TWI625990B - 佈線板及其製造方法 - Google Patents

佈線板及其製造方法 Download PDF

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Publication number
TWI625990B
TWI625990B TW101133257A TW101133257A TWI625990B TW I625990 B TWI625990 B TW I625990B TW 101133257 A TW101133257 A TW 101133257A TW 101133257 A TW101133257 A TW 101133257A TW I625990 B TWI625990 B TW I625990B
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TW
Taiwan
Prior art keywords
layer
wiring
insulating layer
insulating
contact layer
Prior art date
Application number
TW101133257A
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English (en)
Chinese (zh)
Other versions
TW201325339A (zh
Inventor
近藤人資
Original Assignee
新光電氣工業股份有限公司
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Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201325339A publication Critical patent/TW201325339A/zh
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Publication of TWI625990B publication Critical patent/TWI625990B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW101133257A 2011-09-12 2012-09-12 佈線板及其製造方法 TWI625990B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011198564A JP6081693B2 (ja) 2011-09-12 2011-09-12 配線基板及び配線基板の製造方法
JP2011-198564 2011-09-12

Publications (2)

Publication Number Publication Date
TW201325339A TW201325339A (zh) 2013-06-16
TWI625990B true TWI625990B (zh) 2018-06-01

Family

ID=47828810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101133257A TWI625990B (zh) 2011-09-12 2012-09-12 佈線板及其製造方法

Country Status (4)

Country Link
US (1) US9060455B2 (enExample)
JP (1) JP6081693B2 (enExample)
KR (1) KR101906883B1 (enExample)
TW (1) TWI625990B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127664B2 (en) * 2011-10-31 2021-09-21 Unimicron Technology Corp. Circuit board and manufacturing method thereof
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
JP2015008261A (ja) * 2013-05-28 2015-01-15 京セラサーキットソリューションズ株式会社 配線基板およびその製造方法
US20140353019A1 (en) * 2013-05-30 2014-12-04 Deepak ARORA Formation of dielectric with smooth surface
JP6158676B2 (ja) * 2013-10-15 2017-07-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6375121B2 (ja) * 2014-02-27 2018-08-15 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP6341714B2 (ja) 2014-03-25 2018-06-13 新光電気工業株式会社 配線基板及びその製造方法
JP6133227B2 (ja) * 2014-03-27 2017-05-24 新光電気工業株式会社 配線基板及びその製造方法
US9736939B2 (en) 2014-09-19 2017-08-15 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
US9899248B2 (en) * 2014-12-03 2018-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming semiconductor packages having through package vias
US10325853B2 (en) 2014-12-03 2019-06-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming semiconductor packages having through package vias
JP6447075B2 (ja) * 2014-12-10 2019-01-09 凸版印刷株式会社 配線基板、半導体装置及び半導体装置の製造方法
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法
JP2017152536A (ja) * 2016-02-24 2017-08-31 イビデン株式会社 プリント配線板及びその製造方法
US10037961B2 (en) * 2016-05-17 2018-07-31 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out package and method of fabricating the same
US10801137B2 (en) 2016-07-21 2020-10-13 International Business Machines Corporation Glass cloth including attached fibers
JP2018032659A (ja) * 2016-08-22 2018-03-01 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
JP2019121771A (ja) * 2018-01-11 2019-07-22 イビデン株式会社 プリント配線板
TWI713842B (zh) 2018-05-10 2020-12-21 恆勁科技股份有限公司 覆晶封裝基板之製法及其結構
JP7359531B2 (ja) * 2018-06-07 2023-10-11 新光電気工業株式会社 配線基板、配線基板の製造方法及び半導体パッケージの製造方法
KR20220015011A (ko) * 2020-07-30 2022-02-08 삼성전기주식회사 인쇄회로기판 및 전자부품 내장기판
GB202018676D0 (en) * 2020-11-27 2021-01-13 Graphcore Ltd Controlling warpage of a substrate for mounting a semiconductor die
CN114597193A (zh) * 2020-12-07 2022-06-07 群创光电股份有限公司 电子装置的重布线层结构及其制作方法
TWI812977B (zh) * 2021-07-16 2023-08-21 欣興電子股份有限公司 電路板強化結構及其製作方法
JP7743265B2 (ja) * 2021-10-26 2025-09-24 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN117812852A (zh) * 2022-09-23 2024-04-02 鹏鼎控股(深圳)股份有限公司 多层线路板的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1756654A (zh) * 2002-12-27 2006-04-05 日本电气株式会社 薄片材料及布线板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1696714B1 (en) * 1996-12-13 2009-12-02 Ibiden Co., Ltd. Multilayer printed wiring board
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Industrial Co Ltd Wiring board and production process for the same
WO2000045430A1 (en) * 1999-01-29 2000-08-03 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
JP3371894B2 (ja) * 1999-09-17 2003-01-27 ソニーケミカル株式会社 接続材料
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
JP2001230551A (ja) * 2000-02-14 2001-08-24 Ibiden Co Ltd プリント配線板並びに多層プリント配線板及びその製造方法
JP4444435B2 (ja) * 2000-03-06 2010-03-31 ソニーケミカル＆インフォメーションデバイス株式会社 プリント配線基板及びプリント配線基板の製造方法
JP2002064270A (ja) * 2000-08-17 2002-02-28 Matsushita Electric Ind Co Ltd 回路基板とその製造方法
JP2003332734A (ja) * 2002-05-14 2003-11-21 Mitsubishi Gas Chem Co Inc アディティブ法プリント配線板の製造方法。
JP4072176B2 (ja) 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
US7523545B2 (en) * 2006-04-19 2009-04-28 Dynamic Details, Inc. Methods of manufacturing printed circuit boards with stacked micro vias
JP5092662B2 (ja) * 2007-10-03 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
JP2009170753A (ja) * 2008-01-18 2009-07-30 Panasonic Corp 多層プリント配線板とこれを用いた実装体
JP5295596B2 (ja) 2008-03-19 2013-09-18 新光電気工業株式会社 多層配線基板およびその製造方法
JP2010129942A (ja) * 2008-12-01 2010-06-10 Fujitsu Ltd 回路基板及びその製造方法並びに半導体装置及びその製造方法
JP2011051247A (ja) * 2009-09-02 2011-03-17 Hitachi Chem Co Ltd 熱硬化性樹脂組成物層付き金属箔、金属張積層板及びプリント配線板
JP5482083B2 (ja) * 2009-10-14 2014-04-23 日立化成株式会社 配線板用積層板及びその製造方法、プライマー層用樹脂フィルム、多層配線板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1756654A (zh) * 2002-12-27 2006-04-05 日本电气株式会社 薄片材料及布线板

Also Published As

Publication number Publication date
US9060455B2 (en) 2015-06-16
TW201325339A (zh) 2013-06-16
KR101906883B1 (ko) 2018-12-05
KR20130028861A (ko) 2013-03-20
US20130062108A1 (en) 2013-03-14
JP6081693B2 (ja) 2017-02-15
JP2013062314A (ja) 2013-04-04

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