TWI594828B - 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 - Google Patents

應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 Download PDF

Info

Publication number
TWI594828B
TWI594828B TW105102654A TW105102654A TWI594828B TW I594828 B TWI594828 B TW I594828B TW 105102654 A TW105102654 A TW 105102654A TW 105102654 A TW105102654 A TW 105102654A TW I594828 B TWI594828 B TW I594828B
Authority
TW
Taiwan
Prior art keywords
aod
laser beam
processing
subsystem
laser
Prior art date
Application number
TW105102654A
Other languages
English (en)
Chinese (zh)
Other versions
TW201620656A (zh
Inventor
馬克Ａ 昂瑞斯
威廉Ｊ 喬丹
詹姆斯 埃斯梅爾
松本久
布萊恩 強漢森 萊伯格
Original Assignee
伊雷克托科學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 伊雷克托科學工業股份有限公司 filed Critical 伊雷克托科學工業股份有限公司
Publication of TW201620656A publication Critical patent/TW201620656A/zh
Application granted granted Critical
Publication of TWI594828B publication Critical patent/TWI594828B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Micromachines (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW105102654A 2009-05-28 2010-05-27 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 TWI594828B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18188909P 2009-05-28 2009-05-28

Publications (2)

Publication Number Publication Date
TW201620656A TW201620656A (zh) 2016-06-16
TWI594828B true TWI594828B (zh) 2017-08-11

Family

ID=43219074

Family Applications (3)

Application Number Title Priority Date Filing Date
TW105102654A TWI594828B (zh) 2009-05-28 2010-05-27 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
TW099116980A TWI523720B (zh) 2009-05-28 2010-05-27 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
TW099117388A TWI515067B (zh) 2009-05-28 2010-05-28 使用具有靶特徵的雷射射束之透過透鏡校準的雷射處理系統及方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW099116980A TWI523720B (zh) 2009-05-28 2010-05-27 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
TW099117388A TWI515067B (zh) 2009-05-28 2010-05-28 使用具有靶特徵的雷射射束之透過透鏡校準的雷射處理系統及方法

Country Status (6)

Country Link
US (5) US8404998B2 (https=)
JP (3) JP5689873B2 (https=)
KR (8) KR102583177B1 (https=)
CN (2) CN102449863B (https=)
TW (3) TWI594828B (https=)
WO (2) WO2010138897A2 (https=)

Families Citing this family (151)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
JP5100914B2 (ja) * 2010-10-15 2012-12-19 三菱電機株式会社 レーザ加工機及び蛇腹装置
JP6055414B2 (ja) * 2010-10-22 2016-12-27 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
JP5731868B2 (ja) * 2011-03-24 2015-06-10 ビアメカニクス株式会社 レーザ加工方法及び加工装置
US8648277B2 (en) * 2011-03-31 2014-02-11 Electro Scientific Industries, Inc. Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
TWI449420B (zh) * 2011-05-31 2014-08-11 Nat Applied Res Laboratoires 搜索取像系統及其控制方法
JP5860228B2 (ja) * 2011-06-13 2016-02-16 株式会社ディスコ レーザー加工装置
TWI608886B (zh) * 2011-07-05 2017-12-21 電子科學工業股份有限公司 用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法
TWI587957B (zh) * 2011-08-18 2017-06-21 奧寶科技有限公司 用於電路之一檢測/維修/檢測系統之透鏡總成及用於電路之一檢測/維修/檢測系統之組合器總成
US9885934B2 (en) 2011-09-14 2018-02-06 View, Inc. Portable defect mitigators for electrochromic windows
KR101676931B1 (ko) 2011-12-22 2016-11-16 인텔 코포레이션 레이저 빔 스캐닝을 위한 음향 광학 편향기의 구성
US9828277B2 (en) * 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Methods for separation of strengthened glass
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
JP2015516352A (ja) 2012-02-29 2015-06-11 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品
EP2825911B1 (en) 2012-03-13 2018-05-09 View, Inc. Pinhole mitigation for optical devices
US10583523B2 (en) * 2012-05-18 2020-03-10 View, Inc. Circumscribing defects in optical devices
US8848277B2 (en) * 2012-05-31 2014-09-30 Asml Netherlands B.V. System and method for protecting a seed laser in an EUV light source with a Bragg AOM
EP2943778B1 (en) 2013-01-09 2020-10-28 The Regents of The University of California Apparatus and methods for fluorescence imaging using radiofrequency-multiplexed excitation
WO2014110276A1 (en) * 2013-01-11 2014-07-17 Electro Scientific Industries, Inc. Laser pulse energy control systems and methods
DE102013201968B4 (de) 2013-02-07 2014-08-28 BLZ Bayerisches Laserzentrum Gemeinnützige Forschungsgesellschaft mbH Vorrichtung zur akustooptischen Umformung periodisch gepulster, elektromagnetischer Strahlung
US9842665B2 (en) 2013-02-21 2017-12-12 Nlight, Inc. Optimization of high resolution digitally encoded laser scanners for fine feature marking
US10464172B2 (en) 2013-02-21 2019-11-05 Nlight, Inc. Patterning conductive films using variable focal plane to control feature size
KR102020912B1 (ko) 2013-02-21 2019-09-11 엔라이트 인크. 다층 구조의 레이저 패터닝
KR102245810B1 (ko) * 2013-03-15 2021-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Aod 라우트 프로세싱을 위한 레이저 시스템들 및 방법들
JP6516722B2 (ja) * 2013-03-15 2019-05-22 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビームポジショナのレーザ出射に基づく制御
WO2014152526A1 (en) * 2013-03-15 2014-09-25 Electro Scientific Industries, Inc. Laser systems and methods for aod tool settling for aod travel reduction
EP2973896B1 (en) 2013-03-15 2019-09-18 Electro Scientific Industries, Inc. Phased array steering for laser beam positioning systems
TWI543830B (zh) 2013-05-10 2016-08-01 財團法人工業技術研究院 視覺誤差校正方法
DE102013019156A1 (de) * 2013-11-14 2015-05-21 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Erzeugen dynamischer Scannerfiguren zum Bearbeiten eines Werkstücks
KR20150102180A (ko) * 2014-02-27 2015-09-07 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
EP3120130B1 (en) 2014-03-18 2023-07-26 The Regents of the University of California Parallel flow cytometer using radiofrequency mulitplexing, and method
KR101962527B1 (ko) * 2014-05-22 2019-03-26 인텔 코포레이션 광학 빔 조향을 위한 다수의 트랜스듀서를 구비한 음향 광학 편향기
US10069271B2 (en) 2014-06-02 2018-09-04 Nlight, Inc. Scalable high power fiber laser
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
TWI649932B (zh) * 2014-06-20 2019-02-01 美商克萊譚克公司 使用面鏡及／或稜鏡之雷射重覆率倍增器及平頂射束分佈產生器
CN105720463B (zh) 2014-08-01 2021-05-14 恩耐公司 光纤和光纤传输的激光器中的背向反射保护与监控
JP2016096241A (ja) * 2014-11-14 2016-05-26 株式会社ディスコ レーザー発振機構
KR102695912B1 (ko) 2014-12-05 2024-08-14 컨버전트 덴탈 인크 레이저 빔의 정렬을 위한 시스템들 및 방법들
CA2970149C (en) * 2014-12-10 2022-12-13 Berkeley Lights, Inc. Systems for operating electrokinetic devices
US9837783B2 (en) 2015-01-26 2017-12-05 Nlight, Inc. High-power, single-mode fiber sources
US10509390B2 (en) 2015-02-12 2019-12-17 Glowforge Inc. Safety and reliability guarantees for laser fabrication
CN117259959A (zh) 2015-02-12 2023-12-22 格罗弗治公司 用于激光加工的视觉预览
US10507544B2 (en) 2015-02-27 2019-12-17 Electro Scientific Industries, Inc Fast beam manipulation for cross-axis miromaching
US10050404B2 (en) 2015-03-26 2018-08-14 Nlight, Inc. Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss
JP6553940B2 (ja) * 2015-05-15 2019-07-31 株式会社ディスコ レーザー加工装置
CN104921805B (zh) * 2015-05-20 2017-05-31 中卫祥光（北京）科技有限公司 可视化点阵激光治疗仪
US10721420B2 (en) 2015-06-02 2020-07-21 Intel Corporation Method and system of adaptable exposure control and light projection for cameras
CN106794564B (zh) 2015-06-22 2019-02-19 伊雷克托科学工业股份有限公司 多轴工具机及其控制方法
CN107924023B (zh) 2015-07-08 2020-12-01 恩耐公司 具有用于增加的光束参数乘积的中心折射率受抑制的纤维
DE102015112151A1 (de) * 2015-07-24 2017-02-09 Lpkf Laser & Electronics Ag Verfahren und Vorrichtung zur Laserbearbeitung eines Substrates mit mehrfacher Ablenkung einer Laserstrahlung
KR101821239B1 (ko) * 2015-09-04 2018-01-24 주식회사 이오테크닉스 접착제 제거장치 및 방법
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN108474728B (zh) 2015-10-13 2022-04-26 贝克顿·迪金森公司 多模态荧光成像流式细胞术系统
CN108367389B (zh) * 2015-11-23 2020-07-28 恩耐公司 激光加工方法和装置
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US11642725B2 (en) 2016-01-19 2023-05-09 General Electric Company Method for calibrating laser additive manufacturing process
CN108698164B (zh) 2016-01-19 2021-01-29 恩耐公司 处理3d激光扫描仪系统中的校准数据的方法
JP7130562B2 (ja) 2016-03-17 2022-09-05 ベクトン・ディキンソン・アンド・カンパニー ハイスループット蛍光フローサイトメーターを用いる細胞選別
CN109477784B (zh) 2016-05-12 2022-04-01 Bd生物科学公司 具有增强图像分辨率的荧光成像流式细胞术
US10423047B2 (en) * 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus
CN109477785B (zh) 2016-09-13 2022-09-27 贝克顿·迪金森公司 具有光学均衡的流式细胞仪
US10673197B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-based optical modulator
US10730785B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Optical fiber bending mechanisms
US10673198B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-coupled laser with time varying beam characteristics
JP7186695B2 (ja) 2016-09-29 2022-12-09 エヌライト，インコーポレーテッド 調節可能なビーム特性
US10732439B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Fiber-coupled device for varying beam characteristics
US10673199B2 (en) 2016-09-29 2020-06-02 Nlight, Inc. Fiber-based saturable absorber
US10401704B2 (en) * 2016-11-11 2019-09-03 Asml Netherlands B.V. Compensating for a physical effect in an optical system
WO2018098396A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Multi-user computer-numerically-controlled machine
WO2018098399A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Controlled deceleration of moveable components in a computer numerically controlled machine
WO2018098395A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Improved engraving in a computer numerically controlled machine
US12420355B2 (en) 2016-11-25 2025-09-23 Glowforge Inc. Laser fabrication with beam detection
WO2018098398A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Preset optical components in a computer numerically controlled machine
WO2018098394A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Fabrication with image tracing
WO2018098393A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Housing for computer-numerically-controlled machine
WO2018098397A1 (en) 2016-11-25 2018-05-31 Glowforge Inc. Calibration of computer-numerically-controlled machine
JP6870974B2 (ja) * 2016-12-08 2021-05-12 株式会社ディスコ 被加工物の分割方法
US11072025B2 (en) 2016-12-23 2021-07-27 General Electric Company Method for avoiding plume interference in additive manufacturing
US11478853B2 (en) 2016-12-23 2022-10-25 General Electric Company Method for emissions plume monitoring in additive manufacturing
US11318535B2 (en) 2016-12-23 2022-05-03 General Electric Company Method for process control in additive manufacturing
CN110139727B (zh) * 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
US10904514B2 (en) 2017-02-09 2021-01-26 Facebook Technologies, Llc Polarization illumination using acousto-optic structured light in 3D depth sensing
JP6909392B2 (ja) * 2017-03-31 2021-07-28 株式会社東京精密 レーザ加工装置及びレーザ加工方法
KR102611837B1 (ko) 2017-04-04 2023-12-07 엔라이트 인크. 검류계 스캐너 보정을 위한 광학 기준 생성
JP6938212B2 (ja) 2017-05-11 2021-09-22 株式会社ディスコ 加工方法
US10613413B1 (en) 2017-05-31 2020-04-07 Facebook Technologies, Llc Ultra-wide field-of-view scanning devices for depth sensing
US10181200B1 (en) 2017-06-28 2019-01-15 Facebook Technologies, Llc Circularly polarized illumination and detection for depth sensing
KR101902969B1 (ko) * 2017-09-05 2018-11-07 최병찬 레이저 가공 장치 및 방법
US10574973B2 (en) 2017-09-06 2020-02-25 Facebook Technologies, Llc Non-mechanical beam steering for depth sensing
US20240375222A1 (en) * 2023-05-11 2024-11-14 Orbotech Ltd. Universal dynamic beam shaper
KR102319867B1 (ko) * 2018-03-07 2021-10-29 광동 메이디 컨슈머 일렉트릭스 매뉴팩쳐링 컴퍼니 리미티드 식품 가공기 및 식품 가공기의 회전 속도를 증가하기 위한 제어 방법, 장치
TW201946719A (zh) 2018-05-02 2019-12-16 國立清華大學 可攜式同調光表面處理裝置
KR20250039487A (ko) * 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
US11454836B2 (en) 2018-06-29 2022-09-27 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
JP7241615B2 (ja) * 2018-06-29 2023-03-17 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7085951B2 (ja) * 2018-09-05 2022-06-17 イビデン株式会社 レーザ加工装置およびレーザ加工方法
CN111142936B (zh) * 2018-11-02 2021-12-31 深圳云天励飞技术股份有限公司 数据流操作方法、处理器和计算机存储介质
WO2020096857A1 (en) * 2018-11-05 2020-05-14 Alltec Angewandte Laserlicht Technologie Gmbh Laser marking through the lens of an image scanning system with multiple location image calibration
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
JP7470702B2 (ja) * 2019-02-21 2024-04-18 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 材料加工用フェイズドアレイビームステアリング
CN113518684A (zh) * 2019-03-06 2021-10-19 奥宝科技有限公司 高速动态射束整形
US12103110B2 (en) 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
JP7404043B2 (ja) * 2019-03-22 2023-12-25 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
DE102019208386B4 (de) * 2019-06-07 2024-07-25 Infineon Technologies Ag Steuersystem und Verfahren für Laserabtastung
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
EP3997439A4 (en) 2019-07-10 2023-07-19 Becton, Dickinson and Company Reconfigurable integrated circuits for adjusting cell sorting classification
JP7303079B2 (ja) * 2019-09-11 2023-07-04 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2021090305A1 (en) * 2019-11-05 2021-05-14 Orbotech Ltd. Thermal stabilization of acousto-optic devices
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11307433B2 (en) * 2020-02-21 2022-04-19 Robotic Research Opco, Llc Acoustically adjustable lenses
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
GB202005541D0 (en) * 2020-04-16 2020-06-03 M Solv Ltd Method and apparatus for performing laser ablation
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
AU2021275676A1 (en) 2020-05-19 2022-12-08 Becton, Dickinson And Company Methods for modulating an intensity profile of a laser beam and systems for same
EP4172592B1 (en) 2020-06-26 2025-07-16 Becton, Dickinson and Company Dual excitation beams for irradiating a sample in a flow stream and methods for using same
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
DE102020122598A1 (de) 2020-08-28 2022-03-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Bearbeiten eines Materials
US12345658B2 (en) * 2020-09-24 2025-07-01 Kla Corporation Large-particle monitoring with laser power control for defect inspection
US12070898B2 (en) 2020-11-12 2024-08-27 Eagle Technology, Llc Additive manufacturing device with acousto-optic deflector and related methods
WO2022103530A1 (en) * 2020-11-13 2022-05-19 Electro Scientific Industries, Inc. Laser-processing apparatus with debris removal system and integrated beam dump and methods of operating the same
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US20220176495A1 (en) * 2020-12-04 2022-06-09 Lawrence Livermore National Security, Llc System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy
JP7832944B2 (ja) * 2020-12-08 2026-03-18 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 光リレーシステム及びその使用方法及びその製造方法
DE102020134422A1 (de) * 2020-12-21 2022-06-23 Trumpf Laser Gmbh Vorrichtung zur Strahlbeeinflussung eines Laserstrahls
US11740608B2 (en) 2020-12-24 2023-08-29 Glowforge, Inc Computer numerically controlled fabrication using projected information
CN116547592A (zh) * 2020-12-28 2023-08-04 伊雷克托科学工业股份有限公司 用于操作声光偏转器的设备和方法
JP7624843B2 (ja) * 2021-02-22 2025-01-31 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
US11698622B2 (en) 2021-03-09 2023-07-11 Glowforge Inc. Previews for computer numerically controlled fabrication
JP7549559B2 (ja) * 2021-03-25 2024-09-11 ビアメカニクス株式会社 レーザ走査装置及びレーザ加工装置
US11555895B2 (en) * 2021-04-20 2023-01-17 Innovusion, Inc. Dynamic compensation to polygon and motor tolerance using galvo control profile
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
EP4314884A1 (en) 2021-05-21 2024-02-07 Innovusion, Inc. Movement profiles for smart scanning using galvonometer mirror inside lidar scanner
JP2024526083A (ja) 2021-06-21 2024-07-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビーム分析システムを含むレーザ加工装置並びにビーム特性の測定及び制御の方法
KR20240056517A (ko) 2021-09-17 2024-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 광검출기 상의 레이저 빔의 위치 감도 감소를 위한 컨디셔닝 장치 및 이를 사용하는 방법
ES2982598T3 (es) 2021-10-06 2024-10-17 Upnano Gmbh Procedimiento y dispositivo de fabricación generativa basada en litografía de un componente tridimensional
IL312370A (en) 2021-10-25 2025-01-01 Trumpf Lasersystems Semiconductor Mfg Gmbh Deep ultraviolet light source if beam positioning device
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US11874163B2 (en) 2022-01-14 2024-01-16 Ophir Optronics Solutions, Ltd. Laser measurement apparatus having a removable and replaceable beam dump
US12202069B2 (en) * 2022-04-11 2025-01-21 Salasoft Inc System and method for calibrating laser marking and cutting systems
DE102022118147A1 (de) * 2022-07-20 2024-01-25 Precitec Gmbh & Co. Kg Laserbearbeitungskopf und Verfahren zum Bearbeiten eines Werkstücks
JP2025009873A (ja) * 2023-07-03 2025-01-20 株式会社リコー レーザ照射方法、レーザ照射装置、レーザマーキング装置及び造形装置
JP2025117976A (ja) * 2024-01-31 2025-08-13 株式会社リコー レーザ照射装置、造形装置、レーザ照射方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084883A (en) * 1990-11-13 1992-01-28 Escher-Grad Incorporated Laser scanning system for use in laser imaging
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
CN101035647A (zh) * 2004-06-07 2007-09-12 电子科学工业公司 用于提高激光系统性能的声光调制器调制技术
US20080017618A1 (en) * 2001-02-16 2008-01-24 Kelly Bruland On-the-fly laser beam path error correction for specimen target location processing

Family Cites Families (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US580700A (en) 1897-04-13 Henry mcevoy
US3848104A (en) 1973-04-09 1974-11-12 Avco Everett Res Lab Inc Apparatus for heat treating a surface
US3851951A (en) * 1974-01-16 1974-12-03 Isomet Corp High resolution laser beam recorder with self-focusing acousto-optic scanner
US4105953A (en) 1977-01-24 1978-08-08 The United States Of America As Represented By The Secretary Of The Navy Chirped acousto-optic Q switch
US4118675A (en) * 1977-03-31 1978-10-03 The United States Of America As Represented By The Secretary Of The Navy Laser tuning with an acousto-optic lens
US4272151A (en) * 1979-10-30 1981-06-09 Balasubramanian N Apparatus for optical scanning
US4421388A (en) * 1981-04-06 1983-12-20 The United States Of America As Represented By The Secretary Of The Army Acousto-optic time integrating frequency scanning correlator
US4426134A (en) * 1981-11-02 1984-01-17 The United States Of America As Represented By The Secretary Of The Army Three and four product surface-wave acousto-optic time integrating correlators
US4456811A (en) 1982-06-21 1984-06-26 Avco Everett Research Laboratory, Inc. Method of and apparatus for heat treating axisymmetric surfaces with an annular laser beam
US4532402A (en) 1983-09-02 1985-07-30 Xrl, Inc. Method and apparatus for positioning a focused beam on an integrated circuit
FI74154C (fi) * 1985-06-20 1987-12-10 Eero Byckling Foerfarande foer bestrykning av laserstraole medelst icke-mekaniska avlaenkningsdon.
US4827125A (en) * 1987-04-29 1989-05-02 The United States Of America As Represented By The Secretary Of The Department Of Health And Human Services Confocal scanning laser microscope having no moving parts
US4894115A (en) 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
US5187364A (en) * 1989-03-22 1993-02-16 National Research Council Of Canada/Conseil National De Recherches Du Canada Scanning device with waveform generator optimizer
US4970600A (en) 1989-04-04 1990-11-13 Melco Industries, Inc. Laser engraver with X-Y assembly and cut control
DE3916264A1 (de) 1989-05-18 1990-11-22 Diehl Gmbh & Co Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung
US5133602A (en) 1991-04-08 1992-07-28 International Business Machines Corporation Particle path determination system
US5413289A (en) 1991-07-30 1995-05-09 Axis Usa, Inc. Programmably controlled armature winding apparatus
US5223710A (en) * 1992-03-06 1993-06-29 Digital Equipment Corporation Optical angular position sensing system for use with a galvanometer
DE4232915A1 (de) 1992-10-01 1994-04-07 Hohla Kristian Vorrichtung zur Formung der Cornea durch Abtragen von Gewebe
US5558788A (en) 1993-11-30 1996-09-24 Martin Marietta Energy Systems, Inc. Dual beam optical system for pulsed laser ablation film deposition
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5717401A (en) * 1995-09-01 1998-02-10 Litton Systems, Inc. Active recognition system with optical signal processing
US5837962A (en) * 1996-07-15 1998-11-17 Overbeck; James W. Faster laser marker employing acousto-optic deflection
CN1155853C (zh) * 1996-09-06 2004-06-30 富士写真菲林株式会社 声光元件、光偏转器、光束扫描装置及图象记录装置
JPH10249557A (ja) * 1997-03-12 1998-09-22 Mitsubishi Chem Corp テキスチャ装置およびテキスチャ加工方法
JP2000009395A (ja) * 1998-06-19 2000-01-14 Mitsubishi Heavy Ind Ltd スートブロア内蔵型熱交換器
US6172325B1 (en) * 1999-02-10 2001-01-09 Electro Scientific Industries, Inc. Laser processing power output stabilization apparatus and method employing processing position feedback
US6341029B1 (en) 1999-04-27 2002-01-22 Gsi Lumonics, Inc. Method and apparatus for shaping a laser-beam intensity profile by dithering
US6862490B1 (en) * 1999-05-24 2005-03-01 Potomac Photonics, Inc. DLL circuit taking acount of external load
US6313434B1 (en) 1999-05-27 2001-11-06 International Business Machines Corporation Method for creation of inclined microstructures using a scanned laser image
SE516347C2 (sv) * 1999-11-17 2001-12-17 Micronic Laser Systems Ab Laserskanningssystem och metod för mikrolitografisk skrivning
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
EP1275036B1 (en) 2000-01-11 2005-10-26 Electro Scientific Industries, Inc. Abbe error correction system and method
US6985261B2 (en) 2000-03-08 2006-01-10 Esko-Graphics A/S Method and apparatus for seamless imaging of sleeves as used in flexography
WO2001074529A2 (en) 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
KR100346550B1 (ko) * 2000-06-13 2002-07-26 삼성에스디아이 주식회사 레이저 전사장치
US6676878B2 (en) * 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6537941B2 (en) 2001-01-04 2003-03-25 Exxonmobil Chemical Patents, Inc. Rejuvenating SAPO molecular sieve by freeze drying
US7450618B2 (en) * 2001-01-30 2008-11-11 Board Of Trustees Operating Michigan State University Laser system using ultrashort laser pulses
US8497450B2 (en) * 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
WO2002067180A1 (en) 2001-02-16 2002-08-29 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
WO2002080081A1 (en) 2001-03-29 2002-10-10 Lasx Industries, Inc. Controller for a laser using predictive models of materials processing
JP4472931B2 (ja) * 2001-05-03 2010-06-02 ケーエルエー−テンカー コーポレイション 光ビームに試料全体を走査させるためのシステムおよび方法
JP2003053576A (ja) 2001-08-16 2003-02-26 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
US6484114B1 (en) 2001-08-20 2002-11-19 Glimmerglass Networks, Inc. Method for calibrating a free-space-coupled fiber-optic transmission system
US6713718B1 (en) * 2001-11-27 2004-03-30 Vi Engineering, Inc. Scoring process and apparatus with confocal optical measurement
CN1299873C (zh) 2002-01-11 2007-02-14 电子科学工业公司 借助激光光斑放大来激光加工工件的方法
US6706998B2 (en) * 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
JP2003245785A (ja) * 2002-02-22 2003-09-02 Sumitomo Heavy Ind Ltd ビーム加工方法及び装置
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US7563695B2 (en) * 2002-03-27 2009-07-21 Gsi Group Corporation Method and system for high-speed precise laser trimming and scan lens for use therein
JP4187472B2 (ja) 2002-07-15 2008-11-26 株式会社キーエンス 光学式情報読取装置およびその操作方法
JP3822188B2 (ja) * 2002-12-26 2006-09-13 日立ビアメカニクス株式会社 多重ビームレーザ穴あけ加工装置
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7175089B2 (en) 2003-04-07 2007-02-13 Silverbrook Research Pty Ltd Face determination
JP3872462B2 (ja) * 2003-09-01 2007-01-24 住友重機械工業株式会社 レーザ加工装置、及びレーザ加工方法
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
US7483196B2 (en) * 2003-09-23 2009-01-27 Applied Materials, Inc. Apparatus for multiple beam deflection and intensity stabilization
JP4318525B2 (ja) * 2003-10-20 2009-08-26 住友重機械工業株式会社 光学装置及びレーザ照射装置
US7090670B2 (en) 2003-12-31 2006-08-15 Reliant Technologies, Inc. Multi-spot laser surgical apparatus and method
US7199330B2 (en) 2004-01-20 2007-04-03 Coherent, Inc. Systems and methods for forming a laser beam having a flat top
CN1925945A (zh) 2004-03-05 2007-03-07 奥林巴斯株式会社 激光加工装置
US7486705B2 (en) * 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US7548567B2 (en) 2004-04-02 2009-06-16 Vladimir Kupershmidt Analog transmitter using an external cavity laser (ECL)
JP4729269B2 (ja) * 2004-06-01 2011-07-20 オリンパス株式会社 レーザ走査型顕微鏡
WO2005121889A2 (en) 2004-06-07 2005-12-22 Electro Scientific Industries, Inc. Aom modulation techniques for improving laser system performance
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7435927B2 (en) * 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7322104B2 (en) 2004-06-25 2008-01-29 Canon Kabushiki Kaisha Method for producing an ink jet head
US20060000814A1 (en) 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US7508850B2 (en) 2004-09-02 2009-03-24 Coherent, Inc. Apparatus for modifying CO2 slab laser pulses
WO2006042130A2 (en) * 2004-10-06 2006-04-20 Baylor College Of Medicine High speed microscope with three-dimensional laser beam scanning
US20060102888A1 (en) 2004-11-12 2006-05-18 Samsung Electronics Co., Ltd. Semiconductor substrate and method of fabricating the same
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7250618B2 (en) * 2005-02-02 2007-07-31 Nikon Corporation Radiantly heated cathode for an electron gun and heating assembly
US7586618B2 (en) 2005-02-28 2009-09-08 The Board Of Trustees Of The University Of Illinois Distinguishing non-resonant four-wave-mixing noise in coherent stokes and anti-stokes Raman scattering
US7279721B2 (en) 2005-04-13 2007-10-09 Applied Materials, Inc. Dual wavelength thermal flux laser anneal
US7466466B2 (en) * 2005-05-11 2008-12-16 Gsi Group Corporation Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector
US7576766B2 (en) 2005-06-30 2009-08-18 Microsoft Corporation Normalized images for cameras
CN100353205C (zh) * 2005-07-20 2007-12-05 华中科技大学 一种基于二维声光偏转器的激光扫描装置
US7297972B2 (en) * 2005-08-26 2007-11-20 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
US7315038B2 (en) * 2005-08-26 2008-01-01 Electro Scientific Industries, Inc. Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
US7713595B2 (en) 2005-10-18 2010-05-11 Nitto Denko Corporation Optical compensation films produced by a carrier-web-casting process
JP5036181B2 (ja) 2005-12-15 2012-09-26 株式会社ディスコ レーザー加工装置
JP5178022B2 (ja) 2006-02-03 2013-04-10 株式会社半導体エネルギー研究所 記憶素子の作製方法
US8580700B2 (en) * 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
EP1862838B1 (en) * 2006-05-29 2009-08-19 Olympus Corporation Laser scanning microscope and microscopic observing method
JP5133600B2 (ja) 2006-05-29 2013-01-30 オリンパス株式会社 レーザ走査型顕微鏡および顕微鏡観察方法
JP2008012916A (ja) * 2006-06-08 2008-01-24 Hitachi Via Mechanics Ltd 複合シート、複合シートの加工方法、及びレーザ加工装置
US7838818B2 (en) * 2006-06-22 2010-11-23 Olympus Corporation Light-stimulus illumination apparatus which scans light-stimulus laser light in a direction intersecting an optical axis
JP5122773B2 (ja) * 2006-08-04 2013-01-16 株式会社ディスコ レーザー加工機
GB0617945D0 (en) * 2006-09-12 2006-10-18 Ucl Business Plc Imaging apparatus and methods
JP2008068270A (ja) * 2006-09-12 2008-03-27 Disco Abrasive Syst Ltd レーザー加工装置
GB2444037A (en) 2006-11-27 2008-05-28 Xsil Technology Ltd Laser Machining
JP4908177B2 (ja) * 2006-12-15 2012-04-04 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP4274251B2 (ja) * 2007-01-24 2009-06-03 ソニー株式会社 レーザ描画方法及びレーザ描画装置
JP2008186870A (ja) * 2007-01-26 2008-08-14 Disco Abrasive Syst Ltd ビアホールの加工方法
CN101617448B (zh) 2007-01-26 2012-05-23 伊雷克托科学工业股份有限公司 产生用于材料处理的脉冲列的方法和系统
JP4897526B2 (ja) * 2007-03-23 2012-03-14 コニカミノルタオプト株式会社 レーザモジュールの光軸調整方法
JP5201311B2 (ja) 2007-03-28 2013-06-05 富士電機株式会社 レーザ加工方法および装置
US8116341B2 (en) 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
US7724785B2 (en) 2007-06-29 2010-05-25 Coherent, Inc. Multiple pulsed-laser system for silicon crystallization
US8848199B2 (en) * 2007-07-10 2014-09-30 Massachusetts Institute Of Technology Tomographic phase microscopy
JP5114122B2 (ja) 2007-07-20 2013-01-09 日本電波工業株式会社 恒温槽付水晶発振器における恒温槽の制御回路
JP5137488B2 (ja) * 2007-07-25 2013-02-06 オリンパス株式会社 レーザ照射装置およびそれを用いたレーザ加工システム
JP5025391B2 (ja) * 2007-08-30 2012-09-12 住友重機械工業株式会社 レーザ加工装置及び加工方法
WO2009039184A2 (en) * 2007-09-19 2009-03-26 Gsi Group Corporation Link processing with high speed beam deflection
JP5259157B2 (ja) * 2007-11-09 2013-08-07 オリンパス株式会社 レーザ顕微鏡
TW200923631A (en) 2007-11-22 2009-06-01 Inventec Corp Apparatus and method for adjusting working frequency of VRD by detecting current
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US20090193644A1 (en) 2008-01-31 2009-08-06 Michael James Malloy Double nut bolted connection with cheese plate for reinforcing existing riveted or bolted structures under load
US7675673B2 (en) 2008-03-26 2010-03-09 Coherent, Inc. Apparatus for providing multiple time-division multiplexed independently controllable pulsed beams from a single, pulsed laser output-beam
US8124911B2 (en) 2008-03-31 2012-02-28 Electro Scientific Industries, Inc. On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
US7522029B1 (en) 2008-07-24 2009-04-21 International Business Machines Corporation Phase change actuator
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
US8048706B1 (en) 2010-10-14 2011-11-01 Miasole Ablative scribing of solar cell structures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084883A (en) * 1990-11-13 1992-01-28 Escher-Grad Incorporated Laser scanning system for use in laser imaging
US20080017618A1 (en) * 2001-02-16 2008-01-24 Kelly Bruland On-the-fly laser beam path error correction for specimen target location processing
CN101035647A (zh) * 2004-06-07 2007-09-12 电子科学工业公司 用于提高激光系统性能的声光调制器调制技术
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths

Also Published As

Publication number Publication date
WO2010138900A3 (en) 2011-02-24
US20240001484A1 (en) 2024-01-04
CN102481664B (zh) 2014-11-05
JP6170980B2 (ja) 2017-07-26
KR20200034812A (ko) 2020-03-31
CN102449863A (zh) 2012-05-09
US20100301023A1 (en) 2010-12-02
WO2010138897A2 (en) 2010-12-02
JP2016041446A (ja) 2016-03-31
JP5689873B2 (ja) 2015-03-25
KR20120023828A (ko) 2012-03-13
US20130299468A1 (en) 2013-11-14
JP2012528011A (ja) 2012-11-12
JP2012528012A (ja) 2012-11-12
KR102062203B1 (ko) 2020-01-06
KR20220075443A (ko) 2022-06-08
KR102216782B1 (ko) 2021-02-18
WO2010138900A2 (en) 2010-12-02
KR102402984B1 (ko) 2022-05-30
US8404998B2 (en) 2013-03-26
KR102583177B1 (ko) 2023-09-27
TW201107068A (en) 2011-03-01
TWI515067B (zh) 2016-01-01
US11738405B2 (en) 2023-08-29
KR101796798B1 (ko) 2017-11-10
TWI523720B (zh) 2016-03-01
CN102481664A (zh) 2012-05-30
CN102449863B (zh) 2014-03-26
US8288679B2 (en) 2012-10-16
TW201620656A (zh) 2016-06-16
KR20210006501A (ko) 2021-01-18
KR20200001617A (ko) 2020-01-06
TW201111082A (en) 2011-04-01
WO2010138897A3 (en) 2011-03-24
KR20120027393A (ko) 2012-03-21
KR20180097771A (ko) 2018-08-31
KR102093841B1 (ko) 2020-04-29
US10391585B2 (en) 2019-08-27
JP5826744B2 (ja) 2015-12-02
US20190329350A1 (en) 2019-10-31
KR20170051538A (ko) 2017-05-11
US20100301024A1 (en) 2010-12-02

Similar Documents

Publication Publication Date Title
TWI594828B (zh) 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP7162094B2 (ja) ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法