1 (ko) * 2019-03-07 2020-11-12 주식회사 케이씨씨 수용성 에폭시 수지 분산액 및 이의 제조방법
JP7791997B2 (ja) * 2022-07-06 2025-12-24 株式会社日本触媒 硬化性樹脂、並びに硬化性樹脂中間体、硬化性樹脂、硬化性樹脂組成物、及び硬化物の製造方法
CN119842029A (zh) * 2025-03-18 2025-04-18 洛阳昱胜化学有限公司 一种压裂用多元共聚稠化剂及其制备方法

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US6077879A (en) * 1997-11-11 2000-06-20 Nippon Shokubai Co., Ltd. Curable resin and resin composition
JP2007199246A (ja) * 2006-01-25 2007-08-09 Taiyo Ink Mfg Ltd 硬化性組成物及びその硬化物
CN102792224A (zh) * 2010-03-08 2012-11-21 株式会社Lg化学 具有优良耐热性和机械性能的光敏树脂组合物及印刷电路板用保护膜

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GB8315230D0 (en) 1983-06-03 1983-07-06 Shell Int Research Polyglycidyl ethers
EP0127915B1 (en) 1983-06-03 1988-12-07 Shell Internationale Researchmaatschappij B.V. Novel polyglycidyl ethers, their preparation and their use as thermosetting coating compositions
GB8405139D0 (en) 1984-02-28 1984-04-04 Shell Int Research Binders for thermosetting coating compositions
GB8329881D0 (en) 1983-11-09 1983-12-14 Shell Int Research Preparation of binders for coatings
US4686248A (en) 1984-02-28 1987-08-11 Shell Oil Company Preparation of binders for coatings, thermosetting coating compositions and their use
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS63258975A (ja) 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
DE3704149A1 (de) 1987-02-11 1988-08-25 Ruetgerswerke Ag Durch bestrahlung haertbare harze, verfahren zu ihrer herstellung und verwendung
JPH06192387A (ja) 1992-12-24 1994-07-12 Toagosei Chem Ind Co Ltd 活性エネルギー線硬化性樹脂
JP3395993B2 (ja) 1994-03-08 2003-04-14 日本化薬株式会社 樹脂組成物、レジストインキ組成物及びその硬化物
JP3409279B2 (ja) 1997-11-11 2003-05-26 株式会社日本触媒 硬化性樹脂および樹脂組成物
JP3541136B2 (ja) * 1997-12-19 2004-07-07 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP3820406B2 (ja) * 1997-12-19 2006-09-13 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
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TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
WO2007119651A1 (ja) * 2006-04-13 2007-10-25 Taiyo Ink Mfg. Co., Ltd. アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
CN101105626A (zh) * 2006-07-10 2008-01-16 太阳油墨制造株式会社 光固化性·热固化性树脂组合物、其固化物及印刷电路板
JP4873238B2 (ja) * 2006-08-31 2012-02-08 Dic株式会社 アルカリ現像型感光性樹脂組成物、レジストインキ、及びプリント配線基板
WO2008059670A1 (en) * 2006-11-15 2008-05-22 Taiyo Ink Mfg. Co., Ltd. Photocurable/thermosetting resin composition, cured object, and printed wiring board
JP4774070B2 (ja) * 2007-03-05 2011-09-14 株式会社日本触媒 画像形成用感光性樹脂組成物及びその製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6077879A (en) * 1997-11-11 2000-06-20 Nippon Shokubai Co., Ltd. Curable resin and resin composition
JPH11288091A (ja) * 1997-12-19 1999-10-19 Taiyo Ink Mfg Ltd アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP2007199246A (ja) * 2006-01-25 2007-08-09 Taiyo Ink Mfg Ltd 硬化性組成物及びその硬化物
CN102792224A (zh) * 2010-03-08 2012-11-21 株式会社Lg化学 具有优良耐热性和机械性能的光敏树脂组合物及印刷电路板用保护膜

Also Published As

Publication number Publication date
CN105837795A (zh) 2016-08-10
KR101952927B1 (ko) 2019-02-27
TW201629115A (zh) 2016-08-16
JP6557155B2 (ja) 2019-08-07
JP2016145334A (ja) 2016-08-12
US10508169B2 (en) 2019-12-17
US20160222154A1 (en) 2016-08-04
KR20160094862A (ko) 2016-08-10
JP2019151861A (ja) 2019-09-12
JP6691627B2 (ja) 2020-04-28
CN105837795B (zh) 2019-06-14

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