CN105837795B - 固化性树脂及其制备方法 - Google Patents
固化性树脂及其制备方法 Download PDFInfo
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- CN105837795B CN105837795B CN201610055902.4A CN201610055902A CN105837795B CN 105837795 B CN105837795 B CN 105837795B CN 201610055902 A CN201610055902 A CN 201610055902A CN 105837795 B CN105837795 B CN 105837795B
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- epoxy resin
- mole
- curable resin
- resin
- anhydride
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 54
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- 238000006243 chemical reaction Methods 0.000 claims description 22
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- 238000007711 solidification Methods 0.000 claims description 10
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1444—Monoalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
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| JP2015-018461 | 2015-02-02 | ||
| JP2015018461 | 2015-02-02 |
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| CN108164686B (zh) * | 2018-02-01 | 2020-01-21 | 江南大学 | 一种改性环氧丙烯酸酯、含该改性环氧丙烯酸酯的阻焊剂 |
| KR102177966B1 (ko) * | 2019-03-07 | 2020-11-12 | 주식회사 케이씨씨 | 수용성 에폭시 수지 분산액 및 이의 제조방법 |
| JP7791997B2 (ja) * | 2022-07-06 | 2025-12-24 | 株式会社日本触媒 | 硬化性樹脂、並びに硬化性樹脂中間体、硬化性樹脂、硬化性樹脂組成物、及び硬化物の製造方法 |
| CN119842029A (zh) * | 2025-03-18 | 2025-04-18 | 洛阳昱胜化学有限公司 | 一种压裂用多元共聚稠化剂及其制备方法 |
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| GB8405139D0 (en) | 1984-02-28 | 1984-04-04 | Shell Int Research | Binders for thermosetting coating compositions |
| GB8329881D0 (en) | 1983-11-09 | 1983-12-14 | Shell Int Research | Preparation of binders for coatings |
| US4686248A (en) | 1984-02-28 | 1987-08-11 | Shell Oil Company | Preparation of binders for coatings, thermosetting coating compositions and their use |
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| JPS63258975A (ja) | 1986-12-26 | 1988-10-26 | Toshiba Corp | ソルダーレジストインキ組成物 |
| DE3704149A1 (de) | 1987-02-11 | 1988-08-25 | Ruetgerswerke Ag | Durch bestrahlung haertbare harze, verfahren zu ihrer herstellung und verwendung |
| JPH06192387A (ja) | 1992-12-24 | 1994-07-12 | Toagosei Chem Ind Co Ltd | 活性エネルギー線硬化性樹脂 |
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| JP3409279B2 (ja) | 1997-11-11 | 2003-05-26 | 株式会社日本触媒 | 硬化性樹脂および樹脂組成物 |
| JP3541136B2 (ja) * | 1997-12-19 | 2004-07-07 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
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| JP2004061566A (ja) * | 2002-07-25 | 2004-02-26 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板 |
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| TW200710572A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same |
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| WO2007119651A1 (ja) * | 2006-04-13 | 2007-10-25 | Taiyo Ink Mfg. Co., Ltd. | アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板 |
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| WO2008059670A1 (en) * | 2006-11-15 | 2008-05-22 | Taiyo Ink Mfg. Co., Ltd. | Photocurable/thermosetting resin composition, cured object, and printed wiring board |
| JP4774070B2 (ja) * | 2007-03-05 | 2011-09-14 | 株式会社日本触媒 | 画像形成用感光性樹脂組成物及びその製造方法 |
| CN101542392B (zh) * | 2007-03-29 | 2013-08-14 | 太阳控股株式会社 | 光固化性树脂组合物、干膜、固化物以及印刷线路板 |
| JP5661293B2 (ja) | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
| WO2011111964A2 (ko) * | 2010-03-08 | 2011-09-15 | 주식회사 엘지화학 | 내열성 및 기계적 성질이 우수한 감광성 수지 조성물 및 인쇄회로기판용 보호필름 |
| CN103492950B (zh) * | 2011-06-17 | 2016-04-13 | 太阳油墨制造株式会社 | 光固化性热固化性树脂组合物 |
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| TW201629115A (zh) | 2016-08-16 |
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| JP2016145334A (ja) | 2016-08-12 |
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| US10508169B2 (en) | 2019-12-17 |
| US20160222154A1 (en) | 2016-08-04 |
| KR20160094862A (ko) | 2016-08-10 |
| JP2019151861A (ja) | 2019-09-12 |
| JP6691627B2 (ja) | 2020-04-28 |
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